Pick-up system and pick-up method

Abstract

A pickup system (100) is provided with: a jacking unit (34) that jacks a chip (6a) on an adhesive sheet (6b) across the adhesive sheet (6b); a component holding unit (15) that holds the chip (6a) by means of the pick-up nozzle (14a); a negative pressure generation unit (153) that generates negative pressure around the opening (14b) of the pickup nozzle (14a); and a control unit (101) that starts the ejection of the chip (6a) by the ejection unit (34), causes the pickup nozzle (14a) to hold the chip (6a) in a non-contact manner by means of an attraction force that causes the chip (6a) to approach the opening (14b) and a repulsive force that causes the chip (6a) to move away from the opening (14b), and causes the pickup nozzle (14a) to rise, and in the holding of the chip (6a), after the chip (6a) is ejected, causes the pickup nozzle (14a) to move away from the opening (14b). The suction force is generated by causing the negative pressure generation unit (153) to generate negative pressure.

Description

Technical Field

[0001] The present disclosure relates to systems for picking up components, among other things. Background Art

[0002] In order to achieve high functionality of semiconductor packaging, hybrid bonding without using bumps, bonding materials, etc. is required. In hybrid bonding, the semiconductor chip is bonded to a substrate, etc., using hydrogen bonds, etc., while the surface of the semiconductor chip is clean. Therefore, in hybrid bonding, the surface cleanliness of the semiconductor chip needs to be kept high from the time the semiconductor chip is picked up by the dicing tape as an adhesive sheet to the time the semiconductor chip is bonded.

[0003] In addition, a pickup device using a vacuum pickup nozzle has been proposed in the past (for example, see Patent Document 1). In this pickup device, when picking up a semiconductor chip, the surface of the semiconductor chip contacts the metal pickup nozzle. Due to this contact, the surface of the semiconductor chip may be contaminated or damaged. As a result, there is a problem that the semiconductor chip cannot be properly bonded to the substrate. For this reason, a technology for picking up semiconductor chips without contact with the pickup nozzle is required.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-63967 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] However, even in the pickup device of Patent Document 1, when the pickup nozzle holds the semiconductor chip in a non-contact manner, there is a problem that it may be difficult to properly pick up the component, which is the semiconductor chip.

[0009] To this end, the present disclosure provides a picking system capable of properly picking up components.

[0010] Means used to solve problems

[0011] The picking system involved in one embodiment of the present invention comprises: a lifting part, which lifts a component attached to the adhesive sheet from bottom to top via an adhesive sheet; a component holding part, which uses a freely liftable holding tool with an opening to hold the component attached to the adhesive sheet from top; a negative pressure generating part, which generates negative pressure around the opening of the holding tool; and a control part, which controls the lifting part, the component holding part and the negative pressure generating part, and the control part performs the following processing: starting to lift the component by the lifting part, using an attractive force that brings the component close to the opening side of the holding tool and a repulsive force that moves the component away from the opening, so that the holding tool holds the component in a non-contact manner, and raising the holding tool holding the component, and when the holding tool holds the component, after the component is lifted by the lifting part, the attractive force is generated by causing the negative pressure generating part to generate negative pressure.

[0012] Furthermore, these general or specific aspects may be implemented by a system, method, integrated circuit, computer program, or a computer-readable CD-ROM or other recording medium, or by any combination of the system, method, integrated circuit, computer program, and recording medium. In addition, the recording medium may be a non-transitory recording medium.

[0013] Effects of the Invention

[0014] The picking system of the present disclosure is capable of properly picking up components.

[0015] In addition, further advantages and effects in one embodiment of the present disclosure are made clear by the specification and drawings. Such advantages and / or effects are provided by the structures described in some embodiments and the specification and drawings, but not all structures are necessarily required. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a perspective view of the component mounting device in the first embodiment.

[0017] Figure 2 This is a diagram for explaining the operation of mounting a chip on a substrate by the component mounting apparatus in the first embodiment.

[0018] Figure 3 This is a diagram showing an example of the configuration of the pickup system in the first embodiment.

[0019] Figure 4 This is a diagram for explaining an example of a basic operation of picking up a chip by the pickup nozzle in the first embodiment as a basic pattern.

[0020] Figure 5This is a flowchart showing the processing operation of the basic mode of the control unit in the first embodiment.

[0021] Figure 6 This is a diagram for explaining an example of a detailed operation of picking up a chip by the pickup nozzle in the first embodiment as a first mode.

[0022] Figure 7 This is a diagram for explaining an example of a detailed operation of picking up a chip by the pickup nozzle in the first embodiment as a second mode.

[0023] Figure 8 This is a diagram for explaining an example of a detailed operation of picking up a chip by the pickup nozzle in the first embodiment as a third mode.

[0024] Fig. 9 This is a diagram for explaining an example of a detailed operation of picking up a chip by the pickup nozzle in the first embodiment as a fourth mode.

[0025] Fig.10 This is a diagram for explaining an example of a detailed operation of picking up a chip by the pickup nozzle in the first embodiment as a fifth mode.

[0026] Fig.11 This is a diagram for explaining the exceptional operation of the pickup nozzle picking up a chip in the first embodiment as a first exceptional mode.

[0027] Fig.12 This is a diagram for explaining the exceptional operation of the pickup nozzle picking up a chip in the first embodiment as the second exceptional mode.

[0028] Fig.13 This is a perspective view of the component mounting device in the second embodiment.

[0029] Fig.14 This is a diagram showing an example of the configuration of a pickup system in the second embodiment.

[0030] Fig.15 This is a diagram for explaining an example of the basic operation of the pickup nozzle in the second embodiment to pick up a chip.

[0031] Fig.16 This is a diagram showing an example of adjustment of negative pressure by the negative pressure generating unit in the second embodiment.

[0032] Fig.17 This is a diagram showing another example of the adjustment of the negative pressure by the negative pressure generating unit in the second embodiment.

[0033] Fig.18This is a flowchart showing the processing operation of the control unit in the second embodiment.

[0034] Fig.19 This is a diagram for explaining the exceptional operation of the pickup nozzle picking up a chip in the second embodiment as a third exceptional mode.

[0035] Fig. 20 This is a diagram for explaining the exceptional operation of the pickup nozzle picking up a chip in the second embodiment as a fourth exceptional mode. DETAILED DESCRIPTION

[0036] The pickup system according to one embodiment of the present disclosure comprises: a lifting part that lifts a component attached to an adhesive sheet from the bottom to the top through an adhesive sheet; a component holding part that holds the component attached to the adhesive sheet from the top by using a holding tool having an opening and being able to be raised and lowered; a negative pressure generating part that generates negative pressure around the opening of the holding tool; and a control part that controls the lifting part, the component holding part, and the negative pressure generating part, and the control part performs the following processing: the lifting part starts lifting the component, the holding tool holds the component in a non-contact manner by using an attractive force that brings the component close to the opening side of the holding tool and a repulsive force that moves the component away from the opening, the holding tool holding the component rises, and when the holding tool holds the component, after the lifting part lifts the component, the negative pressure generating part generates the attractive force by generating negative pressure. For example, the holding tool is a pickup nozzle.

[0037] When a component is lifted up across an adhesive sheet, the component is easy to peel off from the adhesive sheet. In other words, the peeling of the component from the adhesive sheet is promoted. Here, if negative pressure is generated before the component is lifted up, a force is generated to bring the component close to the holding tool when the component is closely attached to the adhesive sheet. In addition, in order to hold the component in a non-contact manner by the holding tool, a gap is required between the holding tool and the component. Therefore, as described above, in the case where negative pressure is generated before the component is lifted up, a large negative pressure is required, that is, a strong force to bring the component close. And, in the case of peeling the component from the adhesive sheet, due to the large negative pressure, the component is strongly sucked to the holding tool configured with a gap separated from the component. As a result, the component may collide with the holding tool. Even if a repulsive force acts between the component and the holding tool in order to hold the component non-contactly, a collision of the component may occur. As a result, the component is damaged, contaminated or damaged. In addition, in the case where the negative pressure generated before the component is lifted up is small, the generation of the negative pressure may not contribute much to the pickup of the component and is not efficient.

[0038] On the other hand, in one method of the present disclosure, after the component is lifted up, a negative pressure is generated for holding the component in a non-contact manner by the holding tool. Therefore, since the negative pressure is generated after the component is lifted up, thereby promoting the peeling of the component from the adhesive sheet, the negative pressure can be set small, and the collision between the above-mentioned component and the holding tool can be suppressed. Therefore, damage, contamination or breakage of the component can be suppressed, and the component can be kept clean. Furthermore, the efficiency of picking up can be achieved. Therefore, in one method of the present disclosure, the component can be picked up appropriately.

[0039] In addition, the component holding portion may further include: a first ultrasonic wave generating portion that generates ultrasonic waves from the periphery of the opening by vibrating the holding tool, and when the holding tool holds the component, the control portion generates the repulsive force by causing the first ultrasonic wave generating portion to generate ultrasonic waves.

[0040] Thus, a so-called ultrasonic non-contact chuck can be realized. In addition, since a repulsive force is obtained by a squeezing effect based on the generation of ultrasonic waves, an appropriate repulsive force can be easily obtained. As a result, a component can be held efficiently and non-contactly.

[0041] Furthermore, the control unit may cause the first ultrasonic wave generating unit to generate ultrasonic waves before the member is lifted up by the lifting unit.

[0042] Thus, ultrasonic waves can be always generated, and switching between the generation and stop of ultrasonic waves can be omitted. As a result, the processing operation can be simplified and the time taken for picking can be shortened.

[0043] Furthermore, the control unit may cause the first ultrasonic wave generating unit to generate ultrasonic waves after the member is pushed up by the pushing-up unit.

[0044] Thus, after the component is lifted up to promote the peeling of the component from the adhesive sheet, the vibration of the air caused by the ultrasonic wave can be applied to the component to further promote the peeling of the component. As a result, the negative pressure generated by the negative pressure generating part can be suppressed to a small level, and the possibility of the component colliding with the holding tool can be further suppressed.

[0045] In addition, the control unit may also cause the first ultrasonic wave generating unit to generate ultrasonic waves after the component is lifted and the component is peeled off from the adhesive sheet by a given amount. For example, the given amount may be a predetermined area or a ratio of an area. In a specific example, the control unit determines the area of ​​the region peeled off from the adhesive sheet in the entire bottom surface of the adhesive sheet to which the component is attached, for example, by image processing using a camera. Furthermore, the control unit may also cause the first ultrasonic wave generating unit to generate ultrasonic waves after the area of ​​the region reaches a given amount or after the ratio of the area of ​​the region in the overall area of ​​the bottom surface reaches a given amount.

[0046] Thus, since ultrasonic waves are generated after the component is peeled off by a given amount, the possibility of the component colliding with the holding tool can be suppressed with high accuracy.

[0047] In addition, the pickup system may further include a second ultrasonic wave generating unit disposed below the adhesive sheet and outputting ultrasonic waves toward the adhesive sheet.

[0048] Thus, by outputting ultrasonic waves through the second ultrasonic wave generator, air vibrations caused by the ultrasonic waves can be applied to the component attached to the adhesive sheet via the adhesive sheet, which can further promote the peeling of the component. As a result, the possibility of the component colliding with the holding tool can be further suppressed.

[0049] Furthermore, the push-up portion and the second ultrasonic wave generating portion may be movably disposed so that one of the push-up portion and the second ultrasonic wave generating portion is disposed alternately with the other below the component and the adhesive sheet.

[0050] Thus, the promotion of the peeling of the component by the ultrasonic wave output from the second ultrasonic wave generating unit and the promotion of the peeling of the component by the lifting can be alternately switched. As a result, the peeling of the component can be further appropriately promoted. As a result, the possibility of the component colliding with the holding tool can be further suppressed.

[0051] In addition, the picking system may also include: a measuring unit, measuring the flow rate of air or the pressure of air flowing into the holding tool through the opening in order to generate negative pressure through the negative pressure generating unit, and the control unit controls at least one of the negative pressure generating unit and the first ultrasonic generating unit so that the flow rate or pressure measured by the measuring unit converges within a given range.

[0052] Thus, by measuring the flow rate or pressure based on the measuring unit, the holding state of the component based on the holding tool can be grasped, and the holding state can be corrected to an appropriate state. As a result, it is possible to prevent the component from falling from the holding tool, and further to prevent the component from contacting the holding tool. Thus, the component can be properly picked up, for example, the component can be properly handed over to another tool.

[0053] In addition, the general or specific form of the control unit can be implemented by a system, method, integrated circuit, computer program or a computer-readable CD-ROM or other recording medium, or by any combination of systems, methods, integrated circuits, computer programs or recording media. In addition, the recording medium can also be a non-temporary recording medium.

[0054] Hereinafter, the embodiments will be described in detail with reference to the drawings.

[0055] In addition, the embodiments described below all represent general or specific examples. The numerical values, shapes, materials, structural elements, configuration positions of structural elements, connection methods, steps, and the order of steps shown in the following embodiments are examples and are not intended to limit the present disclosure. In addition, among the structural elements in the following embodiments, the structural elements that are not recorded in the independent technical solutions representing the highest concept are described as arbitrary structural elements.

[0056] In addition, each figure is a schematic diagram and may not be a strict illustration. In addition, in each figure, the same symbol is given to the same structural member. In addition, in the following embodiments, expressions such as "approximately at the same time" are used. For example, "approximately at the same time" not only means completely at the same time, but also means substantially at the same time, that is, including an error of, for example, several %. In addition, "approximately at the same time" means at the same time within the scope that can achieve the effect of the present disclosure. The same applies to other expressions using "approximately".

[0057] (Implementation method 1)

[0058] Figure 1 It is a perspective view of the component mounting device in this embodiment.

[0059] The component mounting device 1 in the present embodiment picks up a component and mounts the picked-up component on the substrate 7. Therefore, the component mounting device 1 in the present embodiment is equipped with a pickup system for picking up the component. In addition, the mounting of the component on the substrate 7 is also referred to as the bonding of the component to the substrate 7. In addition, the substrate 7 in the present embodiment is not limited to a specific type of substrate, and may also be a silicon substrate or a silicon chip. In addition, in the present disclosure, the vertical direction is referred to as the Z-axis direction or the up-down direction, a direction on a plane perpendicular to the vertical direction is referred to as the Y-axis direction, the left-right direction or the lateral direction, and the direction perpendicular to the Y-axis direction on the perpendicular plane is referred to as the X-axis direction or the depth direction. In addition, in the present disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In addition, in the present disclosure, the positive side of the Y-axis direction is the right side or right, and the negative side of the Y-axis direction is the left side or left. In addition, in the present disclosure, the positive side of the X-axis direction is the back side or back, and the negative side of the X-axis direction is the near front side or near front.

[0060] The component mounting device 1 includes a base 2, a component supply unit 3, a substrate holding unit 5, a component holding unit 15, a frame 11, a Y-axis drive mechanism 12, a component mounting unit 13, and a pickup camera 21. The base 2 is a base of the component mounting device 1 and supports various structural members included in the component mounting device 1.

[0061] The component supply unit 3 is placed on the base 2 and supplies components to the component holding unit 15. Such a component supply unit 3 includes a holding table 3a, an XY table mechanism 31, a movable plate 32, and a plurality of supporting members 33. The holding table 3a holds the semiconductor wafer unit 6 in a state in which it is along the horizontal direction. The semiconductor wafer unit 6 includes an adhesive sheet 6b and a plurality of chips 6a. The plurality of chips 6a are single pieces or semiconductor chips obtained by cutting a semiconductor wafer, and are supplied by the component supply unit 3 and mounted on the substrate 7. The adhesive sheet 6b is an adhesive sheet. A plurality of chips 6a are attached to the upper surface of the adhesive sheet 6b. The plurality of supporting members 33 are columnar members placed on the movable plate 32 in a manner of standing on the movable plate 32. The plurality of supporting members 33 support the holding table 3a in a state in which the semiconductor wafer unit 6 held by the holding table 3a is separated from the movable plate 32 upward. The movable plate 32 is a plate arranged on the XY table mechanism 31. The XY stage mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction. The semiconductor wafer unit 6 moves in the X-axis direction and the Y-axis direction with the movement of the moving plate 32. That is, the plurality of chips 6a move along the XY plane.

[0062] The pickup camera 21 is disposed above the component supply unit 3 , and captures an image of the picked-up chip 6 a in the semiconductor wafer unit 6 .

[0063] The substrate holding part 5 holds the substrate 7 in a horizontal direction. Such a substrate holding part 5 includes a conveying rail 5a. The substrate holding part 5 positions and holds the substrate 7 conveyed by the conveying rail 5a at a mounting position. The mounting position is a position where the chip 6a is mounted.

[0064] The component holding portion 15 includes an arm 15a, a pickup head moving mechanism 15b, and a pickup head 14. The arm 15a is a columnar member, and is mounted on the pickup head moving mechanism 15b in a state along the X-axis direction. In other words, one end (i.e., the base end) of the arm 15a in the long side direction is mounted on the pickup head moving mechanism 15b. In addition, the pickup head 14 is mounted on the other end (i.e., the front end) of the arm 15a.

[0065] The pickup head moving mechanism 15b is suspended from the Y-axis frame 11b in the frame 11, so that the arm 15a moves along the X-axis direction, the Y-axis direction and the Z-axis direction. Further, the pickup head moving mechanism 15b rotates the arm 15a around the central axis along the long side direction of the arm 15a. In other words, the pickup head moving mechanism 15b rotates the arm 15a around the axis of the X-axis. The pickup head 14 is assembled at the front end of the arm 15a as described above. In addition, the pickup head 14 is provided with a vacuum suction chip 6a and a metal pickup nozzle 14a for example. In addition, vacuum suction is an action of sucking air. Therefore, the pickup nozzle 14a moves along the X-axis direction, the Y-axis direction and the Z-axis direction and rotates around the X-axis by the drive performed by the pickup head moving mechanism 15b. In addition, the pickup head moving mechanism 15b moves the pickup nozzle 14a based on the image pickup result of the pickup camera 21. Thus, the pickup head moving mechanism 15b can lower the pickup nozzle 14a and accurately approach the upper surface of the chip 6a to be picked up. The pickup nozzle 14a in this embodiment is an example of a holding tool having an opening for holding the chip 6a by vacuum suction.

[0066] As described above, the component holding section 15 in the present embodiment holds the chip 6a attached to the adhesive sheet 6b from above using the pick-up nozzle 14a having an opening and being able to be raised and lowered, that is, a holding tool.

[0067] The frame 11 includes two support columns 11a disposed on the positive side of the X-axis direction on the base 2 and a long Y-axis frame 11b. The two support columns 11a support the Y-axis frame 11b in a state where the Y-axis frame 11b is separated upward from the upper surface of the base 2 along the Y-axis direction. In other words, the Y-axis frame 11b is suspended by the two support columns 11a. And, as described above, the pickup head moving mechanism 15b is suspended from the Y-axis frame 11b.

[0068] The Y-axis drive mechanism 12 is mounted on the surface of the Y-axis frame 11b on the negative side in the X-axis direction, and moves the component mounting section 13 in the Y-axis direction. The component mounting section 13 includes a mounting unit 20. The component mounting section 13 receives the chip 6a held by the pickup nozzle 14a from the pickup nozzle 14a by using the mounting unit 20, and mounts the chip 6a on the substrate 7 positioned at the mounting position.

[0069] Figure 2 This is a diagram for explaining the operation of the component mounting device 1 for mounting the chip 6 a on the substrate 7 .

[0070] The component mounting device 1 picks up a chip 6 a disposed at a pickup operation position P set in advance on the XY plane among the plurality of chips 6 a attached to the adhesive sheet 6 b , and mounts the chip 6 a on the substrate 7 .

[0071] Specifically, the XY stage mechanism 31 moves the moving plate 32 in the X-axis direction and the Y-axis direction to place the chip 6 a to be picked up at the picking operation position P. The chip 6 a to be picked up placed at the picking operation position P is lifted up by the lifting portion 34 .

[0072] That is to say, Figure 2 As shown, the component mounting device 1 in this embodiment includes a lifting portion 34 arranged at the pickup operation position P. In addition, the lifting portion 34 may also be provided in the component supply unit 3. The lifting portion 34 lifts the chip 6a attached to the adhesive sheet 6b from the bottom to the top via the adhesive sheet 6b. Specifically, the lifting portion 34 lifts the chip 6a of the pickup object arranged at the pickup operation position P.

[0073] The pickup camera 21 is disposed above the component supply unit 3 and at the pickup operation position P. Such a pickup camera 21 captures the pickup operation position P and its surroundings from above the component supply unit 3 among the plurality of chips 6a attached to the adhesive sheet 6b. Thus, the chip 6a to be picked up is captured, and the position of the chip 6a to be picked up is identified based on the image capture result. In other words, the position of the chip 6a is identified.

[0074] The pickup nozzle 14a of the pickup head 14 is driven by the pickup head moving mechanism 15b to descend, approach the chip 6a whose position is recognized based on the image pickup result of the pickup camera 21 from above, and hold the chip 6a. In addition, the pickup nozzle 14a rises while holding the chip 6a, and then moves, for example, to the negative side in the Y-axis direction. Here, the pickup nozzle 14a makes the lower surface (i.e., bottom surface) of the held chip 6a face upward by the rotation of the arm 15a based on the pickup head moving mechanism 15b. As a result, the chip 6a is held in the pickup nozzle 14a in a state of being turned upside down.

[0075] like Figure 2As shown, the component mounting portion 13 includes not only the above-mentioned mounting unit 20, but also a moving plate 13a, a lifting mechanism 13b, and a lifting plate 13c. The moving plate 13a is a plate that is mounted on the Y-axis driving mechanism 12 so as to be movable in the Y-axis direction. That is, the moving plate 13a is driven by the Y-axis driving mechanism 12 to move in the Y-axis direction.

[0076] The lifting mechanism 13b is mounted on the front surface of the movable plate 13a to lift the lifting plate 13c. The mounting unit 20 is mounted on the lower part of the lifting plate 13c. The mounting unit 20 has a component mounting nozzle 20a. The component mounting nozzle 20a receives the chip 6a from, for example, the pickup nozzle 14a that holds the chip 6a in an upside-down state. For example, the component mounting nozzle 20a is moved to the top of the chip 6a by the Y-axis driving mechanism 12 and the lifting mechanism 13b, respectively, and holds the chip 6a by, for example, vacuum suction. In addition, the component mounting nozzle 20a moves toward the substrate 7 side along the Y-axis direction while holding the chip 6a, and mounts the chip 6a on the substrate 7.

[0077] Figure 3 It is a diagram showing an example of the configuration of the pickup system in this embodiment.

[0078] The pickup system 100 in the present embodiment is a system provided in the component mounting device 1 , and includes, for example, the above-mentioned component holding portion 15 , the push-up portion 34 , and the control portion 101 .

[0079] The component holding portion 15 includes a holding body portion 15c and a pickup nozzle 14a. The holding body portion 15c is composed of, for example, the above-mentioned arm 15a, the pickup head moving mechanism 15b, and the portion of the pickup head 14 other than the pickup nozzle 14a. The holding body portion 15c includes a first ultrasonic wave generating portion 152, a negative pressure generating portion 153, and a driving portion 154.

[0080] The first ultrasonic wave generating unit 152 generates ultrasonic waves from the vicinity of the opening 14b of the pickup nozzle 14a by vibrating the pickup nozzle 14a (i.e., ultrasonic vibration). That is, the pickup nozzle 14a transmits the vibration to the air in contact with the lower surface of the pickup nozzle 14a by ultrasonically vibrating in the up-down direction. For example, the first ultrasonic wave generating unit 152 causes the pickup nozzle 14a to ultrasonically vibrate with a maximum amplitude of about 10 to 20 μm.

[0081] The negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. In the present embodiment, the negative pressure generating unit 153 is configured as a vacuum pump, for example. Such a negative pressure generating unit 153 generates negative pressure around the opening 14b by setting the flow path formed in the pickup nozzle 14a, that is, the flow path 14c of air communicating with the opening 14b, to negative pressure. In other words, the negative pressure generating unit 153 generates negative pressure around the opening 14b by sucking the air around the opening 14b through the flow path 14c.

[0082] The driving unit 154 includes, for example, a motor, etc., and moves the pickup nozzle 14a in the X-axis direction, the Y-axis direction, and the Z-axis direction. In addition, the driving unit 154 rotates the pickup nozzle 14a of the pickup head 14 mounted on the front end of the arm 15a by rotating the arm 15a. Such a driving unit 154 may also be incorporated into the pickup head moving mechanism 15b.

[0083] The lifting portion 34 includes a plurality of lifting pins 34a, and the plurality of lifting pins 34a are moved up and down. The plurality of lifting pins 34a move up and press the adhesive sheet 6b, so that the chip 6a attached to the adhesive sheet 6b is lifted.

[0084] The control unit 101 controls the lifting unit 34 and the component holding unit 15. In the present embodiment, the component holding unit 15 includes the negative pressure generating unit 153, but the negative pressure generating unit 153 may not be included in the component holding unit 15. In this case, the control unit 101 controls the lifting unit 34, the component holding unit 15, and the negative pressure generating unit 153.

[0085] Figure 4 This is a diagram for explaining an example of a basic operation of the pickup nozzle 14a in this embodiment to pick up the chip 6a as a basic pattern.

[0086] First, the XY table mechanism 31 moves the moving plate 32, thereby moving the adhesive sheet 6b held by the table 3a in the X-axis direction and the Y-axis direction. Figure 4 As shown in FIG. 1 (a), the chip 6 a to be picked up is arranged at the picking work position P. That is, the chip 6 a to be picked up is arranged on the plurality of lift pins 34 a of the lift portion 34 .

[0087] Next, if Figure 4 As shown in (b), the lifting portion 34 lifts the chip 6a through the adhesive sheet 6b by raising the plurality of lifting pins 34a. In this way, when the chip 6a is lifted through the adhesive sheet 6b, the chip 6a is easily peeled off from the adhesive sheet 6b. In other words, the peeling of the chip 6a from the adhesive sheet 6b is promoted.

[0088] Next, if Figure 4As shown in (c), the pickup nozzle 14a holds the lifted chip 6a in a non-contact manner. That is, the pickup nozzle 14a holds the chip 6a in a non-contact manner by using an attractive force that brings the chip 6a closer to the opening 14b side of the pickup nozzle 14a and a repulsive force that moves the chip 6a away from the opening 14b. The attractive force is obtained by generating a negative pressure based on the negative pressure generating unit 153. For example, the distance that the chip 6a can be sucked up by the attractive force, that is, the distance from the pickup nozzle 14a to the chip 6a, is approximately 0.05 to 1.0 mm. The repulsive force is obtained by generating an ultrasonic wave based on the first ultrasonic wave generating unit 152.

[0089] And, if Figure 4 As shown in (d) of FIG. 1 , the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0090] Figure 5 It is a flowchart showing the processing operation of the control unit 101 in the basic mode.

[0091] First, the control unit 101 starts lifting of the core piece 6 a by the lifting unit 34 (step S1 ).

[0092] Next, the control unit 101 causes the negative pressure generating unit 153 to generate negative pressure so that the pickup nozzle 14a holds the chip 6a in a non-contact manner (step S2). That is, when the control unit 101 causes the pickup nozzle 14a to hold the chip 6a, after the chip 6a is lifted up by the lifting unit 34, the negative pressure generating unit 153 generates negative pressure, thereby generating the above-mentioned suction force. In addition, the control unit 101 uses the suction force that brings the chip 6a closer to the opening 14b side of the pickup nozzle 14a and the repulsive force that moves the chip 6a away from the opening 14b to cause the pickup nozzle 14a to hold the chip 6a in a non-contact manner. Here, the control unit 101 generates the above-mentioned repulsive force by causing the first ultrasonic wave generating unit 152 to generate ultrasonic waves. The timing of starting the generation of the ultrasonic wave can also be arbitrary.

[0093] Then, the control unit 101 controls the driving unit 154 to raise the pickup nozzle 14 a (step S3 ).

[0094] Thus, in this embodiment, after the chip 6a is lifted, negative pressure is generated for the pickup nozzle 14a to hold the chip 6a in a non-contact manner. Therefore, since negative pressure is generated after the chip 6a is lifted to promote the peeling of the chip 6a from the adhesive sheet 6b, the negative pressure can be set small.

[0095] Here, if negative pressure is generated before the chip 6a is lifted, a force is generated to bring the chip 6a closer to the pickup nozzle 14a in a state where the chip 6a is tightly attached to the adhesive sheet 6b. In addition, in order for the pickup nozzle 14a to hold the chip 6a in a non-contact manner, a gap is required between the pickup nozzle 14a and the chip 6a. Therefore, as described above, in the case where negative pressure is generated before the chip 6a is lifted, a large negative pressure, that is, a strong force to bring the chip 6a closer, is required. And, in the case where the chip 6a is peeled off from the adhesive sheet 6b, due to the large negative pressure, the chip 6a is strongly sucked onto the pickup nozzle 14a configured with a gap from the chip 6a. As a result, the chip 6a may collide with the pickup nozzle 14a. Even if a repulsive force acts between the chip 6a and the pickup nozzle 14a in order to hold the chip 6a in a non-contact manner, the chip 6a may collide. As a result, the chip 6a is damaged, contaminated, or broken. Furthermore, if the negative pressure generated before the chip 6 a is lifted is small, the generation of the negative pressure may not contribute much to the pickup of the chip 6 a and may be inefficient.

[0096] On the other hand, in the present embodiment, as described above, since negative pressure is generated after the chip 6a is lifted up and the peeling of the chip 6a from the adhesive sheet 6b is promoted, the negative pressure can be set small. As a result, the collision between the chip 6a and the pickup nozzle 14a can be suppressed. Therefore, the chip 6a can be suppressed from being damaged, contaminated or broken, and the chip 6a can be kept clean. Furthermore, the efficiency of picking can be achieved. Therefore, in the present embodiment, the chip 6a can be properly picked up.

[0097] In addition, in this embodiment, a so-called ultrasonic non-contact chuck is realized by the generation of ultrasonic waves by the first ultrasonic wave generating unit 152. That is, since a repulsive force is obtained by the squeezing effect based on the generation of ultrasonic waves, an appropriate repulsive force can be easily obtained. As a result, the chip 6a can be held efficiently and non-contactly.

[0098] Figure 6 This is a diagram for explaining an example of a detailed operation of picking up the chip 6a by the pickup nozzle 14a in this embodiment as a first mode.

[0099] First, if Figure 6 As shown in (a), Figure 4 In the example shown, the chip 6a to be picked up is arranged on the plurality of lift pins 34a of the lift portion 34. Figure 6 In the example of , the first ultrasonic wave generator 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a at this time. That is, the first ultrasonic wave generator 152 always generates ultrasonic waves.

[0100] Next, if Figure 6 As shown in (b) of FIG. 8 , the lift-up portion 34 lifts up the chip 6 a via the adhesive sheet 6 b by raising the plurality of lift-up pins 34 a .

[0101] Next, if Figure 6 As shown in (c), the driving unit 154 lowers the pickup nozzle 14a to approach the upper surface of the chip 6a. For example, the driving unit 154 approaches the pickup nozzle 14a to the chip 6a so that the distance from the upper surface of the chip 6a to the lower surface of the pickup nozzle 14a is 100 to 200 μm.

[0102] And, if Figure 6 As shown in (d), the negative pressure generating unit 153 starts to generate negative pressure, that is, to suck air. That is, the negative pressure generating unit 153 starts to suck air around the opening 14b through the flow path 14c of the pickup nozzle 14a. As a result, the pickup nozzle 14a holds the chip 6a in a non-contact manner. In such non-contact holding, a gap of, for example, about 25 μm in width is generated between the pickup nozzle 14a and the chip 6a.

[0103] Afterwards, with Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0104] Thus, in the first mode, the control unit 101 causes the first ultrasonic wave generator 152 to generate ultrasonic waves before starting to lift the chip 6a through the lifting unit 34. Thus, ultrasonic waves can be always generated, and the switching of the generation and stop of ultrasonic waves can be omitted. As a result, the processing operation can be simplified and the time taken for picking can be shortened.

[0105] Figure 7 FIG. 1 is a diagram for explaining an example of a detailed operation of the pickup nozzle 14a in this embodiment to pick up the chip 6a as a second mode. In the second mode, the timing of the generation of the ultrasonic wave by the first ultrasonic wave generating unit 152 is Figure 6 That is, in the second mode, the timing of generating the ultrasonic wave and the timing of generating the negative pressure are substantially the same.

[0106] Specifically, first, Figure 7 As shown in (a), Figure 4 In the illustrated example as well, the chip 6 a to be picked up is arranged on the plurality of lift pins 34 a of the lift portion 34 .

[0107] Next, if Figure 7 As shown in (b) of FIG. 8 , the lift-up portion 34 lifts up the chip 6 a via the adhesive sheet 6 b by raising the plurality of lift-up pins 34 a .

[0108] Next, if Figure 7 As shown in (c), the driving unit 154 moves the pickup nozzle 14a downward to approach the upper surface of the chip 6a.

[0109] And, if Figure 7 As shown in (d), the first ultrasonic wave generating unit 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a, and the negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. That is, the negative pressure generating unit 153 starts to suck the air around the opening 14b through the flow path 14c of the pickup nozzle 14a. As a result, the pickup nozzle 14a holds the chip 6a in a non-contact manner.

[0110] Afterwards, with Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0111] Thus, in the second mode, the control unit 101 causes the first ultrasonic wave generating unit 152 to generate ultrasonic waves after the chip 6a is lifted up by the lifting unit 34. Thus, after the chip 6a is lifted up and the peeling of the chip 6a from the adhesive sheet 6b is promoted, the vibration of the air caused by the ultrasonic wave is applied to the chip 6a, and the peeling of the chip 6a can be further promoted. As a result, the negative pressure by the negative pressure generating unit 153 can be suppressed to be small, and the possibility of the chip 6a colliding with the pickup nozzle 14a can be further suppressed.

[0112] In addition, in the second mode, the control unit 101 may also cause the first ultrasonic generating unit 152 to generate ultrasonic waves after the chip 6a is lifted up and the chip 6a is peeled off from the adhesive sheet 6b by a given amount. For example, the given amount may be a predetermined area or a ratio of an area. In a specific example, the control unit 101 determines the area of ​​the region peeled off from the adhesive sheet 6b in the entire bottom surface of the adhesive sheet 6b to which the chip 6a is attached, for example, by image processing using a camera. Furthermore, the control unit 101 may also cause the first ultrasonic generating unit 152 to generate ultrasonic waves after the area of ​​the region reaches a given amount or after the ratio of the area of ​​the region in the entire area of ​​the bottom surface reaches a given amount. Thus, since ultrasonic waves are generated after the chip 6a is peeled off by a given amount, the possibility of the chip 6a colliding with the pickup nozzle 14a can be suppressed with high accuracy.

[0113] Figure 8 FIG. 1 is a diagram for explaining an example of the detailed operation of the pickup nozzle 14a in this embodiment to pick up the chip 6a as a third mode. In the third mode, the chip 6a is lifted up while applying ultrasonic waves to the chip 6a. Figure 7The second mode is different.

[0114] Specifically, first, Figure 8 As shown in (a), Figure 4 In the illustrated example as well, the chip 6 a to be picked up is arranged on the plurality of lift pins 34 a of the lift portion 34 .

[0115] Next, if Figure 8 As shown in (b) of FIG. 1 , the driving unit 154 lowers the pickup nozzle 14a and brings it close to the upper surface of the chip 6a. At this time, the first ultrasonic wave generating unit 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a.

[0116] Next, if Figure 8 As shown in (c), the lifting unit 34 lifts the chip 6a through the adhesive sheet 6b by raising the plurality of lifting pins 34a. In addition, the driving unit 154 raises the pickup nozzle 14a synchronously with the lifting of the chip 6a. That is, the pickup nozzle 14a and the plurality of lifting pins 34a are raised while the interval between the lower surface of the pickup nozzle 14a and the front ends of the plurality of lifting pins 34a is maintained at a fixed distance.

[0117] Therefore, in the third mode, since the chip 6a is lifted up while being applied with ultrasonic waves, the chip 6a can be applied with ultrasonic waves more efficiently and for a longer period of time than in the first and second modes. In other words, the vibration of the air caused by the ultrasonic waves can be applied to the chip 6a for a longer period of time, which can further promote the peeling of the chip 6a from the adhesive sheet 6b.

[0118] And, if Figure 8 As shown in (d), the negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. That is, the negative pressure generating unit 153 starts to suck the air around the opening 14b through the flow path 14c of the pickup nozzle 14a. Thus, the pickup nozzle 14a holds the chip 6a in a non-contact manner.

[0119] Afterwards, with Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0120] Thus, in the third mode, the peeling of the chip 6a from the adhesive sheet 6b can be further promoted. Furthermore, compared with the second mode, since the generation of ultrasonic waves starts earlier than the generation of negative pressure, that is, since the repulsive force acts earlier than the attractive force, the possibility of the chip 6a colliding with the pickup nozzle 14a can be further suppressed.

[0121] Fig. 91 is a diagram for explaining an example of a detailed operation of the pickup nozzle 14a in this embodiment to pick up the chip 6a as a fourth mode. The fourth mode is also referred to as Figure 7 That is, in the fourth mode, the timing of generating ultrasonic waves and generating negative pressure is different from that in the second mode, but other operations are performed in the same manner as in the second mode.

[0122] Specifically, first, Fig. 9 As shown in (a) of FIG. 1 , the chip 6a to be picked up is arranged on a plurality of lift pins 34a of the lift portion 34. Next, as shown in FIG. Fig. 9 As shown in (b) of FIG. 1 , the lifting portion 34 lifts the chip 6a via the adhesive sheet 6b by raising the plurality of lifting pins 34a. Fig. 9 As shown in (c), the driving unit 154 moves the pickup nozzle 14a downward to approach the upper surface of the chip 6a.

[0123] And, if Fig. 9 As shown in (d) of FIG. 1 , the first ultrasonic wave generating unit 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a. Fig. 9 As shown in (e) of FIG. 1 , the negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. That is, the negative pressure generating unit 153 starts to suck the air around the opening 14b through the flow path 14c of the pickup nozzle 14a.

[0124] Afterwards, with Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0125] In this way, in the fourth mode, the generation of ultrasonic waves starts earlier than the generation of negative pressure compared to the second mode, that is, the repulsive force acts earlier than the attractive force, so the possibility of the chip 6a colliding with the pickup nozzle 14a can be further suppressed.

[0126] Fig.10 This is a diagram for explaining an example of the detailed operation of the pickup nozzle 14a in this embodiment to pick up the chip 6a as a fifth mode. The fifth mode is also referred to as Figure 7 That is, in the fifth mode, an operation for further promoting the peeling of the chip 6a from the adhesive sheet 6b is added to the operation of the second mode.

[0127] Specifically, the picking system 100 performs Fig.10 The actions shown in (a) to (d) are as follows. Fig.10 The actions shown in (a) to (d) are similar to Figure 7 The operations shown in (a) to (d) are the same. By such operations, the pickup nozzle 14a holds the chip 6a in a non-contact manner.

[0128] Next, if Fig.10 As shown in (e) of FIG. 1 , the negative pressure generating unit 153 stops generating the negative pressure. Fig.10 As shown in (d) of FIG. 1 , the negative pressure generating unit 153 starts generating the negative pressure again. The negative pressure generating unit 153 promotes the separation of the chip 6 a from the adhesive sheet 6 b by repeating the start and stop of generating the negative pressure.

[0129] Afterwards, with Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0130] In this way, in the fifth mode, by repeating the start and stop of the generation of negative pressure, it is possible to promote the peeling of the chip 6a from the adhesive sheet 6b more than in any of the above-mentioned modes.

[0131] In the above-mentioned embodiment, the generation of negative pressure starts after the chip 6a is lifted up. However, as long as the chip 6a is properly picked up, the generation of negative pressure may also start before the chip 6a is lifted up. Fig.11 as well as Fig.12 The chip 6a is picked up as in the example shown.

[0132] Fig.11 This is a diagram for explaining an exceptional operation of the pickup nozzle 14a picking up the chip 6a in the present embodiment as a first exceptional mode.

[0133] First, if Fig.11 As shown in (a), Figure 4 In the example shown, the chip 6a to be picked up is arranged on the plurality of lift pins 34a of the lift portion 34. Fig.11 As shown in (b) of FIG. 6 , the driving unit 154 moves the pickup nozzle 14 a downward to approach the upper surface of the chip 6 a .

[0134] Next, if Fig.11 As shown in (c), the first ultrasonic wave generating unit 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a, and the negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a before lifting the chip 6a. That is, the negative pressure generating unit 153 sucks the air around the opening 14b through the flow path 14c of the pickup nozzle 14a. As a result, the pickup nozzle 14a holds the chip 6a in a non-contact manner.

[0135] Next, if Fig.11As shown in (d), the lifting unit 34 lifts the chip 6a through the adhesive sheet 6b by raising the plurality of lifting pins 34a. Furthermore, the driving unit 154 raises the pickup nozzle 14a synchronously with the lifting of the chip 6a. That is, the pickup nozzle 14a and the plurality of lifting pins 34a are raised while the interval between the lower surface of the pickup nozzle 14a and the front ends of the plurality of lifting pins 34a is maintained at a fixed distance.

[0136] Afterwards, with Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0137] Fig.12 This is a diagram for explaining the exceptional action of the pickup nozzle 14a picking up the chip 6a in this embodiment as the second exceptional mode. The second exceptional mode is also referred to as Fig.11 That is, in the second exception mode, the timing of generating ultrasonic waves and generating negative pressure is different from that in the first exception mode, but other operations are performed in the same manner as in the first exception mode.

[0138] Specifically, first, Fig.12 As shown in (a), the chip 6a to be picked up is arranged on the plurality of lift pins 34a of the lift portion 34. In addition, in the second exception mode, the first ultrasonic wave generator 152 generates ultrasonic waves from the periphery of the opening 14b of the pickup nozzle 14a at this time. That is, the first ultrasonic wave generator 152 always generates ultrasonic waves. Furthermore, in the second exception mode, the negative pressure generator 153 also generates negative pressure around the opening 14b of the pickup nozzle 14a at this time. That is, the negative pressure generator 153 always generates negative pressure.

[0139] Next, if Fig.12 As shown in (b) of FIG. 1 , the driving unit 154 lowers the pickup nozzle 14 a and brings it close to the upper surface of the chip 6 a . Thereby, the pickup nozzle 14 a holds the chip 6 a in a non-contact manner.

[0140] Next, if Fig.12 As shown in (c), the lifting unit 34 and the driving unit 154 perform the same operation as in the first exception mode. Fig.11 That is, the lifting unit 34 lifts the chip 6a via the adhesive sheet 6b by raising the plurality of lifting pins 34a. The driving unit 154 raises the pickup nozzle 14a synchronously with the lifting of the chip 6a.

[0141] Afterwards, with Figure 4Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0142] In such a second exceptional mode, the time required for picking up can be shortened compared to the first exceptional mode.

[0143] (Implementation method 2)

[0144] The picking system in this embodiment performs an additional action for properly picking up the chip 6a, which is not performed in the picking system 100 in the first embodiment. In addition, the picking system in this embodiment can also perform any of the first to fifth modes, the first exception mode, and the second exception mode in the first embodiment.

[0145] Fig.13 It is a perspective view of the component mounting device 1a in this embodiment.

[0146] like Fig.13 As shown, the component mounting device 1a in this embodiment includes the various structural elements included in the component mounting device 1 in embodiment 1 and a second ultrasonic generating unit 35. The second ultrasonic generating unit 35 is arranged below the adhesive sheet 6b to output ultrasonic waves to the adhesive sheet 6b. Such a second ultrasonic generating unit 35 is provided in the pickup system in this embodiment. In addition, in this embodiment, below the adhesive sheet 6b, the lifting portion 34 and the second ultrasonic generating unit 35 are configured to be movable along the XY plane. Specifically, the lifting portion 34 and the second ultrasonic generating unit 35 are configured to be movable so that one of the lifting portion 34 and the second ultrasonic generating unit 35 is arranged alternately with the other below the chip 6a and the adhesive sheet 6b of the pickup object.

[0147] Fig.14 It is a diagram showing an example of the configuration of the pickup system in this embodiment.

[0148] The pickup system 100 a in this embodiment is a system included in the component mounting device 1 a , and includes, for example, a component holding unit 15 , a lifting unit 34 , a control unit 101 , a second ultrasonic wave generating unit 35 , a light emitting unit 161 , a camera 162 , and a moving mechanism 36 .

[0149] The component holding portion 15 in this embodiment includes a holding body portion 15c and a pickup nozzle 14a. In addition, the holding body portion 15c in this embodiment includes not only the first ultrasonic wave generating portion 152, the negative pressure generating portion 153, and the driving portion 154 in Embodiment 1, but also a measuring portion 155. The measuring portion 155 measures the flow rate of air flowing into the pickup nozzle 14a through the opening 14b in order to generate negative pressure by the negative pressure generating portion 153. In addition, the air flowing into the pickup nozzle 14a is specifically the air flowing into the flow path 14c.

[0150] The light emitting unit 161 illuminates the periphery of the opening 14b of the pickup nozzle 14a by emitting light.

[0151] The camera 162 takes a picture of the periphery of the opening 14b of the pickup nozzle 14a illuminated by the light emitting unit 161. For example, when the pickup nozzle 14a holds the chip 6a in a non-contact manner, the light emitting unit 161 emits light and the camera 162 takes a picture. Thus, a pickup image is obtained that reflects the periphery of the opening 14b of the pickup nozzle 14a and the chip 6a illuminated by the light emitting unit 161. It can also be said that the state in which the pickup nozzle 14a holds the chip 6a in a non-contact manner (hereinafter also referred to as the holding state) is reflected in the pickup image. The control unit 101 determines the interval between the pickup nozzle 14a and the chip 6a reflected in the pickup image. Thus, the holding state of the chip 6a is identified.

[0152] The moving mechanism 36 includes, for example, a motor, and moves the lifting portion 34 and the second ultrasonic wave generating portion 35 along the XY plane according to the control performed by the control unit 101. Figure 2 The pick-up operation position P shown in the figure is provided with the lifting part 34, and the second ultrasonic wave generating part 35 is moved to a position other than the pick-up operation position P. Alternatively, the moving mechanism 36 replaces the lifting part 34 and the second ultrasonic wave generating part 35 is arranged at the pick-up operation position P, and the lifting part 34 is moved to a position other than the pick-up operation position P.

[0153] Fig.15 This is a diagram for explaining an example of the basic operation of picking up the chip 6a by the pickup nozzle 14a in this embodiment.

[0154] First, if Fig.15As shown in (a), the moving mechanism 36 moves the second ultrasonic generating unit 35 to the picking operation position P. And the second ultrasonic generating unit 35 outputs ultrasonic waves from the bottom to the chip 6a of the picking object through the adhesive sheet 6b. At this time, the second ultrasonic generating unit 35 outputs ultrasonic waves in a non-contact state with the adhesive sheet 6b. For example, when the second ultrasonic generating unit 35 is in contact with the adhesive sheet 6b, the vibration of the second ultrasonic generating unit 35 is transmitted to the chip 6a through the adhesive sheet 6b, and the chip 6a may be damaged. However, in the present embodiment, as described above, since the second ultrasonic generating unit 35 outputs ultrasonic waves in a non-contact manner, the possibility of damage to the chip 6a can be reduced.

[0155] Next, if Fig.15 As shown in (b) of FIG. 1 , the moving mechanism 36 retracts the second ultrasonic wave generating unit 35 from the pickup operation position P and moves the lifting unit 34 to the pickup operation position P. Thereafter, the pickup system 100 a performs the same operation as the pickup system 100 of the first embodiment.

[0156] That is to say, Fig.15 As shown in (c), the lifting portion 34 lifts the chip 6a through the adhesive sheet 6b by raising the plurality of lifting pins 34a. And the pickup nozzle 14a holds the lifted chip 6a in a non-contact manner. That is, the pickup nozzle 14a holds the chip 6a in a non-contact manner by using an attractive force that brings the chip 6a closer to the opening 14b side of the pickup nozzle 14a and a repulsive force that moves the chip 6a away from the opening 14b. The attractive force is obtained by generating negative pressure based on the negative pressure generating portion 153, and the repulsive force is obtained by generating ultrasonic waves based on the first ultrasonic wave generating portion 152.

[0157] In addition, Fig.15 After the state shown in (b), the picking system 100a can also perform the operation of any mode of the first mode to the fifth mode in the first embodiment, such as Fig.15 As shown in (c), the chip 6a is held in a non-contact manner. Alternatively, the pickup system 100a may perform the operation in the first exception mode or the second exception mode in the first embodiment.

[0158] Thus, in this embodiment, by outputting ultrasonic waves from the second ultrasonic wave generating unit 35, the vibration of air caused by the ultrasonic waves can be applied to the chip 6a attached to the adhesive sheet 6b via the adhesive sheet 6b. Therefore, the peeling of the chip 6a can be further promoted. As a result, the possibility of the chip 6a colliding with the pickup nozzle 14a can be further suppressed.

[0159] In addition, in this embodiment, the promotion of the peeling of the chip 6a by the ultrasonic wave output from the second ultrasonic wave generating unit 35 and the promotion of the peeling of the chip 6a by the lifting can be alternately switched. As a result, the peeling of the chip 6a can be further appropriately promoted. As a result, the possibility of the chip 6a colliding with the pickup nozzle 14a can be further suppressed.

[0160] In the present embodiment, lifting from the bottom of the adhesive sheet 6 b and output of ultrasonic waves are performed. However, if the peeling of the chip 6 a is sufficiently accelerated by output of ultrasonic waves, lifting may not be performed.

[0161] Fig.16 This is a diagram showing an example of adjustment of the negative pressure by the negative pressure generating unit 153 .

[0162] For example, Fig.16 As shown, the control unit 101 causes the negative pressure generating unit 153 to adjust the negative pressure based on the air flow rate measured by the measuring unit 155. The air flow rate is the air flow rate flowing into the flow path 14c of the pickup nozzle 14a when the pickup nozzle 14a holds the chip 6a in a non-contact manner.

[0163] Specifically, Fig.16 As shown in (a), the air flow rate measured by the measuring unit 155 is 0.5 L / min. In this case, since the air flow rate is small, the interval between the chip 6a and the pickup nozzle 14a is narrow, and there is a concern that the chip 6a and the pickup nozzle 14a may come into contact.

[0164] For this reason, Fig.16 As shown in (b), the negative pressure generating unit 153 adjusts the negative pressure based on the control performed by the control unit 101. For example, the negative pressure generating unit 153 reduces the negative pressure. As a result, the interval between the chip 6a and the pickup nozzle 14a widens, and the flow rate of air measured by the measuring unit 155 increases to 4.5 L / min. As a result, the contact of the chip 6a can be suppressed. In other words, the chip 6a can be suppressed from being damaged, bent, or broken due to the contact between the chip 6a and the pickup nozzle 14a.

[0165] Thus, in this embodiment, the negative pressure generating unit 153 is controlled so that the flow rate measured by the measuring unit 155 is within a given range. Fig.16 In the example of , the given range is, for example, 4.4 to 4.6 L / min. Fig.16 The example is an example in which the flow rate measured by the measuring unit 155 is less than a given range, but when the flow rate is greater than the given range, the control unit 101 may control the negative pressure generating unit 153 to increase the negative pressure.

[0166] Thus, by measuring the flow rate by the measuring unit 155, the holding state of the chip 6a by the pickup nozzle 14a can be grasped, and the holding state can be corrected to an appropriate state. As a result, the chip 6a can be prevented from falling from the pickup nozzle 14a, and further, the chip 6a can be prevented from contacting the pickup nozzle 14a. Thus, the chip 6a can be properly picked up, for example, the chip 6a can be turned over and properly handed over to the component mounting nozzle 20a. In a specific example, the chip 6a can be prevented from falling from the pickup nozzle 14a when the chip 6a is turned over.

[0167] Fig.17 This is a diagram showing another example of the adjustment of the negative pressure by the negative pressure generating unit 153 .

[0168] For example, Fig.16 As shown, the control unit 101 causes the negative pressure generating unit 153 to adjust the negative pressure based on the image picked up by the camera 162 .

[0169] Specifically, Fig.17 As shown in (a), the control unit 101 acquires the pickup image from the camera 162 and determines the interval between the chip 6a and the pickup nozzle 14a shown in the pickup image. The interval is, for example, 10 μm. In this case, since the interval between the chip 6a and the pickup nozzle 14a is narrow, there is a concern that the chip 6a and the pickup nozzle 14a may come into contact.

[0170] For this reason, Fig.17 As shown in (b), the negative pressure generating unit 153 adjusts the negative pressure based on the control performed by the control unit 101. For example, the negative pressure generating unit 153 reduces the negative pressure. As a result, the gap between the chip 6a and the pickup nozzle 14a becomes wider. The gap becomes as wide as 25 μm, for example. As a result, the contact of the chip 6a can be suppressed. In other words, it is possible to suppress the chip 6a from being damaged, bent, or broken due to the contact between the chip 6a and the pickup nozzle 14a.

[0171] Thus, in this embodiment, the negative pressure generating unit 153 is controlled so that the interval between the chip 6a and the pickup nozzle 14a is within a given range. Fig.17 In the example of , the given range is, for example, 24 to 26 μm. Fig.17 The example is an example in which the interval between the chip 6a and the pickup nozzle 14a is narrow, but when the interval is wide, the control unit 101 may control the negative pressure generating unit 153 to increase the negative pressure.

[0172] Fig.18 1 is a flowchart showing the processing operation of the control unit 101 in this embodiment.

[0173] First, the control unit 101 causes the second ultrasonic wave generator 35 to output ultrasonic waves (step S21). That is, the second ultrasonic wave generator 35 is arranged at the pickup operation position P, and outputs ultrasonic waves to the chip 6a of the pickup object from below through the adhesive sheet 6b. Next, the control unit 101 rotates the second ultrasonic wave generator 35 and the lifting unit 34 (step S22). That is, the second ultrasonic wave generator 35 retreats from the pickup operation position P and moves to a place other than the pickup operation position P. And the lifting unit 34 is arranged at the pickup operation position P.

[0174] Next, the control unit 101 starts to lift the chip 6a by the lifting unit 34 (step S23). In addition, the control unit 101 may repeatedly perform the processing of steps S21 to S23. That is, after the chip 6a is lifted up in step S23, the control unit 101 releases the lifting of the chip 6a and disposes the second ultrasonic wave generating unit 35 at the picking operation position P instead of the lifting unit 34. Furthermore, the control unit 101 repeatedly performs the processing from step S21.

[0175] Next, the control unit 101 causes the negative pressure generating unit 153 to generate negative pressure, so that the pickup nozzle 14a holds the chip 6a in a non-contact manner (step S24). Steps S23 and S24 are the same as those of the first embodiment. Figure 5 The steps S1 and S2 shown are the same processes.

[0176] Next, the control unit 101 obtains the air flow rate measured by the measuring unit 155 (step S25), and determines whether the flow rate is within the appropriate range (step S26). Here, when it is determined that the flow rate is within the appropriate range (yes in step S26), the control unit 101 causes the camera 162 to capture the state of the pickup nozzle 14a holding the chip 6a (step S27). Thus, the above-mentioned pickup image is obtained.

[0177] Next, the control unit 101 determines whether the holding state reflected in the pickup image is appropriate (step S28). In other words, the control unit 101 determines whether the interval between the chip 6a reflected in the pickup image and the pickup nozzle 14a is within an appropriate range. Here, when it is determined that the interval is within the appropriate range (yes in step S28), the control unit 101 controls the driving unit 154 to raise the pickup nozzle 14a to a position where the chip 6a can be delivered to the component mounting nozzle 20a (step S30).

[0178] On the other hand, when it is determined in step S26 that the flow rate is not within the appropriate range (No in step S26), the control unit 101 causes the negative pressure generating unit 153 to adjust the negative pressure (step S29), and repeatedly executes the process from step S25. Similarly, when it is determined in step S28 that the interval is not within the appropriate range (No in step S28), the control unit 101 also causes the negative pressure generating unit 153 to adjust the negative pressure (step S29), and repeatedly executes the process from step S25.

[0179] In addition, in the present embodiment, the measuring unit 155 is a flow meter that measures the flow rate of air, but it may also be a pressure gauge that measures the pressure of air. The pressure of the air is the pressure of the air that flows into the pickup nozzle 14a through the opening 14b in order to generate negative pressure by the negative pressure generating unit 153. The air that flows into the pickup nozzle 14a is specifically the air that flows in through the flow path 14c. In this case, the control unit 101 controls the negative pressure generating unit 153 so that the pressure measured by the measuring unit 155 converges to a given range.

[0180] In addition, the control unit 101 may control the first ultrasonic wave generator 152 instead of controlling the negative pressure generator 153, or may control the negative pressure generator 153 and the first ultrasonic wave generator 152. That is, the control unit 101 controls at least one of the negative pressure generator 153 and the first ultrasonic wave generator 152 so that the flow rate or pressure measured by the measuring unit 155 converges within a given range. In other words, the control unit 101 controls at least one of the attraction force based on the negative pressure and the repulsion force based on the ultrasonic wave. Thus, the holding state can be corrected to an appropriate state.

[0181] (Other variations)

[0182] The above is a description of the pickup system involved in one or more embodiments based on each embodiment, but the present disclosure is not limited to these embodiments. As long as it does not deviate from the main purpose of the present disclosure, various modifications that can be thought of by a person skilled in the art to the above-mentioned embodiments and the methods of combining the structural elements in each embodiment can also be included in the present disclosure.

[0183] For example, in the first and second embodiments described above, the lifted chip 6 a is held in a non-contact manner, but the chip 6 a that is not lifted may be held in a non-contact manner as an exception.

[0184] Fig.19 This is a diagram for explaining an exceptional operation in which the pickup nozzle 14a picks up the chip 6a as a third exceptional mode.

[0185] First, if Fig.19As shown in (a), the second ultrasonic generator 35 is disposed at the pickup operation position P. The second ultrasonic generator 35 outputs ultrasonic waves from below to the chip 6a to be picked up through the adhesive sheet 6b. At this time, the second ultrasonic generator 35 outputs ultrasonic waves without contacting the adhesive sheet 6b.

[0186] Next, if Fig.19 As shown in (b), the driving unit 154 lowers the pickup nozzle 14a and approaches the upper surface of the chip 6a. Furthermore, the first ultrasonic wave generating unit 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a. Fig.19 As shown in (c), the negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. That is, the negative pressure generating unit 153 sucks air around the opening 14b through the flow path 14c of the pickup nozzle 14a. Thus, the pickup nozzle 14a holds the chip 6a in a non-contact manner.

[0187] Next, if Fig.19 As shown in (d) of FIG. 1 , the second ultrasonic wave generating unit 35 stops outputting ultrasonic waves. Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0188] In addition, Fig.19 In the example shown, the chip 6a is not lifted, but it is also possible to lift the chip 6a by the lifting portion 34 and release the lifting, as shown in FIG. Fig.19 As shown in (a) of FIG. 1 , the second ultrasonic wave generating unit 35 outputs ultrasonic waves. Fig.19 In the example shown, the first ultrasonic wave generator 152 generates ultrasonic waves to hold the chip 6a in a non-contact manner, but the first ultrasonic wave generator 152 may not generate ultrasonic waves. In this case, the pickup nozzle 14a contacts the chip 6a and adsorbs the chip 6a.

[0189] In the above-described first and second embodiments, the chips 6 a attached to the adhesive sheet 6 b are picked up, but the chips 6 a placed on a tray may be picked up.

[0190] Fig. 20 This is a diagram for explaining an exceptional operation in which the pickup nozzle 14a picks up the chip 6a as a fourth exceptional mode.

[0191] First, if Fig. 20 As shown in FIG. 8 (a), the pickup nozzle 14 a is arranged above the chip 6 a placed on the tray 4 .

[0192] Next, if Fig. 20As shown in (b) of FIG. 6 , the driving unit 154 moves the pickup nozzle 14 a downward to approach the upper surface of the chip 6 a .

[0193] And, if Fig. 20 As shown in (c), the first ultrasonic wave generating unit 152 generates ultrasonic waves around the opening 14b of the pickup nozzle 14a. Furthermore, the negative pressure generating unit 153 generates negative pressure around the opening 14b of the pickup nozzle 14a. That is, the negative pressure generating unit 153 starts to suck the air around the opening 14b through the flow path 14c of the pickup nozzle 14a. Thus, the pickup nozzle 14a holds the chip 6a in a non-contact manner. For example, when the pickup nozzle 14a approaches the chip 6a in a state where ultrasonic waves are generated, the chip 6a, which is subjected to the vibration of the air caused by the ultrasonic waves, may slide from the tray 4 and deviate because it is attached to the tray 4. However, in the case of the fourth exception mode, since ultrasonic waves are generated after the pickup nozzle 14a approaches the upper surface of the chip 6a, the deviation of the chip 6a can be suppressed.

[0194] Afterwards, with Figure 4 Similarly to the example shown in (d), the pickup nozzle 14 a is driven upward by the driving unit 154 while holding the chip 6 a in a non-contact manner.

[0195] In addition, in the above-mentioned embodiments 1 and 2, the chip 6a is held by ultrasound. That is, the chip 6a is held by a so-called ultrasonic non-contact chuck. However, the present disclosure is not limited to ultrasonic non-contact chucks, and the chip 6a can also be held by a Bernoulli chuck. In the Bernoulli chuck, the negative pressure generating unit 153 generates negative pressure around the opening 14b by blowing out air of a swirling flow from the peripheral portion of the opening 14b in the pickup nozzle 14a. In addition, in the Bernoulli chuck, the flow path 14c of the pickup nozzle 14a is maintained at a positive pressure, and air flows into the opening 14b along the flow path 14c. Even with such a Bernoulli chuck, by generating negative pressure after lifting the chip 6a, the effects of the above-mentioned embodiments 1 and 2 can be achieved.

[0196] In the above-mentioned first and second embodiments, the pickup nozzle 14a holds the chip 6a in a non-contact manner, but the component mounting nozzle 20a may hold the chip 6a in a non-contact manner similarly to the pickup nozzle 14a.

[0197] In addition, in each of the above-mentioned embodiments, the control unit 101 and the like are constituted by dedicated hardware, but they can also be realized by executing a software program suitable for the control unit 101. The control unit 101 can also be realized by a program execution unit such as a CPU or a processor reading a software program recorded in a recording medium such as a hard disk or a semiconductor memory and executing it. Here, the software that realizes the control unit 101 and the like in the above-mentioned embodiments, for example, causes a computer to execute Figure 5 or Fig.18 The steps of the flowchart shown.

[0198] In addition, the following cases are also included in the present disclosure.

[0199] (1) The control unit 101 may be a computer system composed of a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk unit, a display unit, a keyboard, a mouse, etc. A computer program is stored in the RAM or the hard disk unit. The control unit 101 achieves its function by the microprocessor operating according to the computer program. Here, the computer program is a computer program composed of a plurality of command codes representing instructions to a computer in order to achieve a given function.

[0200] (2) The control unit 101 may also be composed of a system LSI (Large Scale Integration). A system LSI is a multifunctional LSI manufactured by integrating multiple components on a single chip. Specifically, it is a computer system composed of a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The microprocessor operates according to the computer program, and the system LSI achieves its functions.

[0201] (3) The control unit 101 may also be composed of a removable IC card or a single module. The IC card or module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or module may also include the above-mentioned ultra-multifunctional LSI. The IC card or module achieves its function by the microprocessor operating according to the computer program. The IC card or module may also be tamper-proof.

[0202] (4) The present disclosure may be the above-described methods. In addition, the present disclosure may be a computer program that implements the methods on a computer, or a digital signal composed of the computer program.

[0203] In addition, the present disclosure may be in the form of a computer program or digital signal recorded on a computer-readable recording medium, such as a floppy disk, a hard disk, a CD (Compact Disc)-ROM, a DVD, a DVD-ROM, a DVD-RAM, a BD (Blu-ray (registered trademark) Disc), a semiconductor memory, etc. In addition, it may be a digital signal recorded on these recording media.

[0204] In addition, the present disclosure may also be transmitted as a computer program or a digital signal via an electric communication line, a wireless communication line or a wired communication line, a network represented by the Internet, data broadcasting, or the like.

[0205] Furthermore, the program or digital signal may be recorded on a recording medium and transferred, or the program or digital signal may be transferred via a network or the like, so that the program or digital signal can be implemented by another independent computer system.

[0206] Industrial Applicability

[0207] The present disclosure can be used, for example, in a system that picks up a component and performs a work using the component.

[0208] Explanation of symbols

[0209] 1.1a Component installation device

[0210] 2 abutment

[0211] 3. Parts supply department

[0212] 3a Keep the workbench

[0213] 5. Substrate holding part

[0214] 5a Transport rails

[0215] 6 Semiconductor chip unit

[0216] 6a chip

[0217] 6b Adhesive sheet

[0218] 7 substrate

[0219] 11 Framework

[0220] 11a Support column

[0221] 11b Y-axis frame

[0222] 12 Y-axis drive mechanism

[0223] 13. Component installation section

[0224] 13a Mobile board

[0225] 13b Lifting mechanism

[0226] 13c lifting plate

[0227] 14 Pickup head

[0228] 14a Pick up nozzle (holding tool)

[0229] 14b Opening

[0230] 14c flow path

[0231] 15. Parts holding section

[0232] 15a Arm

[0233] 15b Pickup head moving mechanism

[0234] 15c Maintain the main body

[0235] 20 Mounting units

[0236] 20a Component mounting nozzle

[0237] 21 Pick up camera

[0238] 31 XY table mechanism

[0239] 32 Mobile board

[0240] 33 Supporting member

[0241] 34 Lifting part

[0242] 34a Lifting pin

[0243] 35. Second ultrasonic wave generating unit

[0244] 36 Mobile mechanism

[0245] 100, 100a Pickup System

[0246] 101 Control Department

[0247] 152 First ultrasonic wave generating unit

[0248] 153 Negative pressure generating unit

[0249] 154 Drive unit

[0250] 155 Measurement Department

[0251] 161 Luminous part

[0252] 162 cameras.

Claims

1. A picking system comprising: A lifting portion, which lifts the component attached to the adhesive sheet from bottom to top through the adhesive sheet; A component holding portion, which holds the component attached to the adhesive sheet from above by using a freely liftable holding tool having an opening; a negative pressure generating portion for generating negative pressure around the opening of the holding tool; and a control unit that controls the lifting unit, the component holding unit, and the negative pressure generating unit, The control unit performs the following processing: The lifting portion starts lifting the component, The holding tool holds the component in a non-contact manner by utilizing an attractive force that brings the component closer to the opening side of the holding tool and a repulsive force that moves the component away from the opening, raising the holding tool holding the component, When the holding tool holds the component, after the component is pushed up by the push-up portion, the suction force is generated by causing the negative pressure generating portion to generate negative pressure.

2. The picking system according to claim 1, wherein: The component holding portion further comprises: The first ultrasonic wave generating unit generates ultrasonic waves from the periphery of the opening by vibrating the holding tool. The control unit generates the repulsive force by causing the first ultrasonic wave generator to generate ultrasonic waves when causing the holding tool to hold the component.

3. The picking system according to claim 2, wherein: The control unit controls the first ultrasonic wave generator to generate ultrasonic waves before the member starts to be lifted up by the lifting unit.

4. The picking system according to claim 2, wherein: The control unit causes the first ultrasonic wave generating unit to generate ultrasonic waves after the member is pushed up by the pushing-up unit.

5. The picking system according to claim 4, wherein: The control unit controls the first ultrasonic wave generator to generate ultrasonic waves after the member is peeled off from the pressure-sensitive adhesive sheet by a predetermined amount due to the lifting of the member.

6. The picking system according to claim 2, wherein: The picking system also has: The second ultrasonic wave generating unit is disposed below the adhesive sheet and outputs ultrasonic waves toward the adhesive sheet.

7. The picking system according to claim 6, wherein: The push-up portion and the second ultrasonic wave generating portion are movably disposed so that one of the push-up portion and the second ultrasonic wave generating portion is alternately disposed below the component and the adhesive sheet with the other.

8. The picking system according to any one of claims 2 to 7, wherein: The picking system also has: a measuring unit for measuring a flow rate of air flowing into the holding tool through the opening or a pressure of the air in order to generate negative pressure by the negative pressure generating unit, The control unit controls at least one of the negative pressure generating unit and the first ultrasonic wave generating unit so that the flow rate or the pressure measured by the measuring unit falls within a given range.

9. A picking method, A lifting action of lifting the component attached to the adhesive sheet from the bottom to the top via the adhesive sheet is started, The holding tool having an opening holds the component in a non-contact manner by using an attractive force that brings the component closer to the opening side and a repulsive force that moves the component away from the opening, The holding tool is raised while holding the component. When the holding tool holds the component, after the component is lifted up by the lifting action, the suction force is generated by causing the negative pressure generating portion to generate negative pressure around the opening of the holding tool.

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