Defect detection method and device applied to additive manufacturing and electronic equipment

Abstract

The invention relates to a defect detection method and device applied to additive manufacturing and electronic equipment. The method comprises the steps that at least one layer of component material is printed on a manufacturing substrate, and multiple layers of component materials are stacked to form a target component; after any layer of component material is printed, defect detection is conducted on the component material on the current manufacturing substrate through air coupling ultrasonic guided waves; after defect detection is performed on a component material on a current manufacturing substrate through air coupling ultrasonic guided waves, at least one layer of component material is printed on the manufacturing substrate. According to the defect detection method, non-contact air coupling ultrasonic guided waves are adopted for defect detection in the additive manufacturing process, on the premise that the components are not damaged and the additive machining environment is not separated, the manufactured components can be detected in real time, the bonding condition between all layers of component materials is evaluated, and the defect detection accuracy is improved. The layering and debonding conditions of component materials are found in time, and the machining quality and the process stability of additive manufacturing are improved.

Description

Technical Field

[0001] The present disclosure relates to the field of additive manufacturing technology, and in particular to a defect detection method, device and electronic equipment applied to additive manufacturing. Background Art

[0002] Additive manufacturing technology, also known as 3D printing technology, is a technology that manufactures physical parts by adding materials layer by layer based on three-dimensional CAD data. As an advanced forming and manufacturing process, additive manufacturing technology can meet the needs of efficient and flexible manufacturing of various complex products, and realize the integrated manufacturing and forming of various complex components such as honeycomb lattice structures and reinforced structures. It has broad application prospects in aerospace, transportation, energy and chemical industry, construction, bioengineering and other fields.

[0003] Compared with traditional compression molding, additive manufacturing technology has a higher degree of freedom in processing and manufacturing, and has unique advantages in preparing components with complex shapes or complex internal structures. However, since the processing parameters of additive composite manufacturing are more complex, in order to ensure the processing quality of processed products, online monitoring methods are required to conduct online detection and evaluation of product processing quality. Summary of the invention

[0004] In order to solve the above technical problems, the present disclosure provides a defect detection method, device and electronic equipment applied to additive manufacturing.

[0005] The present disclosure provides a defect detection method applied to additive manufacturing, comprising: printing at least one layer of component material on a manufacturing substrate, wherein multiple layers of the component material are stacked to form a target component; after printing any layer of the component material, performing defect detection on the component material currently on the manufacturing substrate by air-coupled ultrasonic guided waves; after performing defect detection on the component material currently on the manufacturing substrate by air-coupled ultrasonic guided waves, printing at least one layer of the component material on the manufacturing substrate.

[0006] Based on the same inventive concept, the present disclosure also provides a defect detection device applied to additive manufacturing, including: a manufacturing substrate, used to carry component materials and a target component formed by stacking multiple layers of the component materials; a printing device, used to print at least one layer of the component material on the manufacturing substrate; a defect detection device, used to perform defect detection on the component material currently on the manufacturing substrate through air-coupled ultrasonic guided waves after printing any layer of the component material; the printing device is also used to print at least one layer of the component material on the manufacturing substrate after performing defect detection on the component material currently on the manufacturing substrate through air-coupled ultrasonic guided waves.

[0007] Based on the same inventive concept, the present disclosure also provides an electronic device, comprising: a processor; a memory for storing executable instructions; wherein the processor is used to read the executable instructions from the memory and execute the executable instructions to implement any one of the methods described.

[0008] Compared with the prior art, the technical solution provided by the present invention has the following advantages: the defect detection method provided by the present invention uses non-contact air-coupled ultrasonic guided waves to perform defect detection during the additive manufacturing process. It can perform real-time detection of components under manufacturing without damaging the components or leaving the additive processing environment, evaluate the bonding conditions between each layer of component materials, and promptly discover the delamination and debonding of component materials, thereby improving the processing quality and process stability of additive manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0010] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0011] Figure 1 A schematic flow chart of a defect detection method applied to additive manufacturing provided by an embodiment of the present disclosure;

[0012] Figure 2 A waveform diagram of an ultrasonic excitation signal and an ultrasonic receiving signal provided in an embodiment of the present disclosure;

[0013] Figure 3 A waveform comparison diagram of different ultrasonic receiving signals provided in an embodiment of the present disclosure;

[0014] Figure 4 A schematic diagram of the structure of a defect detection device applied to additive manufacturing provided by an embodiment of the present disclosure;

[0015] Figure 5 A schematic structural diagram of another defect detection device applied to additive manufacturing provided by an embodiment of the present disclosure;

[0016] Figure 6 A schematic diagram of defect detection imaging results provided by an embodiment of the present disclosure;

[0017] Figure 7 A schematic diagram of a defect detection imaging result in the related art;

[0018] Figure 8 A schematic structural diagram of another defect detection device applied to additive manufacturing provided by an embodiment of the present disclosure;

[0019] Fig. 9 A schematic structural diagram of another defect detection device applied to additive manufacturing provided by an embodiment of the present disclosure;

[0020] Fig.10 A schematic diagram of the structure of an electronic device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present disclosure, the scheme of the embodiments of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features therein can be combined with each other without conflict.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure, but the embodiments of the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0023] Due to the immaturity of molding technology and equipment research, the mechanical properties of additive products are generally weaker than those of traditional manufacturing products. In addition, compared with traditional prepreg / autoclave processes, additive manufacturing equipment is exposed to a standard atmospheric environment, which may lead to insufficient raw material infiltration and high product porosity, thus affecting its mechanical properties. Therefore, in order to improve the stability of additive composite manufacturing technology and meet the needs of efficient processing of various components with complex configurations, the following related technologies for additive manufacturing defect detection exist, including: 1) Infrared: Use infrared temperature measurement sensors to directly measure the nozzle temperature of the melted printing area of ​​the resin matrix material, and make feedback adjustments based on the measurement results to ensure that it is always in the optimal temperature window of the process; however, the infrared temperature measurement method can only obtain the simple physical quantity of nozzle temperature, and cannot further evaluate the product processing quality; 2) Laser: Use a laser profiler to scan the shape contour of the processed product, but the laser can only ensure that the geometric shape of the processed product is consistent with the design, and cannot determine internal defects; 3) Vision: Use industrial cameras to directly detect visible defects (inclusions, fiber breakage, fiber bending, etc.) during the processing process; but similarly, the camera cannot detect the most common delamination and debonding defects of fiber-reinforced composite materials, especially additive products, which have problems such as high internal porosity and more serious delamination and debonding. Such internal defects cannot be detected by the above means, and the product processing quality is difficult to guarantee.

[0024] Other related technologies also include the following defect detection methods: 1) Micro CT / industrial CT: Using the penetrating power of X-rays, a series of two-dimensional images are taken and three-dimensional reconstruction is performed, which can be used for high-resolution imaging of smaller process samples; however, it is not suitable for the detection of large-sized parts, and the equipment is complex, costly, and radioactive, making it difficult to apply to in-situ detection / monitoring of additive manufacturing composite material processing; 2) Contact ultrasonic testing: According to the detection method, it includes ultrasonic body wave detection, ultrasonic guided wave detection, phased array ultrasound, etc. According to the coupling method of the ultrasonic transducer, it can be divided into water immersion, coating coupling agent, jet coupling, etc., using the propagation of ultrasonic waves inside the medium and interacting with defects to achieve non-destructive detection of defects; but contact ultrasound is also difficult to deploy in the additive processing environment, and it does not yet have the feasibility of online detection of additive defects; 3) Mechanical testing methods: Add Various tensile and shear components with standard sizes are processed, and mechanical tensile instruments and other equipment are used to measure the mechanical performance parameters such as elastic modulus and shear modulus of the samples. This is a commonly used destructive testing method, but mechanical testing relies on damaged components, and only samples can be selected for testing, and defects in all components cannot be detected; 4) Laser ultrasonic testing: Laser ultrasonic testing is also expected to achieve non-contact online monitoring and internal defect identification of additive manufacturing. It uses laser pulses to obtain component information and defect characterization through thermoelastic or ablation effects, such as component thickness, internal and surface defects, material parameters, etc.; however, laser ultrasonic testing has high requirements on the surface quality of the components being tested. The surface of additively manufactured products is generally rough and has poor flatness, resulting in unsatisfactory detection results. In addition, laser ultrasonic testing equipment is bulky, expensive, and the equipment adjustment is relatively complicated, which is not conducive to practical application.

[0025] In view of this, in order to ensure the consistency of design / manufacturing and guarantee the processing quality of processed products, the embodiments of the present disclosure provide a defect detection method applied to additive manufacturing to detect and evaluate the processing quality of components. Figure 1 As shown, the defect detection method applied to additive manufacturing provided by the embodiment of the present disclosure includes:

[0026] S1. Print at least one layer of component material on a manufacturing substrate, wherein multiple layers of component material are stacked to form a target component.

[0027] S2. After printing any layer of component material, defect detection of the component material on the current manufacturing substrate is performed through air-coupled ultrasonic guided waves.

[0028] Specifically, ultrasonic guided waves have multiple propagation modes in component materials, and each mode is sensitive to different types of defects and geometric features. At the same time, its ability to propagate over long distances is also conducive to the rapid scanning and inspection of large-size components. Compared with penetrating detection (i.e., ultrasonic body waves), ultrasonic guided waves are more suitable for defect detection in additive manufacturing.

[0029] S3. After performing defect detection on the component material on the current manufacturing substrate by air-coupled ultrasonic guided waves, printing at least one layer of component material on the manufacturing substrate.

[0030] In specific implementation, the above S2 and S3 are executed cyclically until a complete target component is formed, which is equivalent to defect detection by air-coupled ultrasonic guided waves in the process of additive manufacturing. During the execution of the above method, defect detection can be performed once for each layer of component material printed, so that interlayer defects between each layer of component material can be detected.

[0031] The defect detection method provided by the embodiment of the present disclosure uses non-contact air-coupled ultrasonic guided waves to perform defect detection during the additive manufacturing process. No liquid coupling medium is required. It can perform real-time detection of components under manufacturing without damaging the components or leaving the additive processing environment, and evaluate the adhesion between each layer of component materials, that is, evaluate whether there are interlayer defects in the components, and promptly discover the delamination and debonding of component materials, thereby improving the processing quality and process stability of additive manufacturing.

[0032] In specific implementation, the method provided in the above-mentioned embodiment of the present disclosure can be implemented through an online detection module to realize online monitoring of processing quality during additive manufacturing, perform real-time detection reporting and alarm on defects, and then feedback and adjust processing parameters in additive manufacturing, while providing corresponding process quality reports for manufactured products, further improving the processing quality and process stability of additive manufacturing products.

[0033] In specific implementation, the method provided in the above-mentioned embodiment of the present disclosure can not only be applied to dense additive plate-type structural components, but also can be used to detect various grid structures, lattice structures, and sandwich structures processed by additive manufacturing technology, and carry out corresponding bonding quality inspection and evaluation.

[0034] Ultrasonic guided wave testing technology is one of the important technical means in the field of non-destructive testing and structural health monitoring. When the wavelength of ultrasonic waves is close to or larger than the structural size, the sound waves will be reflected, superimposed and interfered multiple times in the structure to form ultrasonic guided waves. Compared with the ultrasonic testing method based on bulk waves, guided waves have the advantage of long-distance propagation and can detect a larger range with a fixed probe position without scanning point by point, making them more advantageous in rapid scanning of large areas and structural health testing.

[0035] In the process of additive manufacturing, component materials are generated layer by layer, and each layer of components can be regarded as a flat plate structural component. For flat plate structural components, when the plate thickness is equivalent to the wavelength, guided waves are generated in the thin plate. For the case where the substrate is not considered, that is, the upper and lower end surfaces of the measured plate are free, the guided waves in the plate are called Lamb waves; if the substrate is considered to exist at one end, the substrate is regarded as another material with infinite thickness, and the guided waves in the plate are called generalized Lamb waves. In specific implementation, Lamb waves or generalized Lamb waves can be selected as ultrasonic guided waves in the above embodiments according to actual conditions, all of which are within the protection scope of the present disclosure. Guided waves mainly have four characteristics: frequency dispersion, multi-mode, non-steady-state signals and position changes. Frequency dispersion is an inherent property of ultrasonic guided wave signals. It is a phenomenon that the phase velocity of guided wave signals changes due to different frequencies. It can be understood as the delay of the signal in the time domain, which leads to the broadening of the detection signal during the transmission between plates. In addition, the phase velocity and group velocity of each mode will change with the dispersion characteristics as the frequency changes. Since Lamb waves have low attenuation and longer propagation distance, they have greater advantages in large-scale detection of thin plates.

[0036] Taking Lamb waves as an example, each Lamb wave excitation mode has a mode morphology that conforms to its own characteristics, which can be divided into S-type symmetric type (Symmetric) and A-type antisymmetric type (Anti-symmetric), and each type corresponds to multiple modes. The difference between symmetric and antisymmetric Lamb waves lies in whether the central particle of the thin plate moves horizontally or longitudinally, and whether the particle vibration displacement is symmetric or antisymmetric about the center plane. The symmetric Lamb wave mode that meets the former condition is represented by S0, S1, S2..., and the latter is the antisymmetric Lamb wave mode, represented by A0, A1, A2... The air-coupled ultrasonic guided wave in the above-mentioned embodiment of the present disclosure can preferably adopt the A0 mode of the antisymmetric Lamb wave.

[0037] Compared with the above-mentioned contact ultrasound, air-coupled ultrasonic guided waves use air as the coupling medium. Through an efficient ultrasonic transducer and the defect detection method provided by the above-mentioned embodiment, non-contact ultrasonic non-destructive testing can be realized, and can be applied to in-situ detection of additive manufacturing (i.e., defect detection during the additive manufacturing process).

[0038] In specific implementation, the method provided in the above embodiment of the present disclosure is implemented based on a defect detection device applied to additive manufacturing, the device comprising a manufacturing substrate for carrying component materials and target components, a printing device for printing component materials, and a defect detection device for defect detection. The following embodiment of the present disclosure will further describe the structure of the device, which will not be repeated here.

[0039] Specifically, the method provided in the above embodiment is used for additive manufacturing of composite materials, and the composite material can be a continuous fiber reinforced composite material. Delamination, debonding and porosity between different layers are common types of defects in continuous fiber reinforced composite materials. The method provided in the above embodiment of the present disclosure can specifically detect the defects of such materials in the additive manufacturing process. The continuous fiber reinforced composite material can be a carbon fiber reinforced composite material (CFRP), a glass fiber reinforced composite material (GFRP) and an aramid fiber reinforced composite material (AFRP).

[0040] In some embodiments, in the above S2 and S3, the process of performing defect detection on the component material on the currently manufactured substrate by air-coupled ultrasonic guided waves specifically includes:

[0041] S21. Transmitting an ultrasonic excitation signal to the component material.

[0042] S22. Receive an ultrasonic receiving signal generated when the ultrasonic excitation signal propagates in the component material.

[0043] The ultrasonic wave (i.e. the above-mentioned test ultrasonic signal) is incident obliquely from the air to the upper surface of the component material, refracted on the surface, and then generates ultrasonic guided waves of a specified mode inside the component material. During the propagation process, the ultrasonic guided waves in the component material will continuously leak energy into the air. The leaked energy is called leakage Lamb wave, i.e. the above-mentioned ultrasonic receiving signal.

[0044] In a specific embodiment, the waveforms of the ultrasonic excitation signal and its corresponding ultrasonic receiving signal are as follows: Figure 2 As shown, the horizontal axis is time, the vertical axis is signal amplitude, the time delay between the ultrasonic receiving signal and the ultrasonic excitation signal is the total time for the signal to propagate in the component material and the air. Since the energy is continuously dissipated during signal propagation, the amplitude of the ultrasonic receiving signal is usually smaller than the amplitude of the ultrasonic excitation signal, but the waveforms of the ultrasonic receiving signal and the ultrasonic excitation signal are correlated.

[0045] S23. Subtract the amplitude of the ultrasonic receiving signal from the preset reference amplitude to obtain the amplitude attenuation.

[0046] There are defects inside the component material. The discontinuity of the solid medium caused by the defects will cause the amplitude of the ultrasonic receiving signal to attenuate. Therefore, the defects inside the component can be analyzed by extracting the amplitude attenuation. Specifically, the amplitude of the ultrasonic receiving signal can be the envelope peak of the ultrasonic receiving signal.

[0047] S24. Compare the amplitude attenuation with a preset reference attenuation, and in response to the amplitude attenuation being higher than the reference attenuation at the target position, determine that an interlayer defect exists in the component material at the target position.

[0048] Specifically, the surface of each layer of component material is not absolutely smooth, and there may be slight solid medium discontinuities at some locations, but they are not defects and will not affect the structural strength of the component. The above embodiment of the present disclosure will only determine that the component material has interlayer defects at that location when the amplitude attenuation exceeds the reference attenuation, thereby avoiding false detection of defects and resulting in low production efficiency.

[0049] Figure 3 The figure shows the ultrasonic receiving signal waveforms measured at two positions of the component material in an embodiment, wherein the ultrasonic receiving signal a is the ultrasonic receiving signal at a non-defective position, and the ultrasonic receiving signal b is the ultrasonic receiving signal at a defective position, and the amplitude of the ultrasonic receiving signal b is obviously attenuated.

[0050] In specific implementation, the above-mentioned reference amplitude is obtained by selecting a defect-free sample for testing. Specifically, the above-mentioned reference amplitude is obtained by transmitting an ultrasonic excitation signal to a pre-screened defect-free sample, and receiving an ultrasonic receiving signal generated when the ultrasonic excitation signal propagates in the defect-free sample. The reference amplitude can be the peak value of the ultrasonic receiving signal obtained based on the defect-free sample, or 50% to 80% of the peak value, or the average value of multiple peak values. It can be understood that the above-mentioned defect-free sample can be a sample that meets the production and manufacturing requirements.

[0051] In specific implementation, the above-mentioned reference attenuation is obtained by selecting a non-defective sample for detection. Specifically, the above-mentioned reference attenuation is obtained by transmitting an ultrasonic excitation signal to a pre-screened non-defective sample and receiving an ultrasonic receiving signal generated when the ultrasonic excitation signal propagates in the non-defective sample. The reference attenuation can be the peak value of the amplitude attenuation obtained based on the non-defective sample, or 50% to 80% of the peak value, or the average value of multiple peak values.

[0052] In some embodiments, the above method further comprises:

[0053] After printing any layer of component material, in response to changes in the structural parameters of the component material on the manufacturing substrate, the reference amplitude is adjusted according to the structural parameters of the component material on the current manufacturing substrate and the desired target ultrasonic guided wave mode. The desired target ultrasonic guided wave mode can refer to the ultrasonic guided wave mode selected in the above embodiment, and the following embodiments are the same and will not be repeated.

[0054] On this basis, the above S23 specifically includes:

[0055] The amplitude of the ultrasonic receiving signal is subtracted from the adjusted reference amplitude to obtain the amplitude attenuation.

[0056] Specifically, components with different structural parameters have different reference amplitudes. The disclosed embodiment continuously adjusts the reference amplitude as the component material is printed, which can make defect detection more accurate.

[0057] Specifically, for components with curvature, they can also be regarded as the superposition of plates with different plane sizes, and the reference amplitude can also be accurately corrected by the above method.

[0058] In specific implementation, the adjustment value of the above-mentioned reference amplitude can be obtained according to defect-free samples with different structural parameters, and the specific implementation method can refer to the determination method of the above-mentioned reference amplitude, which will not be repeated here.

[0059] In addition to the above-mentioned embodiment in which the time domain signal amplitude is used as a parameter, in another embodiment, sensitive acoustic parameters such as sound velocity, instantaneous signal amplitude, instantaneous phase, etc. can also be used as detection quantities to achieve higher-precision defect detection.

[0060] In addition to the above-mentioned embodiments in which the low-frequency, low-order A0 mode ultrasonic guided wave is used as the target ultrasonic guided wave mode, in other embodiments, a higher-order guided wave mode or a higher ultrasonic signal frequency band may be used, including a combination of multiple modes and multiple frequency bands, thereby achieving the detection of more defect types and smaller defects.

[0061] In some embodiments, the method provided in the above embodiments of the present disclosure is implemented based on a defect detection device applied to additive manufacturing, the device comprising a manufacturing substrate 20 for carrying component materials and a target component 10 and a defect detection device 30 for defect detection, wherein the defect detection device 30 comprises an ultrasonic excitation probe 31 and an ultrasonic receiving probe 32, such as Figure 4 As shown, on this basis, in the above S2 and S3, the process of performing defect detection on the component material on the current manufacturing substrate by air-coupled ultrasonic guided waves includes:

[0062] S31 , using the ultrasonic excitation probe 31 to transmit an ultrasonic excitation signal to the component material 10 .

[0063] S32, using the ultrasonic receiving probe 32 to receive the ultrasonic receiving signal generated when the ultrasonic excitation signal propagates in the component material 10. The ultrasonic receiving probe 32 and the ultrasonic excitation probe 31 are both located on the side of the component material 10 away from the manufacturing substrate 20, and the signal incident angle α1 of the ultrasonic excitation probe 31 is the same as the signal receiving angle α2 of the ultrasonic receiving probe 32.

[0064] The specific process of S32 can refer to the above S22. The above-mentioned single-side oblique incident probe arrangement mode in which the ultrasonic excitation probe and the ultrasonic receiving probe are both located on the same side of the component material in the embodiment of the present disclosure can be adapted to the additive manufacturing processing environment.

[0065] S33. Determine whether there are defects in the component material based on the ultrasonic receiving signal.

[0066] The specific process of S33 may refer to the above-mentioned S23 and S24.

[0067] The ultrasonic wave (i.e., the ultrasonic excitation signal) emitted by the ultrasonic excitation probe 31 is obliquely incident from the air to the upper surface of the component material 10, refracted on the surface, and then generates ultrasonic guided waves of a specified mode inside the component material 10. During the propagation process, the ultrasonic guided waves in the component material 10 will continuously leak energy into the air. The leaked energy is called leakage Lamb wave, i.e., the ultrasonic receiving signal mentioned above, which is then received by the ultrasonic receiving probe 32.

[0068] In specific implementation, the ultrasonic waves in the above embodiments of the present disclosure may adopt A0 mode ultrasonic guided waves, which have a larger off-plane displacement component, are more suitable for the above-mentioned single-sided probe arrangement, and are easier to obtain ultrasonic receiving signals with a high signal-to-noise ratio.

[0069] In a specific embodiment, the ultrasonic receiving probe 32 and the ultrasonic excitation probe 31 can be selected from probes with a center frequency of 250kHz, a chip diameter of 24mm, a relative bandwidth of 25%, a relative echo sensitivity of -33dB, and a maximum excitation signal amplitude of 200V. The ultrasonic receiving probe 32 has a built-in amplifier powered by 5V, which can effectively improve the amplitude and signal-to-noise ratio of the collected ultrasonic receiving signal to meet the detection requirements.

[0070] In some embodiments, the above S2 specifically includes:

[0071] After printing any layer of component material, in response to changes in the structural parameters of the component material on the manufacturing substrate, the signal incident angle of the ultrasonic excitation probe and the signal receiving angle of the ultrasonic receiving probe are adjusted according to the structural parameters of the component material on the current manufacturing substrate and the required target ultrasonic guided wave mode, and defect detection is performed on the component material on the current manufacturing substrate based on the adjusted signal incident angle and signal receiving angle. Specifically, the above structural parameters may be at least one of the thickness of the component material, the number of layers, and the direction of the layers.

[0072] For flat plate components, components of different thicknesses have different optimal excitation angles (i.e., the signal incident angle α1 of the ultrasonic excitation probe 31 and the signal receiving angle α2 of the ultrasonic receiving probe 32). Only when the excitation angle is appropriate can the ultrasonic guided waves of the specified mode (i.e., the target ultrasonic guided wave mode required above) be excited in the component material, which can propagate over a long distance and be received in the excitation angle. In the process of additive manufacturing, as the component material is printed, the overall thickness of the component increases continuously, and the signal incident angle α1 of the ultrasonic excitation probe 31 and the signal receiving angle α2 of the ultrasonic receiving probe 32 need to be adjusted accordingly.

[0073] In some embodiments, the process of adjusting the signal incident angle of the ultrasonic excitation probe and the signal receiving angle of the ultrasonic receiving probe according to the structural parameters of the component material on the current manufacturing substrate and the required target ultrasonic guided wave mode specifically includes:

[0074] The adjusted signal incident angle and signal receiving angle are determined according to the excitation signal frequency range of the ultrasonic excitation probe, the density of the component material, the stiffness of the component material, the required target ultrasonic guided wave mode, and the thickness of the component material on the current manufacturing substrate. Specifically, the thickness of the component material on the current manufacturing substrate refers to the thickness of all component materials carried on the current manufacturing substrate, not the thickness of one layer of component material.

[0075] In some embodiments, the calculation formula of the signal incident angle and the signal receiving angle θ is sin(θ)=c l / c p , where θ is the signal incident angle and signal receiving angle, c l is the body longitudinal wave velocity in air, c p It is the phase velocity of the target ultrasonic guided wave mode in the component material calculated according to the transmission signal frequency range of the ultrasonic excitation probe, the density of the component material, the stiffness of the component material and the thickness of the component material on the current manufacturing substrate.

[0076] Specifically, the reference value of the body longitudinal wave velocity in the air at room temperature is 343 m / s, and the phase velocity of the target ultrasonic guided wave mode in the component material is obtained through the dispersion characteristics of the component material, and the dispersion characteristics are obtained based on the transmission signal frequency range of the ultrasonic excitation probe, the density of the component material, the stiffness of the component material, and the thickness of the component material on the current manufacturing substrate.

[0077] "Dispersion" is a unique phenomenon of ultrasonic guided waves, which means that waves of different frequencies may propagate at different speeds in the same medium, causing the waveform to distort as the propagation distance increases. The dispersion characteristic curve can represent the change in propagation speed of a certain ultrasonic guided wave mode under different frequency-thickness products (signal frequency × component thickness). When the thickness, density, and stiffness parameters of the current component material are known, the dispersion characteristics of the ultrasonic guided waves propagating therein can be calculated; on this basis, by determining the frequency range of the ultrasonic excitation signal (related to the models of the above-mentioned ultrasonic excitation probe and ultrasonic receiving probe), the phase velocity of the target ultrasonic guided wave mode can be obtained, and the signal incident angle and signal receiving angle can be determined accordingly.

[0078] Those skilled in the art are aware of the method for calculating the dispersion characteristic curve based on the above parameters, which will not be described in detail here. The density, stiffness and other parameters of the above component materials can be directly obtained as reference values ​​based on the processing technology, or can be obtained through measurement, which will not be limited here.

[0079] In other embodiments, the ply direction of the component material can also be included in the calculation parameters of the dispersion characteristics. The ply direction refers to the direction in which each layer of fiber is laid during the manufacturing process of fiber-reinforced composite materials. Since a single layer of fiber has significant anisotropy (the strength and stiffness values ​​along the fiber direction are generally greater), the design of the mechanical properties of the component can be achieved by designing the plies between multiple layers of fiber. For the above-mentioned dispersion characteristic calculation, if the fiber direction is changed, due to the anisotropy of the carbon fiber prepreg, the stiffness matrix of each layer of component material in a fixed coordinate system is actually changed. Therefore, each layer of component material may have different stiffness (even if it is the same fiber prepreg), which needs to be considered in the calculation of the dispersion characteristics.

[0080] In some embodiments, adjusting the signal incident angle of the ultrasonic excitation probe and the signal receiving angle of the ultrasonic receiving probe according to the structural parameters of the component material on the current manufacturing substrate may also include:

[0081] The adjusted signal incident angle and signal receiving angle are determined according to the transmission signal frequency range of the ultrasonic excitation probe, the density of the component material, the stiffness of the component material, the thickness of the component material on the current manufacturing substrate, the required target ultrasonic guided wave mode, and the boundary conditions of the contact surface between the component material and the manufacturing substrate.

[0082] When calculating the optimal excitation angle, in addition to considering the parameters of the component material itself, it is also necessary to consider the boundary conditions of the contact surface between the manufacturing substrate and the component material. If there is no influence of the manufacturing substrate, the component material is a "free boundary condition" in the numerical calculation model. The existence of the manufacturing substrate changes the boundary conditions of the contact surface. By correcting the boundary conditions, the data calculation model can be more in line with the actual detection conditions, thereby making the calculation of the optimal excitation angle more accurate and improving the detection effect.

[0083] Specifically, when the boundary conditions of the contact surface between the component material and the manufacturing substrate are taken into consideration, the ultrasonic guided wave used to detect defects is the generalized Lamb wave in the above embodiment.

[0084] In a specific embodiment, in order to achieve more accurate defect detection, environmental physical quantities such as temperature, humidity, and pressure in the additive manufacturing environment may be added to the data calculation model to further correct the detection model.

[0085] In some embodiments, Figure 4 As shown, the ultrasonic receiving probe 32 and the ultrasonic excitation probe 31 are at the same height from the manufacturing substrate 20 and the component material 10 .

[0086] The heights of the ultrasonic receiving probe and the ultrasonic excitation probe from the manufacturing substrate are both greater than the near-field threshold D th , where D th =D s2 / 4λ+d,D s is the diameter of the excitation area of ​​the ultrasonic excitation probe, λ is the wavelength of the ultrasonic excitation signal, and d is the thickness of the component material on the current manufacturing substrate.

[0087] When setting the probe, the distance between it and the manufacturing substrate and component materials should be appropriate, neither too close nor too far. th The constraint is to avoid the near field of the ultrasonic excitation probe. The near field is also called the Fresnel zone, which is an area with a series of maximum and minimum sound pressure values ​​near the wave source due to wave interference. The existence of the near field will lead to inaccurate quantitative feedback signals. At the same time, if the probe is too far away from the incident upper surface of the component material, due to factors such as sound beam diffusion and ultrasonic wave attenuation in the air, the amplitude of the received ultrasonic receiving signal will be reduced, the signal cannot be identified, and detection imaging cannot be performed. When the distance is greater than the above-mentioned near-field threshold D th , while avoiding the near field area, the probe can be as close as possible to the manufacturing substrate and component materials.

[0088] In some embodiments, the process of performing defect detection on the component material on the currently manufactured substrate by air-coupled ultrasonic guided waves further includes:

[0089] S41, moving the ultrasonic excitation probe and the ultrasonic receiving probe together along a preset path, and using the ultrasonic excitation signal and the ultrasonic receiving signal to perform defect detection on the component material along the preset path during the movement.

[0090] S42. In response to the ultrasonic excitation probe and the ultrasonic receiving probe completing the movement along the preset path, the defect detection data acquired during the movement along the preset path is stored to avoid the mismatch between the acquired signal and the corresponding motion coordinates caused by the accumulated error during the signal acquisition process.

[0091] like Figure 5 As shown, when performing defect detection, the ultrasonic excitation probe and the ultrasonic receiving probe need to move on the xy plane where the component material 10 is located to detect whether there are defects in different areas. The ultrasonic detection system in the related art adopts a control strategy in which motion control and signal acquisition are independent, and the functional modules are decoupled from each other. The upper program is simple to write, but there is a lack of clock coordination between motion stepping and signal storage. As the number of sampling times increases, it is easy to cause the incoordination between motion control and signal acquisition, resulting in imaging errors and logical confusion. Since the method provided by the embodiment of the present disclosure requires repeated steps of material printing and defect detection, if there is a cumulative error in the signal acquisition process, it may eventually cause the result of the previous defect detection to correspond to the next material printing, which in turn leads to the determination of the wrong defect location.

[0092] In view of this, the above embodiment of the present disclosure adopts clock coordination control of motion control and signal acquisition to avoid the mismatch between motion control and data acquisition and storage caused by accumulated errors during program execution. Specifically, each time the motion module starts to move (i.e., starts to execute the above S41) and steps into place (i.e., the above movement along the preset path is completed), it will return the corresponding clock signal pulse, and the upper program will read the rising edge / falling edge of the clock signal; while scanning, the ultrasonic receiving signal collected by the probe flows to the upper program buffer, and the current signal waveform is displayed in real time for the operator to judge the status; when the motion module (i.e., the above ultrasonic excitation probe and ultrasonic receiving probe) steps into place, the returned motion state clock signal pulse stores the ultrasonic receiving signal waveform in the current program buffer in sequence according to the number, and automatically completes the numbering of the saved data.

[0093] At the same time, in order to be compatible with different ultrasound receiving signal storage lengths, probe movement step lengths, etc., technical personnel in this field can customize the waiting time and signal storage time after the probe moves into place, select a suitable time window, take into account the efficiency and stability of automated acquisition, and at the same time improve the operational flexibility and compatibility of the system.

[0094] In specific implementation, the method provided in the above embodiment of the present disclosure develops a host program based on the LabVIEW platform, writes a user operation interface, realizes real-time communication with a PLC (Programmable Logic Controller), reads data inside the PLC, writes motion instructions, and other operations. The pre-written motion control program is downloaded inside the PLC, and different motion subroutines can be executed by changing the internal variable values, thereby issuing different motion instructions to the probe.

[0095] Writing a user interface based on the LabVIEW development environment can improve the convenience and interactivity of the system and reduce the difficulty of operation to meet the needs of rapid defect detection of subsequent components. The user interface can include three parts: 1) Probe motion control, which can realize the sending of various motion control commands such as jog, absolute addressing, and relative motion instructions, for users to simply control the motion platform; 2) Communication between the upper platform and the oscilloscope, including oscilloscope waveform reading, data import, waveform adjustment, waveform saving settings and other oscilloscope operations; 3) Combined with the motion control signal automation acquisition module, it can realize automatic scanning of samples and display the imaging results online.

[0096] The present disclosure also provides a specific embodiment to verify the feasibility of the above method. In the process of executing the above S2 once, the current component material is an automatic tape laying additive composite component (T700 / PA) with a thickness of 2.8 mm and a single-direction ply. At this time, the optimal excitation angle is calculated to be 14°. A defect-free sample of the component material is selected for testing. The waveform of the ultrasonic excitation signal and the waveform of the obtained ultrasonic receiving signal are as shown in FIG. Figure 2 shown.

[0097] The above experiments have verified that the air-coupled ultrasonic guided wave detection technology used can successfully excite the ultrasonic guided wave signal of the A0 mode in the additive composite plate, and its signal waveform is clear, which verifies the feasibility of applying the air-coupled ultrasonic guided wave detection technology to additive composite components.

[0098] In order to further verify the ability of air-coupled ultrasonic guided wave detection technology to identify internal defects of additive composite components, in another specific embodiment, an additive composite component with partial delamination and debonding is used for testing. The signals collected in the experiment are as follows: Figure 3 As shown in the ultrasonic receiving signal b, the ultrasonic receiving signal a is the detection record of the defect-free sample. It can be seen that in the well-bonded area, the received A0 signal amplitude is large, while in the debonded area, the received A0 signal amplitude is significantly reduced. The above experimental verification can realize the non-destructive quantitative characterization of typical delamination and debonding defects inside the additively manufactured composite material through the change of A0 signal amplitude.

[0099] In another embodiment, the detection results can also be imaged online with a bit depth of 8 bits. In this embodiment, air-coupled ultrasonic imaging is performed on a 0° unidirectional laminated additive composite component prepared by an automatic tape laying process, and the signal amplitude is converted into a grayscale value of 0.5 to 1 according to the above-mentioned normalized imaging method based on signal amplitude, wherein the lower the grayscale value, the lower the signal amplitude, and the following image is obtained: Figure 6 The 100*100mm area imaging result is shown in Figure 1. Figure 6 It can be seen from the imaging results that the overall quality of the additive composite component tested is good, but there is a longitudinally distributed internal defect area in the lower left area A, and there is a slight defect distribution in the right area B.

[0100] In order to verify the accuracy of the above-mentioned air-coupled ultrasonic scanning imaging results, the water immersion ultrasonic defect detection in the related technology was carried out on the same component. The ultrasonic probe used was a water immersion focusing probe with a center frequency of 5MHz and a focal length of 30mm. The following images were obtained: Figure 7 The imaging results of the same area shown in Figure 7 It can be seen from the imaging results in the figure that the additive composite component under test also has defects distributed in the lower left area A and the right area B.

[0101] By comparison Figure 6 and Figure 7 The imaging results can prove that the imaging method based on air-coupled ultrasonic guided waves has high accuracy, verify its feasibility for defect detection, and at the same time verify the working stability of the automated detection system built in the above embodiment.

[0102] It should be noted that the method of the embodiment of the present application can be performed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario and completed by multiple devices cooperating with each other. In the case of such a distributed scenario, one of the multiple devices can only perform one or more steps in the method of the embodiment of the present application, and the multiple devices will interact with each other to complete the above method.

[0103] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0104] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides a defect detection device for additive manufacturing, including:

[0105] A substrate is manufactured to support component materials and a target component formed by stacking multiple layers of component materials.

[0106] A printing device is used to print at least one layer of component material on a manufacturing substrate.

[0107] The defect detection equipment is used to perform defect detection on the component material on the current manufacturing substrate through air-coupled ultrasonic guided waves after printing any layer of component material.

[0108] The printing device is also used to print at least one layer of component material on the manufacturing substrate after defect detection of the component material on the current manufacturing substrate is performed by air-coupled ultrasonic guided waves.

[0109] The defect detection device provided in the embodiment of the present disclosure uses non-contact air-coupled ultrasonic guided waves to perform defect detection during the additive manufacturing process. It can perform real-time detection of components under manufacturing without damaging the components, evaluate the adhesion between each layer of component materials, that is, evaluate whether there are interlayer defects in the components, and promptly discover the delamination and debonding of component materials, thereby improving the processing quality and process stability of additive manufacturing.

[0110] In a specific embodiment, Figure 8 As shown, the defect detection device applied to additive manufacturing specifically includes a manufacturing substrate 20 (a printing device not shown can be located in the space above the manufacturing substrate 20 to adapt to different types of printing devices), a defect detection device 30 (including the above-mentioned ultrasonic receiving probe and ultrasonic excitation probe), a system frame structure 41, an x-axis linear module 42, a y-axis linear module 43, and a z-axis manual lifting platform 44, wherein the x-axis linear module 42 and the y-axis linear module 43 are used to control the movement of the defect detection device 30, and the z-axis manual lifting platform 44 is used to adjust the distance between the defect detection device 30 and the component material and the manufacturing substrate 20. The above-mentioned motion control part is composed of an orthogonal linear module based on two-axis planar motion, and the motion control of the servo motor is realized through PLC.

[0111] Fig. 9 FIG. 4 shows an enlarged view of the structure near the defect detection device 30 in the defect detection apparatus, such as Fig. 9 As shown, the defect detection device specifically also includes a linear module end adapter plate 45, a horizontal adapter plate 33, a vertical adapter plate 34, a first angle turntable 35, a second angle turntable 36, a first probe end clamp 37, a second probe end clamp 38 and the above-mentioned ultrasonic receiving probe 32 and ultrasonic excitation probe 31.

[0112] like Figure 8 and Fig. 9 As shown, the manufacturing substrate 20 has a movement range of 400mm*400mm in the X and Y directions in the plane, which can meet the rapid detection requirements of most components. The vertical movement of the manufacturing substrate 20 can be finely adjusted by a high-precision and z-axis manual lifting platform 44, with a stroke of 180mm; the device is equipped with a precise first angle turntable 35 and a second angle turntable 36, which are used to achieve precise adjustment of the oblique incident angle of the ultrasonic receiving probe 32 and the ultrasonic excitation probe 31, and to achieve stable clamping of the probe through multiple adapters. In specific implementation, the manufacturing substrate 20 can also be equipped with a movable positioning fixture to achieve positioning and clamping of components with different sizes, thicknesses, and shapes. The defect detection device composed of the above modules can adapt to composite components of different sizes, and can perform defect detection at different heights and angles to meet more diverse detection needs.

[0113] In a specific embodiment, the device provided by the embodiment of the present disclosure also includes other auxiliary equipment, including a signal generator, a power amplifier, a digital oscilloscope, etc. Specifically, the signal acquisition in the above-mentioned defect detection method applied to additive manufacturing is realized by a multi-channel digital oscilloscope, and the equipment used has an interface reserved for automatic signal acquisition. The power amplifier can be a RITEC GA-2500A high-energy gated RF pulse amplifier, the digital oscilloscope can be a Tektronix MDO3024 four-channel digital oscilloscope, and the signal generator can be a Keysight two-channel signal generator. The performance of each instrument meets the performance index requirements required for the experiment.

[0114] For the convenience of description, the above device is described in terms of functions divided into various modules. Of course, when implementing the present application, the functions of each module can be implemented in the same or multiple software and / or hardware.

[0115] The device of the above embodiment is used to implement the corresponding defect detection method applied to additive manufacturing in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be repeated here.

[0116] Fig.10 A schematic structural diagram of an electronic device provided by an embodiment of the present disclosure is shown.

[0117] like Fig.10 As shown, the electronic device may include a processor 1101 and a memory 1102 storing computer program instructions.

[0118] Specifically, the processor 1101 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0119] The memory 1102 may include a large capacity memory for information or instructions. By way of example and not limitation, the memory 1102 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a tape, or a universal serial bus (USB) drive or a combination of two or more of these. Where appropriate, the memory 1102 may include a removable or non-removable (or fixed) medium. Where appropriate, the memory 1102 may be inside or outside the integrated gateway device. In a specific embodiment, the memory 1102 is a non-volatile solid-state memory. In a specific embodiment, the memory 1102 includes a read-only memory (ROM). Where appropriate, the ROM can be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (Electrically Erasable Programmable ROM, EEPROM), an electrically alterable ROM (EAROM) or flash memory, or a combination of two or more of these.

[0120] The processor 1101 reads and executes the computer program instructions stored in the memory 1102 to perform the steps of the defect detection method applied to additive manufacturing provided by the embodiment of the present disclosure.

[0121] In one example, the electronic device may further include a transceiver 1103 and a bus 1104. Fig.10 As shown, the processor 1101, the memory 1102 and the transceiver 1103 are connected via a bus 1104 and communicate with each other.

[0122] The bus 1104 includes hardware, software, or both. For example, but not limitation, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industrial Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a Memory bus, a MicroChannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other suitable buses or a combination of two or more of these. Where appropriate, the bus 1104 may include one or more buses. Although embodiments of the present application describe and illustrate a particular bus, the present application contemplates any suitable bus or interconnect.

[0123] The following is an embodiment of a computer-readable storage medium provided in an embodiment of the present disclosure. The computer-readable storage medium and the defect detection method applied to additive manufacturing in the above-mentioned embodiments belong to the same inventive concept. For details not described in detail in the embodiment of the computer-readable storage medium, reference can be made to the above-mentioned embodiment of the defect detection method applied to additive manufacturing.

[0124] The present embodiment provides a storage medium including computer executable instructions, which, when executed by a computer processor, are used to perform a defect detection method applied to additive manufacturing.

[0125] Of course, the storage medium containing computer executable instructions provided in the embodiments of the present disclosure is not limited to the above method operations, and the computer executable instructions can also execute related operations in the defect detection method applied to additive manufacturing provided in any embodiment of the present disclosure.

[0126] Through the above description of the implementation methods, technicians in the relevant field can clearly understand that the present disclosure can be implemented with the help of software and necessary general hardware, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present disclosure can be essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, read-only memory (ROM), random access memory (RAM), flash memory (FLASH), hard disk or optical disk, etc., including a number of instructions to enable a computer cloud platform (which can be a personal computer, server, or network cloud platform, etc.) to execute the defect detection method for additive manufacturing provided by each embodiment of the present disclosure.

[0127] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the existence of other identical elements in the process, method, article or device including the above elements.

[0128] The above are only specific embodiments of the present disclosure, which enable those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described above, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A defect detection method for additive manufacturing, characterized in that: include: Printing at least one layer of component material on a manufacturing substrate, wherein multiple layers of the component material are stacked to form a target component; After printing any layer of the component material, performing defect detection on the component material on the current manufacturing substrate by air-coupled ultrasonic guided waves; After defect detection of the component material currently on the manufacturing substrate is performed by air-coupled ultrasonic guided waves, at least one layer of the component material is printed on the manufacturing substrate.

2. The method according to claim 1, characterized in that The defect detection of the component material on the current manufacturing substrate by air-coupled ultrasonic guided waves comprises: transmitting an ultrasonic excitation signal to the component material; receiving an ultrasonic receiving signal generated when the ultrasonic excitation signal propagates in the component material; Subtracting the amplitude of the ultrasonic receiving signal from a preset reference amplitude to obtain an amplitude attenuation; The amplitude attenuation is compared with a preset reference attenuation, and in response to the amplitude attenuation being higher than the reference attenuation at the target position, it is determined that an interlayer defect exists in the component material at the target position.

3. The method according to claim 2, characterized in that Also includes: After printing any layer of the component material, in response to a change in a structural parameter of the component material on the manufacturing substrate, adjusting the reference amplitude according to the structural parameter of the component material on the current manufacturing substrate and a desired target ultrasonic guided wave mode; The step of subtracting the amplitude of the ultrasonic receiving signal from the preset reference amplitude to obtain the amplitude attenuation comprises: The amplitude attenuation is obtained by subtracting the amplitude of the ultrasonic receiving signal from the adjusted reference amplitude.

4. The method according to claim 1, characterized in that: The defect detection of the component material on the current manufacturing substrate by air-coupled ultrasonic guided waves comprises: Using an ultrasonic excitation probe to transmit an ultrasonic excitation signal to the component material; Using an ultrasonic receiving probe to receive an ultrasonic receiving signal generated when the ultrasonic excitation signal propagates in the component material, wherein the ultrasonic receiving probe and the ultrasonic excitation probe are both located on a side of the component material away from the manufacturing substrate, and the signal incident angle of the ultrasonic excitation probe is the same as the signal receiving angle of the ultrasonic receiving probe; It is determined whether there is a defect in the component material according to the ultrasonic receiving signal.

5. The method according to claim 4, characterized in that After printing any layer of the component material, defect detection of the component material on the current manufacturing substrate is performed by air-coupled ultrasonic guided waves, including: After printing any layer of the component material, in response to changes in the structural parameters of the component material on the manufacturing substrate, the signal incident angle of the ultrasonic excitation probe and the signal receiving angle of the ultrasonic receiving probe are adjusted according to the structural parameters of the component material on the current manufacturing substrate and the required target ultrasonic guided wave mode, and defects of the component material on the current manufacturing substrate are detected based on the adjusted signal incident angle and signal receiving angle.

6. The method according to claim 5, characterized in that The adjusting the signal incident angle of the ultrasonic excitation probe and the signal receiving angle of the ultrasonic receiving probe according to the structural parameters of the component material on the current manufacturing substrate and the required target ultrasonic guided wave mode comprises: The adjusted signal incident angle and signal receiving angle are determined according to the transmission signal frequency range of the ultrasonic excitation probe, the density of the component material, the stiffness of the component material, the required target ultrasonic guided wave mode and the thickness of the component material on the current manufacturing substrate.

7. The method according to claim 5, characterized in that The adjusting the signal incident angle of the ultrasonic excitation probe and the signal receiving angle of the ultrasonic receiving probe according to the structural parameters of the component material on the current manufacturing substrate and the required target ultrasonic guided wave mode comprises: The adjusted signal incident angle and signal receiving angle are determined based on the transmission signal frequency range of the ultrasonic excitation probe, the density of the component material, the stiffness of the component material, the required target ultrasonic guided wave mode, the thickness of the component material on the current manufacturing substrate, and the boundary conditions of the contact surface between the component material and the manufacturing substrate.

8. The method according to claim 4, characterized in that The defect detection of the component material on the current manufacturing substrate by air-coupled ultrasonic guided waves also includes: The ultrasonic excitation probe and the ultrasonic receiving probe are moved together along a preset path, and during the movement, the ultrasonic excitation signal and the ultrasonic receiving signal are used to perform defect detection on the component material along the preset path; In response to the ultrasonic excitation probe and the ultrasonic receiving probe completing the movement along the preset path, the defect detection data acquired during the movement along the preset path is stored.

9. A defect detection device for additive manufacturing, characterized in that: include: Manufacturing a substrate for carrying component materials and a target component formed by stacking multiple layers of the component materials; a printing device for printing at least one layer of the component material on the manufacturing substrate; A defect detection device, used for performing defect detection on the component material currently on the manufacturing substrate by air-coupled ultrasonic guided waves after printing any layer of the component material; The printing device is also used to print at least one layer of the component material on the manufacturing substrate after defect detection of the component material on the current manufacturing substrate is performed by air-coupled ultrasonic guided waves.

10. An electronic device, characterized in that: include: processor; A memory for storing executable instructions; The processor is used to read the executable instructions from the memory and execute the executable instructions to implement the method described in any one of claims 1-8.

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