Ultrahigh-frequency radio frequency card based on compensation structure and manufacturing method
By setting a metal oxide coating film as the signal reflection layer in the compensation medium layer of the ultra-high frequency RF card, the problem of signal difference between the front and back sides of the RF card in high-speed motion scenarios is solved, and the stable reading effect of the RF card in complex media scenarios is achieved.
Patent Information
- Application Number
- CN202411697358.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-02-28
AI Technical Summary
In the high-speed motion scenarios, the gains of the front and back reading signals on the front and back sides are relatively different, resulting in unstable reading effects in complex media scenarios, especially in the high-speed motion scenarios, where RF card data cannot be read.
The ultra-high frequency radio frequency card design based on the compensation structure is adopted. By setting a coating film containing metal oxide in the compensation dielectric layer of the radio frequency card, it is used as a signal reflective layer to reflect part of the signal back to the direction of the reader, thereby enhancing the uniformity and intensity of the radio frequency signal inside the label.
It effectively reduces the signal gain difference between the front and back sides of the RF card, ensuring that both sides of the ultra-high frequency RF card can be read quickly and accurately in any scenario, especially in high-speed motion state, which improves the reading success rate of the RF card.
Smart Images
Figure CN119538962A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of radio frequency card manufacturing, in particular to an ultra-high frequency radio frequency card based on a compensation structure and a manufacturing method thereof. Background Art
[0002] In the existing RF (300K-300G) technology field, ultra-high frequency technology (860~960MHz) is widely used in the fields of Internet of Things, Internet of Vehicles, supermarkets, libraries, warehousing, etc. to realize the functions of item-side identity recognition, etc., due to its advantages such as long reading distance (passive RF distance can reach more than 10 meters), high data transmission rate, large number of tags can be read in a short time, large data storage capacity, and lower cost compared with other RFID. The passive RF chip RFID (Radio Frequency Identification) system mainly consists of three parts: tag (RF card), reader and RF antenna. Among them, the tag (RF card) is composed of a packaging carrier, a coupling antenna and a chip. The RF antenna emits an electric field environment, and the chip is powered by capacitive coupling, thereby realizing the mutual communication function between the reader and the RF antenna, and achieving the effect of quickly reading the tag information. However, in actual application, ultra-high frequency RFID technology has problems such as signal susceptibility to interference, limited penetration ability, privacy and security, which need to be further solved and optimized.
[0003] In the field of intelligent traffic control, participants such as motor vehicles and electric vehicles are often in motion, and RF reading and writing equipment (RF antenna) will be installed on the roadside or in some designated places to perform fixed-point reading of UHF RF cards / tags. Commonly used UHF tags use antenna carriers such as ceramics, FR4, and PCB, and the packaging shell is made of materials such as ABS and PC. They are packaged into UHF RF cards through gluing, ultrasonic welding, and one-piece injection molding to achieve long-distance (>10 meters) reading of end identity information. This type of RF card is usually installed in complex media scenes (media includes metal brackets, glass, plastic substrate racks, plastic and metal mixtures, etc.). When reading, the UHF RF card passes through the RF reading and writing equipment while moving (speed is 25km / h~180km / h), and the RF reading and writing equipment effectively reads the UHF tag in the UHF RF card, and the reading time is 50ms~500ms.
[0004] In the moving state, the reading effect of UHF RFID card / tag will be affected to a certain extent. First, the operating frequency range of UHF technology is 860~960MHz. According to the propagation speed formula of electromagnetic waves (wavelength = speed of light / frequency), it can be calculated that the corresponding wavelength is about 31.25cm to 29.2cm. Electromagnetic waves of this wavelength have defects in antenna design and signal propagation, and need to be optimized and adjusted according to specific application scenarios. Secondly, due to the rapid movement of objects, the relative position between UHF RFID card / tag and RF antenna changes rapidly, which may cause signal instability and affect the accuracy and success rate of UHF RFID card reading; thirdly, Doppler effect may occur during movement, causing the frequency of the received signal to change and the center frequency to shift, resulting in increased difficulty in signal processing. Finally, the coupling antenna of UHF (RFID) tags includes linear, circular polarization and dipole lines. Long-distance UHF tags use dipole coupling antennas. UHF RFID cards usually use a single-sided asymmetric packaging structure, which is the printing surface / protective surface, chip, coupling antenna, packaging carrier, adhesive and centrifugal paper. The three-dimensional radiation field and directivity of the dipole antenna based on the symmetrical oscillator are symmetrical along the Z axis. Due to the unilateral asymmetric packaging structure of the label, the radiation lobes on both sides of the Z axis are easily different, causing differences in the signal gain when reading the front and back sides of the label.
[0005] When the above-mentioned UHF radio frequency card is used in high-speed sports scenes. During installation, the radio frequency card will be installed on the surface of glass or metal medium or mixed complex medium carrier by pasting, embedding, screw fixing, etc. Usually, when installing the radio frequency card, the back of the radio frequency card will face the installation carrier, but from the user's perspective, there is also a situation where the front faces the installation carrier. When the UHF radio frequency card passes through the radio frequency reader and writer device on the roadside, the radio frequency reader and writer transmits a radio frequency signal of a certain frequency through the antenna, and the signal forms an electromagnetic field in space. When the radio frequency card RFID tag enters this electromagnetic field, its antenna will sense the electromagnetic field of the radio frequency signal, and the antenna will cut the magnetic induction line and generate an induced microcurrent through electromagnetic induction. This microcurrent provides the chip inside the tag with the energy required for operation, activates the chip and makes it work. The activated tag chip will send out the stored data in the form of electromagnetic waves according to the instructions of the reader. The radio frequency reader and writer receives these electromagnetic wave signals through the antenna and converts them into digital signals for processing. The reader and writer decodes and verifies the received data, and then passes the valid data to the data processing system (or background system) for further processing.
[0006] The ultra-high frequency radio frequency card in this application often adopts a single-sided asymmetric packaging structure under the factors of controlling the thickness and overall cost of the radio frequency card. The radio frequency chip and radio frequency antenna inside the ultra-high frequency radio frequency card are arranged on one side of the dielectric substrate, and the side where they are located is recorded as: the front side, and the other side is recorded as the back side. Then, when the front side of the radio frequency card receives the radio frequency signal of the reading and writing device, the micro-current generated by the radio frequency antenna cutting the electromagnetic field of the radio frequency signal is large, and the corresponding data signal feedback generated by the chip is strong. On the back of the radio frequency card, due to the dielectric loss of the antenna packaging material, signal reflection and other problems that are inconsistent with the front side, the micro-current generated by the radio frequency antenna cutting the electromagnetic field of the radio frequency signal is smaller than that of the front side, and the back of the ultra-high frequency radio frequency card is provided with a thicker installation carrier, so it will cause inconsistent signals on the front and back sides.
[0007] In the prior art, in order to solve the problem of inconsistent reading performance of the front and back of the RFID card caused by this unilateral asymmetric packaging structure, the signal can also be improved by optimizing the RFID antenna. For example, a symmetrical antenna design or a dual-polarized antenna design is adopted to enable the tag to obtain relatively balanced RFID signal coupling on both the front and back sides. However, in complex scenarios, customized antenna design and production processes will lead to increased costs, and this solution is not suitable for mass production of UHF RFID cards. As a result, in high-speed motion scenarios, when a vehicle passes through a roadside RFID reader / writer, the UHF RFID card installed on the vehicle is facing the reading device, and there is a high probability that the RFID card data of the high-speed moving vehicle cannot be read. Summary of the invention
[0008] In order to solve the problem of Z-axis lobe difference caused by the packaged antenna, chip, solder joint, etc. on one side of the tag in the prior art, which leads to the difference in signal gain of the front and back sides of the UHF radio frequency card, the present invention provides an UHF radio frequency card based on a compensation structure, which can reduce the gain difference of the UHF tag signal on both sides of the front and back sides of the radio frequency card, ensuring that both sides of the UHF radio frequency card can be quickly and accurately read in any scenario. At the same time, the application also discloses a method for making an UHF radio frequency card based on a compensation structure.
[0009] The technical solution of the present invention is as follows: an ultra-high frequency radio frequency card based on a compensation structure, comprising: a functional packaging layer, a radio frequency chip, a radio frequency antenna, and a packaging carrier layer, characterized in that it also comprises: a compensation medium layer; The functional encapsulation layer comprises: a first functional encapsulation layer and a second functional encapsulation layer; The first functional encapsulation layer and the second functional encapsulation layer are respectively arranged on the upper and lower end surfaces of the radio frequency switch, and together wrap the encapsulation carrier layer and the compensation medium layer to form a radio frequency card; The packaging carrier layer comprises: a dielectric substrate, the radio frequency chip and the radio frequency antenna are packaged in the dielectric substrate and are located on a side away from the compensation dielectric layer; A coating film containing metal oxide is provided on a side of the compensation medium layer away from the packaging carrier layer; The standard wavelength is set based on the central frequency F of the radio frequency antenna, and the relationship between the film thickness H in the compensation medium layer and the standard wavelength λ is set as: .
[0010] It is further characterized by: The coating film in the compensation medium layer is an oxide film layer of a transparent metal oxide with a refractive index greater than 1.75; The standard wavelength λ is set to: λ=C / F, where C is the wave velocity of the radio frequency wave, in m / s; The radio frequency antenna is a metal-based antenna, and the material is a metal material with good conductivity; The antenna shape of the radio frequency antenna is a dipole antenna shape, and the antenna shape includes a symmetrical or asymmetrical structure; The long side of the antenna impedance matching loop is consistent with the polarization direction of the RFID antenna.
[0011] A method for manufacturing an ultra-high frequency radio frequency card based on a compensation structure comprises the following steps: S1: prepare functional encapsulation layer; S2: making a packaging carrier layer; S3: making a compensation medium layer; S4: stacking the functional encapsulation layer, the encapsulation carrier layer, the compensation medium layer, and the functional encapsulation layer in sequence from top to bottom, performing heating lamination, and then cold pressing to form an ultra-high frequency radio frequency card with a compensation structure; Features: In step S3, the step of making the compensation medium layer includes: S3-1: Calculate the thickness H of the coating film; S3-2: on the compensation medium layer, a polymer compound coating containing carbonate chain segments is provided, which is cured to form a medium support layer; S3-3: On the side of the dielectric support layer away from the packaging carrier layer, a metal oxide thin film layer with a refractive index greater than 1.75 and a thickness of H is generated at one time.
[0012] It is further characterized by: The coating film is generated in step S3-3 as follows: An oxide film layer containing metal oxide is generated on one side of the dielectric support layer by magnetron sputtering as a coating film, and forms a compensation dielectric layer together with the dielectric support layer; The material of the coating film in the compensation dielectric layer includes titanium dioxide, tantalum pentoxide, zirconium oxide or zinc oxide; In step S2, the packaging carrier layer includes a dielectric substrate. The dielectric substrate is a polyester-based material with a temperature resistance of more than 110°C, specifically including: polycarbonate, PET, PETG, ABS, PC and ABS co-extruded material, PBT or polyimide; In step S2, the step of making the packaging carrier layer includes: S2-1: Setting a dielectric substrate; S2-2: manufacturing a radio frequency antenna layer on a side of the dielectric substrate away from the compensation dielectric layer; The manufacturing method of the radio frequency antenna layer includes: pressing or etching; S2-3: mounting the radio frequency chip on the radio frequency antenna layer by gluing; S2-4: Connect the RF antenna layer to the RF chip by welding or wiring.
[0013] The present application provides a UHF radio frequency card based on a compensation structure, in which the radio frequency chip and radio frequency antenna inside are set to an asymmetric setting, so the signal on the front of the radio frequency card where the radio frequency chip and radio frequency antenna are located is stronger. The present application sets a compensation dielectric layer, and in the compensation dielectric layer, a coating film containing metal oxide with higher dielectric properties is added on the side away from the radio frequency chip and radio frequency antenna, as a signal reflection layer, which reflects part of the reflected signal back to the reader direction, and increases the signal strength on the side away from the radio frequency chip; in the present application, the distribution of metal oxide with over-dense ultra-small grains can make the radio frequency signal more evenly distributed inside the tag, reduce the difference of the signal on both sides of the radio frequency card, and ensure that both sides of the UHF radio frequency card in high-speed operation can be read quickly and accurately. Without changing the traditional dipole antenna design, the present application solves the problem of Z-axis lobe difference caused by the packaged antenna, chip, solder joint, etc. on one side of the tag. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic cross-sectional view of the UHF radio frequency card in this application; Figure 2 Schematic diagram of the packaging carrier layer structure; Figure 3 Schematic diagram of the dielectric compensation layer structure; Figure 4 An embodiment of a packaging carrier layer; Figure 5 Embodiment 1 of the UHF radio frequency card; Figure 6 This is embodiment 2 of the UHF radio frequency card. DETAILED DESCRIPTION
[0015] The technical solution of the present application adds a coating film containing metal oxide as a reflective layer on the side of the dielectric substrate away from the RF chip and the RF antenna in the ultra-high frequency RF card. The main function of the reflective layer is to compensate for the micro-current generated by the RF antenna cutting the electromagnetic field of the RF signal, increase the micro-current, optimize signal reflection and scattering, adjust the propagation path of the RF signal, and thereby increase the data signal strength emitted by the RF chip from the back of the RF card.
[0016] Specifically, the present application provides an ultra-high frequency radio frequency card based on a compensation structure, such as Figure 1 As shown, it includes: a functional packaging layer, a radio frequency chip, a radio frequency antenna, a packaging carrier layer and a compensation medium layer.
[0017] The functional encapsulation layer includes: a first functional encapsulation layer and a second functional encapsulation layer; the first functional encapsulation layer and the second functional encapsulation layer are respectively arranged on the upper and lower ends of the RF switch, and together wrap the encapsulation carrier layer and the compensation medium layer to form a RF card. The functional features set in the functional encapsulation layer include but are not limited to: ink printing, QR code, laser etching, micro-nano optical structure, etc., and one or more of them can be combined together.
[0018] The method for manufacturing an ultra-high frequency radio frequency card based on a compensation structure in the present application includes the following steps.
[0019] S1: prepare functional encapsulation layer; The functional encapsulation layer material is a plastic substrate, and its material includes: polycarbonate, PET, PETG, ABS, PC and ABS co-extruded material or PBT. The thickness of the RF chip used in this embodiment is 0.45~0.63mm, and the functional encapsulation layer is controlled within the thickness of 0.2mm~1mm. The overall thickness of the UHF RF card is controlled to be about 1~2mm.
[0020] S2: making a packaging carrier layer.
[0021] In step S2, the encapsulation carrier layer includes a dielectric substrate; the dielectric substrate is a polyester-based material with a temperature resistance of more than 110°C, specifically including: polycarbonate, PET, PETG, ABS, PC and ABS co-extruded material, PBT or polyimide.
[0022] The package carrier layer includes: a dielectric substrate, in which the RF chip and the RF antenna are packaged and located on a side away from the compensation dielectric layer. The RF antenna is a metal-based antenna, and the material is a metal material with good conductivity, such as gold, silver, copper or aluminum; the antenna shape is a dipole antenna shape, and the antenna shape includes a symmetrical or asymmetrical structure; the long side of the antenna impedance matching ring is consistent with the polarization direction of the RFID antenna.
[0023] The standard wavelength is set based on the center frequency F of the RF antenna, and the thickness of the thin film in the compensation dielectric layer is set to a multiple of the standard wavelength. The specific method for setting the standard wavelength λ is: λ=C / F, where C is the wave velocity of the RF wave, in m / s. The film thickness H in the compensation dielectric layer is set to 1 / 8 to 1 times the standard wavelength λ; that is, the corresponding relationship between H and λ is: ; In specific implementation, when the dipole antenna in the RF chip is a symmetrical antenna structure, the specific value of H is adjusted toward 1 / 8 times λ; when the dipole antenna in the RF chip is an asymmetric antenna structure, the specific value of H is adjusted toward 1 times λ; the specific value of the film thickness H also needs to be adjusted with reference to the material, structure and other parameters of the antenna.
[0024] like Figure 4 The figure shows an embodiment of the encapsulation carrier layer. The specific steps of making the encapsulation carrier layer include: S2-1: Setting a dielectric substrate; S2-2: On the side of the dielectric substrate away from the compensation dielectric layer, a radio frequency antenna layer is fabricated. Figure 2 As shown; The RF antenna layer can be made by: pressing or etching; S2-3: Mounting the RF chip on the RF antenna layer by gluing; S2-4: Connect the RF antenna layer to the RF chip by welding or wiring.
[0025] like Figure 3 The compensation dielectric layer comprises a dielectric support layer formed of a plastic film and a coating film filled on the dielectric support layer at one time. A coating film containing a metal oxide is arranged on a side of the compensation dielectric layer away from the encapsulation carrier layer; the coating film in the compensation dielectric layer is a transparent oxide film layer of a metal oxide with a refractive index greater than 1.75.
[0026] S3: The steps for making the compensation dielectric layer are as follows.
[0027] S3-1: Calculate the thickness H of the oxide coating; S3-2: On the compensation medium layer, a polymer compound coating containing carbonate chain segments is provided, and after curing, a plastic film is formed, which is the medium support layer; S3-3: On the side of the dielectric support layer away from the packaging carrier layer, a transparent coating film containing metal oxide with a refractive index greater than 1.75 is generated at one time with a thickness of H.
[0028] The coating film is generated in step S3-3 as follows: A metal oxide film layer is formed as a coating film on one side of the dielectric support layer formed of the plastic film based on magnetron sputtering, and together with the plastic film, a compensation dielectric layer is formed; the coating film in the compensation dielectric layer includes oxides with a refractive index greater than 1.75, including titanium dioxide (TiO2), tantalum pentoxide (Ta2O5), zirconium oxide (ZrO2), zinc oxide (ZnO), etc.
[0029] In this application, an oxide film layer of a metal oxide is provided as a coating film. Firstly, based on the oxide film, there is no interference with the radio frequency performance of the ultra-high frequency RFID. The interference generally absorbs electromagnetic waves and weakens the radio frequency performance. This type of film has excellent optical properties, can form a transparent film, has high hardness and wear resistance, and can even be used as an optical holographic feature. This type of film has certain electrical properties and piezoelectric properties.
[0030] In this method, the oxide film morphology is formed by magnetron sputtering, which can first ensure that the coating film is uniform, and the thickness deviation of the entire coating is small, which can be controlled between 20nm and 500nm. At the same time, the metal oxide film layer generated by sputtering has a dense characteristic, and the atoms in the film are tightly arranged, which can effectively block the invasion of foreign substances. At the same time, the grain structure of the metal oxide film layer is small, and the film with a small grain size usually has a higher transparency and a more uniform refractive index, which will not affect the signal transmission while generating a gain in the RF signal strength on the back of the RF card. Moreover, the metal oxide film layer generated by sputtering is amorphous, and its atomic arrangement is relatively disordered. The film in this state has a certain softness and good fit, which meets the technical requirements that the card body of the ultra-high frequency RF card can be bent, and prolongs the service life of the card body.
[0031] S4: stacking the functional encapsulation layer, the encapsulation carrier layer, the compensation medium layer, and the functional encapsulation layer in sequence from top to bottom, performing heating lamination, and then cold pressing to form an ultra-high frequency radio frequency card with a compensation structure; In this application, the substrate of the UHF radio frequency card is composed of a functional packaging layer, a packaging carrier layer and a dielectric substrate. The materials used in each layer of the substrate are low-loss dielectric materials, which can reduce the attenuation of the radio frequency signal during the penetration process, thereby improving the reverse reading performance. The radio frequency chip and radio frequency antenna are packaged by the substrate as a packaging material, and the material has good radio frequency transparency, which enables the signal to better reach the chip and antenna inside the tag. Effectively enhance the penetration of the radio frequency signal inside the tag.
[0032] The UHF radio frequency card constructed based on the technical solution of the present application has a compensation dielectric layer added to the radio frequency card to compensate for the radio frequency signal. Without changing the antenna design, the reflection and scattering of the radio frequency signal are optimized at a lower cost by selecting a suitable structure and material. The propagation path of the radio frequency signal is adjusted by changing the structure of the label and adding a reflective layer with higher dielectric properties. Adding a reflective layer on the back of the label can reflect part of the reflected signal back to the reader, increasing the signal strength read on the back. It is especially suitable for the production of UHF radio frequency cards for license plate numbers that do not have very strict size requirements.
[0033] When the technical solution of this application is applied in a specific way, the number of layers of each functional layer can be adjusted according to actual needs. Figure 5 and Figure 6 Two specific embodiments are described below. Figure 5 It is a large-size ultra-high frequency radio frequency card, including three functional packaging layers: shell packaging layers 1 to 3. In order to adapt to the vehicle installation environment, the size of the packaging carrier layer is enlarged by the leveling layer, and the dielectric compensation layer is arranged between the leveling layer and the shell packaging layer 3. Figure 6 For a small-sized ultra-high frequency radio frequency card, the dielectric compensation layer is arranged between the packaging carrier layer and the shell packaging layer 2 on the back.
[0034] The RFID tag (electric bicycle license plate) made based on this technical solution can be installed on the windshield, metal bracket, or plastic plate rack in the laboratory and actual testing. The movement speed of the RFID tag is 25-80 km / h, and the reader can effectively read the RFID tag with a reading time of about 100ms. Test results. The test results are: the reading sensitivity of the front and back sides meets the requirements of the national standard "General Specifications for Motor Vehicle Electronic Identification Part 1: Automobile" (GB / T35789.1-2017), and the sensitivity test results are: signal ≤-17dBm, write sensitivity ≤-14dBm.
Claims
1. An ultra-high frequency radio frequency card based on a compensation structure, comprising: Functional packaging layer, radio frequency chip, radio frequency antenna, packaging carrier layer, characterized in that it also includes: compensation medium layer; The functional encapsulation layer comprises: a first functional encapsulation layer and a second functional encapsulation layer; The first functional encapsulation layer and the second functional encapsulation layer are respectively arranged on the upper and lower end surfaces of the radio frequency switch, and together wrap the encapsulation carrier layer and the compensation medium layer to form a radio frequency card; The packaging carrier layer comprises: a dielectric substrate, the radio frequency chip and the radio frequency antenna are packaged in the dielectric substrate and are located on a side away from the compensation dielectric layer; A coating film containing metal oxide is provided on a side of the compensation medium layer away from the packaging carrier layer; The standard wavelength is set based on the central frequency F of the radio frequency antenna, and the relationship between the film thickness H in the compensation medium layer and the standard wavelength λ is set as: 。 2. According to the UHF radio frequency card based on the compensation structure of claim 1, it is characterized in that: The coating film in the compensation medium layer is a transparent oxide film layer of a metal oxide with a refractive index greater than 1.
75.
3. The UHF radio frequency card based on the compensation structure according to claim 1, characterized in that: The standard wavelength λ is set to: λ=C / F, where C is the wave velocity of the radio frequency wave, in units of m / s.
4. The UHF radio frequency card based on the compensation structure according to claim 1, characterized in that: The radio frequency antenna is a metal-based antenna, and the material is a metal material with good conductivity.
5. The UHF radio frequency card based on the compensation structure according to claim 1, characterized in that: The antenna shape of the radio frequency antenna is a dipole antenna shape, and the antenna shape includes a symmetrical or asymmetrical structure; The long side of the antenna impedance matching loop is consistent with the polarization direction of the RFID antenna.
6. A method for manufacturing an ultra-high frequency radio frequency card based on a compensation structure, comprising the following steps: S1: prepare functional encapsulation layer; S2: making a packaging carrier layer; S3: making a compensation medium layer; S4: stacking the functional encapsulation layer, the encapsulation carrier layer, the compensation medium layer, and the functional encapsulation layer in sequence from top to bottom, performing heating lamination, and then cold pressing to form an ultra-high frequency radio frequency card with a compensation structure; Features: In step S3, the step of making the compensation medium layer includes: S3-1: Calculate the thickness H of the coating film; S3-2: on the compensation medium layer, a polymer compound coating containing carbonate chain segments is provided, which is cured to form a medium support layer; S3-3: On the side of the dielectric support layer away from the packaging carrier layer, a metal oxide thin film layer with a refractive index greater than 1.75 and a thickness of H is generated at one time.
7. The method for manufacturing an ultra-high frequency radio frequency card based on a compensation structure according to claim 6, characterized in that: The coating film is generated in step S3-3 as follows: An oxide film layer containing metal oxide is generated as a coating film on one side of the dielectric support layer by magnetron sputtering, and forms a compensation dielectric layer together with the dielectric support layer.
8. The method for manufacturing an ultra-high frequency radio frequency card based on a compensation structure according to claim 6, characterized in that: The material of the coating film in the compensation dielectric layer includes titanium dioxide, tantalum pentoxide, zirconium oxide or zinc oxide.
9. The method for manufacturing an ultra-high frequency radio frequency card based on a compensation structure according to claim 6, characterized in that: In step S2, the packaging carrier layer includes a dielectric substrate. The dielectric substrate is a polyester-based material with a temperature resistance of more than 110° C., specifically including: polycarbonate, PET, PETG, ABS, PC and ABS co-extruded material, PBT or polyimide.
10. The method for manufacturing an ultra-high frequency radio frequency card based on a compensation structure according to claim 6, characterized in that: In step S2, the step of making the packaging carrier layer includes: S2-1: Setting a dielectric substrate; S2-2: manufacturing a radio frequency antenna layer on a side of the dielectric substrate away from the compensation dielectric layer; The manufacturing method of the radio frequency antenna layer includes: pressing or etching; S2-3: mounting the radio frequency chip on the radio frequency antenna layer by gluing; S2-4: Connect the RF antenna layer to the RF chip by welding or wiring.