Photosensitive chip testing device

Abstract

The invention provides a light-sensitive chip testing device, and the device comprises a housing which is provided with an adsorption mechanism and a light source groove, and the adsorption mechanism is used for absorbing a to-be-tested light-sensitive chip; and the light source groove is used for providing an irradiation light source for the light sensing chip to be tested. According to the technical scheme, the adsorption mechanism and the light source groove are arranged, and the adsorption mechanism is used for adsorbing the light sensing chip to be tested; the light source groove is used for providing an irradiation light source for the light sensing chip to be tested; the problem of providing a controllable light source when the light sensing chip is tested is solved.

Description

Background Art

[0002] With the development of modern science and technology, there are more and more types of photosensitive chips. Currently, photosensitive chips are mainly used to receive signals and convert light signals into electrical signals. Whether the conversion is accurate or not and the conversion rate will affect the quality of the chip; therefore, it is necessary to test whether the photosensitive function of the chip is effective before the chip is shipped.

[0003] The ordinary Nest is used to pick up the chip from the sorting machine shuttle and press the chip into the test socket, so that the chip pins contact the pins of the test socket to test the electrical performance. Therefore, the main functions of the ordinary Nest are two: 1. Pick up the chip. 2. Press down the chip.

[0004] When testing the optoelectronic chip, a light source needs to be provided above the chip to illuminate the photosensitive part of the chip to test whether the chip's photosensitivity meets the design requirements. However, during the test, the Nest Plunge is directly above the chip, and the normal Nest Plunge cannot provide light. Summary of the invention

[0005] The present application provides a photosensitive chip testing device to solve the problem of providing a controllable light source when testing a photosensitive chip.

[0006] The present application provides a light sensing chip testing device, comprising: a housing, on which an adsorption mechanism and a light source slot are provided, wherein:

[0007] The adsorption mechanism is used to absorb the photosensitive chip to be tested;

[0008] The light source slot is used to provide a light source for illuminating the light sensing chip to be tested.

[0009] In the above technical solution, an adsorption mechanism and a light source slot are provided. The adsorption mechanism is used to absorb the photosensitive chip to be tested; the light source slot is used to provide an irradiation light source for the photosensitive chip to be tested. This solves the problem of providing a controllable light source when testing the photosensitive chip.

[0010] In a specific embodiment, an original light source is arranged in the housing, wherein:

[0011] The original light source is used to generate the illumination light source.

[0012] In a specific embodiment, the adsorption mechanism includes an adsorption hole provided on the shell, wherein:

[0013] The adsorption hole is used to adsorb the photosensitive chip to be tested.

[0014] In a specific embodiment, the number of the adsorption holes is multiple.

[0015] In a specific implementation manner, the adsorption holes are evenly distributed on the top plate of the shell.

[0016] In a specific implementation manner, the light source slot is arranged on the top plate of the housing.

[0017] In a specific embodiment, it further comprises a driving mechanism, wherein the driving mechanism is connected to the adsorption mechanism,

[0018] The driving mechanism is used to drive the adsorption mechanism.

[0019] In a specific implementation manner, the original light source includes a lamp bead, and the lamp bead is fixedly connected to the shell.

[0020] In a specific implementation scheme, a power column through hole is provided on the shell, and the power column of the lamp bead is installed through the power column through hole.

[0021] In a specific implementation scheme, it also includes a Socket test socket, wherein,

[0022] The driving mechanism drives the housing to press the light sensing chip to be tested into the Socket test socket, and the power column of the lamp bead passes through the power column through hole and abuts against the Socket test socket. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a photosensitive chip testing device provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the structure of another photosensitive chip testing device provided in an embodiment of the present application.

[0025] Among them, 1-shell, 2-adsorption mechanism, 3-light source slot, 4-original light source, 5-driving mechanism, 6-power column through hole. DETAILED DESCRIPTION

[0026] The present application is further described in detail below through the accompanying drawings and embodiments. Through these descriptions, the characteristics and advantages of the present application will become clearer and more specific.

[0027] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Although various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise noted.

[0028] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0029] To facilitate understanding of the photosensitive chip testing device provided in the embodiment of the present application, its application scenario is first explained. The photosensitive chip testing device provided in the embodiment of the present application is used to solve the problem of providing a controllable light source when testing a photosensitive chip. With the development of modern science and technology, the types of photosensitive chips are developing more and more. At present, photosensitive chips are mainly used to receive signals and convert optical signals into electrical signals. Whether the conversion is accurate or not, and how much the conversion rate will affect the quality of the chip; this requires that the photosensitive function of the chip be tested before the chip is shipped. The ordinary Nest is used to suck the chip from the sorting machine shuttle and press the chip down to the test socket, and contact the chip pins with the pins of the test socket to test the electrical performance. Therefore, the main functions of the ordinary Nest are two: 1. Suction chip. 2. Press down the chip. When testing the optoelectronic chip, it is necessary to provide a light source above the chip to illuminate the photosensitive part of the chip to test whether the photosensitive function of the chip meets the design requirements, but the Plunge of the Nest is directly above the chip during the test, and the normal Nest Plunge cannot provide a light source. For this reason, the embodiment of the present application provides a photosensitive chip testing device to solve the problem of providing a controllable light source when testing a photosensitive chip. The following describes it in detail with reference to specific drawings and embodiments.

[0030] refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a photosensitive chip testing device provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure of another photosensitive chip testing device provided in an embodiment of the present application.

[0031] exist Figure 1 In the embodiment of the present application, a light sensing chip testing device is provided, comprising: a housing 1, on which an adsorption mechanism 2 and a light source slot 3 are provided, wherein:

[0032] The adsorption mechanism is used to absorb the photosensitive chip to be tested;

[0033] The light source slot is used to provide a light source for illuminating the light sensing chip to be tested.

[0034] In the above technical solution, an adsorption mechanism and a light source slot are provided. The adsorption mechanism is used to absorb the photosensitive chip to be tested; the light source slot is used to provide an irradiation light source for the photosensitive chip to be tested. This solves the problem of providing a controllable light source when testing the photosensitive chip.

[0035] In this embodiment, four small holes (i.e., adsorption mechanism 2) are opened at the four corners of the top of the Nest Plunger (i.e., the shell 1) for absorbing the chip, and a square or rectangular light source slot (designed according to the size of the photosensitive part of the photosensitive chip) is opened in the middle of the Nest Plunger. Figure 1 Open two holes on the slope at one end of the Nest Plunger to install the power column of the LED lamp beads, as shown. Figure 2 As shown. This application can achieve three functions of Nest: first, it can absorb the chip through the four small holes; second, the top of Nest can also press down the chip; third, it provides light to the photosensitive chip through the light source slot in the middle. This solves the problem of providing a controllable light source when testing the photosensitive chip.

[0036] In a specific embodiment, an original light source 4 is provided in the housing, wherein:

[0037] The original light source is used to generate the illumination light source.

[0038] In a specific embodiment, the adsorption mechanism includes an adsorption hole provided on the shell, wherein:

[0039] The adsorption hole is used to adsorb the photosensitive chip to be tested.

[0040] In a specific implementation manner, the number of the adsorption holes is multiple (two or more), such as two, three, or other different numbers.

[0041] In a specific implementation manner, the adsorption holes are evenly distributed on the top plate of the shell.

[0042] In a specific implementation manner, the light source slot is arranged on the top plate of the housing.

[0043] exist Figure 2 In a specific embodiment, it further includes a driving mechanism 5, which is connected to the adsorption mechanism, wherein:

[0044] The driving mechanism is used to drive the adsorption mechanism.

[0045] In a specific implementation manner, the original light source includes a lamp bead, and the lamp bead is fixedly connected to the shell.

[0046] In a specific implementation scheme, a power column through hole 6 is provided on the shell, and the power column of the lamp bead is installed through the power column through hole.

[0047] In a specific implementation scheme, it also includes a Socket test socket, wherein,

[0048] The driving mechanism drives the housing to press the light sensing chip to be tested into the Socket test socket, and the power column of the lamp bead passes through the power column through hole and abuts against the Socket test socket.

[0049] In this embodiment, the solution of the embodiment of the present application can be used to supply power through the Socket test socket below the chip, and the LED lamp beads can be installed in the Nest Plunge (i.e., the shell 1); during testing, the Nest Plunge presses the chip down to the Socket test socket, and the lamp bead power is turned on at the same time, and the power supply of the LED lamp bead can be controlled and the voltage can be adjusted through the test machine.

[0050] Those skilled in the art will appreciate that the present application may be implemented as a system, method or computer program product.

[0051] Therefore, the present disclosure may be specifically implemented in the following forms, namely: it may be completely hardware, it may be completely software (including firmware, resident software, microcode, etc.), or it may be a combination of hardware and software, generally referred to herein as a "circuit", "module" or "system". In addition, in some embodiments, the present application may also be implemented in the form of a computer program product in one or more computer-readable media, and the computer-readable medium may contain computer-readable program code.

[0052] Any combination of one or more computer-readable media can be used. Computer-readable media can be computer-readable signal media or computer-readable storage media. Computer-readable storage media can be, for example, but not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or devices, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: electrical connections with one or more wires, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this document, computer-readable storage media can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.

[0053] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art can change, modify, replace and modify the above embodiments within the scope of the present application. On this basis, a variety of replacements and improvements can be made to the present application, all of which fall within the scope of protection of the present application.

Claims

1. A light sensing chip testing device, characterized in that: It comprises: a housing, on which an adsorption mechanism and a light source slot are arranged, wherein: The adsorption mechanism is used to absorb the photosensitive chip to be tested; The light source slot is used to provide a light source for illuminating the light sensing chip to be tested.

2. The light sensing chip testing device according to claim 1, characterized in that: An original light source is arranged in the housing, wherein: The original light source is used to generate the illumination light source.

3. The light sensing chip testing device according to claim 2, characterized in that: The adsorption mechanism includes an adsorption hole arranged on the shell, wherein: The adsorption hole is used to adsorb the photosensitive chip to be tested.

4. The light sensing chip testing device according to claim 3, characterized in that: The number of the adsorption holes is multiple.

5. The light sensing chip testing device according to claim 4, characterized in that: The adsorption holes are evenly distributed on the top plate of the shell.

6. The light sensing chip testing device according to claim 5, characterized in that: The light source groove is arranged on the top plate of the housing.

7. The light sensing chip testing device according to claim 6, characterized in that: It also includes a driving mechanism, which is connected to the adsorption mechanism, wherein: The driving mechanism is used to drive the adsorption mechanism.

8. The light sensing chip testing device according to claim 7, characterized in that: The original light source includes a lamp bead, and the lamp bead is fixedly connected to the shell.

9. The light sensing chip testing device according to claim 8, characterized in that: The shell is provided with a power column through hole, and the power column of the lamp bead is installed through the power column through hole.

10. The light sensing chip testing device according to claim 9, characterized in that: Also includes a Socket test socket, where The driving mechanism drives the housing to press the light sensing chip to be tested into the Socket test socket, and the power column of the lamp bead passes through the power column through hole and abuts against the Socket test socket.

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