Circuit board backdrill capacitance test method, device and equipment and storage medium

Abstract

The invention relates to a circuit board backdrill capacitance testing method, device and equipment and a storage medium, and the method comprises the steps: obtaining a capacitance detection instruction, and obtaining the image information of a to-be-detected circuit board according to the capacitance detection instruction; carrying out clustering analysis on the image information of the to-be-detected circuit board by adopting a k-means algorithm to obtain a feature image of the to-be-detected circuit board, and carrying out analysis according to the feature image to obtain a displacement distance and an angle of the probe; adjusting the position of the probe according to the displacement distance and the angle of the probe, and generating a capacitance measurement message after the adjustment of the probe is completed; according to the capacitance measurement message, calculating a capacitance value of the circuit board to be detected through a capacitance method, and comparing the capacitance value of the circuit board to be detected with a preset capacitance value to obtain a capacitance comparison result; and generating a quality evaluation result of the back drilling hole of the circuit board according to the capacitance comparison result, and transmitting the quality evaluation result of the back drilling hole of the circuit board to the user side. The method has the effect of improving the precision and efficiency of back drilling hole quality detection.

Description

Technical Field

[0001] The present application relates to the technical field of capacitor testing, and in particular to a circuit board back-drilling capacitor testing method, device, equipment and storage medium. Background Art

[0002] At present, in the manufacturing process of modern electronic equipment, the widespread use of multi-layer circuit boards has greatly improved the functions and performance of electronic products. Multi-layer circuit boards use lamination technology to press multiple single-layer circuit boards together to achieve higher circuit density and more complex electrical connections. However, in the production process of multi-layer circuit boards, the use of back drilling technology is one of the key links to ensure the quality and performance of circuit boards. However, traditional capacitance testing methods usually require complex testing equipment, and the testing efficiency is low when facing high-density, multi-layer circuit boards, which is difficult to meet the production needs of rapid iteration of modern electronic products.

[0003] The above-mentioned prior art solutions have the following defects: the existing methods have low accuracy in identifying the impact of capacitance changes after back drilling on circuit performance, resulting in low production efficiency of qualified multi-layer circuit boards, so there is room for improvement. Summary of the invention

[0004] In order to improve the accuracy of back-drilling quality detection, the present application provides a circuit board back-drilling capacitor testing method, device, equipment and storage medium.

[0005] The above-mentioned invention objective of the present application is achieved through the following technical solutions: A circuit board back-drilling capacitance testing method, the circuit board back-drilling capacitance testing method comprising: Obtaining a capacitance detection instruction, and obtaining image information of a circuit board to be detected according to the capacitance detection instruction; Using a k-means algorithm to perform cluster analysis on the image information of the circuit board to be detected, obtaining a characteristic image of the circuit board to be detected, and analyzing the displacement distance and angle of the probe based on the characteristic image; Adjust the position of the measuring needle according to the displacement distance and angle of the measuring needle, and generate a capacitance measurement message after the adjustment of the measuring needle is completed; According to the capacitance measurement message, the capacitance value of the circuit board to be detected is calculated by a capacitance method, and the capacitance value of the circuit board to be detected is compared with a preset capacitance value to obtain a capacitance comparison result; A quality assessment result of the back-drilled hole of the circuit board is generated according to the capacitance comparison result, and the quality assessment result of the back-drilled hole of the circuit board is transmitted to a user end.

[0006] By adopting the above technical solution, the image information of the circuit board to be inspected is obtained by receiving the inspection instruction, which ensures the standardization and process of the inspection process and improves the orderliness of the inspection work; by adopting the k-means algorithm for cluster analysis, the characteristic image of the circuit board to be inspected is obtained, and the effective recognition and extraction of the key features of the circuit board are realized; by characteristic image analysis, the specific parameters that the probe needs to move are determined, and the positioning of the probe is accurate, which provides a guarantee for accurate measurement; by automatically adjusting the position of the probe, the precise contact of the measuring point is ensured, and the measurement message is generated at the same time, which provides a signal for the start of the measurement process; by applying the capacitance method for calculation, the capacitance value of the circuit board at a specific position is obtained, and the quantitative measurement of the electrical characteristics of the circuit board is realized. By comparing the actual measurement value with the preset standard value, a quick judgment is realized on whether the capacitance characteristics of the circuit board meet the design requirements. The capacitance comparison result provides direct evidence of whether the quality of the circuit board meets the standard, and provides a decision-making basis for quality control; by further analyzing the capacitance comparison result, the manufacturing quality of the back drilling of the circuit board is evaluated, and a comprehensive evaluation of the product quality is provided. The evaluation result is transmitted to the user in real time, and the instant sharing of information is realized, so that the user can understand the inspection results in time and respond.

[0007] In a preferred example, the present application may be further configured as follows: the obtaining of the capacitance detection instruction, and obtaining the image information of the circuit board to be detected according to the capacitance detection instruction, comprises: Using a high-resolution camera device to shoot the circuit board to be inspected from multiple angles to obtain all-round image information of the circuit board to be inspected; The omnidirectional image information of the circuit board to be inspected is preprocessed, wherein the preprocessing includes denoising, contrast enhancement and edge detection to obtain the image information of the circuit board to be inspected.

[0008] By adopting the above technical solution, the images captured by the high-resolution camera device convert the physical characteristics of the circuit board into digital information, laying the foundation for further processing and analysis. Through multi-angle shooting, a comprehensive observation of all parts of the circuit board is achieved, ensuring the integrity and coverage of the image information, and providing a comprehensive perspective for subsequent analysis; the denoising step in the preprocessing eliminates random noise in the image, which may come from the camera device or environmental factors. The denoising image is clearer and reduces interference in subsequent analysis. By enhancing the contrast of the image, the boundaries between different areas on the circuit board are made more obvious, which helps to highlight the key features on the circuit board. Edge detection highlights the edge information in the image. These edges usually mark the dividing lines between different components or areas, which are crucial for subsequent feature extraction and image segmentation. The preprocessed image information is more intuitive when displayed on the user interface, enhancing the visualization of the data and making it easier for users to understand the status of the circuit board.

[0009] In a preferred example, the present application can be further configured as follows: the k-means algorithm is used to perform cluster analysis on the image information of the circuit board to be detected, and the characteristic image of the circuit board to be detected is obtained, including: Performing k-means clustering analysis on the image information of the circuit board to be detected, identifying characteristic areas on the circuit board to be detected, and obtaining clustering results; A characteristic image of the circuit board to be inspected is generated according to the clustering result, and the characteristic image of the circuit board to be inspected is marked to facilitate subsequent positioning and adjustment of the measuring needle.

[0010] By adopting the above technical solution, through k-means clustering analysis, the system can automatically identify the key feature areas in the image, providing accurate positioning information for subsequent analysis. The clustering results help the system simplify complex image information into easy-to-process feature images, remove irrelevant background, and focus on the features that are valuable for circuit board detection. Clustering analysis ensures accurate identification of feature areas, reduces the possibility of erroneous extraction, and provides a reliable basis for subsequent measurement and analysis; based on the clustering results, the system generates feature images that highlight the key features on the circuit board, providing an intuitive visual reference for automated detection and manual inspection, annotating the feature images of the circuit board to be inspected, automatically marking the key measurement points or features on the circuit board, and providing a clear target for probe positioning and adjustment. The annotated feature images guide the probe to accurately locate the correct position on the circuit board, ensuring the accuracy and repeatability of the measurement.

[0011] In a preferred example, the present application may be further configured as follows: the analysis of the displacement distance and angle of the stylus according to the characteristic image includes: According to the back-drilling hole position and size in the characteristic image, using computer-aided design software to simulate the insertion path of the measuring needle and generate the insertion parameters of the measuring needle; According to the insertion parameters of the measuring needle, the displacement distance and angle of the measuring needle are analyzed and obtained.

[0012] By adopting the above technical solution, the insertion path of the probe is simulated by using computer-aided design software, and the insertion parameters of the probe are simulated according to the back-drilled hole position and size in the feature image, and then the displacement distance and angle of the probe are analyzed. Through simulation, the system can generate detailed probe insertion parameters, including the required displacement distance, angle and possible insertion depth, to provide accurate operation guides for automated equipment. Through automated path simulation and parameter generation, the time for manual calculation and adjustment is reduced, and the overall operation efficiency is improved.

[0013] In a preferred example, the present application may be further configured as follows: the capacitance value of the circuit board to be detected is calculated by a capacitance method according to the capacitance measurement message, and the capacitance value of the circuit board to be detected is compared with a preset capacitance value, and the capacitance comparison result is obtained, including: The capacitance is calculated by the formula: The capacitance value at the position of the probe is calculated, where ε0 is the dielectric constant of air, ε r is the relative dielectric constant between the media, A is the cross-sectional area of ​​the back-drilled hole of the circuit board, and d is the thickness of the medium; the capacitance value at the position of the probe is compared with the preset capacitance value, the capacitance deviation is calculated, and the capacitance comparison result is obtained.

[0014] By adopting the above technical solution, using the capacitance calculation formula: The capacitance value at that location can be accurately calculated based on the geometric parameters of the probe position and the dielectric properties. By using the standard capacitance calculation formula, the measurement process is standardized, ensuring the consistency of the results under different measurement conditions. By comparing the measured capacitance value with the preset standard capacitance value, it is possible to quickly determine whether the circuit board meets the design specifications and calculate the capacitance deviation, providing a quantitative indicator of the difference between the circuit board capacitance characteristics and the expected value, which is helpful for further quality control and analysis.

[0015] In a preferred example, the present application can be further configured as follows: the circuit board back-drilling capacitance testing method further includes: Before each capacitance measurement, a calibration instruction of the measuring instrument is generated to calibrate the initial position of the measuring instrument to ensure the accuracy of the measurement result; Setting a user interface to monitor the capacitance measurement process in real time, and transmitting data of the capacitance measurement process to the user interface, and enabling a user to manually intervene in abnormal situations according to the real-time capacitance measurement data; The measurement data and analysis results of the circuit board are transmitted to a cloud server in real time via the Internet, allowing the user to monitor and control the test process via remote devices; When the capacitance comparison result is that the deviation between the actual capacitance data and the preset capacitance value exceeds a preset threshold, an alarm signal is triggered, and an abnormality report is generated and transmitted to the user end.

[0016] By adopting the above technical solution, by generating a calibration instruction before each measurement, the initial position of the measuring instrument is calibrated to ensure the accuracy and reliability of the measurement results, setting a user interface to monitor the capacitance measurement process in real time, and transmitting data to the user interface, the transparency of the measurement process and the instant visualization of the data are achieved, and the user can manually intervene in abnormal situations according to the real-time capacitance measurement data, thereby enhancing the interactivity of the system and the user's participation; the measurement data and analysis results are transmitted to the cloud server via the Internet, allowing the user to monitor and control the test process through remote devices, thereby improving the flexibility of the system and the convenience of the user; when the capacitance comparison result shows that the deviation between the actual capacitance data and the preset capacitance value exceeds the preset threshold, the system will trigger an alarm signal, thereby achieving rapid detection and feedback of abnormal situations, and the system automatically generates an abnormal report and transmits it to the user end, thereby improving the speed and efficiency of problem response.

[0017] The second object of the invention is achieved by the following technical solutions: A circuit board back-drilling capacitor testing device, the circuit board back-drilling capacitor testing device comprising: An image acquisition module is used to acquire a capacitance detection instruction, and acquire image information of a circuit board to be detected according to the capacitance detection instruction; A cluster analysis module, used for performing cluster analysis on the image information of the circuit board to be detected by using a k-means algorithm to obtain a characteristic image of the circuit board to be detected, and analyzing the displacement distance and angle of the probe according to the characteristic image; an adjustment module, used for adjusting the position of the probe according to the displacement distance and angle of the probe, and generating a capacitance measurement message after the probe is adjusted; A comparison module, configured to calculate the capacitance value of the circuit board to be detected by a capacitance method according to the capacitance measurement message, and compare the capacitance value of the circuit board to be detected with a preset capacitance value to obtain a capacitance comparison result; The display module is used to generate a quality assessment result of the back drilling hole of the circuit board according to the capacitance comparison result, and transmit the quality assessment result of the back drilling hole of the circuit board to a user end.

[0018] By adopting the above technical solution, the image information of the circuit board to be inspected is obtained by receiving the inspection instruction, which ensures the standardization and process of the inspection process and improves the orderliness of the inspection work; by adopting the k-means algorithm for cluster analysis, the characteristic image of the circuit board to be inspected is obtained, and the effective recognition and extraction of the key features of the circuit board are realized; by characteristic image analysis, the specific parameters that the probe needs to move are determined, and the positioning of the probe is accurate, which provides a guarantee for accurate measurement; by automatically adjusting the position of the probe, the precise contact of the measuring point is ensured, and the measurement message is generated at the same time, which provides a signal for the start of the measurement process; by applying the capacitance method for calculation, the capacitance value of the circuit board at a specific position is obtained, and the quantitative measurement of the electrical characteristics of the circuit board is realized. By comparing the actual measurement value with the preset standard value, a quick judgment is realized on whether the capacitance characteristics of the circuit board meet the design requirements. The capacitance comparison result provides direct evidence of whether the quality of the circuit board meets the standard, and provides a decision-making basis for quality control; by further analyzing the capacitance comparison result, the manufacturing quality of the back drilling of the circuit board is evaluated, and a comprehensive evaluation of the product quality is provided. The evaluation result is transmitted to the user in real time, and the instant sharing of information is realized, so that the user can understand the inspection results in time and respond.

[0019] The third objective of the present application is achieved through the following technical solutions: A computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the circuit board back-drilling capacitance testing method are implemented.

[0020] The fourth objective of the present application is achieved through the following technical solutions: A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the circuit board back-drilling capacitor testing method are implemented.

[0021] In summary, the present application includes at least one of the following beneficial technical effects: 1. By receiving the detection instructions, the image information of the circuit board to be detected is obtained, which ensures the standardization and process of the detection process and improves the orderliness of the detection work; by using the k-means algorithm for cluster analysis, the characteristic image of the circuit board to be detected is obtained, and the key features of the circuit board are effectively identified and extracted; 2. Through characteristic image analysis, the specific parameters that the stylus needs to move are determined, and the positioning of the stylus is accurate, which provides a guarantee for accurate measurement. By automatically adjusting the position of the stylus, accurate contact of the measuring point is ensured, and a measurement message is generated at the same time, providing a signal for starting the measurement process. 3. The capacitance method is used for calculation to obtain the capacitance value of the circuit board at a specific position, realizing the quantitative measurement of the electrical characteristics of the circuit board. By comparing the actual measured value with the preset standard value, a quick judgment is made on whether the capacitance characteristics of the circuit board meet the design requirements. The capacitance comparison results provide direct evidence of whether the quality of the circuit board meets the standards, providing a decision-making basis for quality control. Through further analysis of the capacitance comparison results, the manufacturing quality of the back drilling of the circuit board is evaluated, providing a comprehensive evaluation of product quality, and transmitting the evaluation results to users in real time, realizing instant information sharing, so that users can understand the test results in a timely manner and respond. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a flow chart of a circuit board back-drilling capacitor testing method in one embodiment of the present application; Figure 2 This is a flowchart for implementing step S10 in a circuit board backdrilling capacitor testing method in an embodiment of the present application; Figure 3 This is a flowchart for implementing step S20 in a circuit board backdrilling capacitor testing method in an embodiment of the present application; Figure 4 This is a flowchart for implementing step S20 in a circuit board back-drilling capacitor testing method in an embodiment of the present application; Figure 5 This is a flowchart for implementing step S40 in a circuit board backdrilling capacitor testing method in an embodiment of the present application; Figure 6 This is a flow chart of an implementation of a circuit board back-drilling capacitor testing method in an embodiment of the present application; Figure 7 This is a principle block diagram of a circuit board back-drilling capacitor testing device in one embodiment of the present application; Figure 8 It is a schematic diagram of a device in an embodiment of the present application. DETAILED DESCRIPTION

[0023] The present application is further described in detail below in conjunction with the accompanying drawings.

[0024] In one embodiment, if Figure 1 As shown, the present application discloses a circuit board back-drilling capacitance testing method, which specifically includes the following steps: S10: Obtain a capacitance detection instruction, and obtain image information of the circuit board to be detected according to the capacitance detection instruction.

[0025] In this embodiment, the capacitance detection instruction refers to an instruction for detecting the capacitance at the back-drilled hole of the circuit board to be detected.

[0026] Specifically, when the system receives a capacitance detection instruction, it needs to detect the capacitance at the back-drilled hole of the circuit board to be detected. According to the capacitance detection instruction, the system uses a high-resolution camera to capture an image of the circuit board to obtain image information of the circuit board to be detected.

[0027] S20: performing cluster analysis on the image information of the circuit board to be inspected by using a k-means algorithm to obtain a characteristic image of the circuit board to be inspected, and analyzing the displacement distance and angle of the probe according to the characteristic image.

[0028] Specifically, the k-means algorithm is used to perform cluster analysis on the acquired circuit board images. K-means is a commonly used clustering algorithm that can divide data points into k clusters. Through cluster analysis, the system can identify key features in the image, which may be related to specific components or structures on the circuit board. Based on the feature images obtained by cluster analysis, the system analyzes the displacement distance and angle that the probe needs to move.

[0029] S30: adjusting the position of the probe according to the displacement distance and angle of the probe, and generating a capacitance measurement message after the probe is adjusted.

[0030] Specifically, after analyzing the displacement distance and angle that the probe needs to move, the system adjusts the position of the probe based on the displacement distance and angle that the probe needs to move to ensure that it can accurately contact the measurement point on the circuit board. After the probe is adjusted into position, the system generates a capacitance measurement message indicating that the measurement process of the circuit board is about to begin.

[0031] S40: According to the capacitance measurement message, the capacitance value of the circuit board to be detected is calculated by a capacitance method, and the capacitance value of the circuit board to be detected is compared with a preset capacitance value to obtain a capacitance comparison result.

[0032] Specifically, the system uses a capacitance method to measure the capacitance value of the circuit board, and compares the measured capacitance value with a preset standard capacitance value to determine whether the circuit board meets the design specifications, and finally obtains a capacitance data comparison result after comparing the capacitance data.

[0033] S50: generating a quality assessment result of the back drilling hole of the circuit board according to the capacitance comparison result, and transmitting the quality assessment result of the back drilling hole of the circuit board to the user end.

[0034] Specifically, because back drilling is an important step in the circuit board manufacturing process, its quality directly affects the performance of the circuit board. Based on the capacitance comparison results, the system generates a quality assessment result of the circuit board back drilling. Finally, the system transmits the quality assessment result to the user end through a display interface or report for the operator or quality control department to make corresponding records and adjustments.

[0035] By adopting the above technical solution, the image information of the circuit board to be inspected is obtained by receiving the inspection instruction, which ensures the standardization and process of the inspection process and improves the orderliness of the inspection work; by adopting the k-means algorithm for cluster analysis, the characteristic image of the circuit board to be inspected is obtained, and the effective recognition and extraction of the key features of the circuit board are realized; by characteristic image analysis, the specific parameters that the probe needs to move are determined, and the positioning of the probe is accurate, which provides a guarantee for accurate measurement; by automatically adjusting the position of the probe, the precise contact of the measuring point is ensured, and the measurement message is generated at the same time, which provides a signal for the start of the measurement process; by applying the capacitance method for calculation, the capacitance value of the circuit board at a specific position is obtained, and the quantitative measurement of the electrical characteristics of the circuit board is realized. By comparing the actual measurement value with the preset standard value, a quick judgment is realized on whether the capacitance characteristics of the circuit board meet the design requirements. The capacitance comparison result provides direct evidence of whether the quality of the circuit board meets the standard, and provides a decision-making basis for quality control; by further analyzing the capacitance comparison result, the manufacturing quality of the back drilling of the circuit board is evaluated, and a comprehensive evaluation of the product quality is provided. The evaluation result is transmitted to the user in real time, and the instant sharing of information is realized, so that the user can understand the inspection results in time and respond.

[0036] In one embodiment, if Figure 2 As shown, in step S10, a capacitance detection instruction is obtained, and image information of the circuit board to be detected is obtained according to the capacitance detection instruction, which specifically includes: S11: Use a high-resolution camera device to shoot the circuit board to be inspected from multiple angles to obtain all-round image information of the circuit board to be inspected.

[0037] Specifically, a high-resolution camera is used to photograph the circuit board to obtain high-definition images, and the images are photographed from multiple angles to ensure that every detail and feature of the circuit board can be captured. The all-round image information and images obtained from different perspectives can provide a comprehensive view, which helps the subsequent analysis and inspection of the circuit board to be inspected to be more accurate.

[0038] S12: Preprocessing the omnidirectional image information of the circuit board to be inspected, wherein the preprocessing includes denoising, contrast enhancement and edge detection to obtain the image information of the circuit board to be inspected.

[0039] Specifically, in order to improve the image quality and make it more suitable for further processing and analysis, the all-round image information of the circuit board to be inspected is preprocessed. The preprocessing includes denoising, contrast enhancement and edge detection, such as removing random noise in the image, which may come from the camera device, environmental factors or interference in the image transmission process; adjusting the contrast of the image to make the differences between different areas in the image more obvious; identifying the edges in the image, which are usually the dividing lines between different areas, such as the edges of the lines on the circuit board or the outlines of the components. After the above preprocessing steps, the obtained image information will be clearer, with higher contrast and more obvious edges, and finally the image information of the circuit board to be inspected will be obtained.

[0040] In one embodiment, if Figure 3 As shown, in step S20, the image information of the circuit board to be detected is clustered and analyzed using the k-means algorithm to obtain a characteristic image of the circuit board to be detected, which specifically includes: S21: Perform k-means clustering analysis on the image information of the circuit board to be inspected, identify the characteristic area on the circuit board to be inspected, and obtain a clustering result.

[0041] Specifically, in order to group similar areas in the image of the circuit board to be inspected so as to identify the characteristic areas on the circuit board, a k-means clustering analysis is performed on the image information of the circuit board to be inspected. Through the k-means algorithm, the system can identify different characteristic areas in the image, which may have similar color, texture or shape characteristics. After the clustering analysis is completed, the system will obtain a clustering result, which shows the grouping of different areas in the image.

[0042] S22: Generate a feature image of the circuit board to be inspected according to the clustering result, and mark the feature image of the circuit board to be inspected to facilitate subsequent positioning and adjustment of the probe.

[0043] Specifically, based on the clustering results, the system will generate a feature image that highlights the key feature areas on the circuit board. In order to guide the subsequent positioning and adjustment of the probe, the feature image of the circuit board to be inspected is annotated. Through annotation, the system can know where to place the probe and how to adjust the probe for accurate capacitance measurement. With the feature image and annotation information, the system can more accurately position the probe to ensure that it can contact the correct measurement point on the circuit board.

[0044] In one embodiment, if Figure 4 As shown, in step S20, the displacement distance and angle of the measuring needle are analyzed based on the characteristic image, which specifically includes: S23: According to the back-drilling hole position and size in the feature image, the insertion path of the probe is simulated using computer-aided design software to generate insertion parameters of the probe.

[0045] Specifically, according to the position and size of the back-drilled hole in the feature image, the insertion path of the stylus is simulated using computer-aided design software. Through simulation, the CAD software can generate detailed parameters of the stylus insertion path, including insertion depth, angle, speed, etc. These parameters help ensure that the stylus can be accurately inserted into the back-drilled hole.

[0046] S24: According to the insertion parameters of the probe, the displacement distance and angle of the probe are analyzed and obtained.

[0047] In this embodiment, the displacement distance refers to the horizontal or vertical distance that the probe moves from its current position to the insertion point. The angle refers to the direction in which the probe needs to be adjusted. Specifically, based on the insertion parameters generated by the CAD software, the specific distance and angle that the probe needs to move can be further analyzed. After the analysis is completed, the system will derive the displacement distance and angle of the probe. With these precise data, it can be ensured that the probe can be accurately positioned at the measurement point on the circuit board, thereby performing accurate capacitance measurement.

[0048] In one embodiment, if Figure 5 As shown, in step S40, the capacitance value of the circuit board to be detected is calculated by the capacitance method according to the capacitance measurement message, and the capacitance value of the circuit board to be detected is compared with the preset capacitance value to obtain the capacitance comparison result, which specifically includes: S41: Calculate capacitance by the formula: The capacitance value at the probe location is calculated, where ε0 is the dielectric constant of air, ε r is the relative dielectric constant between the media, A is the cross-sectional area of ​​the back-drilled hole of the circuit board, and d is the thickness of the medium.

[0049] Specifically, the capacitance is calculated by the formula: The capacitance value at the probe location is calculated, where ε0 is the dielectric constant of air, ε r is the relative dielectric constant between media, A is the cross-sectional area of ​​the back-drilled hole of the circuit board, and d is the thickness of the medium. According to the above formula, the capacitance value at the position of the probe can be calculated. This value depends on the insertion depth of the probe, the area of ​​the back-drilled hole, and the characteristics of the dielectric material.

[0050] S42: Compare the capacitance value at the position where the measuring needle is located with the preset capacitance value, calculate the capacitance deviation, and obtain the capacitance comparison result.

[0051] Specifically, the calculated capacitance value needs to be compared with the preset capacitance value. The preset capacitance value is the capacitance value defined in the design specification, which is used to ensure that the performance of the circuit board meets the requirements. Finally, the capacitance comparison result is obtained. If the capacitance deviation is within the specified tolerance range, the capacitance performance of the circuit board is considered to be qualified; if the deviation exceeds the tolerance range, further inspection or adjustment may be required.

[0052] In one embodiment, if Figure 6 As shown, the circuit board back drilling capacitor testing method also includes: S61: Before each capacitance measurement, a calibration instruction of the measuring instrument is generated, and the initial position of the measuring instrument is calibrated to ensure the accuracy of the measurement result.

[0053] Specifically, before each capacitance measurement, the system generates a calibration instruction to calibrate the initial position of the measuring instrument to ensure that the initial position of the measuring instrument is accurate, thereby eliminating instrument errors and ensuring the accuracy and repeatability of the measurement results.

[0054] S62: Setting a user interface, monitoring the capacitance measurement process in real time, transmitting data of the capacitance measurement process to the user interface, and enabling a user to manually intervene in abnormal situations according to the real-time capacitance measurement data.

[0055] Specifically, the system sets up a user interface that allows the operator to monitor the capacitance measurement process in real time. The user interface provides an interactive platform so that the operator can view the measurement data in real time and perform manual intervention when an abnormal situation is found.

[0056] S63: Transmits the measurement data and analysis results of the circuit board to the cloud server in real time via the Internet, allowing users to monitor and control the test process through remote devices.

[0057] Specifically, the data collected during the measurement process will be transmitted to the user interface in real time. Real-time data transmission ensures that the operator can obtain the measurement results in a timely manner and respond as needed. The measurement data and analysis results are transmitted to the cloud server in real time via the Internet, which allows users to use remote devices such as smartphones, tablets or laptops to monitor and control the test process.

[0058] S64: When the capacitance comparison result shows that the deviation between the actual capacitance data and the preset capacitance value exceeds a preset threshold, an alarm signal is triggered, and an abnormality report is generated and transmitted to the user end.

[0059] Specifically, when the deviation between the actual measured capacitance value and the preset capacitance value exceeds a preset threshold, the system will trigger an alarm signal to prompt the operator or user that there may be a problem with the measurement result. Once the alarm signal is triggered, the system will automatically generate an exception report, which will record the abnormal situation in detail and transmit it to the user end for the operator to further analyze and take corresponding corrective measures. After the user end receives the exception report, the operator can evaluate the situation and decide whether to take measures, such as recalibrating the instrument, adjusting the measurement settings, or checking the quality of the circuit board.

[0060] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0061] In one embodiment, a circuit board back-drilling capacitance testing device is provided, and the circuit board back-drilling capacitance testing device corresponds to the circuit board back-drilling capacitance testing method in the above embodiment. Figure 7 As shown, the circuit board back-drilling capacitor testing device includes an image acquisition module, a cluster analysis module, an adjustment module, a comparison module and a display module. The functional modules are described in detail as follows: An image acquisition module is used to acquire a capacitance detection instruction, and acquire image information of the circuit board to be detected according to the capacitance detection instruction; a cluster analysis module is used to perform cluster analysis on the image information of the circuit board to be detected using a k-means algorithm to obtain a characteristic image of the circuit board to be detected, and analyze the displacement distance and angle of the probe according to the characteristic image; An adjustment module is used to adjust the position of the probe according to the displacement distance and angle of the probe, and generate a capacitance measurement message after the probe is adjusted; A comparison module is used to calculate the capacitance value of the circuit board to be detected by a capacitance method according to the capacitance measurement message, and compare the capacitance value of the circuit board to be detected with a preset capacitance value to obtain a capacitance comparison result; The display module is used to generate a quality assessment result of the back drilling hole of the circuit board according to the capacitance comparison result, and transmit the quality assessment result of the back drilling hole of the circuit board to the user end.

[0062] Optionally, the circuit board back-drilling capacitance testing device further includes: The pre-adjustment module is used to generate a calibration instruction for the measuring instrument before each capacitance measurement, and calibrate the initial position of the measuring instrument to ensure the accuracy of the measurement result; An interface module is provided, which is used to set a user interface, monitor the capacitance measurement process in real time, transmit the data of the capacitance measurement process to the user interface, and enable the user to manually intervene in abnormal situations according to the real-time capacitance measurement data; Remote control module, used to transmit the measurement data and analysis results of the circuit board to the cloud server in real time via the Internet, allowing users to monitor and control the test process through remote devices; The alarm module is used to trigger an alarm signal and generate an abnormality report to be transmitted to the user end when the capacitance comparison result is that the deviation between the actual capacitance data and the preset capacitance value exceeds a preset threshold.

[0063] Optionally, the image acquisition module includes: The shooting submodule is used to shoot the circuit board to be inspected from multiple angles using a high-resolution camera device to obtain all-round image information of the circuit board to be inspected; The image preprocessing submodule is used to preprocess the omnidirectional image information of the circuit board to be inspected. The preprocessing includes denoising, contrast enhancement and edge detection to obtain the image information of the circuit board to be inspected.

[0064] Optionally, the cluster analysis module includes: The clustering submodule is used to perform k-means clustering analysis on the image information of the circuit board to be inspected, identify the characteristic areas on the circuit board to be inspected, and obtain the clustering results; The annotation submodule is used to generate a feature image of the circuit board to be inspected according to the clustering results, and to annotate the feature image of the circuit board to be inspected for subsequent positioning and adjustment of the probe.

[0065] A simulation submodule is used to simulate the insertion path of the probe according to the back-drilling hole position and size in the feature image using computer-aided design software to generate the insertion parameters of the probe; The analysis submodule is used to analyze and obtain the displacement distance and angle of the probe according to the insertion parameters of the probe.

[0066] Optionally, the comparison module includes: The calculation submodule is used to calculate the capacitance through the formula: The capacitance value at the probe location is calculated, where ε0 is the dielectric constant of air, ε r is the relative dielectric constant between the media, A is the cross-sectional area of ​​the back-drilled hole of the circuit board, and d is the thickness of the media; The comparison result obtaining submodule is used to compare the capacitance value at the position where the measuring needle is located with the preset capacitance value, calculate the capacitance deviation, and obtain the capacitance comparison result.

[0067] The specific definition of a circuit board back-drilling capacitor test device can be found in the above definition of a circuit board back-drilling capacitor test method, which will not be repeated here. Each module in the above circuit board back-drilling capacitor test device can be implemented in whole or in part by software, hardware and a combination thereof. The above modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0068] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 8 As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a circuit board back drilling capacitor test method is implemented.

[0069] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program: Obtaining a capacitance detection instruction, and obtaining image information of the circuit board to be detected according to the capacitance detection instruction; The k-means algorithm is used to perform cluster analysis on the image information of the circuit board to be inspected, and the characteristic image of the circuit board to be inspected is obtained. Based on the characteristic image, the displacement distance and angle of the probe are analyzed; The position of the probe is adjusted according to the displacement distance and angle of the probe, and a capacitance measurement message is generated after the probe adjustment is completed; According to the capacitance measurement message, the capacitance value of the circuit board to be detected is calculated by the capacitance method, and the capacitance value of the circuit board to be detected is compared with a preset capacitance value to obtain a capacitance comparison result; A quality assessment result of the back drilling hole of the circuit board is generated according to the capacitance comparison result, and the quality assessment result of the back drilling hole of the circuit board is transmitted to the user end.

[0070] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: Obtaining a capacitance detection instruction, and obtaining image information of the circuit board to be detected according to the capacitance detection instruction; The k-means algorithm is used to perform cluster analysis on the image information of the circuit board to be inspected, and the characteristic image of the circuit board to be inspected is obtained. Based on the characteristic image, the displacement distance and angle of the probe are analyzed; The position of the probe is adjusted according to the displacement distance and angle of the probe, and a capacitance measurement message is generated after the probe adjustment is completed; According to the capacitance measurement message, the capacitance value of the circuit board to be detected is calculated by the capacitance method, and the capacitance value of the circuit board to be detected is compared with a preset capacitance value to obtain a capacitance comparison result; A quality assessment result of the back drilling hole of the circuit board is generated according to the capacitance comparison result, and the quality assessment result of the back drilling hole of the circuit board is transmitted to the user end.

[0071] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0072] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0073] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A circuit board back-drilling capacitance testing method, characterized in that: The circuit board back-drilling capacitance testing method comprises: obtaining a capacitance detection instruction, and obtaining image information of a circuit board to be detected according to the capacitance detection instruction; Using a k-means algorithm to perform cluster analysis on the image information of the circuit board to be detected, obtaining a characteristic image of the circuit board to be detected, and analyzing the displacement distance and angle of the probe based on the characteristic image; Adjust the position of the measuring needle according to the displacement distance and angle of the measuring needle, and generate a capacitance measurement message after the adjustment of the measuring needle is completed; According to the capacitance measurement message, the capacitance value of the circuit board to be detected is calculated by a capacitance method, and the capacitance value of the circuit board to be detected is compared with a preset capacitance value to obtain a capacitance comparison result; A quality assessment result of the back-drilled hole of the circuit board is generated according to the capacitance comparison result, and the quality assessment result of the back-drilled hole of the circuit board is transmitted to a user end.

2. A circuit board back drilling capacitance testing method according to claim 1, characterized in that: The obtaining of the capacitance detection instruction and obtaining the image information of the circuit board to be detected according to the capacitance detection instruction comprises: Using a high-resolution camera device to shoot the circuit board to be inspected from multiple angles to obtain all-round image information of the circuit board to be inspected; The omnidirectional image information of the circuit board to be inspected is preprocessed, wherein the preprocessing includes denoising, contrast enhancement and edge detection to obtain the image information of the circuit board to be inspected.

3. A circuit board back drilling capacitance testing method according to claim 2, characterized in that: The adopting k-means algorithm to perform cluster analysis on the image information of the circuit board to be detected to obtain the characteristic image of the circuit board to be detected comprises: performing k-means cluster analysis on the image information of the circuit board to be detected, identifying the characteristic area on the circuit board to be detected, and obtaining a clustering result; A characteristic image of the circuit board to be inspected is generated according to the clustering result, and the characteristic image of the circuit board to be inspected is marked to facilitate subsequent positioning and adjustment of the measuring needle.

4. A circuit board back drilling capacitance testing method according to claim 3, characterized in that: The step of analyzing the displacement distance and angle of the measuring needle according to the characteristic image comprises: According to the back-drilling hole position and size in the characteristic image, using computer-aided design software to simulate the insertion path of the measuring needle and generate the insertion parameters of the measuring needle; According to the insertion parameters of the measuring needle, the displacement distance and angle of the measuring needle are analyzed and obtained.

5. A circuit board back drilling capacitance testing method according to claim 1, characterized in that: The step of calculating the capacitance value of the circuit board to be detected by a capacitance method according to the capacitance measurement message, and comparing the capacitance value of the circuit board to be detected with a preset capacitance value to obtain a capacitance comparison result includes: The capacitance is calculated by the formula: The capacitance value at the position of the probe is calculated, where ε0 is the dielectric constant of air, ε r is the relative dielectric constant between the media, A is the cross-sectional area of ​​the back-drilled hole of the circuit board, and d is the thickness of the media; The capacitance value at the position where the measuring needle is located is compared with the preset capacitance value, and the capacitance deviation is calculated to obtain the capacitance comparison result.

6. A circuit board back drilling capacitance testing method according to claim 1, characterized in that: The circuit board back drilling capacitance testing method further comprises: Before each capacitance measurement, a calibration instruction of the measuring instrument is generated to calibrate the initial position of the measuring instrument to ensure the accuracy of the measurement result; Setting a user interface to monitor the capacitance measurement process in real time, and transmitting data of the capacitance measurement process to the user interface, and enabling a user to manually intervene in abnormal situations according to the real-time capacitance measurement data; The measurement data and analysis results of the circuit board are transmitted to a cloud server in real time via the Internet, allowing the user to monitor and control the test process via remote devices; When the capacitance comparison result is that the deviation between the actual capacitance data and the preset capacitance value exceeds a preset threshold, an alarm signal is triggered, and an abnormality report is generated and transmitted to the user end.

7. A circuit board back-drilling capacitor testing device, characterized in that: The circuit board back drilling capacitance testing device comprises: An image acquisition module is used to acquire a capacitance detection instruction, and acquire image information of a circuit board to be detected according to the capacitance detection instruction; A cluster analysis module, used for performing cluster analysis on the image information of the circuit board to be detected by using a k-means algorithm to obtain a characteristic image of the circuit board to be detected, and analyzing the displacement distance and angle of the probe according to the characteristic image; An adjustment module, used for adjusting the position of the measuring needle according to the displacement distance and angle of the measuring needle, and generating a capacitance measurement message after the adjustment of the measuring needle is completed; A comparison module, configured to calculate the capacitance value of the circuit board to be detected by a capacitance method according to the capacitance measurement message, and compare the capacitance value of the circuit board to be detected with a preset capacitance value to obtain a capacitance comparison result; The display module is used to generate a quality assessment result of the back drilling hole of the circuit board according to the capacitance comparison result, and transmit the quality assessment result of the back drilling hole of the circuit board to a user end.

8. A circuit board back-drilling capacitance testing device according to claim 7, characterized in that: The circuit board back drilling capacitance testing device further comprises: A pre-adjustment module is used to generate a calibration instruction for the measuring instrument before each capacitance measurement, and calibrate the initial position of the measuring instrument to ensure the accuracy of the measurement result; An interface module is provided, which is used to set a user interface, monitor the capacitance measurement process in real time, transmit data of the capacitance measurement process to the user interface, and enable a user to manually intervene in abnormal situations according to the real-time capacitance measurement data; A remote control module, used to transmit the measurement data and analysis results of the circuit board to a cloud server in real time via the Internet, allowing the user to monitor and control the test process via remote devices; The alarm module is used to trigger an alarm signal when the capacitance comparison result shows that the deviation between the actual capacitance data and the preset capacitance value exceeds a preset threshold, and generate an abnormality report and transmit it to the user end.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the circuit board backdrill capacitance testing method as claimed in any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of a circuit board back-drilling capacitor testing method as claimed in any one of claims 1 to 6 are implemented.

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