Heat dissipation device

Abstract

The invention discloses a heat dissipation device which is used for dissipating heat for at least one heat source device. The heat dissipation device comprises a supporting frame, at least one radiator and at least one guide mechanism, each guide mechanism is connected with one radiator and used for driving the radiator to be close to or away from a heat source device, a heat conduction layer is arranged on the side, facing the heat source device, of the radiator, and the heat source device is connected to the supporting frame in a pluggable mode. The heat source device slides in the supporting frame from a first position to a second position in the insertion direction, when the heat source device is located at the first position, a gap is formed between the heat conduction layer and the heat source device, and when the heat source device is located at the second position, the heat conduction layer makes contact with the heat source device. According to the heat dissipation device, the heat source device does not make contact with the heat conduction layer of the heat dissipation device in the plugging and unplugging process, and the situation that the heat conduction layer is damaged is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a heat dissipation device. Background Art

[0002] The heat dissipation of the optical module mainly relies on the heat sink. Since the heat sink and the optical module are in direct contact, they cannot fit completely together, which increases the contact thermal resistance and deteriorates the heat dissipation effect. Therefore, a thermal conductive layer is set between the heat sink and the optical module. The thermal conductive layer can reduce the above-mentioned contact thermal resistance. The optical module is plugged in and connected to the optical cage. During the plug-in and unplug process, the optical module will hit the pre-set thermal conductive layer on the heat sink, causing the thermal conductive layer to be damaged, which deteriorates the heat dissipation effect and may also cause serious problems such as port failure and equipment failure. Summary of the invention

[0003] The present application provides a heat dissipation device for dissipating heat for at least one heat source device. The heat dissipation device includes a support frame, at least one heat sink, and at least one guide mechanism. Each of the guide mechanisms is connected to one of the heat sinks and is used to drive the heat sink to approach or move away from the heat source device. A heat conducting layer is provided on the side of the heat sink facing the heat source device, and the heat source device is pluggably connected to the support frame. The heat source device slides from a first position to a second position along the insertion direction in the support frame. When the heat source device is located at the first position, there is a gap between the heat conducting layer and the heat source device. When the heat source device is located at the second position, the heat conducting layer is in contact with the heat source device.

[0004] In the above embodiment, the heat source device is an optical module, and the support frame is an optical cage. A connector is installed in the support frame, and the heat source device is plugged and installed in the support frame, thereby realizing connection or disconnection with the connector. The above-mentioned first position and second position are two positions of the heat source device inside the support frame, respectively. Among them, the first position is the initial position of the heat source device during the insertion process. When the heat source device is in the first position, the heat source device is not connected to the connector, that is, the heat source device is not plugged in place, at this time, the heat conductive layer of the radiator is not in contact with the heat source device. When the heat source device is in the second position, the heat source device is connected to the connector in the support frame, and the heat source device is plugged in place. At this time, the heat conductive layer of the radiator is in contact with the heat source device. In the process of the heat source device sliding from the first position to the second position, that is, in the process of inserting the heat source device, the guide mechanism always applies pressure to the heat source device toward the heat source device, so that it is close to the heat source device. When the heat source device is in the second position, the radiator descends under the action of the guide mechanism, so that the heat conductive layer is in contact with the heat source device. The heat dissipation device of the present application can prevent the heat source component from contacting the heat conduction layer of the heat sink during the plugging and unplugging process, thereby reducing the possibility of damage to the heat conduction layer.

[0005] In an optional technical solution, a driving column is provided on a side of the heat sink facing the heat source device, and the heat source device abuts against the driving column.

[0006] In an optional technical solution, the guide mechanism includes a first guide mechanism, the first guide mechanism includes a first connecting member, a bulge and a groove, the first connecting member is installed on the top of the support frame, the radiator includes a first radiator, the first radiator is installed between the first connecting member and the support frame, the bulge is arranged on the side of the support frame facing the first radiator, the first radiator includes a first surface, the first surface faces the support frame, and the groove is arranged on the first surface; when the heat source device is located at the first position, the first surface is against the bulge, and when the heat source device is located at the second position, the bulge is plugged into the groove.

[0007] In an optional technical solution, the groove has a first guide surface, the first guide surface has an obtuse angle with the first surface, and the convex hull slides along the first guide surface.

[0008] In an optional technical solution, the first connecting member includes a clamping rib, which is located on the side of the first heat sink away from the heat source device, and the clamping rib includes a first rib plate and a second rib plate connected to each other, the first rib plate and the second rib plate have an obtuse angle, and a first edge is formed at the connection between the first rib plate and the second rib plate, the first edge is against the first heat sink, and the extension direction of the first edge is the same as the insertion direction.

[0009] In an optional technical solution, a roller is installed on the first edge.

[0010] In an optional technical solution, the first guide mechanism further includes a first reset component, the support frame includes a top wall, the first reset component is mounted on the top wall, and the first reset component is used to drive the first heat sink to move along the removal direction of the heat source device.

[0011] In an optional technical solution, the guide mechanism also includes a second guide mechanism, the second guide mechanism includes a second connecting member, the support frame includes a top wall and a first side wall and a second side wall arranged opposite to each other, the first side wall and the second side wall are respectively connected to the top wall, the second connecting member is installed between the first side wall and the second side wall, the radiator includes a second radiator, the second radiator is installed on the side of the second connecting member away from the top wall, and the second connecting member includes an elastic member, and the elastic member drives the second radiator to approach the heat source device.

[0012] In an optional technical solution, the second guide mechanism further includes a slide groove, which is arranged on the first side wall and the second side wall, and an extension direction of the slide groove forms an angle with the top wall, and the second heat sink has a bayonet, which is slidably mounted on the slide groove.

[0013] In an optional technical solution, the second connecting member includes a mounting plate and a shielding plate, and the shielding plate is perpendicular to the mounting plate and perpendicular to the insertion direction.

[0014] In an optional technical solution, the shielding plate has a first ventilation hole.

[0015] In an optional technical solution, the second guiding mechanism further includes a second resetting member, the second resetting member is installed on the second connecting member, and the second resetting member is used to drive the second heat sink to move along the removal direction of the heat source device.

[0016] In an optional technical solution, the second radiator includes a second radiator body, a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe is located on the side of the second radiator body facing the first side wall, and the liquid outlet pipe is located on the side of the second radiator body facing the second side wall.

[0017] In an optional technical solution, the first side wall is provided with a through hole for avoiding the liquid inlet pipe, and the second side wall is provided with a through hole for avoiding the liquid outlet pipe, and the length direction of the through hole is consistent with the insertion direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the assembly of a heat dissipation device and a heat source device in one embodiment of the present application;

[0019] Figure 2 An exploded diagram of a heat dissipation device and a heat source device in one embodiment of the present application;

[0020] Figure 3 A cross-sectional view of a heat dissipation device and a heat source device in a first position in an embodiment of the present application;

[0021] Figure 4 A cross-sectional view of a heat dissipation device and a heat source device in an embodiment of the present application when the heat dissipation device is in a second position;

[0022] Figure 5 This is a schematic structural diagram of a first connecting member and a first heat sink in one embodiment of the present application;

[0023] Figure 6 An exploded view of a heat dissipation device in another embodiment of the present application;

[0024] Figure 7A schematic diagram of a heat dissipation device and a heat source device in another embodiment of the present application when the heat dissipation device is in a first position;

[0025] Figure 8 A schematic diagram of a heat sink and a heat source device in another embodiment of the present application when the heat sink is in the second position;

[0026] Fig. 9 A cross-sectional view of a heat sink and a heat source device in another embodiment of the present application when the heat sink is in the second position;

[0027] Fig.10 An assembly diagram of a heat dissipation device and a heat source device in another embodiment of the present application;

[0028] Fig.11 An assembly diagram of a heat dissipation device and two heat source devices in one embodiment of the present application;

[0029] Fig.12 This is a schematic diagram of the assembly of a heat dissipation device and two heat source devices in one embodiment of the present application;

[0030] Fig.13 It is a schematic diagram of the assembly of a heat dissipation device and three heat source devices in one embodiment of the present application.

[0031] Reference numerals:

[0032] 100-heat source device; 1-support frame; 2-heat sink; 3-guide mechanism; M-insertion direction; N-extraction direction; 200-connector; 20-driving column; 30-first guide mechanism; 301-first connecting member; 21-first heat sink; 3011-connecting plate; 3012-pressing rib; 30121-first rib plate; 30122-second rib plate; 3013-first edge; 30123-protrusion; 302-convex hull; 303-groove; 211-first surface; 212-heat-conducting boss; 11-top wall; 213-second surface; 214-first fin; 3 05-fixed plate; 306-spring; 307-mounting column; 3031-first guide surface; 31-second guide mechanism; 310-second connecting member; 12-first side wall; 13-second side wall; 22-second radiator; 3101-elastic member; 311-slide groove; 221-pin; 3102-mounting plate; 3103-shielding plate; 31031-first ventilation hole; 312-second reset member; 313-third side wall; 314-fourth side wall; 220-second radiator body; 222-liquid inlet pipe; 2210-through hole; 15-second ventilation hole; 4-circuit board. DETAILED DESCRIPTION

[0033] In order to reduce the problem that the heat-conducting layer is easily worn during the plugging and unplugging process of the optical module, which affects the heat dissipation effect and thus affects the performance of the optical module. The embodiment of the present application provides a heat dissipation device. In order to make the purpose, technical solution and advantages of the present application clearer, the present application is further described in detail with reference to the accompanying drawings.

[0034] First, the application scenarios are introduced. With the large-scale construction of 5G communication networks and large-capacity data centers, the demand for communication bandwidth has also grown rapidly. As a medium for photoelectric signal conversion, optical modules have increasingly higher requirements for their transmission rate and transmission distance. Therefore, the power consumption of optical modules has risen sharply, and their thermal reliability has become a key issue affecting high-speed transmission. Traditional optical module heat dissipation mainly relies on heat sinks. The optical module is detachably set in the optical cage and is in contact with the heat sink. Due to direct contact, the contact surface of the optical module and the heat sink cannot be completely fitted, and the contact thermal resistance between the optical module and the heat sink will increase, resulting in poor heat dissipation. Therefore, thermal conductive material is added between the optical module and the heat sink to improve the fitting effect and thus reduce the contact thermal resistance. Since the optical module is plugged into the optical cage, during the plug-in process, the thermal conductive layer will be damaged due to collision or friction between the optical module and the heat sink, affecting the heat dissipation effect and thus affecting the reliability of the optical module.

[0035] In view of the above problems, an embodiment of the present application provides a heat dissipation device, which can solve the problem that the thermal conductive material is easily damaged when the optical module is plugged in and out of the optical cage.

[0036] Figure 1 FIG. 1 is a schematic diagram of the assembly of a heat sink and a heat source device in one embodiment of the present application. Figure 1 As shown, an embodiment of the present application provides a heat dissipation device for dissipating heat for at least one heat source device 100. The heat dissipation device includes a support frame 1, at least one heat sink 2 and at least one guide mechanism 3. The heat source device 100 is pluggable and connected to the support frame 1, and a heat conducting layer (not shown in the figure) is provided on the side of the heat sink 2 facing the heat source device 100. Among them, each guide mechanism 3 is connected to a heat sink 2, and is used to drive the heat sink 2 to approach or move away from the heat source device 100. The heat source device 100 slides from the first position to the second position along the insertion direction M in the support frame 1. When the heat source device 100 is in the first position, there is a gap between the heat conducting layer and the heat source device, and when the heat source device 100 is in the second position, the heat conducting layer contacts the heat source device 100. Specifically, the heat source device 100 drives the heat sink 2 to slide along the insertion direction M. At the same time, the guide mechanism 3 drives the heat sink 2 to approach the heat source device 100, and when the heat source device 100 is in the second position, the heat conducting layer contacts the heat source device 100. When the heat source device 100 slides from the second position to the first position in the support frame along the extraction direction N, the guide mechanism 3 drives the heat sink 2 away from the heat source device 100. The insertion direction M and the extraction direction N are opposite.

[0037] In the above embodiment, the heat source device 100 is an optical module, and the support frame 1 is an optical cage. A connector (not shown in the figure) is installed in the support frame 1, and the heat source device 100 is plugged and installed in the support frame 1, thereby realizing connection or disconnection with the connector 200. The above-mentioned first position and second position are two positions of the heat source device 100 inside the support frame, respectively. Among them, the first position is the initial position of the heat source device in the insertion process of 100. When the heat source device is in the first position, the heat source device 100 is not connected to the connector, that is, the heat source device 100 is not plugged in place, at this time, the heat conductive layer of the radiator 2 is not in contact with the heat source device 100. When the heat source device 100 is in the second position, the heat source device 100 is connected to the connector in the support frame 1, and the heat source device 100 is plugged in place, at this time, the heat conductive layer of the radiator 2 is in contact with the heat source device 100. During the process of the heat source device 100 sliding from the first position to the second position, that is, during the insertion of the heat source device 100, the guide mechanism 3 always applies pressure to the heat sink 2 toward the heat source device 100, so that it is close to the heat source device 100. When the heat source device 100 is located at the second position, the heat sink 2 descends under the action of the guide mechanism 3, so that the heat conduction layer contacts the heat source device 100. The heat dissipation device of the present application can prevent the heat source device from contacting the heat conduction layer of the heat sink during the plugging and unplugging process, thereby reducing the possibility of damage to the heat conduction layer.

[0038] The heat source device 100 may be one or more, all of which are pluggable and connected to the support frame 1. Each heat source device 100 is equipped with a heat sink 2 and a set of guide mechanisms 3. Each set of guide mechanisms 3 is independently arranged, and cooperates with the heat source device 100 and the heat sink 2 to complete the contactless plug-in operation.

[0039] In a specific embodiment, a driving column (not shown in the figure) is provided on the side of the heat sink 2 facing the heat source device 100. When the heat source device 100 slides from the first position to the second position, the heat source device 100 abuts against the driving column, driving the heat sink 2 to slide along the insertion direction M.

[0040] The guide mechanism 3 includes two different forms, and the guide mechanism 3 is described in detail below.

[0041] Figure 2 An exploded diagram of a thermal device and a heat source device in one embodiment of the present application is shown in FIG. Figure 3 is a cross-sectional view of a heat sink and a heat source device in a first position in an embodiment of the present application, Figure 4 This is a cross-sectional view of a heat sink and a heat source device in a second position in an embodiment of the present application. Figure 2 to Figure 4In one embodiment, the guide mechanism 3 includes a first guide mechanism 30, and the first guide mechanism 30 includes a first connector 301. The radiator 2 includes a first radiator 21, and the first radiator 21 is installed on the top of the support frame 1 and is located outside the support frame 1. The first connector 301 is fixedly installed on the top of the support frame 1. The first connector 301 includes two connecting plates 3011 and a clamping rib 3012, and the two ends of the clamping rib 3012 are respectively connected to the edges of the two connecting plates 3011, so that the cross-section of the first connector 301 perpendicular to the insertion direction M is "M"-shaped. The first radiator 21 is located between the first connector 301 and the support frame 1, and the clamping rib 3012 is located on the side of the first radiator 21 away from the heat source device 100. The clamping rib 3012 presses the first radiator 21 down to make it close to the heat source device 100. The pressing rib 3012 includes a first rib plate 30121 and a second rib plate 30122 connected to each other, the first rib plate 30121 and the second rib plate 30122 have an obtuse angle, and a first edge 3013 is formed at the connection between the first rib plate 30121 and the second rib plate 30122. The first edge 3013 abuts against the first heat sink 21, and the extension direction of the first edge 3013 is the same as the insertion direction M and the extraction direction N. When the first heat sink 21 moves along the insertion direction M or the extraction direction N, the first edge 3013 is in line contact with the first heat sink 21, so that the friction between the first heat sink 21 and the first connector 301 is small.

[0042] In order to reduce the friction between the first connecting member 301 and the first heat sink 21 , the first edge 3013 may also be provided with a roller (not shown in the figure) to enable the pressing rib 3012 to be connected to the first heat sink 21 by rolling.

[0043] Figure 5 FIG. 1 is a schematic diagram of the structure of the first connecting member and the first heat sink in one embodiment of the present application. Figure 5 As shown, in other embodiments, the clamping rib 3012 may also be in the shape of a flat plate, and a protrusion 30123 is provided on the side of the clamping rib 3012 facing the first heat sink 21, so that the first connector 301 is in point contact with the first heat sink 21, thereby reducing the friction force. Of course, other methods may be used to reduce the friction force between the clamping rib and the first heat sink, such as polishing, electroplating, etc. to process the clamping rib to reduce the roughness of the contact surface between the clamping rib and the first heat sink.

[0044] Please combine Figure 2 to Figure 4, the first guide mechanism 30 further includes a convex hump 302 and a groove 303. Specifically, the surface of the first heat sink 21 facing the heat source device 100 is a first surface 211, and a heat-conducting boss 212 is provided on the first surface 211. The area of ​​the heat-conducting boss 212 is smaller than that of the first surface 211, that is, the vertical projection of the heat-conducting boss 212 on the first surface 211 is completely located in the first surface 211. The heat-conducting boss 212 is located in the middle of the first surface 211. The heat-conducting layer is provided on the heat-conducting boss 212. The support frame 1 includes a top wall 11, and the top wall 11 is provided with a first opening 111. The convex hump 302 is located on the peripheral side of the first opening 111 and faces the first heat sink 21. The position of the first opening 111 corresponds to the position of the heat-conducting boss 212. When the heat source device 100 is located at the second position B, the heat-conducting boss 212 extends into the first opening 111 and contacts the heat source device 100. When the heat source device 100 slides from the first position A to the second position B, the first surface 211 of the first heat sink 21 contacts and slides relatively with the convex bump 302. The first surface 211 is provided with a groove 303. When the heat source device 100 is located at the second position B, the convex bump 302 is plugged into the groove 303. At this time, the first heat sink 21 descends under the pressure of the pressing rib 3012 and contacts the heat source device 100.

[0045] In one embodiment, the first heat sink 21 is an air-cooled heat sink, and the side of the first heat sink 21 away from the first surface 211 is the second surface 213, and the second surface 213 is provided with a plurality of first fins 214. Two adjacent groups of first fins 214 are spaced apart by a preset distance along the insertion or extraction direction. The clamping rib 3012 is located between two adjacent groups of first fins 214 and can slide along the insertion direction M or the extraction direction N.

[0046] It is worth noting that the first radiator 21 may also be a liquid cooling radiator, and the type of radiator may be selected according to actual needs.

[0047] In order to make the first heat sink 21 automatically move away from the heat source device 100 when the heat source device 100 is pulled out. The above-mentioned first guide mechanism 30 also includes a first reset component, which is used to drive the first heat sink 21 to move along the pull-out direction N of the heat source device 100. The first reset component is installed on the side of the top wall 11 facing the outside of the support frame 1. Specifically, the first reset component may include a fixing plate 305, a spring 306 and a mounting column 307. The fixing plate 305 is vertically installed on the top wall 11, the mounting column 307 is installed on the side of the fixing plate 305 facing the first heat sink 21, and one end of the spring 306 is sleeved on the mounting column 307. Correspondingly, a connecting column (not shown in the figure) is provided on the side of the first heat sink 21 facing the fixing plate 305, and the other end of the spring 306 is sleeved on the connecting column. When the first heat sink 21 slides along the insertion direction M, the spring 306 is compressed and has a preload force. When the heat source device 100 is pulled out, the first heat sink 21 is released and slides along the pulling-out direction N under the action of the rebound force of the spring 306 .

[0048] In order to make the convex bump 302 be able to be separated from the groove 303 more smoothly, the groove 303 has a first guide surface 3031, and the first guide surface 3031 has an obtuse angle with the first surface 211. The first guide surface 3031 is located on the side of the groove 303 close to the first reset component. When the first heat sink 21 moves along the extraction direction N, the convex bump 302 slides along the first guide surface 3031 and can slide out of the groove 303 more smoothly.

[0049] Figure 6 This is an exploded view of a heat dissipation device in another embodiment of the present application. Figure 7 This is a schematic diagram of a heat sink and a heat source device in another embodiment of the present application when the heat sink is in the first position. Figure 8 FIG. 1 is a schematic diagram of a heat sink and a heat source device in another embodiment of the present application when the heat sink is in the second position. Figure 6 to Figure 8 In another embodiment, the guide mechanism 3 further includes a second guide mechanism 31, and the second guide mechanism 31 includes a second connecting member 310. The support frame 1 includes a first side wall 12 and a second side wall 13 that are arranged opposite to each other, and the first side wall 12 and the second side wall 13 are respectively connected to the top wall 11, and the second connecting member 310 is installed between the first side wall 12 and the second side wall 13. The radiator 2 includes a second radiator 22, and the second radiator 22 is located in the support frame 1, and is specifically installed on the side of the second connecting member 310 away from the top wall 11. The second connecting member 310 includes an elastic member 3101, and the elastic member 3101 can specifically be a spring. The elastic member 3101 contacts the second radiator 22, and drives the second radiator 22 to approach the heat source device 100.

[0050] The second guide mechanism 31 further includes a slide groove 311, which is provided on the first side wall 12 and the second side wall 13, and the extension direction of the slide groove 311 forms an angle with the top wall 11. Specifically, the slide groove 311 may be a waist-shaped hole, which is inclined toward the heat source device 100 along the insertion direction M. The second heat sink 22 includes a bayonet 221, which is slidably mounted on the slide groove 311. In the process of the heat source device 100 sliding from the first position A to the second position B, the second heat sink 22 is driven to slide along the slide groove 311 and gradually approach the heat source device 100.

[0051] The second connector 310 includes a mounting plate 3102 and a shielding plate 3103. The shielding plate 3103 is perpendicular to the mounting plate 3102 and perpendicular to the insertion direction M. The mounting plate 3102 is located between the top wall 11 and the second heat sink 22 and is parallel to the top wall 11. Both ends of the shielding plate 3103 are in contact with the first side wall 12 and the second side wall 13, respectively, to achieve electromagnetic shielding of the optical module.

[0052] In one embodiment, the shielding plate 3103 has a first ventilation hole 31031. Specifically, the plane where the shielding plate 3103 is located is the windward surface of the second radiator 22. The second radiator 22 can be an air-cooled radiator including an outer frame 222 and a plurality of fins (not shown in the figure), the plurality of fins are located in the outer frame 222, and the extension direction of the fins is consistent with the insertion direction M. The first ventilation hole 31031 is opened on the shielding plate 3103, so that the wind outside the support frame 1 can be introduced into the support frame 1, and the wind flows through the flow channel formed between two adjacent fins through the first ventilation hole 31031, and the heat of the second radiator 22 is taken away, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0053] There may be a plurality of the first ventilation holes 31031 . When the shielding plate 3103 is specifically prepared, the shielding plate 3103 may be made into a mesh plate having a plurality of first ventilation holes 31031 to increase the air intake.

[0054] Fig. 9 This is a cross-sectional view of the heat sink and the heat source device in another embodiment of the present application when the heat sink is in the second position. Fig. 9, so that when the heat source device 100 is pulled out, the second heat sink 22 can automatically move away from the heat source device 100. The second guide mechanism 31 also includes a second reset member 312, which is installed on the second connecting member 310, and the second reset member 312 is used to drive the second heat sink 22 to move along the pull-out direction N. Specifically, the second reset member 312 is fixedly installed on the side of the mounting plate 3102 of the second connecting member 310 facing the second heat sink 22, and is located between the connector 200 and the second heat sink 22. The second reset member 312 can specifically be a spring. When the heat source device 100 is in the second position, the second heat sink 22 presses the second reset member 312. When the heat source device 100 is pulled out, the second heat sink 22 is released, and the second reset member 312 rebounds to move the second heat sink 22 along the pull-out direction N. Under the guidance of the slide groove 311, the second heat sink 22 moves away from the heat source device 100.

[0055] Continue to refer Figure 6 In one embodiment, the second connecting member 310 further includes a third side wall 313 and a fourth side wall 314 arranged opposite to each other, and the third side wall 313 and the fourth side wall 314 are respectively connected to the mounting plate 3102. The first side wall 12 is in contact with the third side wall 313, and the second side wall 13 is in contact with the fourth side wall 314. A slide groove 311 is respectively provided on the third side wall 313 and the fourth side wall 314, and the position of the slide groove 311 is the same as that of the slide groove 311 on the first side wall 12 and the second side wall 13. After the second connecting member 310 is installed on the support frame 1, the slide groove 311 on the first side wall 12 and the third side wall 313 overlap, and the slide groove 311 on the second side wall 13 and the fourth side wall 314 overlap. The second radiator 22 is installed between the third side wall 313 and the fourth side wall 314, and the bayonet 221 on each side of the second radiator 22 simultaneously passes through the slide grooves 311 of the two side walls and extends to the outside of the support frame 1.

[0056] Fig.10 FIG. 1 is an assembly diagram of a heat sink and a heat source device in another embodiment of the present application. Fig.10 As shown, in one embodiment, the second radiator 22 can also be a water-cooled radiator. Specifically, the second radiator 22 includes a second radiator body 220, a liquid inlet pipe 222 and a liquid outlet pipe (not shown in the figure), the liquid inlet pipe 222 is located on the side of the second radiator body 220 facing the first side wall 12, and the liquid outlet pipe is located on the side of the second radiator body 220 facing the second side wall 13. Alternatively, the liquid outlet pipe is located on the side of the second radiator body facing the first side wall, and the liquid inlet pipe is located on the side of the second radiator body facing the second side wall. The water inlet and outlet directions can be set as needed, and this application does not impose specific restrictions.

[0057] The first side wall 12 is provided with a through hole 2210 for avoiding the liquid inlet pipe 222, and the second side wall 13 is provided with a through hole 2210 for avoiding the liquid outlet pipe, and the through hole 2210 extends along the insertion direction M. Correspondingly, the third side wall 313 and the fourth side wall 314 are also provided with through holes 2210. The through holes 2210 of the first side wall 12 and the third side wall 313 overlap, and the through holes 2210 of the second side wall 13 and the fourth side wall 314 overlap. The through holes 2210 enable the liquid inlet pipe and the liquid outlet pipe of the second radiator 22 to be not restricted by the first side wall, the second side wall, the third side wall and the fourth side wall during the movement.

[0058] In an optional embodiment, the liquid inlet pipe and the liquid outlet pipe may also be arranged on the same side of the second radiator. In this case, through holes may be provided on the side walls of the support frame corresponding to the liquid inlet pipe and the liquid outlet pipe and the side walls of the second connecting member to avoid the liquid inlet pipe and the liquid outlet pipe.

[0059] In an optional embodiment, the first side wall 12 and the second side wall 13 are respectively provided with second ventilation holes 15, which is beneficial to improving the heat dissipation efficiency of the heat dissipation assembly.

[0060] like Figure 3 and Fig. 9 In the above embodiments, two types of guide mechanisms 3 are introduced respectively, and each type of guide mechanism 3 can be separately arranged on the support frame 1, wherein the first guide mechanism 30 is suitable for guiding the radiator 2 installed outside the support frame 1. The second guide mechanism 31 is suitable for guiding the radiator 2 installed inside the support frame 1.

[0061] Fig.11 This is an assembly diagram of a heat sink and two heat source devices in one embodiment of the present application, such as Fig.11 As shown, in other embodiments, the above two guide mechanisms 3 can also be installed simultaneously in a support frame 1 having multiple heat source devices 100. For example, the heat dissipation device dissipates heat for two heat source devices 100. The heat source device includes a first heat source device 101 and a second heat source device 102. The first guide mechanism 30 is used to drive the first radiator 21 to approach or move away from the first heat source device 101, and the second guide mechanism 31 is used to drive the second radiator 22 to approach or move away from the second heat source device 102. The second radiator 22 is located between the first heat source device 101 and the second heat source device 102, so that after the heat source device is installed on the heat dissipation device, the overall structure of the device is more compact.

[0062] Fig.12 FIG. 1 is a schematic diagram of an assembly of a heat sink and two heat source devices in one embodiment of the present application. Fig.12As shown, in another feasible embodiment, there are two heat source devices, including a first heat source device 101 and a second heat source device 102. The second heat dissipation device 22 is installed on the side of the second heat source device 102 away from the first heat source device 101. In other words, the two heat source devices are located between the two radiators. Among them, the second guide mechanism 31 is set in the opposite direction to the second guide mechanism 31 in the previous embodiment, so that the slide groove 311 is tilted upward along the insertion direction M, and the elastic member 3101 presses the second radiator 22 upward.

[0063] Fig.13 FIG. 1 is a schematic diagram of the assembly of a heat sink and three heat source devices in one embodiment of the present application. Fig.13 As shown, in other feasible embodiments, there may be three heat source devices 100, and a first guide mechanism 30 and a first heat sink 21, two second guide mechanisms 31 and two second heat sinks 22 are installed in the support frame 1. The heat sink 2 and the heat source device 100 are stacked and spaced apart.

[0064] Please continue to refer to Fig.11 , an embodiment of the present application further provides an electronic device, which includes a circuit board 4, at least one heat source device 100 and the above-mentioned heat dissipation device. Among them, the above-mentioned heat dissipation device includes a support frame 1, and the above-mentioned support frame 1 is installed on the circuit board 4. One end of the support frame 1 has a socket, and the above-mentioned heat source device 100 is inserted into the heat dissipation device through the socket. The heat dissipation device also includes a guide mechanism 3, which is used to drive the radiator 2 to approach or move away from the heat source device 100 to avoid damage caused by friction between the heat conductive layer on the radiator 2 and the heat source device 100. The above-mentioned radiator is an air-cooled radiator or a liquid-cooled radiator.

[0065] In the description of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0066] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A heat dissipation device for dissipating heat for at least one heat source device, characterized in that: It comprises a support frame, at least one heat sink, and at least one guide mechanism, each of which is connected to one of the heat sinks and is used to drive the heat sink to approach or move away from the heat source device, a heat conducting layer is provided on the side of the heat sink facing the heat source device, and the heat source device is pluggably connected to the support frame; The heat source device slides from a first position to a second position along an insertion direction in the support frame. When the heat source device is located at the first position, there is a gap between the heat conductive layer and the heat source device. When the heat source device is located at the second position, the heat conductive layer contacts the heat source device.

2. The heat dissipation device according to claim 1, characterized in that: A driving column is provided on a side of the heat sink facing the heat source device, and the heat source device abuts against the driving column.

3. The heat dissipation device according to claim 2, characterized in that: The guide mechanism includes a first guide mechanism, the first guide mechanism includes a first connecting member, a convex bulge and a groove, the first connecting member is installed on the top of the support frame, the radiator includes a first radiator, the first radiator is installed between the first connecting member and the support frame, the convex bulge is arranged on a side of the support frame facing the first radiator, the first radiator includes a first surface, the first surface faces the support frame, and the groove is arranged on the first surface; When the heat source device is located at the first position, the first surface abuts against the convex bump, and when the heat source device is located at the second position, the convex bump is plugged into the groove.

4. The heat dissipation device according to claim 3, characterized in that: The groove has a first guide surface to enable the convex bump to slide along the first guide surface, and the first guide surface and the first surface have an obtuse angle.

5. The heat dissipation device according to claim 3, characterized in that: The first connecting member includes a clamping rib, which is located on the side of the first heat sink away from the heat source device. The clamping rib includes a first rib plate and a second rib plate connected to each other. The first rib plate and the second rib plate have an obtuse angle. A first edge is formed at the connection between the first rib plate and the second rib plate. The first edge is against the first heat sink, and the extension direction of the first edge is the same as the insertion direction.

6. The heat dissipation device according to claim 5, characterized in that: The first edge is equipped with a roller.

7. The heat dissipation device according to any one of claims 3 to 6, characterized in that: The first guide mechanism further includes a first reset component, the support frame includes a top wall, the first reset component is mounted on the top wall, and the first reset component is used to drive the first heat sink to move along the removal direction of the heat source device.

8. The heat dissipation device according to claim 2, characterized in that: The guide mechanism also includes a second guide mechanism, the second guide mechanism includes a second connecting member, the support frame includes a top wall and a first side wall and a second side wall arranged opposite to each other, the first side wall and the second side wall are respectively connected to the top wall, the second connecting member is installed between the first side wall and the second side wall, the radiator includes a second radiator, the second radiator is installed on the side of the second connecting member away from the top wall, and the second connecting member includes an elastic member, and the elastic member is used to drive the second radiator to approach the heat source device.

9. The heat dissipation device according to claim 8, characterized in that: The second guide mechanism further includes a slide groove, which is arranged on the first side wall and the second side wall. The extension direction of the slide groove forms an angle with the top wall. The second heat sink has a bayonet, which is slidably mounted on the slide groove.

10. The heat dissipation device according to claim 8, characterized in that: The second connecting member includes a mounting plate and a shielding plate, wherein the shielding plate is perpendicular to the mounting plate and perpendicular to the insertion direction.

11. The heat dissipation device according to claim 10, characterized in that: The shielding plate has a first ventilation hole.

12. The heat dissipation device according to any one of claims 8 to 11, characterized in that: The second guiding mechanism further includes a second resetting member, which is mounted on the second connecting member and is used to drive the second heat sink to move along the removal direction of the heat source device.

13. The heat dissipation device according to any one of claims 8 to 11, characterized in that: The second radiator includes a second radiator body, a liquid inlet pipe and a liquid outlet pipe. The liquid inlet pipe is located on a side of the second radiator body facing the first side wall, and the liquid outlet pipe is located on a side of the second radiator body facing the second side wall.

14. The heat dissipation device according to claim 13, characterized in that: The first side wall is provided with a through hole for avoiding the liquid inlet pipe, and the second side wall is provided with a through hole for avoiding the liquid outlet pipe, and the length direction of the through hole is consistent with the insertion direction.

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