Two-color LED packaging device with side light emitting function and module

Abstract

The invention relates to the technical field of LEDs, and particularly discloses a side-emitting double-color LED packaging device and module, which comprises a substrate, a first LED chip, a second LED chip, a first packaging adhesive layer, a second packaging adhesive layer, a first light blocking layer and a second light blocking layer, and is characterized in that the first light blocking layer is arranged on the surface of the substrate, and the second light blocking layer is arranged on the surface of the substrate; the first light blocking layer divides the substrate into a first half area and a second half area, the first LED chip is installed on the surface of the first half area, the first packaging adhesive layer covers the surface of the first LED chip, the second LED chip is installed on the surface of the second half area, and the second packaging adhesive layer covers the surface of the second LED chip. The second packaging adhesive layer covers the surface of the second LED chip; and the second light blocking layer is arranged on the surfaces of the first packaging adhesive layer, the second packaging adhesive layer and the first light blocking layer. According to the invention, the two independent LED chips are integrated in the same packaging device and are respectively covered by the packaging adhesive layer, so that the effect of double-color independent light emitting is realized.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to a luminous two-color LED packaging device and a module. Background Art

[0002] Traditional LED packaging devices mostly use monochromatic light sources, which cannot meet the needs of dual-color light sources in certain specific occasions. Although there are some dual-color LED packaging devices on the market, most of them use top-emitting design, which has limited emitting angle and low light efficiency. Therefore, it is of great significance to develop a dual-color LED packaging device and module that can emit light from the side and has high light efficiency. Summary of the invention

[0003] In order to overcome the problems existing in the prior art, an object of the present invention is to provide a luminous dual-color LED packaging device and module.

[0004] The technical solution adopted by the present invention to solve the technical problem is: a side-emitting two-color LED packaging device, comprising:

[0005] A substrate, a first LED chip, a second LED chip, a first encapsulation adhesive layer, a second encapsulation adhesive layer, a first light blocking layer, and a second light blocking layer;

[0006] The first light blocking layer is arranged on the surface of the substrate, the first light blocking layer divides the substrate into a first half area and a second half area, the first LED chip is mounted on the surface of the first half area, and the first packaging glue layer covers the surface of the first LED chip, the second LED chip is mounted on the surface of the second half area, and the second packaging glue layer covers the surface of the second LED chip;

[0007] The second light blocking layer is disposed on the surfaces of the first packaging glue layer, the second packaging glue layer and the first light blocking layer.

[0008] Main working principle: When the first LED chip is powered on and activated, it emits light of the first color. These lights will first be emitted in all directions, including upward (towards the encapsulation layer) and downward (towards the substrate). Similarly, when the second LED chip is powered on and activated, it will emit light of the second color, also emitted in all directions.

[0009] The first encapsulation layer covers the surface of the first LED chip, and it plays a role of protection and light transmission. The second encapsulation layer covers the surface of the second LED chip, and its function is the same as the first encapsulation layer. The thickness of the encapsulation layer is greater than the thickness of the LED chip, ensuring that the LED chip is completely covered and providing sufficient mechanical protection and optical performance.

[0010] The first light blocking layer is disposed on the surface of the substrate, which divides the substrate into a first half area and a second half area. The main function of this light blocking layer is to block and isolate the light emitted by the first LED chip and the second LED chip to prevent them from interfering with or mixing with each other. When the light propagates in the encapsulation layer, it may experience multiple refractions and reflections, but due to the existence of the first light blocking layer, they are confined to the first half area and the second half area, forming the side-emitting effects of the first and second colors, respectively.

[0011] The second light blocking layer is arranged on the first encapsulation adhesive layer, the second encapsulation adhesive layer and the surface of the first light blocking layer. This additional light blocking layer has the effect of reducing the light transmittance, ensuring the purity and clarity of the two-color light. Since the light emitted by the LED chip is guided and transmitted by the encapsulation adhesive layer, and is effectively isolated and reflected by the light blocking layer, the two-color light is mainly emitted from the side of the packaged device, but some light will be transmitted from the second blocking layer.

[0012] In summary, the side-emitting dual-color LED package device achieves the side-emitting effect of dual-color light through a clever structural design, and ensures the purity and clarity of the dual-color light. This device has broad application prospects in the fields of lighting, display and decoration.

[0013] Preferably, the first light blocking layer is perpendicular to one side of the substrate, and the first LED chip and the second LED chip are opposite to two ends of the substrate respectively.

[0014] Preferably, the first light blocking layer is connected to the diagonal corner of the substrate, and the first LED chip and the second LED chip are respectively opposite to the end corners on both sides of the substrate.

[0015] Preferably, the first encapsulation adhesive layer and the second encapsulation adhesive layer are composed of one of transparent thermosetting resin materials or materials containing fluorescent powder; the thickness of the first encapsulation adhesive layer and the second encapsulation adhesive layer is greater than the thickness of the first LED chip and the second LED chip; the two ends of the first encapsulation adhesive layer and the two ends of the second encapsulation adhesive layer do not exceed the edge of the substrate, and the width of the first encapsulation adhesive layer and the width of the second encapsulation adhesive layer are the same.

[0016] Preferably, the first light blocking layer contains a thermosetting resin material of a reflective material; the thickness of the first light blocking layer is equal to the thickness of the first packaging glue layer and the second packaging glue layer; the width of the first light blocking layer is equal to or greater than 0.4 mm; and the first light blocking layer does not exceed the edge of the substrate.

[0017] Preferably, the first light blocking layer contains a thermosetting resin material of a reflective material; the thickness of the first light blocking layer is equal to the thickness of the first packaging glue layer and the second packaging glue layer; the width of the first light blocking layer is equal to or greater than 0.4 mm; and the first light blocking layer does not exceed the edge of the substrate.

[0018] Preferably, the second light blocking layer contains a thermosetting resin material of a reflective material; the second light blocking layer covers the first light blocking layer, the first encapsulation glue layer and the second encapsulation glue layer; the second light blocking layer does not exceed the edges of the first light blocking layer, the first encapsulation glue layer and the second encapsulation glue layer, and the thickness of the second light blocking layer is less than the thickness of the first light blocking layer.

[0019] A side-emitting dual-color LED package module, comprising the above-mentioned side-emitting dual-color LED package device and a PCB circuit board;

[0020] There are multiple side-emitting dual-color LED package devices, and the multiple side-emitting dual-color LED package devices are mounted on the PCB circuit board, and the two ends of the first light blocking layer in two adjacent side-emitting dual-color LED package devices are arranged opposite to each other.

[0021] Main working principle: The working principle of the side-emitting dual-color LED package module is mainly based on the luminous characteristics of the side-emitting dual-color LED package devices it consists of and their arrangement on the PCB circuit board.

[0022] Each side-emitting dual-color LED package device contains two independent LED chips, namely the first LED chip and the second LED chip, which emit light of different colors respectively. These lights are guided and transmitted by the encapsulation glue layer, and are effectively isolated by the light blocking layer to ensure the purity and clarity of the dual-color light.

[0023] Multiple side-emitting dual-color LED package devices are mounted on a PCB circuit board. The arrangement of these devices can be designed according to specific application requirements, such as linear arrangement, matrix arrangement, etc.

[0024] The two ends of the first light blocking layer in two adjacent packaged devices are arranged opposite to each other. This design helps to further isolate the different colors of light emitted by adjacent devices and prevent them from interfering with or mixing with each other. When the LED chip of each packaged device is powered on and activated, the first LED chip and the second LED chip will emit light of different colors. These lights propagate in the encapsulation glue layer and are guided to the side and top of the device. Since the two ends of the first light blocking layer of adjacent devices are arranged opposite to each other, an effective light isolation area is formed between them. This area can prevent the light emitted by adjacent devices from penetrating or mixing with each other, ensuring that the two-color light emitted by each device remains pure and clear.

[0025] Since the packaged devices in the module are independently controlled, complex lighting effects and patterns can be achieved to meet different application scenarios and needs.

[0026] In summary, the side-emitting dual-color LED package module achieves the dual-color light side-emitting effect and ensures the purity and clarity of the dual-color light by precisely designing the arrangement of the package components and the structure of the light blocking layer. This module has important value in a variety of applications.

[0027] Preferably, a plurality of the side-emitting bi-color LED package devices are provided, and the plurality of side-emitting bi-color LED package devices are mounted on the PCB circuit board, and the two ends of the first light blocking layer in two adjacent side-emitting bi-color LED package devices are arranged opposite to each other.

[0028] Preferably, the plurality of side-emitting bi-color LED package devices are divided into two groups. The two groups of the side-emitting bi-color LED package devices are arranged side by side, and the first light blocking layers in the two groups of the side-emitting bi-color LED package devices are arranged in parallel. The two groups of parallelly arranged first light blocking layers enclose a luminous dark area.

[0029] Preferably, two groups of the first light blocking layers arranged in parallel form a "V" shape.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. The present invention achieves the effect of independent dual-color light emission by integrating two independent LED chips in the same packaged device and covering them with a packaging adhesive layer respectively. This design enables a single packaged device to emit two different colors of light at the same time, increasing the diversity and flexibility of the product. The provision of the first light blocking layer effectively isolates the light emitted by the two LED chips, preventing them from interfering with or mixing each other, thereby ensuring the purity and clarity of the dual-color light. This is particularly important for applications that require precise color control. The packaged device is designed to emit light mainly from the side and supplemented by top emission, so that the light is mainly emitted from the side of the device, increasing the distribution range and visual effect of the light.

[0032] 2. The present invention forms a modular design by combining multiple side-emitting dual-color LED package devices. This design allows the module to be flexibly configured and expanded according to specific application requirements, improving the adaptability and flexibility of the product. The two ends of the first light blocking layer in two adjacent package devices are arranged opposite to each other, further enhancing the light isolation effect. This design ensures that the dual-color light emitted by each package device remains pure and clear, while improving the overall light consistency of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0034] Figure 1 A side view of a dual-color LED package device emitting light from the side;

[0035] Figure 2 This is a cross-sectional top view of the side-emitting dual-color LED package device along line A. Figure 1 ;

[0036] Figure 3 This is a cross-sectional top view of the side-emitting dual-color LED package device along line A. Figure 2 ;

[0037] Figure 4 This is an overall schematic diagram of the side-emitting dual-color LED package module;

[0038] Figure 5 The two-color LED package module emitting light from this side is in a "V" state schematic diagram.

[0039] Figure 6 This is a schematic diagram of the luminous state of the two-color LED package module emitting light from this side in a "V" shape.

[0040] 1. Substrate; 2. First LED chip; 3. Second LED chip; 4. First encapsulation adhesive layer; 5. Second encapsulation adhesive layer; 6. First light blocking layer; 7. Second light blocking layer; 8. PCB circuit board; 9. Luminous dark area. DETAILED DESCRIPTION

[0041] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present invention.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0043] Example 1

[0044] This embodiment discloses a side-emitting dual-color LED package device, such as Figure 1-Figure 3 As shown, including:

[0045] Substrate 1, first LED chip 2, second LED chip 3, first encapsulation adhesive layer 4, second encapsulation adhesive layer 5, first light blocking layer 6 and second light blocking layer 7;

[0046] The first light blocking layer 6 is arranged on the surface of the substrate 1, and the first light blocking layer 6 divides the substrate 1 into a first half area and a second half area. The first LED chip 2 is mounted on the surface of the first half area, and the first packaging glue layer 4 covers the surface of the first LED chip 2. The second LED chip 3 is mounted on the surface of the second half area, and the second packaging glue layer 5 covers the surface of the second LED chip 3.

[0047] The second light blocking layer 7 is disposed on the surfaces of the first packaging glue layer 4 , the second packaging glue layer 5 and the first light blocking layer 6 .

[0048] When the first LED chip 2 is powered on and activated, it emits light of the first color. These lights are first emitted in all directions, including upward (toward the encapsulation layer) and downward (toward the substrate 1). Similarly, when the second LED chip 3 is powered on and activated, it emits light of the second color, also emitted in all directions.

[0049] The first encapsulation layer 4 covers the surface of the first LED chip 2, and plays a role of protection and light transmission. The second encapsulation layer 5 covers the surface of the second LED chip 3, and its function is the same as that of the first encapsulation layer 4. The thickness of the encapsulation layer is greater than the thickness of the LED chip, ensuring that the LED chip is completely covered and providing sufficient mechanical protection and optical performance.

[0050] The first light blocking layer 6 is disposed on the surface of the substrate 1, and it divides the substrate 1 into a first half area and a second half area. The main function of this light blocking layer is to block and isolate the light emitted by the first LED chip 2 and the second LED chip 3 to prevent them from interfering with or mixing with each other. When the light propagates in the encapsulation layer, it may experience multiple refractions and reflections, but due to the presence of the first light blocking layer 6, they are confined to the first half area and the second half area, forming the side-emitting effects of the first and second colors, respectively.

[0051] The second light blocking layer 7 is arranged on the surface of the first encapsulation glue layer 4, the second encapsulation glue layer 5 and the first light blocking layer 6. This additional light blocking layer has the effect of reducing the light transmittance, ensuring the purity and clarity of the two-color light. Since the light emitted by the LED chip is guided and transmitted by the encapsulation glue layer, and is effectively isolated and reflected by the light blocking layer, the two-color light is mainly emitted from the side of the packaged device, but part of the light will be transmitted from the second blocking layer.

[0052] In summary, the side-emitting dual-color LED package device achieves the side-emitting effect of dual-color light through a clever structural design, and ensures the purity and clarity of the dual-color light. This device has broad application prospects in the fields of lighting, display and decoration.

[0053] In some optional embodiments, the first light blocking layer 6 is perpendicular to one side of the substrate 1, that is, a straight dividing line is formed, and the first LED chip 2 and the second LED chip 3 are respectively mounted at two ends of the substrate 1, opposite to the dividing line. The light emitted by the first LED chip 2 and the second LED chip 3 is blocked by the first light blocking layer 6. Figure 2 As shown, the light will be respectively transmitted outward from both ends of the substrate 1. Thus, a layout mode of the LED chip and the light blocking layer is provided, which increases the flexibility of the design and still maintains the effect of two-color independent light emission and light isolation.

[0054] In some optional embodiments, the first light blocking layer 6 is connected to the diagonal of the substrate 1 to form a diagonal dividing line. The first LED chip 2 and the second LED chip 3 are respectively installed at the end corners on both sides of the substrate 1, opposite to the dividing line. The light emitted by the first LED chip 2 and the second LED chip 3 is blocked by the first light blocking layer 6. Figure 3 As shown, the light will be respectively transmitted outward from the two end corners of the substrate 1. Thus, a layout mode of the LED chip and the light blocking layer is provided, which increases the flexibility of the design and still maintains the effect of two-color independent light emission and light isolation.

[0055] In some optional embodiments, the first encapsulation glue layer 4 and the second encapsulation glue layer 5 are made of a transparent thermosetting resin material or a phosphor-containing thermosetting resin material to ensure light transmittance and possible color conversion. The thickness of the first encapsulation glue layer 4 and the second encapsulation glue layer 5 is greater than the thickness of the first LED chip 2 and the second LED chip 3 to provide sufficient protection and mechanical strength. The width of the encapsulation glue layer is the same and does not exceed the edge of the substrate 1 to ensure uniform distribution of light and prevent light leakage.

[0056] The first encapsulation glue layer 4 and the second encapsulation glue layer 5 not only protect the first LED chip 2 and the second LED chip 3, but also play a role in guiding light. The light propagates in the first encapsulation glue layer 4 and the second encapsulation glue layer 5 and is emitted from the side. It provides good light transmittance and possible color conversion effect. The thickness and width of the encapsulation glue layer are reasonably designed to ensure uniform distribution of light and prevent leakage.

[0057] In some optional embodiments, the first light blocking layer 6 contains a thermosetting resin material of a reflective material, which enhances the reflection and isolation effect of light. The thickness of the light blocking layer is the same as that of the encapsulation glue layer, ensuring the uniformity and consistency of the structure. The width of the light blocking layer is equal to or greater than 0.4 mm, providing sufficient light isolation effect. The light blocking layer does not exceed the edge of the substrate 1, preventing light leakage and interference. The first light blocking layer 6 effectively isolates the light emitted by the two LED chips and enhances the light isolation effect through the reflective material. It provides a good light isolation effect, ensures the purity and clarity of the two-color light, and the thickness and width of the light blocking layer are reasonably designed to ensure the stability of the structure and the light isolation effect.

[0058] In some optional embodiments, the second light blocking layer 7 also contains a thermosetting resin material of a reflective material, which enhances the reflection and isolation effect of light. The second light blocking layer 7 covers the first light blocking layer 6 and the packaging glue layer, which has the effect of isolating part of the light, allowing the light to pass through the second light blocking layer 7 in a softer way. The thickness of the second light blocking layer 7 is less than the thickness of the first light blocking layer 6, ensuring that light passes through the second light blocking layer 7. The second light blocking layer 7 does not exceed the edge of the first light blocking layer 6 and the packaging glue layer, preventing light leakage and interference. The purity and clarity of the two-color light are ensured, and different light effects are presented.

[0059] Example 2

[0060] A side-emitting dual-color LED package module, such as Figure 4 As shown, it includes the side-emitting dual-color LED package device in the above-mentioned embodiment 1, and a PCB circuit board 8;

[0061] There are multiple side-emitting dual-color LED package devices, and the multiple side-emitting dual-color LED package devices are installed on the PCB circuit board 8, and the two ends of the first light blocking layer 6 in two adjacent side-emitting dual-color LED package devices are arranged opposite to each other.

[0062] The working principle of the side-emitting dual-color LED package module is mainly based on the light-emitting characteristics of the side-emitting dual-color LED package components it comprises and their arrangement on the PCB circuit board 8.

[0063] Each side-emitting dual-color LED package device includes two independent LED chips, namely, a first LED chip 2 and a second LED chip 3, which emit light of different colors. These lights are guided and transmitted by the encapsulation glue layer, and are effectively isolated by the light blocking layer to ensure the purity and clarity of the dual-color light.

[0064] A plurality of side-emitting dual-color LED package devices are mounted on the PCB circuit board 8. The arrangement of these devices can be designed according to specific application requirements, such as linear arrangement, matrix arrangement, etc.

[0065] The two ends of the first light blocking layer 6 in two adjacent packaged devices are arranged opposite to each other. This design helps to further isolate the lights of different colors emitted by adjacent devices and prevent them from interfering with or mixing with each other. When the LED chips of each packaged device are powered on and activated, the first LED chip 2 and the second LED chip 3 will emit lights of different colors. These lights propagate in the packaging glue layer and are guided to the side and top of the device for emission. Since the two ends of the first light blocking layer 6 of adjacent devices are arranged opposite to each other, an effective light isolation area is formed between them. This area can prevent the lights emitted by adjacent devices from penetrating or mixing with each other, ensuring that the two-color light emitted by each device remains pure and clear.

[0066] Since the packaged devices in the module are independently controlled, complex lighting effects and patterns can be achieved to meet different application scenarios and needs.

[0067] In summary, the side-emitting dual-color LED package module achieves the dual-color light side-emitting effect and ensures the purity and clarity of the dual-color light by precisely designing the arrangement of the package components and the structure of the light blocking layer. This module has important value in a variety of applications.

[0068] In some optional embodiments, such as Figure 5-Figure 6 As shown, a plurality of dual-color LED package devices are divided into two groups. The two groups of devices are arranged side by side on a PCB circuit board 8, ensuring that the first light blocking layers 6 in the two groups of devices are arranged in parallel.

[0069] By adjusting the arrangement and spacing of the devices, two sets of parallel first light blocking layers 6 are arranged to form a luminous dark area 9. Most of the light in this luminous dark area 9 will be blocked by the second light blocking layer 7, and only a small part of the light will pass through the second light blocking layer 7. Therefore, the brightness of this part is lower than that of other areas, which can be used to emphasize the light effects of other areas, or as part of the design element, this dark area contrasts with the surrounding bright areas, enhancing the overall visual effect.

[0070] In some optional embodiments, the arrangement and spacing of the two groups of dual-color LED package devices are further adjusted so that the two groups of parallel first light blocking layers 6 surround a "V"-shaped luminous dark area 9. This "V"-shaped dark area can point to a specific direction to guide the viewer's sight or emphasize the light effect of a certain area.

[0071] The two groups of dual-color LED package devices work independently and emit light of different colors. By precisely adjusting the arrangement and spacing of the devices, the two groups of parallel first light blocking layers 6 form a "V"-shaped luminous dark area 9. This dark area forms a sharp contrast with the surrounding bright areas, enhancing the overall visual effect and sense of hierarchy. The "V"-shaped luminous dark area 9 can guide the viewer's line of sight, emphasize specific areas or design elements, and improve the attractiveness and application value of the product.

[0072] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A side-emitting dual-color LED package device, characterized in that: include: A substrate, a first LED chip, a second LED chip, a first encapsulation adhesive layer, a second encapsulation adhesive layer, a first light blocking layer, and a second light blocking layer; The first light blocking layer is arranged on the surface of the substrate, the first light blocking layer divides the substrate into a first half area and a second half area, the first LED chip is mounted on the surface of the first half area, and the first packaging glue layer covers the surface of the first LED chip, the second LED chip is mounted on the surface of the second half area, and the second packaging glue layer covers the surface of the second LED chip; The second light blocking layer is disposed on the surfaces of the first packaging glue layer, the second packaging glue layer and the first light blocking layer.

2. The side-emitting dual-color LED package device according to claim 1, characterized in that: The first light blocking layer is perpendicular to one side of the substrate, and the first LED chip and the second LED chip are respectively opposite to two ends of the substrate.

3. The side-emitting dual-color LED package device according to claim 1, characterized in that: The first light blocking layer is connected to the diagonal corner of the substrate, and the first LED chip and the second LED chip are respectively opposite to the end corners on both sides of the substrate.

4. The side-emitting dual-color LED package device according to claim 1, characterized in that: The first encapsulation adhesive layer and the second encapsulation adhesive layer are composed of one of transparent thermosetting resin materials or materials containing fluorescent powder; the thickness of the first encapsulation adhesive layer and the second encapsulation adhesive layer is greater than the thickness of the first LED chip and the second LED chip; the two ends of the first encapsulation adhesive layer and the two ends of the second encapsulation adhesive layer do not exceed the edge of the substrate, and the width of the first encapsulation adhesive layer and the width of the second encapsulation adhesive layer are the same.

5. The side-emitting dual-color LED package device according to claim 1, characterized in that: The first light blocking layer contains a thermosetting resin material of a reflective material; the thickness of the first light blocking layer is equal to the thickness of the first packaging glue layer and the second packaging glue layer; the width of the first light blocking layer is equal to or greater than 0.4 mm; the first light blocking layer does not exceed the edge of the substrate.

6. The side-emitting dual-color LED package device according to claim 1, characterized in that: The second light blocking layer contains a thermosetting resin material of a reflective material; the second light blocking layer covers the first light blocking layer, the first encapsulation glue layer and the second encapsulation glue layer; the second light blocking layer does not exceed the edges of the first light blocking layer, the first encapsulation glue layer and the second encapsulation glue layer, and the thickness of the second light blocking layer is less than the thickness of the first light blocking layer.

7. A side-emitting dual-color LED package module, characterized in that: A side-emitting dual-color LED package device comprising any one of claims 1 to 6, and a PCB circuit board; There are multiple side-emitting dual-color LED package devices, and the multiple side-emitting dual-color LED package devices are mounted on the PCB circuit board, and the two ends of the first light blocking layer in two adjacent side-emitting dual-color LED package devices are arranged opposite to each other.

8. The side-emitting dual-color LED package module according to claim 7, characterized in that: The plurality of side-emitting bi-color LED package devices are divided into two groups. The two groups of the side-emitting bi-color LED package devices are arranged side by side, and the first light blocking layers in the two groups of the side-emitting bi-color LED package devices are arranged in parallel. The two groups of the first light blocking layers arranged in parallel form a luminous dark area.

9. The side-emitting dual-color LED package module according to claim 8, characterized in that: Two sets of the first light blocking layers arranged in parallel form a "V" shape.

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