Mask frame, mask assembly with mask frame, and deposition apparatus

Abstract

The invention relates to a mask frame, a mask assembly and a deposition apparatus. The mask frame includes: a frame body supporting a mask; an insulating layer that prevents energy from being transmitted to the frame body; and an absorbing layer absorbing energy from external light, in which the insulating layer is disposed between the first surface of the frame body and the absorbing layer.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0113141 filed in the Korean Intellectual Property Office on August 28, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments relate to a mask frame, a mask assembly having the mask frame, and a deposition apparatus. Background Art

[0004] The display panel includes pixels. Each pixel includes a driving element such as a transistor and a display element such as an organic light emitting element. The display element can be formed by stacking electrodes and various functional layers on a substrate.

[0005] A mask having an opening area defined to penetrate is used to pattern and arrange the functional layer forming the display element. For example, the shape of the patterned functional layer can be controlled according to the shape of the opening area of ​​the mask. The mask and mask frame used to manufacture the display element can be cleaned after the deposition process. As the resolution of the display element increases, dry cleaning is preferred to wet cleaning for cleaning the mask and mask frame. Summary of the invention

[0006] Embodiments provide a mask frame that quickly and effectively removes residual organic material during a cleaning process, a mask assembly having the mask frame, and a deposition apparatus.

[0007] However, the embodiments of the present disclosure are not limited to those described herein. The above and other embodiments will become more apparent to those skilled in the art to which the present disclosure pertains by referring to the detailed description of the present disclosure given below.

[0008] In an embodiment, the mask frame may include: a frame body supporting the mask; an insulating layer preventing energy from being transmitted to the frame body; and an absorption layer absorbing energy from external light, wherein the insulating layer may be disposed between a first surface of the frame body and the absorption layer.

[0009] The frame body may include a frame opening defined by an inner side surface perpendicular to the first surface, and the mask may be disposed in the frame opening.

[0010] The insulating layer may comprise a ceramic material.

[0011] The thickness of the absorption layer may be thinner than the thickness of the frame body.

[0012] The absorber layer may include a metallic material.

[0013] An insulating layer may be disposed between the absorbent layer and the inner side surface defining the frame opening.

[0014] An insulating layer may be disposed between an outer side surface of the frame body and the absorption layer.

[0015] In an embodiment, the mask assembly may include: a mask, which forms a functional layer of a display device through a deposition process; and a mask frame, which supports the mask, wherein the mask frame may include: a frame body, which supports the mask; a first insulating layer, which prevents energy from being transmitted to the frame body; and a first absorption layer, which absorbs energy from external light, wherein the first insulating layer may be disposed between a first surface of the frame body and the first absorption layer.

[0016] The mask assembly may further include: a second insulating layer that blocks energy from being transmitted to the mask; and a second absorbing layer that absorbs energy from external light. The second insulating layer may be disposed between the mask and the second absorbing layer.

[0017] The frame body may include a frame opening defined by an inner side surface perpendicular to the first surface, and the mask may be disposed in the frame opening.

[0018] The first insulating layer may include a ceramic material.

[0019] The thickness of the first absorbent layer may be thinner than the thickness of the frame body.

[0020] The first absorber layer may include a metallic material.

[0021] The thickness of the second absorption layer may be thinner than the thickness of the mask.

[0022] The first insulating layer and the second insulating layer may be made of the same material.

[0023] The first absorbent layer and the second absorbent layer may be made of the same material.

[0024] In an embodiment, a deposition apparatus may include: a deposition chamber; and a mask assembly disposed in the deposition chamber, the mask assembly including a mask and a mask frame supporting the mask; and a deposition source spraying a deposition material toward the mask assembly, wherein the mask frame may include: a frame body supporting the mask; an insulating layer preventing energy from being transmitted to the frame body; and an absorption layer absorbing energy from external light, and the insulating layer may be disposed between a first surface of the frame body and the absorption layer.

[0025] The frame body may include a frame opening defined by an inner side surface perpendicular to the first surface, and the mask may be disposed in the frame opening.

[0026] The insulating layer may comprise a ceramic material.

[0027] The thickness of the absorption layer may be thinner than the thickness of the frame body.

[0028] According to the mask frame and the mask assembly having the mask frame according to the present disclosure, residual organic materials may be quickly and effectively removed during a cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic cross-sectional view of a deposition setup is shown.

[0030] Figure 2 A schematic top plan view of a display panel formed using a deposition apparatus is shown.

[0031] Figure 3 Shown along Figure 2 A schematic cross-sectional view taken along line II'.

[0032] Figure 4 An exploded schematic perspective view of an example of a mask assembly including a mask and a mask frame is shown.

[0033] Figure 5 Shows Figure 4 Schematic cross-sectional view of a mask assembly.

[0034] Figure 6 Shows Figure 5 An enlarged schematic diagram of area A.

[0035] Figure 7 Shows Figure 5 An enlarged schematic diagram of area B.

[0036] Figure 8 A schematic cross-sectional view of a mask assembly according to another embodiment is shown.

[0037] Fig. 9 Shows Figure 8 An enlarged schematic diagram of area A'.

[0038] Fig.10 A schematic cross-sectional view of a mask assembly according to another embodiment is shown.

[0039] Fig.11 Shows Fig.10 An enlarged schematic diagram of area A".

[0040] Fig.12 A schematic cross-sectional view of a mask assembly according to another embodiment is shown.

[0041] Fig.13 A schematic cross-sectional view of a mask assembly according to another embodiment is shown. DETAILED DESCRIPTION

[0042] In the following description, for the purpose of illustration, many specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable words and are non-limiting examples of the apparatus or method disclosed herein. However, it is apparent that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Here, various embodiments do not have to be exclusive and do not limit the present disclosure. For example, the specific shape, configuration, and characteristics of an embodiment may be used or implemented in another embodiment.

[0043] Unless otherwise indicated, the embodiments shown should be understood to provide features of the present invention. Therefore, unless otherwise indicated, the features, components, modules, layers, films, panels, regions and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of various embodiments may be combined, separated, interchanged and / or rearranged in other ways without departing from the scope of the present invention.

[0044] The use of cross hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, unless specified, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the elements. In addition, in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. When the embodiment can be implemented differently, a specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the described sequence. Similarly, the same reference numerals represent the same elements.

[0045] When an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, it may be directly on, connected to or coupled to another element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connection" may refer to a physical connection, an electrical connection and / or a fluid connection with or without an intervening element. In addition, the axis of the first direction DR1, the axis of the second direction DR2, and the axis of the third direction DR3 are not limited to the three axes of a rectangular coordinate system such as the X-axis, the Y-axis, and the Z-axis, and may be interpreted in a broader sense. For example, the axis of the first direction DR1, the axis of the second direction DR2, and the axis of the third direction DR3 may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of A and B" may be understood to mean only A, only B, or any combination of A and B. Furthermore, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as any combination of only X, only Y, only Z, or two or more of X, Y, and Z. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0046] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0047] For descriptive purposes, spatially relative terms such as "below," "below," "under," "down," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein and thereby describe the relationship of one element to another element(s) as shown in the accompanying drawings. In addition to the orientations depicted in the accompanying drawings, spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "below" other elements or features will then be oriented "above" the other elements or features. Thus, the term "below" may encompass both above and below orientations. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatially relative descriptors used herein should be interpreted accordingly.

[0048] Figure 1 A schematic cross-sectional view of a deposition apparatus EDA is shown.

[0049] refer to Figure 1 , the deposition equipment (or deposition device) EDA according to the embodiment may include a deposition chamber CB, a fixing member CM, a deposition source DS disposed inside the deposition chamber CB, and a mask assembly MK disposed inside the deposition chamber CB. For example, the deposition equipment EDA may further include additional mechanical equipment for realizing an online system.

[0050] The deposition chamber CB may set the deposition condition to vacuum or may have a vacuum deposition condition. The deposition chamber CB may include a bottom surface, a ceiling surface, and a side wall. The bottom surface of the deposition chamber CB may be parallel to a surface defined by the first direction DR1 and the second direction DR2. The normal direction of the bottom surface of the deposition chamber CB indicates a third direction DR3.

[0051] The fixing member CM may be disposed inside the deposition chamber CB, may be disposed on the deposition source DS, and may fix the mask assembly MK. The fixing member CM may be installed (or disposed) on the ceiling surface of the deposition chamber CB. The fixing member CM may include a clamp or a robot arm that clamps the mask assembly MK.

[0052] The fixing member CM may include a support portion BD and a magnetic material MM coupled to the support portion BD. The support portion BD may include a plate as a basic structure for fixing the mask assembly MK, but the embodiment is not limited thereto. The magnetic material MM may be disposed inside or outside the support portion BD. The magnetic material MM may fix the mask assembly MK with a magnetic force.

[0053] The deposition source DS may evaporate the deposition material and eject it as deposition vapor. The deposition vapor may pass through the mask assembly MK and may be deposited on the display panel DP in a specific pattern. The display panel DP may be defined as a substrate in an intermediate step during a manufacturing process of a finished display panel DP to be described later.

[0054] The mask assembly MK may be disposed inside the deposition chamber CB, may be disposed on the deposition source DS, and may support the display panel DP. The display panel DP may include a glass substrate or a plastic substrate. The display panel DP may include a polymer layer disposed on a base substrate.

[0055] Figure 2 A schematic top plan view of a display panel DP formed using a deposition apparatus is shown. Figure 2 shows the use of deposition equipment EDA (see Figure 1 ) is a schematic plan view of a display panel DP manufactured by using a display panel DP. The display panel DP may be arranged Figure 1 On the mask assembly MK shown in , a deposition process may be performed.

[0056] refer to Figure 2, the display panel DP according to the embodiment may include an active area AA and a peripheral area NAA. The display panel DP may include a first light emitting area PXA-R, a second light emitting area PXA-G, and a third light emitting area PXA-B that are different from each other in the active area AA. For example, the first light emitting area PXA-R may be a red light emitting area that emits red light, the second light emitting area PXA-G may be a green light emitting area that emits green light, and the third light emitting area PXA-B may be a blue light emitting area that emits blue light.

[0057] The first light-emitting region PXA-R, the second light-emitting region PXA-G, and the third light-emitting region PXA-B may be separated from each other and may not overlap with each other when viewed on a plane defined by the first direction DR1 and the second direction DR2, and the region between adjacent light-emitting regions PXA-R, PXA-G, and PXA-B may be defined as a non-light-emitting region NPXA.

[0058] Figure 1 and Figure 2 The display panel DP shown in FIG. 4 may include at least one functional layer manufactured using a mask MS. For example, among the functional layers included in the display panel DP, a functional layer in the form of a common layer that overlaps all of the light emitting areas PXA-R, PXA-G, and PXA-B may be provided using the mask MS.

[0059] The light emitting regions PXA-R, PXA-G, and PXA-B of the display panel DP according to the embodiment may be arranged in a stripe shape. For example, the first light emitting region PXA-R, the second light emitting region PXA-G, and the third light emitting region PXA-B may be alternately arranged along the second direction DR2, and the light emitting regions PXA-R, PXA-G, or PXA-B providing light of the same color may be arranged to be spaced apart from each other along the first direction DR1.

[0060] For example, the arrangement form of the light-emitting areas PXA-R, PXA-G and PXA-B is not limited thereto, and the order in which the first light-emitting area PXA-R, the second light-emitting area PXA-G and the third light-emitting area PXA-B are arranged can be set to various combinations according to the characteristics of the display quality required by the display panel DP.

[0061] For example, the light emitting regions PXA-R, PXA-G, and PXA-B may have a diamond arrangement form. For example, the areas of the light emitting regions PXA-R, PXA-G, and PXA-B may also be different from each other, and the arrangement shape and the arrangement area may be variously adjusted or modified according to the characteristics of the display quality required by the display panel DP.

[0062] Figure 3 Shown along Figure 2A schematic cross-sectional view taken along line II'.

[0063] refer to Figure 3 , using deposition equipment EDA (see Figure 1 ) may be combined with an optical layer PP and a cover substrate BL disposed on the display panel DP to form a display device DD. The display panel DP may include light emitting elements ED-1, ED-2, and ED-3. The optical layer PP may be disposed on the display panel DP to control light reflected from the display panel DP due to external light. The optical layer PP may include, for example, a polarizing layer or a color filter layer. For example, unlike what is shown in the figure, the optical layer PP may be omitted in the display device DD of the embodiment.

[0064] The cover substrate BL may be disposed on the optical layer PP. The cover substrate BL may be a member providing a base surface on which the optical layer PP is disposed. The cover substrate BL may be an inorganic layer, an organic layer, or a composite material layer. For example, unlike the illustration, the cover substrate BL may be omitted in an embodiment.

[0065] In an embodiment, the display panel DP may include a base layer BS, a circuit layer DP-CL disposed on the base layer BS, and a display element layer DP-ED. The display element layer DP-ED may include light emitting elements ED-1, ED-2, and ED-3. For example, the display panel DP may include an encapsulation layer TFE disposed on the display element layer DP-ED.

[0066] In an embodiment, the display panel DP may be an organic electroluminescent display panel including an organic electroluminescent element in the display element layer DP-ED. Figure 1 ) can be used to form a part of the functional layer of the display element layer DP-ED of the organic electroluminescent display panel.

[0067] In an embodiment, the circuit layer DP-CL may be disposed on the base layer BS, and the circuit layer DP-CL may include transistors. Each of the transistors (not shown) may include a control electrode, an input electrode, and an output electrode. For example, the circuit layer DP-CL may include an insulating layer.

[0068] The encapsulation layer TFE may cover the light emitting elements ED-1, ED-2 and ED-3. The encapsulation layer TFE may seal the display element layer DP-ED. The encapsulation layer TFE may be a thin film encapsulation layer.

[0069] Each of the light emitting elements ED-1, ED-2, and ED-3 may include a first electrode EL1, a hole transport region HTR, one of the light emitting layers EML-R, EML-G, and EML-B, an electron transport region ETR, and a second electrode EL2.

[0070] At least a portion of the first electrode EL1 of each of the light emitting elements ED-1, ED-2, and ED-3 may be exposed through a display opening OH defined in the pixel defining film PDL. The light emitting layers EML-R, EML-G, and EML-B may be disposed in the display opening OH, and the hole transport region HTR, the electron transport region ETR, and the second electrode EL2 may be disposed as a common layer throughout the light emitting elements ED-1, ED-2, and ED-3.

[0071] At least one of the hole transport region HTR, the electron transport region ETR, and the second electrode EL2 provided as a common layer in the light emitting elements ED-1, ED-2, and ED-3 of the display panel DP may be provided using the mask MS.

[0072] For example, some of the insulating layers included in the circuit layer DP-CL or the encapsulation layer TFE disposed on the light emitting elements ED-1, ED-2, and ED-3 may also be disposed using the mask MS.

[0073] Figure 4 An exploded schematic perspective view of an example of a mask assembly MK including a mask MS and a mask frame FR is shown. Figure 5 Shows Figure 4 Schematic cross-sectional view of the mask assembly MK. Figure 5 Shown along Figure 4 A schematic cross-sectional view taken along line II-II' in FIG. Figure 4 and Figure 5 , a direction opposite to the third direction DR3 may be defined as a fourth direction DR4.

[0074] refer to Figure 4 and Figure 5 , the mask assembly MK may include a mask MS and a mask frame FR. In an embodiment, the mask assembly MK may be used to form a common layer including the same material on a target material as a deposition surface. In an embodiment, the mask assembly MK may include an opening mask for thin film processing, which is used to form a functional layer set as a thin film. The opening mask for thin film processing may be a mask for stacking a thin film layer of the same material throughout each individual display device on a target substrate.

[0075] The mask frame FR may support the mask MS. For example, the frame opening FR-OP may be defined inside the mask frame FR, and the mask MS may be disposed inside the frame opening FR-OP. For example, the mask frame FR may have an upper surface and a lower surface perpendicular to the third direction DR3. For example, the frame opening FR-OP may be defined by an inner side surface perpendicular to the upper surface. The inner side surface defining the frame opening FR-OP may be perpendicular to the lower surface.

[0076] The mask frame FR may support an edge portion of the mask MS. In an embodiment, the mask frame FR may be disposed below the mask MS. The mask MS may be placed (or disposed) on the mask frame FR. For example, the mask frame FR may include a support surface SS that supports the mask MS at an inner side defining the frame opening FR-OP, and the mask MS may be disposed on the support surface SS. However, the embodiment is not limited thereto, and the mask frame FR may be disposed above and below an edge portion of the mask MS to support the mask MS.

[0077] For example, the mask MS may be fixed to the mask frame FR. The mask MS may be fixed to the mask frame FR by a method such as a welding process.

[0078] The mask frame FR may be made of a metal material including at least one of iron (Fe) and nickel (Ni). For example, the mask frame FR may include an alloy of iron and nickel. The mask frame FR may be manufactured to include stainless steel (SUS) or Invar.

[0079] The mask MS may include at least one open region OP. In an implementation, the mask MS may include the open regions OP spaced apart from each other in a plan view.

[0080] The open area OP may be defined by being aligned on a plane defined by the first direction DR1 and the second direction DR2 . Figure 4 An embodiment of a mask MS in which five opening areas OP are defined to be spaced apart from each other along the first direction DR1 and two opening areas OP are defined to be spaced apart from each other along the second direction DR2 is shown. However, this is an example, and the number of opening areas OP is not limited to those shown. The opening areas OP may be arranged at regular intervals (or distances) along one of the first direction DR1 and the second direction DR2. A material forming a functional layer in the form of a common layer through each of the opening areas OP may be deposited on a target substrate.

[0081] The mask MS may be made of a metal material including at least one of iron (Fe) and nickel (Ni). For example, the mask MS may include an alloy of iron and nickel. The mask MS may be manufactured to include stainless steel (SUS) or Invar alloy. The mask MS and the mask frame FR may be made of the same material. However, the embodiment is not limited thereto.

[0082] The mask MS may have a thermal expansion coefficient of about 5 ppm / ° C. or less. For example, the mask frame FR may also have a thermal expansion coefficient similar to that of the mask MS. Therefore, thermal deformation of the mask MS during the deposition process may be minimized, thereby improving deposition quality on the target substrate.

[0083] The mask MS according to the embodiment may have a plate shape extending along the first direction DR1 and the second direction DR2. In the embodiment, when viewed on a plane defined by the first direction DR1 and the second direction DR2, the mask MS may have a quadrilateral shape. However, the embodiment is not limited thereto, and the shape of the mask MS may be modified and set in various forms according to the shape of the target substrate as a deposition surface or the shape of the mask frame FR supporting the mask MS.

[0084] For example, the opening region OP in the mask MS of the embodiment may have a quadrangular shape in a plan view. However, the embodiment is not limited thereto, and the shape of the opening region OP may be modified to have various shapes according to the shape of the functional layer deposited and formed on the target substrate.

[0085] The mask MS may include a lower surface (or first surface) MS-DS and an upper surface (or second surface) MS-US facing each other.

[0086] Figure 6 Shows Figure 5 An enlarged schematic diagram of area A.

[0087] After the deposition process of the display panel DP, the deposition material may remain on the mask frame FR. Figure 6 In the embodiment of the present invention, the residual layer 130 may be formed on the frame layer 110 based on the fourth direction DR4. The frame layer 110 may form the mask frame FR. The residual layer 130 may be a deposition material remaining on the frame layer 110 after the deposition process. As an example, the residual layer 130 may include an organic material.

[0088] In order to reuse the mask frame FR, it may be necessary to remove the residual layer 130 on the frame layer 110. As a method for removing the residual layer 130, a method of irradiating high-energy light onto the residual layer 130 may be used. In some embodiments, light generated from a xenon flash lamp may be irradiated onto the residual layer 130. For example, the light generated from the xenon flash lamp may have a wavelength of about 200 nm to about 1200 nm. For example, energy of the light L2 having a wavelength of about 250 nm to about 430 nm may be absorbed into the residual layer 130. For example, energy of the light L1 in the remaining wavelength band may pass through the residual layer 130 to be transmitted to the frame layer 110.

[0089] The temperature of the residual layer 130 may be increased by the light L2 having a wavelength of about 250 nm to about 430 nm. For example, the temperature of the frame layer 110 may be increased by the light L1 in the remaining wavelength band. As the temperature of the residual layer 130 increases, the material forming the residual layer 130 may evaporate and the residual layer 130 may be removed. For example, a mask frame cleaning process by light irradiation may be performed.

[0090] Figure 7 Shows Figure 5 An enlarged schematic diagram of area B.

[0091] After the deposition process of the display panel DP, the deposition material may remain on the mask MS. Figure 7 In the embodiment of the present invention, the residual layer 130 may be formed on the mask layer 120 based on the fourth direction DR4. The mask layer 120 may form a mask MS.

[0092] In order to reuse the mask MS, it is necessary to remove the residual layer 130 on the mask layer 120. Figure 6 In the described method, light having high energy may be irradiated onto the residual layer 130 .

[0093] Since the mask MS and the mask frame FR form the mask assembly MK, the process of removing the residual layer 130 on the mask layer 120 and the process of removing the residual layer 130 on the frame layer 110 may be simultaneously performed. For example, by irradiating light generated by a xenon flash lamp onto the mask assembly MK based on the fourth direction DR4, the residual layer 130 on the mask layer 120 and the frame layer 110 may be simultaneously removed.

[0094] Reference together Figure 6 and Figure 7 , the thickness of the frame layer 110 forming the mask frame FR may be relatively thicker than the thickness of the mask layer 120 forming the mask MS. The temperature of the mask layer 120 having a relatively thin thickness may be rapidly increased due to the energy of the light L1. Therefore, the temperature of the residual layer 130 on the mask layer 120 may also be rapidly increased, and the residual layer 130 may be rapidly removed from the mask layer 120.

[0095] However, the relatively thick frame layer 110 may have a large heat capacity, so when it receives energy from the light L1, its temperature may slowly increase. This may be a factor that prevents the temperature of the residual layer 130 on the frame layer 110 from increasing. For example, the temperature of the residual layer 130 on the frame layer 110 may slowly increase, and the residual layer 130 may be slowly or incompletely removed from the frame layer 110.

[0096] The mask frame FR according to the embodiment may be formed on a frame body FRB (see Figure 8 ) includes a coating on the frame body FRB. The coating can reduce or prevent the energy of the irradiated light from being transmitted to the frame body FRB during the cleaning process (see Figure 8 ), and the temperature of the residual layer 130 can be quickly increased. Therefore, the residual layer 130 on the mask frame FR can be quickly and effectively removed during the cleaning process.

[0097] Figure 8A schematic cross-sectional view of a mask assembly according to another embodiment is shown.

[0098] refer to Figure 8 , the mask assembly may include a mask MS and a mask frame FR. The mask frame FR may include a frame body FRB and a coating CL on the frame body FRB. In addition to the mask frame FR including the frame body FRB and the coating CL on the frame body FRB, Figure 8 The mask assembly shown in Figure 5 The mask assembly MK shown in FIG. 1 is the same as that shown in FIG. Therefore, a redundant description thereof will be omitted below.

[0099] The frame body FRB may be made of a metal material including at least one of iron (Fe) and nickel (Ni). For example, the frame body FRB may include an alloy of iron and nickel. The frame body FRB may be manufactured to include stainless steel (SUS) or Invar alloy.

[0100] The coating layer CL may be formed on the frame body FRB with respect to the fourth direction DR4. Figure 4 As described, the mask frame FR may have an upper surface and a lower surface perpendicular to the third direction DR3, and the frame opening FR-OP may be defined by a side surface perpendicular to the upper surface. Similarly, the frame body FRB may also have an upper surface and a lower surface perpendicular to the third direction DR3. Figure 8 In the embodiment, the coating layer CL may be defined as being formed on the upper surface of the frame body FRB based on the fourth direction DR4.

[0101] The coating layer CL may be formed to reduce or prevent energy of light irradiated during a cleaning process from being transmitted to the frame body FRB and rapidly increasing the temperature of a residual layer.

[0102] At least one of the multiple layers included in the coating layer CL may be formed by a plasma spraying method. The coating material may be melted at a high temperature using heat energy such as heated gas or discharge to generate molten particles, and the generated molten particles may be accelerated by high-speed air and gas flow, and then by colliding them onto the base material, a film may be immediately formed on the surface of the base material.

[0103] In an embodiment, the coating layer CL may include an insulating layer and an absorption layer. The insulating layer may prevent or reduce light energy from being transmitted to the frame body FRB. The absorption layer may absorb light energy and quickly increase the temperature of the residual layer. For this purpose, the insulating layer may be interposed between the frame body FRB and the absorption layer.

[0104] At least one of the insulating layer and the absorption layer included in the coating CL may be formed by a plasma spraying method. According to the plasma spraying method, the coating material may be melted at a high temperature using heat energy such as heated gas or discharge to generate molten particles, and the generated molten particles may be accelerated by high-speed air and gas flow, and then by colliding them onto the base material, a film may be immediately formed on the surface of the base material. However, this is only an example of a method of forming the coating CL, and the coating CL may be formed by another method. Hereinafter, reference will be made to Fig. 9 Describe in more detail.

[0105] Fig. 9 Shows Figure 8 An enlarged schematic diagram of area A'.

[0106] refer to Fig. 9 , the coating layer CL may be formed on the frame layer 210. The frame layer 210 may form a frame body FRB. The frame layer 210 and Figure 6 The frame layer 110 shown in FIG. 1 may be made of substantially the same material.

[0107] For example, the insulating layer 220 and the absorbing layer 230 may be sequentially formed on the frame layer 210 based on the fourth direction DR4. For example, the insulating layer 220 may be interposed between the absorbing layer 230 and the frame layer 210 forming the frame body FRB.

[0108] exist Fig. 9 In the embodiment of the present invention, the residual layer 240 may be formed on the coating layer CL based on the fourth direction DR4. For example, the residual layer 240 may be formed on the absorption layer 230. Fig. 9 The residual layer 240 and Figure 6 The residual layer 130 shown in FIG. 1 may be made of substantially the same material.

[0109] In order to reuse the mask frame FR, it is necessary to remove the residual layer 240 on the coating layer CL. For example, light generated from a xenon flash lamp may be irradiated onto the residual layer 240. For example, the light generated from the xenon flash lamp may have a wavelength of about 200 nm to about 1200 nm. For example, energy of the light L2 having a wavelength of about 250 nm to about 430 nm may be absorbed into the residual layer 240. For example, energy of the light L1 in the remaining wavelength band may pass through the residual layer 240 to be transmitted to the coating layer CL.

[0110] The temperature of the residual layer 240 may be increased by the light L2 having a wavelength of about 250 nm to about 430 nm. For example, the temperature of the absorption layer 230 in the coating layer CL may be increased by the light L1 in the remaining wavelength band. Since the absorption layer 230 is formed as a thin film whose thickness is much thinner than that of the frame layer 210, the temperature may be rapidly increased by absorbing the energy of the light L1. For example, the insulating layer 220 may reduce or prevent the heat energy from the absorption layer 230 from being transmitted to the frame layer 210.

[0111] In this way, the energy of the light generated from the xenon flash lamp may be used to increase the temperature of the absorption layer 230 and the residual layer 240, and may not be transmitted to the frame layer 210. Therefore, the residual layer 240 may be removed quickly and efficiently during the cleaning process.

[0112] The insulating layer 220 may include a material that effectively blocks heat transferred from the absorption layer 230 to the frame layer 210. According to an embodiment, the insulating layer 220 may include a ceramic material having good insulating properties. However, the insulating layer 220 is not limited thereto and may include other materials.

[0113] The absorption layer 230 may include a material whose temperature is rapidly increased by absorbing the energy of the light L1. According to an embodiment, the absorption layer 230 may be made of a metal material including at least one of iron (Fe) and nickel (Ni). For example, the absorption layer 230 may include an alloy of iron and nickel. As another example, the absorption layer 230 may be manufactured to include stainless steel (SUS) or Invar alloy. In some embodiments, the absorption layer 230 and the frame layer 210 may be made of the same material.

[0114] Fig.10 A schematic cross-sectional view of a mask assembly according to another embodiment is shown.

[0115] refer to Fig.10 , the mask assembly may include a mask MS and a mask frame FR'. The mask frame FR' may include a frame body FRB' and a coating CL' on the frame body FRB'. Fig.10 In the embodiment, the coating layer CL′ may be formed not only on the upper surface of the frame body FRB′ but also on the inner side surface of the frame body FRB′ based on the fourth direction DR4.

[0116] With reference Figure 8 Similar to the description, Fig.10 The frame body FRB' may also have an upper surface and a lower surface perpendicular to the third direction DR3. Fig.10 , the coating layer CL′ may be defined as being formed on the upper surface of the frame body FRB′ based on the fourth direction DR4.

[0117] For example, the frame body FRB' may have a frame opening defined by inner side surfaces. Each of the inner side surfaces may be perpendicular to the upper surface of the frame body FRB'. Fig.10 In the embodiment shown in FIG. 1 , the coating CL′ may also be formed on the inner surface of the frame body FRB′. In this way, the residual layer formed on the inner surface of the frame body FRB′ can be effectively removed. Fig.11 Give a description.

[0118] Fig.11 Shows Fig.10 An enlarged schematic diagram of area A".

[0119] refer to Fig.11 , the coating layer CL' may be formed on an upper surface of the body portion 310 in the fourth direction DR4 and on an upper surface of the body portion 310 in the first direction DR1. The body portion 310 may form a frame body FRB'.

[0120] For example, the insulating layer 320 and the absorption layer 330 may be sequentially formed on the body part 310 based on the fourth direction DR4. For example, the insulating layer 320 and the absorption layer 330 may be sequentially formed on the body part 310 based on the first direction DR1. For example, the insulating layer 320 may be interposed between the absorption layer 330 and the body part 310 forming the frame body FRB'.

[0121] exist Fig.11 In the embodiment of the present invention, the residual layer 340 may be formed on the coating layer CL′ based on the first direction DR1 and the fourth direction DR4. For example, the residual layer 340 may be formed on the absorption layer 330.

[0122] Therefore, according to Fig.11 According to the embodiment, during the cleaning process, residues formed not only on the upper surface of the mask frame FR′ based on the fourth direction DR4 but also on the inner side surfaces may be quickly and effectively removed.

[0123] Fig.12 A schematic cross-sectional view of a mask assembly according to another embodiment is shown.

[0124] refer to Fig.12 The mask assembly may include a mask MS and a mask frame FR". The mask frame FR" may include a frame body FRB" and a coating CL" on the frame body FRB". Fig.12 In the embodiment, based on the fourth direction DR4, the coating CL" can be formed not only on the upper surface and the inner surface of the frame body FRB", but also on the outer surface of the frame body FRB". In this way, the residual layer formed on the outer surface of the frame body FRB" can be quickly and effectively removed.

[0125] Fig.13 A schematic cross-sectional view of a mask assembly according to another embodiment is shown.

[0126] refer to Fig.13 , the mask assembly may include a mask MS and a mask frame FR. The mask frame FR may include a frame body FRB and a first coating layer CL1 on the frame body FRB. The first coating layer CL1 may include a first insulating layer and a first absorbing layer. For example, a second coating layer CL2 may be formed on the mask MS. The second coating layer CL2 may include a second insulating layer and a second absorbing layer. Each of the first coating layer CL1 and the second coating layer CL2 may be formed in a manner similar to the reference Fig. 9 The first insulating layer and the second insulating layer may be formed in the same manner as described above. For example, the first insulating layer and the second insulating layer may be made of the same material, and the first absorbing layer and the second absorbing layer may also be made of the same material. For example, the thickness of the absorbing layer included in the second coating layer CL2 may be thinner than the thickness of the mask MS. Fig.13 According to the embodiment shown in FIG. 1 , it is possible to quickly and effectively remove not only the residue formed on the first coating layer CL1 of the mask frame FR but also the residue formed on the second coating layer CL2 of the mask MS.

[0127] At the end of the detailed description, those skilled in the art will appreciate that many changes and modifications may be made to the embodiments without departing substantially from the principles and spirit and scope of the present disclosure. Therefore, the disclosed embodiments are used in a general and descriptive sense only and not for the purpose of limitation.

Claims

1. A mask frame, comprising: A frame body, supporting the mask; an insulating layer to prevent energy from being transmitted to the frame body; as well as The absorption layer absorbs the energy from external light. Wherein, the insulating layer is arranged between the first surface of the frame body and the absorption layer.

2. The mask frame according to claim 1, wherein: The frame body includes a frame opening defined by an inner side surface perpendicular to the first surface, and The mask is disposed in the frame opening.

3. The mask frame according to claim 1, wherein: The insulating layer includes a ceramic material.

4. The mask frame according to claim 1, wherein: The thickness of the absorption layer is thinner than the thickness of the frame body.

5. The mask frame according to claim 1, wherein: The absorption layer includes a metallic material.

6. The mask frame according to claim 2, wherein: The insulating layer is disposed between the absorbent layer and the inner side surface defining the frame opening.

7. The mask frame according to claim 1, wherein: The insulating layer is disposed between an outer side surface of the frame body and the absorption layer.

8. A mask assembly, comprising: A mask for forming a functional layer of a display device through a deposition process; as well as a mask frame supporting the mask, Wherein, the mask frame comprises: A frame body, supporting the mask; a first insulating layer that blocks energy transmission to the frame body; and a first absorption layer that absorbs energy from external light, and The first insulating layer is disposed between the first surface of the frame body and the first absorbing layer.

9. The mask assembly according to claim 8, further comprising: a second insulating layer that blocks energy transmission to the mask; as well as a second absorption layer, absorbing energy from the external light, Wherein, the second insulating layer is arranged between the mask and the second absorption layer.

10. A deposition apparatus comprising: Sedimentation chamber; as well as A mask assembly is disposed in the deposition chamber, the mask assembly comprising: Mask; and a mask frame supporting the mask; and a deposition source, spraying deposition material toward the mask assembly, Wherein, the mask frame comprises: A frame body, supporting the mask; an insulating layer to prevent energy from being transmitted to the frame body; and an absorption layer, which absorbs energy from external light, and The insulating layer is disposed between the first surface of the frame body and the absorption layer.

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