Hole and hole chamfer machining method

Abstract

The invention discloses a hole and a hole chamfer machining method, and belongs to the technical field of glass machining. According to the scheme, the multiple focuses are generated through the optical splitter, the holes and the hole chamfer contour lines are processed in the glass in parallel through the multiple focuses, then the holes and the hole chamfers are shown through chemical liquid polishing and splitting treatment, one-time forming is achieved, the edge is smooth, the polishing step needed by subsequent processing is omitted, the processing time is shortened, the processing cost is reduced, and the production efficiency is improved. The problems of stress concentration and high quality control difficulty caused by direct treatment of holes and chamfers on the surface of the glass in the prior art are avoided; by accurately controlling laser parameters, micron-level machining precision is achieved, smooth and neat edges of holes and chamfers are guaranteed, the problem that chamfering machining is limited is solved, smooth double-sided chamfers can be manufactured in small apertures, heat generated in the machining process is guaranteed to be minimized, heat affected zones are reduced, and machining efficiency is improved. And the possibility that the glass is broken due to thermal stress is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of glass processing, and in particular to a hole and a hole chamfering processing method. Background Art

[0002] At present, many cover materials choose transparent brittle materials such as thin glass as the main material. Because of its scratch resistance, excellent light transmittance, outstanding aesthetics, chemical stability and easy cleaning, it has been widely used in smartphones, wearable devices and other electronic products.

[0003] Holes are usually designed in the cover for considerations such as heat dissipation, audio transmission, sensor functions, connection and charging interfaces, and design aesthetics. Traditional cover hole processing methods, such as CNC processing, side wall polishing, and traditional laser cutting, have many technical defects in the processing of transparent brittle materials:

[0004] Chamfering is limited: Traditional hole processing technology is difficult to achieve chamfering of small hole designs, and usually can only do no internal chamfering or only single-sided chamfering.

[0005] Difficult quality control: Different stages of hole processing may lead to uneven stress distribution, burrs, microcracks or other structural weaknesses in the material, increasing the risk of fragmentation, affecting the strength and safety of the final product, making quality control complex and difficult. In some processing processes, such as laser cutting, the heat-affected zone may cause the material strength to decrease, increasing the risk of rupture in subsequent use.

[0006] Long processing time and high processing cost: Hole processing often requires multiple steps, such as CNC cutting, polishing and laser cutting. Each step requires separate equipment setup and operation, which increases operational complexity and maintenance costs, and increases the risk of failure. Each process change requires repositioning and adjustment of the material to be processed, which may introduce positioning errors, reduce overall processing efficiency, extend production cycles and increase processing costs. Multi-stage hole processing is usually accompanied by higher energy consumption, further increasing production costs.

[0007] These defects not only affect the overall quality and material utilization of the product, but may also affect the strength and safety of the final product. Therefore, it is particularly important to seek more advanced processing technologies to overcome these defects. Summary of the invention

[0008] The technical problem to be solved by the present invention is: to provide a thin glass edge processing method in view of the above-mentioned defects of the prior art.

[0009] To achieve the above object, the present invention provides a method for processing the edge of thin glass, the method being used to process a hole on thin glass and to process a chamfer on the edge of the hole, the method comprising the following steps:

[0010] Step S1, making a design file of a hole and a hole chamfer, and obtaining a phase drawing according to the design file, wherein the design file includes processing path information, the phase drawing includes line information of the hole and the hole chamfer, and the hole chamfer includes double-sided chamfer and single-sided chamfer;

[0011] Step S2, machining a hole and an outline of a hole chamfer in the thin glass according to the design file and the phase drawing, wherein the hole and the outline of the hole chamfer are connected to the outer surface of the thin glass;

[0012] Step S3, chemical liquid polishing is performed on the thin glass;

[0013] Step S4, performing a cracking process on the holes processed on the thin glass.

[0014] Preferably, the specific method of step S2 is: according to the design file and the phase drawing, use a beam splitter to divide the laser beam into multiple branches, adjust the position of each branch focus through a dynamic focusing system, so that each focus is processed according to a predetermined path, and set laser parameters according to the type and thickness of the thin glass, and process the contour lines of holes and chamfers in one rotation in the thin glass; the laser parameters include laser power, laser energy, speed, frequency, focusing depth, and point spacing.

[0015] Preferably, in step S2, if the hole chamfer is a double-sided chamfer, after the hole and the hole chamfer are processed, the laser cutting lens light group is flipped 180 degrees and reversely rotated to form 5 areas to be split.

[0016] Preferably, in step S2, the parameter settings of laser energy and speed need to meet the following conditions: the heat generated by the laser on the sub-surface is sufficient to melt the thin glass without damaging the surface of the thin glass.

[0017] Preferably, the chemical liquid used in the chemical liquid polishing is an acidic solution or an alkaline solution, and the liquid polishing parameters include concentration, temperature and time.

[0018] Preferably, after step S3, the method further includes:

[0019] The thin glass product is cleaned and dried.

[0020] Preferably, before step S3, the method further includes:

[0021] According to the processing drawing requirements, the thin glass is subjected to other processing steps before the chemical strengthening step.

[0022] The present invention has the following beneficial effects: the embodiment of the present invention generates multiple focal points through a beam splitter, and the holes and hole chamfer contours are processed in the glass in parallel with multiple focal points, and then the holes and hole chamfers are revealed through chemical liquid polishing and fragmentation treatment, forming in one step, and the edges are smooth, reducing the polishing steps required for subsequent processing, shortening the processing time, reducing the processing cost, and avoiding the stress concentration and quality control difficulties caused by traditional hole and chamfer treatment directly on the glass surface, effectively reducing the risk of breakage; by accurately controlling laser processing parameters such as laser power, focus and scanning speed, micron-level processing accuracy is achieved, ensuring that the holes and hole chamfer edges are smooth and neat, solving the problem of limited chamfer processing, so that smooth double-sided chamfers can be produced in small apertures, and ensuring that the heat generated during the processing is minimized, reducing the heat-affected zone, and reducing the possibility of glass breakage due to thermal stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0024] Figure 1 A schematic diagram of the steps of a hole and a hole chamfering processing method provided in an embodiment of the present invention.

[0025] Figure 2 Schematic diagram of single-sided chamfer and double-sided chamfer splits.

[0026] Figure 3 Schematic diagram of the double-sided chamfer contour processing principle.

[0027] Figure 4 This is a schematic diagram of the double-sided chamfer contour line.

[0028] Figure 5 Shown is a schematic diagram of the front effect of a hole and a hole chamfering processing method according to an embodiment of the present invention.

[0029] Figure 6 It is a schematic diagram of the side effect of the double-sided hole and the hole chamfering processing method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Thin glass is widely used in electronic products, architectural decoration, and household items due to its excellent light transmittance and aesthetics. However, the traditional hole processing method has poor edge strength and is usually unable to produce fine chamfers. Therefore, a new technology is needed to improve the processing quality of thin glass holes and hole chamfering.

[0032] The core technology of the solution of the present invention is the laser hole process, which uses high-precision laser equipment to process transparent brittle materials and process holes and hole chamfers inside thin glass. The innovation of this method is that traditional technology cannot achieve fine chamfering of small holes, usually no internal chamfering or only single-sided chamfering, and the chamfering is directly processed on the outer edge of the hole; while this technology controls the laser processing parameters to process the contour lines of the hole and the hole chamfer inside the thin glass, so that a delicate chamfering effect can be produced within a small aperture, and effectively disperses stress, reducing the risk of cracking in the area around the hole, thereby improving the problem of insufficient material strength caused by traditional CNC processing and traditional laser processing.

[0033] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings of the specification. It should be understood that the embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0034] The present invention is applicable to processing holes and hole chamfers on thin glass, wherein the thin glass is glass with a thickness of less than 1 mm. In addition, the scheme of the present invention is also applicable to processing holes and hole chamfers on other transparent and brittle materials other than thin glass.

[0035] like Figure 1 As shown, an embodiment of the present invention provides a method for processing holes and hole chamfering, the method comprising the following steps:

[0036] Step S1, making a design file of holes and hole chamfers, and obtaining a phase drawing according to the design file, wherein the design file includes processing path information, and the phase drawing includes line information of the holes and hole chamfers.

[0037] In an embodiment of the present invention, the design file is uploaded to a control system of a laser device, and the phase drawing is exported from the control system.

[0038] In an embodiment of the present invention, a chamfered geometric model is designed by CAD (Computer-Aided Design) software to generate a CAD design file, and then based on the CAD design file, a CAM (Computer-Aided Manufacturing) software is used to generate a CAM design file including processing path information.

[0039] In the embodiment of the present invention, a high-power laser is used to precisely control the glass. The contour lines of holes and hole chamfers are processed inside the glass by adjusting the focal position, energy distribution control, shape and angle of the laser beam. By precisely adjusting the angle and depth of the hole chamfer, a smooth transition is ensured on the sub-surface, thereby achieving personalized hole and hole chamfer processing for glass of different thicknesses and types.

[0040] In the embodiment of the present invention, the hole chamfer includes single-side chamfer and double-side chamfer.

[0041] In an embodiment of the present invention, the selected laser equipment is an ultrafast laser suitable for thin glass materials, such as an infrared femtosecond laser and an infrared picosecond laser, to ensure that high-efficiency chamfering processing can be achieved. In addition, in order to improve processing efficiency, it is preferred to use a laser with a spatial light modulator or a diffractive optical element. The laser is equipped with necessary auxiliary equipment, such as an automatic loading and unloading system, a cooling system and a safety protection device. Use CAD / CAM and other software for product design and processing path planning to ensure the compatibility of the laser system with the design software. Configure the control system of the laser equipment to ensure that it can receive processing instructions generated by the software. Before processing, check all parts of the laser equipment, including the laser head, optical path system, power supply and cooling system, to ensure that the equipment is in good condition, confirm that the safety protection device of the laser equipment is working properly, and fix the thin glass to be processed on the workbench to ensure that it is stable and does not move. Vacuum adsorption or mechanical clamps can be used to fix the thin glass product.

[0042] Step S2, according to the design file and the phase drawing, processing the outline of the hole and the hole chamfer in the thin glass, and the outline of the hole and the hole chamfer is connected to the outer surface of the thin glass.

[0043] In the embodiment of the present invention, in the step S2, the specific method of the step S2 is: according to the design file and the phase drawing, use a beam splitter to divide the laser beam into multiple branches, adjust the position of each branch focus through a dynamic focusing system, so that each focus is processed according to a predetermined path, and set the laser parameters according to the type and thickness of the thin glass, and process the contour lines of holes and chamfers in one rotation in the thin glass, and the contour lines of holes and chamfers are connected to the outer surface of the thin glass; the laser parameters include laser power, laser energy, speed, frequency, focus depth, and point spacing. In the embodiment of the present invention, the beam splitter can select a spatial light modulator or a diffractive optical element, and by using a multi-focus parallel processing strategy, the purpose of one-time processing and forming, improving processing efficiency, and reducing the heat-affected zone can be achieved.

[0044] In an embodiment of the present invention, the hole is a circular hole with an aperture of 0.5mm-0.8mm, and the lateral projection of the hole chamfer is 0.1mm-0.15mm. The number of laser focal points is preferably 60, the number of upper and lower chamfer focal points is about 20 each, the spacing between the focal points is about 5 microns, the number of body position focal points is about 20, and the spacing between the focal points is about 17 microns. A larger number of focal points can better control the shape of the chamfer in the hole and form a chamfer contour line that is closer to the drawing. When drilling, the laser pulse width used is 3 picoseconds, the pulse train is 4 to 8, the single pulse energy is 20 to 36uJ, the drilling speed is 10mm / s, the point spacing is 2um, and the frequency is 100Khz; the laser beam goes clockwise in accordance with the drawing route, and then goes counterclockwise to complete the hole and hole chamfering processing.

[0045] In the embodiment of the present invention, in order to facilitate the breaking, the contour lines of the hole and the chamfer need to be connected to the outer surface of the thin glass.

[0046] like Figure 2 The figure shows the schematic diagram of single-sided chamfer and double-sided chamfer lobes. Figure 2 The single-sided chamfer in the chamfer can be easily split in the direction of the chamfer. Figure 2 The double-sided chamfer in the process, whether the split is facing upward or downward, will be stuck at the junction of the chamfer and the hole. Therefore, in the embodiment of the present invention, in the step S2, if the hole chamfer is a double-sided chamfer, after the hole and the hole chamfer are processed, the laser cutting lens light group is turned 180 degrees and reversely rotated to form 5 areas to be split. Specifically, when forming Figure 2 After chamfering the two sides, follow Figure 3 The principle is to flip the laser cutting lens group 180 degrees and perform reverse rotation processing to form a Figure 4There are five areas to be split, among which the upper left corner, upper right corner, lower left corner and right small corner are four cone-shaped split areas, the irregular area in the middle is the main area of ​​the hole, and the two adjacent areas are separated by a contour line.

[0047] In the embodiment of the present invention, in step S2, the parameter settings of the laser energy and speed need to meet the following conditions: the heat generated by the laser on the sub-surface is sufficient to melt the thin glass without damaging the surface of the thin glass. By using appropriate laser energy and cutting speed, the heat generated by the laser on the sub-surface is sufficient to melt the material and form the desired chamfer shape while avoiding excessive heat damage to the surface.

[0048] In actual implementation, multiple trial cuts are required to determine the best parameter combination. During the laser chamfering process, the real-time monitoring system of the processing equipment is used to observe possible problems during the processing, such as laser focus offset, material deformation, etc., and the processing is immediately suspended for adjustment if necessary. After the holes and hole chamfering are completed, production samples are taken, and the shape and edge quality of the holes and hole chamfers of the products are observed through slicing and microscopy to observe whether there are burrs, uneven cutting, incorrect hole chamfering positions, and microcracks, and adjust the laser parameters according to specific problems. By repeatedly adjusting the laser parameters, the best hole and hole chamfering effect and the minimum thermal impact can be achieved. In addition, after processing, strict quality inspections are required, including surface finish, edge strength and microcrack inspections to ensure that the processed glass meets quality standards.

[0049] In the embodiments of the present invention, in practical applications, by optimizing the processing steps, the equipment operation time and energy consumption are reduced, thereby reducing the overall production cost; by optimizing the cutting path and strategy, the raw materials are utilized to the maximum extent and the waste generation is reduced.

[0050] Figure 5 It is a schematic diagram showing the front effect of the hole and the hole chamfering processing method according to the embodiment of the present invention. Figure 6 The figure shows a schematic diagram of the side effect of the hole and hole chamfering processing method according to an embodiment of the present invention. After the hole processing in step S2, only the outline of the hole and the hole chamfer is formed inside the glass, and the glass in the hole and hole chamfer area is still connected with other areas, and only falls off after being cracked to form a hole.

[0051] Laser equipment generally requires only one operator to monitor, while CNC equipment may require more manual intervention for setting and debugging. Therefore, the hole and hole chamfering processing method of the embodiment of the present invention can significantly reduce labor costs compared to traditional CNC processing. In addition, during the chamfering process using laser equipment, an automatic loading and unloading system can be equipped to reduce the need for manual handling.

[0052] Step S3, chemical liquid polishing is performed on the thin glass.

[0053] In the embodiment of the present invention, before step S3, the following steps are further included:

[0054] According to the processing drawing requirements, the thin glass is subjected to other processing steps before the chemical strengthening step.

[0055] In step S3, the other processes usually refer to the white sheet process in the drawing processing technology, that is, various processing technologies before chemical strengthening, such as polishing, grinding, etc. These traditional processing technologies are mainly physical processing technologies, which are extremely easy to produce destructive effects due to fragile positions. If the traditional hole processing method is adopted, the hole is directly exposed to the outside, and the strength around the hole is poor. In the white sheet process, the edge of the hole is very easy to break, affecting the yield and material utilization value at the production level. In the embodiment of the present invention, during the white sheet process, the hole is hidden in the glass, reducing the risk of breakage.

[0056] In the embodiment of the present invention, the chemical liquid used in the chemical liquid polishing is an acid solution or an alkaline solution. The specific chemical liquid to be selected depends on the specific processing requirements and the chemical composition of the glass.

[0057] In an embodiment of the present invention, the components of the acidic solution include: hydrofluoric acid with a concentration of 3-5%, sulfuric acid with a concentration of 1-2%, ammonium fluoride with a concentration of 1-3%, and a surfactant with a concentration of 0.1-0.3%. Among them, hydrofluoric acid is used for glass etching, sulfuric acid is used to enhance the etching effect of hydrofluoric acid, ammonium fluoride is used as a buffer to control the etching rate, and the surfactant is used to ensure uniform etching and control the pore structure. The acidic solution is suitable for glass with a high silicon content, such as liquid polishing of quartz glass, and scenes that require detailed polishing and removal of the oxide layer.

[0058] In the embodiment of the present invention, the components of the alkaline solution include: sodium hydroxide with a concentration of 30-70%, and a temperature maintained at 120-150° C. The alkaline solution is suitable for liquid polishing of aluminosilicate glass, as well as scenes requiring rough polishing or low cost and high safety requirements.

[0059] During the liquid polishing process, the chemical liquid reacts with the glass surface to remove tiny scratches, burrs and surface dirt, thereby improving the surface finish. At the same time, the chemical liquid reacts with the glass surface. After the surface is removed by the liquid, the liquid further expands and penetrates into the glass, reacts with the position of the contour line, effectively dissolves micro cracks, and smoothes and repairs cracks on the edges, reducing stress concentration and improving surface roughness.

[0060] In the embodiment of the present invention, the liquid polishing parameters include concentration, temperature, and time. The best polishing effect is to control the liquid polishing rate through the liquid polishing parameters such as concentration, temperature, and time, so that the hole main area of ​​the thin glass does not fall off in the liquid polishing tank, and after leaving the liquid polishing tank, it can be manually broken or broken by a jig, and new defects will not be generated due to incomplete liquid polishing during breaking.

[0061] like Figure 6 As shown, for double-sided chamfers, during the liquid polishing process, the positions of the holes and the hole chamfer contours are continuously dissolved, and the cracked areas at the four corners usually fall off during the liquid polishing process and are dissolved in the liquid polishing liquid. After the liquid polishing is completed, the main area of ​​the hole in the middle maintains a weak connection stress with the area outside the hole. After the cracking, the main area of ​​the hole falls off from the glass, and the shape of the hole and the hole chamfer is fully revealed.

[0062] In the embodiment of the present invention, after step S4, the following steps are further included:

[0063] The thin glass product is cleaned and dried. Specifically, in the embodiment of the present invention, after polishing, the thin glass is thoroughly cleaned with deionized water to remove residual chemical liquid. After cleaning, the thin glass is placed in a drying device and dried until there is no water stain on the surface and it remains bright.

[0064] Step S4, performing a cracking process on the holes processed on the thin glass.

[0065] In actual applications, the best chemical liquid polishing parameters are selected through repeated tests, so that the subsequent splitting can be done easily without generating new defects during the splitting.

[0066] There are also solutions in the prior art that use laser drilling and then chamfer the edges of the holes. The principle is to achieve a melting hole effect by continuously rotating the focus to ablate the glass. The excess waste falls off due to the ablation. After the hole processing is completed, the chamfer is processed through an additional process. This method has the disadvantages of long processing time, large thermal response area, and high energy consumption. In the embodiment of the present invention, the contour lines of the holes and chamfers are formed inside the thin glass by laser, and then the holes and chamfers are revealed by liquid polishing and splitting. Compared with the laser ablation solution, it has the advantages of one-time forming, small heat-affected zone, high processing accuracy, low energy consumption, and reduced stress concentration.

[0067] In the embodiment of the present invention, the processing time of processing a circular hole with a diameter of 0.8 mm and chamfering according to the method of step S2 is 2s / piece, and the processing time of processing a hole with the same diameter by the traditional CNC punching, chamfering, and polishing combined processing method is 60s to 150s / piece. It can be seen that the scheme of the embodiment of the present invention has a significant improvement in processing efficiency.

[0068] The hole and hole chamfering processing method of the embodiment of the present invention avoids the contact between the material and the mechanical processing tool, thereby avoiding the edge collapse and sand loss problems in traditional hole processing. Compared with the traditional CNC drilling, chamfering, and polishing combined processing method of a polishing machine, the appearance yield of the hole is improved by 10% to 20%.

[0069] After the conventional CNC punching, chamfering and polishing combined processing method, the surface roughness of the hole is 400nm~800nm. The hole and hole chamfering processing method of the embodiment of the present invention does not have a polishing step, and the surface roughness of the hole is 800nm~1000nm, which is slightly worse than the conventional processing method. However, the solution of the embodiment of the present invention does not use a mechanical processing step that is in direct contact with the material, thereby avoiding the problem of internal material damage caused by mechanical processing, and the edge strength of the hole is improved by 30%~50% compared with the conventional processing method.

[0070] The embodiment of the present invention generates multiple focal points through a beam splitter, and the holes and hole chamfer contours are processed in the glass in parallel with the multiple focal points, and then the holes and hole chamfers are revealed through chemical liquid polishing and cracking treatment, forming in one step, and the edges are smooth, reducing the polishing steps required for subsequent processing, shortening the processing time, reducing the processing cost, and avoiding the stress concentration and quality control difficulties caused by the traditional hole and chamfer processing directly on the glass surface, effectively reducing the risk of cracking; by accurately controlling the laser processing parameters such as laser power, focus and scanning speed, the micron-level processing accuracy is achieved. The holes and chamfered edges are ensured to be smooth and neat, which solves the problem of limited chamfering processing, so that smooth double-sided chamfers can be made even in small apertures, and the heat generated during the processing is minimized, the heat-affected zone is reduced, and the possibility of glass cracking due to thermal stress is reduced; since the holes and chamfering are processed inside the glass, surface scratches and burrs that may be generated in traditional methods are avoided, which helps to maintain the integrity of the glass surface and reduce the risk of microcracks; the chamfers inside the holes can increase the edge strength of the holes, making them more resilient when subjected to impact or pressure, and reducing the possibility of cracking. In summary, the present invention hides the hole and chamfered contour inside the glass, which can effectively solve the problems of limited chamfering processing, difficult quality control, long processing time, and high processing cost in the hole and chamfering processing in traditional thin glass processing from multiple aspects, improves the strength and durability of the hole edges, and improves the surface quality, providing better protection for the safety and aesthetics of glass products.

[0071] The above are only specific implementations of the present invention, which cannot be used to limit the scope of the present invention. Equivalent changes made by ordinary technicians in this technical field based on this creation, as well as changes known to technicians in this field, should still fall within the scope of the present invention.

Claims

1. A hole and hole chamfering processing method, used for processing holes on thin glass and processing chamfers on the edges of the holes, characterized in that: The method comprises the following steps: Step S1, making a design file of a hole and a hole chamfer, and obtaining a phase drawing according to the design file, wherein the design file includes processing path information, the phase drawing includes line information of the hole and the hole chamfer, and the hole chamfer includes double-sided chamfer and single-sided chamfer; Step S2, machining a hole and an outline of a hole chamfer in the thin glass according to the design file and the phase drawing, wherein the hole and the outline of the hole chamfer are connected to the outer surface of the thin glass; Step S3, chemical liquid polishing is performed on the thin glass; Step S4, performing a cracking process on the holes processed on the thin glass; The specific method of step S2 is: according to the design file and the phase drawing, use a beam splitter to divide the laser beam into multiple branches, adjust the position of each branch focus through a dynamic focusing system, so that each focus is processed according to a predetermined path, and set laser parameters according to the type and thickness of the thin glass, and process the contour lines of holes and chamfers in one rotation in the thin glass; the laser parameters include laser power, laser energy, speed, frequency, focusing depth, and point spacing.

2. The method for processing holes and hole chamfering according to claim 1, characterized in that: In the step S2, if the hole chamfer is a double-sided chamfer, after the hole and the hole chamfer are processed, the laser cutting lens light group is flipped 180 degrees and reversely rotated to form 5 areas to be split.

3. The method for processing holes and hole chamfering according to claim 1, characterized in that: In step S2, the parameter settings of laser energy and speed need to meet the following conditions: the heat generated by the laser on the sub-surface is sufficient to melt the thin glass without damaging the surface of the thin glass.

4. The method for processing holes and hole chamfering according to claim 1, characterized in that: The chemical liquid used in the chemical liquid blasting is an acidic solution or an alkaline solution, and the liquid blasting parameters include concentration, temperature, and time.

5. The method for processing holes and hole chamfering according to claim 1, characterized in that: After step S3, the method further includes: The thin glass product is cleaned and dried.

6. The method for processing holes and hole chamfering according to claim 1, characterized in that: Before step S3, the method further includes: According to the processing drawing requirements, the thin glass is subjected to other processing steps before the chemical strengthening step.

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