Large-size circuit board drilling equipment and drilling method thereof

Abstract

The present invention discloses a large-size circuit board drilling equipment and a drilling method thereof, which relates to the field of circuit board drilling, and includes a machine body, wherein at least one base is slidably connected in the machine body, and a lifting support plate is arranged in the base along its own sliding direction, and the support plate located below the drilling nozzle of the machine body is in a descending state, and the top surface of the other support plates is flush with the top surface of the base, and also includes a blowing box and an air suction box, wherein the blowing box and the air suction box are fixed on both sides of the support plate along the length direction of the support plate, and face oppositely, and after the support plate descends, the blowing box and the air suction box arranged opposite to each other on the adjacent support plates start blowing and inhaling. When drilling holes in the circuit board, the present invention moves the support plate downward, and the flowing gas takes away the waste generated in the drilling process and the heat generated by the friction between the drill nozzle and the circuit board, effectively avoiding the thicker circuit board from strangling the drill nozzle due to waste generated when drilling small-diameter holes, and can also efficiently discharge the heat generated in the drilling process, thereby improving the drilling quality.

Description

Technical Field

[0001] The invention relates to the field of circuit board drilling, in particular to a large-size circuit board drilling device and a drilling method thereof. Background Art

[0002] In the process of PCB circuit board manufacturing, it is often necessary to drill holes of different diameters on the PCB board for component insertion or conduction.

[0003] In the past few decades of development of the PCB industry, the method of using mechanical drills to drill holes has always been the mainstream technology. Mechanical drilling has withstood the growing demand for printed circuit boards and is still considered a safe and cost-effective method of drilling holes. In the prior art, a CNC PCB drilling machine is generally used to drill holes in PCB boards. Pins are used to fix the PCB boards on a machine table that can move horizontally and longitudinally, and multiple CNC drills installed on a drill rack that can move horizontally and laterally are used to drill holes in the PCB boards.

[0004] A Chinese patent with the related announcement number CN102036492B discloses a method for drilling holes in a PCB board. When drilling holes in a thicker PCB board, a method is adopted in which a hole is first drilled on one side to a depth exceeding half the thickness of the PCB board, the PCB board is turned over, and then a hole is drilled again at the same position.

[0005] In order to extend the travel of the drill bit and protect the drill bit and the machine from damage, the existing PCB board drilling machine generally puts a pad between the PCB board and the machine. When the drill bit is drilling a small-diameter through hole on a thicker PCB board, waste chips from the PCB board and the pad are easily accumulated at the bottom of the drilling, and then the drill bit is strangled due to poor chip removal due to the excessive drilling depth. In severe cases, the drill bit may break. In addition, due to the deep drilling depth, the heat of the drill bit and the bottom layer of the PCB board is not easy to dissipate quickly, which may cause the PCB board to deform due to heat accumulation, and it is also easy to shorten the service life of the drill bit. In summary, the existing PCB board drilling equipment is not easy to drill small-diameter holes on thicker PCB boards. Summary of the invention

[0006] Based on this, the purpose of the present invention is to provide a large-size circuit board drilling device and a drilling method thereof to solve the technical problem that the existing PCB board drilling equipment is not easy to drill small holes on thicker PCB boards.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a large-size circuit board drilling equipment, comprising a body, in which at least one base is slidably connected, and in which a lifting and lowering support plate is arranged along its own sliding direction, and the support plate located below the drilling nozzle of the body is in a descending state, and the top surface of the remaining support plates is flush with the top surface of the base, and also includes a blowing box and an air suction box, which are fixed on both sides of the pallet along the length direction of the pallet and face oppositely. After the pallet is lowered, the blowing boxes and air suction boxes arranged opposite to each other on adjacent pallets start blowing and sucking.

[0008] By adopting the above technical solution, the support plate moves downward when drilling holes in the circuit board, and the flowing gas takes away the waste chips generated in the drilling process and the heat generated by the friction between the drill bit and the circuit board, effectively preventing the drill bit from being strangled due to waste chips when drilling small-diameter holes in thicker circuit boards. At the same time, it can also efficiently discharge the heat generated in the drilling process, thereby improving the drilling quality.

[0009] The present invention is further configured such that after the support plate is lowered, a gas flow cavity is formed between the top surface of the support plate, the bottom surface of the circuit board, and the blowing box and the suction box.

[0010] As a preferred embodiment, it is possible to effectively prevent waste chips generated by drilling holes in the circuit board from falling into the base.

[0011] The present invention is further configured such that the base is provided with conductive tracks along its own sliding direction at positions close to both sides of the inner wall of the machine body, and the conductive tracks are provided with conductive sheets corresponding to each support plate at intervals along the length direction, and a fixing frame is fixedly connected to the machine body, and a conductive head for contacting the conductive track is provided at the end of the fixing frame, and the conductive head can only contact one conductive sheet at a time, and the connection line of the two conductive heads and the connection line of each drill bit can overlap with each other when projected to the ground.

[0012] Preferably, the supporting plates below each drill bit on the machine body are all in a lowered state, so that a cavity for chip removal and temperature reduction is formed below the circuit board.

[0013] The present invention is further configured as follows: a partition plate parallel to the bottom wall is installed in the base, a magnetic box is spaced apart between the partition plate and the bottom wall of the base along the sliding direction of the base, a telescopic column is slidably connected in the magnetic box, and an electromagnet for attracting the telescopic column and a reset spring for resetting the support plate are arranged inside, the top of the telescopic column is fixedly connected to the bottom surface of the support plate, and a flange is provided on the edge of the support plate for limiting the support plate from leaving the base, and when the top surface of the support plate is flush with the top surface of the base, the reset spring in the magnetic box is in a compressed state.

[0014] Preferably, the support plate corresponding to the bottom of the drill bit can be quickly lowered and separated from the circuit board by electromagnetic attraction.

[0015] The present invention is further configured such that both sides of the base are provided with blowing pipes and suction pipes along the sliding direction, both ends of the blowing box are connected with blowing lifting pipes, the blowing lifting pipes are slidably connected in the blowing duct along the vertical direction, the blowing duct extends to the bottom of the adjacent pallet and is connected to the blowing pipe, both ends of the suction box are connected with suction lifting pipes, the suction lifting pipes are slidably connected in the suction duct along the vertical direction, the suction duct extends to the bottom of the adjacent pallet and is connected to the suction pipe, the blowing duct and the suction duct are both provided with air valves under the corresponding pallet, the air valves are opened by the descending pallet, and the two air valves under the pallet are the air valves corresponding to the blowing box and the suction box arranged opposite to each other between the two adjacent pallets on both sides.

[0016] Preferably, after the pallet is lowered, the gas passages of the relatively facing blow boxes and suction boxes connected to two adjacent pallets are opened, thereby generating an airflow above the lowered pallet that can carry away waste chips and waste heat.

[0017] The present invention is further configured such that a plug plate is slidably connected in the air valve along the vertical direction, a pressure rod is fixedly connected to the top of the plug plate, the pressure rod is slidably connected in a fixed box, the fixed box passes through the partition plate, and a spring is arranged inside to reset the pressure rod.

[0018] Preferably, the pressure rod can insert the plug plate into the air valve under the pressure of the bottom surface of the supporting plate. When the portion of the plug plate with the circular hole enters the air valve, the two ends of the air valve are in a connected state.

[0019] The present invention is further configured such that the blow box is provided with upwardly inclined wind guide blades at intervals along the height direction, the lowest wind guide blade does not contact the inner wall of the blow box, and an inwardly inclined wind shield blade is provided above the inner wall of the suction box along the length direction.

[0020] Preferably, the air guide blades direct the air flow in the blow box toward the bottom surface of the circuit board, thereby better blowing out the waste chips in the through holes on the circuit board.

[0021] A method for drilling a large-size circuit board, the process comprising the following steps:

[0022] Step 1: Fix the PCB on the base with the front side facing upwards, select a drill bit suitable for the target blind hole diameter, and process the blind hole on the front side of the PCB;

[0023] Step 2: Select a drill bit smaller than the target through hole diameter and drill a blind hole at the target through hole location;

[0024] Step 3: Flip and fix the circuit board so that the reverse side of the circuit board faces upward and is fixed on the base, and a drill bit suitable for the target through-hole diameter is used to process the through-holes on the circuit board.

[0025] The present invention is further configured such that the diameter of the drill tip selected in step 2 is 45-95% of the target through hole diameter, and the diameter of the selected drill tip is positively correlated with the thickness of the circuit board.

[0026] As a preferred embodiment, it is possible to effectively avoid the holes obtained by the two drillings being non-concentric.

[0027] The present invention is further configured such that the drilling depth into the circuit board in step 2 is 50-90% of the thickness of the circuit board, and the drilling depth into the circuit board is positively correlated with the diameter of the drill hole.

[0028] Preferably, for small-diameter holes, the initial drilling depth is shallow, which effectively avoids the drill bit from breaking.

[0029] In summary, the present invention mainly has the following beneficial effects:

[0030] 1. The present invention arranges a support plate in the base that can be lowered according to the position of the drill bit, and arranges a gas flow channel on the adjacent edges of the support plate. When drilling holes in the circuit board, the support plate moves down, and the flowing gas takes away the waste chips generated in the drilling process and the heat generated by the friction between the drill bit and the circuit board, effectively avoiding the drill bit from being strangled due to waste chips when drilling small-diameter holes in thicker circuit boards, and at the same time, it can also efficiently discharge the heat generated in the drilling process, thereby improving the drilling quality.

[0031] 2. The present invention arranges two blowing boxes and suction boxes facing opposite directions in the length direction of the edge of the pallet. After the pallet is lowered, the blowing boxes and suction boxes of the two adjacent pallets can be directed toward each other, thereby forming a flowing airflow below the drilling area of ​​the circuit board, so that when the holes on the circuit board are drilled through, the waste chips are taken away along the airflow, thereby avoiding the situation where the waste chips accumulate and strangle the drill bit;

[0032] 3. The present invention arranges air guide blades at intervals along the length direction at the air outlet end of the blow box, so that the bottom ends of the air guide blades are away from the bottom end of the blow box. The air guide blades can guide the airflow, so that the airflow blown out of the blow box can flow toward the bottom surface of the circuit board, thereby better taking away the waste chips in the through hole of the circuit board. In addition, since the lowest air guide blade does not contact the inner wall of the blow box, the gas blown out of the blow box can flow along the surface of the descending support plate, thereby taking away the waste chips on the surface of the support plate, thereby avoiding the phenomenon of poor contact between the support plate and the circuit board after the support plate rises;

[0033] 4. The present invention performs double-sided secondary drilling on the through holes on the circuit board, with the second drilling diameter being the target diameter and the first drilling diameter being smaller than the target diameter. After the support plate is lowered, the drill tip of the second drilling expands the hole drilled for the first time, thereby reducing the generation of burrs and peaks while achieving the drilling purpose. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A perspective view of the present invention;

[0035] Figure 2 For the present invention Figure 1 A magnified view of middle;

[0036] Figure 3 A three-dimensional diagram of the base of the present invention in a state where the support plate is lowered;

[0037] Figure 4 For the present invention Figure 3 Enlarged view of middle B;

[0038] Figure 5 It is a three-dimensional view of the interior of the base of the present invention when the support plate is not lowered;

[0039] Figure 6 For the present invention Figure 5 Enlarged view of middle C;

[0040] Figure 7 Another perspective view of the interior of the base of the present invention when the support plate is not lowered;

[0041] Figure 8 It is a three-dimensional view of the interior of the base of the present invention when the support plate is in a lowered state;

[0042] Fig. 9 For the present invention Figure 8 Enlarged view of middle D;

[0043] Fig.10 Another perspective view of the interior of the base of the present invention is a perspective view of the lowered state of the support plate;

[0044] Fig.11 It is a cross-sectional stereoscopic view of the blowing box and the suction box of the present invention.

[0045] Description of reference numerals:

[0046] 1. Machine body; 2. Base; 201. Partition plate; 3. Support plate; 4. Fixed frame; 401. Conductive head; 5. Conductive track; 6. Blowing pipe; 7. Suction pipe; 8. Blowing duct; 9. Suction duct; 10. Blowing lifting pipe; 11. Suction lifting pipe; 12. Blowing box; 1201. Wind guide blade; 13. Suction box; 1301. Wind shield blade; 14. Air valve; 15. Insert plate; 16. Fixed box; 17. Pressure rod; 18. Magnetic box; 19. Telescopic column. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0048] The following describes an embodiment of the present invention based on its overall structure.

[0049] First embodiment:

[0050] A large-size circuit board drilling equipment, see Figure 1-11 , including a body 1, in which at least one base 2 is slidably connected, and in which a lifting and lowering pallet 3 is arranged along its own sliding direction, the pallet 3 located below the drill bit of the body 1 is in a descending state, and the top surfaces of the other pallets 3 are flush with the top surfaces of the base 2, and the pallet 3 that has not descended and the surface of the base 2 together provide good support for the circuit board, and also include a blowing box 12 and an air suction box 13, which are fixed to both sides of the pallet 3 along the length direction of the pallet 3 and face opposite directions, and the blowing boxes 12 and the air suction boxes 13 of the two pallets 3 close to each other are arranged opposite to each other, and after the pallet 3 is descended, the blowing boxes 12 and the air suction boxes 13 arranged opposite to each other on both sides of the descending pallet 3 start to blow and inhale.

[0051] In the above embodiments, please refer to Figure 3-9 After the pallet 3 is lowered, a gas circulation cavity is formed between the top surface of the pallet 3, the bottom surface of the circuit board, and the blowing box 12 and the suction box 13. The heights of the blowing box 12 and the suction box 13 are the same as the lowering height of the pallet 3. The positive pressure in the blowing box 12 and the negative pressure in the suction box 13 form an airflow flowing from the blowing box 12 toward the suction box 13. The heat generated by drilling is conducted and diffused on the bottom surface of the circuit board itself, and the heat diffused and conducted on the bottom surface of the circuit board is then transferred to the airflow, thereby realizing efficient heat dissipation of the bottom surface of the circuit board. At the same time, because the airflow is in a confined space, the circuit board waste generated by drilling is sucked into the suction box 13 by the airflow, which can effectively prevent the waste generated by drilling the circuit board from falling into the base 2.

[0052] In the above embodiments, please refer to Figure 1-10The base 2 is provided with conductive tracks 5 at positions on both sides of the inner wall of the body 1 along its own sliding direction. In the present embodiment, the base 2 is specifically provided with six conductive tracks 5 in parallel and closely arranged. The conductive tracks 5 are provided at positions of the bases 2 on both sides close to the inner wall of the body 1. The conductive tracks 5 are provided with conductive sheets corresponding to each support plate 3 at intervals along the length direction. A fixing frame 4 is fixedly connected in the body 1. A conductive head 401 for contacting the conductive track 5 is provided at the end of the fixing frame 4. The conductive head 401 can only contact one conductive sheet at the same time to avoid simultaneously lowering the two support plates 3 in the base 2. The connection line of the two conductive heads 401 and the connection line of each drill bit can overlap with each other when projected to the ground.

[0053] Specifically, each drill bit in the body 1 is installed on a moving platform that can move horizontally, and the movement direction of the base 2 is horizontal longitudinal movement. During the movement of the base 2, the conductive track 5 slides relative to the conductive head 401, and the conductive head 401 contacts different conductive sheets in the conductive track 5 respectively, and connects the conductive circuits under the support plate 3 corresponding to the different conductive sheets, so that the support plates 3 under each drill nozzle on the body 1 are in a descending state, and a cavity for chip removal and cooling is formed under the circuit board.

[0054] In the above embodiments, please refer to Figure 3-10 A partition plate 201 parallel to the bottom wall is installed in the base 2, and a magnetic box 18 is arranged between the partition plate 201 and the bottom wall of the base 2 along the sliding direction of the base 2. A telescopic column 19 is slidably connected in the magnetic box 18, and an electromagnet for attracting the telescopic column 19 and a reset spring for resetting the support plate 3 are arranged inside. The top of the telescopic column 19 is fixedly connected to the bottom surface of the support plate 3.

[0055] Furthermore, a flange is provided on the edge of the support plate 3 for limiting the support plate 3 from leaving the base 2. When the top surface of the support plate 3 is flush with the top surface of the base 2, the reset spring in the magnetic suction box 18 is in a compressed state. When the electromagnet is energized, the spring will be further compressed to retract the telescopic column 19, thereby lowering the height of the support plate 3. After the electromagnet is powered off, the telescopic column 19 quickly extends under the action of the spring elastic force, and the flange on the edge of the support plate 3 contacts the limiting step of the base 2. When the top surface of the support plate 3 is flush with the top surface of the base 2, the base 2 limits the support plate 3 from continuing to move upward. When the pressure applied to the support plate 3 is less than the elastic force of the spring, the support plate 3 cannot be pressed down, thereby achieving the effect of stabilizing the support of the circuit board. The support plate 3 corresponding to the bottom of the drill bit can be quickly lowered and separated from the contact with the circuit board by electromagnetic attraction.

[0056] In the above embodiments, please refer to Figure 5-10, both sides of the base 2 are provided with a blowing pipe 6 and an air suction pipe 7 along the sliding direction, the blowing pipe 6 and the air suction pipe 7 of the base 2 are respectively connected to the blower and the negative pressure pipeline in the body 1, the negative pressure pipeline of the air suction pipe 7 can be shared with the existing negative pressure pipeline of the body 1, and both ends of the blowing box 12 are connected with a blowing lifting pipe 10, the blowing lifting pipe 10 is slidably connected to the blowing duct 8 along the vertical direction, the blowing duct 8 extends to the bottom of the adjacent support plate 3 and is connected to the blowing pipe 6, and both ends of the air suction box 13 are connected with an air suction lifting pipe 11, the air suction lifting pipe 11 is slidably connected to the suction duct 9 along the vertical direction, the suction duct 9 extends to the bottom of the adjacent support plate 3 and is connected to the suction pipe 7. Specifically, the bottom ends of the blowing lifting pipe 10 and the suction lifting pipe 11 are provided with pistons, and the suction duct 9 and the blowing duct 8 are staggered with each other, and will not interfere with each other.

[0057] Furthermore, the blowing duct 8 and the suction duct 9 are both provided with air valves 14 under the corresponding pallets 3, and the air valves 14 are opened by the descending pallet 3. The two air valves 14 under the pallet 3 are the air valves 14 corresponding to the blowing boxes 12 and suction boxes 13 arranged opposite to each other between the two adjacent pallets 3 on both sides. After the pallet 3 descends, the gas passages of the relatively facing blowing boxes 12 and suction boxes 13 connected to the two adjacent pallets 3 will be opened, thereby generating an airflow above the descending pallet 3 that can take away waste chips and waste heat.

[0058] A method for drilling a large-size circuit board, the process comprising the following steps:

[0059] Step 1: Fix the front side of the circuit board on the base with the front side facing upward, select a drill bit suitable for the target blind hole diameter, and process the blind hole on the front side of the circuit board. Since the blind hole does not need to be drilled through the circuit board, the waste chips generated during the drilling process are adsorbed and collected by the negative pressure collection bin on one side of the drill bit, and part of the heat generated during the drilling process of the drill bit is transferred downward and conducted to the flowing airflow;

[0060] Step 2: Select a drill tip smaller than the target through hole diameter, and drill a blind hole at the target through hole position. Specifically, for example, when drilling a hole with a diameter of 0.3mm for a circuit board with a thickness of 100mil, the selected drill tip diameter is 45-95% of the target through hole diameter. In this embodiment, a 0.2mm drill tip is specifically used. Specifically, when actually selecting a drill tip with an ideal diameter, due to the limitation of existing drill tip specifications, when it is impossible to customize an adaptive drill tip according to the drilling diameter, a drill tip that can be used in existing drill tip specifications and is closest to the ideal diameter can be selected. The diameter of the selected drill tip is positively correlated with the thickness of the circuit board, which can effectively avoid the non-concentricity of the holes obtained by two drillings. The drilling depth into the circuit board is 50-90% of the thickness of the circuit board. In this embodiment, the drilling depth into the circuit board is 80mil, which is positively correlated with the diameter of the drill hole. For small-diameter holes, the initial drilling depth is shallow, which effectively avoids the occurrence of drill tip breakage.

[0061] Step 3: Flip and fix the circuit board so that the back of the circuit board is fixed on the base upward, and use a drill bit suitable for the target through-hole diameter to process the through-hole on the circuit board. Specifically, the waste chips generated at the beginning of drilling are sucked away by the negative pressure pipe on one side of the drill bit, and as the drilling depth increases, under the action of the airflow in the cavity on the bottom surface of the circuit board, the waste chips that are not easily sucked away by the negative pressure pipe above the circuit board will fall and be taken away by the airflow, effectively avoiding the accumulation of waste chips in the drill hole, and at the same time, it can also effectively cool the drill bit and the bottom surface of the circuit board during continuous drilling.

[0062] Second embodiment:

[0063] A large-size circuit board drilling equipment, see Figure 1-11 On the basis of the first embodiment, the difference from the first embodiment is that a plug plate 15 is slidably connected in the air valve 14 along the vertical direction, and a round hole is provided on the plug plate 15 for gas circulation. When the pressure rod 17 is not pressed down, the bottom of the plug plate 15 is located in the air valve 14, so that the gas at both ends of the air valve 14 is in a relatively non-circulating state. The top of the plug plate 15 is fixedly connected with a pressure rod 17, and the pressure rod 17 is slidably connected to the fixing box 16. The fixing box 16 passes through the partition plate 201 and is provided with a spring for resetting the pressure rod 17.

[0064] Specifically, after the support plate 3 is controlled by the electromagnet to descend, the pressure rod 17 will cause the plug plate 15 to be inserted into the air valve 14 under the pressure of the bottom surface of the support plate 3. When the part of the plug plate 15 with the circular hole enters the air valve 14, the two ends of the air valve 14 are in a connected state. When the support plate 3 is reset, the pressure rod 17 is also moved upward and reset by the elastic force of the reset spring in the fixing box 16, so that the parts of the plug plate 15 without the through hole correspond to the two ends of the air valve 14, thereby preventing the gas from flowing through the air valve 14.

[0065] A method for drilling a large-size circuit board, the process comprising the following steps:

[0066] Step 1: Fix the front side of the circuit board on the base with the front side facing upward, select a drill bit suitable for the target blind hole diameter, and process the blind hole on the front side of the circuit board. Since the blind hole does not need to be drilled through the circuit board, the waste chips generated during the drilling process are adsorbed and collected by the negative pressure collection bin on one side of the drill bit, and part of the heat generated during the drilling process of the drill bit is transferred downward and conducted to the flowing airflow;

[0067] Step 2: Select a drill tip smaller than the target through hole diameter, and drill a blind hole at the target through hole position. Specifically, for example, when drilling a hole with a diameter of 0.3mm for a circuit board with a thickness of 120mil, the selected drill tip diameter is 45-95% of the target through hole diameter. In this embodiment, a 0.25mm drill tip is specifically used. Specifically, when actually selecting a drill tip with an ideal diameter, due to the limitation of existing drill tip specifications, when it is impossible to customize an adaptive drill tip according to the drilling diameter, a drill tip that can be used in existing drill tip specifications and is closest to the ideal diameter can be selected. The diameter of the selected drill tip is positively correlated with the thickness of the circuit board, which can effectively avoid the non-concentricity of the holes obtained by two drillings. The drilling depth into the circuit board is 50-90% of the thickness of the circuit board. In this embodiment, the drilling depth into the circuit board is 96mil, which is positively correlated with the diameter of the drill hole. For small-diameter holes, the initial drilling depth is shallow, which effectively avoids the occurrence of drill tip breakage.

[0068] Step 3: Flip and fix the circuit board so that the back of the circuit board is fixed on the base upward, and use a drill bit suitable for the target through-hole diameter to process the through-hole on the circuit board. Specifically, the waste chips generated at the beginning of drilling are sucked away by the negative pressure pipe on one side of the drill bit, and as the drilling depth increases, under the action of the airflow in the cavity on the bottom surface of the circuit board, the waste chips that are not easily sucked away by the negative pressure pipe above the circuit board will fall and be taken away by the airflow, effectively avoiding the accumulation of waste chips in the drill hole, and at the same time, it can also effectively cool the drill bit and the bottom surface of the circuit board during continuous drilling.

[0069] The third embodiment:

[0070] A large-size circuit board drilling equipment, see Figure 1-11 On the basis of the second embodiment, the difference from the second embodiment is that the blow box 12 is provided with upwardly inclined air guide blades 1201 at intervals along the height direction. The air guide blades 1201 make the air flow in the blow box 12 flow more toward the bottom surface of the circuit board, thereby better blowing out the waste chips in the through holes on the circuit board. The lowest air guide blades 1201 do not contact the inner wall of the blow box 12, and an air outlet close to the top surface of the lowered support plate 3 flows out at the gas outlet position of the blow box 12. The gas in the blow box 12 flows out along the air outlet, which can make the waste chips on the surface of the support plate 3 better blown into the suction box 13, thereby preventing the waste chips of the circuit board from remaining on the top surface of the raised support plate 3 and affecting the fitting between the support plate 3 and the bottom surface of the circuit board.

[0071] Furthermore, an inwardly inclined windshield blade 1301 is provided above the inner wall of the air suction box 13 along the length direction to reduce the cross-sectional area at the air inlet of the air suction box 13 and generate a stronger negative pressure at the air inlet of the air suction box 13.

[0072] A method for drilling a large-size circuit board, the process comprising the following steps:

[0073] Step 1: Fix the front side of the circuit board on the base with the front side facing upward, select a drill bit suitable for the target blind hole diameter, and process the blind hole on the front side of the circuit board. Since the blind hole does not need to be drilled through the circuit board, the waste chips generated during the drilling process are adsorbed and collected by the negative pressure collection bin on one side of the drill bit, and part of the heat generated during the drilling process of the drill bit is transferred downward and conducted to the flowing airflow;

[0074] Step 2: Select a drill tip smaller than the target through hole diameter, and drill a blind hole at the target through hole position. Specifically, for example, when drilling a hole with a diameter of 0.2mm for a circuit board with a thickness of 60mil, the selected drill tip diameter is 45-95% of the target through hole diameter. In this embodiment, a 0.1mm drill tip is specifically used. Specifically, when actually selecting a drill tip with an ideal diameter, due to the limitation of existing drill tip specifications, when it is impossible to customize an adaptive drill tip according to the drilling diameter, a drill tip that can be used in existing drill tip specifications and is closest to the ideal diameter can be selected. The diameter of the selected drill tip is positively correlated with the thickness of the circuit board, which can effectively avoid the non-concentricity of the holes obtained by two drillings. The drilling depth into the circuit board is 50-90% of the thickness of the circuit board. In this embodiment, the drilling depth into the circuit board is 36mil, which is positively correlated with the diameter of the drill hole. For small-diameter holes, the initial drilling depth is shallow, which effectively avoids the occurrence of drill tip breakage.

[0075] Step 3: Flip and fix the circuit board so that the back of the circuit board is fixed on the base upward, and use a drill bit suitable for the target through-hole diameter to process the through-hole on the circuit board. Specifically, the waste chips generated at the beginning of drilling are sucked away by the negative pressure pipe on one side of the drill bit, and as the drilling depth increases, under the action of the airflow in the cavity on the bottom surface of the circuit board, the waste chips that are not easily sucked away by the negative pressure pipe above the circuit board will fall and be taken away by the airflow, effectively avoiding the accumulation of waste chips in the drill hole, and at the same time, it can also effectively cool the drill bit and the bottom surface of the circuit board during continuous drilling.

[0076] Fourth embodiment:

[0077] A method for drilling a large-size circuit board, the process comprising the following steps:

[0078] Step 1: Fix the front side of the circuit board on the base with the front side facing upward, select a drill bit suitable for the target blind hole diameter, and process the blind hole on the front side of the circuit board. Since the blind hole does not need to be drilled through the circuit board, the waste chips generated during the drilling process are adsorbed and collected by the negative pressure collection bin on one side of the drill bit, and part of the heat generated during the drilling process of the drill bit is transferred downward and conducted to the flowing airflow;

[0079] Step 2: Select a drill tip smaller than the target through hole diameter, and drill a blind hole at the target through hole position. Specifically, for example, when drilling a hole with a diameter of 0.2mm on a circuit board with a thickness of 120mil, the selected drill tip diameter is 45-95% of the target through hole diameter. In this embodiment, a 0.15mm drill tip is specifically used. Specifically, when actually selecting a drill tip with an ideal diameter, due to the limitation of existing drill tip specifications, when it is impossible to customize an adaptive drill tip according to the drilling diameter, a drill tip that can be used in existing drill tip specifications and is closest to the ideal diameter can be selected. The diameter of the selected drill tip is positively correlated with the thickness of the circuit board, which can effectively avoid the non-concentricity of the holes obtained by two drillings. The drilling depth into the circuit board is 50-90% of the thickness of the circuit board. In this embodiment, the drilling depth into the circuit board is 72mil, which is positively correlated with the diameter of the drill hole. For small-diameter holes, the initial drilling depth is shallow, which effectively avoids the occurrence of drill tip breakage.

[0080] Step 3: Flip and fix the circuit board so that the back of the circuit board is fixed on the base upward, and use a drill bit suitable for the target through-hole diameter to process the through-hole on the circuit board. Specifically, the waste chips generated at the beginning of drilling are sucked away by the negative pressure pipe on one side of the drill bit, and as the drilling depth increases, under the action of the airflow in the cavity on the bottom surface of the circuit board, the waste chips that are not easily sucked away by the negative pressure pipe above the circuit board will fall and be taken away by the airflow, effectively avoiding the accumulation of waste chips in the drill hole, and at the same time, it can also effectively cool the drill bit and the bottom surface of the circuit board during continuous drilling.

[0081] The specific principle of the present invention for forming a cavity below the corresponding drill bit of the circuit board is as follows: the conductive head 401 contacts the conductive sheet in the conductive track 5 to power the electromagnet below the drill bit, so that the support plate 3 below the drill bit descends to form a cavity. After the support plate 3 descends, the air valve 14 below is opened to connect the air blowing pipelines and the air suction pipelines arranged opposite to each other on the adjacent support plates on both sides of the descending support plate 3, and an air flow for taking away waste chips and waste heat is formed in the air below the support plate 3. As the base 2 moves, the support plate 3 leaving the bottom of the drill bit is reset by the spring. Since the connection line of the conductive head 401 and the connection line of the drill bit are projected to the ground and overlap with each other, the support plate 3 below the corresponding drill bit will descend with the movement of the base 2, thereby ensuring that the drill bit will not damage the support plate 3. At the same time, when the drill bit drills through the circuit board, it can effectively discharge the waste chips generated by drilling, and at the same time, it can also have a good cooling effect on the bottom surface of the circuit board, thereby realizing the small hole punching operation for the thick circuit board.

[0082] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A large-size circuit board drilling device, characterized in that: include: A machine body (1), wherein at least one base (2) is slidably connected inside the machine body (1); A base (2), wherein the base (2) has lifting and lowering support plates (3) arranged along the sliding direction thereof, the support plate (3) located below the drill bit of the machine body (1) being in a lowered state, and the top surfaces of the other support plates (3) being flush with the top surface of the base (2); A blowing box (12) and an air suction box (13), wherein the blowing box (12) and the air suction box (13) are fixed on both sides of the support plate (3) along the length direction of the support plate (3) and face opposite directions. After the support plate (3) is lowered, the blowing box (12) and the air suction box (13) arranged opposite to each other adjacent to the support plate (3) start blowing and sucking. After the support plate (3) is lowered, the top surface of the support plate (3), the bottom surface of the circuit board, and the space between the blowing box (12) and the air suction box (13) form a gas flow cavity. Both sides of the base (2) are provided with a blowing pipe (6) and an air suction pipe (7) along the sliding direction. Both ends of the blowing box (12) are connected to a blowing lifting pipe (10). The blowing lifting pipe (10) is slidably connected to the blowing lifting pipe (10) along the vertical direction. In the air duct (8), the blowing duct (8) extends to the bottom of the adjacent support plate (3) and is connected to the blowing pipe (6), both ends of the suction box (13) are connected to the suction lifting pipe (11), the suction lifting pipe (11) is slidably connected to the suction duct (9) in the vertical direction, the suction duct (9) extends to the bottom of the adjacent support plate (3) and is connected to the suction pipe (7), the blowing duct (8) and the suction duct (9) are both provided with air valves (14) under the corresponding support plate (3), the air valves (14) are opened by the descending support plate (3), and the two air valves (14) under the support plate (3) are the air valves (14) corresponding to the blowing box (12) and the suction box (13) arranged opposite to each other between the two adjacent support plates (3) on both sides.

2. A large-size circuit board drilling device according to claim 1, characterized in that: The base (2) is provided with conductive tracks (5) at positions close to both sides of the inner wall of the body (1) along the sliding direction thereof; the conductive tracks (5) are provided with conductive sheets corresponding to the respective support plates (3) at intervals along the length direction; a fixing frame (4) is fixedly connected inside the body (1); a conductive head (401) for contacting the conductive track (5) is provided at the end of the fixing frame (4); the conductive head (401) can only contact one conductive sheet at a time; and the connection line of the two conductive heads (401) and the connection line of the respective drill bits can overlap each other when projected onto the ground.

3. A large-size circuit board drilling device according to claim 2, characterized in that: A partition plate (201) parallel to the bottom wall is installed in the base (2); a magnetic suction box (18) is arranged between the partition plate (201) and the bottom wall of the base (2) along the sliding direction of the base (2); a telescopic column (19) is slidably connected in the magnetic suction box (18), and an electromagnet for attracting the telescopic column (19) and a reset spring for resetting the support plate (3) are arranged inside the magnetic suction box (18); the top end of the telescopic column (19) is fixedly connected to the bottom surface of the support plate (3); the edge of the support plate (3) is provided with a flange for limiting the support plate (3) from leaving the base (2); when the top surface of the support plate (3) is flush with the top surface of the base (2), the reset spring in the magnetic suction box (18) is in a compressed state.

4. A large-size circuit board drilling device according to claim 3, characterized in that: A plug plate (15) is slidably connected in the vertical direction inside the air valve (14), a pressure rod (17) is fixedly connected to the top of the plug plate (15), and the pressure rod (17) is slidably connected inside a fixed box (16). The fixed box (16) passes through the partition plate (201) and has a spring inside for returning the pressure rod (17).

5. The large-size circuit board drilling device according to claim 1, characterized in that: The blowing box (12) is provided with wind guide blades (1201) inclined upward at intervals along the height direction, the lowest wind guide blade (1201) does not contact the inner wall of the blowing box (12), and wind shield blades (1301) inclined inward are provided above the inner wall of the suction box (13) along the length direction.

6. A method for drilling a large-size circuit board, characterized in that The process of using the large-size circuit board drilling equipment according to any one of claims 1 to 5 comprises the following steps: Step 1: Fix the PCB on the base with the front side facing upwards, select a drill bit suitable for the target blind hole diameter, and process the blind hole on the front side of the PCB; Step 2: Select a drill bit smaller than the target through hole diameter and drill a blind hole at the target through hole location; Step 3: Flip and fix the circuit board so that the reverse side of the circuit board faces upward and is fixed on the base, and a drill bit suitable for the target through-hole diameter is used to process the through-holes on the circuit board.

7. The large-size circuit board drilling method according to claim 6, characterized in that: The diameter of the drill tip selected in step 2 is 45-95% of the target through hole diameter, and the diameter of the selected drill tip is positively correlated with the thickness of the circuit board.

8. The large-size circuit board drilling method according to claim 7, characterized in that: In the step 2, the drilling depth into the circuit board is 50-90% of the thickness of the circuit board, and the drilling depth into the circuit board is positively correlated with the diameter of the drill hole.

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