Auxiliary chip removal device of hole making system based on jet flow control

Abstract

The invention relates to an auxiliary chip removal device of a hole making system based on jet flow control. The auxiliary chip removal device comprises a high-pressure buffer assembly, a low-pressure buffer assembly and an air guide mechanism. The high-pressure buffering assembly is arranged in the low-pressure buffering assembly and used for blowing cuttings to suspend in the air. The low-pressure buffering assembly wraps the high-pressure buffering assembly and is used for absorbing cuttings. The high-pressure buffering assembly and the low-pressure buffering assembly are provided with a through cutter inlet channel in the same longitudinal direction, and a cutter can penetrate through the cutter inlet channel to conduct drilling operation on an operation area of the face to be machined. The bottom of the low-pressure buffering assembly is attached to a to-be-machined face. The air guiding mechanism is used for adjusting and optimizing the airflow direction and speed in the high-pressure buffering assembly and the low-pressure buffering assembly. Compared with the prior art, double mechanisms of high-pressure air blowing and low-pressure air suction are combined, and the problem that a traditional chip removal mode is low in efficiency is effectively solved. And due to the introduction of the air guide mechanism, the accurate regulation and control of airflow are realized, and the pertinence and efficiency of chip removal are improved.

Description

Technical Field

[0001] The invention relates to the technical field of mechanical processing, and in particular to an auxiliary chip removal device of a hole making system based on jet control. Background Art

[0002] In metal cutting processing, if the chips generated by drilling operations are not removed in time, it will not only affect the processing efficiency, but may also cause tool wear, deterioration of workpiece surface quality and safety hazards.

[0003] According to the investigation, the existing chip removal devices for hole making are divided into two types: direct suction type and blowing and suction type. Among them, the wind field of the direct suction type chip removal device is approximately axially symmetrically distributed, which brings the following problems: 1. The chips are located in the central area of ​​the chip removal device, and the flow field just forms a low-speed and high-pressure area in this area, where the chips are difficult to remove; 2. The suction pressure decays quickly, and the effective chip removal airflow is difficult to reach the chip area. The blowing and suction type chip removal device makes up for the shortcomings of the direct suction type, but there are still the following problems: 1. During the processing, the wind field around the tool exists in the form of cylindrical flow, thereby generating a low-speed area on the "leeward side", which hinders the chips from moving with the fluid; 2. Some chips are blown into the environment instead of entering the suction port.

[0004] Therefore, considering the demand for chip removal devices in the existing processing process and the shortcomings of the existing chip removal devices, it is particularly important to develop a device that can effectively and quickly remove drilling chips. Summary of the invention

[0005] The purpose of the present invention is to overcome the defects of the above-mentioned prior art, thereby providing a jet-controlled auxiliary chip removal device for a hole-making system. The present invention utilizes the principle of airflow dynamics to accurately control the direction and intensity of the airflow to achieve a device for efficient and continuous chip removal during the drilling process, thereby improving processing efficiency and workpiece quality.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] The technical solution of the present invention is to provide a jet-controlled hole-making system auxiliary chip removal device, comprising: a high-pressure buffer component, a low-pressure buffer component, and an air guide mechanism;

[0008] The high-pressure buffer assembly is arranged inside the low-pressure buffer assembly and is used to blow the chips up and suspend them in the air;

[0009] The low-pressure buffer component is wrapped around the outside of the high-pressure buffer component and is used to absorb chips;

[0010] The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a tool inlet passage in the same longitudinal direction for the tool to pass through the working area of ​​the processing surface to perform drilling operations;

[0011] The bottom of the low-pressure buffer assembly is in contact with the surface to be processed;

[0012] The air guiding mechanism is used to adjust and optimize the airflow direction and speed in the high-pressure buffer assembly and the low-pressure buffer assembly.

[0013] In some specific embodiments, the high-pressure buffer assembly includes a high-pressure buffer chamber, an air intake pipe,

[0014] The air inlet pipe is in communication with the high-pressure buffer chamber and is used to connect to a high-pressure air source;

[0015] The high-pressure buffer chamber is used to guide the airflow entering from the air inlet pipe to reach the working area.

[0016] In some specific embodiments, the air inlet pipe is provided with one or more air inlet pipes.

[0017] In some specific embodiments, the low-pressure buffer assembly includes a low-pressure buffer chamber, an air intake pipe,

[0018] The air intake pipe is in communication with the low-pressure buffer chamber and is used to connect to a low-pressure air source;

[0019] The low-pressure buffer chamber is used to guide the air flow from the working area to the air intake pipe.

[0020] In some specific embodiments, the number of the suction pipes is one or more.

[0021] In some specific embodiments, the air guide mechanism includes a plurality of air guide blades disposed in the low-pressure buffer chamber and used to guide the flow direction of the airflow, and the air guide blades are located above the surface to be processed and around the chips in the working area.

[0022] In some specific embodiments, the air guide mechanism includes an air intake branch pipe, a power impeller, and an air guide impeller.

[0023] The air intake branch pipe is used to be connected to a high-pressure air source;

[0024] The power impeller is arranged in the low-pressure buffer chamber, aligned with the air intake branch pipe, and connected to the air guide impeller;

[0025] The power impeller and the air guide impeller are provided with holes which penetrate the tool inlet channel. The air guide blades include a plurality of air guide blades which are arranged around the holes and are located above the surface to be processed and around the chips in the working area, so as to change the air flow direction in the working area.

[0026] In some specific embodiments, the invention further comprises: a chip collection device, a filtering system, and a control system.

[0027] The chip collection device is connected to the air intake pipe and is used to collect and store the sucked chips;

[0028] The filtering device is arranged inside the air intake pipe or between the chip collecting device and the air intake pipe, and is used to prevent the chips from entering the low-pressure air source;

[0029] The control system is used to receive external signals and adjust the gas parameters in the air intake pipe and the air intake pipe.

[0030] In some specific embodiments, a sealing ring is provided between the bottom of the low-pressure buffer chamber and the surface to be processed.

[0031] In some specific embodiments, the high-pressure buffer assembly and the low-pressure buffer assembly are made of wear-resistant and corrosion-resistant materials.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] (1) The device of the present invention controls the direction and intensity of the airflow, dynamically adjusts the airflow parameters, generates a time-varying wind field, and effectively discharges the chips generated during the drilling process away from the working area, thereby improving the drilling efficiency and safety.

[0034] (2) The present invention combines the dual mechanisms of high-pressure blowing and low-pressure suction to effectively solve the problem of low efficiency of traditional chip removal. The introduction of the air guide mechanism achieves precise control of the airflow and improves the pertinence and efficiency of chip removal.

[0035] (3) The device of the present invention has a simple and compact structure, is easy to install and maintain, and is suitable for a variety of processing scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of the structure of embodiment 1 of the present invention.

[0037] Figure 2 Another schematic diagram of the structure of Example 1 of the present invention.

[0038] Figure 3 Schematic diagram of the structure of Example 2 of the present invention.

[0039] Figure 4 Schematic diagram of the gas guide structure in Example 2 of the present invention.

[0040] The following are marked in the figure:

[0041] 1 is the cavity wall, 2 is the air suction pipe, 3 is the air inlet pipe, 4 is the high-pressure buffer chamber, 5 is the low-pressure buffer chamber, 6 is the chip inlet, 7 is the tool inlet channel, 8 is the air guide mechanism, 9 is the surface to be processed, 10 is the chip, 11 is the sealing ring, 12 is the air guide blade, 13 is the air inlet branch pipe, 14 is the power impeller, 15 is the air guide impeller, and 16 is the bearing. DETAILED DESCRIPTION

[0042] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0043] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0044] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0045] In the following embodiments, unless otherwise specified, functional components or structures are conventional components or conventional structures used in the art to achieve corresponding functions.

[0046] Embodiment 1:

[0047] like Figures 1-2 As shown, an auxiliary chip removal device of a hole-making system based on jet control includes: a high-pressure buffer component, a low-pressure buffer component, and an air guide mechanism 8;

[0048] The high-pressure buffer assembly is arranged inside the low-pressure buffer assembly and is used to blow the chips up and suspend them in the air;

[0049] The low-pressure buffer component is wrapped around the outside of the high-pressure buffer component and is used to absorb chips;

[0050] The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a tool inlet channel 7 in the same longitudinal direction for a tool to pass through and perform drilling operations on the working area of ​​the surface to be processed 9;

[0051] The bottom of the low-pressure buffer assembly is in contact with the surface to be processed 9;

[0052] The air guiding mechanism 8 is used to adjust and optimize the airflow direction and speed in the high-pressure buffer assembly and the low-pressure buffer assembly.

[0053] More specifically, in this embodiment:

[0054] The auxiliary chip removal device of the hole-making system based on jet control comprises a high-pressure buffer component, a low-pressure buffer component and an air guide mechanism 8.

[0055] The high-pressure buffer assembly includes a high-pressure buffer chamber 4 and an air inlet pipe 3, wherein the air inlet pipe 3 is connected to the high-pressure buffer chamber 4 and is used to connect a high-pressure gas source to blow high-pressure air into the high-pressure buffer chamber 4, which can blow away the chips generated during the drilling process. The high-pressure buffer chamber 4 is used to guide the airflow entering from the air inlet pipe 3 to the working area. The air inlet pipe 3 can be provided with one or more, and the parameters of the airflow, such as flow rate, flow rate, pressure, etc., can be adjusted manually or automatically.

[0056] The low-pressure buffer component is wrapped around the outside of the high-pressure buffer component and is used to absorb the chips. The low-pressure buffer component includes a low-pressure buffer chamber 5 and an air intake pipe 2, wherein the air intake pipe 2 is connected to the low-pressure buffer chamber 5 and is used to connect a low-pressure gas source to form a negative pressure area, which is used to suck in and discharge the suspended chips to reduce flow loss. The low-pressure buffer chamber 5 is used to guide the airflow from the working area to the air intake pipe 2. The air intake pipe 2 can be provided with one or more, and the parameters of the airflow, such as flow rate, flow, pressure, etc., can be adjusted manually or automatically.

[0057] The high-pressure buffer chamber 4 is located inside, and the low-pressure buffer chamber 5 wraps the high-pressure buffer chamber 4 and is located outside, forming two fixed cavities inside and outside. The cavity walls 1 of the high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 are made of wear-resistant and corrosion-resistant materials. The bottom of the low-pressure buffer chamber 5 is fitted with the surface to be processed 9 through a sealing gasket 11, and can also be fitted by wool felt, brushes, etc., to ensure effective guidance and sealing of the airflow. The high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 are opened in the same longitudinal direction at the central area with a tool entrance channel 7 that penetrates and is used for the tool to pass through the working area of ​​the surface to be processed 9 to perform drilling operations. The chips 10 generated by drilling are located in the area directly below the tool entrance channel 7.

[0058] The air guide mechanism 8 includes a plurality of air guide blades 12 arranged in the low-pressure buffer chamber 5 and used for guiding the flow direction of the airflow. The air guide blades 12 can be connected to the cavity wall 1 of the high-pressure buffer chamber 4. The air guide blades 12 are located above the surface to be processed 9 and around the chips in the working area.

[0059] In addition, it also includes: chip collection device, filtration system, and control system.

[0060] Among them, the chip collection device is connected to the intake pipe 2, which is used to collect and store the inhaled chips; the filtering device is arranged inside the intake pipe 2 or between the chip collection device and the intake pipe 2, which is used to prevent the chips from entering the low-pressure gas source; the control system is used to receive external signals and adjust the gas parameters in the intake pipe 2 and the intake pipe 1.

[0061] In this embodiment, the high-pressure airflow enters the high-pressure buffer chamber 4 through the air inlet pipe 3, is aimed at the drilling area, and uses the power of the airflow to blow up the generated chips 10 and suspend them in the air to prevent them from directly adhering to the tool or workpiece surface. At the same time, the low-pressure air source generates negative pressure in the low-pressure buffer chamber 5 through the air intake pipe 2, sucks the suspended chips 10 and transports them to the chip collection device, so as to achieve continuous and efficient removal of the chips 10. The air guide mechanism 8 designed based on fluid mechanics can adjust the direction and speed of the airflow, optimize the wind field state, significantly improve the chip removal efficiency, and reduce energy consumption.

[0062] During the hole making process, the bottom of the auxiliary chip removal device of the hole making system based on jet control in this embodiment serves as the chip inlet 6, which is correspondingly attached to the surface to be processed 9. The hole making tool enters through the tool inlet channel 7 to make holes in the surface to be processed 9. The high-pressure airflow enters the device from the air inlet pipe 3, passes through the high-pressure buffer chamber 4 to reach the designated area to blow up the chips 10, and then the chips 10 are discharged through the low-pressure buffer chamber 5 by the negative pressure generated by the suction pipe 2.

[0063] Embodiment 2:

[0064] like Figures 3-4 As shown, an auxiliary chip removal device of a hole-making system based on jet control includes: a high-pressure buffer component, a low-pressure buffer component, and an air guide mechanism 8;

[0065] The high-pressure buffer assembly is arranged inside the low-pressure buffer assembly and is used to blow the chips up and suspend them in the air;

[0066] The low-pressure buffer component is wrapped around the outside of the high-pressure buffer component and is used to absorb chips;

[0067] The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a tool inlet channel 7 in the same longitudinal direction for a tool to pass through and perform drilling operations on the working area of ​​the surface to be processed 9;

[0068] The bottom of the low-pressure buffer assembly is in contact with the surface to be processed 9;

[0069] The air guiding mechanism 8 is used to adjust and optimize the airflow direction and speed in the high-pressure buffer assembly and the low-pressure buffer assembly.

[0070] More specifically, in this embodiment:

[0071] The auxiliary chip removal device of the hole-making system based on jet control comprises a high-pressure buffer component, a low-pressure buffer component and an air guide mechanism 8.

[0072] The high-pressure buffer assembly includes a high-pressure buffer chamber 4 and an air inlet pipe 3, wherein the air inlet pipe 3 is connected to the high-pressure buffer chamber 4 and is used to connect a high-pressure gas source to blow high-pressure air into the high-pressure buffer chamber 4, which can blow away the chips generated during the drilling process. The high-pressure buffer chamber 4 is used to guide the airflow entering from the air inlet pipe 3 to the working area. The air inlet pipe 3 can be provided with one or more, and the parameters of the airflow, such as flow rate, flow rate, pressure, etc., can be adjusted manually or automatically.

[0073] The low-pressure buffer component is wrapped around the outside of the high-pressure buffer component and is used to absorb the chips. The low-pressure buffer component includes a low-pressure buffer chamber 5 and an air intake pipe 2, wherein the air intake pipe 2 is connected to the low-pressure buffer chamber 5 and is used to connect a low-pressure gas source to form a negative pressure area, which is used to suck in and discharge the suspended chips to reduce flow loss. The low-pressure buffer chamber 5 is used to guide the airflow from the working area to the air intake pipe 2. The air intake pipe 2 can be provided with one or more, and the parameters of the airflow, such as flow rate, flow, pressure, etc., can be adjusted manually or automatically.

[0074] The high-pressure buffer chamber 4 is located inside, and the low-pressure buffer chamber 5 wraps the high-pressure buffer chamber 4 and is located outside, forming two fixed cavities inside and outside. The cavity walls 1 of the high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 are made of wear-resistant and corrosion-resistant materials. The bottom of the low-pressure buffer chamber 5 is fitted with the surface to be processed 9 through a sealing gasket 11, and can also be fitted by wool felt, brushes, etc., to ensure effective guidance and sealing of the airflow. The high-pressure buffer chamber 4 and the low-pressure buffer chamber 5 are opened in the same longitudinal direction at the central area with a tool entrance channel 7 that penetrates and is used for the tool to pass through the working area of ​​the surface to be processed 9 to perform drilling operations. The chips 10 generated by drilling are located in the area directly below the tool entrance channel 7.

[0075] The air guide mechanism 8 includes an air intake branch pipe 13 , a power impeller 14 , and an air guide impeller 15 .

[0076] The air inlet branch pipe 13 is arranged on the cavity wall 1 of the low-pressure buffer cavity 5 and is connected to the high-pressure gas source.

[0077] The power impeller 14 can be connected to the cavity wall 1 of the low-pressure buffer cavity 5 through a bearing 16, and can rotate relative to the cavity wall 1. There is a blade structure on it. The power impeller 14 is aligned with the intake branch pipe 13, and the high-pressure airflow in the intake branch pipe 13 drives the power impeller 14 to rotate.

[0078] The lower part of the power impeller 14 is connected to the air guide impeller 15, and drives the air guide impeller 15 to rotate. The connection method between the two can be gluing, welding, integral molding, etc. The power impeller 14 and the air guide impeller 15 are provided with holes that penetrate the tool inlet channel 7, so that the tool can work after passing through and introduce the airflow into the working area. The air guide blades 12 include a plurality of air guide blades 12 arranged around the holes, and are located above the surface to be processed 9 and around the chips in the working area, and are used to change the airflow direction in the working area. Through the synergistic effect of the above-mentioned mechanisms, a changing rotating flow field is generated in the working area.

[0079] In addition, it also includes: a chip collection device, a filtering system, and a control system, wherein the chip collection device is connected to the suction pipe 2 to collect and store the sucked chips;

[0080] The filter device is arranged inside the air intake pipe 2 or between the chip collecting device and the air intake pipe 2 to prevent the chips from entering the low-pressure air source;

[0081] The control system is used to receive external signals and adjust the gas parameters in the intake pipe 2 and the intake pipe 1.

[0082] In this embodiment, the high-pressure airflow enters the high-pressure buffer chamber 4 through the air inlet pipe 3, is aimed at the drilling area, and uses the power of the airflow to blow up the generated chips 10 and suspend them in the air to prevent them from directly adhering to the tool or workpiece surface. At the same time, the low-pressure air source generates negative pressure in the low-pressure buffer chamber 5 through the air intake pipe 2, sucks the suspended chips 10 and transports them to the chip collection device, so as to achieve continuous and efficient removal of the chips 10. The air guide mechanism 8 designed based on fluid mechanics can adjust the direction and speed of the airflow, optimize the wind field state, significantly improve the chip removal efficiency, and reduce energy consumption.

[0083] During the hole making process, the bottom of the auxiliary chip removal device of the hole making system based on jet control in this embodiment serves as the chip inlet 6, which is correspondingly attached to the surface to be processed 9. The hole making tool enters through the tool inlet channel 7 to make holes in the surface to be processed 9. The high-pressure airflow enters the device from the air inlet pipe 3, passes through the high-pressure buffer chamber 4 to reach the designated area to blow up the chips 10, and then the chips 10 are discharged through the low-pressure buffer chamber 5 by the negative pressure generated by the suction pipe 2.

[0084] The above description of the embodiments is to facilitate the understanding and use of the invention by those skilled in the art. It is obvious that those skilled in the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the present invention is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the present invention should be within the scope of protection of the present invention.

Claims

1. A jet-controlled hole-making system auxiliary chip removal device, characterized in that: include: A high-pressure buffer component, a low-pressure buffer component, and an air guide mechanism (8); The high-pressure buffer assembly is arranged inside the low-pressure buffer assembly and is used to blow the chips (10) up and suspend them in the air; The low-pressure buffer component is wrapped around the outside of the high-pressure buffer component and is used to absorb chips (10); The high-pressure buffer assembly and the low-pressure buffer assembly are provided with a tool inlet channel (7) which is through and used for the tool to pass through the working area of ​​the processing surface (9) to perform drilling operations; The bottom of the low-pressure buffer assembly is in contact with the surface to be processed (9); The air guiding mechanism (8) is used to adjust and optimize the airflow direction and speed in the high-pressure buffer assembly and the low-pressure buffer assembly.

2. The auxiliary chip removal device of the hole making system according to claim 1, characterized in that: The high-pressure buffer assembly comprises a high-pressure buffer chamber (4), an air intake pipe (3), The air inlet pipe (3) is in communication with the high-pressure buffer chamber (4) and is used to connect to a high-pressure air source; The high-pressure buffer chamber (4) is used to guide the airflow entering from the air inlet pipe (3) to reach the working area.

3. The auxiliary chip removal device of the hole making system according to claim 2, characterized in that: The air inlet pipe (3) is provided with one or more.

4. The auxiliary chip removal device of the hole making system according to claim 1, characterized in that: The low-pressure buffer assembly comprises a low-pressure buffer chamber (5), an air intake pipe (2), The air intake pipe (2) is in communication with the low-pressure buffer chamber (5) and is used to connect to a low-pressure air source; The low-pressure buffer chamber (5) is used to guide the air flow from the working area to the air intake pipe (2).

5. The auxiliary chip removal device of the hole making system according to claim 4, characterized in that: The air intake pipe (2) is provided with one or more.

6. The auxiliary chip removal device of the hole making system according to claim 4, characterized in that: The air guide mechanism (8) comprises a plurality of air guide blades (12) arranged in the low-pressure buffer chamber (5) and used for guiding the flow direction of the airflow; the air guide blades (12) are located above the surface to be processed (9) and around the chips in the working area.

7. The auxiliary chip removal device of the hole making system according to claim 4, characterized in that: The air guide mechanism (8) comprises an air intake branch pipe (13), a power impeller (14), and an air guide impeller (15). The air intake branch pipe (13) is used to be connected to a high-pressure air source; The power impeller (14) is arranged in the low-pressure buffer chamber (5), aligned with the air intake branch pipe (13), and connected to the air guide impeller (15); The power impeller (14) and the air guide impeller (15) are provided with holes that penetrate the tool inlet channel (7); the air guide blades (12) include a plurality of air guide blades (12) arranged around the holes and located above the surface to be processed (9) and around the chips (10) in the working area, so as to change the air flow direction in the working area.

8. The auxiliary chip removal device of the hole making system according to claim 4, characterized in that: Also includes: Chip collection device, filtration system, control system, The chip collection device is connected to the air intake pipe (2) and is used to collect and store the sucked chips; The filtering device is arranged inside the air intake pipe (2) or between the chip collecting device and the air intake pipe (2) and is used to prevent the chips from entering the low-pressure air source; The control system is used to receive external signals and adjust gas parameters in the air intake pipe (2) and the air intake pipe (1).

9. The auxiliary chip removal device of the hole making system according to claim 4, characterized in that: A sealing ring (11) is provided between the bottom of the low-pressure buffer chamber (5) and the surface to be processed (9).

10. The auxiliary chip removal device of the hole making system according to claim 1, characterized in that: The high-pressure buffer component and the low-pressure buffer component are made of wear-resistant and corrosion-resistant materials.

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