Display module, preparation method thereof and electronic equipment

Abstract

The invention provides a display module and a preparation method thereof, and an electronic device, the display module comprises a metal wire layer, an organic layer and an inorganic layer, the boundary of the organic layer and the boundary of the inorganic layer at an outer dam part close to a position with a large carving amount on the side of the metal wire layer are interchanged, and the inorganic layer is separated between the organic layer and the metal wire layer; therefore, residual organic glue at the side-carved position of the metal wire layer cannot be in contact with the organic layer to form a continuous organic channel, a channel for water vapor to invade into a display area of the display module is cut off, and meanwhile, an insulating edge-covering structure is arranged at the side-carved position of the metal wire layer in a range from the outer side of the outer dam to the bending area, so that good side edge packaging is formed, and the service life of the display module is prolonged. The plurality of insulating edge covering structures arranged at intervals can form a plurality of effective packaging areas, so that the effective packaging distance of the packaging layer is prolonged, and the packaging reliability of the display module is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a preparation method thereof, and an electronic device. Background Art

[0002] At present, AA perforated screens have become the mainstream of AMOLED display technology. The perforated technology on the screen is to disconnect the continuous light-emitting layer in the non-display area at the through-hole position. The industry currently uses the TAT (Ti / Al / Ti) Undercut partition structure to separate the light-emitting layer. However, in the process of forming the TAT partition structure in the hole area, other TAT metal bare areas of the screen body will also be side-etched. In the subsequent organic glue process, the organic glue is likely to remain at the side-etched position, and water vapor is likely to invade the screen body along the side-etched position of the organic filling, resulting in packaging reliability problems such as black spots on the screen body. Summary of the invention

[0003] The purpose of the present invention is to provide a display module and a preparation method thereof, and an electronic device, so as to solve the problem in the prior art that organic glue remains on the metal side engraving part, causing water vapor to invade the screen body and affect the packaging.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] In a first aspect, the present invention provides a display module.

[0006] The display module includes a metal wire layer, an organic layer and an inorganic layer.

[0007] The frame portion of the display module includes a first area, a second area and a third area, wherein:

[0008] The first area is close to the display area of ​​the display module, the third area is close to the bending area of ​​the display module, and the second area is located between the first area and the third area.

[0009] The metal wire layer, organic layer and inorganic layer are simultaneously located in the first region, the second region and the third region, and in the second region, the inorganic layer is located between the metal wire layer and the organic layer and isolates the metal wire layer from the organic layer; thereby preventing the organic glue remaining at the side engraving position of the metal wire layer from contacting the organic layer and forming a continuous organic channel, thereby blocking the channel for water vapor to invade the display area of ​​the display module.

[0010] Furthermore, in the third region, a first isolation structure is provided on the metal wire layer, wherein the first isolation structure comprises an insulating block, and the insulating block is located at an edge of the metal wire layer and wraps a side of the metal wire layer;

[0011] Optionally, there are a plurality of insulating blocks, which are arranged at intervals along the side of the metal wire layer.

[0012] Furthermore, in the third region, a second insulating structure is provided on the metal wire layer, the second insulating structure comprises an insulating strip, the insulating strip is located at an edge of the metal wire layer and wraps a side of the metal wire layer, and a plurality of insulating strips form a group and are arranged at intervals along the side of the metal wire layer;

[0013] Optionally, there are several groups of the insulating strips, which are arranged at intervals along the side of the metal wire layer.

[0014] An insulating edging structure is set at the side engraving position of the metal wire layer within the range from the outer side of the outer dam to the bending area to form a good side encapsulation. Multiple insulating edging structures arranged at intervals can form multiple effective encapsulation areas, extend the effective encapsulation distance of the encapsulation layer, and improve the encapsulation reliability of the display module.

[0015] Furthermore, the display module also includes an encapsulation layer, and in the second area, the encapsulation layer wraps the organic layer and the inorganic layer, and the organic layer is located in a closed cavity formed by the encapsulation layer and the inorganic layer, and the metal wire layer is located on the side of the inorganic layer away from the organic layer.

[0016] Furthermore, the frame portion of the display module also includes a dam area, wherein:

[0017] The second region includes the dam region, in which the encapsulation layer wraps the organic layer and the inorganic layer, and the organic layer is located in a closed cavity formed by the encapsulation layer and the inorganic layer, and the metal wire layer is located on a side of the inorganic layer away from the organic layer;

[0018] The above-mentioned dam area is an outer dam area, and the boundaries of the organic layer and the inorganic layer at the outer dam part are interchanged, so that the inorganic layer is separated between the organic layer and the metal wire layer, so that the organic glue remaining at the side engraving position of the metal wire layer cannot contact the organic layer and form a continuous organic channel, thereby isolating the channel for water vapor to invade the display area of ​​the display module;

[0019] In addition, the frame area of ​​the display module also includes an inner dam area, and the inner dam area may not have the same structure as the outer dam area, or may have the same structure as the outer dam area.

[0020] Further, at an end of the third region away from the second region, the inorganic layer is disposed on the metal wire layer, and the encapsulation layer is disposed on and covers the inorganic layer.

[0021] In a second aspect, a method for preparing a display module is provided, wherein the display module comprises a metal wire layer, an organic layer, an inorganic layer and an encapsulation layer, and the method for preparing the display module comprises:

[0022] In the area where the dam is formed on the display module, the encapsulation layer and the inorganic layer wrap the organic layer so that the organic layer does not contact the metal wire layer.

[0023] Furthermore, at a portion of the dam close to a side of the display module bending region, at least one insulating block is formed at an edge of the metal wire layer and wraps a side edge of the metal wire layer.

[0024] Furthermore, at least one group of insulating strips is formed at the edge of the metal wire layer at a portion of the dam close to the display module bending region, and a group of insulating strips is composed of a plurality of insulating strips arranged at intervals.

[0025] In a third aspect, an electronic device comprises the display module described in any one of the items.

[0026] The advantages of the present invention are: a display module and a preparation method thereof, and an electronic device of the present invention interchange the boundaries of the organic layer and the inorganic layer at the outer dam portion near the position where the side engraving of the metal wire layer is relatively large, so that the inorganic layer is separated between the organic layer and the metal wire layer, so that the organic glue remaining at the side engraving position of the metal wire layer cannot contact the organic layer and form a continuous organic channel, thereby blocking the channel for water vapor to invade the display area of ​​the display module. At the same time, an insulating edging structure is set at the side engraving position of the metal wire layer within the range from the outside of the outer dam to the bending area to form a good side encapsulation. Multiple insulating edging structures arranged at intervals can form multiple effective encapsulation areas, extend the effective encapsulation distance of the encapsulation layer, and improve the encapsulation reliability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 Schematic diagram of the organic glue residue structure on the TAT metal side engraving area of ​​the screen.

[0029] Figure 2 The figure is a schematic diagram of the structure of the frame part of the existing display module.

[0030] Figure 3 It is a schematic diagram of the structure of the frame part of the display module in one embodiment of the present invention.

[0031] Figure 4 It is a schematic diagram of an isolation structure in one embodiment of the present invention.

[0032] Figure 5 It is a schematic diagram of an isolation structure in another embodiment of the present invention.

[0033] Figure 6 It is a schematic diagram of an isolation structure in yet another embodiment of the present invention.

[0034] Figure 7 FIG. 4 is a flow chart of a method for preparing a display module in an embodiment of the present invention.

[0035] Figure 8 FIG. 4 is a flow chart of a method for preparing a display module in another embodiment of the present invention.

[0036] Fig. 9 The present invention is a flow chart of a method for preparing a display module in another embodiment of the present invention.

[0037] The components in the figure are shown as follows:

[0038] 1. Metal wire layer; 2. Residual organic glue; 3. Encapsulation layer; 31. Upper encapsulation layer; 32. Lower encapsulation layer; 4. Organic layer; 5. Inorganic layer; 6. Insulation block; 7. Insulation strip;

[0039] a, first area; b, second area; c, third area. DETAILED DESCRIPTION

[0040] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0041] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0042] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0043] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0044] Overview

[0045] As described in the background technology, in the process of forming the TAT partition structure of the hole area, other TAT metal bare areas of the screen body will also be engraved on the side. Because there are many metal traces in the lower frame of the screen body, the packaging structure needs to overlap with the metal wire layer 1 to form an effective package. However, in the ear area of ​​the lower frame, such as Figure 1 As shown, since the side is also engraved during the process of forming the TAT partition structure in the hole area, the organic glue is likely to remain at the side engraved position in the subsequent organic glue process, and the residual organic glue 2 will be separated between the metal wire layer and the packaging layer 3, resulting in the absence of an effective overlapping portion between the metal wire layer 1 and the packaging layer 3. In a high temperature and high humidity environment, water vapor is likely to invade the screen body along the side engraved position of the organic filler, resulting in the screen body being prone to packaging reliability problems such as black spots.

[0046] In the existing display module frame structure, such as Figure 2 As shown, the inner and outer dam structures of the lower frame at position A are both structures in which the organic layer 4 wraps the inorganic layer 5. However, it can be seen from the above content that in the process of forming the TAT partition structure in the hole area, the metal wire layer 1 within the range from the outer side of the outer dam to the bending area has a larger offset after side engraving. Therefore, it is easy for the organic glue to remain in this position during the process of the organic layer 4. The inner and outer dam structures happen to be structures in which the organic layer 4 wraps the inorganic layer 5. Therefore, the organic layer 4 will form a continuous organic channel with the organic glue 2 remaining at the side engraving position of the metal wire layer 1. At position B on the outside of the outer dam, the encapsulation layer 3 is relatively weak at the edge position of the inorganic layer 5. After water vapor invades from position B, it can enter the display area along the continuous organic channel formed by the residual organic glue, and then the display module fails.

[0047] In view of the above problems, the inventors have improved the structure of the frame of the display module by swapping the boundaries of the organic layer 4 and the inorganic layer 5 at the outer dam portion near the side engraving position of the metal wire layer 1 where the amount of side engraving is relatively large, so that the inorganic layer 5 is separated between the organic layer 4 and the metal wire layer 1, so that the organic glue 2 remaining at the side engraving position of the metal wire layer 1 cannot contact the organic layer 4 and form a continuous organic channel, thereby blocking the channel for water vapor to invade the display area of ​​the display module. At the same time, an insulating edging structure is set at the side engraving position of the metal wire layer 1 within the range from the outside of the outer dam to the bending area to form a good side encapsulation. Multiple insulating edging structures arranged at intervals can form multiple effective encapsulation areas, extend the effective encapsulation distance of the encapsulation layer 3, and improve the encapsulation reliability of the display module.

[0048] Based on the above concept, the present application will be exemplarily described below in conjunction with the accompanying drawings.

[0049] Exemplary Structure

[0050] This embodiment provides a display module, such as Figure 3 As shown,

[0051] The display module includes a metal wire layer 1, an organic layer 4 and an inorganic layer 5.

[0052] The metal wire layer 1 needs to be side-etched in the process of forming the hole area TAT partition structure in the screen drilling technology.

[0053] The frame portion of the display module includes a first area a, a second area b and a third area c.

[0054] The second area b is the location of the outer dam, the first area a is the inner area of ​​the outer dam (close to the AA display area of ​​the display module), and the third area c is the outer area of ​​the outer dam (close to the bending area of ​​the display module). The metal wire layer 1 of the third area c is greatly offset after side engraving, and the weaker position of the packaging part in the third area c is easy to be invaded by water vapor;

[0055] The inorganic layer 5 of the second region b (external lifting position) is arranged between the organic layer 4 and the metal wire layer 1 to separate the organic layer 4 from the metal wire layer 1. When the metal wire layer 1 is side-engraved, the organic glue 2 remaining at the side-engraved position cannot contact the organic layer 4 due to the barrier of the inorganic layer 5. The remaining organic glue 2 cannot form a continuous organic channel with the organic layer 4. After water vapor invades from the weaker position of the third region c packaging, the invasion channel is blocked, and water vapor cannot enter the AA display area of ​​the display module after passing through the third region c, the second region b and the first region a in sequence, thereby improving the packaging reliability of the display module.

[0056] In some embodiments, the above-mentioned structure in which the inorganic layer 5 is arranged between the organic layer 4 and the metal wire layer 1 to form a partition is arranged at the outer dam position, and the inner dam position can be the original organic layer 4 wrapping the inorganic layer 5 structure, or it can be the same partition structure as the outer dam position.

[0057] In some embodiments, Figure 3 As shown, at the outer dam position, the encapsulation layer 3 wraps the organic layer 4 and the inorganic layer 5, and the organic layer 4 is located in the closed cavity formed by the encapsulation layer 3 and the inorganic layer 5, and the metal wire layer 1 is on the side of the inorganic layer 5 away from the organic layer 4; the encapsulation layer 3 is composed of an upper encapsulation layer 31 and a lower encapsulation layer 32, and on the inner side of the inner dam, the upper encapsulation layer 31 and the lower encapsulation layer 32 are separated, and at the inner dam position, the upper encapsulation layer 31 and the lower encapsulation layer 32 form an encapsulation layer and extend outward to the bending area of ​​the display module.

[0058] In some embodiments, Figure 4 As shown, in the third region c (the portion where the metal wire layer 1 is greatly offset after side engraving), an isolation structure is provided on the metal wire layer 1, and the isolation structure includes an insulating block 6, and the insulating block 6 is located at the edge of the metal wire layer 1 and wraps the side of the metal wire layer 1; there are multiple insulating blocks 6 and they are arranged at intervals along the side of the metal wire layer 1, and the width of the insulating block 6 can be 10 microns to 20 microns, and the length can be 10 microns to 20 microns;

[0059] In some embodiments, Figure 5 As shown, the above-mentioned partition structure also includes an insulating strip 7, which is located at the edge of the metal wire layer 1 and wraps the side of the metal wire layer 1. A plurality of insulating strips 7 form a group and are arranged at intervals along the side of the metal wire layer 1. There are several groups of insulating strips 7 and they are arranged at intervals along the side of the metal wire layer 1. The width of the insulating strip 7 is about 0.8 microns. At the same time, in the same group of insulating strips 7, the interval between two adjacent insulating strips 7 is about 0.8 microns.

[0060] The insulating edging structure is arranged at the side engraving position of the metal wire layer 1 within the range from the outer side of the outer dam to the bending area, which can form a good side package. The multiple insulating edging structures arranged at intervals can form multiple effective packaging areas, extend the effective packaging distance of the packaging layer 3, and improve the packaging reliability of the display module.

[0061] It should be noted that the partition structure includes a plurality of insulating blocks 6 arranged at intervals, and also includes a plurality of insulating strips 7 arranged at intervals in the transverse direction. At the same time, the partition structure also includes a structure in which the insulating blocks 6 and the insulating strips 7 are arranged at the same time (such as Figure 6 As shown), but not limited thereto, the isolation structure also includes other structures that can achieve the same or similar functions.

[0062] It should be noted that the insulating blocks 6 and insulating strips 7 are made of the same material as the inorganic layer 5 , and the insulating blocks 6 or insulating strips 7 can be prepared simultaneously when the inorganic layer 5 is prepared.

[0063] like Figure 3 As shown, at position B, the inorganic layer 5 is arranged on the metal wire layer 1, and the encapsulation layer 3 is arranged on the inorganic layer 5 and covers the inorganic layer 5, and a double-layer encapsulation layer 3 climbs over the inorganic layer 5 structure is adopted. The side engraving amount of the metal wire layer 1 in the ear area close to the inorganic layer 5 is relatively small, and the encapsulation layer 3 is filled more fully at this position. When the double-layer encapsulation layer 3 covers the inorganic layer 5, the distance between the gaps of the encapsulation layer 3 and the inorganic layer 5 is lengthened, thereby enhancing the water vapor barrier ability of the inorganic layer 5.

[0064] Exemplary Methods

[0065] This embodiment also provides a method for preparing a display module, wherein the display module includes a metal wire layer, an organic layer, an inorganic layer, and an encapsulation layer.

[0066] like Figure 7 As shown, the first method for preparing the display module includes:

[0067] S1. In an area where a dam is formed on a display module, the encapsulation layer and the inorganic layer are used to wrap the organic layer so that the organic layer does not contact the metal wire layer.

[0068] S2. Form a plurality of insulating blocks arranged at intervals on the side edge of the metal wire layer (ie, the side engraving portion) from the outside of the dam position to the bending area of ​​the display module and wrap the side edge of the metal wire layer.

[0069] like Figure 8 As shown, the second method for preparing the display module includes:

[0070] S1. In an area where a dam is formed on a display module, the encapsulation layer and the inorganic layer are used to wrap the organic layer so that the organic layer does not contact the metal wire layer.

[0071] S2. Form multiple groups of insulating strips arranged at intervals on the side of the metal wire layer from the outside of the dam position to the bending area of ​​the display module (ie, the side engraving portion) and wrap the side of the metal wire layer.

[0072] like Fig. 9 As shown, the third method for preparing the display module includes:

[0073] S1. In an area where a dam is formed on a display module, the encapsulation layer and the inorganic layer are used to wrap the organic layer so that the organic layer does not contact the metal wire layer.

[0074] S2. Form a plurality of insulating blocks and a plurality of insulating strips arranged at intervals on the side of the metal wire layer (i.e., the side engraved portion) from the outer side of the dam position to the bending area of ​​the display module, and make the insulating blocks and insulating strips wrap the side of the metal wire layer at the same time.

[0075] Exemplary Electronic Devices

[0076] In a third aspect, this embodiment provides an electronic device, comprising the display module described in any one of the above embodiments.

[0077] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display module, characterized in that: The display module includes a metal wire layer, an organic layer and an inorganic layer. The frame portion of the display module includes a first area, a second area and a third area, wherein: The first area is close to the display area of ​​the display module, the third area is close to the bending area of ​​the display module, and the second area is located between the first area and the third area. The metal wire layer, the organic layer and the inorganic layer are simultaneously located in the first region, the second region and the third region, and in the second region, the inorganic layer is located between the metal wire layer and the organic layer and isolates the metal wire layer from the organic layer.

2. The display module according to claim 1, wherein: In the third region, a first isolation structure is disposed on the metal wire layer, wherein the first isolation structure comprises an insulating block, and the insulating block is located at an edge of the metal wire layer and wraps a side of the metal wire layer; Optionally, there are a plurality of insulating blocks, which are arranged at intervals along the side of the metal wire layer.

3. The display module according to claim 1, wherein: In the third region, a second insulating structure is provided on the metal wire layer, the second insulating structure comprises an insulating strip, the insulating strip is located at an edge of the metal wire layer and wraps a side of the metal wire layer, and a plurality of insulating strips form a group and are arranged at intervals along the side of the metal wire layer; Optionally, there are several groups of the insulating strips, which are arranged at intervals along the side of the metal wire layer.

4. The display module according to claim 1, wherein: The display module further includes a packaging layer. In the second region, the encapsulation layer wraps the organic layer and the inorganic layer, and the organic layer is located in a closed cavity formed by the encapsulation layer and the inorganic layer, and the metal wire layer is located on a side of the inorganic layer away from the organic layer.

5. The display module according to claim 4, characterized in that: The frame portion of the display module also includes a dam area, wherein: The second region includes the dam region, in which the encapsulation layer wraps the organic layer and the inorganic layer, and the organic layer is located in a closed cavity formed by the encapsulation layer and the inorganic layer, and the metal wire layer is located on a side of the inorganic layer away from the organic layer.

6. The display module according to claim 4, characterized in that: At an end of the third region away from the second region, the inorganic layer is disposed on the metal wire layer, and the encapsulation layer is disposed on and covers the inorganic layer.

7. A method for preparing a display module, characterized in that: The display module includes a metal wire layer, an organic layer, an inorganic layer and an encapsulation layer, and the display module preparation method includes: In the area where the dam is formed on the display module, the encapsulation layer and the inorganic layer wrap the organic layer so that the organic layer does not contact the metal wire layer.

8. The method for preparing a display module according to claim 7, wherein: At least one insulating block is formed at an edge of the metal wire layer at a portion of the dam close to a side of the display module bending region and wraps the side of the metal wire layer.

9. The method for preparing a display module according to claim 7, wherein: At least one group of insulating strips is formed at the edge of the metal wire layer at a portion of the dam close to the display module bending area, and a group of insulating strips is composed of a plurality of insulating strips arranged at intervals.

10. An electronic device, characterized in that: The invention comprises the display module as claimed in any one of claims 1 to 6.

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