Device and method for detecting cleanliness of glue conveying system

Abstract

The invention belongs to the technical field of silicon wafer processing, and particularly relates to a device and a method for detecting the cleanliness of a glue conveying system. The glue conveying system cleanliness detection device comprises a supporting structure, a rotation driving structure, a silicon wafer fixing structure arranged on the supporting structure, a glue conveying system, a solvent conveying structure and a thickness detection structure. The method for detecting the cleanliness of the glue conveying system comprises the following steps: recovering glue in a glue container, inputting a solvent into the glue container, and extracting the solvent by a suction pump to dissolve and clean the suction pump and a glue pipe; measuring the thickness of silicon dioxide on the surface of the silicon wafer to be glued or the thickness of the silicon wafer; after the glue conveying system is cleaned, a glue pipe sprays a solvent to the middle of the silicon wafer for solvent spin coating; and measuring the thickness of the silicon dioxide on the surface of the silicon wafer or the thickness of the silicon wafer again, and comparing with the measured value so as to judge the cleanliness. Detection is convenient, and the problems that an existing glue conveying system is difficult in cleanliness detection and low in detection efficiency are solved.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon wafer processing, and in particular relates to a cleanliness detection device and a detection method for a glue delivery system. Background Art

[0002] When processing silicon wafers, it is necessary to spray colloid on the surface of the silicon wafer, mainly by dripping the colloid on the surface of the silicon wafer through the hose of the glue sprayer, and then evenly dispersing the colloid on the surface of the silicon wafer by rotation. For the processing of different types of silicon wafers, different types of colloids are required due to their different process requirements. After changing the colloid, the hose needs to be cleaned to prevent the residual colloid from contaminating the newly replaced colloid and affecting the processing of the silicon wafer.

[0003] At present, the surface of silicon wafers is mainly observed under a microscope to detect whether there is any residue. This is difficult and inefficient, which seriously affects the processing capacity of silicon wafers. Summary of the invention

[0004] The purpose of the present invention is to provide a device and method for detecting the cleanliness of a glue delivery system, aiming to solve the problems of difficulty in detecting the cleanliness of the existing glue delivery system and low detection efficiency.

[0005] The present invention discloses a device for detecting the cleanliness of a glue delivery system, the device comprising a support structure, a rotation driving structure for driving the support structure to rotate, a silicon wafer fixing structure arranged on the support structure, and a glue delivery system arranged above the support structure, wherein the glue delivery system comprises a mounting seat arranged above the support structure, a moving driving mechanism for driving the mounting seat to move, a rubber hose fixed to the mounting seat, a colloid container, and a suction pump for sucking colloid inside the colloid container, wherein the rubber hose is connected to the outlet of the suction pump; and the device further comprises a solvent delivery structure for delivering a solvent to the inside of the colloid container, and a thickness detection structure for detecting thickness.

[0006] As an improvement, the rubber hose is arranged vertically.

[0007] As an improvement, the support structure is configured as a circular disk, the circular disk is provided with a closed air cavity, and a plurality of air suction holes connected to the closed air cavity are provided on the upper side of the circular disk, and the plurality of air suction holes form the silicon wafer fixing structure.

[0008] As an improvement, the circular disk body includes a lower plate body, a lower plate body groove is provided on the upper side of the lower plate body; an upper plate body is buckled on the upper side of the lower plate body, an upper plate body groove corresponding to the lower plate body groove is provided on the lower side of the upper plate body, and the closed air cavity is formed between the lower plate body groove and the upper plate body groove; and a sealing ring body is arranged between the upper plate body and the lower plate body.

[0009] As an improvement, the rotation drive structure includes a rotating shaft and a rotation power mechanism for driving the rotating shaft to rotate; the circular disk is fixed to the upper end of the rotating shaft.

[0010] The present invention also discloses a method for detecting the cleanliness of a glue delivery system, based on the device for detecting the cleanliness of a glue delivery system, comprising the following steps:

[0011] Step 1. Recovering the colloid inside the colloid container, and then inputting the solvent inside the solvent delivery structure into the colloid container, the solvent dissolves the colloid remaining inside the colloid container, and the suction pump extracts the solvent inside the colloid container to dissolve and clean the suction pump and the hose;

[0012] Step 2. Measuring the thickness of silicon dioxide on the surface of the silicon wafer to be coated or the thickness of the silicon wafer to be coated;

[0013] Step 3. After cleaning the glue delivery system, the silicon wafer to be coated is moved to the support structure, and the silicon wafer fixing structure fixes the silicon wafer to the support structure;

[0014] Step 4. The mobile drive mechanism drives the hose to move to the middle of the silicon wafer, sprays the solvent to the middle of the silicon wafer, and the rotation drive structure drives the support structure and the silicon wafer fixed to the support structure to rotate, and the solvent is evenly dispersed on the surface of the silicon wafer under the action of centrifugal force;

[0015] Step 5. After the solvent on the surface of the silicon wafer evaporates, measure the thickness of silicon dioxide on the surface of the silicon wafer or the thickness of the silicon wafer again, and compare the measured value with the measured value in step 2 to determine the cleanliness.

[0016] As an improvement, the solvent delivery structure includes a solvent container; for step one, the solvent container containing the solvent is connected to the interior of the colloid container, and the solvent in the solvent container is input into the interior of the colloid container.

[0017] As an improvement, the rubber hose is connected to the solvent container to form a solvent flow loop; or, a recovery container is provided in step one, and the rubber hose is connected to the recovery container.

[0018] As an improvement, for step four, when the hose sprays the solvent, the support structure and the silicon wafer fixed to the support structure have a low initial rotation speed. After the hose sprays the solvent, the support structure and the silicon wafer fixed to the support structure are driven by the rotating drive structure to accelerate to a high spin coating speed.

[0019] As an improvement, for step 4, after spin coating the solvent, the support structure and the silicon wafer fixed to the support structure are driven by the rotation driving structure to accelerate to a volatilization rotation speed.

[0020] Due to the adoption of the above-mentioned technical scheme, the glue delivery system cleanliness detection device of the present invention includes a supporting structure, a rotating driving structure for driving the supporting structure to rotate, a silicon wafer fixing structure arranged on the supporting structure, and a glue delivery system arranged above the corresponding supporting structure. The glue delivery system includes a mounting seat arranged above the supporting structure, a moving driving mechanism for driving the mounting seat to move, a hose fixed to the mounting seat, a colloid container and a suction pump for sucking the colloid inside the colloid container, and the hose is connected to the outlet of the suction pump; it also includes a solvent delivery structure for delivering a solvent to the inside of the colloid container and a thickness detection structure for detecting the thickness.

[0021] The cleanliness detection method of the glue delivery system of the present invention is based on the cleanliness detection device of the glue delivery system, and comprises the following steps:

[0022] Step 1. Recover the colloid in the colloid container, then input the solvent in the solvent delivery structure into the colloid container, the solvent dissolves the colloid remaining in the colloid container, and the suction pump extracts the solvent in the colloid container to dissolve and clean the suction pump and the hose;

[0023] Step 2. Measuring the thickness of silicon dioxide on the surface of the silicon wafer to be coated or the thickness of the silicon wafer to be coated;

[0024] Step 3. After cleaning the glue delivery system, the silicon wafer to be coated is moved to the support structure, and the silicon wafer fixing structure fixes the silicon wafer to the support structure;

[0025] Step 4. The mobile driving mechanism drives the hose to move to the middle of the silicon wafer, sprays the solvent to the middle of the silicon wafer, and the rotation driving structure drives the support structure and the silicon wafer fixed to the support structure to rotate, and the solvent is evenly dispersed on the surface of the silicon wafer under the action of centrifugal force;

[0026] Step 5. After the solvent on the surface of the silicon wafer evaporates, measure the thickness of silicon dioxide on the surface of the silicon wafer or the thickness of the silicon wafer again, and compare the measured value with the measured value in step 2 to determine the cleanliness.

[0027] The thickness of silicon dioxide on the surface of the silicon wafer to be coated with glue or the thickness of the silicon wafer is measured in advance; after cleaning the glue delivery system, the solvent delivered through the hose is spin-coated on the surface of the silicon wafer, and the thickness of silicon dioxide on the surface of the silicon wafer or the thickness of the silicon wafer after the solvent is spin-coated is measured again. Since the solvent is volatile, the change in the thickness of silicon dioxide on the surface of the silicon wafer or the silicon wafer can be used to detect whether the solvent sprayed by the glue delivery system contains colloid, so as to judge the cleanliness of the glue delivery system. The detection is convenient, which solves the problems of difficult cleanliness detection and low detection efficiency of the existing glue delivery system. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a structural schematic diagram of a cleanliness detection device for a glue delivery system according to an embodiment of the present invention;

[0029] Among them, 10, support structure; 20, rotating shaft; 30, mounting seat; 40, hose; 50, silicon wafer; 60, colloid container; 70, solvent container. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0031] in, Figure 1 The schematic diagram of the structure of the cleanliness detection device of the glue delivery system according to the embodiment of the present invention is shown. For the convenience of description, only the parts related to the present invention are shown in the figure.

[0032] It should be noted that, if the present invention involves directional indications (such as up, down, front, back, left, right, etc.), such directional indications are only used to explain the relative positional relationship between the components under a certain specific posture. If the specific posture changes, the directional indication will also change accordingly; if the present invention involves descriptions of "first", "second", etc., such descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0033] Depend on Figure 1 It can be known that the glue delivery system cleanliness detection device of the embodiment of the present invention includes a support structure 10, a rotation driving structure for driving the support structure 10 to rotate, a silicon wafer fixing structure arranged on the support structure 10, and a glue delivery system arranged above the corresponding support structure 10. Specifically, the glue delivery system includes a mounting seat 30 arranged above the support structure 10, a moving driving mechanism (not shown in the figure) for driving the mounting seat 30 to move, a hose 40 fixed to the mounting seat 30, a colloid container 60, and a suction pump (not shown in the figure) for sucking the colloid inside the colloid container 60, and the hose 40 is connected to the outlet of the suction pump; it also includes a solvent delivery structure for delivering a solvent to the inside of the colloid container 60, and a thickness detection structure for detecting the thickness.

[0034] For ease of understanding, the following description is made of the coating of the silicon wafer 50, the cleaning of the glue delivery system, and the detection of the cleanliness in conjunction with the accompanying drawings:

[0035] When applying glue, the transport mechanism transports the silicon wafer 50 to the support structure 10, and the silicon wafer fixing structure fixes the silicon wafer 50 to the support structure 10; the glue delivery system sprays colloid to the middle of the silicon wafer 50, and the rotation drive structure drives the support structure 10 and the silicon wafer 50 fixed to the support structure 10 to rotate, and the colloid is evenly dispersed on the surface of the silicon wafer 50 under the action of centrifugal force.

[0036] When processing different types of silicon wafers or improving the processing technology, different types of colloids need to be replaced. After replacing the colloid, the glue delivery system needs to be cleaned to prevent the residual colloid from contaminating the newly replaced colloid and affecting the processing of the silicon wafer.

[0037] During cleaning, the colloid in the colloid container 60 of the glue delivery system is recovered, and then the solvent is input into the colloid container 60 by the solvent delivery structure. The solvent can dissolve the colloid remaining in the colloid container 60, and the suction pump draws the solvent in the colloid container 60 to dissolve and clean the suction pump and the hose 40.

[0038] During the inspection, the thickness of silicon dioxide on the surface of the silicon wafer 50 to be coated with glue or the thickness of the silicon wafer 50 is measured in advance; then the silicon wafer 50 to be coated with glue is moved to the support structure 10, the silicon wafer 50 is fixed to the support structure 10 by the silicon wafer fixing structure, the solvent is sprayed to the middle of the silicon wafer 50 by the glue delivery structure, and the support structure 10 and the silicon wafer 50 fixed to the support structure 10 are driven by the rotation drive structure to rotate, and the solvent is evenly dispersed on the surface of the silicon wafer 50 under the action of centrifugal force; after waiting for the solvent on the surface of the silicon wafer 50 to evaporate, the thickness of silicon dioxide on the surface of the silicon wafer 50 or the thickness of the silicon wafer 50 is measured again, and the measured value is compared with the previous measured value to determine the cleanliness of the glue delivery system.

[0039] Since the solvent is volatile, the change in the thickness of the silicon wafer 50 or the silica on the surface of the silicon wafer 50 can be used to detect whether the solvent sprayed by the glue delivery system contains colloid, so as to judge the cleanliness of the glue delivery system. The detection is convenient, which solves the problem of difficult cleanliness detection and low detection efficiency of the existing glue delivery system.

[0040] In the embodiment of the present invention, in order to facilitate the spraying of the colloid to the middle of the silicon wafer 50 , the tube body portion of the rubber hose 40 fixed to the mounting seat 30 is arranged vertically.

[0041] Usually, a solenoid valve is connected in series to the hose 40 to control on / off and outflow.

[0042] The mobile drive mechanism includes a spray translation drive mechanism and a spray lifting drive mechanism fixedly installed on the output part of the spray translation drive mechanism. The mounting seat 30 is fixed on the output part of the spray lifting drive mechanism. The spray translation drive mechanism and the spray lifting drive mechanism are electric cylinders. Of course, the mobile drive mechanism can also be set as a manipulator.

[0043] In an embodiment of the present invention, the support structure 10 is a circular disk body, which is provided with a closed air cavity, and a plurality of suction holes connected to the closed air cavity are provided on the upper side of the circular disk body, and the plurality of suction holes form a silicon wafer fixing structure; after the silicon wafer 50 is placed on the circular disk body, the plurality of suction holes can adsorb the silicon wafer 50 to the circular disk body to prevent the position of the silicon wafer 50 from changing during rotation.

[0044] Specifically, the circular disk body includes a lower plate body, on the upper side of which a lower plate body groove is provided; an upper plate body that is buckled on the upper side of the lower plate body, on the lower side of the upper plate body a upper plate body groove corresponding to the lower plate body groove is provided, a closed air cavity is formed between the lower plate body groove and the upper plate body groove, a connecting hole that is connected to the lower plate body groove is provided on one side edge of the lower plate body, and the connecting hole is connected to an air pump; and a sealing ring body is arranged between the upper plate body and the lower plate body to prevent air leakage in the closed air cavity.

[0045] In some other embodiments, the silicon wafer fixing structure includes at least two groups of clamping mechanisms arranged at intervals along the circumferential direction, each group of clamping mechanisms includes a clamping drive mechanism, a clamping block fixedly mounted on the output of the clamping drive mechanism, and a contoured clamping surface is provided on the clamping block to facilitate matching with the silicon wafer 50. Usually, the clamping drive mechanism is configured as a cylinder, and the clamping mechanism is provided with two groups and is arranged opposite to each other.

[0046] In the embodiment of the present invention, the rotation driving structure includes a rotating shaft 20 and a rotation power mechanism for driving the rotating shaft 20 to rotate, such as a motor, a hydraulic motor, etc.; the circular disc is fixed to the upper end of the rotating shaft 20.

[0047] In the embodiment of the present invention, the spraying device further comprises an electric control module, and the rotation drive structure and the glue delivery system are electrically connected to the electric control module respectively. Of course, if the spraying device of the embodiment of the present invention is applied to an automated production line, the electric control module of the spraying device is the electric control module of the automated production line.

[0048] Specifically, the electric control module is a well-known structure in the field of automation equipment, and its specific structure will not be described in detail here.

[0049] The present invention also discloses a method for detecting the cleanliness of a glue delivery system, which is based on the above-mentioned device for detecting the cleanliness of a glue delivery system and comprises the following steps:

[0050] Step 1. Recover the colloid in the colloid container 60 of the glue delivery system, and then input the solvent in the solvent delivery structure into the colloid container 60, the solvent dissolves the colloid remaining in the colloid container 60, and the suction pump extracts the solvent in the colloid container 60 to dissolve and clean the suction pump and the hose 40;

[0051] Step 2. Measuring the thickness of silicon dioxide on the surface of the silicon wafer 50 to be coated or the thickness of the silicon wafer 50 to be coated, usually, using an ellipsometer to measure the thickness of silicon dioxide on the surface of the silicon wafer 50, using a thickness measurement sensor to measure the thickness of the silicon wafer 50;

[0052] Step 3. After cleaning the glue delivery system, the silicon wafer 50 to be coated is transported to the support structure 10, and the silicon wafer fixing structure fixes the silicon wafer 50 to the support structure 10;

[0053] Step 4. The mobile driving mechanism drives the mounting seat 30 and the hose 40 fixed to the mounting seat 30 to move to the middle of the silicon wafer 50, sprays the solvent to the middle of the silicon wafer 50, and the rotation driving structure drives the support structure 10 and the silicon wafer 50 fixed to the support structure 10 to rotate, and the solvent is evenly dispersed on the surface of the silicon wafer 50 under the action of centrifugal force;

[0054] Step 5. After the solvent on the surface of the silicon wafer 50 evaporates, the thickness of the silicon dioxide on the surface of the silicon wafer 50 or the thickness of the silicon wafer 50 is measured again, and the measured value is compared with the measured value in step 2 to determine the cleanliness of the glue delivery system;

[0055] If the difference is within the set error range, which is less than or equal to 3nm, the cleanliness of the glue delivery system meets the use requirements; if the difference exceeds the set error range and is greater than 3nm, the cleanliness of the glue delivery system does not meet the use requirements and needs to be further cleaned.

[0056] The thickness of silicon dioxide on the surface of the silicon wafer 50 to be coated with glue or the thickness of the silicon wafer 50 is measured in advance; after cleaning the glue delivery system, the solvent delivered by the hose 40 is spin-coated on the surface of the silicon wafer 50, and the thickness of silicon dioxide on the surface of the silicon wafer 50 or the thickness of the silicon wafer 50 after the solvent is spin-coated is measured again. Since the solvent is volatile, the change in the thickness of silicon dioxide on the surface of the silicon wafer 50 or the thickness of the silicon wafer 50 can be used to detect whether the solvent sprayed by the glue delivery system contains colloid, so as to judge the cleanliness of the glue delivery system. The detection is convenient, which solves the problems of difficult cleanliness detection and low detection efficiency of the existing glue delivery system.

[0057] In an embodiment of the present invention, the solvent delivery structure includes a solvent container 70; for step one, the solvent container 70 filled with the solvent is connected to the interior of the colloid container 60, and the solvent inside the solvent container 70 is input into the interior of the colloid container 60. Generally, the solvent inside the solvent container 70 can flow into the interior of the colloid container 60 through a connecting pipe. Of course, a suction pump can also be provided to draw the solvent inside the solvent container 70 into the interior of the colloid container 60.

[0058] Specifically, the hose 40 is connected to the solvent container 70 to form a solvent flow loop.

[0059] In some other embodiments, a recovery container is provided, and the hose 40 is connected to the recovery container. In this case, a solvent container 70 with a larger capacity can be selected to ensure that the solvent inside the solvent container 70 can dissolve all the residual colloid.

[0060] In an embodiment of the present invention, for step four, since the solvent is fluid, in order to improve the spin coating efficiency, when the hose 40 sprays the solvent, the support structure 10 and the silicon wafer 50 fixed to the support structure 10 have a low initial rotation speed, which reduces the acceleration time. Usually, the initial rotation speed is between 50r / min-200r / min. After the hose 40 sprays the solvent, the support structure 10 and the silicon wafer 50 fixed to the support structure 10 are driven by the rotating drive structure to accelerate to a high spin coating speed. Usually, the spin coating speed is between 2000r / min-3000r / min, which is convenient for evenly spin coating the solvent on the surface of the silicon wafer 50.

[0061] Furthermore, after the solvent is spin-coated, the support structure 10 and the silicon wafer 50 fixed to the support structure 10 are accelerated to a volatilization speed by the rotation driving structure, so that the solvent can be volatilized quickly. Usually, the volatilization speed is above 4000 r / min.

[0062] In an embodiment of the present invention, the transportation of the silicon wafer 50 in step one is mainly achieved through a transportation structure, which is electrically connected to the electric control module and includes a transportation translation drive mechanism, a transportation lifting drive mechanism fixedly installed on the output part of the transportation translation drive mechanism, and a picking structure fixedly installed on the output part of the transportation lifting drive mechanism. Specifically, the picking structure is a suction structure, including at least one suction nozzle for sucking the silicon wafer 50. Usually, the transportation translation drive mechanism and the transportation lifting drive mechanism are configured as electric cylinders.

[0063] Of course, the picking structure can also be fixed to the output part of the robot.

[0064] The above descriptions are only some embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A cleanliness detection device for a glue delivery system, characterized in that: It includes a support structure, a rotation driving structure for driving the support structure to rotate, a silicon wafer fixing structure arranged on the support structure, and a glue delivery system arranged above the support structure, wherein the glue delivery system includes a mounting seat arranged above the support structure, a moving driving mechanism for driving the mounting seat to move, a rubber hose fixed to the mounting seat, a colloid container, and a suction pump for sucking colloid inside the colloid container, wherein the rubber hose is connected to the outlet of the suction pump; it also includes a solvent delivery structure for delivering a solvent to the inside of the colloid container, and a thickness detection structure for detecting thickness.

2. The cleanliness detection device for the glue delivery system according to claim 1 is characterized in that: The rubber hose is arranged vertically.

3. The cleanliness detection device for the glue delivery system according to claim 1 is characterized in that: The supporting structure is configured as a circular disk body, the circular disk body is provided with a sealed air cavity, a plurality of air suction holes communicating with the sealed air cavity are provided on the upper side of the circular disk body, and the plurality of air suction holes form the silicon wafer fixing structure.

4. The cleanliness detection device for the glue delivery system according to claim 3 is characterized in that: The circular disk body includes a lower plate body, on the upper side of which a lower plate body groove is provided; an upper plate body that is buckled on the upper side of the lower plate body, on the lower side of the upper plate body a upper plate body groove corresponding to the lower plate body groove is provided, and the closed air cavity is formed between the lower plate body groove and the upper plate body groove; and a sealing ring body is arranged between the upper plate body and the lower plate body.

5. The cleanliness detection device for the glue delivery system according to claim 3 is characterized in that: The rotation driving structure comprises a rotating shaft and a rotation power mechanism for driving the rotating shaft to rotate; the circular disc is fixed to the upper end of the rotating shaft.

6. A method for detecting the cleanliness of a glue delivery system, characterized in that: The following steps are involved: Step 1. Recovering the colloid inside the colloid container, and then inputting the solvent inside the solvent delivery structure into the colloid container, the solvent dissolves the colloid remaining inside the colloid container, and the suction pump extracts the solvent inside the colloid container to dissolve and clean the suction pump and the hose; Step 2. Measuring the thickness of silicon dioxide on the surface of the silicon wafer to be coated or the thickness of the silicon wafer to be coated; Step 3. After cleaning the glue delivery system, the silicon wafer to be coated is transported to the support structure, and the silicon wafer fixing structure fixes the silicon wafer to the support structure; Step 4. The mobile drive mechanism drives the hose to move to the middle of the silicon wafer, sprays the solvent to the middle of the silicon wafer, and the rotation drive structure drives the support structure and the silicon wafer fixed to the support structure to rotate, and the solvent is evenly dispersed on the surface of the silicon wafer under the action of centrifugal force; Step 5. After the solvent on the surface of the silicon wafer evaporates, measure the thickness of silicon dioxide on the surface of the silicon wafer or the thickness of the silicon wafer again, and compare the measured value with the measured value in step 2 to determine the cleanliness.

7. The method for detecting cleanliness of a glue delivery system according to claim 6, characterized in that: The solvent delivery structure includes a solvent container; for step one, the solvent container filled with solvent is connected to the inside of the colloid container, and the solvent in the solvent container is input into the inside of the colloid container.

8. The method for detecting cleanliness of a glue delivery system according to claim 7, characterized in that: The rubber hose is connected to the solvent container to form a solvent flow loop; or, a recovery container is provided in step one, and the rubber hose is connected to the recovery container.

9. The method for detecting cleanliness of a glue delivery system according to claim 6, characterized in that: For step four, when the hose sprays the solvent, the support structure and the silicon wafer fixed to the support structure have a low initial rotation speed. After the hose sprays the solvent, the support structure and the silicon wafer fixed to the support structure are driven by the rotating drive structure to accelerate to a high spin coating speed.

10. The method for detecting cleanliness of a glue delivery system according to claim 6, characterized in that: In step 4, after the solvent is spin-coated, the support structure and the silicon wafer fixed to the support structure are driven by the rotation driving structure to accelerate to a volatilization rotation speed.

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