Silicon rod slotting device, grinding system, silicon rod, battery piece and photovoltaic module

Abstract

The invention discloses a silicon rod grooving device, a grinding system, a silicon rod, a battery piece and a photovoltaic module, relates to the technical field of silicon wafer manufacturing, and aims to solve the problems of poor grooving quality and low grooving efficiency of the silicon rod. The silicon rod grooving device comprises a grooving grinding wheel assembly which comprises a first support, a grinding wheel assembly and a first driving part. The grinding wheel assembly is arranged on the first support and comprises a plurality of grinding wheels arranged in the axial direction, and the grinding wheels are used for grooving the surface of the silicon rod; the first driving part is arranged on the first support, mechanically connected to the grinding wheel assembly and used for driving the grinding wheel assembly to rotate in the axial direction. Due to the fact that the two ends of the grinding wheel assembly are supported through the first supports, the rigidity of the grinding wheel assembly in the working process is improved, the grinding wheels on the grinding wheel assembly are not prone to shaking, the silicon rod grooving quality is improved, the multiple grinding wheels are arranged on the grinding wheel assembly, multiple grooves can be synchronously formed in the surface of a silicon rod at a time, and the grooving efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer manufacturing, and in particular to a silicon rod grooving device, a grinding system, a silicon rod, a battery sheet and a photovoltaic module. Background Art

[0002] In order to improve the efficiency of photovoltaic modules, some photovoltaic modules currently reduce or even eliminate the spacing between solar cells in the photovoltaic modules. Specifically, by grooving the edge of the silicon wafer, when the solar cells formed by the silicon wafer are interconnected, the conductive interconnect passes through the groove, and the two ends of the conductive interconnect are respectively connected to the front and back components corresponding to the adjacent solar cells to form a battery string. Since the conductive interconnect is located in the groove, there is no gap or a small gap at the overlap of the two solar cells, that is, the overlapping position, thereby solving the problem of hidden cracks or breakage of solar cells in the lamination process of photovoltaic modules.

[0003] The existing method of slotting the edge of a silicon wafer is to slot the surface of a square silicon rod perpendicular to the slicing direction using a high-precision vertical machining center, and then slice the silicon rod to obtain a silicon wafer with slots. Figure 1 As shown, the grinding wheel is installed at one end of the tool handle, and the tool handle and the grinding wheel are driven to rotate by the high-speed rotation of the main shaft, and the surface of the silicon rod is grooved by the grinding wheel to obtain a grooved silicon rod, as shown in FIG. Figure 2 The existing silicon rod slotting method has the following disadvantages: due to the use of an extended tool handle, the grinding wheel is not rigid enough, and the grinding wheel shakes during the grinding slotting process, thus affecting the slotting quality; considering the grinding rigidity of the grinding wheel, conventional slotting can only process one slot at a time, which is inefficient. Summary of the invention

[0004] The object of the present invention is to provide a silicon rod grooving device, a grinding system, a silicon rod, a battery cell and a photovoltaic module to improve the grooving efficiency and quality.

[0005] In a first aspect, the present invention provides a silicon rod slotting device, comprising a slotting grinding wheel assembly, wherein the slotting grinding wheel assembly comprises a first bracket, a grinding wheel assembly and a first driving component;

[0006] The grinding wheel assembly is arranged on the first bracket, and the grinding wheel assembly includes a plurality of grinding wheels arranged along the axial direction, and the grinding wheels are used to groove the surface of the silicon rod;

[0007] The first driving component is arranged on the first bracket and mechanically connected to the grinding wheel assembly, and is used for driving the plurality of grinding wheels to rotate axially.

[0008] When adopting the above technical solution, the slotting grinding wheel assembly adopts a grinding wheel assembly whose two ends are both arranged on the first bracket, and the grinding wheel assembly includes multiple grinding wheels arranged along the axial direction. Since both ends of the grinding wheel assembly are supported by the first bracket, the rigidity of the grinding wheel assembly during operation is improved, and the grinding wheel thereon is not prone to shaking, thereby improving the quality of silicon rod slotting. Multiple grinding wheels are arranged on the grinding wheel assembly, which can simultaneously open multiple grooves on the surface of the silicon rod at one time, thereby improving the efficiency of silicon rod slotting.

[0009] In some possible implementations, the first bracket includes a fixed frame and a rotating frame, the rotating frame is rotatably connected to the fixed frame, the grinding wheel assembly is arranged on the rotating frame, and the silicon rod grooving device also includes a second driving component, the second driving component is arranged on the fixed frame, and is used to drive the rotating frame to rotate relative to the fixed frame.

[0010] When the above technical solution is adopted, the second driving component can be used to drive the rotating frame to rotate relative to the fixed frame, and then the rotating frame drives the grinding wheel assembly thereon to approach and move away from the surface of the silicon rod, so that the grinding wheel assembly can make groove contact and disengagement with the surface of the silicon rod, which is easy to operate.

[0011] In some possible implementations, the slotted grinding wheel assembly includes a first grinding wheel group and a second grinding wheel group, the first grinding wheel group and the second grinding wheel group are both arranged axially and are respectively located at both ends of the rotating frame; the first driving component includes at least one first driving member, and the first grinding wheel group and the second grinding wheel group are respectively connected to at least one first driving member.

[0012] When the above technical solution is adopted, the first grinding wheel group and the second grinding wheel group are respectively located at the two ends of the rotating frame, and the rotating frame is driven by the second driving component to rotate relative to the fixed frame. Through the rotation of the rotating frame, one of the first grinding wheel group and the second grinding wheel group on the rotating frame is contacted with the surface of the silicon rod to make grooves. Since the first grinding wheel group is used for rough grooving of the silicon rod surface and the second grinding wheel group is used for fine grooving of the silicon rod surface, the switching between rough grooving and fine grooving is realized by rotating the rotating frame relative to the fixed frame. By setting two grinding wheel assemblies that can switch between rough grooving and fine grooving at the same workstation, the structure is compact and the space occupation is reduced.

[0013] In some possible implementations, there are two slotting grinding wheel assemblies, which are arranged opposite to each other and used to slot two opposite sides of the silicon rod. The two slotting grinding wheel assemblies arranged opposite to each other can slot two opposite sides of the silicon rod at the same time, thereby improving the slotting efficiency.

[0014] In a second aspect, the present invention further provides a grinding system, comprising a frame and a grinding assembly, the grinding assembly being arranged at a grinding station of the frame, and also comprising a silicon rod grooving device as described in any of the above items, the silicon rod grooving device being arranged at a grooving station of the frame, and the grinding station and the grooving station being arranged sequentially on the frame.

[0015] When the above technical solution is adopted, since the grinding system adopts the silicon rod grooving device of the first aspect, it has the same beneficial effects as the first aspect, and reference can be made to the description of the first aspect. In addition, the grinding system integrates the grinding component and the silicon rod grooving device together. On the basis of completing the surface grinding of the silicon rod by the grinding wheel, the surface of the silicon rod can be further grooved in the same grinding system. The grooved grinding wheel component can be integrated on the original grinding system, and there is no need to set up an additional independent grooving device, thereby reducing equipment and operating costs.

[0016] In some possible implementations, the grinding assembly includes a second bracket, a grinding wheel and a third driving component, the third driving component is arranged on the second bracket, the grinding wheel is connected to the driving end of the third driving component, the third driving component is used to drive the grinding wheel to rotate, and the grinding wheel is used to grind the surface of the silicon rod.

[0017] In some possible implementations, the grinding wheel includes a first grinding wheel and a second grinding wheel, and the first grinding wheel and the second grinding wheel are both dynamically connected to the driving end of the third driving component. In this way, the surface of the silicon rod is polished twice by the first grinding wheel and the second grinding wheel respectively, thereby improving the polishing quality.

[0018] In some possible implementations, the first grinding wheel is an inner grinding wheel, the second grinding wheel is an outer grinding wheel, the inner grinding wheel and the outer grinding wheel are coaxially nested, and the inner grinding wheel and the outer grinding wheel can move relative to each other along the axial direction of the grinding wheel; the grinding assembly also includes a telescopic mechanism, which acts on the inner grinding wheel to drive the inner grinding wheel to telescope relative to the outer grinding wheel.

[0019] When the above technical solution is adopted, the inner grinding wheel and the outer grinding wheel are coaxially nested in a grinding station, and the inner grinding wheel is driven to extend and retract relative to the outer grinding wheel by a telescopic mechanism. When the inner grinding wheel is extended, it contacts the surface of the silicon rod for a primary grinding, and when the inner grinding wheel is retracted to the inside of the end face of the outer grinding wheel, the outer grinding wheel contacts the surface of the silicon rod for a secondary grinding. The grinding assembly has a compact structure and high switching efficiency.

[0020] In some possible implementations, the grinding system further includes a feeding mechanism, which is used to drive the silicon rod slotting device and the grinding assembly to move closer to and away from the silicon rod. By driving the silicon rod slotting device and the grinding assembly as a whole closer to and away from the silicon rod surface through the feeding mechanism, the distance between the grinding wheel assembly and the grinding wheel and the silicon rod can be adjusted within a larger range, and the moving distance of the feeding mechanism can be adjusted according to different silicon rod sizes to meet the grinding and slotting processing of silicon rods of different sizes.

[0021] In some possible implementations, there are two polishing assemblies, which are arranged opposite to each other and are used to polish two opposite sides of the silicon rod. The two oppositely arranged polishing assemblies can polish two opposite sides of the silicon rod at the same time, thereby improving the polishing efficiency.

[0022] In a third aspect, the present invention further provides a silicon rod prepared by the above-mentioned grinding system, wherein at least one surface of the silicon rod is provided with a plurality of grooves parallel to each other, and the parallelism of the plurality of grooves is greater than 90%.

[0023] Since there are multiple grooves on the silicon rod, and the grooves will be affected by the processing accuracy to varying degrees during the processing, resulting in a certain offset of the grooves finally processed, and the multiple grooves are not parallel. In the grinding system of the present application, the grinding station and the grooving station are arranged in sequence along the transmission direction of the silicon rod, and the silicon rod can be polished and grooved at the same time. The silicon rod with grooves can be obtained by one processing, and there is no need to transfer it to the grooving device after grinding, thereby ensuring that the grooves can be processed in the preset direction during the processing, and the parallelism of the processed grooves is high and the consistency of the groove shape is good; the overall accuracy of subsequent manufacturing using the silicon wafer will also be greatly improved.

[0024] It should be noted that the parallelism of the grooves refers to the degree of parallelism between multiple grooves. The higher the parallelism, the better the shape consistency of the final grooves, which meets the needs of subsequent manufacturing.

[0025] In a fourth aspect, the present invention further provides a solar cell, comprising a silicon wafer, wherein the silicon wafer is prepared by slicing a silicon rod prepared as described above, and the edge of the silicon wafer and / or the solar cell has a notch opposite to the groove.

[0026] In a fifth aspect, the present invention further provides a photovoltaic module, comprising a plurality of cells interconnected by conductive interconnects, the cell being the cell as described above, the conductive interconnect passing through a recess of the cell, and the two ends of the conductive interconnect being respectively connected to the front and back components of adjacent cell.

[0027] Since the conductive interconnect is located in the notch, the gap between the two cells at the overlap, that is, the overlapping position, is small, thereby solving the problem of hidden cracks or breakage of solar cells in the photovoltaic module lamination process. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0029] Figure 1 It is a structural schematic diagram of a grinding wheel in the prior art;

[0030] Figure 2 It is a schematic diagram of the structure of slotting on silicon rod;

[0031] Figure 3 A schematic structural diagram of a slotting grinding wheel assembly of a silicon rod slotting device provided in an embodiment of the present invention;

[0032] Figure 4 for Figure 3 A schematic structural diagram of a grinding wheel assembly of a slotted grinding wheel assembly;

[0033] Figure 5 A schematic structural diagram of a grinding system provided by an embodiment of the present invention;

[0034] Figure 6 A schematic structural diagram of a grinding assembly of a grinding system provided by an embodiment of the present invention;

[0035] Figure 7 A schematic structural diagram of a silicon wafer provided in an embodiment of the present invention.

[0036] Figure numerals: 01 is a silicon rod, 011 is a groove, 1 is a slotted grinding wheel assembly, 11 is a grinding wheel assembly, 111 is a grinding wheel, 112 is a first grinding wheel group, 113 is a second grinding wheel group, 12 is a first bracket, 121 is a fixed frame, 122 is a rotating frame, 13 is a first driving component, 14 is a second driving component, 15 is a first feeding mechanism, 151 is a first slide, 152 is a first slider, 153 is a first guide rail, 2 is a grinding assembly, 21 is a second bracket, 22 is a grinding wheel, 221 is an outer grinding wheel, 222 is an inner grinding wheel, 23 is a third driving component, 24 is a second feeding mechanism, 241 is a second slide, 242 is a second slider, 243 is a second guide rail, 3 is a frame, and 5 is a recess. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0040] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] like Figure 2 As shown, the embodiment of the present invention provides a silicon rod, which is prepared by the grinding system in the embodiment of the present application. The grinding system is described below. At least one surface of the silicon rod 01 is provided with a plurality of mutually parallel grooves 011, and the parallelism of the plurality of grooves 011 is greater than 90%.

[0043] Since the silicon rod 01 has multiple grooves 011, and the grooves 011 will be affected by the processing accuracy to varying degrees during the processing, resulting in a certain offset of the grooves 011 finally processed, and the multiple grooves 011 are not parallel. In the grinding system of the present application, the grinding station and the grooving station are arranged in sequence along the transmission direction of the silicon rod 01, and the silicon rod 01 can be polished and grooved at the same time. The silicon rod 01 with the grooves 011 can be obtained in one processing, and there is no need to transfer to the grooving device after grinding, thereby ensuring that the grooves 011 can follow the preset direction during the processing, and the processed grooves 011 have good parallelism and high consistency of the groove shape.

[0044] like Figure 3-Figure 5As shown, an embodiment of the present invention provides a silicon rod slotting device, including a frame 3 and a slotting grinding wheel assembly 1, a slotting station is arranged on the frame 3, the slotting grinding wheel assembly 1 is located on the slotting station, the slotting grinding wheel assembly 1 includes a first bracket 12, a grinding wheel assembly 11 and a first driving component 13, wherein the grinding wheel assembly 11 is arranged on the first bracket 12, the grinding wheel assembly 11 includes a plurality of grinding wheels 111 arranged along the axial direction, and the grinding wheel 111 is used to slot the surface of the silicon rod to obtain a groove; the first driving component 13 is arranged on the first bracket 12 and mechanically connected to the grinding wheel assembly 11, and is used to drive the plurality of grinding wheels 111 to rotate around the axial direction.

[0045] In the present application, both ends of the grinding wheel assembly 11 are connected to the first bracket 12, and the two ends of the grinding wheel assembly 11 are supported by the first bracket 12. The grinding wheel assembly 11 can rotate around its own rotation axis. The grinding wheel assembly 11 can be a rod-shaped grinding wheel, which has a rod body and a plurality of grinding wheels 111 arranged on the outer peripheral surface of the rod body. The plurality of grinding wheels 111 are arranged at intervals along the axial direction of the grinding wheel assembly 11, and the axis of the grinding wheel 111 is colinear with the axis of the rod body. The outer ring of the grinding wheel 111 radially protrudes from the rod body, and the grinding wheel 111 and the rod body are an integral structure. The outer ring of each grinding wheel 111 is used to groove the surface of the silicon rod.

[0046] The first driving component 13 is arranged on the first bracket 12 and mechanically connected to the grinding wheel assembly 11, and is used for driving the grinding wheel assembly 11 to rotate around its own rotation axis. The first driving component 13 can be a motor or a motor including a reducer. The driving end of the first driving component 13 can be directly connected to the end of the grinding wheel assembly 11, and can also be connected through a transmission component, such as a gear transmission component, a chain transmission component or a belt transmission component.

[0047] When the silicon rod 01 is working, when the silicon rod 01 moves to the grooving station in a direction perpendicular to its slicing direction, multiple grinding wheels 111 of the grinding wheel assembly 11 simultaneously contact the surface of the silicon rod 01 perpendicular to the slicing direction. As the silicon rod 01 continues to move, the grinding wheel assembly 11 is driven to rotate by the first driving component 13, so that the grinding wheel 111 rotates and grooves on the surface of the silicon rod 01, thereby obtaining multiple grooves 011 on the surface of the silicon rod.

[0048] In the silicon rod grooving device, since both ends of the grinding wheel assembly 11 are rotatably supported by the first bracket 12, the rigidity of the grinding wheel assembly 11 during operation is improved, and the grinding wheel 111 thereon is not prone to shaking, thereby improving the quality of silicon rod grooving. A plurality of grinding wheels 111 are arranged on the grinding wheel assembly 11, and a plurality of grooves 011 can be simultaneously opened on the surface of the silicon rod 01 at one time, thereby improving the efficiency of silicon rod grooving.

[0049] It should be noted that, in order to facilitate the slotting of the silicon rod 01, the rotation axis of the grinding wheel assembly 11 can be arranged in the vertical direction, and the driving end of the first driving component 13 is connected to the upper end and / or the lower end of the grinding wheel assembly 11. When connected to the upper end power, it is convenient for installation and maintenance, and the structure is compact. The slotted grinding wheel assembly 1 is located on the left and / or right side of the square silicon rod, and the grinding wheel assembly 11 can groove the left or right surface of the square silicon rod. Of course, according to the placement form of the silicon rod 01 and the arrangement form of the silicon rod conveying mechanism, the direction of the rotation axis of the grinding wheel assembly 11 is determined, so that the direction of the rotation axis of the grinding wheel assembly 11 is parallel to the surface to be slotted and perpendicular to the moving direction of the silicon rod. For example, the rotation axis of the grinding wheel assembly 11 can also be arranged horizontally, and the grinding wheel assembly 11 is used to slot the upper surface of the silicon rod 01.

[0050] like Figure 3 As shown, in some embodiments, the first bracket 12 includes a fixed frame 121 and a rotating frame 122, the rotating frame 122 is rotatably connected to the fixed frame 121, the silicon rod slotting device also includes a second driving component 14, the grinding wheel assembly 11 is arranged on the rotating frame 122, specifically, the fixed frame 121 has two mounting plates, the rotating frame 122 is located between the two mounting plates, both ends of the grinding wheel assembly 11 are rotatably connected to the rotating frame 122, and the two ends of the grinding wheel assembly 11 are supported by the rotating frame 122, so that the rotation axis of the rotating frame 122 is parallel to the rotation axis of the grinding wheel assembly 11; the second driving component 14 is arranged on the fixed frame 121, specifically, it can be arranged on the mounting plate of the fixed frame 121, the driving end of the second driving component 14 is connected to the rotating frame 122 by power, and is used to drive the rotating frame 122 to rotate relative to the fixed frame 121. For example, when the rotation axis of the grinding wheel assembly 11 is arranged in the vertical direction, the rotation axis of the rotating frame 122 is also arranged in the vertical direction, and the second driving component 14 drives the rotating frame 122 to rotate horizontally. The second driving component 14 may be a motor or a motor with a reducer. The driving end of the second driving component 14 may be directly connected to the rotating frame 122 or connected to the rotating shaft of the rotating frame 122 through a transmission component.

[0051] During operation, the second driving component 14 can be used to drive the rotating frame 122 to rotate relative to the fixed frame 121, and then the rotating frame 122 drives the grinding wheel assembly 11 thereon to approach and move away from the surface of the silicon rod 01, so that the grinding wheel assembly 11 can make groove contact and break contact with the surface of the silicon rod 01, which is easy to operate.

[0052] Of course, the first driving component and the second driving component can also be arranged on the same bracket, and the first driving component and the second driving component respectively drive the grinding wheel assembly to rotate and drive the grinding wheel assembly to swing.

[0053] like Figure 3As shown, further, in some embodiments, the slotted grinding wheel assembly 1 includes a first grinding wheel group 112 and a second grinding wheel group 113, the rotation axes of the first grinding wheel group 112 and the second grinding wheel group 113 are parallel, and are both arranged along the axial direction of the grinding wheel assembly 11 described above, and are located at both ends of the rotating frame 122, the first driving component 13 includes at least one first driving member, and the first grinding wheel group 112 and the second grinding wheel group 113 are respectively connected to at least one first driving member.

[0054] Specifically, both ends of the first grinding wheel group 112 and the second grinding wheel group 113 are rotatably connected to the rotating frame 122. The rotating frame 122 can be an I-shaped structure, including a top plate, a bottom plate and two parallel webs in the middle. The rotation axis of the rotating frame 122 is located at the middle web position of the rotating frame 122. The first grinding wheel group 112 and the second grinding wheel group 113 are located between the top plate and the bottom plate, and the two ends are rotatably connected to the top plate and the bottom plate respectively. The first grinding wheel group 112 and the second grinding wheel group 113 are respectively located at the two ends of the rotating frame 122. The number of grinding wheels 111 on the first grinding wheel group 112 is equal to the number of grinding wheels 111 on the second grinding wheel group 113. And the positions correspond one to one, the grinding wheels 111 on the first grinding wheel group 112 and the second grinding wheel group 113 can both be coarse grinding wheels or fine grinding wheels; or, the grinding wheel 111 on the first grinding wheel group 112 can be a coarse grinding wheel for coarse grooving the surface of the silicon rod 01, and the grinding wheel 111 on the second grinding wheel group 113 can be a fine grinding wheel for fine grooving the surface of the silicon rod 01; the first grinding wheel group 112 and the second grinding wheel group 113 are each correspondingly connected to at least one first driving member, that is, the first grinding wheel group is connected to at least one first driving member, and the second grinding wheel group 113 is connected to at least one first driving member, so that the grinding wheels on each grinding wheel group can grind the silicon rod according to specific needs.

[0055] When the silicon rod grooving device is working, the second driving component 14 drives the rotating frame 122 to rotate along the first direction, so that the rotating frame 122 drives the first grinding wheel group 112 to approach the surface of the silicon rod to perform a groove first, and then the second driving component 14 drives the rotating frame 122 to rotate in the direction opposite to the first direction, so that the rotating frame 122 drives the first grinding wheel group 112 to break away from the contact with the surface of the silicon rod, and at the same time drives the second grinding wheel group 113 to approach the surface of the silicon rod to perform a second groove.

[0056] When the above technical solution is adopted, the rotating frame 122 is rotated to realize that one of the first grinding wheel group 112 and the second grinding wheel group 113 on the rotating frame 122 contacts the silicon rod surface to perform grooving. Therefore, the rotation of the rotating frame 122 relative to the fixed frame 121 realizes the switching between primary grooving and secondary grooving. When the first grinding wheel group 112 is used for rough grooving of the silicon rod surface and the second grinding wheel group 113 is used for fine grooving of the silicon rod surface, the switching between rough grooving and fine grooving can be realized by rotating the rotating frame 122 relative to the fixed frame 121. By arranging two grinding wheel assemblies 11 capable of switching between primary grooving and secondary grooving at the same workstation, the structure of the grooving grinding wheel assembly 1 is compact and the space occupation is reduced.

[0057] Of course, the first grinding wheel group 112 and the second grinding wheel group 113 can also be respectively set at two different workstations and arranged in sequence along the moving direction of the silicon rod 01 , without the need to switch the primary grooving and the secondary grooving by rotating the rotating frame 122 .

[0058] For example, the first grinding wheel group 112 and the second grinding wheel group 113 are symmetrically arranged relative to the rotation axis of the rotating frame 122, and the rotation radius is the same, so the rotation switching angle is the same, which is convenient for control. Of course, an asymmetrical arrangement can also be used, where the rotation axes of the first grinding wheel group 112, the second grinding wheel group 113 and the rotating frame 122 are not coplanar and are arranged in a triangular shape, as long as the switching of the first grinding wheel group 112 and the second grinding wheel group 113 can be achieved by rotating the rotating frame 122.

[0059] like Figure 5 As shown, in some embodiments, the number of slotted grinding wheel assemblies 1 is two, and the two slotted grinding wheel assemblies 1 are arranged opposite to each other, and are respectively located at two slotting stations on both sides of the silicon rod transmission path on the frame 3, for slotting the two opposite sides of the silicon rod 01. The two sets of slotted grinding wheel assemblies 1 arranged opposite to each other can be used to slot the two opposite sides of the silicon rod 01 at one time, thereby improving the slotting efficiency. Of course, only one set of slotted grinding wheel assemblies 1 can also be provided.

[0060] like Figure 5 and Figure 6 As shown, based on the silicon rod grooving device described in any of the above embodiments, an embodiment of the present invention further provides a grinding system, including a frame, a grinding assembly 2 and the silicon rod grooving device described in any of the above embodiments, a grinding station is arranged on the frame 3, the grinding assembly 2 is arranged at the grinding station of the frame, the silicon rod grooving device is arranged at the grooving station of the frame, and the grinding station and the grooving station are arranged in sequence along the frame.

[0061] During operation, the silicon rod 01 first passes through the grinding station, and the grinding assembly 2 grinds the surface of the square silicon rod to be grooved. It can also grind the edges of the square silicon rod. The grinding of the surface or edges to be grooved can be completed by adjusting the placement posture of the silicon rod during transportation. After grinding, the silicon rod 01 continues to move to the groove station, and the grooved grinding wheel assembly 1 grooves the ground silicon rod surface at the groove station.

[0062] When the above technical solution is adopted, since the grinding system adopts the silicon rod slotting device described in any of the above embodiments, it has the same beneficial effects as any of the above embodiments, and reference can be made to the description of the above embodiments. In addition, the grinding system integrates the silicon rod slotting device and the grinding assembly 2 together. On the basis of completing the silicon rod surface grinding by the grinding wheel 22, the silicon rod surface can be slotted in the same grinding system. The slotted grinding wheel assembly 1 can be integrated into the original grinding system, and other mechanisms in the grinding system, such as the silicon rod conveying mechanism, the silicon rod position detection mechanism, the silicon rod or grinding wheel lifting mechanism, the cooling mechanism, the spraying mechanism, the protective cover mechanism, etc., can be shared. There is no need to set up an additional independent slotting device, which reduces equipment and operating costs.

[0063] For example, Figure 6 As shown, the grinding assembly 2 includes a second bracket 21, a grinding wheel 22 and a third driving component 23. The third driving component 23 is arranged on the second bracket 21. The grinding wheel 22 is connected to the driving end of the third driving component 23. The third driving component 23 is used to drive the grinding wheel 22 to rotate. The grinding wheel 22 is used to grind the surface of the silicon rod 01.

[0064] In some embodiments, the grinding wheel includes a first grinding wheel and a second grinding wheel, and the first grinding wheel and the second grinding wheel are both connected to the driving end of the third driving component. The first grinding wheel and the second grinding wheel can share a third driving component, or the first grinding wheel and the second grinding wheel are each connected to a corresponding third driving component. The first grinding wheel and the second grinding wheel are respectively used for primary grinding and secondary grinding of the silicon rod, thereby improving the grinding quality.

[0065] like Figure 6As shown, exemplarily, the first grinding wheel is the inner grinding wheel 222, and the second grinding wheel is the outer grinding wheel 221. The inner grinding wheel 222 and the outer grinding wheel 221 are coaxially nested and arranged, and the inner grinding wheel 222 and the outer grinding wheel 221 can move relative to each other along the axial direction of the grinding wheel 22. The inner grinding wheel 222 and the outer grinding wheel 221 are both dynamically connected to the driving end of the third driving component 23. One of the inner grinding wheel 222 and the outer grinding wheel 221 is a rough grinding wheel for rough grinding the surface of the silicon rod, and the other is a fine grinding wheel for fine grinding the surface of the silicon rod, or the inner grinding wheel 222 and the outer grinding wheel 221 are both rough grinding wheels or fine grinding wheels; the grinding assembly also includes a telescopic mechanism, which acts on the inner grinding wheel 222 to drive the inner grinding wheel 222 to axially telescope relative to the outer grinding wheel 221. The grinding surfaces of the inner grinding wheel 222 and the outer grinding wheel 221 are planes perpendicular to their rotation axes, and the rotation axes of the inner grinding wheel 222 and the outer grinding wheel 221 are perpendicular to the transmission direction of the silicon rods.

[0066] Specifically, the mounting seat of the inner grinding wheel is coaxially nested with the mounting seat of the outer grinding wheel and connected by a flat key, and can move relative to the axial direction and can rotate together. The mounting seat of the outer grinding wheel is a "mountain" shaped structure, and the mounting seat of the inner grinding wheel is an annular disc structure. The inner ring and outer ring of the annular disc mounting seat of the inner grinding wheel are respectively sealed and sleeved with the middle protrusion and outer edge protrusion of the outer grinding wheel. The end cover is fixed to the middle protrusion of the mounting seat of the outer grinding wheel facing away from the second bracket, and the outer ring protrusion of the inner grinding wheel is sealed and sleeved with the outer ring edge of the end cover. The third driving component can be a motor, and the output shaft of the motor is connected to the mounting seat of the outer grinding wheel to drive the inner grinding wheel and the outer grinding wheel to rotate together. The telescopic mechanism can be a pneumatic telescopic mechanism or a hydraulic telescopic mechanism. Taking the pneumatic telescopic mechanism as an example, the pneumatic telescopic mechanism includes an air pump, a first chamber and a second chamber. The first chamber is located on the side of the inner grinding wheel facing the second bracket, that is, the first chamber is located between the mounting seat of the outer grinding wheel and the mounting seat of the inner grinding wheel. The first chamber is connected to the air pump through the first flow channel, and the first flow channel passes through the second bracket through a rotary joint until it is connected to the first chamber. The second chamber is located on the side of the inner grinding wheel facing away from the second bracket, that is, the second chamber is located between the mounting seat of the inner grinding wheel and the end cover, and the mounting seat of the inner grinding wheel can move axially between the mounting seat of the outer grinding wheel and the end cover. The second chamber is connected to the air pump through the second flow channel, and the second flow channel passes through the second bracket through a rotary joint until it is connected to the second chamber.

[0067] The pneumatic telescopic mechanism can be used to drive the inner grinding wheel to extend and retract relative to the outer grinding wheel. When the inner grinding wheel is in a retracted state, the motor shaft can be used to drive the outer grinding wheel to rotate to grind the silicon rod for the first time; then, the air pump in the pneumatic telescopic mechanism is used to inflate the first chamber through the first flow channel, pushing the mounting seat of the inner grinding wheel to move along the extension direction, and making the inner grinding wheel protrude from the grinding surface of the outer grinding wheel, so that the inner grinding wheel is in an extended state. At this time, the motor shaft can be used to drive the inner grinding wheel to rotate to grind the silicon rod for the second time. Then, the air pump of the pneumatic telescopic mechanism is used to inflate the second chamber through the second flow channel, pushing the mounting seat of the inner grinding wheel to move along the retracted direction, and making the inner grinding wheel recessed in the outer grinding wheel, so that the inner grinding wheel is in a retracted state.

[0068] When the above technical solution is adopted, the inner grinding wheel 222 and the outer grinding wheel 221 are coaxially arranged at a workstation, and the inner grinding wheel 222 is driven to extend and retract relative to the outer grinding wheel 221 by a telescopic mechanism. When the inner grinding wheel 222 is extended, it contacts the surface of the silicon rod for a primary grinding, such as rough grinding. The inner grinding wheel 222 is retracted to the inside of the end face of the outer grinding wheel 221, so that the outer grinding wheel 221 contacts the surface of the silicon rod for a secondary grinding, such as fine grinding. The grinding assembly has a compact structure and high switching efficiency.

[0069] In another example, the first grinding wheel and the second grinding wheel are coaxially arranged, the grinding surfaces of the first grinding wheel and the second grinding wheel are peripheral surfaces, and the rotation axis of the first grinding wheel and the second grinding wheel is parallel to the transmission direction of the silicon rod. The first grinding wheel and the second grinding wheel are respectively slidably arranged on two guide rails, and the first grinding wheel and the second grinding wheel can move relative to each other along the axial direction of the grinding wheel on their respective guide rails. The first grinding wheel and the second grinding wheel are both dynamically connected to the driving end of the third driving component. For example, the first grinding wheel and the second grinding wheel can share a third driving component, and the third driving component is located between the first grinding wheel and the second grinding wheel. When the first grinding wheel moves on the guide rail to the surface to be ground of the silicon rod, the first grinding wheel is dynamically connected to the third driving component, and can be connected by gear transmission. The third driving component drives the first grinding wheel to rotate for one grinding. When the first grinding wheel moves away from the surface to be polished on the guide rail, the first grinding wheel is disconnected from the power connection with the third driving component, the second grinding wheel moves to the surface to be polished on the guide rail, the second grinding wheel is connected to the third driving component by power, and the point driving component drives the second grinding wheel to rotate for secondary grinding. The first grinding wheel and the second grinding wheel can be manually driven to move on the guide rail, or driven to move by a linear driving component. Alternatively, the first grinding wheel and the second grinding wheel can each be connected to a third driving component by power, the first grinding wheel moves on the guide rail together with the corresponding third driving component, and the second grinding wheel moves on the guide rail together with the corresponding third driving component. The first grinding wheel and the second grinding wheel can be polished at the same polishing station, and the structure is compact.

[0070] Of course, the two grinding wheels for grinding the silicon rods may also be respectively arranged at two different grinding stations, for example, arranged in sequence along the conveying direction of the silicon rods.

[0071] In some embodiments, the grinding system further includes a feeding mechanism, which is used to drive the silicon rod grooving device and the grinding assembly to move closer to and away from the silicon rod.

[0072] For example, Figure 3As shown, the grinding system also includes a first feeding mechanism 15, and the first feeding mechanism 15 is connected to the first bracket 12. Specifically, the first feeding mechanism 15 is connected to the fixed frame 121, and the first feeding mechanism 15 is used to drive the first bracket 12 to move close to and away from the silicon rod 01. The first feeding mechanism 15 drives the slotted grinding wheel assembly 1 to move closer to and away from the silicon rod surface as a whole, and the distance between the grinding wheel assembly 11 and the silicon rod 01 can be adjusted within a larger range. The moving distance of the first feeding mechanism 15 can be adjusted according to different silicon rod sizes to meet the slotting processing of silicon rods of different sizes. Of course, when the size of the silicon rod is constant and there is no need to adjust the distance between the grinding wheel assembly 11 and the silicon rod surface over a large range, the distance can be adjusted only by rotating the rotating frame 122.

[0073] Specifically, the first feeding mechanism 15 includes a first slide 151, a first slider 152 and a fourth driving component, wherein a first guide rail 153 is arranged on the first slide 151, and the guiding direction of the first guide rail 153 intersects with the conveying direction of the silicon rod 01 and can be perpendicular to each other. The number of the first guide rails 153 can be one, two, three or more, as long as they can guide stably; the first slider 152 is arranged on the first bracket 12, specifically, it can be arranged at the bottom of the fixed frame 121, and the first slider 152 is slidably matched with the first guide rail 153; the fourth driving component is arranged on the first slide 151, and the driving end of the fourth driving component is connected to the first bracket 12, specifically connected to the fixed frame 121, for driving the first bracket 12 to move back and forth linearly relative to the first slide 151. The fourth driving component can be a component that can output linear motion, such as an electric cylinder, a pneumatic cylinder or a hydraulic cylinder.

[0074] The first feeding mechanism 15 realizes the linear movement cooperation between the first bracket 12 and the first slide 151 through the sliding cooperation between the first slider 152 and the first guide rail 153, thereby realizing the approach and distance of the grinding wheel assembly 11 relative to the silicon rod 01. The first feeding mechanism 15 has a simple structure and moves smoothly, and can ensure the quality of the slotting.

[0075] For example, Figure 6 As shown, the grinding system also includes a second feeding mechanism 24, which is connected to the second bracket 21, and is used to drive the second bracket 21 to move back and forth to approach and move away from the silicon rod. The second feeding mechanism 24 drives the grinding assembly 2 as a whole to approach and move away from the silicon rod surface, and the distance between the grinding wheel 22 and the silicon rod can be adjusted within a larger range. The moving distance of the second feeding mechanism 24 can be adjusted according to different silicon rod sizes to meet the grinding processing of silicon rods of different sizes.

[0076] Specifically, the second feeding mechanism 24 has a similar structure to the first feeding mechanism 15. The second feeding mechanism 24 includes a second slide 241, a second slider 242 and a fifth driving component, wherein a second guide rail 243 is provided on the second slide 241, and the guiding direction of the second guide rail 243 intersects with the conveying direction of the silicon rod and can be perpendicular to each other. The number of the second guide rails 243 can be one, two, three or more, as long as they can guide stably; the second slider 242 is provided on the second bracket 21, and the second slider 242 and the second guide rail 243 are slidably matched; the fifth driving component is provided on the second slide 241, and the driving end of the fifth driving component is connected to the second bracket 21, and is used to drive the second bracket 21 to move back and forth linearly relative to the second slide 241. The fifth driving component can be a component that can output linear motion, such as an electric cylinder, a pneumatic cylinder or a hydraulic cylinder.

[0077] The second feeding mechanism 24 realizes the linear movement cooperation between the second bracket 21 and the second slide 241 through the sliding cooperation between the second slider 242 and the second guide rail 243, thereby realizing the approach and distance of the grinding wheel 22 relative to the silicon rod. The second feeding mechanism 24 has a simple structure and moves smoothly, which can ensure the quality of grinding.

[0078] like Figure 5 As shown, in some embodiments, there are two polishing assemblies 2, which are arranged opposite to each other and are respectively located at two polishing stations on both sides of the silicon rod transmission path on the frame 3, for polishing the two opposite sides of the silicon rod 01. The two opposite sides of the silicon rod 01 can be polished at the same time by two oppositely arranged polishing assemblies 2, thereby improving the polishing efficiency.

[0079] like Figure 7 The embodiment of the present invention further provides a silicon wafer obtained by slicing a silicon rod prepared by the grinding system in any of the above embodiments, wherein at least one side of the silicon wafer has a plurality of notches 5, and the total offset of the notches 5 is less than 2%.

[0080] Since there are multiple notches 5 on at least one side of the silicon wafer, and the notches 5 will be affected by the processing accuracy to varying degrees during the processing, there will be certain deviations between the processed notches 5, resulting in a certain offset of the final processed notches 5. For example, when processing a rectangular groove on a square silicon rod, the degree of deviation between the position of the groove and the feeding direction of the grinding wheel along the feeding direction of multiple parallel grinding wheels from the starting position of the groove to the depth direction of the groove can characterize the offset of the final groove. For those skilled in the art, for grooves with arc, triangle, trapezoid, etc. shapes, the offset of the groove can be confirmed according to the specific offset position and direction, and the offset is also within the protection scope of the present application, and the present application does not limit this.

[0081] In the grinding system of the present application, the grinding station and the groove opening station are arranged in sequence along the transmission direction of the silicon rod, and the grinding and groove opening of the silicon rod can be realized simultaneously. The silicon rod with grooves can be obtained by one processing, and there is no need to transfer it to the groove opening device after grinding, thereby ensuring that the groove can be processed in the preset direction during the processing, and the total offset of the processed groove is small; the overall accuracy of the subsequent processing using the silicon wafer will also be greatly improved.

[0082] Furthermore, in some embodiments, notches 5 are provided on two opposite sides of the silicon wafer. When the cell sheets prepared by using the silicon wafer are prepared into a cell string, the conductive interconnectors between adjacent cell sheets can be conveniently passed through the notches 5, further reducing the spacing between adjacent cell sheets and reducing the damage of the conductive interconnectors to the cell sheets during lamination.

[0083] Based on the silicon wafer described in any of the above embodiments, an embodiment of the present invention further provides a cell, including a silicon wafer, the silicon wafer being a silicon wafer as described in any of the above embodiments, the edge of the silicon wafer and / or the cell having a notch 5 corresponding to the notch 011, it can be understood that the notch 5 can be set on the edge of any side of the silicon wafer, and the position of the notch 5 corresponds to the position of the notch 011 of the silicon rod 01. When the cell formed by the silicon wafer is interconnected, the conductive interconnect passes through the notch 5, and the two ends of the conductive interconnect are respectively connected to the front and back components corresponding to the adjacent cell to form a cell string. Since the conductive interconnect is located in the notch 5, the gap between the overlapped parts of the two cell, that is, the overlapped position is small, thereby solving the problem of hidden cracks or breakage of the cell in the photovoltaic module lamination process.

[0084] The embodiment of the present invention further provides a photovoltaic module, comprising a plurality of cells interconnected by conductive interconnectors, wherein the cell is the cell described in the above embodiment, the conductive interconnectors pass through the notches of the cell, and the two ends of the conductive interconnectors are respectively connected to the front and back components of adjacent cell. The photovoltaic module has the same beneficial effects as the cell, which will not be described in detail.

[0085] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0086] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A silicon rod slotting device, characterized in that: It includes a slotted grinding wheel assembly, which includes a first bracket, a grinding wheel assembly and a first driving component; The grinding wheel assembly is arranged on the first bracket, and the grinding wheel assembly includes a plurality of grinding wheels arranged along the axial direction, and the grinding wheels are used to groove the surface of the silicon rod; The first driving component is disposed on the first bracket and mechanically connected to the grinding wheel assembly, and is used for driving the plurality of grinding wheels to rotate around the axial direction.

2. The silicon rod slotting device according to claim 1, characterized in that: The first bracket includes a fixed frame and a rotating frame, the rotating frame is rotatably connected to the fixed frame, and the grinding wheel assembly is arranged on the rotating frame; The silicon rod grooving device further includes a second driving component, which is disposed on the fixed frame and is used to drive the rotating frame to rotate relative to the fixed frame.

3. The silicon rod slotting device according to claim 2, characterized in that: The grinding wheel assembly comprises a first grinding wheel group and a second grinding wheel group, wherein the first grinding wheel group and the second grinding wheel group are both arranged along the axial direction and are respectively located at two ends of the rotating frame; The first driving component includes at least one first driving member, and the first grinding wheel group and the second grinding wheel group are respectively connected to a corresponding first driving member.

4. The silicon rod slotting device according to any one of claims 1 to 3, characterized in that: There are two slotting grinding wheel assemblies, which are arranged opposite to each other and used for slotting two opposite sides of the silicon rod.

5. A grinding system, comprising a frame and a grinding assembly, wherein the grinding assembly is arranged at a grinding station of the frame, characterized in that: It also includes the silicon rod grooving device according to any one of claims 1 to 4, wherein the silicon rod grooving device is arranged at a grooving station of the frame, and the grinding station and the grooving station are arranged sequentially on the frame.

6. The grinding system according to claim 5, characterized in that The grinding assembly includes a second bracket, a grinding wheel and a third driving component, wherein the third driving component is arranged on the second bracket, the grinding wheel is connected to the driving end of the third driving component, and the third driving component is used to drive the grinding wheel to rotate, and the grinding wheel is used to grind the surface of the silicon rod.

7. The grinding system according to claim 6, characterized in that The grinding wheel comprises a first grinding wheel and a second grinding wheel, and the first grinding wheel and the second grinding wheel are both dynamically connected to the driving end of the third driving component.

8. The grinding system according to claim 7, characterized in that The first grinding wheel is an inner grinding wheel, and the second grinding wheel is an outer grinding wheel. The inner grinding wheel and the outer grinding wheel are coaxially nested and can move relative to each other along the axial direction of the grinding wheel. The grinding assembly also includes a telescopic mechanism, which acts on the inner grinding wheel to drive the inner grinding wheel to telescope relative to the outer grinding wheel.

9. The grinding system according to claim 5, characterized in that: The grinding system also includes a feeding mechanism, which is used to drive the silicon rod grooving device and the grinding assembly to move closer to and away from the silicon rod.

10. The grinding system according to claim 5, characterized in that There are two grinding assemblies, which are arranged opposite to each other and used for grinding two opposite sides of the silicon rod.

11. A silicon rod, characterized in that: Prepared by the grinding system according to any one of claims 5 to 10, at least one surface of the silicon rod is provided with a plurality of grooves parallel to each other, and the parallelism of the plurality of grooves is greater than 90%.

12. A battery cell, comprising a silicon wafer, characterized in that: The silicon wafer is prepared by slicing the silicon rod described in claim 11, and the edge of the silicon wafer and / or the battery cell has a notch corresponding to the groove.

13. A photovoltaic module comprising a plurality of cells interconnected by conductive interconnects, characterized in that: The battery cell is the battery cell as claimed in claim 12, the conductive interconnector passes through the notch of the battery cell, and two ends of the conductive interconnector are respectively connected to the front component and the back component of the adjacent battery cell.

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