Testing device and testing system

Abstract

The embodiment of the invention discloses a testing device and a testing system. The testing device comprises a simulation load which is used for providing a heat source and is arranged adjacent to a to-be-tested radiator, and the to-be-tested radiator is used for cooling the simulation load; the temperature acquisition module is arranged in the simulation load and is used for acquiring temperature information of the simulation load; the sensing module is arranged inside or on the surface of the to-be-tested radiator and used for collecting heat exchange information of the to-be-tested radiator; and the control module is respectively connected with the simulation load, the temperature acquisition module and the sensing module, and the control module is used for testing the heat dissipation efficiency of the to-be-tested radiator according to the temperature information and the heat exchange information of the simulation load. In the testing device provided by the invention, the simulation load can simulate the heating characteristics of different loads, and the sensor can accurately measure various physical quantities, so that the accurate evaluation of the heat dissipation performance of the high-power chip is realized, and the automation and accuracy of the testing process are ensured.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of chip technology, and in particular to a testing device and a testing system. Background Art

[0002] With the rapid development of high-performance computing chips, especially in the field of AI (Artificial Intelligence), high-power chips such as CPU (Central Processing Unit), GPU (Graphics Processing Unit) and DPU (Data Processing Unit) will generate a lot of heat during operation, which requires timely and effective heat dissipation. However, the existing technology lacks effective evaluation of the performance of high-power chip cooling systems, which restricts the further development of high-power chips. Summary of the invention

[0003] The embodiments of the present invention provide a testing device and a testing system to effectively evaluate the performance of the heat dissipation system of a high-power chip and provide support for the sustainable development of high-performance computing chips.

[0004] In order to achieve the above technical problems, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a testing device, including:

[0006] A simulated load, the simulated load is used to provide a heat source and is used to be arranged adjacent to the radiator to be tested, and the radiator to be tested is used to dissipate heat for the simulated load;

[0007] A temperature acquisition module, disposed inside the simulated load, for acquiring temperature information of the simulated load;

[0008] A sensor module is arranged inside or on the surface of the radiator to be tested, and is used to collect heat exchange information of the radiator to be tested;

[0009] A control module, wherein the control module is connected to the simulated load, the temperature acquisition module and the sensor module respectively, and the control module is used to test the heat dissipation efficiency of the radiator to be tested according to the temperature information of the simulated load and the heat exchange information.

[0010] In a second aspect, an embodiment of the present invention provides a testing system, including: the testing device described in any one of the above embodiments.

[0011] The embodiment of the present invention forms an efficient heat dissipation performance testing device by connecting a simulated load, a temperature acquisition module, a sensor module and a control module. The power of the simulated load can be adjusted to simulate the heating conditions of different loads; the temperature acquisition module accurately senses the temperature of the simulated load through a temperature sensor; and a plurality of sensors are provided in the sensor module, which can accurately collect information of a variety of physical quantities. Through the coordinated work of various components, the test device provided by the present invention can realize the accurate evaluation of the heat dissipation performance of high-power chips, ensure the automation and accuracy of the test process, and thus promote the continuous progress of high-performance electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0013] Figure 1 is a schematic diagram of a testing device provided by an embodiment of the present invention;

[0014] Figure 2 is a schematic diagram of a thick film resistor provided by an embodiment of the present invention;

[0015] Figure 3 is a schematic diagram of the connection relationship of a temperature sensor provided by an embodiment of the present invention;

[0016] Figure 4 is a schematic diagram of another testing device provided by an embodiment of the present invention;

[0017] Figure 5 Schematic diagram of another testing device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0019] Based on the above technical problems, this embodiment proposes the following solutions:

[0020] Figure 1 Schematic diagram of a test device provided by an embodiment of the present invention. Figure 1 As shown, the test device includes:

[0021] The simulated load 110 is used to provide a heat source and is arranged adjacent to the heat sink to be tested. The heat sink to be tested is used to dissipate heat for the simulated load 110 .

[0022] The temperature acquisition module 120 is disposed inside the simulated load 110 and is used to acquire temperature information of the simulated load 110 .

[0023] The sensor module 130 is disposed inside or on the surface of the radiator to be tested, and is used to collect heat exchange information of the radiator to be tested.

[0024] The control module 140 is connected to the simulated load 110 , the temperature acquisition module 120 and the sensor module 130 respectively. The control module 140 is used to test the heat dissipation efficiency of the radiator to be tested according to the temperature information and heat exchange information of the simulated load 110 .

[0025] Specifically, the simulated load 110 refers to a heat source used to simulate actual working conditions in a test environment. The simulated load 110 is arranged next to the radiator to be tested to ensure that the heat can be effectively transferred to the radiator to be tested, thereby testing the heat dissipation effect of the radiator to be tested. The radiator to be tested refers to a heat dissipation device to be tested, which mainly dissipates heat to the surrounding environment by means of heat conduction, convection or radiation, to ensure that the electronic components or systems connected thereto (the simulated load 110 in the embodiment of the present invention) operate within a safe operating temperature range. Exemplarily, the radiator to be tested can be various types of radiators, including air-cooled radiators, water-cooled radiators, heat pipe radiators, etc. The specific selection depends on the test requirements and application scenarios.

[0026] The temperature acquisition module 120 refers to an electronic device for monitoring and recording temperature data, which is disposed inside the simulated load 110 and can acquire temperature information of the simulated load 110 in real time to evaluate its performance and heat dissipation effect.

[0027] The sensor module 130 refers to an integrated electronic component that is specifically used to monitor and collect information about specific physical quantities. The sensor module 130 is set inside or on the surface of the heat sink to be tested and is mainly used to collect data related to its heat exchange performance, including temperature changes, heat flux density and other parameters, and then monitor the working status of the heat sink to be tested in real time to ensure that the chip operates within a safe range.

[0028] The control module 140 refers to an integrated electronic system that is responsible for coordinating and managing the operation of each component. During the test, the control module 140 can adjust the working state of the simulated load 110 according to the actual situation, and provide real-time feedback on the evaluation results of the heat dissipation efficiency, provide users with intuitive performance analysis, and help optimize the heat dissipation effect of the chip. Exemplarily, the control module 140 may include components such as an STM32 single-chip microcomputer, a data processing unit, and peripheral circuits.

[0029] In the embodiment of the present invention, the simulated load 110 is responsible for providing a heat source and is arranged adjacent to the radiator to be tested so that the radiator to be tested can effectively dissipate heat. The temperature acquisition module 120 is located inside the simulated load 110 and monitors the temperature information of the simulated load 110 in real time. The sensor module 130 is installed inside or on the surface of the radiator to be tested and is responsible for collecting the heat dissipation information of the radiator to be tested. All modules are connected through the control module 140, and the control module 140 analyzes and tests the heat dissipation efficiency of the radiator to be tested based on the acquired temperature and heat dissipation data.

[0030] The embodiment of the present invention forms an efficient heat dissipation performance testing device by connecting the simulated load 110, the temperature acquisition module 120, the sensor module 130 and the control module 140. Among them, the power of the simulated load 110 can be adjusted to simulate the heating conditions of different loads; the temperature acquisition module 120 accurately senses the temperature of the simulated load through the temperature sensor; and the sensor module 130 is provided with multiple sensors, which can accurately collect a variety of physical quantity information. Through the coordinated work of various components, the test device provided by the present invention can realize the accurate evaluation of the heat dissipation performance of high-power chips, ensure the automation and accuracy of the test process, and thus promote the continuous progress of high-performance electronic devices.

[0031] Optionally, the simulated load includes: a substrate, the material of the substrate includes a thermally conductive ceramic material; a thick film resistor, which is arranged on one side of the substrate, and the thick film resistor is used to generate heat to simulate chip heating; optionally, the simulated load also includes a packaging layer, which is arranged on a side of the thick film resistor away from the substrate; and the temperature acquisition module is arranged between the substrate and the packaging layer.

[0032] Optionally, based on the above embodiments, the simulated load may include a substrate and a thick film resistor. Specifically, the substrate refers to the basic structure of the simulated load, has good thermal conductivity, and can effectively conduct the generated heat. Thermally conductive ceramic materials refer to a class of ceramic materials with good thermal conductivity, which are mainly used for thermal management and heat dissipation applications, can effectively conduct heat, and excel in electrical insulation and chemical stability. Exemplarily, the thermally conductive ceramic material can be aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, etc.

[0033] Thick film resistors refer to resistors made of conductive materials (thick film), usually made by coating conductive materials on insulating substrates. Thick film resistors are installed on one side of the substrate to generate heat and simulate the heat generated by the chip during operation. By adjusting the current, thick film resistors can simulate different power outputs, thereby testing the performance of the heat sink under various loads.

[0034] Exemplarily, in an embodiment of the present invention, a multilayer aluminum nitride ceramic substrate is used, and a thick film resistor is coated on one side of the substrate, and a high-precision digital temperature sensor is used to monitor the temperature of the simulated load in real time. This design constitutes a low-temperature co-fired ceramic (LTCC) circuit with high thermal conductivity, which can effectively simulate the heating characteristics of the chip and realize accurate temperature monitoring. Among them, the thermal conductivity of the multilayer aluminum nitride ceramic substrate can reach 170-230W / m·K, so that the high thermal conductivity LTCC circuit can simulate a heating power of more than 800W.

[0035] Optionally, based on the above embodiments, the simulated load may further include an encapsulation layer. The encapsulation layer refers to a protective layer located on the side of the thick film resistor away from the substrate, which can protect the thick film resistor and its internal structure, and can also affect the radiation and dissipation of heat. The temperature acquisition module refers to a monitoring device arranged between the substrate and the encapsulation layer, which is responsible for real-time monitoring of the temperature changes of the thick film resistor and the surrounding environment, and provides important temperature data for the thermal management and performance evaluation of the system.

[0036] In the embodiment of the present invention, the packaging layer can effectively manage heat, help the chip dissipate heat, and protect the circuit from physical damage, dust, moisture and chemicals, thereby extending its service life.

[0037] Optionally, based on the above embodiments, Figure 2 Schematic diagram of a thick film resistor provided by an embodiment of the present invention. Figure 3 Schematic diagram of the connection relationship of a temperature sensor provided by an embodiment of the present invention. Figures 1 to 3 The thick film resistor may include at least two resistors connected in parallel, the resistors are arranged at intervals, and the heating areas of two adjacent resistors are different; the temperature acquisition module 120 includes at least two temperature sensors 121, and the temperature sensors 121 are arranged corresponding to the resistors.

[0038] Specifically, the spacing setting refers to a certain physical spacing between each resistor. The heating area refers to the heat distribution area generated by the resistor when it is working. Different resistors can produce different heating areas due to differences in design and materials to simulate the heat distribution inside the chip. A temperature sensor refers to a device that can sense temperature changes and output corresponding signals.

[0039] like Figure 2As shown, the first resistor R1, the second resistor R2, the third resistor R3 and the fourth resistor R4 are connected in parallel to form an integral electric heat simulation load. The four resistors are arranged at intervals to facilitate simulating the heating conditions of different areas, and the design of each resistor (such as resistance value and area) can be adjusted so that they generate different heating powers when connected in parallel, thereby simulating the heating characteristics of the chip under different working conditions.

[0040] Combination Figure 3 and Figure 4 As shown, a temperature sensor 121 is used as an example for explanation. The temperature sensor 121 has 8 pins, among which the DXP pin and the DXN pin are connected in parallel with the capacitor C1, and are also connected in parallel with the series circuit composed of the resistor R5, the transistor Q1 and the resistor R6. The A1 pin is suspended, the A0 pin is grounded, the V+ pin is connected to a high level, the SCL pin is used to transmit the signal P1, the SDA pin is used to transmit the signal P2, the SCL pin and the SDA pin are respectively connected to the corresponding pins of the control module 140, and the GND pin is grounded. The temperature sensor and the resistor of the temperature acquisition module are set correspondingly, that is, each resistor corresponds to a temperature sensor to measure the temperature of the resistor in real time.

[0041] In the embodiment of the present invention, the temperature sensor 121 and the control module 140 can be connected via I 2 C protocol for signal transmission, where I 2 C protocol refers to a serial communication protocol used to transmit data between integrated circuits. 2 C uses two signal lines: one is the serial data line (Serial Data Line, SDA), the other is the serial clock line (Serial Clock Line, SCL), which can connect the microcontroller and various external devices within a short distance.

[0042] In the embodiment of the present invention, a thermally conductive ceramic substrate and a thick film resistor are packaged to obtain a simulated load. By adjusting the current of the thick film resistor, its heating power can be flexibly changed, thereby simulating the thermal behavior of the chip under different working conditions. In addition, a temperature sensor is used to monitor the heating condition of each resistor in real time. These designs enable the present invention to improve the heating simulation accuracy of the simulated load, thereby enhancing the authenticity and reliability of the chip heating test device.

[0043] Figure 4 Schematic diagram of another testing device provided by an embodiment of the present invention. Figure 4 As shown, optionally, based on the above embodiments, the testing device includes: an adjustable power supply 150, the adjustable power supply 150 is connected to the simulated load 110; the adjustable power supply 150 is used to adjust the heating power of the simulated load 110 according to the output voltage value.

[0044] Specifically, the adjustable power supply 150 refers to a power supply device capable of adjusting output voltage or current, allowing a user to set a specific voltage value as required to provide the required power to a load.

[0045] In the test device provided in the embodiment of the present invention, the main function of the adjustable power supply 150 is to adjust the heating power of the simulated load 110 connected thereto according to the set output voltage value, so that the test equipment can perform performance evaluation under different working conditions.

[0046] Continue to see Figure 4 Optionally, based on the above embodiments, the test device includes: a communication connector 160, the communication connector 160 is connected between the control module 140 and the adjustable power supply 150, the control module 140 is used to generate a control signal according to the temperature information of the simulated load 110, and the control signal is used to be transmitted to the adjustable power supply 150 through the communication connector 160; the adjustable power supply 150 is used to adjust the output voltage value according to the control signal.

[0047] Specifically, the communication connector 160 refers to an interface for realizing data transmission between different devices. In an embodiment of the present invention, the communication connector 160 is connected between the control module 140 and the adjustable power supply 150, and is responsible for transmitting control signals. Exemplarily, the communication connector 160 can be connected to the control module 140 or the adjustable power supply 150 via the CAN bus to achieve efficient data transmission and communication between devices. Among them, the CAN bus refers to a serial communication protocol for connecting microcontrollers and devices, which has strong anti-interference capabilities and error detection mechanisms, can operate stably in complex electrical environments, and ensure accurate transmission of control signals and temperature data. Through the CAN bus, the control module 140 can obtain information from the simulated load 110 and the temperature sensor in real time, and quickly send the control signal to the adjustable power supply 150. This fast response capability improves the dynamic regulation performance of the system and ensures that the simulated load 110 can accurately reflect the heating characteristics of the chip.

[0048] Temperature information refers to data about the temperature of an object or environment collected by a temperature sensor. These data are usually represented in the form of digital or analog signals, and can reflect the temperature state of the object being measured in real time. Exemplarily, the temperature information may include: current temperature value, temperature change rate, temperature history data, etc. The control signal refers to an instruction issued by the control module 140, which is used to adjust the working state of the simulated load 110 and the output of the adjustable power supply 150.

[0049] The embodiment of the present invention solves the problem of inaccurate control of the heating characteristics of the simulated load 110 in the traditional testing device by introducing an adjustable power supply 150 and a communication connector 160, so that the control module 140 can generate a control signal in real time according to the temperature information of the simulated load 110, thereby flexibly adjusting the output voltage value of the adjustable power supply 150 to ensure the accuracy and reliability of the testing process.

[0050] Optionally, based on the above embodiments, the sensing module includes: a flow sensor, which is arranged in the liquid cooling pipeline of the radiator to be tested, and is used to detect the flow information of the liquid cooling pipeline of the radiator to be tested; a pressure sensor, which is arranged in the input pipeline and the return pipeline of the liquid cooling pipeline of the radiator to be tested, and is used to detect the first pressure information of the input pipeline and the second pressure information of the return pipeline; at least two temperature sensors, which are respectively arranged in the input pipeline and the return pipeline of the liquid cooling pipeline of the radiator to be tested; the temperature sensor is used to detect the first temperature information of the liquid flowing through the input pipeline and the second temperature information of the liquid flowing through the return pipeline; a control module is connected to the flow sensor and the temperature sensor, and the control module determines the heat dissipation efficiency of the radiator to be tested according to the flow information, the first pressure information, the second pressure information, the first temperature information, the second temperature information, and the temperature information of the simulated load.

[0051] In an embodiment of the present invention, the radiator to be tested may be a liquid-cooled radiator. A liquid-cooled radiator refers to a heat dissipation device that uses liquid as a cooling medium to effectively reduce the temperature of a device. Its working principle is to use flowing coolant to transfer heat from a component that needs to be dissipated (such as an electronic component or an engine) to the radiator, and then dissipate the heat to the surrounding environment through the surface of the radiator.

[0052] Specifically, a flow sensor refers to a device used to measure the flow rate of a fluid in a pipeline, and can monitor the liquid flow information in the liquid cooling pipeline of the radiator to be tested in real time. The liquid cooling pipeline refers to the pipeline used for liquid circulation when the radiator to be tested is liquid-cooled. Flow information refers to the dynamic change data information of the liquid flow in the liquid cooling pipeline monitored by the flow sensor. The flow information can be used to analyze whether the heat dissipation device is working within the normal range.

[0053] A pressure sensor refers to a device used to measure the pressure of liquid or gas, and is usually installed in the input and return pipes of the liquid cooling pipeline of the radiator to be tested. Among them, the input pipe of the liquid cooling pipeline refers to the pipe through which liquid or gas flows into the radiator. In a liquid cooling system, the input pipe is responsible for introducing coolant (such as water or special coolant) from an external system into the radiator for heat exchange. The return pipe of the liquid cooling pipeline refers to the pipe through which liquid or gas flows from the radiator back to the external system or liquid storage device. In a liquid cooling system, the return pipe is responsible for guiding the liquid that has passed through the radiator back, usually for recycling. Installing the pressure sensor in the input and return pipes of the liquid cooling pipeline of the radiator to be tested, respectively, to monitor the pressure of the inflowing and outflowing liquid, helps to analyze the liquid flow state, evaluate the working performance of the radiator, and provide important data support for the calculation of heat dissipation efficiency and system optimization.

[0054] The first pressure information refers to the pressure data detected by the pressure sensor located in the input pipeline of the liquid cooling pipeline. The second pressure information refers to the pressure data detected by the pressure sensor located in the return pipeline of the liquid cooling pipeline. By monitoring the first pressure information and the second pressure information, the workload of the radiator to be tested and the stability of the liquid flow can be evaluated.

[0055] The first temperature information refers to the temperature data monitored by the temperature sensor placed in the condensation pipeline of the radiator to be tested. The second temperature information refers to the temperature data monitored by the temperature sensor placed in the return pipeline of the radiator to be tested. By monitoring the first temperature information and the second temperature information, the heat dissipation status of the input and output liquid of the radiator to be tested can be evaluated.

[0056] Heat dissipation efficiency refers to the effectiveness of a heat sink in transferring heat from one medium (such as an electronic component) to another medium (such as a coolant) during operation. By calculating the heat dissipation efficiency, it is possible to evaluate the performance of the heat sink in actual applications, determine whether it meets the design requirements, and ensure its reliability and efficiency under various working conditions.

[0057] The embodiment of the present invention determines the heat dissipation efficiency of the radiator to be tested (liquid-cooled radiator) through the flow, pressure and temperature information monitored by the flow sensor, pressure sensor and temperature sensor in the sensor module, as well as the temperature information of the simulated load, so as to evaluate the heat dissipation effect of the radiator to be tested, ensure the effectiveness and accuracy of the test process, and provide a basis for test device optimization and fault diagnosis.

[0058] Optionally, based on the above embodiments, the sensing module includes: a speed sensor, which is arranged on the fan shaft of the radiator to be tested, and is used to detect the speed information of the fan of the radiator to be tested; a control module is connected to the speed sensor, and the control module is used to determine the heat dissipation efficiency of the radiator to be tested based on the speed information and the temperature information of the simulated load.

[0059] In the embodiment of the present invention, the heat sink to be tested may be an air-cooled heat sink, which refers to a heat sink that uses air as a cooling medium to transfer heat from the device to the surrounding environment by natural convection or forced convection. Its working principle is to introduce air flow into the surface of the heat sink through a fan or natural airflow, so that the heat sink absorbs the heat generated by the device and dissipates it into the air.

[0060] Specifically, a speed sensor refers to a device used to measure the speed of a rotating object, which can monitor the rotation speed of an object in real time, and is usually expressed in revolutions per minute (RPM). The fan shaft refers to the component that connects the fan blades and the motor, which is responsible for transmitting power to drive the fan to rotate. In an air-cooled radiator, the state of the fan shaft directly affects the fan's working efficiency and air circulation performance. Speed ​​information refers to the rotation speed data of the radiator fan to be tested obtained by a speed sensor. This information is usually expressed in revolutions per minute (RPM) and is used to evaluate the fan's contribution to air flow during the heat dissipation process. The fan speed directly affects the heat dissipation effect of the radiator. The higher the speed, the stronger the airflow generated and the better the heat dissipation effect.

[0061] The embodiment of the present invention determines the heat dissipation efficiency of the radiator to be tested (air-cooled radiator) through the speed information monitored by the speed sensor and the temperature information of the simulated load, so as to evaluate the heat dissipation effect of the radiator to be tested, ensure the effectiveness and accuracy of the test process, and provide a basis for test device optimization and fault diagnosis.

[0062] Optionally, based on the above embodiments, the control module is further used to determine whether the heat dissipation efficiency of the radiator to be tested is qualified according to the difference between the heat dissipation efficiency of the radiator to be tested and the preset heat dissipation efficiency.

[0063] Specifically, the preset heat dissipation efficiency refers to the theoretical maximum heat dissipation efficiency value set by the heat sink to be tested according to the expected working conditions and application requirements during the design and manufacturing stage. If the heat dissipation efficiency of the heat sink to be tested is lower than the preset heat dissipation efficiency, a warning message can be issued in the corresponding display module to adjust the heat dissipation device in time, thereby enhancing the reliability and response speed of the heat dissipation test device.

[0064] Figure 5 Schematic diagram of another testing device provided by an embodiment of the present invention. Figure 5As shown, optionally, based on the above embodiments, the test device further includes: a power adapter 170, the power adapter 170 is used to transmit a first voltage signal; a voltage-stabilized power supply 180, connected to the power adapter 170, the voltage-stabilized power supply 180 is used to step down the first voltage signal and output a second voltage signal; the voltage-stabilized power supply 180 is connected to the control module 140, the voltage-stabilized power supply 180 is used to supply power to the control module 140; an input module 190, connected to the control module 140, the input module 190 is used to input test information; a display module 100, connected to the control module 140, the display module 100 is used to display the test information of the radiator to be tested according to the control signal of the control module 140; the test information includes the temperature information of the simulated load 110, the test efficiency of the radiator to be tested, the heat exchange information and the qualified information.

[0065] Specifically, the power adapter 170 refers to a device for converting AC power into a DC power suitable for use with the device, which can provide a stable power supply, ensure the normal operation of the entire test device, and avoid equipment failures caused by unstable voltage. The first voltage signal refers to the voltage signal output by the power adapter 170, which is usually a DC voltage generated after AC power conversion. The first voltage signal is the initial power signal supplied to the entire test device and has a higher voltage value.

[0066] The stabilized power supply 180 refers to a power supply device that can provide a stable output voltage to ensure that the connected electronic device (such as the control module 140) can obtain the required voltage supply under various conditions. The second voltage signal refers to the voltage signal output by the stabilized power supply 180 after voltage reduction and regulation. The second voltage signal is generated by the stabilized power supply 180 after regulation according to the first voltage signal, and meets the working requirements of the control module 140 and other devices.

[0067] The input module 190 refers to an input terminal for receiving test information. The input module 190 allows the user to input customized test information, making the test process more flexible and improving the pertinence and effectiveness of the test. Exemplarily, the input module 190 may include a key. The display module 100 refers to a device that displays relevant test information of the radiator to be tested according to the control signal of the control module so that the user can monitor in real time. Exemplarily, the display module 100 may be an LCD display, an OLED display, an LED display, etc.

[0068] In the embodiment of the present invention, the power adapter 170 provides power for the entire test device, and the voltage stabilizer 180 is connected to the power adapter 170 to ensure that the input voltage is stable within a suitable range. The user inputs test-related parameters and information through the input module 190, and the control module 140 processes them. When the heat dissipation efficiency of the radiator to be tested is lower than the preset value, the control module 140 can issue a warning message and prompt the user through the display module 100 to ensure that adjustment measures are taken in time to improve the heat dissipation performance.

[0069] The embodiment of the present invention realizes comprehensive monitoring and evaluation of the performance of the radiator to be tested through the cooperation of multiple components such as the power adapter 170, the voltage-stabilized power supply 180, the control module 140, the input module 190 and the display module 100. The present invention not only improves the accuracy and real-time performance of the test device, but also enhances the user's operating experience, ensuring that the radiator to be tested can operate reliably and safely under various working conditions.

[0070] An embodiment of the present invention further provides a testing system, which may include: the testing device provided by any embodiment of the present invention, having the functional modules and beneficial effects of the corresponding device.

[0071] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A testing device, characterized in that: include: A simulated load, the simulated load is used to provide a heat source and is used to be arranged adjacent to the radiator to be tested, and the radiator to be tested is used to dissipate heat for the simulated load; A temperature acquisition module, disposed inside the simulated load, for acquiring temperature information of the simulated load; A sensor module is arranged inside or on the surface of the radiator to be tested, and is used to collect heat exchange information of the radiator to be tested; A control module, wherein the control module is connected to the simulated load, the temperature acquisition module and the sensor module respectively, and the control module is used to test the heat dissipation efficiency of the radiator to be tested according to the temperature information of the simulated load and the heat exchange information.

2. The testing device according to claim 1, characterized in that: The simulated load includes: A substrate, wherein the material of the substrate comprises a thermally conductive ceramic material; A thick film resistor is disposed on one side of the substrate, and the thick film resistor is used to generate heat to simulate chip heating; Optionally, the simulated load further includes a packaging layer, which is arranged on a side of the thick film resistor away from the substrate; The temperature acquisition module is arranged between the substrate and the packaging layer.

3. The testing device according to claim 2, characterized in that: The thick film resistor comprises at least two resistors connected in parallel, the resistors are arranged at intervals, and the heating areas of two adjacent resistors are different; The temperature acquisition module includes at least two temperature sensors, and the temperature sensors are arranged corresponding to the resistors.

4. The testing device according to claim 1, characterized in that: The testing device further includes: an adjustable power supply, wherein the adjustable power supply is connected to the simulated load; The adjustable power supply is used to adjust the heating power of the simulated load according to the output voltage value.

5. The testing device according to claim 4, characterized in that: The testing device also includes: a communication connector, which is connected between the control module and the adjustable power supply, the control module is used to generate a control signal according to the temperature information of the simulated load, and the control signal is used to be transmitted to the adjustable power supply through the communication connector; the adjustable power supply is used to adjust the output voltage value according to the control signal.

6. The testing device according to claim 1, characterized in that: The sensor module comprises: A flow sensor, the flow sensor is arranged in the liquid cooling pipeline of the radiator to be tested, and the flow sensor is used to detect the flow information of the liquid cooling pipeline of the radiator to be tested; A pressure sensor, the pressure sensor is arranged in an input pipeline and a return pipeline of the liquid cooling pipeline of the radiator to be tested, and the pressure sensor is used to detect first pressure information of the input pipeline and second pressure information of the return pipeline; At least two temperature sensors, the temperature sensors are respectively arranged in the input pipeline and the return pipeline of the liquid cooling pipeline of the radiator to be tested; the temperature sensors are used to detect the first temperature information of the liquid flowing through the input pipeline and the second temperature information of the liquid flowing through the return pipeline; The control module is connected to the flow sensor and the temperature sensor, and determines the heat dissipation efficiency of the radiator to be tested according to the flow information, the first pressure information, the second pressure information, the first temperature information and the second temperature information, and the temperature information of the simulated load.

7. The testing device according to claim 1, characterized in that: The sensor module comprises: A rotation speed sensor, the rotation speed sensor is arranged on the fan shaft of the radiator to be tested, and the rotation speed sensor is used to detect the rotation speed information of the fan of the radiator to be tested; The control module is connected to the rotation speed sensor, and is used to determine the heat dissipation efficiency of the radiator to be tested according to the rotation speed information and the temperature information of the simulated load.

8. The testing device according to claim 1, characterized in that: The control module is further used to determine whether the heat dissipation efficiency of the radiator to be tested is qualified according to the difference between the heat dissipation efficiency of the radiator to be tested and the preset heat dissipation efficiency.

9. The testing device according to claim 1, characterized in that: The testing device further comprises: A power adapter, wherein the power adapter is used to transmit a first voltage signal; A voltage-stabilized power supply connected to the power adapter, the voltage-stabilized power supply being used to step down the first voltage signal and output a second voltage signal; The voltage-stabilized power supply is connected to the control module, and the voltage-stabilized power supply is used to supply power to the control module; An input module, connected to the control module, and used for inputting test information; A display module is connected to the control module, and is used to display the test information of the radiator to be tested according to the control signal of the control module; the test information includes the temperature information of the simulated load, the test efficiency of the radiator to be tested, heat exchange information and qualification information.

10. A testing system, characterized in that: include: A test device as claimed in any one of claims 1 to 9.

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