LED lamp bead board processing method and LED lamp bead board

Abstract

The invention relates to the technical field of LED lamp bead processing, and discloses an LED lamp bead board processing method and an LED lamp bead board. The LED lamp bead board processing method comprises the steps that a transparent substrate is divided into at least one sub-board, and an LED chip installation area, a first positive electrode conductive band and a first negative electrode conductive band are arranged on the front face of the sub-board in a silk-screen printing mode; a plurality of LED chips are installed in the LED chip installation area; lED chips are connected in series through gold threads to form an LED chip belt, and the two ends of the LED chip belt are connected with the first positive electrode conductive belt and the first negative electrode conductive belt through gold threads respectively; a first layer of fluorescent glue is uniformly sprayed on the LED chips on the front surface of the transparent substrate by adopting a powder spraying process and is in complete contact with the front surface of the transparent substrate, and a second layer of fluorescent glue is uniformly sprayed on the back surface of the transparent substrate and is in complete contact with the back surface of the transparent substrate. Therefore, the fluorescent glue is uniformly covered on the LED chip by adopting a powder spraying process, so that the LED chip emits more uniform light, heat generated during excitation of the fluorescent powder can be directly guided into the transparent substrate, and the heat resistance of the LED lamp bead is better.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp bead processing, and in particular to an LED lamp bead plate processing method and an LED lamp bead plate. Background Art

[0002] At present, a plurality of LED lamp beads are arranged on an LED (Light Emitting Diode) lamp board. The packaging process of LED lamp beads generally includes process flows such as die bonding, wire welding and glue dispensing. The glue dispensing process usually adopts phosphor powder, diffusion powder and silica gel to mix and then dispense the powder, and then bake it according to the silica gel baking conditions. With the help of diffusion powder, the phosphor powder will be evenly distributed in the silica gel, resulting in a thicker thickness of the silica gel and making it impossible for the silica gel to fully contact with the substrate. The heat generated when the phosphor powder is excited cannot be directly introduced into the substrate, resulting in poor heat resistance of the LED lamp beads, affecting the normal operation of the LED lamp beads. Summary of the invention

[0003] The embodiments of the present invention aim to provide a method for processing an LED lamp bead board and an LED lamp bead board, which can solve the problem that the current LED lamp bead board adopts a dispensing process, resulting in poor heat resistance of the LED lamp beads, thereby affecting the normal operation of the LED lamp beads.

[0004] In order to solve the above technical problems, the first embodiment of the present invention provides a method for processing an LED lamp bead board, which is applied to an LED lamp bead board. The LED lamp bead board includes a transparent substrate, a plurality of LED chips and a plurality of gold wires. The LED lamp bead board processing method includes:

[0005] At least one sub-board is divided on the transparent substrate, and the front side of the sub-board is silk-screened with an LED chip mounting area, a first positive conductive belt and a first negative conductive belt that are not connected to each other;

[0006] Fixing a plurality of LED chips in the LED chip mounting area of ​​the sub-board by means of mounting materials;

[0007] The LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires;

[0008] A first layer of fluorescent glue is evenly sprayed on the LED chip on the front of the transparent substrate using a powder spraying process so that the first layer of fluorescent glue is in full contact with the front of the transparent substrate, and a second layer of fluorescent glue is evenly sprayed on the back of the transparent substrate so that the second layer of fluorescent glue is in full contact with the back of the transparent substrate.

[0009] Optionally, the front side of the sub-board is also silk-screened with a second positive conductive tape and a second negative conductive tape that are not connected to each other, and the second positive conductive tape and the second negative conductive tape are respectively arranged on the periphery of the first positive conductive tape and the first negative conductive tape, and the first positive conductive tape and the second positive conductive tape are isolated, and the first negative conductive tape and the second negative conductive tape are isolated.

[0010] Optionally, the mounting material is a die-bonding adhesive, and the step of fixing a plurality of LED chips in the LED chip mounting area of ​​the sub-board through the mounting material comprises:

[0011] The LED chip is mounted on the LED chip mounting area through the bonding adhesive, and then the transparent substrate with the LED chip mounted is placed in an oven for baking to bond the bonding adhesive, thereby fixing the LED chip on the transparent substrate.

[0012] Optionally, the LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and two ends of the LED chip belt are respectively connected to a first positive conductive belt and a first negative conductive belt through gold wires, including:

[0013] If all the LED chips in the LED chip mounting area of ​​the sub-board are mounted in a row, all the LED chips are connected in series end to end through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires, and the first positive conductive belt and the first negative conductive belt are respectively connected to the second positive conductive belt and the second negative conductive belt through gold wires; or,

[0014] If the LED chips in the LED chip mounting area of ​​the sub-board are installed in multiple rows, all the LED chips are connected in series end to end through gold wires to form an LED chip strip, and the two ends of the LED chip strip are respectively connected to the first positive conductive strip and the first negative conductive strip through gold wires, and the first positive conductive strip and the first negative conductive strip are respectively connected to the second positive conductive strip and the second negative conductive strip through gold wires; or, the LED chips in each row are connected in series end to end through gold wires to form an LED chip strip, thereby forming multiple LED chip strips, and the two ends of each LED chip strip are respectively connected to the first positive conductive strip and the first negative conductive strip through gold wires, and the first positive conductive strip and the first negative conductive strip are respectively connected to the second positive conductive strip and the second negative conductive strip through gold wires.

[0015] Optionally, the LED chip is a constant voltage LED chip, the LED lamp bead board further includes a constant current chip, the front of the sub-board is also silk-screened with a constant current chip installation area, and the constant current chip is fixedly installed in the constant current chip installation area by means of installation materials;

[0016] The constant current chip is electrically connected to the first positive conductive belt and the first negative conductive belt through gold wires, so that the constant current chip is electrically connected to the constant voltage LED chip through the first positive conductive belt and the first negative conductive belt. At the same time, the constant current chip is electrically connected to the second positive conductive belt and the second negative conductive belt through gold wires.

[0017] Optionally, the method of uniformly spraying a first layer of fluorescent glue on the LED chip on the front side of the transparent substrate by a powder spraying process so that the first layer of fluorescent glue is in full contact with the front side of the transparent substrate, and uniformly spraying a second layer of fluorescent glue on the back side of the transparent substrate so that the second layer of fluorescent glue is in full contact with the back side of the transparent substrate comprises:

[0018] The first layer of fluorescent glue is evenly sprayed only on the LED chip on the front of the transparent substrate by using a powder spraying process so that the first layer of fluorescent glue is in full contact with the front of the transparent substrate, and the first layer of fluorescent glue is not sprayed on other areas on the front of the transparent substrate except the area where the LED chip is located;

[0019] The powder spraying process is adopted to evenly spray the second layer of fluorescent glue only on the area where the back side of the transparent substrate is located relative to the LED chip, and make the second layer of fluorescent glue completely contact with the back side of the transparent substrate. The spraying area of ​​the second layer of fluorescent glue is equal to the spraying area of ​​the first layer of fluorescent glue, and the thickness of the spraying area of ​​the second layer of fluorescent glue is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue.

[0020] Optionally, the method of uniformly spraying a first layer of fluorescent glue on the LED chip on the front side of the transparent substrate by a powder spraying process so that the first layer of fluorescent glue is in full contact with the front side of the transparent substrate, and uniformly spraying a second layer of fluorescent glue on the back side of the transparent substrate so that the second layer of fluorescent glue is in full contact with the back side of the transparent substrate comprises:

[0021] A first layer of fluorescent glue is evenly sprayed on the area where the sub-board to which the LED chip belongs on the front of the transparent substrate by a powder spraying process, and the first layer of fluorescent glue is in full contact with the front of the transparent substrate;

[0022] A powder spraying process is used to evenly spray a second layer of fluorescent glue on the area where the back side of the transparent substrate is relative to the area where the sub-board is located, and the second layer of fluorescent glue is in complete contact with the back side of the transparent substrate. The spraying area of ​​the second layer of fluorescent glue is equal to the spraying area of ​​the first layer of fluorescent glue, and the thickness of the spraying area of ​​the second layer of fluorescent glue is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue.

[0023] Optionally, the LED lamp bead board processing method also includes: using a printing process to evenly print a first layer of transparent silicone on the first layer of fluorescent glue on the front side of the transparent substrate, and evenly printing a second layer of transparent silicone on the second layer of fluorescent glue on the back side of the transparent substrate.

[0024] Optionally, the LED lamp bead board processing method further includes: if the transparent substrate is divided into a plurality of sub-boards with the same specifications, the transparent substrate is divided into a plurality of sub-boards with the same specifications according to the regional positions of the sub-boards to obtain a plurality of independent LED lamps.

[0025] Accordingly, the second embodiment of the present invention further provides an LED lamp bead board, which is obtained by applying the LED lamp bead board processing method described in the first embodiment of the present invention, and the LED lamp bead board includes a transparent substrate, a plurality of LED chips, a first layer of fluorescent glue, a second layer of fluorescent glue and a plurality of gold wires, wherein:

[0026] The transparent substrate is divided into at least one sub-board, and the front side of the sub-board is silk-screened with an LED chip mounting area, a first positive conductive belt and a first negative conductive belt that are not connected to each other;

[0027] A plurality of LED chips are fixedly mounted in the LED chip mounting area of ​​the sub-board by means of mounting materials;

[0028] The LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires;

[0029] The first layer of fluorescent glue is evenly sprayed on the LED chip on the front side of the transparent substrate using a powder spraying process so that the first layer of fluorescent glue is in full contact with the front side of the substrate. The second layer of fluorescent glue is evenly sprayed on the back side of the transparent substrate using a powder spraying process so that the second layer of fluorescent glue is in full contact with the back side of the substrate.

[0030] Compared with the prior art, the present invention provides a method for processing an LED lamp bead board and an LED lamp bead board, the method comprising: dividing a transparent substrate into a plurality of sub-boards of the same specification, the front side of each sub-board being silk-screened with an LED chip mounting area, a first positive conductive belt and a first negative conductive belt which are not connected to each other; fixing a plurality of LED chips in the LED chip mounting area of ​​each sub-board through mounting materials; connecting the LED chips in each sub-board in series through gold wires to form an LED chip belt, the two ends of the LED chip belt being respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires; using a powder spraying process to evenly spray a first layer of fluorescent glue on the LED chip on the front side of the transparent substrate and make the first layer of fluorescent glue completely contact with the front side of the transparent substrate, and evenly spraying a second layer of fluorescent glue on the back side of the transparent substrate and make the second layer of fluorescent glue completely contact with the back side of the transparent substrate. Therefore, by adopting the powder spraying process, the fluorescent glue can be more evenly covered on the LED chip, making the LED chip emit light more evenly; the fluorescent glue using the powder spraying process is in full contact with the transparent substrate, and the heat generated when the fluorescent powder is excited can be directly introduced into the transparent substrate, making the heat resistance of the LED lamp bead better; the thickness of the fluorescent glue obtained by the powder spraying process is thinner than that obtained by the conventional dispensing process, and the heat resistance is better, and the production efficiency of the powder spraying process is higher. Therefore, the problem that the current LED lamp bead board adopts the dispensing process, resulting in poor heat resistance of the LED lamp bead, which affects the normal operation of the LED lamp bead can be solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0032] Figure 1 It is a flow chart of a method for processing an LED lamp bead board provided by the present invention;

[0033] Figure 2 It is a structural schematic diagram of an LED lamp bead board provided by the present invention;

[0034] Figure 3 It is a structural schematic diagram of one of the sub-boards of an LED lamp bead board provided by the present invention;

[0035] Figure 4 This is a schematic diagram of the top view of the structure of an LED lamp bead board provided by the present invention;

[0036] Figure 5 This is a schematic diagram of an LED lamp bead board provided by the present invention in which an LED chip and a conductive tape are connected by gold wire;

[0037] Figure 6 It is a schematic diagram of a LED chip in an LED lamp bead board provided by the present invention using a powder spraying process to evenly spray a first layer of fluorescent glue on the LED chip on the front side of a transparent substrate and evenly spray a second layer of fluorescent glue on the back side of the transparent substrate (seen from a top view from the front side of the transparent substrate);

[0038] Figure 7 It is a schematic diagram of a LED chip in an LED lamp bead board provided by the present invention using a powder spraying process to evenly spray a first layer of fluorescent glue on the LED chip on the front side of a transparent substrate and evenly spray a second layer of fluorescent glue on the back side of the transparent substrate (seen from an upward angle from the front side of the transparent substrate);

[0039] Figure 8 It is a schematic diagram of a LED chip in an LED lamp bead board provided by the present invention, using a powder spraying process to evenly spray a first layer of fluorescent glue on the area where the LED chip belongs to the sub-board on the front side of the transparent substrate, and evenly spraying a second layer of fluorescent glue on the area at a relative position between the back side of the transparent substrate and the area where the sub-board is located (seen from the top view of the front side of the transparent substrate);

[0040] Fig. 9 It is a schematic diagram of a LED chip in an LED lamp bead board provided by the present invention, using a powder spraying process to evenly spray a first layer of fluorescent glue on the area where the LED chip belongs to the sub-board on the front side of the transparent substrate, and evenly spraying a second layer of fluorescent glue on the area at a relative position between the back side of the transparent substrate and the area where the sub-board is located (seen from the perspective of looking up at the front side of the transparent substrate);

[0041] Fig.10 It is another schematic flow chart of a method for processing an LED lamp bead board provided by the present invention;

[0042] Fig.11 It is a schematic diagram of an LED lamp bead board provided by the present invention, in which the LED chip is uniformly printed on the first layer of fluorescent glue on the front side of the transparent substrate by a printing process, and the second layer of transparent silicone is printed on the second layer of fluorescent glue 40 on the back side of the transparent substrate (seen from the top view of the front side of the transparent substrate);

[0043] Fig.12 It is a schematic diagram of an LED lamp bead board provided by the present invention, in which the LED chip is uniformly printed on the first layer of fluorescent glue on the front side of the transparent substrate by a printing process, and the second layer of transparent silicone is printed on the second layer of fluorescent glue 40 on the back side of the transparent substrate (seen from the perspective of looking up at the front side of the transparent substrate);

[0044] Fig.13Another schematic diagram of an LED lamp bead board provided by the present invention, in which the LED chips are uniformly printed on the first layer of fluorescent glue on the front side of the transparent substrate by a printing process, and the second layer of transparent silicone is printed on the second layer of fluorescent glue 40 on the back side of the transparent substrate (seen from the top view of the front side of the transparent substrate);

[0045] Fig.14 This is another schematic diagram (seen from an upward perspective from the front of the transparent substrate) of an LED lamp bead board provided by the present invention, in which the LED chips are evenly printed on the first layer of fluorescent glue on the front side of the transparent substrate using a printing process to print a first layer of transparent silicone and a second layer of transparent silicone is printed on the second layer of fluorescent glue 40 on the back side of the transparent substrate.

[0046] Description of main component symbols:

[0047] LED lamp board 100 LED lamp 200

[0048] Transparent substrate 10 LED chip 20

[0049] The first layer of fluorescent glue 30 The second layer of fluorescent glue 40

[0050] Gold wire 50 Constant current chip 60

[0051] The first layer of transparent silicone 70 The second layer of transparent silicone 80

[0052] Sub-board 11 First positive conductive tape 111

[0053] First cathode conductive belt 112 LED chip mounting area 113

[0054] The second positive electrode conductive belt 114 and the second negative electrode conductive belt 115

[0055] Constant current chip installation area 116 DETAILED DESCRIPTION

[0056] In order to facilitate the understanding of the present invention, the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "bottom" etc. used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0057] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification and in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0058] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0059] In one embodiment, Figures 1 to 3 As shown, the present invention provides a method for processing an LED lamp bead board, which is applied to an LED lamp bead board 100. The LED lamp bead board 100 includes a transparent substrate 10, a plurality of LED chips 20 and a plurality of gold wires 50. The method for processing the LED lamp bead board includes:

[0060] S1. At least one sub-board 11 is divided on the transparent substrate 10. The front side of the sub-board 11 is screen-printed with an LED chip mounting area 113, a first positive conductive belt 111 and a first negative conductive belt 112 which are not connected to each other;

[0061] S2, fixing a plurality of LED chips 20 in the LED chip mounting area 113 of the sub-board 11 by means of mounting materials;

[0062] S3, connecting the LED chips 20 in the sub-board 11 in series through the gold wire 50 to form an LED chip belt, and connecting the two ends of the LED chip belt to the first positive conductive belt 111 and the first negative conductive belt 112 through the gold wire respectively;

[0063] S4. Use a powder spraying process to evenly spray a first layer of fluorescent glue 30 on the LED chip 20 on the front side of the transparent substrate 10 and make the first layer of fluorescent glue 30 completely contact with the front side of the transparent substrate 10, and evenly spray a second layer of fluorescent glue 40 on the back side of the transparent substrate 10 and make the second layer of fluorescent glue 40 completely contact with the back side of the transparent substrate.

[0064] In the present embodiment, a method for processing an LED lamp bead board is provided, including: at least one sub-board is divided on a transparent substrate, and the front side of the sub-board is silk-screened with an LED chip mounting area, a first positive conductive belt and a first negative conductive belt that are not connected to each other; a plurality of LED chips are fixedly mounted in the LED chip mounting area of ​​the sub-board through mounting materials; the LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires; a first layer of fluorescent glue is evenly sprayed on the LED chip on the front side of the transparent substrate by a powder spraying process, and the first layer of fluorescent glue is completely in contact with the front side of the transparent substrate, and a second layer of fluorescent glue is evenly sprayed on the back side of the transparent substrate, and the second layer of fluorescent glue is completely in contact with the back side of the transparent substrate. Therefore, by adopting the powder spraying process, the fluorescent glue can be more evenly covered on the LED chip, making the LED chip emit light more evenly; the fluorescent glue using the powder spraying process is in full contact with the transparent substrate, and the heat generated when the fluorescent powder is excited can be directly introduced into the transparent substrate, making the heat resistance of the LED lamp bead better; the thickness of the fluorescent glue obtained by the powder spraying process is thinner than that obtained by the conventional dispensing process, and the heat resistance is better, and the production efficiency of the powder spraying process is higher. Therefore, the problem that the current LED lamp bead board adopts the dispensing process, resulting in poor heat resistance of the LED lamp bead, which affects the normal operation of the LED lamp bead can be solved.

[0065] In one embodiment, in step S1 , at least one sub-board 11 is divided on the transparent substrate 10 , and an LED chip mounting area 113 , a first positive conductive strip 111 and a first negative conductive strip 112 which are not connected to each other are screen-printed on the front side of the sub-board 11 .

[0066] Specifically, the transparent substrate 10 is divided into a sub-board 11, such as Figure 3 A daughter board 11 is shown.

[0067] like Figure 2 and Figure 4 As shown, the transparent substrate 10 is divided into a plurality of sub-boards 11 of the same specification, each sub-board 11 is as shown in FIG. Figure 3As shown. On the front of the transparent substrate 10, the layout is divided according to rows (M) and columns (N), and M x N regions are formed between each row and each column. The specifications of each region are consistent, including the specifications of size and shape. Each region is a sub-board 11, so that a plurality of sub-boards 11 with consistent specifications are divided on the front of the transparent substrate 10 according to the row and column rules. Each sub-board 11 is as shown in FIG. Figure 3 shown.

[0068] like Figure 3 As shown, the front side of the sub-board 11 is silk-screened with an LED chip mounting area 113 , a first positive conductive tape 111 and a first negative conductive tape 112 which are not connected to each other, and the first positive conductive tape 111 and the first negative conductive tape 112 are arranged around the LED chip mounting area 113 .

[0069] In some embodiments, Figure 3 As shown, the front side of the sub-board 11 is also screen-printed with a second positive conductive belt 114 and a second negative conductive belt 115 which are not connected to each other. The second positive conductive belt 114 and the second negative conductive belt 115 are respectively arranged on the periphery of the first positive conductive belt 111 and the first negative conductive belt 112. The first positive conductive belt 111 and the second positive conductive belt 114 are isolated, and the first negative conductive belt 112 and the second negative conductive belt 115 are isolated.

[0070] In some embodiments, Figure 3 As shown, a constant current chip mounting area 116 is also silk-screened on the front of the daughter board 11 .

[0071] For example, the transparent substrate 10 is a transparent sapphire substrate, the sub-plate 11 is rectangular, and a plurality of rectangular sub-plates of the same specification are divided on the front side of the transparent sapphire substrate according to rectangular rules of rows and columns.

[0072] In one embodiment, in step S2 , a plurality of LED chips 20 are fixedly mounted in the LED chip mounting area 113 of the sub-board 11 by means of mounting materials.

[0073] Specifically, Figure 5 As shown, if the transparent substrate 10 is divided into a sub-board 11, a plurality of LED chips 20 are fixedly mounted in the LED chip mounting area 113 of the sub-board 11 by means of mounting materials.

[0074] like Figure 2 and Figure 4 As shown, if the transparent substrate 10 is divided into a plurality of sub-boards 11 of the same specification, each sub-board 11 is as shown in FIG. Figure 3 and Figure 5As shown, a plurality of LED chips 20 are evenly distributed according to the number of sub-boards 11 of the transparent substrate 10, and the LED chips 20 distributed to each sub-board 11 are fixedly installed in the LED chip installation area 113 of the corresponding sub-board 11 by means of installation materials.

[0075] For example, the installation material is a bonding adhesive, which is prepared by using fluorescent powder, diffusion powder and silicone, and then baked according to the silicone baking conditions. With the help of the diffusion powder, the fluorescent powder will be evenly distributed in the silicone.

[0076] The LED chip 20 is mounted on the LED chip mounting area 113 of the sub-board 11 on the front side of the transparent substrate 10 by means of a bonding adhesive. Since there is no LED chip on the back side of the transparent substrate, no bonding adhesive is applied for bonding. Subsequently, the transparent substrate with the LED chip mounted is placed in an oven for baking to bond the bonding adhesive, thereby achieving the purpose of fixing the LED chip on the transparent substrate.

[0077] In some embodiments, Figure 3 and Figure 5 As shown, the LED chip 20 can be a constant voltage LED chip. At this time, the LED lamp bead board 100 also includes a constant current chip 60, which is fixedly mounted in the constant current chip mounting area 116 of the sub-board 11 through mounting materials.

[0078] For example, the mounting material is a bonding adhesive, and the constant current chip 60 is mounted in the constant current chip mounting area 116 of the sub-board 11 on the front side of the transparent substrate 10 by the bonding adhesive. Because there is no constant current chip on the back side of the transparent substrate 10, there is no need to apply the bonding adhesive for bonding. Subsequently, the transparent substrate with the constant current chip mounted is placed in an oven for baking to bond the bonding adhesive to the crystal, so as to achieve the purpose of fixing the constant current chip on the transparent substrate.

[0079] In one embodiment, in step S3, the LED chips 20 in the sub-board 11 are connected in series through gold wires to form an LED chip strip, and the two ends of the LED chip strip are respectively connected to the first positive conductive strip 111 and the first negative conductive strip 112 through gold wires 50. Figure 3 and Figure 5 shown.

[0080] Specifically, if all the LED chips 20 in the LED chip mounting area 113 in the sub-board 11 are installed in a row, all the LED chips 20 can be connected in series end to end through the gold wire 50 to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt 111 and the first negative conductive belt 112 through the gold wire 50, and the first positive conductive belt 111 and the first negative conductive belt 112 are respectively connected to the second positive conductive belt 114 and the second negative conductive belt 115 through the gold wire 50. Thus, the second positive conductive belt 114, the first positive conductive belt 111, the LED chip belt and the first negative conductive belt 112, the second negative conductive belt 115 can form a conductive path, and when the second positive conductive belt 114 and the second negative conductive belt 115 are connected to an external input voltage, the conductive path can provide voltage for the LED chips 20 in the LED chip belt, so that the LED chips 20 are powered on and emit light.

[0081] If the LED chips 20 in the LED chip mounting area 113 in the sub-board 11 are installed in multiple rows, all the LED chips 20 can be connected in series end to end through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt 111 and the first negative conductive belt 112 through gold wires 50, and the first positive conductive belt 111 and the first negative conductive belt 112 are respectively connected to the second positive conductive belt 114 and the second negative conductive belt 115 through gold wires 50. Thus, the second positive conductive belt 114, the first positive conductive belt 111, the LED chip belt and the first negative conductive belt 112, the second negative conductive belt 115 can form a conductive path, and when the second positive conductive belt 114 and the second negative conductive belt 115 are connected to an external input voltage, the conductive path can provide voltage for the LED chips 20 in the LED chip belt, so that the LED chips 20 are powered on and emit light.

[0082] Alternatively, the LED chips 20 in each row may be connected in series end to end through the gold wire 50 to form an LED chip strip, and the two ends of the LED chip strip formed after the series connection in each row are respectively connected to the first positive conductive strip 111 and the first negative conductive strip 112 through the gold wire 50. Therefore, when the LED chips 20 are divided into multiple rows, the LED chips 20 in one row form an LED chip strip, thereby forming multiple LED chip strips, and the two ends of each LED chip strip are respectively connected to the first positive conductive strip 111 and the first negative conductive strip 112 through the gold wire 50, and the first positive conductive strip 111 and the first negative conductive strip 112 are respectively connected to the second positive conductive strip 114 and the second negative conductive strip 115 through the gold wire 50. Therefore, in each LED chip strip, the second positive conductive strip 114, the first positive conductive strip 111, the LED chip strip, the first negative conductive strip 112, and the second negative conductive strip 115 form a conductive path, and each LED chip strip forms a conductive path. When the second positive conductive strip 114 and the second negative conductive strip 115 are connected to an external input voltage, each conductive path can provide voltage to the LED chip 20 in the LED chip strip in the conductive path, so that the LED chip 20 is powered on and emits light.

[0083] In some embodiments, the LED chip 20 may be a constant voltage LED chip. At this time, the LED lamp bead board 100 further includes a constant current chip 60, which is fixedly mounted in the constant current chip mounting area 116 of the sub-board 11 through mounting materials to provide a stable voltage for the constant voltage LED chip.

[0084] For example, the mounting material is a bonding adhesive, and the constant current chip 60 is fixedly mounted in the constant current chip mounting area 116 of the daughter board 11 by the bonding adhesive.

[0085] The constant current chip 60 has a constant current function and has a built-in bridge stack. The input voltage can be regardless of positive or negative polarity, thereby providing a stable voltage for the constant voltage LED chip connected thereto.

[0086] like Figure 3 and Figure 5As shown, the constant current chip 60 is electrically connected to the first positive conductive belt 111 and the first negative conductive belt 112 through the gold wire 50, so that the constant current chip 60 can be electrically connected to the constant voltage LED chip through the first positive conductive belt 111 and the first negative conductive belt 112. At the same time, the constant current chip 60 is electrically connected to the second positive conductive belt 114 and the second negative conductive belt 115 through the gold wire 50, so that the second positive conductive belt 114, the constant current chip 60, the first positive conductive belt 111, the constant voltage LED chip belt and the first negative conductive belt 112, the constant current chip 60, and the second negative conductive belt 115 can form a conductive path. When the second positive conductive belt 114 and the second negative conductive belt 115 are connected to an external input voltage, the conductive path can provide a stable voltage for the constant voltage LED chip in the constant voltage LED chip belt, so that the constant voltage LED chip is powered on and emits light.

[0087] In one embodiment, in step S4, a powder spraying process is used to evenly spray a first layer of fluorescent glue 30 on the LED chip 20 on the front side of the transparent substrate 10 and make the first layer of fluorescent glue 30 completely contact with the front side of the transparent substrate 10, and a second layer of fluorescent glue 40 is evenly sprayed on the back side of the transparent substrate 10 and make the second layer of fluorescent glue 40 completely contact with the back side of the transparent substrate 10.

[0088] Specifically, a first layer of fluorescent glue 30 is evenly sprayed on the LED chip 20 on the front side of the transparent substrate 10 using a powder spraying process, so that the first layer of fluorescent glue 30 is in complete contact with the front side of the transparent substrate 10; a second layer of fluorescent glue 40 is evenly sprayed on the back side of the transparent substrate 10 using a powder spraying process, so that the second layer of fluorescent glue 40 is in complete contact with the back side of the transparent substrate 10.

[0089] The powder spraying process is to directly atomize the fluorescent glue through the powder spraying equipment and then spray it on the product surface. Before powder spraying, the product surface needs to be treated with a powder spraying fixture, and the areas on the product surface that need to be powder sprayed are opened, and the areas on the product surface that do not need to be powder sprayed are covered.

[0090] As an optional embodiment, Figure 6 and Figure 7As shown, the first layer of fluorescent glue 30 is evenly sprayed only on the LED chip 20 on the front of the transparent substrate 10 by the powder spraying process, and the first layer of fluorescent glue 30 is in full contact with the front of the transparent substrate 10. The first layer of fluorescent glue 30 is not sprayed on other areas of the front of the transparent substrate 10 except the area where the LED chip 20 is located. That is, the first layer of fluorescent glue 30 is evenly sprayed only on the area where the LED chip 20 is located on the front of the transparent substrate 10 by the powder spraying process, that is, the first layer of fluorescent glue 30 is not sprayed on other areas of the front of the transparent substrate 10 except the area where the LED chip 20 is located on the front of the transparent substrate 10. The first layer of fluorescent glue 30 is in full contact with the area where the LED chip 20 is located on the front of the transparent substrate 10. The use of the powder spraying process can make the fluorescent glue cover the LED chip more evenly, and the light output is more uniform.

[0091] like Figure 6 and Figure 7 As shown, the second layer of fluorescent glue 40 is evenly sprayed only on the area where the back of the transparent substrate 10 and the LED chip 20 are located in relative position by using the powder spraying process, and the second layer of fluorescent glue 40 is in full contact with the back of the transparent substrate 10. The spraying area of ​​the second layer of fluorescent glue 40 is equal to the spraying area of ​​the first layer of fluorescent glue 30, and the thickness of the spraying area of ​​the second layer of fluorescent glue 40 is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue 30. That is, the second layer of fluorescent glue 40 is evenly sprayed only on the area where the back of the transparent substrate 10 and the LED chip 20 are located in relative position by using the powder spraying process, and the second layer of fluorescent glue 40 is in full contact with the area where the LED chip 20 is located in relative position on the back of the transparent substrate 10. The spraying area of ​​the second layer of fluorescent glue 40 is equal to the spraying area of ​​the first layer of fluorescent glue 30, but the thickness of the spraying area of ​​the second layer of fluorescent glue 40 is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue 30.

[0092] As another optional embodiment, Figure 8 and Fig. 9 As shown, a first layer of fluorescent glue 30 is evenly sprayed on the area where the sub-board 11 to which the LED chip 20 belongs on the front side of the transparent substrate 10 by a powder spraying process, and the first layer of fluorescent glue 30 is in full contact with the front side of the transparent substrate 10, that is, the first layer of fluorescent glue 30 is evenly sprayed on the area where the sub-board 11 to which the LED chip 20 belongs on the front side of the transparent substrate 10 by a powder spraying process, and the first layer of fluorescent glue 30 is in full contact with the area where each sub-board 11 on the front side of the transparent substrate 10 is located.

[0093] like Figure 8 and Fig. 9As shown, the second layer of fluorescent glue 40 is uniformly sprayed on the area where the back of the transparent substrate 10 and the area where the sub-boards 11 are located by using the powder spraying process, and the second layer of fluorescent glue 40 is in full contact with the back of the transparent substrate 10. The spraying area of ​​the second layer of fluorescent glue 40 is equal to the spraying area of ​​the first layer of fluorescent glue 30, and the thickness of the spraying area of ​​the second layer of fluorescent glue 40 is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue 30. That is, the second layer of fluorescent glue 40 is uniformly sprayed on the area where the back of the transparent substrate 10 and the area where the sub-boards 11 are located by using the powder spraying process, and the second layer of fluorescent glue 40 is in full contact with the area where each sub-board 11 is located on the back of the transparent substrate 10. The spraying area of ​​the second layer of fluorescent glue 40 is equal to the spraying area of ​​the first layer of fluorescent glue 30, but the thickness of the spraying area of ​​the second layer of fluorescent glue 40 is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue 30.

[0094] In the above two embodiments, the first layer of fluorescent glue is evenly sprayed on the front of the transparent substrate, and the second layer of fluorescent glue is evenly sprayed on the back of the transparent substrate by using the powder spraying process, so that the fluorescent glue can be more evenly covered on the LED chip, so that the LED chip emits light more evenly, and the spraying area of ​​the first layer of fluorescent glue is equal to the spraying area of ​​the second layer of fluorescent glue, but the thickness of the spraying area of ​​the first layer of fluorescent glue is thicker than the thickness of the spraying area of ​​the second layer of fluorescent glue. This is because the LED chip is arranged on the front of the transparent substrate, and the LED chip is not arranged on the back of the transparent substrate. The difference in the thickness of the fluorescent glue on the front and back of the transparent substrate is used to make the consistency of the light emission on the front and back of the transparent substrate better. The powder spraying process can make the first layer of fluorescent glue completely contact with the front of the transparent substrate and the second layer of fluorescent glue completely contact with the back of the transparent substrate, so that the heat generated when the fluorescent powder in the fluorescent glue is excited can be directly introduced into the transparent substrate, and the heat resistance is better. The thickness of the fluorescent glue obtained by the powder spraying process is thinner than that obtained by the conventional dispensing process, and the heat resistance is better, and the production efficiency of the powder spraying process is higher.

[0095] In one embodiment, Fig.10 As shown, the LED lamp bead board processing method also includes: step S5, using a printing process to uniformly print a first layer of transparent silicone 70 on the first layer of fluorescent glue 30 on the front side of the transparent substrate 10 and cover the enclosed area of ​​the second positive conductive tape 114 and the second negative conductive tape 115, and uniformly print a second layer of transparent silicone 80 on the second layer of fluorescent glue 40 on the back side of the transparent substrate 10.

[0096] Specifically, Figures 11 to 14 As shown, a first layer of transparent silica gel is evenly printed on the first layer of fluorescent glue 30 on the front side of the transparent substrate 10 by a printing process and covers the enclosed area of ​​the second positive electrode conductive belt 114 and the second negative electrode conductive belt 115 .

[0097] A second layer of transparent silicone 80 is evenly printed on the second layer of fluorescent glue 40 on the back of the transparent substrate 10 using a printing process. The printing area of ​​the second layer of transparent silicone 80 is equal to the printing area of ​​the first layer of transparent silicone 70 , and the thickness of the printing area of ​​the second layer of transparent silicone 80 is equal to the thickness of the printing area of ​​the first layer of transparent silicone 70 .

[0098] In this embodiment, a first layer of transparent silicone is evenly printed on the first layer of fluorescent glue on the front of the transparent substrate, and a second layer of transparent silicone is evenly printed on the second layer of fluorescent glue on the back of the transparent substrate. The thickness of the printed area of ​​the first layer of transparent silicone is equal to the thickness of the printed area of ​​the second layer of transparent silicone. This makes the LED lamp bead board beautifully shaped and emits light evenly. The printing process is used to make the production efficiency of the LED lamp bead board higher.

[0099] In one embodiment, Fig.10 As shown, the LED lamp bead board processing method also includes: step S6, if the transparent substrate 10 is divided into a plurality of sub-boards 11 with the same specifications, the transparent substrate 10 is divided into a plurality of sub-boards 11 with the same specifications according to the regional positions of the sub-boards to obtain a plurality of independent LED lamps.

[0100] Specifically, after the transparent substrate has been through the step of solid crystal in step S2, wire bonding in step S3, powder spraying in step S4, and printing glue in step S5, the LED lamp bead board has been processed on the transparent substrate. At this time, if the transparent substrate is divided into a sub-board, the sub-board can be separated from the transparent substrate according to the regional position of the sub-board divided on the transparent substrate to obtain an independent LED lamp. The obtained LED lamp is as follows: Figure 3 If the transparent substrate is divided into several sub-boards with the same specifications, each sub-board can be separated from the transparent substrate according to the regional position of the sub-boards divided on the transparent substrate to obtain several independent LED lamps. The obtained LED lamps are as shown in FIG. Figure 3 shown.

[0101] Based on the same concept, in one embodiment, Figures 2 to 3 As shown, the present invention further provides an LED lamp bead board 100, which is obtained by using the LED lamp bead board processing method described in any of the above embodiments. The LED lamp bead board 100 includes a transparent substrate 10, a plurality of LED chips 20, a first layer of fluorescent glue 30, a second layer of fluorescent glue 40 and a plurality of gold wires 50, wherein:

[0102] The transparent substrate 10 is divided into at least one sub-board 11, and the front side of the sub-board 11 is silk-screened with an LED chip mounting area 113, a first positive conductive belt 111 and a first negative conductive belt 112 which are not connected to each other;

[0103] A plurality of LED chips 20 are fixedly mounted in the LED chip mounting area 113 of the sub-board 11 by mounting materials;

[0104] The LED chips 20 in the sub-board 11 are connected in series through the gold wire 50 to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt 111 and the first negative conductive belt 112 through the gold wire 50;

[0105] The first layer of fluorescent glue 30 is evenly sprayed on the LED chip on the front side of the transparent substrate 10 using a powder spraying process so that the first layer of fluorescent glue 30 is in full contact with the front side of the transparent substrate 10. The second layer of fluorescent glue 40 is evenly sprayed on the back side of the transparent substrate 10 using a powder spraying process so that the second layer of fluorescent glue 40 is in full contact with the back side of the transparent substrate 10.

[0106] In the present embodiment, an LED lamp bead board is provided, including a transparent substrate, a plurality of LED chips, a first layer of fluorescent glue, a second layer of fluorescent glue and a plurality of gold wires, wherein: the transparent substrate is divided into at least one sub-board, and the front side of the sub-board is silk-screened with an LED chip mounting area, a first positive conductive belt and a first negative conductive belt that are not connected to each other; a plurality of LED chips are fixedly mounted in the LED chip mounting area of ​​the sub-board through mounting materials; the LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires; the first layer of fluorescent glue is evenly sprayed on the LED chip on the front side of the transparent substrate by a powder spraying process and the first layer of fluorescent glue is in full contact with the front side of the transparent substrate, and the second layer of fluorescent glue is evenly sprayed on the back side of the transparent substrate by a powder spraying process and the second layer of fluorescent glue is in full contact with the back side of the transparent substrate. Therefore, by adopting the powder spraying process, the fluorescent glue can be more evenly covered on the LED chip, making the LED chip emit light more evenly; the fluorescent glue using the powder spraying process is in full contact with the transparent substrate, and the heat generated when the fluorescent powder is excited can be directly introduced into the transparent substrate, making the heat resistance of the LED lamp bead better; the thickness of the fluorescent glue obtained by the powder spraying process is thinner than that obtained by the conventional dispensing process, and the heat resistance is better, and the production efficiency of the powder spraying process is higher. Therefore, the problem that the current LED lamp bead board adopts the dispensing process, resulting in poor heat resistance of the LED lamp bead, which affects the normal operation of the LED lamp bead can be solved.

[0107] In one embodiment, the transparent substrate 10 is divided into at least one sub-board 11 , and the front side of the sub-board 11 is screen-printed with an LED chip mounting area 113 , a first positive conductive strip 111 and a first negative conductive strip 112 that are not connected to each other.

[0108] Specifically, the transparent substrate 10 is divided into a sub-board 11, such as Figure 3 A daughter board 11 is shown.

[0109] like Figure 2 and Figure 4 As shown, the transparent substrate 10 is divided into a plurality of sub-boards 11 of the same specification, each sub-board 11 is as shown in FIG. Figure 3 As shown. On the front of the transparent substrate 10, the layout is divided according to rows (M) and columns (N), and M x N regions are formed between each row and each column. The specifications of each region are consistent, including the specifications of size and shape. Each region is a sub-board 11, so that a plurality of sub-boards 11 with consistent specifications are divided on the front of the transparent substrate 10 according to the row and column rules. Each sub-board 11 is as shown in FIG. Figure 3 shown.

[0110] like Figure 3 As shown, the front side of the sub-board 11 is silk-screened with an LED chip mounting area 113 , a first positive conductive tape 111 and a first negative conductive tape 112 which are not connected to each other, and the first positive conductive tape 111 and the first negative conductive tape 112 are arranged around the LED chip mounting area 113 .

[0111] In some embodiments, Figure 3 As shown, the front side of the sub-board 11 is also screen-printed with a second positive conductive belt 114 and a second negative conductive belt 115 which are not connected to each other. The second positive conductive belt 114 and the second negative conductive belt 115 are respectively arranged on the periphery of the first positive conductive belt 111 and the first negative conductive belt 112. The first positive conductive belt 111 and the second positive conductive belt 114 are isolated, and the first negative conductive belt 112 and the second negative conductive belt 115 are isolated.

[0112] In some embodiments, Figure 3 As shown, a constant current chip mounting area 116 is also silk-screened on the front of the daughter board 11 .

[0113] For example, the transparent substrate 10 is a transparent sapphire substrate, the sub-plate 11 is rectangular, and a plurality of rectangular sub-plates of the same specification are divided on the front side of the transparent sapphire substrate according to rectangular rules of rows and columns.

[0114] In one embodiment, a plurality of LED chips 20 are fixedly mounted in the LED chip mounting area 113 of the sub-board 11 by mounting materials.

[0115] Specifically, Figure 5 As shown, if the transparent substrate 10 is divided into a sub-board 11, a plurality of LED chips 20 are fixedly mounted in the LED chip mounting area 113 of the sub-board 11 by means of mounting materials.

[0116] like Figure 2 and Figure 4 As shown, if the transparent substrate 10 is divided into a plurality of sub-boards 11 of the same specification, each sub-board 11 is as shown in FIG. Figure 3 and Figure 5As shown, a plurality of LED chips 20 are evenly distributed according to the number of sub-boards 11 of the transparent substrate 10, and the LED chips 20 distributed to each sub-board 11 are fixedly installed in the LED chip installation area 113 of the corresponding sub-board 11 by means of installation materials.

[0117] For example, the installation material is a bonding adhesive, which is prepared by using fluorescent powder, diffusion powder and silicone, and then baked according to the silicone baking conditions. With the help of the diffusion powder, the fluorescent powder will be evenly distributed in the silicone.

[0118] The LED chip 20 is mounted on the LED chip mounting area 113 of the sub-board 11 on the front side of the transparent substrate 10 by means of a bonding adhesive. Since there is no LED chip on the back side of the transparent substrate, no bonding adhesive is applied for bonding. Subsequently, the transparent substrate with the LED chip mounted is placed in an oven for baking to bond the bonding adhesive, thereby achieving the purpose of fixing the LED chip on the transparent substrate.

[0119] In some embodiments, Figure 3 and Figure 5 As shown, the LED chip 20 can be a constant voltage LED chip. At this time, the LED lamp bead board 100 also includes a constant current chip 60, which is fixedly mounted in the constant current chip mounting area 116 of the sub-board 11 through mounting materials.

[0120] For example, the mounting material is a bonding adhesive, and the constant current chip 60 is mounted in the constant current chip mounting area 116 of the sub-board 11 on the front side of the transparent substrate 10 by the bonding adhesive. Because there is no constant current chip on the back side of the transparent substrate 10, there is no need to apply the bonding adhesive for bonding. Subsequently, the transparent substrate with the constant current chip mounted is placed in an oven for baking to bond the bonding adhesive to the crystal, so as to achieve the purpose of fixing the constant current chip on the transparent substrate.

[0121] In one embodiment, the LED chips 20 in the sub-board 11 are connected in series through the gold wire 50 to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt 111 and the first negative conductive belt 112 through the gold wire 50. Figure 3 and Figure 5 shown.

[0122] Specifically, if all the LED chips 20 in the LED chip mounting area 113 in the sub-board 11 are installed in a row, all the LED chips 20 can be connected in series end to end through the gold wire 50 to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt 111 and the first negative conductive belt 112 through the gold wire 50, and the first positive conductive belt 111 and the first negative conductive belt 112 are respectively connected to the second positive conductive belt 114 and the second negative conductive belt 115 through the gold wire 50. Thus, the second positive conductive belt 114, the first positive conductive belt 111, the LED chip belt and the first negative conductive belt 112, the second negative conductive belt 115 can form a conductive path, and when the second positive conductive belt 114 and the second negative conductive belt 115 are connected to an external input voltage, the conductive path can provide voltage for the LED chips 20 in the LED chip belt, so that the LED chips 20 are powered on and emit light.

[0123] If the LED chips 20 in the LED chip mounting area 113 in the sub-board 11 are installed in multiple rows, all the LED chips 20 can be connected in series end to end through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt 111 and the first negative conductive belt 112 through gold wires 50, and the first positive conductive belt 111 and the first negative conductive belt 112 are respectively connected to the second positive conductive belt 114 and the second negative conductive belt 115 through gold wires 50. Thus, the second positive conductive belt 114, the first positive conductive belt 111, the LED chip belt and the first negative conductive belt 112, the second negative conductive belt 115 can form a conductive path, and when the second positive conductive belt 114 and the second negative conductive belt 115 are connected to an external input voltage, the conductive path can provide voltage for the LED chips 20 in the LED chip belt, so that the LED chips 20 are powered on and emit light.

[0124] Alternatively, the LED chips 20 in each row may be connected in series end to end through the gold wire 50 to form an LED chip strip, and the two ends of the LED chip strip formed after the series connection in each row are respectively connected to the first positive conductive strip 111 and the first negative conductive strip 112 through the gold wire 50. Therefore, when the LED chips 20 are divided into multiple rows, the LED chips 20 in one row form an LED chip strip, thereby forming multiple LED chip strips, and the two ends of each LED chip strip are respectively connected to the first positive conductive strip 111 and the first negative conductive strip 112 through the gold wire 50, and the first positive conductive strip 111 and the first negative conductive strip 112 are respectively connected to the second positive conductive strip 114 and the second negative conductive strip 115 through the gold wire 50. Therefore, in each LED chip strip, the second positive conductive strip 114, the first positive conductive strip 111, the LED chip strip, the first negative conductive strip 112, and the second negative conductive strip 115 form a conductive path, and each LED chip strip forms a conductive path. When the second positive conductive strip 114 and the second negative conductive strip 115 are connected to an external input voltage, each conductive path can provide voltage to the LED chip 20 in the LED chip strip in the conductive path, so that the LED chip 20 is powered on and emits light.

[0125] In some embodiments, the LED chip 20 may be a constant voltage LED chip. At this time, the LED lamp bead board 100 further includes a constant current chip 60, which is fixedly mounted in the constant current chip mounting area 116 of the sub-board 11 through mounting materials to provide a stable voltage for the constant voltage LED chip.

[0126] For example, the mounting material is a bonding adhesive, and the constant current chip 60 is fixedly mounted in the constant current chip mounting area 116 of the daughter board 11 by the bonding adhesive.

[0127] The constant current chip 60 has a constant current function and has a built-in bridge stack. The input voltage can be regardless of positive or negative polarity, thereby providing a stable voltage for the constant voltage LED chip connected thereto.

[0128] like Figure 3 and Figure 5As shown, the constant current chip 60 is electrically connected to the first positive conductive belt 111 and the first negative conductive belt 112 through the gold wire 50, so that the constant current chip 60 can be electrically connected to the constant voltage LED chip through the first positive conductive belt 111 and the first negative conductive belt 112. At the same time, the constant current chip 60 is electrically connected to the second positive conductive belt 114 and the second negative conductive belt 115 through the gold wire 50, so that the second positive conductive belt 114, the constant current chip 60, the first positive conductive belt 111, the constant voltage LED chip belt and the first negative conductive belt 112, the constant current chip 60, and the second negative conductive belt 115 can form a conductive path. When the second positive conductive belt 114 and the second negative conductive belt 115 are connected to an external input voltage, the conductive path can provide a stable voltage for the constant voltage LED chip in the constant voltage LED chip belt, so that the constant voltage LED chip is powered on and emits light.

[0129] In one embodiment, the first layer of fluorescent glue 30 is evenly sprayed on the LED chip on the front side of the transparent substrate 10 using a powder spraying process so that the first layer of fluorescent glue 30 is in full contact with the front side of the transparent substrate 10, and the second layer of fluorescent glue 40 is evenly sprayed on the back side of the transparent substrate 10 using a powder spraying process so that the second layer of fluorescent glue 40 is in full contact with the back side of the transparent substrate 10.

[0130] The powder spraying process is to directly atomize the fluorescent glue through the powder spraying equipment and then spray it on the product surface. Before powder spraying, the product surface needs to be treated with a powder spraying fixture, and the areas on the product surface that need to be powder sprayed are opened, and the areas on the product surface that do not need to be powder sprayed are covered.

[0131] As an optional embodiment, Figure 6 and Figure 7 As shown, the first layer of fluorescent glue 30 is evenly sprayed only on the area 113 where the LED chip is located on the front of the transparent substrate 10 by using a powder spraying process, that is, except for spraying the first layer of fluorescent glue 30 on the area 113 where the LED chip is located on the front of the transparent substrate 10, the first layer of fluorescent glue 30 is not sprayed on other areas on the front of the transparent substrate 10. The first layer of fluorescent glue 30 is in full contact with the area 113 where the LED chip is located on the front of the transparent substrate 10. The powder spraying process can make the fluorescent glue cover the LED chip 20 more evenly, and the light output is more uniform.

[0132] like Figure 6 and Figure 7As shown, the second layer of fluorescent glue 40 is evenly sprayed only on the area on the back of the transparent substrate 10 where the LED chip 20 is located, using a powder spraying process. The second layer of fluorescent glue 40 is in full contact with the area on the back of the transparent substrate 10 where the LED chip 20 is located. The spraying area of ​​the second layer of fluorescent glue 40 is equal to the spraying area of ​​the first layer of fluorescent glue 30, but the thickness of the spraying area of ​​the second layer of fluorescent glue 40 is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue 30.

[0133] As another optional embodiment, Figure 8 and Fig. 9 As shown, the first layer of fluorescent glue 30 is evenly sprayed on the area where the sub-board 11 of the LED chip 20 is located on the front of the transparent substrate 10 by using a powder spraying process, and the first layer of fluorescent glue 30 is completely in contact with the area where each sub-board 11 is located on the front of the transparent substrate 10.

[0134] like Figure 8 and Fig. 9 As shown, the second layer of fluorescent glue 40 is evenly sprayed on the back of the transparent substrate 10 and the area where the sub-boards 11 are located by a powder spraying process, and the second layer of fluorescent glue 40 is completely in contact with the area where each sub-board 11 is located on the back of the transparent substrate 10. The spraying area of ​​the second layer of fluorescent glue 40 is equal to the spraying area of ​​the first layer of fluorescent glue 30, but the thickness of the spraying area of ​​the second layer of fluorescent glue 40 is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue 30.

[0135] In the above two embodiments, the first layer of fluorescent glue is evenly sprayed on the front of the transparent substrate, and the second layer of fluorescent glue is evenly sprayed on the back of the transparent substrate by using the powder spraying process, so that the fluorescent glue can be more evenly covered on the LED chip, so that the LED chip emits light more evenly, and the spraying area of ​​the first layer of fluorescent glue is equal to the spraying area of ​​the second layer of fluorescent glue, but the thickness of the spraying area of ​​the first layer of fluorescent glue is thicker than the thickness of the spraying area of ​​the second layer of fluorescent glue. This is because the LED chip is arranged on the front of the transparent substrate, and the LED chip is not arranged on the back of the transparent substrate. The difference in the thickness of the fluorescent glue on the front and back of the transparent substrate is used to make the consistency of the light emission on the front and back of the transparent substrate better. The powder spraying process can make the first layer of fluorescent glue completely contact with the front of the substrate and the second layer of fluorescent glue completely contact with the back of the substrate, so that the heat generated when the fluorescent powder in the fluorescent glue is excited can be directly introduced into the transparent substrate, and the heat resistance is better. The thickness of the fluorescent glue obtained by the powder spraying process is thinner than that obtained by the conventional dispensing process, and the heat resistance is better, and the production efficiency of the powder spraying process is higher.

[0136] In one embodiment, Figures 11 to 14As shown, the LED lamp bead board 100 also includes a first layer of transparent silicone 70 and a second layer of transparent silicone 80. The first layer of transparent silicone 70 is evenly printed on the first layer of fluorescent glue 30 on the front side of the transparent substrate 10 by a printing process and covers the enclosed area of ​​the second positive conductive tape 114 and the second negative conductive tape 115. The second layer of transparent silicone 80 is evenly printed on the second layer of fluorescent glue 40 on the back side of the transparent substrate 10 by a printing process. The printing area of ​​the first layer of transparent silicone 70 is equal to the printing area of ​​the second layer of transparent silicone 80, and the thickness of the printing area of ​​the first layer of transparent silicone 70 is equal to the thickness of the printing area of ​​the second layer of transparent silicone 80.

[0137] In this embodiment, a first layer of transparent silicone is evenly printed on the first layer of fluorescent glue on the front side of the transparent substrate and covers the enclosed area of ​​the second positive conductive belt and the second negative conductive belt, and a second layer of transparent silicone is evenly printed on the second layer of fluorescent glue on the back side of the transparent substrate. The thickness of the printed area of ​​the first layer of transparent silicone is equal to the thickness of the printed area of ​​the second layer of transparent silicone, so that the LED lamp bead board has beautiful shape and uniform light output, and the printing process is adopted to make the production efficiency of the LED lamp bead board higher.

[0138] In one embodiment, if the transparent substrate 10 is divided into a plurality of sub-boards 11 of the same specification, the transparent substrate 10 is divided into a plurality of sub-boards 11 of the same specification according to the regional positions of the sub-boards 11 to obtain a plurality of independent LED lamps 200 .

[0139] Specifically, after the transparent substrate has been subjected to die bonding, wire bonding, powder spraying and glue printing, the processing of the LED lamp bead board has been completed on the transparent substrate. At this time, if the transparent substrate is divided into a sub-board, the sub-board can be separated from the transparent substrate according to the regional position of the sub-board divided on the transparent substrate to obtain an independent LED lamp. The obtained LED lamp is as follows Figure 3 If the transparent substrate is divided into several sub-boards with the same specifications, each sub-board can be separated from the transparent substrate according to the regional position of the sub-boards divided on the transparent substrate to obtain several independent LED lamps. The obtained LED lamps are as shown in FIG. Figure 3 shown.

[0140] It should be noted that the above-mentioned LED lamp bead board embodiment and the LED lamp bead board processing method embodiment belong to the same concept, and the specific implementation process is detailed in the LED lamp bead board processing method embodiment, and the technical features in the LED lamp bead board processing method embodiment are correspondingly applicable in the above-mentioned LED lamp bead board embodiment, which will not be repeated here.

[0141] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0142] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the above embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the above embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for processing LED lamp beads, characterized in that: Applied to an LED lamp bead board, the LED lamp bead board includes a transparent substrate, a plurality of LED chips and a plurality of gold wires, and the LED lamp bead board processing method includes: At least one sub-board is divided on the transparent substrate, and the front side of the sub-board is silk-screened with an LED chip mounting area, a first positive conductive belt and a first negative conductive belt that are not connected to each other; Fixing a plurality of LED chips in the LED chip mounting area of ​​the sub-board by means of mounting materials; The LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires; A first layer of fluorescent glue is evenly sprayed on the LED chip on the front of the transparent substrate using a powder spraying process so that the first layer of fluorescent glue is in full contact with the front of the transparent substrate, and a second layer of fluorescent glue is evenly sprayed on the back of the transparent substrate so that the second layer of fluorescent glue is in full contact with the back of the transparent substrate.

2. The LED lamp bead board processing method according to claim 1, characterized in that: The front side of the sub-board is also silk-screened with a second positive conductive belt and a second negative conductive belt that are not connected to each other. The second positive conductive belt and the second negative conductive belt are respectively arranged on the periphery of the first positive conductive belt and the first negative conductive belt. The first positive conductive belt and the second positive conductive belt are isolated, and the first negative conductive belt and the second negative conductive belt are isolated.

3. The LED lamp bead board processing method according to claim 1, characterized in that: The mounting material is a die-bonding adhesive, and the step of fixing a plurality of LED chips in the LED chip mounting area of ​​the sub-board through the mounting material comprises: The LED chip is mounted on the LED chip mounting area through the bonding adhesive, and then the transparent substrate with the LED chip mounted is placed in an oven for baking to bond the bonding adhesive, thereby fixing the LED chip on the transparent substrate.

4. The LED lamp bead board processing method according to claim 2, characterized in that: The LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires, including: If all the LED chips in the LED chip mounting area of ​​the sub-board are mounted in a row, all the LED chips are connected in series end to end through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires, and the first positive conductive belt and the first negative conductive belt are respectively connected to the second positive conductive belt and the second negative conductive belt through gold wires; or, If the LED chips in the LED chip mounting area of ​​the sub-board are installed in multiple rows, all the LED chips are connected in series end to end through gold wires to form an LED chip strip, and the two ends of the LED chip strip are respectively connected to the first positive conductive strip and the first negative conductive strip through gold wires, and the first positive conductive strip and the first negative conductive strip are respectively connected to the second positive conductive strip and the second negative conductive strip through gold wires; or, the LED chips in each row are connected in series end to end through gold wires to form an LED chip strip, thereby forming multiple LED chip strips, and the two ends of each LED chip strip are respectively connected to the first positive conductive strip and the first negative conductive strip through gold wires, and the first positive conductive strip and the first negative conductive strip are respectively connected to the second positive conductive strip and the second negative conductive strip through gold wires.

5. The LED lamp bead board processing method according to claim 2, characterized in that: The LED chip is a constant voltage LED chip, the LED lamp bead board also includes a constant current chip, the front of the sub-board is also silk-screened with a constant current chip installation area, and the constant current chip is fixedly installed in the constant current chip installation area by means of installation materials; The constant current chip is electrically connected to the first positive conductive belt and the first negative conductive belt through gold wires, so that the constant current chip is electrically connected to the constant voltage LED chip through the first positive conductive belt and the first negative conductive belt. At the same time, the constant current chip is electrically connected to the second positive conductive belt and the second negative conductive belt through gold wires.

6. The LED lamp bead board processing method according to claim 1, characterized in that: The method of using a powder spraying process to uniformly spray a first layer of fluorescent glue on the LED chip on the front side of the transparent substrate so that the first layer of fluorescent glue is in full contact with the front side of the transparent substrate, and uniformly spraying a second layer of fluorescent glue on the back side of the transparent substrate so that the second layer of fluorescent glue is in full contact with the back side of the transparent substrate comprises: The first layer of fluorescent glue is evenly sprayed only on the LED chip on the front of the transparent substrate by using a powder spraying process so that the first layer of fluorescent glue is in full contact with the front of the transparent substrate, and the first layer of fluorescent glue is not sprayed on other areas on the front of the transparent substrate except the area where the LED chip is located; The powder spraying process is adopted to evenly spray the second layer of fluorescent glue only on the area where the back side of the transparent substrate is located relative to the LED chip, and make the second layer of fluorescent glue completely contact with the back side of the transparent substrate. The spraying area of ​​the second layer of fluorescent glue is equal to the spraying area of ​​the first layer of fluorescent glue, and the thickness of the spraying area of ​​the second layer of fluorescent glue is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue.

7. The LED lamp bead board processing method according to claim 1, characterized in that: The method of using a powder spraying process to uniformly spray a first layer of fluorescent glue on the LED chip on the front side of the transparent substrate so that the first layer of fluorescent glue is in full contact with the front side of the transparent substrate, and uniformly spraying a second layer of fluorescent glue on the back side of the transparent substrate so that the second layer of fluorescent glue is in full contact with the back side of the transparent substrate comprises: A first layer of fluorescent glue is evenly sprayed on the area where the sub-board to which the LED chip belongs on the front of the transparent substrate by a powder spraying process, and the first layer of fluorescent glue is in full contact with the front of the transparent substrate; A powder spraying process is used to evenly spray a second layer of fluorescent glue on the area where the back side of the transparent substrate is relative to the area where the sub-board is located, and the second layer of fluorescent glue is in complete contact with the back side of the transparent substrate. The spraying area of ​​the second layer of fluorescent glue is equal to the spraying area of ​​the first layer of fluorescent glue, and the thickness of the spraying area of ​​the second layer of fluorescent glue is thinner than the thickness of the spraying area of ​​the first layer of fluorescent glue.

8. The LED lamp bead board processing method according to claim 1, characterized in that: The LED lamp bead board processing method also includes: using a printing process to evenly print a first layer of transparent silicone on the first layer of fluorescent glue on the front side of the transparent substrate, and evenly printing a second layer of transparent silicone on the second layer of fluorescent glue on the back side of the transparent substrate.

9. The LED lamp bead board processing method according to claim 1, characterized in that: The LED lamp bead board processing method also includes: if the transparent substrate is divided into a plurality of sub-boards with the same specifications, the transparent substrate is divided into a plurality of sub-boards with the same specifications according to the regional positions of the sub-boards to obtain a plurality of independent LED lamps.

10. An LED lamp bead board, characterized in that: The LED lamp bead board is obtained by applying the LED lamp bead board processing method according to any one of claims 1 to 9, and the LED lamp bead board comprises a transparent substrate, a plurality of LED chips, a first layer of fluorescent glue, a second layer of fluorescent glue and a plurality of gold wires, wherein: The transparent substrate is divided into at least one sub-board, and the front side of the sub-board is silk-screened with an LED chip mounting area, a first positive conductive belt and a first negative conductive belt that are not connected to each other; A plurality of LED chips are fixedly mounted in the LED chip mounting area of ​​the sub-board by means of mounting materials; The LED chips in the sub-board are connected in series through gold wires to form an LED chip belt, and the two ends of the LED chip belt are respectively connected to the first positive conductive belt and the first negative conductive belt through gold wires; The first layer of fluorescent glue is evenly sprayed on the LED chip on the front side of the transparent substrate using a powder spraying process so that the first layer of fluorescent glue is in full contact with the front side of the substrate. The second layer of fluorescent glue is evenly sprayed on the back side of the transparent substrate using a powder spraying process so that the second layer of fluorescent glue is in full contact with the back side of the substrate.

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