Multi-path air inlet mixing device and semiconductor coating equipment

By setting a flow-guided output section in the intake module of the multiple intake mixing device, the airflow flows into the mixing chamber in a spiral shape, the problems of airflow hedging and reverse dispersion in the existing device are solved, the gas mixing efficiency and uniformity are improved, and the film deposition effect is improved.

CN119530767APending Publication Date: 2025-02-28JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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Patent Information

Application Number
CN202411581602.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-06
Publication Date
2025-02-28

AI Technical Summary

Technical Problem

The existing multi-channel intake mixing devices are prone to airflow hedging or backflow during the gas mixing process, resulting in low gas mixing efficiency and poor uniformity, and the gas stays in the mixing channel for a long time, producing particulate matter, affecting the film deposition effect.

Method used

A multi-channel intake mixing device is designed, and the multiple intake channels in the intake module are provided with a flow-guided output section, and the flow-guided output section is connected to the intake end in a direction deviating from the axis of the air mixing chamber, so that the inflowing multiple gas flows to the outlet end in a spiral shape, avoiding the airflow hedging and backflow.

Benefits of technology

The gas mixing efficiency and uniformity are improved, the residence time of gas in the gas mixing cavity is shortened, the generation of particulate matter is reduced, and the film deposition effect is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a multi-path air inlet mixing device and semiconductor coating equipment, and relates to the technical field of semiconductors. The multi-path gas inlet mixing device comprises a gas inlet module and a gas mixing module which are connected with each other, wherein a plurality of gas inlet flow channels used for being externally connected with a plurality of paths of gas sources are arranged in the gas inlet module; the gas mixing module is provided with a gas mixing cavity, the gas mixing cavity is provided with a gas inlet end and a gas outlet end, the multiple gas inlet flow channels are each provided with a flow guide output section, and the multiple flow guide output sections communicate with the gas inlet end in the direction deviating from the axis of the gas mixing cavity so that multiple paths of gas flowing into the gas inlet end can spirally flow to the gas outlet end. The multi-path gas inlet mixing device provided by the invention is higher in gas mixing efficiency and better in gas mixing uniformity, and the film deposition effect can be improved.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a multi-channel air intake mixing device and semiconductor coating equipment. Background Art

[0002] In the ALD (atomic layer deposition) deposition process, multiple reaction gases and carrier gases need to be introduced into the reaction chamber of the equipment through different pipelines. In order to facilitate control, an intake manifold that can centrally control the intake of multiple reaction gases and carrier gases has appeared on the market. Multiple independent intake flow channels are arranged in the intake manifold, and each intake flow channel is connected to an ALD valve that controls the flow rate. Some intake manifolds also have a gas mixing function by configuring a mixing flow channel, which can pre-mix the introduced multiple reaction gases and carrier gases before output.

[0003] The mixing flow channel of this type of intake manifold is usually simply connected to multiple intake flow channels. In actual applications, multiple airflows entering the mixing flow channel often collide with each other or flow back into other intake flow channels, resulting in low mixing efficiency and poor mixing uniformity. In addition, the gas is easy to stay in the mixing flow channel for a long time to produce particulate matter, resulting in poor subsequent deposition effect. Summary of the invention

[0004] The object of the present invention is to provide a multi-channel air intake mixing device, which has higher mixing efficiency, better mixing uniformity, and can improve the thin film deposition effect.

[0005] Another object of the present invention is to provide a semiconductor coating device, which has the characteristics of higher gas mixing efficiency and better gas mixing uniformity.

[0006] The embodiment of the present invention provides a technical solution:

[0007] A multi-channel air intake mixing device comprises an air intake module and an air mixing module connected to each other, wherein the air intake module is provided with a plurality of air intake flow passages for externally connecting to a multi-channel air source;

[0008] The gas mixing module has a gas mixing chamber, which has an air inlet end and an air outlet end. The multiple air inlet flow channels all have a guide output section, and the multiple guide output sections are connected to the air inlet end along a direction deviating from the axis of the gas mixing chamber, so that the multiple gases flowing into the air inlet end flow toward the air outlet end in a spiral shape.

[0009] In an optional embodiment, the plurality of flow guide output sections form an angle with the cross section of the mixing chamber and are inclined toward the same circumferential direction with the axis of the mixing chamber as the center line, and the plurality of flow guide output sections are circumferentially distributed around the axis of the mixing chamber.

[0010] In an optional embodiment, the air intake module and the air mixing module are integrally formed, or,

[0011] The air intake module is detachably connected to the air mixing module.

[0012] In an optional embodiment, the gas mixing chamber further has at least one diameter-changing portion, and the gas inlet end is connected with the gas outlet end through the diameter-changing portion;

[0013] The cross-sectional area of ​​the gas mixing chamber at the gas inlet end and / or the gas outlet end is different from the cross-sectional area at the diameter-reducing portion.

[0014] In an optional embodiment, the air inlet end, the reducing portion and the air outlet end are coaxially arranged, and the cross-sectional area of ​​the air mixing chamber gradually decreases from the air inlet end to the reducing portion; and the cross-sectional area of ​​the air mixing chamber gradually increases from the reducing portion to the air outlet end.

[0015] In an optional embodiment, a mounting protrusion is provided on the surface of the air intake module, and the mounting protrusion is used to install a thermal conductive compensation member, so that the thermal conductive compensation member covers the surface of the air intake module to form a flat surface structure.

[0016] In an optional embodiment, the air intake module has an air intake surface, an air outlet surface and a heating surface, the number of the air intake surfaces is multiple, the multiple air intake flow channels all have an air inlet and an air outlet, the multiple air inlets are distributed on the multiple air intake surfaces, and the multiple air outlets are distributed on the air outlet surface;

[0017] The gas outlet surface covers the gas inlet end, and the multiple guide output sections all transport gas to the gas inlet end through the corresponding gas outlets; the heating surface is provided with a heating hole extending to the interior of the gas inlet module, and the heating hole is used to install a heating element to heat the gas inlet module.

[0018] In an optional embodiment, the air intake module is a cylindrical structure, a plurality of the air intake surfaces are sequentially arranged circumferentially on the circumferential side wall between the two ends of the air intake module, the air outlet surface and the heating surface are the two end walls of the air intake module respectively, or,

[0019] The air intake module is a polyhedron structure, and the air outlet surface, the heating surface and the plurality of air intake surfaces are a plurality of wall surfaces of the air intake module.

[0020] In an optional embodiment, at least part of the intake air passages has an exhaust port, and the exhaust port is used to discharge the gas in the corresponding intake air passages and / or the mixing chamber to the outside.

[0021] The embodiment of the present invention further provides a semiconductor coating device, comprising a device body and the multi-channel air intake mixing device, wherein the multi-channel air intake mixing device comprises an air intake module and a mixing module connected to each other, wherein the air intake module is provided with a plurality of air intake channels for externally connecting a multi-channel gas source; the mixing module has a mixing chamber, wherein the mixing chamber has an air intake end and an air outlet end, wherein the plurality of air intake channels each have a flow guide output section, wherein the plurality of flow guide output sections are connected to the air intake end in a direction deviating from the axis of the mixing chamber, so that the multi-channel gas flowing into the air intake end flows in a spiral shape toward the air outlet end. The device body has a reaction chamber, and the air outlet end is connected to the reaction chamber.

[0022] Compared with the prior art, the multi-channel air intake mixing device provided by the present invention has multiple air intake flow channels in the air intake module provided with guide output sections, and the multiple guide output sections are connected to the air intake end in a direction deviating from the axis of the air mixing chamber. Therefore, the gas input into the air mixing chamber through the multiple guide output sections can flow smoothly and quickly to the air outlet end in a spiral state around the axis of the air mixing chamber. The airflow output by different guide output sections will not collide, nor will it flow back into other guide output sections, and the gas stays in the air mixing chamber for a short time. Therefore, the beneficial effects of the multi-channel air intake mixing device provided by the present invention include: higher air mixing efficiency, better air mixing uniformity, and improved thin film deposition effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of the structure of a multi-channel air intake mixing device provided by an embodiment of the present invention;

[0025] Figure 2 A cross-sectional view of the connection structure between the air intake module and the mixing module;

[0026] Figure 3 It is a schematic diagram of the connection structure between multiple flow guide output sections in the air intake module and the mixing chamber in the mixing module;

[0027] Figure 4 It is a schematic diagram of the structure of the air intake module.

[0028] Icons: 100-multi-way air intake mixing device; 110-air intake module; 111-intake flow channel; 1111-flow guide output section; 1112-air inlet; 1113-air outlet; 1114-exhaust outlet; 112-air inlet surface; 1121-mounting hole; 1122-mounting protrusion; 113-air outlet surface; 114-heating surface; 1141-heating hole; 115-sealing ring; 120-mixing module; 121-mixing chamber; 1211-inlet end; 1212-air outlet; 1213-reducing part; 130-ALD valve. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0032] In the description of the present invention, it should be understood that the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the product of the invention is usually placed when in use, or are directions or positional relationships commonly understood by those skilled in the art. These directions or positional relationships are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0033] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms such as "setting" and "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] The specific implementation modes of the present invention are described in detail below in conjunction with the accompanying drawings.

[0036] Example

[0037] See also Figure 1 , Figure 1 Shown is a schematic structural diagram of a multi-channel air intake mixing device 100 provided in this embodiment.

[0038] The multi-channel air intake mixing device 100 provided in this embodiment includes an air intake module 110 , an air mixing module 120 and a plurality of ALD valves 130 . The air intake module 110 is connected to the air mixing module 120 , and the plurality of ALD valves 130 are all disposed on the air intake module 110 .

[0039] Please refer to Figure 2 , Figure 2 It is a cross-sectional view of the connection structure between the air intake module 110 and the air mixing module 120 .

[0040] The gas inlet module 110 is provided with a plurality of inlet channels 111 for connecting to a plurality of gas sources, and the plurality of inlet channels 111 are independent of each other. The gas mixing module 120 has a gas mixing chamber 121, and the gas mixing chamber 121 has an inlet end 1211 and an outlet end 1212. The plurality of inlet channels 111 are used to input a plurality of gases into the inlet end 1211 of the gas mixing chamber 121, so that the gases are mixed in the gas mixing chamber 121 and then provided to the reaction chamber of the semiconductor coating device through the outlet end 1212.

[0041] Any intake channel 111 is connected to at least one ALD valve 130 , and the gas flow in the corresponding intake channel 111 is controlled by the ALD valve 130 . The minimum flow rate can be zero, so that the corresponding intake channel 111 stops delivering gas to the mixing chamber 121 .

[0042] In this embodiment, the plurality of intake air passages 111 each have an intake output section 1111 , and the plurality of intake air passages 111 are connected to the intake end 1211 of the mixing chamber 121 through the corresponding intake output section 1111 .

[0043] For details, please refer to Figure 3 , Figure 3It is a schematic structural diagram showing the connection between a plurality of flow guiding output sections 1111 and the gas mixing chamber 121 .

[0044] In this embodiment, multiple guide output sections 1111 are connected to the air inlet end 1211 along a direction deviating from the axis of the mixing chamber 121. The multiple guide output sections 1111 form an angle with the cross-section of the mixing chamber 121 and are inclined in the same circumferential direction with the axis of the mixing chamber 121 as the center line, so that the multiple gases flowing into the air inlet end 1211 flow in a spiral shape toward the air outlet end 1212.

[0045] Figure 3 The direction indicated by the X arrow is the circumferential direction in which the plurality of flow guiding output sections 1111 are inclined relative to the cross section of the gas mixing chamber 121. The deviation of the flow guiding output section 1111 from the axis of the gas mixing chamber 121 means that the extension direction of the flow guiding output section 1111 is misaligned with the axis of the gas mixing chamber 121. It can be understood that the cross section of the gas mixing chamber 121 is the cross section of the gas mixing chamber 121 perpendicular to the axis thereof.

[0046] In actual applications, multiple inlet flow channels 111 transport multiple gases to the mixing chamber 121. After each gas flows into the corresponding guide output section 1111, under the guidance of the guide output section 1111, each gas flows into the inlet end 1211 of the mixing chamber 121 in a direction deviating from the axis of the mixing chamber 121.

[0047] After each gas flows into the gas inlet end 1211, the flow directions in the circumferential direction and the axial direction are consistent, ensuring that the gases in each path will not collide with each other, and will not flow back into other diversion output sections 1111. Under the limiting effect of the cavity wall of the gas mixing cavity 121, each gas flows to the gas outlet end 1212 in a spirally mixed state, which improves the gas mixing efficiency and gas mixing uniformity of each gas, and can also avoid gas residue and particle generation, so that the subsequent deposition effect is improved.

[0048] In order to further improve the gas mixing effect, in this embodiment, multiple flow guide output sections 1111 are distributed circumferentially around the axis of the gas mixing chamber 121. In fact, one end of the multiple flow guide output sections 1111 connected to the gas mixing chamber 121 is distributed in sequence along the direction indicated by the X arrow.

[0049] In the present embodiment, the air intake module 110 and the air mixing module 120 are detachably connected. It can be understood that if it is applied to a semiconductor coating equipment that requires premixed gas, the air outlet end 1212 of the air mixing module 120 is connected to the semiconductor coating equipment; if the applied semiconductor coating equipment does not require premixed gas, the air mixing module 120 can be detached from the air intake module 110, and the multiple guide output sections 1111 on the air intake module 110 are directly connected to the semiconductor coating equipment.

[0050] Furthermore, since the multiple intake flow channels 111 inside the intake module 110 are independent of each other, different gases can only mix when flowing into the mixing chamber 121. Therefore, pollutants generated by the reactions of different gases will only exist in the mixing chamber 121. The pollutants can be removed by disassembling and replacing the mixing module 120, which is convenient and quick.

[0051] In order to prevent gas leakage, in this embodiment, a sealing ring 115 is provided between the air intake module 110 and the air mixing module 120. The sealing ring 115 is located at the periphery of the air intake end 1211 and is used to seal the gap between the air intake module 110 and the air mixing module 120. In other embodiments, in order to simplify the structure, the air intake module 110 and the air mixing module 120 can also be an integrally formed structure.

[0052] To further improve the uniformity of gas mixing, the mixing chamber 121 also has at least one diameter reducing portion 1213, through which the inlet end 1211 is connected to the outlet end 1212. The cross-sectional area of ​​the mixing chamber 121 at the inlet end 1211 and / or the outlet end 1212 is different from the cross-sectional area at the diameter reducing portion 1213.

[0053] In actual applications, the gas flowing into the air inlet end 1211 will pass through the reducing portion 1213 during the process of flowing along the mixing chamber 121 to the air outlet end 1212, and the flow area of ​​the gas will change, so that the direction and pressure of the gas will change, so that the gas can be mixed more evenly and more quickly in the mixing chamber 121. This design can reduce the distance required for mixing, that is, reduce the length of the mixing chamber 121, thereby further reducing the amount of gas film formation or particle generation on the inner wall of the mixing chamber 121.

[0054] Preferably, in this embodiment, the air inlet end 1211, the reducing portion 1213 and the air outlet end 1212 are coaxially arranged, and the cross-sectional area of ​​the mixing chamber 121 gradually decreases from the air inlet end 1211 to the reducing portion 1213, and the cross-sectional area of ​​the mixing chamber 121 gradually increases from the reducing portion 1213 to the air outlet end 1212.

[0055] In other words, the air inlet cavity in this embodiment is funnel-shaped, and the diameter-reducing portion 1213 is its waist. When the gas flowing into the air inlet end 1211 from the guide output section 1111 flows to the air outlet end 1212, the flow surface first decreases and then increases, thereby obtaining a better mixing effect.

[0056] In another embodiment, in order to further improve the gas mixing effect, a plurality of diameter-changing portions 1213 may be arranged so that the flow area undergoes more changes during the flow of gas in the gas mixing chamber 121 .

[0057] It should be noted that, in the radial cross section, the cavity wall of the mixing cavity 121 can be straight or arc-shaped. In practical applications, the axial length and cavity wall curvature of the mixing cavity 121 can be adaptively adjusted according to factors such as the inlet flow rate of multiple gas paths and the pressure conditions of the chemical reaction of each gas.

[0058] Please refer to Figure 4 , Figure 4 FIG. 1 is a schematic structural diagram of the air intake module 110 .

[0059] The air intake module 110 has an air intake surface 112, an air outlet surface 113 and a heating surface 114. There are multiple air intake surfaces 112, and each of the multiple air intake channels 111 has an air intake port 1112 and an air outlet port 1113. The multiple air intake ports 1112 are distributed on the multiple air intake surfaces 112, and the multiple air outlet ports 1113 are distributed on the air outlet surface 113.

[0060] In this embodiment, the gas outlet surface 113 covers the gas inlet end 1211, and the plurality of flow guide output sections 1111 deliver gas to the gas inlet end 1211 through the corresponding gas outlets 1113. The heating surface 114 is provided with a heating hole 1141 extending to the inside of the gas inlet module 110. The heating hole 1141 is used to install a heating element to heat the gas inlet module 110.

[0061] In fact, at least one ALD valve 130 is connected between the air inlet 1112 and the air outlet 1113 of the air inlet flow channel 111, and the gas flow from the air inlet 1112 to the air outlet 1113 is regulated by at least one ALD valve 130. When a certain gas input is not needed, at least one ALD valve 130 in the corresponding air inlet flow channel 111 is closed.

[0062] Specifically, a plurality of mounting holes 1121 are provided on the air intake surface 112, and two or three adjacent mounting holes 1121 in a group interrupt the air intake passage 111. An ALD valve 130 is assembled with a group of mounting holes 1121, thereby connecting to the air intake passage 111. When the ALD valve 130 is opened, the disconnected air intake passage 111 is connected.

[0063] The heating element may be an electrically controlled heating rod. In another embodiment, according to actual application conditions, the air inlet 1112 of part of the air inlet duct 111 may be arranged on the heating surface 114. In addition, in this embodiment, at least part of the air inlet duct 111 has an exhaust port 1114, which is used to discharge the gas in the corresponding air inlet duct 111 to the outside.

[0064] It is understandable that the exhaust port 1114 is actually selectively connected to the air inlet 1112 and the air outlet 1113 through the flow channel. In this embodiment, a flow channel branch appears between the air inlet 1112 and the air outlet 1113, and the other end of the flow channel branch is the exhaust port 1114.

[0065] In order to achieve refined control of each airflow, in this embodiment, an ALD valve 130 is arranged between the air inlet 1112 and the flow channel branch, an ALD valve 130 is arranged on the flow channel branch, and an ALD valve 130 is also arranged between the air outlet 1113 and the flow channel branch. In fact, the ALD valve 130 is arranged outside the diversion and exhaust section.

[0066] During the normal flow of gas in the intake flow channel 111 from the intake port 1112 to the outlet port 1113, by controlling the ALD valve 130 arranged on the flow channel branch, the excess portion of the corresponding gas in the intake flow channel 111 can be diverted to the exhaust port 1114 and thus discharged to the outside.

[0067] It is understandable that the gases transported in different inlet flow channels 111 include different reaction gases, carrier gases and cleaning gases for thin film deposition, the carrier gases are usually inert gases or nitrogen, etc., and the cleaning gases are usually ozone, nitrogen trifluoride, etc., which can be selected according to actual application conditions. In this embodiment, the gas inlets 1112 on different inlet surfaces 112 input different gases, the gas inlet 1112 on one reaction surface and its corresponding inlet flow channel 111 are used to input carrier gas, and the gas inlets 1112 on the remaining inlet surfaces 112 and their corresponding inlet flow channels 111 are used to input different reaction gases.

[0068] In one application, the first reaction gas and the carrier gas are input into the mixing chamber 121 through two inlet flow channels 111, mixed, and then input into the reaction chamber of the semiconductor coating equipment through the gas outlet 1212, and the input of the first reaction gas stops. Then, the second reaction gas is input into the mixing chamber 121 through another inlet flow channel 111, mixed with the input carrier gas, and then input into the reaction chamber through the gas outlet 1212.

[0069] In this embodiment, the air intake module 110 is a polyhedral structure, and the air outlet surface 113, the heating surface 114 and the multiple air intake surfaces 112 are multiple wall surfaces of the air intake module 110. Specifically, the air intake module 110 is a rectangular parallelepiped, and the number of air intake surfaces 112 is four, which are the four lateral wall surfaces of the rectangular parallelepiped, and the heating surface 114 and the air outlet surface 113 are the upper and lower end surfaces of the rectangular parallelepiped.

[0070] In other embodiments, the shape of the air intake module 110 can be adjusted according to actual application conditions. For example, the air intake module 110 can also be a cylinder, and the plurality of air intake surfaces 112 are sequentially arranged circumferentially on the circumferential side wall between the two ends of the cylinder, and the air outlet surface 113 and the heating surface 114 are the two end walls of the cylinder respectively.

[0071] In another embodiment, in order to achieve stable control of the temperature of the air intake module 110 , especially to keep the air intake module 110 warm, it is necessary to wrap a heat-insulating layer (not shown in the figure) on the outside of the air intake module 110 .

[0072] Considering that in actual applications, when the air inlet 1112 of the air intake module 110 is connected to an external air intake pipe, the exhaust port 1114 is connected to an external exhaust pipe and the ALD valve 130 is installed, the surface of the air intake module 110 will form more step structures with poor flatness, making it difficult for the insulation layer to fit tightly, resulting in poor insulation effect.

[0073] In order to solve this problem, in this embodiment, a mounting protrusion 1122 is provided on the surface of the air intake module 110, and the mounting protrusion 1122 is used to install a thermal conductive compensation member, so that the thermal conductive compensation member covers the surface of the air intake module 110 to form a flat surface structure. Figure 4 As shown, in this embodiment, mounting protrusions 1122 are provided on the multiple air intake surfaces 112 of the air intake module 110 .

[0074] The thermal conductive compensation piece has good thermal conductivity. In practical applications, the material of the thermal conductive compensation piece can be selected according to the actual application conditions, and can be aluminum, etc. It can be understood that after the thermal conductive compensation piece is installed on the mounting protrusion 1122, the thermal conductive compensation piece can compensate for the step structure formed on the surface of the air intake module 110 to obtain a flat surface structure, so that the thermal insulation layer can fit closely on the flat surface structure to obtain an ideal thermal insulation effect.

[0075] In other embodiments, in order to obtain a flat surface structure of the air intake module 110, other methods may be used instead of setting the mounting protrusions 1122. For example, in another embodiment, a plurality of groove mounting portions are provided on the surface of the air intake module 110, and the plurality of air intake ports 1112, exhaust ports 1114 and mounting holes 1121 are correspondingly surrounded by the plurality of groove mounting portions.

[0076] The groove mounting part around the air inlet 1112 is used to cooperate with the external air inlet pipe, the groove mounting part around the air outlet 1114 is used to cooperate with the external air outlet pipe, and the groove mounting part around the mounting hole 1121 is used to provide an escape space for the installation of the ALD valve 130. The provision of the groove mounting part ensures that the air inlet module 110 can still maintain a flat surface when connected with the air inlet pipe, the air outlet pipe and the ALD valve, and can also make the insulation layer fit tightly, thereby obtaining a better insulation effect.

[0077] In summary, the multi-channel air intake mixing device 100 provided in this embodiment achieves higher air mixing efficiency and better air mixing uniformity through the structural design of the guide output end of each air intake channel 111 and the air mixing chamber 121, which can improve the effect of subsequent thin film deposition.

[0078] In addition, this embodiment further provides a semiconductor coating device, including a device body and the aforementioned multi-channel air inlet mixing device 100, the device body has a reaction chamber, and the gas outlet end 1212 is connected to the reaction chamber.

[0079] In this embodiment, the semiconductor coating device is a thin film deposition device. Benefiting from the beneficial effects of the multi-channel air inlet mixing device 100, the semiconductor coating device provided by this embodiment also has the characteristics of higher gas mixing efficiency, better gas mixing uniformity and better thin film deposition effect.

[0080] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-channel air intake mixing device, characterized in that: It comprises an air intake module (110) and an air mixing module (120) which are connected to each other, wherein the air intake module (110) is provided with a plurality of air intake channels (111) for connecting to multiple air sources externally; The gas mixing module (120) has a gas mixing chamber (121), the gas mixing chamber (121) has an inlet end (1211) and an outlet end (1212), the plurality of inlet flow channels (111) each have a flow guide output section (1111), the plurality of flow guide output sections (1111) are connected to the inlet end (1211) along a direction deviating from the axis of the gas mixing chamber (121), so that the multiple gases flowing into the inlet end (1211) flow in a spiral shape toward the outlet end (1212).

2. The multi-way air intake mixing device according to claim 1, characterized in that: The plurality of flow guide output sections (1111) form an angle with the cross section of the gas mixing chamber (121), and are arranged to be inclined in the same circumferential direction with the axis of the gas mixing chamber (121) as the center line; the plurality of flow guide output sections (1111) are distributed circumferentially around the axis of the gas mixing chamber (121).

3. The multi-way air intake mixing device according to claim 1, characterized in that: The air intake module (110) and the air mixing module (120) are integrally formed, or, The air intake module (110) and the air mixing module (120) are detachably connected.

4. The multi-way air intake mixing device according to any one of claims 1 to 3, characterized in that: The gas mixing chamber (121) further comprises at least one diameter-changing portion (1213), and the gas inlet end (1211) is connected to the gas outlet end (1212) via the diameter-changing portion (1213); The cross-sectional area of ​​the gas mixing chamber (121) at the gas inlet end (1211) and / or the gas outlet end (1212) is different from the cross-sectional area at the diameter-reducing portion (1213).

5. The multi-way air intake mixing device according to claim 4, characterized in that: The air inlet end (1211), the diameter-changing portion (1213) and the air outlet end (1212) are coaxially arranged; the cross-sectional area of ​​the air mixing chamber (121) gradually decreases from the air inlet end (1211) to the diameter-changing portion (1213); and the cross-sectional area of ​​the air mixing chamber (121) gradually increases from the diameter-changing portion (1213) to the air outlet end (1212).

6. The multi-way air intake mixing device according to any one of claims 1 to 3, characterized in that: The surface of the air intake module (110) is provided with a mounting protrusion (1122), and the mounting protrusion (1122) is used to mount a thermal conductive compensation piece, so that the thermal conductive compensation piece covers the surface of the air intake module (110) to form a flat surface structure.

7. The multi-way air intake mixing device according to any one of claims 1 to 3, characterized in that: The air intake module (110) comprises an air intake surface (112), an air outlet surface (113) and a heating surface (114); the number of the air intake surfaces (112) is multiple, the multiple air intake channels (111) each comprise an air intake port (1112) and an air outlet port (1113); the multiple air intake ports (1112) are distributed on the multiple air intake surfaces (112), and the multiple air outlet ports (1113) are distributed on the air outlet surfaces (113); The gas outlet surface (113) covers the gas inlet end (1211), and the plurality of flow guide output sections (1111) deliver gas to the gas inlet end (1211) through the corresponding gas outlets (1113); the heating surface (114) is provided with a heating hole (1141) extending to the interior of the gas inlet module (110), and the heating hole (1141) is used to install a heating element to heat the gas inlet module (110).

8. The multi-way air intake mixing device according to claim 7, characterized in that: The air intake module (110) is a cylindrical structure, a plurality of the air intake surfaces (112) are sequentially arranged circumferentially on the circumferential side wall between the two ends of the air intake module (110), and the air outlet surface (113) and the heating surface (114) are respectively the end walls of the two ends of the air intake module (110); or, The air intake module (110) is a polyhedral structure, and the air outlet surface (113), the heating surface (114) and the plurality of air intake surfaces (112) are a plurality of wall surfaces of the air intake module (110).

9. The multi-way air intake mixing device according to claim 7, characterized in that: At least part of the intake flow channel (111) has an exhaust port (1114), and the exhaust port (1114) is used to discharge the gas in the corresponding intake flow channel (111) and / or the gas mixing chamber (121) to the outside.

10. A semiconductor coating device, characterized in that: It comprises an equipment body and a multi-way air intake mixing device (100) as claimed in any one of claims 1 to 9, wherein the equipment body has a reaction chamber, and the air outlet end (1212) is connected to the reaction chamber.