Exhaust pipe heating device and semiconductor device
By designing the exhaust pipe heating device for heating components and thermally conductive components in semiconductor equipment, the problem of blockage caused by too low exhaust pipe temperature is solved, and effective heating and insulation of the exhaust pipe is achieved, ensuring the normal operation of the equipment and product quality.
Patent Information
- Application Number
- CN202411677773.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-02-28
AI Technical Summary
During the process of semiconductor equipment, the temperature of the exhaust pipe is too low, which causes the exhaust pipe to be blocked, affecting the pressure control in the chamber and the cleanliness of the product surface.
A heating device for an exhaust pipe is designed, including a heating assembly and a thermal conductivity assembly. The heating assembly provides heat to the exhaust pipe. The thermal conductivity assembly transfers heat to the exhaust pipe and blocks heat transfer when the exhaust pipe temperature reaches a preset value to prevent the heating assembly from overheating.
It effectively avoids the exhaust pipe blockage, ensures the pressure control in the chamber and the cleanliness of the product surface, and protects the heating components to avoid damage.
Smart Images
Figure CN119530759A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a heating device for an exhaust pipe and a semiconductor device. Background Art
[0002] In the semiconductor industry, specific manufacturing equipment is usually used to process products. Among them, plasma chemical vapor deposition or plasma etching is an indispensable process flow. In the process flow of plasma chemical vapor deposition or plasma etching, excess reaction gases and reaction by-products enter the exhaust pipe from the chamber of the manufacturing equipment and are discharged from the manufacturing equipment through the exhaust pipe. If the temperature of the exhaust pipe is too low, a large amount of excess reaction gases and reaction by-products will adhere to the inner wall of the exhaust pipe or deposit to form an organic layer, causing the exhaust pipe to gradually become blocked. Once the exhaust pipe is blocked, it will affect the pressure control in the chamber, and it is easy to cause the reaction gases and reaction by-products to flow back into the chamber, thereby affecting the surface cleanliness of the product.
[0003] Therefore, during the process of plasma chemical vapor deposition or plasma etching, it is usually necessary to heat the exhaust pipe so that the temperature of the exhaust pipe reaches a certain temperature range to avoid clogging of the exhaust pipe due to too low a temperature of the exhaust pipe. Summary of the invention
[0004] In view of this, the embodiments of the present disclosure provide a heating device for an exhaust pipe and a semiconductor device, which solve the problem of exhaust pipe clogging due to excessively low temperature of the exhaust pipe when the semiconductor device is performing a process.
[0005] In a first aspect, an embodiment of the present disclosure provides a heating device for an exhaust pipe, which is applied to a semiconductor device, wherein the semiconductor device at least comprises a reaction chamber and an exhaust pipe, wherein exhaust gas is generated after a reaction occurs inside the reaction chamber, and the exhaust pipe is connected to the bottom of the reaction chamber and is capable of discharging the exhaust gas; wherein the heating device for the exhaust pipe comprises: a heating component connected to the exhaust pipe and configured to provide heat for the exhaust pipe; a heat-conducting component disposed between the heating component and the exhaust pipe, and configured to transfer the heat generated by the heating component to the exhaust pipe and to keep the exhaust pipe warm, or, when the temperature of the exhaust pipe is greater than or equal to a preset temperature, to block at least part of the heat of the exhaust pipe from being transferred to the heating component.
[0006] In some embodiments, the heating component provides heat to the exhaust pipe when the temperature of the exhaust pipe is lower than a first target temperature, and stops working and does not provide heat to the exhaust pipe when the temperature of the exhaust pipe is higher than a second target temperature.
[0007] In some embodiments, when the reaction chamber of the semiconductor device performs a first process, the heating component provides heat for the exhaust pipe, and the heat-conducting component transfers the heat generated by the heating component to the exhaust pipe and keeps the exhaust pipe warm; when the reaction chamber of the semiconductor device performs a second process, the heat-conducting component blocks at least part of the heat of the exhaust pipe from being transferred to the heating component; wherein the second process is after the first process, the first process includes at least one of a deposition process and an etching process on the surface of the wafer, and the second process includes a cleaning process for the reaction chamber and / or the exhaust pipe.
[0008] In some embodiments, the heat-conducting component includes: a plurality of heat-conducting parts, each of which has a tubular shape, and the plurality of heat-conducting parts are sequentially mounted; wherein the innermost heat-conducting part among the plurality of heat-conducting parts is mounted on the exhaust pipe, and the heating component is mounted on the outermost heat-conducting part.
[0009] In some embodiments, the plurality of heat conductive members include: a first heat conductive member, which is mounted on the exhaust pipe and extends along the extension direction of the exhaust pipe; a second heat conductive member, which is mounted on the side wall of the first heat conductive member away from the exhaust pipe and extends along the extension direction of the exhaust pipe; a third heat conductive member, which is mounted on the side wall of the second heat conductive member away from the first heat conductive member and extends along the extension direction of the exhaust pipe; wherein the heating assembly is mounted on the side wall of the third heat conductive member away from the second heat conductive member.
[0010] In some embodiments, the thermal conductivity of the material of the first thermal conductor, the thermal conductivity of the material of the second thermal conductor, and the thermal conductivity of the material of the third thermal conductor are the same; or, the thermal conductivity of the material of the first thermal conductor and the thermal conductivity of the material of the third thermal conductor are the same, and the thermal conductivity of the material of the first thermal conductor and the thermal conductivity of the material of the third thermal conductor are both smaller than the thermal conductivity of the material of the second thermal conductor; or, the thermal conductivity of the material of the first thermal conductor, the thermal conductivity of the material of the second thermal conductor, and the thermal conductivity of the material of the third thermal conductor decrease in sequence.
[0011] In some embodiments, the cross-sections of the first heat conducting member, the second heat conducting member, the third heat conducting member, and the exhaust pipe are of the same shape.
[0012] In some embodiments, the heating component includes: a support member, the shape of the support member includes a tubular shape, the support member is sleeved on the outermost heat-conducting member of the heat-conducting component, and extends along the extension direction of the exhaust pipe, wherein the support member has a plurality of accommodating spaces, the plurality of accommodating spaces are arranged in sequence along the circumferential direction of the support member, and the accommodating spaces extend along the extension direction of the support member; a plurality of heating rods, respectively arranged in the plurality of accommodating spaces, the heating rods extend along the extension direction of the support member, the heating rods are electrically connected to a power source, can be energized and generate heat.
[0013] In some embodiments, the heating device of the exhaust pipe also includes: at least one cooling pipe, which is arranged adjacent to the heat conductor, and the cooling pipe has a medium input port and a medium output port, and the cooling medium can flow into the medium input port and flow out of the medium output port.
[0014] In some embodiments, the cooling pipe is disposed around the heat conductive member along a surrounding direction of the heat conductive member, and extends along an extending direction of the heat conductive member.
[0015] In some embodiments, there are multiple cooling pipes, and at least one cooling pipe is disposed between every two adjacent heat conducting members.
[0016] In a second aspect, an embodiment of the present disclosure provides a semiconductor device, comprising: a reaction chamber; an exhaust pipe connected to the bottom of the reaction chamber and configured to exhaust exhaust gas from the reaction chamber; a heating device for the exhaust pipe described in the first aspect, connected to the exhaust pipe and configured to heat and keep the exhaust pipe warm; a temperature detection device, arranged inside the reaction chamber and adjacent to the exhaust pipe, configured to detect the temperature of the exhaust pipe.
[0017] The heating device for the exhaust pipe provided in the embodiment of the present disclosure includes a heating component and a heat-conducting component arranged between the heating component and the exhaust pipe. The heating component generates heat, and the heat-conducting component transfers the heat to the exhaust pipe to achieve heating and heat preservation of the exhaust pipe, thereby avoiding the exhaust pipe being blocked due to the exhaust pipe being too low in temperature. In addition, when the temperature of the exhaust pipe is greater than or equal to a preset temperature, the heat-conducting component can block at least part of the heat of the exhaust pipe from being transferred to the heating component, thereby avoiding excessive heat being transferred to the heating component and causing damage to the heating component. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 Shown is a schematic structural diagram of a semiconductor device provided in one embodiment of the present disclosure.
[0019] Figure 2Shown is a front view of an exhaust pipe and a heating device for the exhaust pipe provided in one embodiment of the present disclosure.
[0020] Figure 3 Shown is a front view of an exhaust pipe and a heating device for the exhaust pipe provided in another embodiment of the present disclosure.
[0021] Figure 4 Shown Figure 3 A side view of an exhaust pipe and a heating device for the exhaust pipe is shown.
[0022] Figure 5 Shown is a side view of an exhaust pipe and a heating device for the exhaust pipe provided in another embodiment of the present disclosure.
[0023] Figure 6 Shown is a side view of an exhaust pipe and a heating device for the exhaust pipe provided in another embodiment of the present disclosure.
[0024] Figure 7 Shown Figure 6 A front view of the exhaust pipe and the heating device of the exhaust pipe is shown.
[0025] Figure 8 Shown is a side view of a heating component and a heat conducting component provided in one embodiment of the present disclosure.
[0026] Fig. 9 Shown Figure 8 Front view of the heating assembly and heat conducting assembly shown.
[0027] Fig.10 Shown is a front view of a heating component, a heat-conducting component and a cooling pipe provided in one embodiment of the present disclosure.
[0028] Fig.11 Shown is a front view of a heat conducting member and a cooling pipe provided in an embodiment of the present disclosure.
[0029] Reference numerals:
[0030] 1. Semiconductor equipment; 10. Heating device for exhaust pipe; 100. Heating assembly; 110. Support member; 1101. Accommodating space; 120. Heating rod; 200. Heat-conducting assembly; 210. Heat-conducting member; 2101. First heat-conducting member; 2102. Second heat-conducting member; 2103. Third heat-conducting member; 300. Cooling pipe; 301. Medium input port; 302. Medium output port; 20. Reaction chamber; 30. Exhaust pipe; 40. Temperature detection device. DETAILED DESCRIPTION
[0031] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0032] Figure 1 Shown is a schematic structural diagram of a semiconductor device provided in one embodiment of the present disclosure. Figure 2 Shown is a front view of an exhaust pipe and a heating device for the exhaust pipe provided in one embodiment of the present disclosure. Figure 3 Shown is a front view of an exhaust pipe and a heating device for the exhaust pipe provided in another embodiment of the present disclosure. Figure 4 Shown Figure 3 The exhaust pipe and the exhaust pipe heating device are shown in FIG. Figures 1 to 4 As shown, the exhaust pipe heating device 10 is applied to a semiconductor device 1, and the semiconductor device 1 at least includes a reaction chamber 20 and an exhaust pipe 30. After the reaction occurs inside the reaction chamber 20, exhaust gas is generated. The exhaust pipe 30 is connected to the bottom of the reaction chamber 20 and can discharge the exhaust gas. The exhaust pipe heating device 10 includes a heating component 100 and a heat-conducting component 200. The heating component 100 is connected to the exhaust pipe 30 and is configured to provide heat for the exhaust pipe 30. The heat-conducting component 200 is arranged between the heating component 100 and the exhaust pipe 30, and is configured to transfer the heat generated by the heating component 100 to the exhaust pipe 30 and indirectly heat the exhaust pipe 30, or, when the temperature of the exhaust pipe 30 is greater than or equal to the preset temperature, block at least part of the heat of the exhaust pipe 30 from being transferred to the heating component 100, so as to prevent the temperature of the heating component 100 from exceeding the limit of its own tolerance temperature, resulting in damage to the heating component 100.
[0033] The exhaust pipe heating device 10 provided in the embodiment of the present disclosure includes a heating component 100 and a heat-conducting component 200 disposed between the heating component 100 and the exhaust pipe 30. The heating component 100 generates heat, and the heat-conducting component 200 transfers the heat to the exhaust pipe 30 to achieve heating and heat preservation of the exhaust pipe 30, thereby avoiding the blockage of the exhaust pipe 30 due to the excessively low temperature of the exhaust pipe 30. In addition, when the temperature of the exhaust pipe 30 is greater than or equal to the preset temperature, the heat-conducting component 200 can block at least part of the heat of the exhaust pipe 30 from being transferred to the heating component 100, thereby avoiding excessive heat from being transferred to the heating component 100 and causing damage to the heating component 100.
[0034] Exemplarily, the heating assembly 100 is located at one side of the exhaust pipe 30 and extends along the extension direction of the exhaust pipe 30, and the heat-conducting assembly 200 is arranged around the exhaust pipe 30 along the surrounding direction of the exhaust pipe 30 and extends along the extension direction of the exhaust pipe 30. Exemplarily, the heating assembly 100 is arranged around the exhaust pipe 30 along the surrounding direction of the exhaust pipe 30 and extends along the extension direction of the exhaust pipe 30, and the heat-conducting assembly 200 is arranged around the exhaust pipe 30 along the surrounding direction of the exhaust pipe 30 and extends along the extension direction of the exhaust pipe 30. Exemplarily, the heating assembly 100 may include a heating rod, a heating wire, a heating plate, a heating pipe, etc.
[0035] For example, the heat conducting component 200 may include a heat conducting plate, a heat conducting pipe, and the like.
[0036] Exemplarily, the preset temperature can be set according to the tolerance temperature of the heating assembly 100. Exemplarily, the tolerance temperature of the heating assembly 100 ranges from 300° C. to 400° C. Exemplarily, the tolerance temperature of the heating assembly 100 is 350° C., 360° C., and the like.
[0037] Exemplarily, the cross-section of the exhaust pipe 30 may be in the shape of a circular ring, a rectangular ring, or other polygonal rings, etc. Exemplarily, the cross-section of the heating component 100 may be in the shape of a circle, a rectangle, a donut-shaped ring, or a rectangular ring, etc. Exemplarily, the cross-section of the heat-conducting component 200 may be in the shape of a circular ring, a rectangular ring, or other polygonal rings, etc.
[0038] In some embodiments, the heating component 100 provides heat to the exhaust pipe 30 when the temperature of the exhaust pipe 30 is lower than the first target temperature, and stops working and does not provide heat to the exhaust pipe 30 when the temperature of the exhaust pipe 30 is higher than the second target temperature, thereby ensuring that the temperature of the exhaust pipe 10 is always maintained between the first temperature and the second temperature, thereby preventing the exhaust pipe 30 from being blocked due to the temperature being too low, and preventing the heating component 100 from being damaged due to the temperature being too high.
[0039] Exemplarily, the first target temperature may be between 20°C and 100°C, such as 50°C, 60°C, etc., and may be set as needed. This embodiment does not fix a specific value. Exemplarily, the second target temperature may be between 100°C and 150°C, such as 100°C, 120°C, etc., and may be set as needed. This embodiment does not fix a specific value.
[0040] For plasma etching or plasma chemical vapor deposition equipment, there are generally two processes, one is a reaction process, and the other is a cleaning process, and the cleaning process is generally performed after the reaction process. Specifically, for plasma etching equipment, it includes a process of etching the wafer in the plasma etching equipment, and also includes a process of cleaning the plasma etching equipment after the wafer is etched. Similarly, for plasma chemical vapor deposition equipment, it includes a process of coating the wafer in the plasma chemical vapor deposition equipment, and also includes a process of cleaning the plasma chemical vapor deposition equipment after coating. In this embodiment, the first process refers to the reaction process of plasma etching or plasma chemical vapor deposition equipment, and the second process refers to the cleaning process of plasma etching or plasma chemical vapor deposition equipment.
[0041] When the semiconductor device 1 performs the first process, unconsumed reactants and reaction byproducts containing carbon, fluorine, or carbon and fluorine enter the exhaust pipe 30 from the reaction chamber 20. If the temperature of the exhaust pipe 30 is too low, the reactants and reaction byproducts may excessively adhere to the inner wall of the exhaust pipe 30, or the organic layer may be deposited and accumulated on the inner wall of the exhaust pipe 30, thereby gradually clogging the exhaust pipe 30. Once the exhaust pipe 30 is clogged, the pressure control of the reaction chamber 20 of the semiconductor device 1 may be affected, and the reaction gas and reaction byproducts may easily flow back to the reaction chamber 20 of the semiconductor device 1, thereby affecting the cleanliness of the wafer surface.
[0042] When the semiconductor device 1 is performing the second process, when the fluorine- and oxygen-containing reactants react with the deposits on the inner wall of the reaction chamber 20 and the inner wall of the exhaust pipe 30 to be removed, a lot of heat is often generated, causing the exhaust pipe 30 to heat up rapidly, so that the temperature of the exhaust pipe 30 exceeds the tolerance temperature of the heating component 100, causing the heating component 100 to be damaged.
[0043] In some embodiments, when the reaction chamber 20 of the semiconductor device 1 performs a first process, the heating component 100 provides heat for the exhaust pipe 30, and the heat-conducting component 200 transfers the heat generated by the heating component 100 to the exhaust pipe 30, and keeps the exhaust pipe 30 warm. When the reaction chamber 20 of the semiconductor device 1 performs a second process, the heat-conducting component 200 blocks at least part of the heat of the exhaust pipe 30 from being transferred to the heating component 100. The second process is after the first process, the first process includes at least one of a deposition process and an etching process on the surface of the wafer, and the second process includes a cleaning process for the reaction chamber 20, or the exhaust pipe 30, or the reaction chamber 20 and the exhaust pipe 30.
[0044] When the reaction chamber 20 of the semiconductor device 1 performs the first process, the heating component 100 generates heat, and the heat-conducting component 200 transfers the heat to the exhaust pipe 30 to achieve heating and heat preservation of the exhaust pipe 30, thereby avoiding the blockage of the exhaust pipe 30 due to the excessively low temperature of the exhaust pipe 30 when the reaction chamber 20 performs the first process. When the reaction chamber 20 performs the first process, it needs to be performed at a certain temperature. Therefore, the reaction chamber 20 needs to be heated in advance so that the reaction chamber 20 reaches a suitable reaction temperature before the first process is performed on the wafer. At the same time, the exhaust pipe 30 also needs to reach a certain temperature in advance so that the excess reaction gas and reaction by-products can be discharged from the exhaust pipe 30 in time. This is also part of the first process. At this time, it is necessary to control the heating component 100 to heat the exhaust pipe 30 so that the exhaust pipe 30 reaches a suitable temperature.
[0045] In addition, when the reaction chamber 20 performs the second process, when the temperature of the exhaust pipe 30 is greater than or equal to the preset temperature, the heat conductive component 200 can block at least part of the heat of the exhaust pipe 30 from being transferred to the heating component 100, thereby avoiding excessive heat being transferred to the heating component 100 and causing damage to the heating component 100.
[0046] In some embodiments, Figure 5 As shown, the heat conducting assembly 200 includes a plurality of heat conducting members 210, the shape of the heat conducting members 210 includes a tubular shape, and the plurality of heat conducting members 210 are sequentially mounted. The innermost heat conducting member 210 of the plurality of heat conducting members 210 is mounted on the exhaust pipe 30, and the heating assembly 100 is mounted on the outermost heat conducting member 210.
[0047] The structure of the heat conducting assembly 200 is simple. In addition, the exhaust pipe 30 is wrapped with a plurality of tubular heat conducting members 210, and the heat generated by the heating assembly 100 is transferred to the exhaust pipe 30, thereby improving the uniformity of heat transfer and the heat preservation effect on the exhaust pipe 30. In addition, when the temperature of the exhaust pipe 30 is greater than or equal to the preset temperature, the plurality of tubular heat conducting members 210 wrap the exhaust pipe 30, which can prevent more heat from the exhaust pipe 30 from being transferred to the heating assembly 100 as much as possible.
[0048] Exemplarily, the number of the heat conducting members 210 may be two, three, four or even more, and the number of the heat conducting members 210 may be set according to actual production needs. Figure 5 The number of heat conducting members 210 shown is three.
[0049] In some embodiments, Figures 5 to 7As shown, the plurality of heat-conducting members 210 include a first heat-conducting member 2101, a second heat-conducting member 2102, and a third heat-conducting member 2103. The first heat-conducting member 2101 is sleeved on the exhaust pipe 30 and extends along the extension direction of the exhaust pipe 30. The second heat-conducting member 2102 is sleeved on the side wall of the first heat-conducting member 2101 away from the exhaust pipe 30 and extends along the extension direction of the exhaust pipe 30. The third heat-conducting member 2103 is sleeved on the side wall of the second heat-conducting member 2102 away from the first heat-conducting member 2101 and extends along the extension direction of the exhaust pipe 30. The heating assembly 100 is sleeved on the side wall of the third heat-conducting member 2103 away from the second heat-conducting member 2102.
[0050] By reasonably setting the number of heat conductive parts 210, the heat conductive component 200 can quickly transfer heat and heat and keep the exhaust pipe 30 warm. It can also prevent the heat conductive component 200 from transferring as much heat as possible from the exhaust pipe 30 to the heating component 100 when the temperature of the exhaust pipe 30 is greater than or equal to the preset temperature.
[0051] Exemplarily, the cross-section of the heat conductor 210 may be in the shape of a circular ring, a rectangular ring or other polygonal rings, etc. Exemplarily, the cross-sections of the first heat conductor 2101 , the second heat conductor 2102 and the third heat conductor 2103 may be the same or different in shape.
[0052] Exemplarily, the material of the heat conductor 210 is a metal material. Exemplarily, the metal material may be copper, aluminum, or the like.
[0053] Exemplarily, the thermal conductivities of the materials of the first heat conductor 2101 , the second heat conductor 2102 , and the third heat conductor 2103 may be the same or different.
[0054] Exemplarily, the first heat conductor 2101 and the second heat conductor 2102 are detachably connected, and the second heat conductor 2102 and the third heat conductor 2103 are detachably connected, so as to improve the installation stability of the heat conducting assembly 200 and facilitate the replacement and maintenance of any heat conductor 210 .
[0055] Exemplarily, the first heat-conducting member 2101 is detachably connected to the exhaust pipe 30 to improve the installation stability of the heat-conducting component 200 . In addition, it is also convenient to replace and maintain the heat-conducting component 200 and the exhaust pipe 30 .
[0056] Exemplarily, the heating component 100 and the third heat conductor 2103 are detachably connected to improve the installation stability of the heating component 100 . In addition, it is also convenient to replace and maintain the heating component 100 .
[0057] In some embodiments, the thermal conductivity of the material of the first heat conductor 2101 , the thermal conductivity of the material of the second heat conductor 2102 , and the thermal conductivity of the material of the third heat conductor 2103 are the same.
[0058] In some embodiments, the thermal conductivity of the material of the first thermal conductor 2101 is the same as the thermal conductivity of the material of the third thermal conductor 2103 , and the thermal conductivity of the material of the first thermal conductor 2101 and the thermal conductivity of the material of the third thermal conductor 2103 are both smaller than the thermal conductivity of the material of the second thermal conductor 2102 .
[0059] By changing the thermal conductivity, the thermal conductivity of the heat-conducting member 210 close to the heating assembly 100 is higher than that of the heat-conducting member 210 far away, so that the heat generated by the heating assembly 100 can be quickly transferred to the exhaust pipe 30, thereby improving the heating efficiency. In the second process, when the heat generated by the cleaning reaction chamber 20 and the exhaust pipe 30 is transferred outward from the exhaust pipe 30, due to the influence of the thermal conductivity of the heat-conducting member 210, the efficiency of heat transfer to the heating assembly 100 will be reduced, and the heat transfer time will be prolonged, which can prevent the heating assembly 100 from rapidly heating up to the limit of its own tolerance temperature, thereby causing damage to the heating assembly 100.
[0060] The above-mentioned arrangement enables the third heat-conducting member 2103 to transfer the heat generated by the heating component 100 to the second heat-conducting member 2102, the second heat-conducting member 2102 to quickly transfer the received heat to the first heat-conducting member 2101, and the first heat-conducting member 2101 to transfer the received heat to the exhaust pipe 30, so as to heat and keep the exhaust pipe 30 warm. In addition, it is also possible to avoid partial heat of the exhaust pipe 30 from being quickly transferred to the heating component 100 when the temperature of the exhaust pipe 30 is greater than or equal to a preset temperature.
[0061] In some embodiments, the thermal conductivity of the material of the first heat conductor 2101 , the thermal conductivity of the material of the second heat conductor 2102 , and the thermal conductivity of the material of the third heat conductor 2103 decrease in sequence.
[0062] The above arrangement can realize that the heat transfer rate of the third heat conductor 2103, the second heat conductor 2102 and the first heat conductor 2101 is increased in sequence, so as to transfer the heat generated by the heating component 100 to the exhaust pipe 30 from slow to fast, so as to heat and keep the exhaust pipe 30 warm, and improve the heating efficiency of the exhaust pipe 30 by the heating component 100. In addition, it can also be realized that when the temperature of the exhaust pipe 30 is greater than or equal to the preset temperature, part of the heat of the exhaust pipe 30 is transferred to the heating component 100 from fast to slow, slowing down the transfer efficiency of the heat from the exhaust pipe 30 to the heating component 100, avoiding that part of the heat of the exhaust pipe 30 is quickly transferred to the heating component 100, causing the heating component 100 to heat up quickly, thereby avoiding that the temperature of the heating component 100 is quickly increased to break through its own heat resistance temperature and causing the heating component 100 to be damaged.
[0063] In some embodiments, the cross-sections of the first heat conductor 2101 , the second heat conductor 2102 , the third heat conductor 2103 , and the exhaust pipe 30 are of the same shape.
[0064] The above arrangement can improve the uniformity of heat transfer between two adjacent heat-conducting members 210 , as well as the uniformity of heat transfer between the heat-conducting member 210 and the exhaust pipe 30 .
[0065] For example, Figure 5 As shown, the cross-section of each heat conducting member 210 is in the shape of a circular ring.
[0066] In some embodiments, Figures 7 to 9 As shown, the heating component 100 includes a support member 110 and a plurality of heating rods 120. The shape of the support member 110 includes a tubular shape, and the support member 110 is sleeved on the outermost heat-conducting member 210 of the heat-conducting component 200, and extends along the extension direction of the exhaust pipe 30. The support member 110 has a plurality of accommodating spaces 1101, and the plurality of accommodating spaces 1101 are arranged in sequence along the circumferential direction of the support member 110, and the accommodating spaces 1101 extend along the extension direction of the support member 110. The plurality of heating rods 120 are respectively arranged in the plurality of accommodating spaces 1101, and the heating rods 120 extend along the extension direction of the support member 110. The heating rods 110 are electrically connected to a power source, can be energized and generate heat. The heating component 100 has a simple structure, good heating uniformity, and is easy to disassemble and assemble.
[0067] In some embodiments, Figure 1 and Fig.10 As shown, the exhaust pipe heating device 10 also includes at least one cooling pipe 300, which is arranged adjacent to the heat conductor 210. The cooling pipe 300 has a medium input port 301 and a medium output port 302, and the cooling medium can flow in from the medium input port 301 and flow out from the medium output port 302.
[0068] When the temperature of the exhaust pipe 30 is greater than or equal to the preset temperature, the cooling medium flows through the cooling pipe 300 and takes away the heat of the heat conductor 210 to cool the heat conductor 210 to further reduce the heat transferred from the heat conductor 210 to the heating assembly 100.
[0069] Exemplarily, the number of cooling pipes 300 is one, and the cooling pipe 300 is disposed on a side of the outermost heat conductive member 210 away from the exhaust pipe 30, or between any two adjacent heat conductive members 210, or between the innermost heat conductive member 210 and the exhaust pipe 30. Exemplarily, the cooling pipe 300 extends along the extension direction of the heat conductive member 210.
[0070] Exemplarily, there are two cooling pipes 300. Exemplarily, one cooling pipe 300 is disposed on the side of the outermost heat-conducting member 210 away from the exhaust pipe 30, and the other cooling pipe 300 is disposed between any two adjacent heat-conducting members 210. Exemplarily, one cooling pipe 300 is disposed between any two adjacent heat-conducting members 210, and the other cooling pipe 300 is disposed between the innermost heat-conducting member 210 and the exhaust pipe 30. Exemplarily, one cooling pipe 300 is disposed on the side of the outermost heat-conducting member 210 away from the exhaust pipe 30, and the other cooling pipe 300 is disposed between the innermost heat-conducting member 210 and the exhaust pipe 30.
[0071] Exemplarily, the cooling medium may be in a gaseous or liquid state.
[0072] In some embodiments, Fig.11 As shown, the cooling pipe 300 is disposed around the heat conductive member 210 along the surrounding direction of the heat conductive member 210 and extends along the extending direction of the heat conductive member 210 to improve the cooling efficiency and cooling uniformity of the heat conductive member 210 by the cooling medium.
[0073] In some embodiments, there are multiple cooling pipes 300, and at least one cooling pipe 300 is set between every two adjacent heat conductive parts 210 to enable the cooling medium to cool each heat conductive part 210, further improving the cooling efficiency and cooling uniformity of the cooling medium on the heat conductive part 210.
[0074] The present disclosure provides a semiconductor device 1, such as Figure 1 As shown, the semiconductor device 1 includes the exhaust pipe heating device 10, the reaction chamber 20, the exhaust pipe 30 and the temperature detection device 40 mentioned in the above embodiment. The exhaust pipe 30 is connected to the bottom of the reaction chamber 20 and is configured to discharge the exhaust gas inside the reaction chamber 20. The exhaust pipe heating device 10 is connected to the exhaust pipe 30 and is configured to heat and keep the exhaust pipe 30 warm. The temperature detection device 40 is arranged inside the reaction chamber 20 and adjacent to the exhaust pipe 30, and is configured to detect the temperature of the exhaust pipe 30.
[0075] Since the semiconductor device 1 includes the heating device 10 for the exhaust pipe, all technical features and technical effects of the semiconductor device 1 including the heating device 10 for the exhaust pipe are not described in detail here.
[0076] In the embodiments of the present disclosure, if not clearly defined, the connection may be in the form of detachable connection by means of bolts and nuts, screws, buckles, magnets, etc. In some connections, if there is no special requirement for detachable matching, non-detachable connection may be achieved by means of welding, bonding, etc.
[0077] The phrases "one embodiment", "an embodiment", etc. mentioned in the specification indicate that the embodiment described may include a specific feature, structure or characteristic, but not every embodiment may include the specific feature, structure or characteristic. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments, whether explicitly or not explicitly described.
[0078] It should be understood that “on,” “above,” and “over” in this disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).
[0079] Additionally, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one component or feature to other components or features as shown in the figures. The spatially relative terms are intended to encompass different orientations of the component in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.
[0080] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.
[0081] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.
Claims
1. A heating device for an exhaust pipe, characterized in that: Applied to semiconductor equipment, the semiconductor equipment at least comprises a reaction chamber and an exhaust pipe, exhaust gas is generated after reaction occurs inside the reaction chamber, the exhaust pipe is connected to the bottom of the reaction chamber and can discharge the exhaust gas; Wherein, the heating device of the exhaust pipe comprises: a heating assembly connected to the exhaust pipe and configured to provide heat to the exhaust pipe; A heat-conducting component is disposed between the heating component and the exhaust pipe, and is configured to transfer the heat generated by the heating component to the exhaust pipe and to keep the exhaust pipe warm, or, when the temperature of the exhaust pipe is greater than or equal to a preset temperature, to block at least part of the heat of the exhaust pipe from being transferred to the heating component.
2. The exhaust pipe heating device according to claim 1, characterized in that: The heating component provides heat to the exhaust pipe when the temperature of the exhaust pipe is lower than a first target temperature, and stops working and does not provide heat to the exhaust pipe when the temperature of the exhaust pipe is higher than a second target temperature.
3. The exhaust pipe heating device according to claim 1, characterized in that: When the reaction chamber of the semiconductor device performs a first process, the heating component provides heat for the exhaust pipe, and the heat-conducting component transfers the heat generated by the heating component to the exhaust pipe and keeps the exhaust pipe warm; When the reaction chamber of the semiconductor device performs a second process, the heat conducting component blocks at least part of the heat of the exhaust pipe from being transferred to the heating component; The second process is performed after the first process, the first process includes at least one of a deposition process and an etching process on the surface of the wafer, and the second process includes a cleaning process for the reaction chamber and / or the exhaust pipe.
4. The exhaust pipe heating device according to any one of claims 1 to 3, characterized in that: The heat conducting component comprises: A plurality of heat-conducting members, wherein the shape of the heat-conducting members includes a tubular shape, and the plurality of heat-conducting members are sequentially mounted; Among the plurality of heat-conducting members, the innermost heat-conducting member is sleeved on the exhaust pipe, and the heating component is sleeved on the outermost heat-conducting member.
5. The exhaust pipe heating device according to claim 4, characterized in that: The plurality of heat conducting members include: A first heat conducting member, which is sleeved on the exhaust pipe and extends along an extending direction of the exhaust pipe; A second heat-conducting member, which is sleeved on a side wall of the first heat-conducting member away from the exhaust pipe and extends along an extending direction of the exhaust pipe; A third heat-conducting member, which is sleeved on a side wall of the second heat-conducting member away from the first heat-conducting member and extends along an extending direction of the exhaust pipe; Wherein, the heating component is sleeved on the side wall of the third heat-conducting component away from the second heat-conducting component.
6. The exhaust pipe heating device according to claim 5, characterized in that: The thermal conductivity of the material of the first heat-conducting member, the thermal conductivity of the material of the second heat-conducting member and the thermal conductivity of the material of the third heat-conducting member are the same; Alternatively, the thermal conductivity of the material of the first heat-conducting member is the same as the thermal conductivity of the material of the third heat-conducting member, and the thermal conductivity of the material of the first heat-conducting member and the thermal conductivity of the material of the third heat-conducting member are both smaller than the thermal conductivity of the material of the second heat-conducting member; Alternatively, the thermal conductivity of the material of the first heat-conducting member, the thermal conductivity of the material of the second heat-conducting member, and the thermal conductivity of the material of the third heat-conducting member decrease in sequence.
7. The exhaust pipe heating device according to claim 6, characterized in that: The cross-sections of the first heat conducting member, the second heat conducting member, the third heat conducting member and the exhaust pipe are of the same shape.
8. The exhaust pipe heating device according to any one of claims 5 to 7, characterized in that: The heating assembly comprises: A support member, wherein the shape of the support member includes a tubular shape, the support member is sleeved on the outermost heat-conducting member of the heat-conducting assembly, and extends along the extension direction of the exhaust pipe, wherein the support member has a plurality of accommodating spaces, the plurality of accommodating spaces are sequentially arranged along the circumferential direction of the support member, and the accommodating spaces extend along the extension direction of the support member; A plurality of heating rods are respectively arranged in the plurality of accommodating spaces, the heating rods extend along the extension direction of the supporting member, and the heating rods are electrically connected to a power source and can be energized to generate heat.
9. The exhaust pipe heating device according to claim 8, characterized in that: Also includes: At least one cooling pipeline is arranged adjacent to the heat conducting element, and the cooling pipeline has a medium input port and a medium output port, and a cooling medium can flow into the medium input port and flow out of the medium output port.
10. The exhaust pipe heating device according to claim 9, characterized in that: The cooling pipe is disposed around the heat conducting member along a surrounding direction of the heat conducting member and extends along an extending direction of the heat conducting member.
11. The exhaust pipe heating device according to claim 10, characterized in that: There are multiple cooling pipes, and at least one cooling pipe is arranged between every two adjacent heat conducting members.
12. A semiconductor device, characterized in that: include: reaction chamber; an exhaust pipe, connected to the bottom of the reaction chamber and configured to exhaust waste gas inside the reaction chamber; The exhaust pipe heating device according to any one of claims 1 to 11, connected to the exhaust pipe and configured to heat and keep the exhaust pipe warm; The temperature detection device is arranged inside the reaction chamber and adjacent to the exhaust pipe, and is configured to detect the temperature of the exhaust pipe.