Method and equipment for detecting height of adhesive line after adhesive line bonding of metal bipolar plate

Abstract

The invention belongs to the technical field of glue lines, and particularly relates to a method and equipment for detecting the height of a glue line after a metal bipolar plate is bonded with the glue line. The reference point of each detection point is set to be the metal plate edge on the measurement point edge as the reference, so that the measured glue line height is based on the frame of the metal bipolar plate, the data of each point is not influenced by the deformation of the metal plate, and the detected quantity is more accurate; the problem that the heights of the rubber lines at all positions cannot be measured well after the rubber lines of the metal bipolar plate are bonded and cured is solved, and the situation that the height of the measured rubber lines and the selected reference are not affected by buckling deformation of the metal bipolar plate is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of glue lines, and in particular relates to a method and equipment for detecting the height of glue lines after the glue lines are bonded to metal bipolar plates. Background Art

[0002] Metal bipolar plates are formed by stamping thin plates into monopolar plates, and then combined into bipolar plates by laser welding. The stamping stress of the thin plate material causes large deformation. In addition, the superposition of thermal deformation after laser welding causes the warping deformation of the bipolar plate to become very large, especially at the three-cavity inlet and outlet of the bipolar plate. These defects easily cause uneven height of the glue point during the bonding process of the bipolar plate glue line. After the glue line is bonded and cured, the height of the glue line is also uneven. Under the standard pressing force, the height of the battery stack becomes higher, the volume becomes larger, the airtightness does not meet the standard, and the quality of the battery stack does not meet the performance requirements. When the standard height is met, the pressing force is too large, which has a great impact on the electrochemical reaction of the battery stack, thereby reducing the performance of the fuel cell. It has a great impact on the life and power generation efficiency of the fuel cell. In view of the above reasons, in the production process of the fuel cell, it is necessary to improve the accuracy of the bonding and curing measurement of the metal bipolar plate glue line. Through accurate measurement data, the glue line bonding process is improved so that the quality of the metal bipolar plate glue line meets the standard to solve the bottleneck process in the production process. This requires the development of a new detection method to solve this problem. Summary of the invention

[0003] In view of the above technical problems, the present invention provides a method and device for detecting the height of the glue line of a metal bipolar plate after the glue line of the metal bipolar plate is bonded and cured, which can measure the glue line height at all positions of the metal bipolar plate.

[0004] Specifically, the first aspect of the present invention is to provide a method for detecting the height of a glue line after bonding a metal bipolar plate, characterized in that the detection method comprises the following steps:

[0005] (1) Choose different testing platforms according to the product appearance and testing range;

[0006] (2) Setting the reference points and test locations;

[0007] (3) Through the set motion path, the sensor head scans the glue line after the metal bipolar plate is bonded to produce a 3D rendering of the glue line, measures the height of the glue line, and automatically measures the height data of the detection point relative to the metal plate frame;

[0008] (4) After all the inspection points are inspected, they are compared with the set upper and lower limits to determine NG or OK, that is, the metal bipolar plate glue line bonding is determined to be unqualified.

[0009] In some embodiments, the detection platform in step (1) is divided into adsorption type or compression type.

[0010] In some embodiments, the reference point in step (2) is the inner edge of each detected point, that is, the reference of each point is on the inner convex edge, and the inner convex edges are in the same plane.

[0011] In some embodiments, the number of detected positions in step (2) is 14, and the metal bipolar plate is divided into two channel areas, two distribution areas, one flow field area, one sealing area, and two sides, wherein two positions are selected from each of the two channel areas, two distribution areas, one flow field area, and one sealing area, and one position is selected from each of the two sides.

[0012] In some embodiments, the upper and lower limits set in step (4) are input according to product requirements.

[0013] In some embodiments, ten points are measured at each position and an average value of the ten points is taken.

[0014] In some embodiments, the OK result is determined if the detection results of the 14 positions are all within the set upper and lower limits, then it is determined as an OK result; the NG result is determined if the value of one of the 14 positions exceeds the upper limit or is lower than the lower limit, then it is determined as an NG result.

[0015] The second aspect of the present invention is to provide a device for detecting the height of the glue line after the metal bipolar plate is bonded, including a marble base and detection software. A Y-axis motion axis is provided in the middle of the marble base, and the Y-axis motion axis is connected to the R rotation motion axis. The top of the R rotation motion axis is connected to the detection platform. A sensor head is provided above the detection platform, and the sensor head is connected to the Z-axis motion axis, and the Z-axis motion axis is connected to the X-axis motion axis.

[0016] Beneficial effects:

[0017] The reference point of each detection point of the present invention is set to the edge of the metal plate on the edge of the measuring point as the reference, so that the measured glue line height is based on the frame of the metal bipolar plate. The data of each point is not affected by the deformation of the metal plate, and the detected quantity is more accurate. The problem that the glue line height of all positions of the metal bipolar plate cannot be well measured after the glue line of the metal bipolar plate is bonded and cured is solved, and the measured glue line height and the selected reference are avoided from being affected by the warping deformation of the metal bipolar plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of the device of the present invention;

[0019] Figure 2 This is the actual detection diagram of the present invention;

[0020] Figure 3 It is a partition diagram of the metal bipolar plate in the present invention;

[0021] Among them, 1. Y-axis motion axis; 2. Marble base; 3. R rotation motion axis; 4. Detection platform; 5. Sensor head; 6. X-axis motion axis; 7. Z-axis motion axis; 8. Detection software. DETAILED DESCRIPTION

[0022] The following will be a clear and complete description of the technical solution of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] The components of the embodiments of the present invention generally described and shown herein may be arranged and designed in a variety of different configurations. Therefore, the detailed description of the embodiments of the present invention provided below is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0024] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be noted that the directions or positional relationships indicated by "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0026] A first aspect of the present invention is to provide a method for detecting the height of a glue line after bonding a metal bipolar plate, characterized in that the detection method comprises the following steps:

[0027] (1) Choose different testing platforms according to the product appearance and testing range;

[0028] (2) Setting reference points and test locations;

[0029] (3) Through the set motion path, the sensor head scans the glue line after the metal bipolar plate is bonded to produce a 3D rendering of the glue line, measures the height of the glue line, and automatically measures the height data of the detection point relative to the metal plate frame;

[0030] (4) After all the inspection points are inspected, they are compared with the set upper and lower limits to determine NG or OK, that is, the metal bipolar plate glue line bonding is determined to be unqualified.

[0031] in, Figure 2A specific detection diagram is given.

[0032] In step 1, the detection platform is divided into an adsorption type or a compression type.

[0033] In step 2, the reference point is the inner edge of each detected point, that is, the reference of each point is on the inner convex edge, and the inner convex edges are in the same plane.

[0034] There are 14 locations detected in step 2. The metal bipolar plate is divided into two channel areas, two distribution areas, one flow field area, one sealing area, and two sides. Two locations are selected from each of the two channel areas, two distribution areas, one flow field area, and one sealing area, and one location is selected from each of the two sides. Figure 3 The partitions shown.

[0035] The upper and lower limits set in step 4 are input according to product requirements.

[0036] Ten points are measured at each position, and an average value of the ten points is taken.

[0037] The OK result is determined if the detection results of the 14 positions are all within the set upper and lower limits; the NG result is determined if the value of one of the 14 positions exceeds the upper limit or is lower than the lower limit.

[0038] The present invention provides a device for detecting the height of the glue line after the metal bipolar plate is bonded with the glue line, comprising a marble base 2 and a detection software 8. A Y-axis motion axis 1 is arranged in the middle of the marble base 2, and an R-rotation motion axis 3 is connected to the Y-axis motion axis 1. The top of the R-rotation motion axis 3 is connected to a detection platform 4. A sensing head 5 is arranged above the detection platform 4, and the sensing head 5 is connected to a Z-axis motion axis 7, and the Z-axis motion axis 7 is connected to an X-axis motion axis 6. Each motion axis moves through an electrode, and each data is input into the detection software 8. The detection software 8 controls the movement of the Y-axis motion axis 1, the R-rotation motion axis 3, the Z-axis motion axis 7, and the X-axis motion axis 6 to ensure that the sensing head 5 detects the glue line path and measures the height.

[0039] The working process is:

[0040] After the metal bipolar plate glue line is bonded and solidified, it is placed on the detection platform 4 and fixed, and then moved to the position set by the program. The sensor head 5 starts to scan the glue line on the metal plate to produce a 3D rendering of the glue line, and measures the height of the glue line. First, the height measurement reference is set, and then the detection point is set. The reference of each detection point is set to the metal plate edge on the edge of the measuring point as the reference. In this way, the measured glue line height is based on the frame of the metal bipolar plate. The data of each point is not affected by the deformation of the metal plate, and the detected quantity is more accurate. The position and movement path of all detection points of the metal bipolar plate are compiled, and the XYR movement axis automatically moves to the position of each detection point of the metal bipolar plate. The sensor head automatically scans the 3D map and automatically measures the height data of the point relative to the plate frame. When all points are detected, the software system determines whether the metal bipolar plate glue line bonding is unqualified based on the measured data and the set NG and OK data, and gives the judgment result.

[0041] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for detecting the height of a glue line after bonding a metal bipolar plate, characterized in that: The detection method comprises the following steps: (1) Choose different testing platforms according to the product appearance and testing range; (2) Setting the reference points and test locations; (3) Through the set motion path, the sensor head scans the glue line after the metal bipolar plate is bonded to produce a 3D rendering of the glue line, measures the height of the glue line, and automatically measures the height data of the detection point relative to the metal plate frame; (4) After all the inspection points are inspected, they are compared with the set upper and lower limits to determine NG or OK, that is, the metal bipolar plate glue line bonding is determined to be unqualified.

2. The method for detecting the height of the glue line after the metal bipolar plate is bonded according to claim 1, characterized in that: The detection platform in step (1) is divided into an adsorption type or a compression type.

3. The method for detecting the height of the glue line after the metal bipolar plate is bonded according to claim 3, characterized in that: In the step (2), the reference point is the inner edge of each detected point, that is, the reference of each point is on the inner convex edge, and the inner convex edges are in the same plane.

4. The method for detecting the height of the glue line after the metal bipolar plate is bonded according to claim 3, characterized in that: There are 14 positions detected in step (2), and the metal bipolar plate is divided into two channel areas, two distribution areas, one flow field area, one sealing area, and two sides. Two positions are selected from each of the two channel areas, two distribution areas, one flow field area, and one sealing area, and one position is selected from each of the two sides.

5. The method for detecting the height of the glue line after the metal bipolar plate is bonded according to claim 4, characterized in that: The upper and lower limits set in step (4) are input according to product requirements.

6. The method for detecting the height of the glue line after the metal bipolar plate is bonded according to claim 4, characterized in that: Ten points are measured at each position, and the average value of the ten points is taken.

7. The method for detecting the height of the glue line after the metal bipolar plate is bonded according to claim 4, characterized in that: The OK result is determined if the detection results of the 14 positions are all within the set upper and lower limits; the NG result is determined if the value of one of the 14 positions exceeds the upper limit or is lower than the lower limit.

8. A device for detecting the height of the glue line after the metal bipolar plate is bonded according to any one of claims 1 to 7, characterized in that: The invention comprises a marble base (2) and detection software (8); a Y-axis motion shaft (1) is arranged in the middle of the marble base (2); an R-rotation motion shaft (3) is connected to the Y-axis motion shaft (1); the top of the R-rotation motion shaft (3) is connected to a detection platform (4); a sensor head (5) is arranged above the detection platform (4); the sensor head (5) is connected to a Z-axis motion shaft (7); and the Z-axis motion shaft (7) is connected to an X-axis motion shaft (6).

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