A kind of bipolar plate nickel plating device for hydrogen production electrolytic cell

Abstract

The application discloses a kind of bipolar plate nickel plating device for hydrogen production electrolytic cell, it is related to nickel plating device technical field, including nickel plating treatment pool, the feeding mechanism is installed in nickel plating treatment pool side, and nickel plating treatment pool one end is respectively fixedly connected with filtering mechanism and stirring mechanism, the stirring mechanism is located above filtering mechanism.The application is in the process of using, by the power of plating solution flow drives No.1 connecting shaft and No.1 stirring paddle to rotate counterclockwise, No.1 impeller and No.1 stirring paddle counterclockwise stir plating solution inside nickel plating treatment pool at this time, similarly, by No.2 guide vane again accelerates plating solution inside No.2 guide pipe, impacts No.2 impeller, drives No.2 connecting shaft and No.2 stirring paddle to rotate clockwise, No.2 impeller and No.2 stirring paddle clockwise stir plating solution inside nickel plating treatment pool at this time, improve the uniformity of substance in plating solution inside nickel plating treatment pool.

Description

Technical Field

[0001] This invention relates to the field of nickel plating equipment technology, specifically to a bipolar plate nickel plating device for a hydrogen electrolytic cell. Background Technology

[0002] Bipolar plates are key components in hydrogen electrolyzers. To improve their corrosion resistance, conductivity, and surface properties during use, nickel plating is performed on the surface of the bipolar plates.

[0003] For example, CN219490211U discloses "a nickel plating device", which includes: a tank, a filter mechanism and a lifting mechanism respectively installed on one side and the top of the tank; the filter mechanism includes a mounting platform installed on one side of the tank and a slot constructed on one side of the mounting platform, a drive motor installed on the top of the mounting platform, and the output end of the drive motor passes through the top of the mounting platform and is connected to a filter housing located inside the slot, a return pipe is inserted into the bottom of one side of the tank, and the end of the return pipe away from the tank passes through the outer wall of one side of the mounting platform and extends to the top of the filter housing, a return pump is installed on the return pipe, and bristles that abut against the corresponding side of the filter housing are evenly adhered to one side wall of the slot.

[0004] However, in existing technologies, due to the complex shape of bipolar plates, the components in the plating solution are prone to uneven distribution at different locations during the nickel plating process, resulting in inconsistent plating thickness. In some corners, edges, and holes, the plating may be too thin or there may be missed plating. The uniformity of the plating directly affects the uniformity of the current distribution on the surface of the bipolar plate. If the plating is uneven, the current will concentrate in the thinner areas, resulting in excessively high local current density, which may cause overheating and electrode polarization, reducing hydrogen production efficiency. In the thicker areas, the current density is relatively low, which may not be able to fully utilize the function of the bipolar plate. Summary of the Invention

[0005] The purpose of this invention is to provide a bipolar plate nickel plating apparatus for hydrogen electrolysis cells, in order to solve the problem mentioned in the background art that, due to the complex shape of the bipolar plate, the components in the plating solution are easily unevenly distributed in different positions during the nickel plating process, resulting in inconsistent plating thickness. In some corners, edges, and holes, the plating layer may be too thin or there may be missed plating.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a bipolar plate nickel plating device for a hydrogen electrolyzer, comprising a nickel plating treatment tank, a feeding mechanism installed on the side of the nickel plating treatment tank, and a filtration mechanism and a stirring mechanism fixedly connected to one end of the nickel plating treatment tank, the stirring mechanism being located above the filtration mechanism; the feeding mechanism being used to feed material into the nickel plating treatment tank; the filtration mechanism being used to filter impurities in the plating solution inside the nickel plating treatment tank; and the stirring mechanism being used to stir the plating solution inside the nickel plating treatment tank. The stirring mechanism includes an air compressor, a first guide pipe, a first connecting shaft, a second guide pipe, and a second connecting shaft. An air compressor is fixedly connected to one end of a nickel plating tank, and an air guide pipe is fixedly connected to the end of the air compressor. A filter box is installed inside the nickel plating tank, and the air guide pipe is fixedly connected to the filter box. A first guide pipe is fixedly connected to the filter box. A first connecting shaft is rotatably connected to the inside of the nickel plating tank, and a first impeller is fixedly connected to the surface of the first connecting shaft. A first stirring paddle is fixedly connected to the surface of the first connecting shaft. A second guide pipe is fixedly connected to the filter box, and a second connecting shaft is rotatably connected to the inside of the nickel plating tank. A second impeller is fixedly connected to the surface of the second connecting shaft, and a second stirring paddle is fixedly connected to the surface of the second connecting shaft.

[0007] Preferably, the bottom of the nickel plating treatment pool is funnel-shaped, and a No. 1 reinforcing plate and a No. 2 reinforcing plate are fixedly connected inside the nickel plating treatment pool.

[0008] Preferably, the first connecting shaft is located above the first reinforcing plate, and the first connecting shaft is rotatably connected to the first reinforcing plate.

[0009] Preferably, the first stirring paddle is located above the first connecting shaft, and the first guide pipe is fixedly connected to the end of the first guide head, which is located on the side of the first impeller.

[0010] Preferably, the second connecting shaft is located on the upper part of the second reinforcing plate, and the second connecting shaft is rotatably connected to the second reinforcing plate.

[0011] Preferably, the second stirring paddle is located above the second impeller, and the end of the second guide pipe is fixedly connected to the second guide head, which is located on the side of the second impeller.

[0012] Preferably, both the first guide head and the second impeller are horn tubes.

[0013] Preferably, the filtration mechanism includes a circulation pump, which is fixedly connected to the side of the nickel plating tank, and a main water pump is fixedly connected to the end of the circulation pump. A branch water pump is fixedly connected to the end of the main water pump, and the branch water pump is fixedly connected to the bottom of the nickel plating tank. An outlet water pipe is fixedly connected to the upper part of the circulation pump, and the outlet water pipe is fixedly connected to the filter box.

[0014] Preferably, the filter box has a mounting groove fixedly connected inside, a mounting plate is inserted into the mounting groove, and a filter plate is fixedly connected to the side of the mounting plate.

[0015] Preferably, the feeding mechanism includes a horizontal moving component, which is fixedly connected to the side of the nickel plating tank. A vertical moving component is fixedly connected to the moving end of the horizontal moving component. A mounting frame is fixedly connected to the moving end of the vertical moving component. A fixing plate is fixedly connected to the bottom of the mounting frame. An electric push rod is fixedly connected to the bottom of the fixing plate. A placement frame is installed at the bottom of the electric push rod. A limit rod is fixedly connected to the upper part of the placement frame. The limit rod is slidably inserted into the fixing plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. In this invention, the high-speed flowing plating solution is accelerated again by the No. 1 guide head, impacting the No. 1 impeller. The power of the plating solution flow drives the No. 1 connecting shaft and the No. 1 stirring paddle to rotate counterclockwise. At this time, the No. 1 impeller and the No. 1 stirring paddle stir the plating solution inside the nickel plating tank counterclockwise. Similarly, the plating solution inside the No. 2 guide pipe is accelerated again by the No. 2 guide head, impacting the No. 2 impeller. This drives the No. 2 connecting shaft and the No. 2 stirring paddle to rotate clockwise. At this time, the No. 2 impeller and the No. 2 stirring paddle stir the plating solution inside the nickel plating tank clockwise, thereby improving the uniformity of the substances in the plating solution inside the nickel plating tank.

[0018] 2. In this invention, by using the counterclockwise stirring of the No. 1 stirring paddle and the clockwise stirring of the No. 2 stirring paddle, the plating solution in the nickel plating treatment tank is mixed and impacted, thereby further improving the uniformity of the substances in the plating solution.

[0019] 3. In this invention, during the nickel plating process of the bipolar plate, the plating solution inside the nickel plating treatment tank is circulated into the filter box by a circulating pump through the branch pipe and the main pipe. The filter plate filters the impurities in the plating solution to avoid the impurities in the plating solution affecting the quality of the nickel plating layer of the bipolar plate. The filter plate is installed and disassembled by the plug-in connection between the mounting plate and the mounting groove, which facilitates the cleaning and replacement of the filter plate. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural schematic diagram of a bipolar plate nickel plating device for a hydrogen production electrolyzer according to the present invention;

[0021] Figure 2 This is a side view of a bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to the present invention.

[0022] Figure 3 This is a top view schematic diagram of a bipolar plate nickel plating device for a hydrogen electrolyzer according to the present invention;

[0023] Figure 4 This is a schematic diagram of the internal structure of the filter box in a bipolar plate nickel plating device for a hydrogen electrolyzer according to the present invention.

[0024] Figure 5 This is a top view of the No. 1 guide pipe in a bipolar plate nickel plating device for a hydrogen electrolyzer according to the present invention.

[0025] Figure 6 This is a three-dimensional structural diagram of the No. 2 guide pipe in a bipolar plate nickel plating device for a hydrogen electrolyzer according to the present invention.

[0026] Figure 7 This is a three-dimensional structural diagram of the feeding mechanism in a bipolar plate nickel plating device for a hydrogen electrolyzer according to the present invention.

[0027] In the diagram: 1. Nickel plating tank; 2. Filtration mechanism; 21. Circulation pump; 22. Main water supply pipe; 23. Outlet pipe; 24. Filter box; 25. Branch water supply pipe; 26. Filter plate; 27. Mounting slot; 28. Mounting plate; 3. Stirring mechanism; 31. Air compressor; 32. Air guide pipe; 33. No. 1 guide pipe; 34. No. 1 guide head; 35. No. 1 connecting shaft; 36. No. 1 impeller; 37. No. 1 stirring paddle; 38. No. 2 guide pipe; 39. No. 2 guide head; 310. No. 2 connecting shaft; 311. No. 2 impeller; 312. No. 2 stirring paddle; 4. Feeding mechanism; 41. Horizontal moving component; 42. Vertical moving component; 43. Mounting frame; 44. Fixing plate; 45. Electric push rod; 46. Placement frame; 47. Limiting rod. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Example 1: Refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7The diagram shows a bipolar plate nickel plating apparatus for a hydrogen electrolyzer, comprising a nickel plating tank 1, a feeding mechanism 4 mounted on the side of the nickel plating tank 1, and a filter mechanism 2 and a stirring mechanism 3 fixedly connected to one end of the nickel plating tank 1. The stirring mechanism 3 is located above the filter mechanism 2. The feeding mechanism 4 is used to feed materials into the nickel plating tank 1, the filter mechanism 2 is used to filter impurities in the plating solution inside the nickel plating tank 1, and the stirring mechanism 3 is used to stir the plating solution inside the nickel plating tank 1. Mechanism 3 includes an air compressor 31, a first guide pipe 33, a first connecting shaft 35, a second guide pipe 38, and a second connecting shaft 310. The air compressor 31 is fixedly connected to one end of the nickel plating tank 1, and an air guide pipe 32 is fixedly connected to the end of the air compressor 31. A filter box 24 is installed inside the nickel plating tank 1, and the air guide pipe 32 is fixedly connected to the filter box 24. The first guide pipe 33 is fixedly connected to the filter box 24. The first connecting shaft 35 is rotatably connected to the inside of the nickel plating tank 1, and... A first impeller 36 is fixedly connected to the surface of the first connecting shaft 35, and a first stirring paddle 37 is fixedly connected to the surface of the first connecting shaft 35. A second guide pipe 38 is fixedly connected to the filter box 24. A second connecting shaft 310 is rotatably connected to the inside of the nickel plating treatment tank 1, and a second impeller 311 and a second stirring paddle 312 are fixedly connected to the surface of the second connecting shaft 310. The first connecting shaft 35 is located above the first reinforcing plate, and the first connecting shaft 35 is rotatably connected to the first reinforcing plate. The first stirring paddle 37 is located above the first connecting shaft 35. The end of the first guide pipe 33 is fixedly connected to the first guide head 34, which is located on the side of the first impeller 36. The second connecting shaft 310 is located on the upper part of the second reinforcing plate and is rotatably connected to the second reinforcing plate. The second stirring paddle 312 is located above the second impeller 311. The end of the second guide pipe 38 is fixedly connected to the second guide head 39, which is located on the side of the second impeller 311.

[0030] In this embodiment, plating solution is added into the nickel plating treatment tank 1. While the filtration mechanism 2 is filtering the plating solution, the air compressor 31 injects compressed air into the filter box 24 through the air guide pipe 32, thereby increasing the pressure inside the filter box 24. This can accelerate the filtration speed of the plating solution and also accelerate the flow speed of the plating solution after filtration. The plating solution is circulated into the nickel plating treatment tank 1 through the first guide pipe 33 and the second guide pipe 38.

[0031] The high-speed flowing plating solution is accelerated again by the first guide head 34, impacting the first impeller 36. The flow power drives the first connecting shaft 35 and the first stirring paddle 37 to rotate counterclockwise. At this time, the first impeller 36 and the first stirring paddle 37 stir the plating solution inside the nickel plating treatment tank 1 counterclockwise. Similarly, the plating solution inside the second guide pipe 38 is accelerated again by the second guide head 39, impacting the second impeller 311. This drives the second connecting shaft 310 and the second stirring paddle 312 to rotate clockwise. At this time, the second impeller 311 and the second stirring paddle 312 stir the plating solution inside the nickel plating treatment tank 1 clockwise, improving the uniformity of the substances in the plating solution inside the nickel plating treatment tank 1.

[0032] By using the counterclockwise stirring of the No. 1 stirring paddle 37 and the clockwise stirring of the No. 2 stirring paddle 312, the plating solution in the nickel plating treatment tank 1 is mixed and impacted, further improving the uniformity of the substances in the plating solution.

[0033] Example 2: According to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the feeding mechanism 4 includes a horizontal moving component 41, which is fixedly connected to the side of the nickel plating tank 1. A vertical moving component 42 is fixedly connected to the moving end of the horizontal moving component 41. A mounting frame 43 is fixedly connected to the moving end of the vertical moving component 42. A fixing plate 44 is fixedly connected to the bottom of the mounting frame 43. An electric push rod 45 is fixedly connected to the bottom of the fixing plate 44. A placement frame 46 is installed at the bottom of the electric push rod 45. A limit rod 47 is fixedly connected to the upper part of the placement frame 46. The limit rod 47 is slidably inserted into the fixing plate 44.

[0034] The bottom of the nickel plating tank 1 is funnel-shaped, and a first reinforcing plate and a second reinforcing plate are fixedly connected inside the nickel plating tank 1. The first guide head 34 and the second impeller 311 are both horn tubes. The filtration mechanism 2 includes a circulation pump 21, which is fixedly connected to the side of the nickel plating tank 1. A main water pump 22 is fixedly connected to the end of the circulation pump 21, and a branch water pump 25 is fixedly connected to the end of the main water pump 22. The branch water pump 25 is fixedly connected to the bottom of the nickel plating tank 1. An outlet pipe 23 is fixedly connected to the upper part of the circulation pump 21, and the outlet pipe 23 is fixedly connected to the filter box 24. An installation groove 27 is fixedly connected inside the filter box 24, and an installation plate 28 is inserted into the installation groove 27. A filter plate 26 is fixedly connected to the side of the installation plate 28.

[0035] In this embodiment, plating solution is added into the nickel plating treatment tank 1, and the bipolar plate to be nickel plated is placed inside the placement rack 46. The horizontal position of the bipolar plate is adjusted by the horizontal moving component 41, and the vertical position of the bipolar plate is adjusted by the vertical moving component 42. Finally, the placement rack 46 and the bipolar plate placed inside it are placed into the nickel plating treatment tank 1 for nickel plating by extending the electric push rod 45. During the movement of the placement rack 46, the limiting rod 47 slides along the fixed plate 44 to limit the movement of the placement rack 46 and improve the stability of the movement of the placement rack 46.

[0036] During the nickel plating process of the bipolar plate, the plating solution inside the nickel plating treatment tank 1 is circulated into the filter box 24 by the circulation pump 21 through the water pumping branch pipe 25 and the water pumping main pipe 22. The impurities in the plating solution are filtered by the filter plate 26 to avoid the impurities in the plating solution from affecting the quality of the nickel plating layer of the bipolar plate.

[0037] The filter plate 26 is installed and removed by inserting the mounting plate 28 into the mounting groove 27, which facilitates the cleaning and replacement of the filter plate 26.

[0038] The method of use and working principle of this device: Add plating solution into the nickel plating treatment tank 1, place the bipolar plate to be nickel plated inside the placement rack 46, adjust the horizontal position of the bipolar plate by the horizontal moving component 41, adjust the vertical position of the bipolar plate by the vertical moving component 42, and finally place the placement rack 46 and the bipolar plate placed inside it into the nickel plating treatment tank 1 by extending the electric push rod 45 for nickel plating treatment.

[0039] During the nickel plating process of the bipolar plate, the plating solution inside the nickel plating treatment tank 1 is circulated into the filter box 24 by the circulation pump 21 through the water pumping branch pipe 25 and the water pumping main pipe 22, and the impurities in the plating solution are filtered by the filter plate 26.

[0040] While the filtration mechanism 2 filters the plating solution, the air compressor 31 injects compressed air into the filter box 24 through the air guide pipe 32, thereby increasing the pressure inside the filter box 24. The plating solution is circulated into the nickel plating treatment pool 1 through the first guide pipe 33 and the second guide pipe 38.

[0041] The high-speed flowing plating solution is accelerated again by the first guide head 34, impacting the first impeller 36. The power of the plating solution flow drives the first connecting shaft 35 and the first agitator 37 to rotate counterclockwise. Similarly, the plating solution inside the second guide pipe 38 is accelerated again by the second guide head 39, impacting the second impeller 311, driving the second connecting shaft 310 and the second agitator 312 to rotate clockwise.

[0042] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bipolar plate nickel plating apparatus for a hydrogen electrolyzer, comprising a nickel plating treatment tank (1), wherein a feeding mechanism (4) is installed on the side of the nickel plating treatment tank (1), and a filter mechanism (2) and a stirring mechanism (3) are fixedly connected to one end of the nickel plating treatment tank (1), wherein the stirring mechanism (3) is located above the filter mechanism (2), characterized in that: The feeding mechanism (4) is used to feed materials into the nickel plating tank (1). The filtration mechanism (2) is used to filter impurities in the plating solution inside the nickel plating tank (1). The stirring mechanism (3) is used to stir the plating solution inside the nickel plating tank (1). The stirring mechanism (3) includes an air compressor (31), a first guide pipe (33), a first connecting shaft (35), a second guide pipe (38), and a second connecting shaft (310). The air compressor (31) is fixedly connected to one end of the nickel plating tank (1), and an air guide pipe (32) is fixedly connected to the end of the air compressor (31). A filter box (24) is installed inside the nickel plating tank (1). (32) is fixedly connected to the filter box (24), the first guide pipe (33) is fixedly connected to the filter box (24), the first connecting shaft (35) is rotatably connected to the inside of the nickel plating treatment tank (1), and the first impeller (36) is fixedly connected to the surface of the first connecting shaft (35), and the first stirring paddle (37) is fixedly connected to the surface of the first connecting shaft (35). The second guide pipe (38) is fixedly connected to the filter box (24), the second connecting shaft (310) is rotatably connected to the inside of the nickel plating treatment tank (1), and the second impeller (311) is fixedly connected to the surface of the second connecting shaft (310), and the second stirring paddle (312) is fixedly connected to the surface of the second connecting shaft (310).

2. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The bottom of the nickel plating treatment tank (1) is funnel-shaped, and a No. 1 reinforcing plate and a No. 2 reinforcing plate are fixedly connected inside the nickel plating treatment tank (1).

3. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The first connecting shaft (35) is located on the upper part of the first reinforcing plate, and the first connecting shaft (35) is rotatably connected to the first reinforcing plate.

4. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The first stirring paddle (37) is located above the first connecting shaft (35), and the first guide pipe (33) is fixedly connected to the end of the first guide head (34), which is located on the side of the first impeller (36).

5. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The second connecting shaft (310) is located on the upper part of the second reinforcing plate, and the second connecting shaft (310) is rotatably connected to the second reinforcing plate.

6. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The second stirring paddle (312) is located above the second impeller (311), and the end of the second guide pipe (38) is fixedly connected to the second guide head (39), which is located on the side of the second impeller (311).

7. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 4, characterized in that: Both the first guide head (34) and the second impeller (311) are horn tubes.

8. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The filtration mechanism (2) includes a circulation pump (21), which is fixedly connected to the side of the nickel plating tank (1), and a main water pump (22) is fixedly connected to the end of the circulation pump (21). A branch water pump (25) is fixedly connected to the end of the main water pump (22), and the branch water pump (25) is fixedly connected to the bottom of the nickel plating tank (1). An outlet water pipe (23) is fixedly connected to the upper part of the circulation pump (21), and the outlet water pipe (23) is fixedly connected to the filter box (24).

9. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The filter box (24) is fixedly connected to the inside of the mounting groove (27), and the mounting plate (28) is inserted into the mounting groove (27). The side of the mounting plate (28) is fixedly connected to the filter plate (26).

10. The bipolar plate nickel plating apparatus for a hydrogen electrolyzer according to claim 1, characterized in that: The feeding mechanism (4) includes a horizontal moving component (41), which is fixedly connected to the side of the nickel plating tank (1). A vertical moving component (42) is fixedly connected to the moving end of the horizontal moving component (41). A mounting frame (43) is fixedly connected to the moving end of the vertical moving component (42). A fixing plate (44) is fixedly connected to the bottom of the mounting frame (43). An electric push rod (45) is fixedly connected to the bottom of the fixing plate (44). A placement frame (46) is installed at the bottom of the electric push rod (45). A limit rod (47) is fixedly connected to the upper part of the placement frame (46). The limit rod (47) is slidably inserted into the fixing plate (44).

Images