Display device and manufacturing method thereof

Abstract

The invention discloses a display device and a manufacturing method thereof. The display device comprises a flexible array substrate, a first connecting layer, a second connecting layer, a conductive adhesive film and a connecting circuit layer. The flexible array substrate has an effective region. The first connecting layer is arranged on the flexible array substrate and is distributed along the first edge of the effective area. The second connecting layer is arranged on the flexible array substrate, is distributed along the first edge and at least covers part of the first connecting layer. The conductive adhesive film is arranged on the flexible array substrate, is distributed along the first edge and is not adjacent to the first connecting layer. The connecting line layer is arranged on the conductive adhesive film. The Young's modulus of the conductive adhesive film is larger than that of the first connecting layer.

Description

Technical Field

[0001] The present invention relates to a panel structure and a display device containing the panel structure, in particular to a panel structure which is not easy to be broken during the manufacturing process and a display device containing the panel structure. Background Art

[0002] With the rapid development of display technology, displays have gradually developed from early cathode ray tube displays to current flat panel displays. Compared with flat panel displays composed of hard substrates (such as glass substrates), flexible substrates (such as plastic substrates) have the characteristics of flexibility and impact resistance. Therefore, in recent years, research has been conducted on flexible displays that use active components on flexible substrates.

[0003] In the manufacturing process of the existing flexible display, each component is first made on a hard substrate (such as a glass substrate), for example, a flexible substrate and a chip on film (COF) board are made on a glass substrate, wherein the chip on film is adhered to the flexible substrate through a conductive film (such as anisotropic conductive film, ACF). However, when the hard substrate is removed after the manufacturing is completed, since the conductive film generally has high rigidity, when the hard substrate is peeled off, the flexible substrate is easily cracked due to pulling, and even easily broken at the place where the conductive film is adhered.

[0004] In order to solve the above problems, the prior art attaches a protective film to the active area (AA) of the flexible substrate, and applies a protective adhesive layer to the gap between the protective film and the conductive adhesive film to protect the flexible substrate. However, this method is still prone to fracture at the attachment point of the conductive adhesive film on the flexible substrate, and there is still the problem of cracks at other locations on the flexible substrate where the protective adhesive layer is not attached. In addition, if the protective adhesive layer is applied too thinly, it is easy to cause uneven coating. On the contrary, if the protective adhesive layer is applied too thickly, it is easy to generate bubbles at the edge of the protective film. Therefore, there is still a need for a display device and a manufacturing method thereof to solve the problems caused by the prior art. Summary of the invention

[0005] To solve the above-mentioned problems of the prior art, an embodiment of the present invention provides a display device, including a flexible array substrate, a first connection layer, a second connection layer, a conductive adhesive film and a connection circuit layer. The flexible array substrate has an effective area. The first connection layer is arranged on the flexible array substrate and distributed along the first edge of the effective area. The second connection layer is arranged on the flexible array substrate, distributed along the first edge and at least partially covers the first connection layer. The conductive adhesive film is arranged on the flexible array substrate, distributed along the first edge and not adjacent to the first connection layer, and the connection circuit layer is arranged on the conductive adhesive film. Among them, the Young's modulus of the conductive adhesive film is greater than the Young's modulus of the first connection layer.

[0006] To solve the above-mentioned problems of the prior art, one embodiment of the present invention provides a method for manufacturing a display device, comprising the following steps: providing a hard substrate; setting a flexible array substrate on the hard substrate; coating a first connection layer on the flexible array substrate, wherein the first connection layer is distributed along the first edge and is located outside the effective area; coating a conductive adhesive film on the flexible array substrate and not adjacent to the first connection layer, wherein the conductive adhesive film is distributed along the first edge and is located outside the effective area; attaching a connection circuit layer on the conductive adhesive film; attaching a protective layer to the effective area on the flexible array substrate; coating a second connection layer on the flexible array substrate and adjacent to the first connection layer, wherein the second connection layer is distributed along the first edge and is not adjacent to the protective layer; removing the hard substrate; and removing the protective layer.

[0007] To solve the above-mentioned problems of the prior art, another embodiment of the present invention provides a display device, comprising a flexible array substrate, a first connection layer, a conductive adhesive film, and a connection circuit layer. The flexible array substrate has an effective area. The first connection layer is arranged on the flexible array substrate and distributed along the first edge of the effective area. The conductive adhesive film is arranged on the flexible array substrate, distributed along the first edge and at least partially covers the first connection layer. The connection circuit layer is arranged on the conductive adhesive film. The Young's modulus of the conductive adhesive film is greater than the Young's modulus of the first connection layer.

[0008] To solve the above-mentioned problems of the prior art, another embodiment of the present invention provides a method for manufacturing a display device, comprising the following steps: providing a hard substrate; arranging a flexible array substrate on the hard substrate; coating a first connection layer on the flexible array substrate, wherein the first connection layer is distributed along the first edge and is located outside the effective area; coating a conductive adhesive film on the flexible array substrate and at least partially covering the first connection layer, wherein the conductive adhesive film is distributed along the first edge and is located outside the effective area; attaching a connection circuit layer on the conductive adhesive film; attaching a protective layer on the effective area; removing the hard substrate; and removing the protective layer.

[0009] According to the display device of the present invention, the first connection layer is arranged on the flexible array substrate and distributed along the first edge of the effective area. The second connection layer is arranged on the flexible array substrate, distributed along the first edge and at least partially covers the first connection layer. The conductive adhesive film is arranged on the flexible array substrate, distributed along the first edge and not adjacent to the first connection layer. The Young's modulus of the conductive adhesive film is greater than the Young's modulus of the first connection layer. In this way, when the hard substrate is removed during the manufacturing process of the display device, the high Young's modulus of the conductive adhesive material and the relatively low Young's modulus of the first connection layer can make the flexible array substrate attached to the first connection layer and the conductive adhesive material during the manufacturing process of the display device not produce crack defects, thereby improving the manufacturing yield of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A is a schematic top view of a display device according to an embodiment of the present invention.

[0011] Figure 1B is based on Figure 1A A schematic cross-sectional view of the display device of the embodiment along line segment AA′.

[0012] Figure 2 is based on Figure 1A A flowchart of manufacturing the display device of the embodiment.

[0013] 3A to 3H is based on Figure 1A Schematic diagram of the manufacturing process of the display device of the embodiment.

[0014] Figure 4A is a schematic top view of a display device according to another embodiment of the present invention.

[0015] Figure 4B is based on Figure 4A A schematic cross-sectional view of the display device of the embodiment along line segment BB'.

[0016] Figure 5 is based on Figure 4A A flowchart of manufacturing the display device of the embodiment.

[0017] FIG. 6A to FIG. 6G is based on Figure 4A Schematic diagram of the manufacturing process of the display device of the embodiment.

[0018] Fig. 7A is a schematic top view of a display device according to yet another embodiment of the present invention.

[0019] Figure 7B is based on Fig. 7A A schematic cross-sectional view of the display device of the embodiment along line CC'.

[0020] Figure 7Cis based on Fig. 7A Schematic diagram of peeling off the hard substrate 20 in the manufacturing process of the display device of the embodiment.

[0021] Fig. 8A is a schematic top view of a display device according to yet another embodiment of the present invention.

[0022] Figure 8B is based on Fig. 8A A schematic cross-sectional view of the display device of the embodiment along line segment DD'.

[0023] Figure 8C is based on Fig. 8A Schematic diagram of peeling off the hard substrate 20 in the manufacturing process of the display device of the embodiment.

[0024] Fig. 9A is a schematic top view of a display device according to yet another embodiment of the present invention.

[0025] Fig. 9B is based on Fig. 9A A schematic cross-sectional view of the display device of the embodiment along line segment EE'.

[0026] Fig. 9C is based on Fig. 9A Schematic diagram of peeling off the hard substrate 20 in the manufacturing process of the display device of the embodiment.

[0027] Description of reference numerals:

[0028] 1.1A, 1B, 1C, 1D display device

[0029] 10Flexible array substrate

[0030] 11 Effective Area

[0031] 12 protection layers

[0032] 20Hard substrate

[0033] 101 First Connection Layer

[0034] 102 Second connection layer

[0035] 103 conductive film

[0036] 104 Connect the circuit board

[0037] 111 First Edge

[0038] 1021 Electrical connection area

[0039] AA', BB', CC', DD', EE' line segments

[0040] D1, D2, D3 directions

[0041] Steps S101 to S109, S201 to S208

[0042] W1, W2, W3 width DETAILED DESCRIPTION

[0043] Various embodiments will be described below, and those skilled in the art should be able to easily understand the concept and principle of the present invention by referring to the description with the accompanying drawings. However, although some specific embodiments will be described in detail herein, these embodiments are only illustrative and are not to be considered as limiting or exhaustive in all respects. Therefore, for those skilled in the art, various changes and modifications to the present invention should be obvious and easily achievable without departing from the concept and principle of the present invention.

[0044] In the embodiments of the present invention, "upper", "lower", "left", "right", "front" or "rear" is used herein to describe the relationship between one element and another element, and is only used to illustrate the orientation presented in the figure, and does not limit its actual position. The device in the drawings does not limit the orientation or orientation of its elements due to the flipping of the device. In addition, in order to clearly indicate the directional relationship between different drawings, the Cartesian coordinate system (XYZ coordinate system; i.e., rectangular coordinate system) is used as an example in some of the drawings to indicate the corresponding directions, but the present invention is not limited thereto.

[0045] Figure 1A is a schematic top view of a display device according to an embodiment of the present invention. Figure 1B is based on Figure 1A A schematic cross-sectional view of the display device of the embodiment along line segment AA'. Figure 1A and Figure 1B. The display device 1 includes a flexible array substrate 10, a first connection layer 101, a second connection layer 102, a conductive adhesive film 103 and a connection circuit layer 104. The flexible array substrate 10 has an active area 11 (i.e., the active area of ​​the display device 1, also known as the AA area). The flexible array substrate 10 is a basic element of the existing TFT-LCD display device and is not described in detail here. The first connection layer 101 is arranged on the flexible array substrate 10 and distributed along the first edge 111 of the active area 11, wherein the first connection layer 101 is not located in the active area 11 to avoid the user directly seeing the first connection layer 101 when viewing the display device 1 and affecting the field of vision. The first connection layer 101 can be an organic or inorganic material such as acrylic, styrene, epoxy resin, UV curing glue, heat curing glue, moisture curing glue, etc., which is not limited here. The conductive adhesive film 103 is disposed on the flexible array substrate 10. The conductive adhesive film 103 is distributed along the first edge 111 and is not adjacent to the first connection layer 101. The connection circuit layer 104 is disposed on the flexible array substrate 10 and is not adjacent to the first connection layer 101. In this embodiment, the connection circuit layer 104 is, for example, a package (chip on film, COF, i.e., flip chip circuit layer) that integrates the driver chip into the flexible printed circuit board. The thickness of the connection circuit layer 104 is, for example, 50μm. In addition, the connection circuit layer 104 is disposed on the conductive adhesive film 103. The conductive adhesive film 103 is used to position the connection circuit layer 104 on the flexible array substrate 10 and electrically connect the flexible array substrate 10. The conductive adhesive film 103 is, for example, a film layer formed by anisotropic conductive paste (ACP) or anisotropic conductive film (ACF). The thickness of the conductive adhesive film 103 is, for example, 5μm.

[0046] Please continue to refer to Figure 1A and Figure 1B. The second connection layer 102 is also disposed on the flexible array substrate 10 and at least partially covers the first connection layer 101. The second connection layer 102 is distributed along the first edge 111, and the second connection layer 102 is not located in the effective area 11 to avoid affecting the user's viewing. The second connection layer 102 can be made of acrylic, styrene, epoxy resin, heat curing glue, moisture curing glue and other materials. The second connection layer 102 is, for example, disposed in the gap between the conductive adhesive film 103 and the first connection layer 101 and at least partially covers the first connection layer 101, so as to reduce the possibility of the flexible array substrate 10 breaking at the location where the first connection layer 101 and the conductive adhesive film 103 are disposed in the manufacturing process of the display device 1 described later. The second connection layer 102 of this embodiment at least partially covers the first connection layer 101, the conductive adhesive film 103 and the connection circuit layer 104, but in other embodiments, the second connection layer 102 can also be configured not to cover the conductive adhesive film 103 and the connection circuit layer 104, and the present invention is not limited thereto. In addition, the Young's modulus of the conductive adhesive film 103 is greater than that of the first connection layer 101, so that the possibility of the flexible array substrate 10 being broken is reduced in the manufacturing process of the display device 1 described later. The Young's modulus of the second connection layer 102 is preferably greater than or equal to that of the first connection layer 101, which can reduce the possibility of crack defects in the flexible array substrate 10 at the location where the second connection layer 102 is set in the step of removing the hard substrate 20 described later. In this embodiment, the Young's modulus of the conductive adhesive film 103 is preferably between 10MPa and 50GPa, the Young's modulus of the first connection layer 101 is between 10MPa and 50GPa, and the Young's modulus of the second connection layer 102 is also between 10MPa and 50GPa, so that in the manufacturing process of the display device 1 described later, there can be better rigidity transmission when peeling off the hard substrate 20. In addition, the rigidity referred to in the present invention refers to the degree to which the mechanical strength of the flexible array substrate 10 is directly or indirectly enhanced when the first connection layer 101 , the second connection layer 102 , the conductive adhesive film 103 and other adhesive layers are adhered to the flexible array substrate 10 .

[0047] Figure 2 is based on Figure 1A A manufacturing flow chart of the device of the embodiment, 3A to 3H is based on Figure 1A Schematic diagram of the manufacturing process of the device of the embodiment. The manufacturing method of the display device 1 of this embodiment includes the following steps. Please refer to Figure 1A to Figure 2 and Figure 3A First, in step S101, a hard substrate 20 is provided, wherein the hard substrate 20 is, for example, a glass substrate or other suitable materials. Figure 1A to Figure 2 and Figure 3B , step S102, disposing the flexible array substrate 10 on the rigid substrate 20. Please refer to Figure 1A to Figure 2 and Figure 3BStep S103, coating a first connection layer 101 on the flexible array substrate 10, wherein the first connection layer 101 is coated along a direction D3 parallel to the first edge 111 (e.g., a direction parallel to the X-axis), the first connection layer 101 is distributed along the first edge 111 and is located outside the active area 11, and the first connection layer 101 has a width W1 in the direction D3 (shown in Figure 1A In this step, the thickness of the first connection layer 101 is preferably less than 40 μm to avoid bubbles in the step of attaching the protective layer 12 described later. Figure 1A to Figure 2 and Figure 3C , step S104, coating a conductive film 103 on the flexible array substrate 10 and not adjacent to the first connection layer 101, wherein the conductive film 103 is coated in a direction D3 parallel to the first edge 111, the conductive film 103 is distributed along the first edge 111 and is located outside the active area 11, and the conductive film 103 has a width W3 in the direction D3. Please refer to Figure 1A to Figure 2 and Figure 3D , step S105, attaching the connection circuit layer 104 on the conductive film 103, so that the connection circuit layer 104 is electrically connected to the flexible array substrate 10, wherein the connection circuit layer 104 is not located in the active area 11. Please refer to Figure 1A to Figure 2 and Figure 3E Step S106, attaching a protective layer 12 to the active area 11, the protective layer 12 can appropriately enhance the rigidity of the active area 11 on the flexible array substrate 10. In this step, the protective layer 12 can optionally at least partially cover the first connection layer 101, or at least partially cover the conductive adhesive film 103 (as described later). 7A to 7C In this way, the stress on the flexible array substrate 10 can be appropriately dispersed during the process of removing the hard substrate 20 described later. Figure 1A to Figure 2 and Figure 3F Step S107, coating the second connection layer 102 on the flexible array substrate 10 and at least partially covering the first connection layer 101, the second connection layer 102 is distributed along the first edge 111 and is not adjacent to the protective layer 12, wherein the second connection layer 102 has a width W2 in the direction D3 (shown in FIG. Figure 1A ).

[0048] Please refer to Figure 1A to Figure 2 and Figure 3G, step S108, removing the hard substrate 20, for example, by mechanically removing the hard substrate 20 along the first direction D1. In this embodiment, the first direction D1 is, for example, the +Y axis direction. In the first direction D1, the first connection layer 101, the second connection layer 102 and the conductive adhesive film 103 are sequentially arranged on the flexible array substrate 10, that is, at least part of the first connection layer 101 is located between the second connection layer 102 and the first edge 111, and the second connection layer 102 is located between at least part of the first connection layer 101 and the conductive adhesive film 103, wherein the Young's modulus of the conductive adhesive film 103 is greater than the Young's modulus of the first connection layer 101 and the Young's modulus of the second connection layer 102. In this way, when the rigid substrate 20 is peeled off along the first direction D1, the first connection layer 101 will first enhance the rigidity of the flexible array substrate 10, so that no crack defects will be generated when the rigid substrate 20 is peeled off to the position of the first connection layer 101 on the flexible array substrate 10. Then, the second connection layer 102 fills the gap between the first connection layer 101 and the conductive adhesive film 103, which is usually caused by the tolerance when coating the first connection layer 101 and the conductive adhesive layer 103. The second connection layer 102 can also enhance the rigidity of the flexible array substrate 10 to buffer the tensile stress acting on the flexible array substrate 10 when the rigid substrate 20 is peeled off to the position of the second connection layer 102 on the flexible array substrate 10. Furthermore, the conductive adhesive film 103 has a relatively high Young's modulus. When the rigid substrate 20 is peeled off to the location of the conductive adhesive film 103 on the flexible array substrate 10, the rigidity of the flexible array substrate 10 can be further enhanced compared to the location of the first connection layer 101 and the second connection layer 102, so that no crack defect will be generated when the rigid substrate 20 is peeled off to the location of the conductive adhesive film 103 on the flexible array substrate 10. In this way, due to the relatively high Young's modulus of the conductive adhesive material 103 and the relatively low Young's modulus of the first connection layer 101, the flexible array substrate 10 will not generate crack defects at both the locations where it is attached to the first connection layer 101 and the conductive adhesive material 103, thereby improving the manufacturing yield of the display device 1.

[0049] Please refer to Figure 1A , Figure 1B , Figure 3C and Figure 3G. The first connection layer 101 has a width W1 in a direction D3 parallel to the first edge 111 (for example, a direction parallel to the X-axis), and the second connection layer 102 has a width W2 in a direction D3 parallel to the first edge 111, and the width W1 is greater than or equal to the width W2. The conductive adhesive film 103 has a width W3 in a direction D3 parallel to the first edge 111, and the width W2 is greater than or equal to the width W3. In this way, when the positions where the first connection layer 101, the second connection layer 102 and the conductive adhesive film 103 are set on the flexible array substrate 10 in the process of removing the hard substrate 20 along the first direction D1, the positions where the first connection layer 101, the second connection layer 102 and the conductive adhesive film 103 are attached on the flexible array substrate 10 can have better rigidity transmission. Finally, please refer to Figure 1A to Figure 2 and Figure 3H , step S109, removing the protective layer 12, for example, peeling off the protective layer 12 along the second direction D2, to complete the production of the display device 1, wherein the second direction D2 is, for example, the -Y axis direction. In this step, the protective layer 12 can be a release tape / film, such as a PE release film, an OPP release film, a PET fluorine release film, or other suitable materials. Since the protective layer 12 only slightly increases the rigidity of the flexible array substrate 10, the tensile stress generated when removing the protective layer 12 will not cause cracks in the flexible array substrate 10.

[0050] Figure 4A is a schematic top view of a display device according to another embodiment of the present invention. Figure 4B is based on Figure 4A A schematic cross-sectional view of the display device of the embodiment along line segment BB'. Figure 4A and Figure 4BThe display device 1A is similar to the aforementioned display device 1, and the same elements are represented by the same reference numerals and are not repeated here. The differences between the display device 1A and the aforementioned display device 1 are as follows. In the display device 1A, the first connection layer 101 is disposed on the flexible array substrate 10 and distributed along the first edge 111 of the active area 11. The conductive adhesive film 103 is disposed on the flexible array substrate 10, and the conductive adhesive film 103 is distributed along the first edge 111 and at least partially covers the first connection layer 101, and the connection circuit layer 104 is disposed on the conductive adhesive film 103, wherein the display device 1A does not have a second connection layer 102. In the present embodiment, the first connection layer 101 is, for example, disposed around at least a portion of the conductive adhesive film 103, at least a portion of the first connection layer 101 is located between the conductive adhesive film 103 and the first edge 111, and the Young's modulus of the conductive adhesive film 103 is greater than that of the first connection layer 101. In this way, the high Young's modulus of the conductive adhesive material 103 and the relatively low Young's modulus of the first connection layer 101 enable the display device 1A to have no crack defects in the manufacturing process of the flexible array substrate 10 attached to the first connection layer 101 and the conductive adhesive material 103, thereby improving the manufacturing yield of the display device 1A. In the present embodiment, the Young's modulus of the conductive adhesive film 103 is preferably between 10 MPa and 50 GPa, and the Young's modulus of the first connection layer 101 is between 10 MPa and 50 GPa. In this way, in the manufacturing process of the display device 1A described later, better rigidity transfer can be achieved when peeling off the hard substrate 20.

[0051] Figure 5 is based on Figure 4A A flowchart of manufacturing the display device of the embodiment. FIG. 6A to FIG. 6G is based on Figure 4A Schematic diagram of the manufacturing process of the display device of the embodiment. The manufacturing method of the display device 1A is similar to the manufacturing method of the display device 1 described above. The same components are represented by the same reference numerals and will not be repeated here. The differences are as follows. Please refer to FIG. 4A to FIG. 5 and Fig. 6A , Figure 6B , step S201 to step S203, provide a hard substrate 20, set the flexible array substrate 10 on the hard substrate 20, and apply the first connection layer 101 on the flexible array substrate 10, wherein the first connection layer 101 is distributed along the first edge 111 and is located outside the effective area 11. In these steps, the thickness of the first connection layer 101 is preferably less than 40 μm to avoid bubbles in the step of attaching the protective layer 12. In this embodiment, when the first connection layer 101 is applied, an electrical connection area 1021 can be reserved for the conductive adhesive film 103 to be applied. Please refer to FIG. 4A to FIG. 5 and Figure 6C , Fig.6D, steps S204 to S205 are similar to steps S104 to S106 of the manufacturing method of the display device 1 described above. In the manufacturing method of the display device 1A, a conductive film 103 is coated on the flexible array substrate 10 and at least partially covers the first connection layer 101. The conductive film 103 is distributed along the first edge 111 and is located outside the active area 11; the connection circuit layer 104 is attached to the conductive film 103; and the protective layer 12 is attached to the active area 11. Please refer to FIG. 4A to FIG. 5 and FIG. 6E to FIG. 6G , step S206 to step S208, attaching the protective layer 12 to the active area 11, removing the hard substrate 20, and removing the protective layer 12, wherein the second connection layer 102 does not need to be coated in these steps. Please refer to Fig. 6E , the hard substrate 20 is removed, for example, by mechanically peeling off the hard substrate 20 along the first direction D1 (for example, the +Y axis direction). Since the Young's modulus of the conductive adhesive film 103 is greater than that of the first connection layer 101, when the hard substrate 20 is removed, no crack defects will occur on the flexible array substrate 10 at the locations where it is attached to the first connection layer 101 and the conductive adhesive material 103. Please refer to Fig. 6F In another embodiment, the hard substrate 20 can also be removed by mechanically peeling off the hard substrate 20 along the second direction D2 (e.g., the -Y axis direction). Similarly, no crack defects will occur on the flexible array substrate 10 where it is attached to the first connection layer 101 and the conductive adhesive 103. Figure 4A As shown, the first connection layer 101 has a width W1 in a direction D3 parallel to the first edge 111 (for example, a direction parallel to the X-axis), and the conductive adhesive film 103 has a width W3 in a direction D3 parallel to the first edge 111, wherein the width W1 is greater than or equal to the width W3. In this way, in the process of removing the hard substrate 20, the positions where the first connection layer 101 and the conductive adhesive film 103 are attached on the flexible array substrate 10 can have better rigidity transmission.

[0052] Fig. 7A is a schematic top view of a display device according to yet another embodiment of the present invention. Figure 7B is based on Fig. 7A A schematic cross-sectional view of the display device of the embodiment along line CC'. Figure 7C is based on Fig. 7A Schematic diagram of peeling off the hard substrate 20 in the manufacturing process of the display device of the embodiment. Fig. 7A and Figure 7B The display device 1B is similar to the aforementioned display device 1, and the same components are represented by the same reference numerals, which will not be described in detail here. The differences between the display device 1B and the aforementioned display device 1 are as follows. Fig. 7A and Figure 7BIn the display device 1B, the second connection layer 102 does not cover the conductive film 103 and the connection circuit layer 104, and the connection circuit layer 104 partially covers the second connection layer 102 but does not contact the second connection layer 102. Figure 7C In the manufacturing process of the display device 1B, in the step of removing the hard substrate 20 (i.e., step S108), the hard substrate 20 is peeled off along the second direction D2 (e.g., the -Y axis direction). Since the second connection layer 102 is located between at least a portion of the first connection layer 101 and the conductive adhesive film 103, and the conductive adhesive film 103 is located between the second connection layer 102 and the first edge 111, when the hard substrate 20 is peeled off in sequence to the positions of the first connection layer 101, the second connection layer 102, and the conductive adhesive film 103 on the flexible array substrate 10, no crack defects will be generated. In addition, in the step of attaching the protective layer 12 (i.e., step S106), the protective layer 12 does not cover the conductive adhesive film 103 and the connection circuit layer 104 to avoid the generation of bubbles.

[0053] Fig. 8A is a schematic top view of a display device according to yet another embodiment of the present invention. Figure 8B is based on Fig. 8A A schematic cross-sectional view of the display device of the embodiment along line segment DD'. Figure 8C is based on Fig. 8A Schematic diagram of peeling off the hard substrate 20 in the manufacturing process of the display device of the embodiment. Fig. 8A and Figure 8B The display device 1C is similar to the aforementioned display device 1A, and the same elements are represented by the same reference numerals, which will not be described in detail here. The difference between the display device 1C and the aforementioned display device 1A is as follows. In the display device 1C, the conductive adhesive film 103 at least partially covers the first connection layer 101, and the connection line layer 104 at least partially covers the first connection layer 101. In addition, please refer to Figure 8C In the manufacturing process of the display device 1C, in the step of removing the hard substrate 20 (i.e., step S207), the hard substrate 20 is peeled off along the second direction D2 (e.g., the -Y axis direction). Since at least part of the conductive film 103 is located between the first connection layer 101 and the first edge 111, no crack defect will be generated when the hard substrate 20 is peeled off to the position where the first connection layer 101 and the conductive film 103 are located on the flexible array substrate 10. In addition, in the step of attaching the protective layer 12 (i.e., step S206), the protective layer 12 does not cover the conductive film 103 and the connection circuit layer 104 to avoid the generation of bubbles.

[0054] Fig. 9A is a schematic top view of a display device according to yet another embodiment of the present invention. Fig. 9B is based on Fig. 9A A schematic cross-sectional view of the display device of the embodiment along line segment EE'. Fig. 9C is based on Fig. 9A Schematic diagram of peeling off the hard substrate 20 in the manufacturing process of the display device of the embodiment. Fig. 9A and Fig. 9B The display device 1D is similar to the aforementioned display devices 1A and 1C, and the same elements are represented by the same reference numerals, which will not be repeated here. The differences between the display device 1D and the aforementioned display devices 1A and 1C are as follows. In the display device 1C, the conductive adhesive film 103 at least partially covers the first connection layer 101, wherein the first connection layer 101 has a width W1 in a direction parallel to the first edge 111, and the conductive adhesive film 103 has a width W3 in a direction parallel to the first edge 111, and the width W1 is equal to the width W3. In the process of removing the hard substrate 20, the positions where the first connection layer 101 and the conductive adhesive film 103 are attached on the flexible array substrate 10 can have good rigidity transmission. In addition, please refer to Fig. 9C In the manufacturing process of the display device 1D, in the step of removing the hard substrate 20 (i.e., step S207), the hard substrate 20 is peeled off along the first direction D2 (e.g., the +Y axis direction). Since at least a portion of the first connection layer 101 is located between the conductive adhesive film 103 and the first edge 111, no crack defect will be generated when the hard substrate 20 is peeled off to the position where the first connection layer 101 and the conductive adhesive film 103 are located on the flexible array substrate 10. In addition, in the step of attaching the protective layer 12 (i.e., step S206), the protective layer 12 at least partially covers the first connection layer 101, and the stress on the flexible array substrate 10 can be appropriately dispersed in the step of removing the hard substrate 20 (i.e., step S207).

[0055] In summary, in the display device of the present invention, the second connection layer is disposed on the flexible array substrate and covers at least a portion of the first connection layer, the conductive adhesive film is disposed on the flexible array substrate and is not adjacent to the first connection layer, and the Young's modulus of the conductive adhesive film is greater than the Young's modulus of the first connection layer. In this way, when the hard substrate is removed during the manufacturing process of the display device, the high Young's modulus of the conductive adhesive material and the relatively low Young's modulus of the first connection layer can prevent the flexible array substrate attached to the first connection layer and the conductive adhesive material from having crack defects during the manufacturing process of the display device, thereby improving the manufacturing yield of the display device.

[0056] The present invention has been described by the above-mentioned relevant embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the present invention. On the contrary, modifications and equivalent settings of the concepts and scopes contained in the claims are all included in the scope of the present invention.

Claims

1. A display device, comprising: A flexible array substrate having an active area; A first connection layer is disposed on the flexible array substrate and distributed along a first edge of the active area; A second connection layer is disposed on the flexible array substrate, distributed along the first edge and covering at least a portion of the first connection layer; A conductive adhesive film is disposed on the flexible array substrate, distributed along the first edge and not adjacent to the first connection layer; as well as A connection circuit layer is disposed on the conductive film; The Young's modulus of the conductive adhesive film is greater than the Young's modulus of the first connecting layer. 2 . The display device of claim 1 , wherein a Young's modulus of the first connection layer is between 10 MPa and 50 GPa. The display device of claim 1 , wherein a Young's modulus of the second connection layer is between 10 MPa and 50 GPa. 4 . The display device of claim 1 , wherein the Young's modulus of the conductive adhesive film is between 10 MPa and 50 GPa. 5 . The display device of claim 1 , wherein a Young's modulus of the second connection layer is greater than or equal to a Young's modulus of the first connection layer. The display device of claim 1 , wherein a thickness of the first connection layer is less than 40 μm. 7 . The display device of claim 1 , wherein a width of the first connection layer parallel to the first edge is greater than or equal to a width of the second connection layer parallel to the first edge. 8 . The display device of claim 7 , wherein a width of the second connection layer parallel to the first edge is greater than or equal to a width of the conductive adhesive film parallel to the first edge. 9 . The display device of claim 1 , wherein at least a portion of the first connection layer is located between the second connection layer and the first edge, and the second connection layer is located between at least a portion of the first connection layer and the conductive adhesive film. 10 . The display device of claim 1 , wherein the second connection layer is located between at least a portion of the first connection layer and the conductive adhesive film, and the conductive adhesive film is located between the second connection layer and the first edge.

11. A method for manufacturing a display device as claimed in any one of claims 1 to 10, comprising the following steps: Providing a hard substrate; Disposing the flexible array substrate on the rigid substrate; Coating the first connection layer on the flexible array substrate, wherein the first connection layer is distributed along the first edge and is located outside the active area; Applying the conductive adhesive film on the flexible array substrate and not adjacent to the first connection layer, wherein the conductive adhesive film is distributed along the first edge and is located outside the active area; Attaching the connection circuit layer to the conductive adhesive film; Attaching a protective layer to the effective area; Coating the second connection layer on the flexible array substrate and at least partially covering the first connection layer, wherein the second connection layer is distributed along the first edge and is not adjacent to the protection layer; removing the hard substrate; as well as Remove the protective layer. 12 . The method for manufacturing a display device according to claim 11 , wherein in the step of attaching the protective layer to the active area, the protective layer at least partially covers the first connection layer. 13 . The method for manufacturing a display device according to claim 11 , wherein in the step of attaching the protective layer to the active area, the protective layer at least partially covers the conductive adhesive film.

14. A display device, comprising: A flexible array substrate having an active area; A first connection layer is disposed on the flexible array substrate and distributed along a first edge of the active area; A conductive adhesive film is disposed on the flexible array substrate, distributed along the first edge and at least partially covering the first connection layer; as well as A connection circuit layer is disposed on the conductive film; The Young's modulus of the conductive adhesive film is greater than the Young's modulus of the first connecting layer. The display device of claim 14 , wherein a Young's modulus of the first connection layer is between 10 MPa and 50 GPa. 16 . The display device of claim 14 , wherein a Young's modulus of the conductive adhesive film is between 10 MPa and 50 GPa.

17. The display device of claim 14, wherein the first connection layer surrounds at least a portion of the conductive adhesive film.

18. The display device of claim 14, wherein a thickness of the first connection layer is less than 40 μm.

19. The display device of claim 14, wherein at least a portion of the first connection layer is located between the conductive adhesive film and the first edge.

20. The display device of claim 14, wherein at least a portion of the conductive adhesive film is located between the first connection layer and the first edge.

21. A method for manufacturing a display device as claimed in any one of claims 14 to 20, comprising the following steps: Providing a hard substrate; Disposing the flexible array substrate on the rigid substrate; Coating the first connection layer on the flexible array substrate, wherein the first connection layer is distributed along the first edge and is located outside the active area; Applying the conductive adhesive film on the flexible array substrate and at least partially covering the first connection layer, wherein the conductive adhesive film is distributed along the first edge and is located outside the active area; Attaching the connection circuit layer to the conductive adhesive film; Attaching a protective layer to the effective area; removing the rigid substrate; and Remove the protective layer. 22 . The method for manufacturing a display device according to claim 20 , wherein the protection layer at least partially covers the first connection layer.

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