Wafer thinning device and wafer thinning method

Abstract

The present invention provides a wafer thinning device and a wafer thinning method thereof, which relate to the technical field of wafer thinning, and include a first electric turntable, a second electric turntable, a vacuum suction cup seat and a bearing block, wherein an electric telescopic rod is symmetrically installed on the bottom surface of the bearing block, and the output shaft of the electric telescopic rod is fixedly connected to the first electric turntable, and further include a first placement box and a second placement box arranged between the two bearing blocks, wherein a milling cutter is arranged in an annular array inside the first placement box, and a grinding block is arranged in an annular array inside the second placement box, and adjustment columns are symmetrically arranged on both sides of the first placement box, and clamping blocks are arranged above the adjustment columns, and positioning blocks are arranged on the surfaces of the first placement box and the second placement box. The present invention can keep the milling cutter and the grinding block moving synchronously, so that the milling cutter and the grinding block can directly perform wafer thinning after switching, without the need for centering adjustment again.

Description

Technical Field

[0001] The invention relates to the technical field of wafer thinning, and in particular to a wafer thinning device. Background Art

[0002] Wafer thinning technology is one of the key processes in the semiconductor manufacturing process. As semiconductor devices develop towards high performance, miniaturization, and lightweight, the requirements for wafer thickness are becoming more and more stringent. Especially in the fields of manufacturing ultra-thin packaging, power devices, and flexible electronics, the quality of the wafer thinning process directly affects the electrical performance, mechanical reliability, and production efficiency of the device.

[0003] Wafer thinning usually uses mechanical cutting to thin the material on the back of the wafer. The mechanical cutting method is usually divided into a rough grinding stage and a fine grinding stage. The switch between the rough grinding stage and the fine grinding stage usually requires shutdown operation, and re-centering operation is required after the switch is completed, which is not conducive to improving production efficiency. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a wafer thinning device, which enables the milling cutter and the grinding block to move synchronously so that the milling cutter and the grinding block can directly perform wafer thinning work after switching without the need for re-centering and adjustment.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0006] A wafer thinning device comprises a first electric turntable, a second electric turntable is installed in a ring array on the surface of the first electric turntable, a vacuum suction cup seat is installed inside each of the second electric turntables, a bearing block is symmetrically arranged above the first electric turntable, an electric telescopic rod is symmetrically installed on the bottom surface of the bearing block, and the output shaft of the electric telescopic rod is fixedly connected to the first electric turntable, and further comprises:

[0007] A first placement box and a second placement box are arranged between the two bearing blocks, wherein the first placement box has milling cutters arranged in an annular array inside, and the second placement box has grinding blocks arranged in an annular array inside, for synchronously adjusting the grinding radius of the milling cutter and the grinding block;

[0008] Adjustment columns are symmetrically arranged on both sides of the first placing box, and the milling cutter and the grinding block are switched by rotating the adjustment columns. Clamping blocks are arranged above the adjustment columns, and positioning blocks are arranged on the surfaces of the first placing box and the second placing box. The corresponding positioning blocks are clamped by the clamping blocks to maintain the vertical state of the first placing box and the second placing box, and at the same time, the first placing box or the second placing box located above is clamped to keep the grinding block or the milling cutter that is not in a working state in a stationary state.

[0009] Furthermore, the inner bottom surface of the first placing box is provided with adjustment grooves in a circular array, and the milling cutters are respectively located inside the corresponding adjustment grooves. The first installation grooves provided on the upper surface of the first placing box are provided with first slide rails installed in a circular array, and the interior of the first slide rails is slidably connected to a slide table, and a third motor is installed on the bottom surface of the slide table. A clamping head is installed on the end of the output shaft of the third motor, and the milling cutter is clamped inside the clamping head.

[0010] Furthermore, the inside of the adjustment groove is slidably connected to a fourth slider, the milling cutter is rotatably connected to the inside of the fourth slider through a first bearing, the bottom surface of the slide is fixedly connected to a connecting rod in an annular array, a connecting plate is provided below the third motor, and the milling cutter is rotatably connected to the first circular groove opened on the surface of the connecting plate through a second bearing.

[0011] Furthermore, the second placing box is rotatably connected to the surface of the first placing box through a third bearing, the grinding block is correspondingly slidably connected in a first slide groove opened in a circular array on the surface of the second placing box, a second motor is installed in a circular array on the upper surface of the second placing box, the ends of the output shaft of the second motor are fixedly connected with gears, the inner wall of the second placing box is fixedly connected with teeth in a circular array, and the gear is meshed with the second placing box through the teeth.

[0012] Furthermore, a connecting column is provided inside the second placement box, and the connecting column is rotatably connected to the second placement box and the first placement box respectively through two fifth bearings. A baffle is fixedly connected to the inner wall of the second placement box, and a shielding tube is fixedly connected to the inner top surface of the first placement box, and the shielding tube is fixedly connected to the baffle.

[0013] Furthermore, a constraint plate is fixedly connected to the interior of the second placement box, and the surface of the constraint plate is provided with constraint grooves in a ring array, and the interiors of the constraint grooves are slidably connected with constraint blocks, and the grinding block is threadedly connected to the surface of the constraint block.

[0014] Furthermore, the bottom surface of the constraint block is fixedly connected to a second sliding sleeve, the interior of the second sliding sleeve is slidably connected to a second sliding rod, the bottom end of the second sliding rod is fixedly connected to a second slider, the interior of the second slider is slidably connected to a first constraint rod, the interior of the shielding tube is movably connected to a first adjustment bucket, and the first constraint rod is fixedly connected to the first adjustment bucket.

[0015] Furthermore, a third slider is fixedly connected to the surface of the slide, a second constraint rod is slidably connected to the surface of the third slider, a second adjustment bucket is arranged below the first adjustment bucket, the second adjustment bucket is rotatably connected to the first adjustment bucket through a tapered roller bearing, the second constraint rod is fixedly connected to the second adjustment bucket, and the third slider is slidably connected to the second adjustment bucket.

[0016] Furthermore, the surface of the supporting block is fixedly connected with a sliding sleeve, the clamping block is slidably connected to the inside of the sliding sleeve, the inside of the sliding sleeve is slidably connected with a sliding magnet, an electromagnet is installed inside the sliding sleeve, the adjusting column is rotatably connected to the adjusting column through a fourth bearing, the bottom surface of the clamping block is fixedly connected with a guide rod, the bottom end of the guide rod is located in a guide groove opened on the surface of the adjusting column, a first motor is installed inside the supporting block, the output shaft of the first motor is fixedly connected to the adjusting column, and the surface of the first placement box is symmetrically fixedly connected with connecting blocks, and the connecting blocks are fixedly connected to the adjusting column.

[0017] Furthermore, a wafer thinning method specifically comprises the following steps:

[0018] Step 1: placing wafers of the same specifications in the corresponding second electric turntable, fixing the wafers by a vacuum suction cup, and positioning the wafers at the rotation center of the second electric turntable by an external centering system, so that both the first electric turntable and the second electric turntable rotate;

[0019] Step 2: The milling cutter is at a suitable height by controlling the extension and retraction of the electric telescopic rod, and the third motor is started to drive the milling cutter to rotate through the clamping head, and the second motor is controlled to rotate, and the milling cutter is expanded toward the wafer under the clamping constraint of the second placement box by the adjusting column through the clamping block, so that the milling cutter grinds the wafer along the edge of the wafer;

[0020] Step three, when the milling cutter grinds the wafer to the set position, stop the second motor, lift the second placement box through the electric telescopic rod, and control the first motor to drive the adjusting column to rotate. The rotation of the adjusting column makes the direction of the first placement box face downward, so that the clamping block clamps and fixes the first placement box through the positioning block, and control the second motor to rotate. The rotation of the second motor makes the second placement box drive the grinding block to continuously grind the wafer until the thickness of the wafer reaches the set value.

[0021] The above solution of the present invention includes at least the following beneficial effects:

[0022] The above solution of the present invention realizes the rapid switching between the rough grinding stage and the fine grinding stage by respectively carrying the milling cutter and the grinding block in the first placement box and the second placement box, reduces the downtime and centering adjustment time, and improves the wafer thinning efficiency;

[0023] Through the annular array milling cutter inside the first placement box and the annular array grinding block inside the second placement box, as well as the mechanism for synchronously adjusting the grinding radius, the coordinated operation of the rough grinding and fine grinding stages is achieved, the consistency of the grinding radius is ensured, and the processing accuracy of wafer thinning is improved;

[0024] The clamping action of the clamping block allows the grinding mechanism that is not in a working state to remain stationary, thereby reducing the corresponding energy consumption loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure provided by the present invention.

[0026] Figure 2 It is a schematic diagram of the sliding sleeve in the present invention.

[0027] Figure 3 It is a schematic diagram of the regulating column in the present invention.

[0028] Figure 4 It is a schematic diagram of the second motor in the present invention.

[0029] Figure 5 It is a schematic diagram of the first slide rail in the present invention.

[0030] Figure 6 It is a schematic diagram of the fourth sliding block in the present invention.

[0031] Figure 7 It is a schematic diagram of the second sliding block in the present invention.

[0032] Figure 8 It is a schematic diagram of the third sliding block in the present invention.

[0033] In the figure: 101, first electric turntable; 102, second electric turntable; 103, vacuum suction cup seat; 104, bearing block; 105, electric telescopic rod;

[0034] 201, first placement box; 202, second placement box; 203, grinding block; 204, constraint plate; 205, connection block; 206, positioning block; 207, adjustment column; 208, clamping block; 209, sliding sleeve; 210, electromagnet; 211, sliding magnetic block; 212, guide rod; 214, constraint groove; 215, constraint block; 216, second sliding sleeve; 217, second sliding rod; 218, second sliding block; 219, first constraint rod; 220, first Adjusting bucket; 221, second adjusting bucket; 222, first motor; 223, second restraining rod; 224, third slider; 225, connecting column; 226, second motor; 227, gear; 228, teeth; 229, baffle; 230, shielding cylinder; 231, first slide rail; 232, slide table; 233, third motor; 234, clamping head; 235, adjusting slot; 236, fourth slider; 237, milling cutter; 238, connecting plate; 239, connecting rod. DETAILED DESCRIPTION

[0035] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0036] like Figures 1 to 8 As shown, an embodiment of the present invention provides a wafer thinning device, comprising a first electric turntable 101, a second electric turntable 102 is installed in a ring array on the surface of the first electric turntable 101, a vacuum suction cup seat 103 is installed inside each of the second electric turntables 102, a bearing block 104 is symmetrically arranged above the first electric turntable 101, an electric telescopic rod 105 is symmetrically installed on the bottom surface of the bearing block 104, and the output shaft of the electric telescopic rod 105 is fixedly connected to the first electric turntable 101, and further comprising:

[0037] A first placement box 201 and a second placement box 202 are arranged between the two bearing blocks 104. The first placement box 201 has a milling cutter 237 arranged in an annular array inside, and the second placement box 202 has a grinding block 203 arranged in an annular array inside, which are used to synchronously adjust the grinding radius of the milling cutter 237 and the grinding block 203.

[0038] Adjustment columns 207 are symmetrically arranged on both sides of the first placement box 201. The milling cutter 237 and the grinding block 203 are switched by rotating the adjustment columns 207. Clamping blocks 208 are arranged above the adjustment columns 207. Positioning blocks 206 are arranged on the surfaces of the first placement box 201 and the second placement box 202. The corresponding positioning blocks 206 are clamped by the clamping blocks 208 to maintain the vertical state of the first placement box 201 and the second placement box 202. At the same time, the first placement box 201 or the second placement box 202 located above is clamped to keep the grinding block 203 or the milling cutter 237 that is not in a working state in a stationary state.

[0039] In the embodiment of the present invention, when thinning the wafer, the wafer is placed inside the second electric turntable 102. After the wafer is centered, the vacuum suction cup 103 is used to fix the wafer by vacuum suction. At the beginning of the thinning work, the milling cutter 237 is located outside the second electric turntable 102. The first electric turntable 101 is controlled to rotate so that the three second electric turntables 102 start to rotate around the central axis of the first electric turntable 101. The rotation of the second electric turntable 102 causes the wafer to rotate, so that the milling cutter 237 can grind the wafer.

[0040] After the three milling cutters 237 are lowered to a suitable height by the electric telescopic rod 105, the milling cutters 237 are gradually expanded and moved toward the wafer, and the milling cutters 237 are rotated, so that the milling cutters 237 start milling the wafer to remove the material on the back of the wafer. This process requires the use of a grinding fluid spray device to reduce the impact of debris and heat generated during the grinding process;

[0041] The milling cutter 237 moves up to the central axis position of the wafer so that the back surface of the wafer is evenly milled. When the milling cutter 237 mills the wafer to the set thickness, the milling cutter 237 stops rotating, and the electric telescopic rod 105 lifts the first placement box 201 as a whole, and the first placement box 201 and the second placement box 202 are turned over, so that the grinding block 203 faces downward. Through the linkage adjustment of the grinding block 203 and the milling cutter 237, the grinding block 203 can directly participate in the grinding of the wafer without resetting, thereby improving the efficiency of the wafer thinning work of the device;

[0042] By adjusting the clamping cooperation between the column 207 and the clamping block 208, the first placement box 201 or the second placement box 202 which is not in the thinning operation is kept stationary to reduce energy loss;

[0043] like Figure 6As shown, the inner bottom surface of the first placement box 201 is provided with adjustment grooves 235 in a circular array, and the milling cutters 237 are respectively located inside the corresponding adjustment grooves 235. The first installation groove opened on the upper surface of the first placement box 201 is provided with a first slide rail 231 in a circular array. The interior of the first slide rail 231 is slidably connected to a slide table 232. The bottom surface of the slide table 232 is provided with a third motor 233. A clamping head 234 is provided at the end of the output shaft of the third motor 233, and the milling cutter 237 is clamped inside the clamping head 234.

[0044] In an embodiment of the present invention, the three milling cutters 237 are synchronously expanded in the direction of the three wafers by adjusting the rotation of the slot 235 so that the thinning efficiency of the three wafers is kept consistent. The slide 232 slides inside the first slide rail 231 so that the third motor 233 moves following the movement of the milling cutter 237, thereby causing the milling cutter 237 in the clamping head 234 to rotate during the movement, thereby completing the milling action.

[0045] like Figure 6 As shown, the inside of the adjustment groove 235 is slidably connected to the fourth slider 236, the milling cutter 237 is rotatably connected to the inside of the fourth slider 236 through the first bearing, the bottom surface of the slide 232 is fixedly connected to the connecting rod 239 in a circular array, and a connecting plate 238 is arranged under the third motor 233, and the milling cutter 237 is rotatably connected to the first circular groove opened on the surface of the connecting plate 238 through the second bearing.

[0046] In the embodiment of the present invention, the friction resistance between the milling cutter 237 and the first placement box 201 is reduced by the arrangement of the fourth slider 236, thereby reducing the vibration of the milling cutter 237. The vibration of the third motor 233 during operation is further reduced by the connection rod 239 and the connection plate 238 through the arrangement of the connecting plate 238 and the milling cutter 237.

[0047] In another preferred embodiment of the present invention, the connecting rod 239 is configured as an electric push rod. When the first placement box 201 rotates to the upper part and is clamped by the adjusting column 207 and the corresponding clamping block 208, the connecting rod 239 increases the friction between the connecting plate 238 and the inner wall of the first placement box 201, so that the position of the milling cutter 237 remains stable, thereby increasing the centrifugal force generated when the second placement box 202 rotates.

[0048] like Figure 3 , Figure 4 , Figure 5 , Figure 6As shown, the second placing box 202 is rotatably connected to the surface of the first placing box 201 through a third bearing, and the grinding block 203 is correspondingly slidably connected in a first slide groove opened in a ring array on the surface of the second placing box 202. The upper surface of the second placing box 202 is installed with a second motor 226 in a ring array, and the ends of the output shaft of the second motor 226 are fixedly connected with gears 227. The inner wall of the second placing box 202 is fixedly connected with teeth 228 in a ring array, and the gear 227 is meshed with the second placing box 202 through the teeth 228.

[0049] In the embodiment of the present invention, the grinding blocks 203 of the annular array and the second placement box 202 form a grinding wheel, and the radius of the grinding wheel is adjusted by sliding the grinding blocks 203 in the slide groove on the surface of the second placement box 202, and then the moving distance of the grinding blocks 203 in the slide groove on the surface of the second placement box 202 is adjusted according to the different specifications of the wafers, so that the grinding area of ​​the grinding blocks 203 is adjusted;

[0050] When the second placement box 202 is clamped and fixed between the clamping block 208 and the corresponding positioning block 206, the rotation of the second motor 226, under the action of the teeth 228 and the gear 227, causes the first placement box 201 to rotate relative to the first electric turntable 101, so that the milling cutter 237 can expand through the adjustment slot 235;

[0051] When the first placement box 201 is clamped and fixed between the clamping block 208 and the corresponding positioning block 206, the rotation of the second motor 226, under the action of the teeth 228 and the gear 227, causes the second placement box 202 to drive the grinding block 203 to rotate, so as to complete the grinding work of the grinding block 203.

[0052] like Figure 4 , Figure 5 , Figure 7 As shown, a connecting column 225 is provided inside the second placement box 202, and the connecting column 225 is rotatably connected to the second placement box 202 and the first placement box 201 respectively through two fifth bearings, a baffle 229 is fixedly connected to the inner wall of the second placement box 202, and a shielding tube 230 is fixedly connected to the inner top surface of the first placement box 201, and the shielding tube 230 is fixedly connected to the baffle 229.

[0053] In the embodiment of the present invention, the connection column 225 is provided to make the rotation between the first placement box 201 and the second placement box 202 more stable, and the cooperation between the baffle 229 and the shielding tube 230 prevents debris generated during the thinning process from adhering to the surface of the second motor 226, the gear 227 and the teeth 228, thereby maintaining the rotation of the first placement box 201 and the second placement box 202 stable.

[0054] like Figure 4 , Figure 5 and Figure 7 As shown, a constraint plate 204 is fixedly connected to the interior of the second placement box 202, and a constraint groove 214 is provided on the surface of the constraint plate 204 in a ring array. Constraint blocks 215 are slidably connected to the interior of the constraint grooves 214, and the grinding block 203 is threadedly connected to the surface of the constraint block 215.

[0055] In the embodiment of the present invention, the constraint plate 204 is arranged to prevent the grinding block 203 from rubbing against the inner wall of the second placement box 202 during the grinding process. At the same time, the friction between the constraint block 215 and the constraint plate 204 improves the stability of the grinding block 203 during the grinding process.

[0056] like Figure 7 As shown, the bottom surface of the constraint block 215 is fixedly connected with the second sliding sleeve 216, the second sliding sleeve 216 is internally slidably connected with the second sliding rod 217, the bottom end of the second sliding rod 217 is fixedly connected with the second slider 218, the second slider 218 is internally slidably connected with the first constraint rod 219, the shielding tube 230 is internally movably connected with the first adjusting bucket 220, and the first constraint rod 219 is fixedly connected to the first adjusting bucket 220.

[0057] The surface of the slide 232 is fixedly connected with the third slider 224, and the surface of the third slider 224 is slidably connected with the second constraint rod 223. A second adjusting bucket 221 is arranged below the first adjusting bucket 220, and the second adjusting bucket 221 is rotatably connected to the first adjusting bucket 220 through a tapered roller bearing. The second constraint rod 223 is fixedly connected to the second adjusting bucket 221, and the third slider 224 is slidably connected to the second adjusting bucket 221.

[0058] In an embodiment of the present invention, when the milling cutter 237 moves relatively inside the adjustment groove 235, the slide 232 drives the third slider 224 to move on the inner wall of the second adjustment bucket 221 along the surface of the second constraint rod 223. The movement of the third slider 224 causes the height of the second adjustment bucket 221 to change, thereby changing the height of the first adjustment bucket 220. The change in the height of the first adjustment bucket 220 causes the second slider 218 on the surface of the first constraint rod 219 to move. When moving, the second slider 218 drives the second slide bar 217 to slide inside the second slide sleeve 216, while causing the constraint block 215 to slide inside the constraint groove 214, thereby causing the grinding block 203 on the surface of the constraint block 215 to move in the slide groove on the surface of the second placement box 202, thereby making the grinding radius of the grinding block 203 consistent with the grinding radius of the milling cutter 237, avoiding secondary adjustment, which is beneficial to improving the thinning efficiency of the wafer.

[0059] like Figure 1 , Figure 2 , Figure 3As shown, the surface of the supporting block 104 is fixedly connected with a sliding sleeve 209, the clamping block 208 is slidably connected to the inside of the sliding sleeve 209, the sliding sleeve 209 is slidably connected with a sliding magnetic block 211, the sliding sleeve 209 is installed with an electromagnet 210, the adjusting column 207 is rotatably connected to the adjusting column 207 through a fourth bearing, the bottom surface of the clamping block 208 is fixedly connected with a guide rod 212, the bottom end of the guide rod 212 is located in a guide groove provided on the surface of the adjusting column 207, the inside of the supporting block 104 is installed with a first motor 222, the output shaft of the first motor 222 is fixedly connected to the adjusting column 207, the surface of the first placement box 201 is symmetrically fixedly connected with a connecting block 205, and the connecting block 205 is fixedly connected to the adjusting column 207.

[0060] In the embodiment of the present invention, the operation of the first motor 222 causes the adjusting column 207 to drive the first placement box 201 to rotate through the connecting block 205. During this process, the adjusting column 207 cooperates with the guide groove on the surface and the guide rod 212 to make the clamping block 208 first shrink toward the inside of the sliding sleeve 209, and then extend toward the outside of the sliding sleeve 209, until the adjusting column 207 squeezes the corresponding positioning block 206 again.

[0061] When the first motor 222 is running, the magnetic force between the electromagnet 210 and the sliding magnet 211 is an attractive force, so that the clamping block 208 moves inside the sliding sleeve 209. When the first motor 222 stops running, the magnetic force between the electromagnet 210 and the sliding magnet 211 is a repulsive force, so that the sliding magnet 211 compresses the air between the clamping block 208 and the sliding magnet 211 inside the sliding sleeve 209 to make the clamping block 208 and the corresponding positioning block 206 fit tightly, so that the first placing box 201 and the second placing box 202 remain stable when the second motor 226 is running, and at the same time, the first placing box 201 and the second placing box 202 remain in a vertical state to ensure the thinning effect of the milling cutter 237 and the grinding block 203.

[0062] A wafer thinning method comprises the following steps:

[0063] Step 1: Place wafers of the same specification in the corresponding second electric turntable 102, fix the wafers by the vacuum chuck 103, and make the wafers be located at the rotation center of the second electric turntable 102 by the external centering system, so that both the first electric turntable 101 and the second electric turntable 102 rotate;

[0064] Step 2: The milling cutter 237 is at a suitable height by controlling the extension and retraction of the electric telescopic rod 105, and the third motor 233 is started to drive the milling cutter 237 to rotate through the clamping head 234, and the second motor 226 is controlled to rotate, and the milling cutter 237 is expanded toward the wafer under the clamping constraint of the second placement box 202 by the adjusting column 207 through the clamping block 208, so that the milling cutter 237 grinds the wafer along the edge of the wafer;

[0065] Step three, when the milling cutter 237 grinds the wafer to the set position, the second motor 226 stops running, the second placement box 202 is lifted by the electric telescopic rod 105, and the first motor 222 is controlled to drive the adjusting column 207 to rotate. The rotation of the adjusting column 207 makes the first placement box 201 face downward, so that the clamping block 208 clamps and fixes the first placement box 201 through the positioning block 206, and the second motor 226 is controlled to rotate. The rotation of the second motor 226 makes the second placement box 202 drive the grinding block 203 to continuously grind the wafer until the thickness of the wafer reaches the set value.

[0066] It should be noted that the usage and installation methods of the first electric turntable 101, the second electric turntable 102, the vacuum suction cup seat 103 and the clamping head 234, as well as the external centering system and the grinding fluid spraying system are all well known in the prior art and will not be elaborated here.

[0067] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer thinning device, comprising a first electric turntable, a second electric turntable is installed in a circular array on the surface of the first electric turntable, a vacuum suction cup seat is installed inside each of the second electric turntables, a bearing block is symmetrically arranged above the first electric turntable, an electric telescopic rod is symmetrically installed on the bottom surface of the bearing block, and the output shaft of the electric telescopic rod is fixedly connected to the first electric turntable, characterized in that: Also includes: A first placement box and a second placement box are arranged between the two bearing blocks, wherein the first placement box has milling cutters arranged in an annular array inside, and the second placement box has grinding blocks arranged in an annular array inside, for synchronously adjusting the grinding radius of the milling cutter and the grinding block; Adjustment columns are symmetrically arranged on both sides of the first placement box, and the milling cutter and the grinding block are switched by rotating the adjustment columns. Clamping blocks are arranged above the adjustment columns, and positioning blocks are arranged on the surfaces of the first placement box and the second placement box. The corresponding positioning blocks are clamped by the clamping blocks to keep the first placement box and the second placement box in a vertical state, and the first placement box or the second placement box located above is clamped at the same time to keep the grinding block or the milling cutter that is not in a working state in a static state; The inner bottom surface of the first placement box is provided with adjustment grooves in a circular array, and the milling cutters are respectively located inside the corresponding adjustment grooves. The first installation grooves provided on the upper surface of the first placement box are provided with first slide rails installed in a circular array, and the interior of the first slide rail is slidably connected to a slide table, and a third motor is installed on the bottom surface of the slide table. A clamping head is installed on the end of the output shaft of the third motor, and the milling cutter is clamped inside the clamping head.

2. The wafer thinning device according to claim 1, characterized in that: The inside of the adjustment groove is slidably connected to a fourth slider, the milling cutter is rotatably connected to the inside of the fourth slider via a first bearing, the bottom surface of the slide is fixedly connected to a connecting rod in a circular array, a connecting plate is provided below the third motor, and the milling cutter is rotatably connected to a first circular groove opened on the surface of the connecting plate via a second bearing.

3. The wafer thinning device according to claim 2, characterized in that: The second placement box is rotatably connected to the surface of the first placement box via a third bearing, the grinding block is correspondingly slidably connected in a first slide groove opened in a circular array on the surface of the second placement box, a second motor is installed in a circular array on the upper surface of the second placement box, the ends of the output shaft of the second motor are fixedly connected with gears, the inner wall of the second placement box is fixedly connected with teeth in a circular array, and the gear is meshed and connected with the second placement box through the teeth.

4. The wafer thinning device according to claim 3, characterized in that: A connecting column is provided inside the second placement box, and the connecting column is rotatably connected to the second placement box and the first placement box respectively through two fifth bearings. A baffle is fixedly connected to the inner wall of the second placement box, and a shielding tube is fixedly connected to the inner top surface of the first placement box, and the shielding tube is fixedly connected to the baffle.

5. The wafer thinning device according to claim 4, characterized in that: A restraining plate is fixedly connected inside the second placement box, and restraining grooves are provided on the surface of the restraining plate in an annular array. Restraining blocks are slidably connected inside the restraining grooves, and the grinding blocks are threadedly connected to the surface of the restraining blocks.

6. The wafer thinning device according to claim 5, characterized in that: The bottom surface of the constraint block is fixedly connected with a second sliding sleeve, the interior of the second sliding sleeve is slidably connected with a second sliding rod, the bottom end of the second sliding rod is fixedly connected with a second sliding block, the interior of the second sliding block is slidably connected with a first constraint rod, the interior of the shielding tube is movably connected with a first adjusting bucket, and the first constraint rods are fixedly connected to the first adjusting bucket.

7. The wafer thinning device according to claim 6, characterized in that: The surface of the slide is fixedly connected with a third slider, the surface of the third slider is slidably connected with a second constraint rod, a second adjustment bucket is arranged below the first adjustment bucket, the second adjustment bucket is rotatably connected to the first adjustment bucket through a tapered roller bearing, the second constraint rod is fixedly connected to the second adjustment bucket, and the third slider is slidably connected to the second adjustment bucket.

8. The wafer thinning device according to claim 7, characterized in that: The surface of the supporting block is fixedly connected with a sliding sleeve, the clamping block is slidably connected to the inside of the sliding sleeve, the inside of the sliding sleeve is slidably connected with a sliding magnetic block, an electromagnet is installed inside the sliding sleeve, the adjusting column is rotatably connected to the adjusting column through a fourth bearing, the bottom surface of the clamping block is fixedly connected with a guide rod, the bottom end of the guide rod is located in a guide groove opened on the surface of the adjusting column, a first motor is installed inside the supporting block, the output shaft of the first motor is fixedly connected to the adjusting column, and the surface of the first placement box is symmetrically fixedly connected with connecting blocks, and the connecting blocks are fixedly connected to the adjusting column.

9. A wafer thinning method, applied to the device as claimed in claim 8, comprising the following steps: Step 1: placing wafers of the same specifications in the corresponding second electric turntable, fixing the wafers by a vacuum suction cup, and positioning the wafers at the rotation center of the second electric turntable by an external centering system, so that both the first electric turntable and the second electric turntable rotate; Step 2: The milling cutter is at a suitable height by controlling the extension and retraction of the electric telescopic rod, and the third motor is started to drive the milling cutter to rotate through the clamping head, and the second motor is controlled to rotate, and the milling cutter is expanded toward the wafer under the clamping constraint of the second placement box by the adjusting column through the clamping block, so that the milling cutter grinds the wafer along the edge of the wafer; Step three, when the milling cutter grinds the wafer to the set position, stop the second motor, lift the second placement box through the electric telescopic rod, and control the first motor to drive the adjusting column to rotate. The rotation of the adjusting column makes the direction of the first placement box face downward, so that the clamping block clamps and fixes the first placement box through the positioning block, and control the second motor to rotate. The rotation of the second motor makes the second placement box drive the grinding block to continuously grind the wafer until the thickness of the wafer reaches the set value.

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