Wafer chamfer cutting method, electronic device, computer-readable storage medium, and dicing machine

Abstract

The present invention relates to the technical field of dicing machines, and in particular to a method for chamfering a wafer, an electronic device, a computer-readable storage medium, and a dicing machine. The method for chamfering a wafer of the present invention obtains the coordinates of a corner point B to be cut on a wafer and the coordinates of a cutting point A on a side where the corner point B is located, and the cutting point A is located on the chamfer cutting line of the corner point B. The carrier rotates a preset angle so that the corner point B falls on the X-axis, and the chamfer cutting line is parallel to the Y-axis of the plane rectangular coordinate system. The coordinates of the rotating cutting point A are obtained according to the preset angle, and the carrier moves toward the cutting tool along the X-axis direction until the chamfer cutting line is directly below the cutting tool. The cutting tool descends to the cutting height, and the carrier moves toward the cutting tool along the Y-axis to complete the chamfering of the corner point B. The corners of the wafer are chamfered by the cutting tool, and there is no need to replace the slotting tool, thereby improving the chamfering efficiency of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of dicing machines, and in particular to a wafer chamfering cutting method, electronic equipment, computer-readable storage medium and dicing machine. Background Art

[0002] During wafer cutting, the dicing machine controls the slotting tool on the first axis to descend to a first height to slot the wafer on the stage. The cutting tool on the second axis is then controlled to descend to a second height so that the cutting tool can cut the wafer into small pieces along the slotting marks. Finally, the slotting tool on the first axis is replaced, and the corners of the small wafers are chamfered to prevent defects, cracks, and other problems at the corners of the wafer from being slightly squeezed or impacted (due to the brittle nature of the silicon substrate itself).

[0003] In the above-mentioned cutting process, since the first axis and the second axis have different set knife heights (the descending heights of the tool), after the tool change operation on the first axis, the knife height of the first axis needs to be reset, and operations such as knife sharpening and warming up need to be performed, which reduces the chamfer cutting efficiency of the wafer. Summary of the Invention

[0004] The object of the present invention is to provide a wafer chamfer cutting method, electronic equipment, computer-readable storage medium and dicing machine to improve the efficiency of wafer chamfer cutting.

[0005] To achieve this object, the technical solution adopted in the present invention is:

[0006] The chamfer cutting method of a wafer comprises the following steps:

[0007] The wafer to be cut is placed and adsorbed on the carrier of the dicing machine;

[0008] Establishing a plane rectangular coordinate system with the rotation center of the carrier as the origin; obtaining the coordinates of a corner point B to be cut on the wafer and the coordinates of a cutting point A on a side where the corner point B is located, wherein the cutting point A is located on the chamfer cutting line of the corner point B;

[0009] The carrier is rotated by a preset angle so that the corner point B falls on the X axis of the plane rectangular coordinate system, and the chamfer cutting line is parallel to the Y axis of the plane rectangular coordinate system;

[0010] The coordinates of the cutting point A after rotation are obtained according to the preset angle, and the carrier moves along the X-axis direction toward the cutting tool until the chamfer cutting line is located directly below the cutting tool;

[0011] The cutting tool is lowered to a cutting height, and the carrier moves along the Y axis toward the cutting tool to complete the chamfering of the corner point B.

[0012] As an optional solution for the chamfering cutting method of the wafer, before the carrier rotates, it is determined whether the corner point B is located on the X axis or the Y axis;

[0013] If the corner point B is located on the X-axis, the preset angle is 0° or 180°;

[0014] If the corner point B is located on the Y axis, the preset angle is 90° or 270°.

[0015] As an optional solution for the chamfering cutting method of the wafer, if the corner point B is not on the X-axis or the Y-axis, the preset angle is calculated based on the coordinates of the corner point B before and after rotation.

[0016] As an optional solution to the wafer chamfer cutting method, before the carrier rotates, it is determined whether the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system;

[0017] If the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system, the coordinate value of the cutting point A after rotation is.

[0018] As an optional solution for the chamfer cutting method of the wafer, the coordinates of the corner point B and the cutting point A before rotation are obtained by a positioning camera on the dicing machine.

[0019] As an optional solution of the wafer chamfer cutting method, the moving speed of the carrier along the Y-axis toward the cutting tool is 0 mm / s to 400 mm / s.

[0020] Electronic equipment, including:

[0021] at least one processor; and

[0022] a memory communicatively connected to the at least one processor; wherein,

[0023] The memory stores a computer program that can be executed by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the above-mentioned wafer chamfering cutting method.

[0024] A computer-readable storage medium stores a computer program, which implements the above-mentioned wafer chamfering cutting method when executed by a processor.

[0025] The dicing machine includes a carrier, a second shaft and a cutting tool. The carrier is used to carry the wafer. The second shaft is located above the carrier and the cutting tool is provided at the output end of the second shaft. The cutting tool performs chamfer cutting of the wafer using the above-mentioned wafer chamfer cutting method.

[0026] As an optional solution of the dicing machine, the dicing machine further includes a first shaft and a slotting tool, the first shaft is located above the carrier and the slotting tool is provided at the output end of the first shaft.

[0027] The beneficial effects of the present invention are:

[0028] The present invention proposes a method for chamfering a wafer. First, a plane rectangular coordinate system is established with the rotation center of the carrier as the origin. The coordinates of the corner point B to be cut on the wafer and the coordinates of the cutting point A on one side where the corner point B is located are obtained. The cutting point A is located on the chamfer cutting line of the corner point B. The carrier is rotated by a preset angle so that the corner point B falls on the X-axis of the plane rectangular coordinate system, and the chamfer cutting line is parallel to the Y-axis of the plane rectangular coordinate system. The coordinates of the rotating cutting point A are obtained according to the preset angle, and the carrier moves toward the cutting tool along the X-axis until the chamfer cutting line is directly below the cutting tool. The cutting tool is lowered to the cutting height, and the carrier moves toward the cutting tool along the Y-axis to complete the chamfer cutting of the corner point B. The corners of the wafer are chamfered by the cutting tool without replacing the slotting tool, avoiding the operations of resetting the knife height of the first axis, sharpening the knife, and warming up the machine, thereby improving the efficiency of the chamfering cutting of the wafer.

[0029] The electronic device, computer-readable storage medium, and dicing machine proposed in the present invention directly chamfer the corners of a wafer using a cutting tool, thereby improving the chamfering efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a top view of the dicing machine before the stage is rotated according to an embodiment of the present invention;

[0031] Figure 2 is a top view of the dicing machine after the carrier is rotated according to an embodiment of the present invention;

[0032] Figure 3 This is a main flow chart of a wafer chamfering method provided by an embodiment of the present invention;

[0033] Figure 4 It is a block diagram of an electronic device provided by an embodiment of the present invention.

[0034] The names and numbers of the components in the figure are as follows:

[0035] 400, dicing machine; 401, memory; 402, processor;

[0036] 1. Carrier; 2. Slotting tool; 3. Cutting tool; 4. Turntable; 5. Wafer; 6. Chamfer cutting line. DETAILED DESCRIPTION

[0037] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the present invention are further described below with reference to the accompanying drawings and through specific embodiments. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the drawings only show portions relevant to the present invention, not all of them.

[0038] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0039] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0040] In the description of this embodiment, terms such as "upper," "lower," "right," and "left" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0041] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0042] like Figure 1 and Figure 2 As shown, this embodiment provides a dicing machine 400, which includes a carrier 1, a first shaft and a slotting tool 2, a second shaft and a cutting tool 3. The carrier 1 is used to support a wafer 5. The first shaft is located above the carrier 1 and the slotting tool 2 is provided at the output end of the first shaft. The second shaft is located above the carrier 1 and the cutting tool 3 is provided at the output end of the second shaft.

[0043] Specifically, the dicing machine 400 also includes a machine, a turntable 4, a driving member and a vacuum adsorption mechanism. The turntable 4 is rotatably mounted on the machine, and the carrier 1 is mounted on the turntable 4 and rotates synchronously with the turntable 4. Both the first axis and the second axis can be mounted on the machine in a liftable manner. A plurality of driving members are also installed on the machine to respectively drive the rotation of the turntable 4 and the lifting and lowering movement of the first axis and the second axis. Adsorption holes are provided on the carrier 1, and the pipelines of the vacuum adsorption mechanism are connected to the adsorption holes so that the carrier 1 can carry and fix the wafer 5 by vacuum adsorption. Since the dicing machine 400 is a prior art, the structure and working process of the dicing machine 400 will not be described in detail.

[0044] In this embodiment, the dicing machine 400 controls the first-axis slotting tool 2 to descend to a first height to slot the wafer 5 on the stage 1. The dicing machine then controls the second-axis cutting tool 3 to descend to a second height so that the cutting tool 3 separates the wafer 5 into smaller pieces along the slotting marks. Finally, the first-axis slotting tool 2 is replaced, and the corners of the smaller wafers 5 are chamfered to prevent defects, cracks, and other problems on the wafers 5.

[0045] In the above-mentioned cutting process, after the tool change operation is performed on the first axis, the tool height of the first axis needs to be reset, and operations such as tool sharpening and warming up need to be performed, which reduces the chamfer cutting efficiency of the wafer 5 .

[0046] To solve the above problems, Figures 1 to 3 As shown, this embodiment also proposes a wafer chamfer cutting method, which includes the following steps:

[0047] The wafer 5 to be cut is placed on and adsorbed on the carrier 1 of the dicing machine 400 .

[0048] A plane rectangular coordinate system is established with the rotation center of the carrier 1 as the origin, and the coordinates of the corner point B to be cut on the wafer 5 and the coordinates of the cutting point A on one side where the corner point B is located are obtained. The cutting point A is located on the chamfer cutting line 6 of the corner point B.

[0049] The stage 1 is rotated by a preset angle (clockwise as indicated by the arrow in the figure) so that the corner point B falls on the X axis of the plane rectangular coordinate system and the chamfer cutting line 6 is parallel to the Y axis of the plane rectangular coordinate system.

[0050] The coordinates of the cutting point A after rotation are obtained according to the preset angle, and the carrier 1 moves along the X-axis direction toward the cutting tool 3 until the chamfer cutting line 6 is directly below the cutting tool 3;

[0051] The cutting tool 3 is lowered to the cutting height, and the carrier 1 moves along the Y axis toward the cutting tool 3 to complete the chamfering of the corner point B.

[0052] The chamfer cutting method of the wafer of this embodiment first establishes a plane rectangular coordinate system with the rotation center of the carrier 1 as the origin, that is, the XY coordinate system in the figure. The coordinates of the corner point B to be cut on the wafer 5 and the coordinates of the cutting point A on one side where the corner point B is located are obtained, and the cutting point A is located on the chamfer cutting line 6 of the corner point B. The carrier 1 is rotated by a preset angle so that the corner point B falls on the X axis of the plane rectangular coordinate system, and the chamfer cutting line 6 is parallel to the Y axis of the plane rectangular coordinate system. According to the preset angle, the coordinates of the rotating cutting point A are obtained, and the carrier 1 moves toward the cutting tool 3 along the X axis until the chamfer cutting line 6 is directly below the cutting tool 3. The cutting tool 3 is lowered to the cutting height, and the carrier 1 moves toward the cutting tool 3 along the Y axis to complete the chamfer cutting of the corner point B. The corners of the wafer 5 are chamfered by the cutting tool 3, and there is no need to replace the slotting tool 2, thereby avoiding the operations of resetting the knife height of the first axis, sharpening the knife, and warming up the machine, thereby improving the chamfer cutting efficiency of the wafer 5.

[0053] It should be noted that the coordinates of the corner point B and the cutting point A before rotation are obtained by a positioning camera (not shown) on the dicing machine 400 to ensure the coordinate accuracy of the corner point B and the cutting point A, thereby improving the quality of the chamfer cutting. The above-mentioned positioning camera can be a CCD camera, which can obtain the coordinates of the corner point B and the cutting point A in a plane rectangular coordinate system by taking pictures. Since the positioning camera and the process of obtaining the coordinate values ​​are both existing technologies, the structure and working process of the positioning camera will not be described in detail.

[0054] Specifically, if Figure 1 As shown, first, the wafer 5 to be cut is placed on the carrier 1, and the carrier 1 fixes the wafer 5 by vacuum adsorption to ensure that the position of the wafer 5 relative to the carrier 1 remains fixed. Then, a plane rectangular coordinate system is established with the rotation center of the carrier 1 as the origin, and the projection of the cutting tool 3 on the carrier 1 along the height direction falls on the X-axis. Secondly, the coordinates of the corner point B to be cut off and the coordinates of the cutting point A on one side where the corner point B is located are obtained by positioning the camera. It should be noted that the selection of the cutting point A depends on the angle of the chamfer, and the cutting point A is located on the chamfer cutting line 6 of the corner point B, so that the cutting point A is the starting point or end point of the chamfer cutting.

[0055] By rotating the carrier 1 by a preset angle, the chamfered cutting line 6 is made parallel to the Y axis, and the corner point B now falls on the X axis. Since the corner point B has the same rotation angle as the cutting point A, the preset angle of this embodiment can be calculated based on the coordinates of the corner point B before and after rotation, thereby obtaining the rotation angle of the cutting point A, and then the coordinate value of the rotating cutting point A is calculated based on the coordinates of the cutting point A before rotation and the rotation angle, thereby obtaining the X-axis coordinate value of the chamfered cutting line 6. Therefore, based on the coordinates of the rotating cutting point A and the coordinate value of the projection point of the cutting tool 3 on the plane rectangular coordinate system, that is, the difference between the X coordinate value of the rotating cutting point A and the X coordinate value of the projection point, the carrier 1 moves along the X-axis direction toward the cutting tool 3 until the chamfered cutting line 6 is directly below the cutting tool 3. At this time, the X coordinate value of the rotating cutting point A is equal to the X coordinate value of the projection point. Finally, the cutting tool 3 descends to the cutting height, and the carrier 1 moves along the Y axis (forward or reverse) toward the cutting tool 3. The cutting tool 3 cuts off the corner point B along the chamfer cutting line 6 and forms a chamfer to complete the chamfer cutting of the corner point B.

[0056] It should be noted that before the stage 1 is rotated, it is determined whether the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system. If the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system, the coordinate value of the cutting point A after rotation is (0, 0).

[0057] Before the carrier 1 rotates, determine whether the corner point B is located on the X-axis or the Y-axis. If the corner point B is located on the X-axis, the preset angle is 0° or 180°; if the corner point B is located on the Y-axis, the preset angle is 90° or 270°. Specifically, when the corner point B is located in the positive direction of the X-axis, the preset angle is 0°, that is, chamfering can be performed at the corner point B without rotation. When the corner point B is located in the negative direction of the X-axis, the preset angle is 180°, that is, the carrier 1 is rotated 180° in the clockwise direction as indicated by the arrow in the figure, and the corner point B can be rotated to the positive direction of the X-axis. When the corner point B is located in the positive direction of the Y-axis, the preset angle is 90°, that is, the carrier 1 is rotated 90° in the clockwise direction as indicated by the arrow in the figure, and the corner point B can be rotated to the positive direction of the X-axis. If the corner point B is located in the negative direction of the Y axis, the preset angle is 270°, that is, the platform 1 is rotated 270° clockwise as indicated by the arrow in the figure to rotate the corner point B to the positive direction of the X axis.

[0058] Furthermore, if the corner point B is not on the X-axis or the Y-axis, the preset angle is calculated based on the coordinates of the corner point B before and after the rotation.

[0059] In this embodiment, the speed of movement of the carrier 1 along the Y-axis toward the cutting blade 3 is 0 mm / s to 400 mm / s. The speed of movement of the carrier 1 along the Y-axis toward the cutting blade 3 can be 50 mm / s, 100 mm / s, 150 mm / s, 200 mm / s, 250 mm / s, 300 mm / s, 350 mm / s, or 400 mm / s, etc., to ensure the stability of the chamfer cutting, avoid excessive cutting force caused by excessive chamfer cutting speed, thereby causing problems such as wafer 5 cracking, incomplete cutting, or uneven cutting edges, thereby improving the chamfer cutting quality of the wafer 5.

[0060] like Figure 4 As shown, this embodiment also proposes an electronic device, which includes at least one processor 402 and a memory 401 in communication with the at least one processor 402. The memory 401 stores a computer program that can be executed by the at least one processor 402, and the computer program is executed by the at least one processor 402 to enable the at least one processor 402 to perform the above-mentioned wafer chamfering cutting method. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or required herein.

[0061] This embodiment further provides a computer-readable storage medium on which a computer program is stored. When the program is executed by the processor 402 , the above-mentioned wafer chamfering cutting method is implemented.

[0062] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor 402, which can be a special purpose or general purpose programmable processor 402 that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0063] The program code for implementing the method itself can be written in any combination of one or more programming languages. Such program code can be provided to a processor 402 or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the program code is executed by the processor 402 or controller, the functions / operations specified in the flow chart and / or block diagram are implemented. The program code can be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0064] In the context of the present application, a machine-readable medium can be a tangible medium that can contain or store a program for use by an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0065] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0066] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or grid browser through which a user can interact with embodiments of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by digital data communication (e.g., a communication grid) in any form or medium. Examples of communication grids include: a local area network (LAN), a wide area network (WAN), the Internet, and a blockchain grid.

[0067] A computer system may include a client and a server. The client and server are generally remote from each other and typically interact through a communication grid. The client-server relationship is established by computer programs running on the respective computers and establishing a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, a host product within the cloud computing service system that addresses the management difficulties and poor business scalability of traditional physical hosts and VPS services ("Virtual Private Server," or simply "VPS"). The server may also be a server in a distributed system or a server integrated with blockchain.

[0068] The above embodiments merely illustrate the basic principles and features of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for chamfering a wafer, characterized in that: The steps include: The wafer (5) to be cut is placed and adsorbed on the carrier (1) of the dicing machine (400); A plane rectangular coordinate system is established with the rotation center of the carrier (1) as the origin; the coordinates of the corner point B to be cut off on the wafer (5) and the coordinates of the cutting point A on a side where the corner point B is located are obtained, and the cutting point A is located on the chamfer cutting line (6) of the corner point B; The carrier (1) is rotated at a preset angle so that the corner point B falls on the positive direction of the X axis of the plane rectangular coordinate system, and the chamfer cutting line (6) is parallel to the Y axis of the plane rectangular coordinate system; The coordinates of the rotating cutting point A are obtained according to the preset angle, and the carrier (1) moves along the X-axis direction toward the cutting tool (3) until the chamfer cutting line (6) is located directly below the cutting tool (3); The cutting tool (3) is lowered to a cutting height, and the carrier (1) moves along the Y axis toward the cutting tool (3) to complete the chamfering of the corner point B; Before the carrier (1) rotates, determining whether the corner point B is located on the X-axis or the Y-axis; If the corner point B is located on the X-axis, the preset angle is 0° or 180°; If the corner point B is located on the Y axis, the preset angle is 90° or 270°.

2. The wafer chamfering cutting method according to claim 1, wherein: If the corner point B is not on the X-axis or the Y-axis, the preset angle is calculated according to the coordinates of the corner point B before and after rotation.

3. The wafer chamfering cutting method according to claim 1, wherein: Before the carrier (1) rotates, determining whether the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system; If the coordinates of the cutting point A are located at the origin of the plane rectangular coordinate system, the coordinate value of the cutting point A after rotation is (0, 0).

4. The wafer chamfering cutting method according to claim 1, wherein: The coordinates of the corner point B and the cutting point A before rotation are acquired through a positioning camera on the dicing machine (400).

5. The wafer chamfering cutting method according to claim 1, wherein: The moving speed of the carrier (1) along the Y axis toward the cutting tool (3) is 0 mm / s to 400 mm / s.

6. An electronic device, characterized in that include: at least one processor (402); as well as A memory (401) communicatively connected to the at least one processor (402); wherein, The memory (401) stores a computer program that can be executed by the at least one processor (402), and the computer program is executed by the at least one processor (402) so that the at least one processor (402) can perform the wafer chamfering cutting method according to any one of claims 1 to 5.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the wafer chamfering method according to any one of claims 1 to 5 is implemented.

8. A dicing machine, characterized in that: The invention comprises a carrier (1), a first shaft, a second shaft, a slotting tool (2) and a cutting tool (3), wherein the carrier (1) is used to carry a wafer (5), the first shaft is located above the carrier (1) and the slotting tool (2) is provided at the output end of the first shaft, the second shaft is located above the carrier (1) and the cutting tool (3) is provided at the output end of the second shaft, and the cutting tool (3) performs chamfer cutting on the wafer (5) by the wafer chamfer cutting method according to any one of claims 1 to 5.

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