Glue coating and developing apparatus and control method thereof

Abstract

The application provides a gluing and developing device and a control method thereof. The gluing and developing device comprises a wafer cassette module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer arranged in sequence along a horizontal direction. The first interlayer process module comprises a tackifying process unit for tackifying a wafer. The first process module comprises N layers of partitions stacked from bottom to top, for separating N+1 gluing process layers in the first process module, wherein N is a positive integer. At least one of the partitions is provided with a vertical through-layer unit for conveying the wafer between different gluing process layers. The vertical through-layer unit comprises a fixed part and a movable part. The fixed part is fixed relative to the partition. The movable part is movably connected to the fixed part. When the movable part is in contact with the wafer, the movable part drives the wafer to pass through at least one of the partitions. The device is used to reduce the occupancy time of conveying the wafer, so as to improve the production capacity.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a glue coating and developing device and a control method thereof. Background Art

[0002] In the current semiconductor photolithography process, the resist coating, photolithography, and development equipment complete the photoresist coating, photolithography, and development processes, respectively. With advancements in semiconductor processing technology, the market is mainstreaming the integration of the resist coating and development processes onto the same equipment. This requires the production capacity of the resist coating and development equipment to be greater than that of the photolithography equipment. The production capacity of the resist coating and development equipment is determined by the bottleneck capacity of the process unit and the robot.

[0003] In the existing technology, wafers need to pass through different process layers of the coating and developing equipment in sequence to complete the coating process. Each time the process layer is changed, the first through-wall unit is required to load the wafer and pass it from the first process layer to the interlayer process module. The interlayer robot transfers the wafer to the second through-wall unit, and the second through-wall unit loads the wafer and passes it from the interlayer process module to the second process layer. The workload of the interlayer robot to transfer the wafer is large, and the wafer transfer time is long, which is not conducive to improving production capacity. Therefore, there is an urgent need for a new type of coating and developing equipment and its control method to improve the above problems. Summary of the Invention

[0004] The object of the present invention is to provide a glue coating and developing device and a control method thereof, which is used to reduce the time occupied by transferring wafers to improve production capacity.

[0005] In the first aspect, the present invention provides a glue coating and developing device, comprising a film box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer arranged in sequence along the horizontal direction; the first interlayer process module comprises a viscosity-enhancing process unit for performing viscosity-enhancing treatment on the wafer; N layers of partitions are stacked in sequence from bottom to top in the first process module, which are used to separate N+1 glue coating process layers in the first process module, where N is a positive integer; at least one layer of the partition is provided with a vertical cross-layer unit, which is used to transfer wafers between different glue coating process layers; the vertical cross-layer unit is provided with a fixed part and a movable part; the fixed part is relatively fixed to the partition; the movable part is movably connected to the fixed part; when the movable part contacts the wafer, it is used to drive the wafer through at least one layer of the partition.

[0006] The method has the beneficial effects that: the vertical through-layer unit is arranged in the at least one partition plate, so that the wafer can be transmitted between different glue coating process layers; the fixed part is fixedly connected with the partition plate; the movable part is movably connected with the fixed part; when the movable part is in contact with the wafer, the movable part drives the wafer to pass through the at least one partition plate, so that the wafer can directly pass through the partition plate without passing through the interlayer process module, thereby reducing the working load of the interlayer robot, reducing the wafer transmission occupation time, and improving the production capacity.

[0007] Optionally, the contact surface of the movable part and the wafer is horizontally arranged; when the movable part drives the wafer to pass through the partition plate, the wafer moves in the vertical direction.

[0008] Optionally, the first process module includes a first glue coating process layer, a second glue coating process layer and a third glue coating process layer; the first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer all include a heat treatment unit; the heat treatment unit is used for baking the wafer when the heat treatment unit is in the working state.

[0009] Optionally, the first interlayer process module includes a first interlayer robot; the first interlayer robot is used for sending the wafer in the wafer box module into the tackifying process unit, or sending the wafer in the tackifying process unit into the first glue coating process layer; the number of the tackifying process units is at least M, and M is an integer greater than 1.

[0010] Optionally, the second process module is arranged between the first interlayer process module and the second interlayer process module; the second process module is arranged in double full-duplex symmetry with the first process module.

[0011] Optionally, a first through-wall cooling unit is arranged between the first process module and the first interlayer process module; a second through-wall cooling unit and a first through-wall robot are arranged between the second interlayer process module and the cleaning process layer; the first through-wall cooling unit is arranged between the first interlayer process module and the first glue coating process layer; the second through-wall cooling unit and the first through-wall robot are arranged between the second interlayer process module and the cleaning process layer; the first through-wall cooling unit and the second through-wall cooling unit both include a first through-wall part and a cooling part; the first end of the first through-wall part is fixed, and the second end of the first through-wall part is movable relative to the first end and is used for transmitting the wafer; the cooling part is used for refrigeration and is in contact with the surface of the wafer to cool the wafer.

[0012] Optionally, a wall-penetrating optical detection unit is further included, the wall-penetrating optical detection unit comprising a second wall-penetrating part, a light source and a camera; the first end of the second wall-penetrating part is fixed, and the second end of the second wall-penetrating part is movable relative to the first end for transmitting the wafer; the light source is used for projecting light onto the wafer surface, and the camera is used for receiving the light reflected by the wafer surface; the wall-penetrating optical detection unit is arranged between the third glue coating process layer and the first interlayer process module, and is used for transmitting the wafer in the third glue coating process layer to the first interlayer process module while performing optical detection on the wafer.

[0013] Optionally, a wall-penetrating edge exposure unit and a second wall-penetrating mechanical hand are further included; the wall-penetrating edge exposure unit comprises a third wall-penetrating part and an exposure part; the first end of the third wall-penetrating part is fixed, and the second end of the third wall-penetrating part is movable relative to the first end for transmitting the wafer; the exposure part covers the edge of the wafer for process exposure of the wafer edge; the wall-penetrating edge exposure unit is arranged between the second glue coating process layer and the second interlayer process module, and is used for transmitting the wafer in the second glue coating process layer to the second interlayer process module while performing edge exposure treatment on the wafer; the second wall-penetrating mechanical hand is used for transmitting the wafer in the second interlayer process module to the cleaning process layer.

[0014] Optionally, the cassette module is provided with a cassette mechanical hand for loading and transmitting a wafer transfer box, and the wafer transfer box is used for loading the wafer; the first interlayer process module is provided with a first interlayer mechanical hand for transmitting the wafer in the first interlayer process module; the second interlayer process module is provided with a second interlayer mechanical hand for transmitting the wafer in the second interlayer process module; the first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer are all provided with an intra-layer mechanical hand for transmitting the wafer in the layer to perform process treatment on the wafer.

[0015] In the second aspect, the present invention provides a control method for a glue coating and developing device, comprising: S1, controlling a film box robot to place a film box taken out from a film box cache position onto a film box loading unit, and the film box loading unit opens a first wafer transfer box; controlling a wafer robot to transfer the wafer in the first wafer transfer box into a wafer placement position of a first interlayer process module; S2, controlling the first interlayer robot to first place the wafer into a tackifying process unit, and then taking the wafer out of the tackifying process unit and placing it into a first through-the-wall cooling unit; after loading the wafer into the first through-the-wall cooling unit, transferring the wafer into the first glue coating process layer, and the intra-layer robot in the first glue coating process layer carries the wafer for the first processing and then places it into a vertical through-layer unit, and the vertical through-layer unit sends the wafer in the first glue coating process layer into the second glue coating process layer; S3, controlling the intra-layer robot in the second glue coating process layer to carry After the wafer is processed for the second time, it is placed in the through-wall edge exposure unit, and the through-wall edge exposure unit transfers the wafer to the second interlayer process module; S4, controls the second interlayer robot to first carry the wafer for back side cleaning, and then transfers the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine completes the process, the wafer is transferred to the interface robot area; the interface robot places the wafer on the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer on the first through-wall robot; S5, the first through-wall robot transfers the wafer to the cleaning process layer, the in-layer robot in the cleaning process layer carries the wafer for front side cleaning, and places the wafer on the second through-wall cooling unit; the second through-wall cooling unit transfers the wafer back to the second interlayer process module.

[0016] Optionally, after the second through-wall cooling unit brings the wafer back to the second interlayer process module, it also includes: S6, controlling the second interlayer robot to place the wafer on the second through-wall cooling unit into the second through-wall robot, and the second through-wall robot transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for a third processing and then places it into the through-wall optical detection unit, and the through-wall optical detection unit transfers the wafer to the first interlayer process module; S7, controlling the first interlayer robot to place the wafer to the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the wafer box module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic side cross-sectional structural diagram of a glue coating and developing device provided by the present invention;

[0018] Figure 2 A schematic top-view cross-sectional structural diagram of a glue coating and developing device provided by the present invention;

[0019] Figure 3 A schematic diagram of a vertical through-layer unit according to the present application;

[0020] Figure 4 A schematic diagram of a first through-wall cooling unit according to the present application;

[0021] Figure 5 A schematic diagram of a through-wall optical detection unit according to the present application;

[0022] Figure 6 A schematic diagram of a through-wall edge exposure unit according to the present application;

[0023] Figure 7 A flowchart of a control method of a gluing and developing device according to the present application.

[0024] Reference numerals in the drawings:

[0025] 1, a cassette module; 11, a cassette robot; 12, a wafer robot; 13, a cassette loading unit; 14, a wafer transfer cassette; 15, a buffer site; 16, a crane site; 17, a manual site; 2, a first interlayer process module; 21, a tackifying process unit; 22, a first interlayer robot; 301, a first gluing process layer; 302, a second gluing process layer; 303, a third gluing process layer; 31, a first process module; 32, a second process module; 331, a first intra-layer robot; 333, a third intra-layer robot; 341, a liquid treatment unit; 342, a heat treatment unit; 351, a first partition; 352, a second partition; 4, a second interlayer process module; 41, a back washing process unit; 42, a second interlayer robot; 45, an interface module; 5, a cleaning process layer; 51, a front washing process unit; 52, a cleaning robot; 53, an interface robot; 6, a through-wall edge exposure unit; 601, an exposure part; 602, a third through-wall part; 7, a through-wall optical detection unit; 701, a camera; 702, a light source; 703, a second through-wall part; 801, a cooling part; 802, a first through-wall part; 81, a first through-wall cooling unit; 82, a second through-wall cooling unit; 83, a vertical through-layer unit; 831, a fixed part; 832, a movable part; 833, a connecting piece; 834, a robot finger; 835, a suction cup; 836, a sliding component; 91, a first through-wall robot; 92, a second through-wall robot. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0027] In view of the problems existing in the existing technology, such as Figure 1 and Figure 2 As shown, the present invention provides a glue coating and developing device, including a film box module 1, a first interlayer process module 2, a first process module 31, a second interlayer process module 4 and a cleaning process layer 5 arranged in sequence along a horizontally set first direction; the first interlayer process module 2 includes a bonding process unit 21 for performing bonding treatment on the wafer; the first process module 31 is stacked with a first partition 351 and a second partition 352 from bottom to top, which are used to separate the first glue coating process layer 301, the second glue coating process layer 302 and the third glue coating process layer 303 in the first process module 31.

[0028] Specifically, a vertical layer-crossing unit 83 is provided in the first partition 351, which is used to transfer wafers between the first glue coating process layer 301 and the second glue coating process layer 302; the vertical layer-crossing unit 83 is provided with a fixed part 831 and a movable part 832; the fixed part 831 is relatively fixed to the partition; the movable part 832 is movably connected to the fixed part 831; when the movable part 832 contacts the wafer, it is used to drive the wafer to pass through the first partition 351.

[0029] In some embodiments, the first interlayer process module 2 includes a first interlayer robot 22; the first interlayer robot 22 is used to transfer wafers from the cassette module 1 to the adhesion process unit 21, or to transfer wafers from the adhesion process unit 21 to the first glue coating process layer 301; the number of the adhesion process units 21 is 2. In other embodiments, the number of the adhesion process units 21 is greater than M, where M is an integer greater than 2. By providing a vertical through-layer unit 83, this embodiment can eliminate the need for a through-wall robot for transferring wafers from the first glue coating process layer 301 to the first interlayer process module 2 and a through-wall robot for transferring wafers from the first interlayer process module 2 to the second glue coating process layer 302. Furthermore, this embodiment allows wafers to pass directly through the first partition 351 without the involvement of the first interlayer robot 22, which helps reduce the workload of the first interlayer robot 22, shortens the time it takes to transfer wafers, and improves production capacity.

[0030] In some embodiments, a first through-the-wall cooling unit 81 is provided between the first process module 31 and the first interlayer process module 2; a second through-the-wall cooling unit 82 and a first through-the-wall robot 91 are provided between the second interlayer process module 4 and the cleaning process layer 5; the first through-the-wall cooling unit 81 is provided between the first interlayer process module 2 and the first glue coating process layer 301; the second through-the-wall cooling unit 82 and the first through-the-wall robot 91 are both provided between the second interlayer process module 4 and the cleaning process layer 5.

[0031] In other specific embodiments, the wafer box module 1 is provided with a wafer box robot 11 for loading and transporting a wafer transfer box 14, and the wafer transfer box 14 is used to load wafers; the second interlayer process module 4 is provided with a second interlayer robot 42 for transporting wafers within the second interlayer process module 4; the first gluing process layer 301, the second gluing process layer 302, the third gluing process layer 303 and the cleaning process layer 5 are all provided with intra-layer robots for transporting wafers within the layer so that the wafers can undergo process processing.

[0032] like Figure 3 As shown, in some embodiments, the contact surface between the movable portion 832 and the wafer is horizontally arranged; when the movable portion 832 drives the wafer to pass through the first partition 351, the wafer moves in a vertical direction.

[0033] More specifically, the movable part 832 comprises a connecting piece 833, a finger, a suction cup 835 and a sliding part 836; the fixed part 831 is arranged as a sliding rail, and the sliding part 836 is in sliding connection with the sliding rail. The connecting piece 833 is connected with the sliding part 836; the connecting piece 833 is connected with a mechanical finger 834, and the surface of the mechanical finger 834 is provided with the suction cup 835, which is used for adsorbing the wafer when the suction cup 835 is in contact with the wafer. For example, the upper and lower ends of the connecting piece 833 are both provided with the mechanical finger 834, and adjacent mechanical fingers 834 are arranged in parallel, and each mechanical finger 834 is connected with three suction cups 835.

[0034] In some other embodiments, the first glue coating process layer 301, the second glue coating process layer 302 and the third glue coating process layer 303 each comprise a liquid treatment unit 341 for performing glue coating treatment on the wafer surface; the cleaning process layer 5 comprises a front cleaning process unit 51 for performing front cleaning treatment on the wafer; and the second interlayer process module 4 comprises a back cleaning process unit 41 for performing back cleaning treatment on the wafer.

[0035] It is worth noting that the cassette module 1 is also provided with a buffer position 15, a crane position 16 and a manual position 17; the crane position 16 is used for loading the wafer transport cassette 14 taken from the crane; the manual position 17 is used for loading the wafer transport cassette 14 carried by manpower; and the cassette mechanical hand 11 is used for taking the wafer transport cassette 14 from the crane position 16 or the manual position 17. The buffer position 15 is arranged between the wafer mechanical hand 12 and the cassette loading unit 13, and is used for buffering the wafer transport cassette 14.

[0036] Please refer to Figure 1 and Figure 2 In some embodiments, the first glue coating process layer 301, the second glue coating process layer 302, the third glue coating process layer 303 and the cleaning process layer 5 each comprise a heat treatment unit 342, which is used for baking the wafer when in working state.

[0037] Please refer to Figure 2 In some embodiments, a second process module 32 is further included, which is arranged between the first interlayer process module 2 and the second interlayer process module 4, and is arranged in duplex symmetry with the first process module 31. In this embodiment, the first process module 31 and the second process module 32 are arranged in duplex symmetry, so that each glue coating process layer is arranged symmetrically, which facilitates the third layer mechanical hand 333 to simultaneously take or place wafers in the first process module 31 and the second process module 32, and keeps the wafers in the first process module 31 and the second process module 32 synchronized for process treatment, which is beneficial to simplify the operation and improve the production capacity.

[0038] Please refer to Figure 1 and Figure 2 Specifically, the third-layer robot is arranged in the first process module 31, and the third-layer robot 333 is used to simultaneously transfer the wafers located in the third coating process layer 303 in the first process module 31 and the wafers located in the third coating process layer 303 in the second process module 32.

[0039] It is worth noting that the second interlayer process module 4 and the cleaning process layer 5 together form an interface module 45, which is used to interface with the exposure machine. Specifically, the second interlayer robot 42 is used to transport wafers into the backwash process unit 41. The interface module 45 is equipped with an interface robot for transporting wafers after backwashing into the exposure machine for exposure. The interface robot is also used to place wafers after exposure in the wafer placement position of the second interlayer process module 4.

[0040] Specifically, the interface module 45 is further provided with an interface robot 53 , which is used to carry the wafer through the refrigeration unit and then transfer it to the exposure machine. The interface robot 53 is also used to place the wafer at the wafer placement position of the second interlayer process module 4 .

[0041] like Figure 4 As shown, the first through-wall cooling unit 81 and the second through-wall cooling unit 82 each include a first through-wall portion 802 and a cooling portion 801. The first through-wall portion 802 has a fixed first end, and a second end that is movable relative to the first end, for transporting wafers. The cooling portion 801 is configured to cool the wafers and contact the wafer surface to cool them. The adhesion process unit 21 is configured to apply adhesion promoter to the wafer surface and simultaneously heat the wafer coated with the adhesion promoter.

[0042] Please refer to Figure 1 Specifically, a first-layer robot 331 is provided in the first gluing process layer 301; a second-layer robot is provided in the second gluing process layer 302; a third-layer robot 333 is provided in the third gluing process layer 303; and a cleaning robot 52 is provided in the cleaning process layer 5. Exemplarily, the third-layer robot 333 is located between the third gluing process layer 303 of the first process module 31 and the third gluing process layer 303 of the second process module 32. In other examples, both the first process module 31 and the second process module 32 have N process layers, where N is any positive integer, and the Nth-layer robot is located between the Nth process layer of the first process module 31 and the Nth process layer of the second process module 32.

[0043] It is worth mentioning that the first wall-through cooling unit 81, the second wall-through cooling unit 82, the first wall-through part 802 and the vertical wall-through part 83 can all be provided with different cooling parts 801 at the same time to meet the cooling needs of wafers at different positions, avoid the separate transmission of wafers for cooling, and be beneficial to improving the production efficiency.

[0044] As shown in Figure 5 Specifically, the wall-through optical detection unit 7 is arranged between the third glue coating process layer 303 and the first interlayer process module 2, used for transmitting the wafer in the third glue coating process layer 303 to the first interlayer process module 2, and simultaneously performing optical detection on the wafer.

[0045] Specifically, the wall-through optical detection unit 7 is arranged between the third glue coating process layer 303 and the first interlayer process module 2, used for transmitting the wafer in the third glue coating process layer 303 to the first interlayer process module 2, and simultaneously performing optical detection on the wafer.

[0046] As shown in Figure 6 In some embodiments, the wall-through edge exposure unit 6 and the second wall-through mechanical hand 92 are further included. The wall-through edge exposure unit 6 includes a third wall-through part 602 and an exposure part 601. The first end of the third wall-through part 602 is fixed, and the second end of the third wall-through part 602 is movable relative to the first end, used for transmitting the wafer. The exposure part 601 covers the edge of the wafer, used for process exposure of the edge of the wafer. The wall-through edge exposure unit 6 is arranged between the second glue coating process layer 302 and the second interlayer process module 4, used for transmitting the wafer in the second glue coating process layer 302 to the second interlayer process module 4, and simultaneously performing edge exposure treatment on the wafer. The second wall-through mechanical hand 92 is used for transmitting the wafer in the second interlayer process module 4 to the cleaning process layer 5.

[0047] Specifically, the wall-through edge exposure unit 6 is arranged between the second glue coating process layer 302 and the second interlayer process module 4, used for transmitting the wafer in the second glue coating process layer 302 to the second interlayer process module 4, and simultaneously performing edge exposure treatment on the wafer. A third wall-through mechanical hand is further arranged between the second glue coating process layer 302 and the first interlayer process module 2, used for transmitting the wafer in the first interlayer process module 2 to the second glue coating process layer 302.

[0048] like Figure 7 As shown, this embodiment provides a control method for a glue coating and developing device, including: S1, controlling the film box robot to place the film box taken out from the film box cache position to the film box loading unit, and the film box loading unit opens the first wafer conveying box; controlling the wafer robot to transfer the wafer in the first wafer conveying box to the wafer placement position of the first inter-layer process module; S2, controlling the first inter-layer robot to first place the wafer in the adhesion process unit, and then taking out the wafer from the adhesion process unit and placing it in the first through-wall cooling unit; after the first through-wall cooling unit loads the wafer, it transfers the wafer to the first glue coating process layer, and the intra-layer robot in the first glue coating process layer carries the wafer for the first processing and then places it into the vertical through-layer unit, and the vertical through-layer unit sends the wafer in the first glue coating process layer to the second glue coating process layer; S3, controlling the intra-layer robot in the second glue coating process layer to carry After the wafer undergoes the second processing, it is placed in the through-wall edge exposure unit, and the through-wall edge exposure unit transfers the wafer to the second interlayer process module; S4, controls the second interlayer robot to first carry the wafer for back side cleaning, and then transfers the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine completes the process, the wafer is transferred to the interface robot area; the interface robot places the wafer in the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer on the first through-wall robot; S5, the first through-wall robot transfers the wafer to the cleaning process layer, the in-layer robot in the cleaning process layer carries the wafer for front side cleaning, and places the wafer on the second through-wall cooling unit; the second through-wall cooling unit transfers the wafer back to the second interlayer process module.

[0049] Specifically, after the second through-the-wall cooling unit brings the wafer back to the second interlayer process module, the process further includes: S6, controlling the second interlayer robot to place the wafer on the second through-the-wall cooling unit into the second through-the-wall robot, which transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for a third processing and then places it into the through-the-wall optical inspection unit, which transfers the wafer to the first interlayer process module. It is worth noting that the first processing, the second processing, and the third processing all include heat treatment and liquid treatment of the wafer.

[0050] In other specific embodiments, after the through-wall optical inspection unit transfers the wafer to the first interlayer process module, it also includes: S7, controlling the first interlayer robot to place the wafer to the wafer placement position, and controlling the wafer robot to transfer the wafer on the wafer placement position to the second wafer transfer box in the wafer box module.

[0051] While the embodiments of the application have been illustrated and described in detail, it will be readily apparent to those skilled in the art that various modifications and changes can be made to the embodiments without departing from the scope and spirit of the application, as described in the claims. Moreover, the application described is not limited in its application to the details set forth in the description or illustrated in the drawings. The application is capable of other embodiments and of being practiced or carried out in various ways.

Claims

1. A coating and developing device, characterized in that: It includes a film box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer which are arranged in sequence along the horizontal direction; The first interlayer process module includes an adhesion process unit for performing adhesion treatment on the wafer; The first process module is provided with N layers of partitions stacked sequentially from bottom to top, for separating and forming N+1 glue coating process layers in the first process module, where N is a positive integer; At least one of the partitions is provided with a vertical layer-crossing unit for transferring wafers between different glue coating process layers; The vertical layer-penetrating unit is provided with a fixed part and a movable part; the fixed part is relatively fixed to the partition; the movable part is movably connected to the fixed part; when the movable part contacts the wafer, it is used to drive the wafer to pass through at least one layer of the partition.

2. The device according to claim 1, characterized in that The contact surface between the movable portion and the wafer is arranged horizontally; when the movable portion drives the wafer to pass through the partition, the wafer moves in a vertical direction.

3. The device according to claim 1 or 2, characterized in that The first process module includes a first glue coating process layer, a second glue coating process layer, and a third glue coating process layer. The first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer all include a heat treatment unit, and the heat treatment unit is used to bake the wafer when it is in working state.

4. The device according to claim 3, characterized in that The first interlayer process module includes a first interlayer robot; the first interlayer robot is used to send the wafers from the cassette module into the adhesion process unit, or to send the wafers in the adhesion process unit into the first glue coating process layer; the number of the adhesion process units is at least M, and M is an integer greater than 1.

5. The device according to claim 1, characterized in that The invention also includes a second process module, which is arranged between the first inter-layer process module and the second inter-layer process module, and the second process module and the first process module are arranged in duplex symmetry.

6. The device according to claim 1, characterized in that A first through-the-wall cooling unit is provided between the first process module and the first interlayer process module; a second through-the-wall cooling unit and a first through-the-wall manipulator are provided between the second interlayer process module and the cleaning process layer; The first through-wall cooling unit is arranged between the first interlayer process module and the first gluing process layer; the second through-wall cooling unit and the first through-wall manipulator are both arranged between the second interlayer process module and the cleaning process layer; The first through-wall cooling unit and the second through-wall cooling unit both include a first through-wall portion and a cooling portion; the first end of the first through-wall portion is fixed, and the second end of the first through-wall portion is movable relative to the first end for transferring wafers; the cooling portion is used for cooling and contacts the surface of the wafer to cool the wafer.

7. The device according to claim 3, characterized in that The device further includes a through-wall optical detection unit, the through-wall optical detection unit including a second through-wall portion, a light source, and a camera; the first end of the second through-wall portion is fixed, and the second end of the second through-wall portion is movable relative to the first end, for transmitting the wafer; the light source is used to project light onto the surface of the wafer, and the camera is used to receive light reflected by the surface of the wafer; The through-wall optical inspection unit is arranged between the third glue coating process layer and the first interlayer process module, and is used to transfer the wafers in the third glue coating process layer to the first interlayer process module and perform optical inspection on the wafers at the same time.

8. The device according to claim 3, characterized in that The device also includes a through-wall edge exposure unit and a second through-wall robot; the through-wall edge exposure unit includes a third through-wall portion and an exposure portion; the first end of the third through-wall portion is fixed, and the second end of the third through-wall portion is movable relative to the first end for transferring the wafer; the exposure portion covers the edge of the wafer for exposing the edge of the wafer to process; The through-wall edge exposure unit is provided between the second glue coating process layer and the second interlayer process module, and is used to transfer the wafer in the second glue coating process layer to the second interlayer process module and perform exposure processing on the edge of the wafer at the same time; The second through-wall robot is used to transfer the wafers in the second interlayer process module to the cleaning process layer.

9. The device according to claim 3, characterized in that The cassette module is provided with a cassette robot for loading and transporting a wafer transport cassette, and the wafer transport cassette is used to load wafers; A first interlayer robot is provided in the first interlayer process module for transferring wafers in the first interlayer process module; A second interlayer robot is provided in the second interlayer process module for transferring wafers in the second interlayer process module; Intra-layer robots are provided in the first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer for transferring wafers within the layer so that the wafers can undergo process treatment.

10. A control method for a coating and developing device, characterized in that: include: S1, control the cassette robot to take the cassette from the cassette buffer and place it on the cassette loading unit, and the cassette loading unit opens the first wafer cassette; Controlling the wafer robot to transfer the wafer in the first wafer transfer box to the wafer placement position of the first interlayer process module; S2, controlling the first inter-layer robot to first place the wafer into the adhesion process unit, then taking the wafer out of the adhesion process unit and placing it into the first through-wall cooling unit; after loading the wafer into the first through-wall cooling unit, the wafer is transferred to the first glue coating process layer; the intra-layer robot in the first glue coating process layer carries the wafer for the first processing and then places it into the vertical through-layer unit; the vertical through-layer unit transfers the wafer in the first glue coating process layer into the second glue coating process layer; S3, controlling the intra-layer robot in the second coating process layer to carry the wafer to a through-wall edge exposure unit for a second processing, and then transferring the wafer to the second inter-layer process module; S4: Control the second interlayer robot to carry the wafer for backside cleaning, then transfer the wafer to the interface robot area. The interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine. After the wafer in the exposure machine completes the process, the wafer is transferred to the interface robot area; the interface robot places the wafer on the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer on the first through-wall robot; S5, the first through-the-wall robot transfers the wafer to the cleaning process layer, the intra-layer robot in the cleaning process layer carries the wafer for front cleaning, and places the wafer into the second through-the-wall cooling unit; the second through-the-wall cooling unit transfers the wafer back to the second inter-layer process module.

11. The method according to claim 10, characterized in that After the second through-wall cooling unit brings the wafer back to the second interlayer process module, the method further includes: S6, controlling the second interlayer robot to place the wafer on the second through-wall cooling unit into the second through-wall robot, which then transfers the wafer to the third glue coating layer; the intra-layer robot in the third glue coating layer carries the wafer for a third processing and then places it into the through-wall optical inspection unit, which then transfers the wafer to the first interlayer process module; S7, controlling the first interlayer robot to place the wafer at the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the cassette module.

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