Rotary epitaxial apparatus and wafer carrier assembly

Abstract

A rotating epitaxial apparatus and a wafer carrier assembly are disclosed. The wafer carrier assembly includes a carrier disk and a shield member detachably mounted on the carrier disk. The carrier disk has a plurality of wafer slots recessed from a top surface thereof, and each of the wafer slots includes a receiving region for receiving a wafer therein. The carrier disk can define two tangent lines with a top edge of each of the wafer slots through a center of the top surface. The top edge of each of the wafer slots has an inscribed segment adjacent to the center and between the two tangent lines. The shield member has a plurality of blocking portions respectively spanning the inscribed segments of the wafer slots but not within the regions of the corresponding wafer slots. Accordingly, by arranging the shield member without substantially affecting the epitaxial operation, the possibility of wafer disengagement (or wafer flying) from the wafer carrier assembly is effectively reduced.

Description

Technical Field

[0001] This invention relates to an epitaxial device, and more particularly to a rotary epitaxial device and a wafer carrier assembly. Background Technology

[0002] In existing wafer carriers, when carrying multiple wafers for epitaxial growth, there is a possibility that any one of the wafers may detach from the carrier, leading to contamination of the chamber where the epitaxial growth is performed, and consequently contamination of other wafers. However, existing wafer carriers do not have a suitable structure to avoid or reduce the occurrence of this problem. Therefore, the inventors believed that these shortcomings could be improved, and through dedicated research and the application of scientific principles, finally proposed this invention, which is rationally designed and effectively improves upon these shortcomings. Summary of the Invention

[0003] The present invention provides a rotary epitaxial device and a wafer carrier assembly, which can effectively improve the defects that may occur in existing wafer carriers.

[0004] This invention discloses a rotary epitaxial wafer apparatus, comprising: a carrier disk having a plurality of wafer slots recessed from its top surface, wherein the carrier disk is capable of defining two tangent lines through the center of its top surface to the top edge of each wafer slot; wherein the top edge of each wafer slot has an inner tangent segment adjacent to the center and located between the two tangent lines; the centerline of each wafer slot is separated from the top edge by a slot radius; wherein each wafer slot includes: a receiving area for receiving a wafer therein; and

[0005] A buffer region located between a top surface and a receiving region, and the buffer region communicating with the receiving region and having a groove top edge; a protective member detachably mounted on a carrier plate; wherein the protective member has multiple blocking portions that respectively cross the inner segments of multiple wafer grooves but are not within the receiving region of the corresponding wafer groove; wherein each blocking portion is separated from the centerline of the corresponding wafer groove by a limiting distance, which is less than the groove radius of the corresponding wafer groove but greater than or equal to 95% of the groove radius; and a device body defining a rotation axis, and the carrier plate being mounted on the device body; wherein the center of the carrier plate is located on the rotation axis, so that the device body can drive the carrier plate to rotate about the rotation axis in a rotational direction.

[0006] Preferably, the protective member has a plurality of mounting portions spaced apart from each other, which are respectively connected to a plurality of blocking portions, and each mounting portion is screwed onto the carrier plate in a screwing direction opposite to the rotation direction.

[0007] Preferably, the protective member has a mounting portion that connects multiple blocking parts, and the mounting portion is screwed onto the center of the bearing plate along the axis of rotation in a screwing direction opposite to the direction of rotation.

[0008] Preferably, the protective member has a mounting portion that connects multiple blocking portions, and the mounting portion is screwed onto the bearing plate in a screwing direction opposite to the rotation direction and surrounds the outer side of the center.

[0009] Preferably, the mounting portion has a guide surface away from the obstruction portion, which forms a guide angle of less than or equal to 45 degrees with the top surface.

[0010] Preferably, the mounting portion includes: a screw-locking ring body screwed onto the bearing plate; and an operating ring body connected to a plurality of blocking portions, wherein the operating ring body can be pressed against the screw-locking ring body in a direction parallel to the rotation axis to move from a disengaged position to an engaged position; wherein, when the operating ring body is in the disengaged position, the screw-locking ring body can only be pushed by the operating ring body rotating in the screw-locking direction; when the operating ring body is in the engaged position, the screw-locking ring body can be pushed by the operating ring body rotating in the rotation direction or the screw-locking direction.

[0011] Preferably, each blocking portion is not located within the buffer area of ​​the corresponding wafer trench.

[0012] This invention also discloses a wafer carrier assembly, comprising: a carrier disk having a plurality of wafer slots recessed from its top surface, wherein the carrier disk is capable of defining two tangent lines with the top edge of each wafer slot through the center of the top surface; wherein the top edge of each wafer slot has an inner segment adjacent to the center and located between the two tangent lines; the centerline of each wafer slot is separated from the top edge by a slot radius; wherein each wafer slot includes: a receiving area for receiving a wafer therein; and a buffer area located between the top surface and the receiving area, and the buffer area is connected to the receiving area and has a slot top edge; and a protective member detachably mounted on the carrier disk; wherein the protective member has a plurality of blocking portions that respectively cross the inner segments of the plurality of wafer slots but are not within the receiving area of ​​the corresponding wafer slot; wherein each blocking portion is separated from the centerline of the corresponding wafer slot by a limiting distance, which is less than the slot radius of the corresponding wafer slot but greater than or equal to 95% of the slot radius.

[0013] Preferably, each blocking portion has a central angle relative to the centerline of the corresponding wafer groove, which is greater than 0 degrees and less than or equal to 5 degrees.

[0014] Preferably, each wafer trench is defined with a predetermined radial direction passing through its centerline and the center of the circle, and each blocking portion is disposed on the predetermined radial direction of the corresponding wafer trench.

[0015] Preferably, each blocking portion covers up to 25% of the top edge of the corresponding wafer trench along a direction parallel to any center line.

[0016] Preferably, along a direction parallel to any center line, each blocking portion is separated from the receiving area of ​​the corresponding wafer trench by a gap greater than 0 and less than or equal to 5% of the trench radius.

[0017] Preferably, the blocking portion has an arc-shaped protrusion located in the buffer area of ​​the corresponding wafer trench, but not within the receiving area of ​​the corresponding wafer trench.

[0018] Preferably, each blocking part protrudes from the top surface of the corresponding wafer slot edge by a distance of less than or equal to 3 mm, and the protective member has a height of less than or equal to 1.5 mm relative to the top surface of the carrier disk.

[0019] This invention also discloses a wafer carrier assembly, comprising: a carrier disk having a plurality of wafer slots recessed from its top surface; wherein the centerline of each wafer slot is separated from the top edge of the slot by a slot radius; wherein each wafer slot includes: a receiving area for receiving a wafer therein; and a buffer area located between the top surface and the receiving area, and the buffer area is connected to the receiving area and has a slot top edge; and a plurality of protective members, each detachably mounted on the carrier disk; wherein each protective member has: a mounting portion that is annular and screwed onto the carrier disk, and the mounting portion surrounds the outside of a wafer slot; and a plurality of blocking portions connected to the inner edge of the mounting portion, the plurality of blocking portions crossing the top edge of the corresponding wafer slot but not within the receiving area of ​​the corresponding wafer slot; wherein each blocking portion is separated from the centerline of the corresponding wafer slot by a limiting distance, which is less than the slot radius of the corresponding wafer slot but greater than or equal to 95% of the slot radius.

[0020] Preferably, the mounting portion includes: a locking ring body screwed onto the bearing plate along a locking direction; and an operating ring body connected to a plurality of blocking portions, wherein the operating ring body can be pressed against the locking ring body in a direction parallel to any one of the center lines to move from a disengaged position to an engaged position; wherein, when the operating ring body is in the disengaged position, the locking ring body can only be pushed by the operating ring body rotating along the locking direction; when the operating ring body is in the engaged position, the locking ring body can be pushed by the operating ring body rotating along the locking direction or in a rotational direction opposite to the locking direction.

[0021] Preferably, in each protective element, the sum of the central angles of the plurality of blocking portions relative to the center line of the corresponding wafer groove is greater than 0 degrees and less than or equal to 75 degrees.

[0022] Preferably, in each protective element, a plurality of blocking portions shield up to 25% of the top edge of the corresponding wafer trench along a direction parallel to any one of the center lines.

[0023] Preferably, the number of multiple blocking parts in each protective component is defined as n, and n is a positive integer greater than 1; wherein each protective component is n-fold rotationally symmetric with respect to the center line of the corresponding wafer groove.

[0024] Preferably, n is further limited to between 3 and 15.

[0025] In summary, the rotary epitaxial device and wafer carrier assembly disclosed in the embodiments of the present invention are configured with at least one blocking part that meets the default conditions (e.g., the limiting distance is less than the wafer radius, but greater than or equal to 95% of the wafer radius) in the inner section (or top edge of the wafer slot) of each wafer slot, thereby configuring at least one of the protective components with almost no impact on the epitaxial operation, thereby effectively reducing the possibility of the wafer detaching from the wafer carrier assembly (or flying off).

[0026] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0027] Figure 1 This is a three-dimensional schematic diagram of the rotary epitaxial device according to Embodiment 1 of the present invention.

[0028] Figure 2 for Figure 1 An exploded view of the wafer carrier component.

[0029] Figure 3 for Figure 1 A top view of the wafer carrier component when it is not carrying a wafer.

[0030] Figure 3A for Figure 3 An enlarged schematic diagram of region IIIA.

[0031] Figure 4 for Figure 1 A schematic cross-sectional view along section line IV-IV.

[0032] Figure 4A for Figure 4 An enlarged schematic diagram of the IVA region.

[0033] Figure 5 for Figure 4 Another form of sectional view.

[0034] Figure 5A for Figure 5 An enlarged schematic diagram of the VA region.

[0035] Figure 6 for Figure 4 Another form of sectional view.

[0036] Figure 6A for Figure 6 An enlarged diagram of the VIA region.

[0037] Figure 7 for Figure 3 Another form of top-down diagram.

[0038] Figure 7A for Figure 7 An enlarged schematic diagram of region VIIA.

[0039] Figure 8 for Figure 3 Another form of top-down diagram.

[0040] Figure 8A for Figure 8 An enlarged schematic diagram of region VIIIA.

[0041] Figure 9 This is a three-dimensional schematic diagram of the wafer carrier component according to Embodiment 2 of the present invention.

[0042] Figure 10 for Figure 9 A schematic diagram of its breakdown.

[0043] Figure 11 for Figure 9 A top-down view of the wafer without support.

[0044] Figure 11A for Figure 11 An enlarged schematic diagram of the XIA region.

[0045] Figure 12 for Figure 9 A cross-sectional view along section line XII-XII.

[0046] Figure 12A for Figure 12 An enlarged schematic diagram of the XIIA region.

[0047] Figure 13 for Figure 12 Another form of sectional view.

[0048] Figure 13A for Figure 13 An enlarged schematic diagram of region XIIIA. Detailed Implementation

[0049] The following specific embodiments illustrate the implementation of the "rotational epitaxial wafer device and wafer carrier assembly" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0050] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0051] [Example 1]

[0052] Please see Figures 1 to 8A As shown, this is an embodiment of the present invention. Figure 1 As shown, this embodiment discloses a rotary epitaxial wafer 1000, which includes a device body 200, a support plate 1 mounted on the device body 200, and a protective member 2 detachably mounted on the support plate 1, but is not limited thereto. In this embodiment, the device body 200 defines a rotation axis L1, and the support plate 1 (top surface 11) is generally circular with its center 111 located on the rotation axis L1, so that the device body 200 can drive the support plate 1 to rotate about the rotation axis L1 along a rotation direction 100 (e.g., ...). Figure 1 Rotate counterclockwise.

[0053] It should be noted that the carrier disk 1 and the protective component 2 can also be collectively referred to as a wafer carrier assembly 100 in this embodiment. Although the wafer carrier assembly 100 is described in conjunction with the device body 200, the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the wafer carrier assembly 100 can also be used independently (e.g., for sale) or in conjunction with other devices. The various components of the wafer carrier assembly 100 will be described first, and then the connection relationships between the various components will be described as appropriate.

[0054] like Figures 2 to 4AAs shown, the carrier disk 1 has a plurality of wafer slots 12 recessed from the top surface 11, and an assembly slot 13 located inside the plurality of wafer slots 12. Preferably, the plurality of wafer slots 12 are arranged at equal intervals, and the assembly slot 13 is annular and surrounds the center 111 of the top surface 11 (that is, the center of the assembly slot 13 also falls on the rotation axis L1, or overlaps with the center 111), but the present invention is not limited thereto.

[0055] To facilitate understanding of this embodiment, the number of the plurality of wafer trenches 12 and their corresponding configurations (e.g., the blocking portion 21 described below) are presented and described in three in the drawings, but the present invention is not limited thereto. That is, in other embodiments of the present invention not shown, the number of the plurality of wafer trenches 12 and their corresponding configurations can be adjusted and varied according to design requirements (e.g., five).

[0056] Furthermore, since the plurality of wafer trenches 12 adopt substantially the same structure in this embodiment, for ease of explanation, only the structure of one wafer trench 12 will be described below, but the present invention is not limited thereto. In other embodiments of the present invention not shown, the structures of the plurality of wafer trenches 12 may also differ slightly.

[0057] In this embodiment, when viewed from the top view angle of the carrier disk 1 (e.g.: Figure 3 and Figure 3A The carrier disk 1 can be defined by two tangent lines L1211 through the center 111 of the top surface 11 and the top edge 121 of the wafer trench 12. The top edge 121 of the wafer trench 12 has an inner segment 1211, which is adjacent to the center 111 and located between the two tangent lines L1211.

[0058] In addition, such as Figures 2 to 4A As shown, the wafer trench 12 is defined by a center line L12 perpendicular to its bottom 122 and passing through the center of the top edge 121. The wafer trench 12 is also defined by a predetermined radial direction P12 passing through its center line L12 and the center 111 of the carrier disk 1. The center line L12 of the wafer trench 12 is separated from the top edge 121 by a trench radius D12, and the radius of the bottom 122 is not less than (e.g., greater than) the trench radius D12.

[0059] In other words, the wafer trench 12 includes a receiving region 123 and a buffer region 124 located between the top surface 11 and the receiving region 123. The receiving region 123 has the trench bottom 122 and is used to receive a wafer W therein, and the buffer region 124 is connected to the receiving region 123 and has the trench top edge 121.

[0060] In this embodiment, the protective member 2 has a plurality of blocking portions 21 and a mounting portion 22 connected to the plurality of blocking portions 21. The protective member 2 can be detachably mounted on the carrier plate 1 by the cooperation of the mounting portion 22 with the assembly groove 13, so that the plurality of blocking portions 21 respectively cross the inner tangent segments 1211 of the plurality of wafer grooves 12, but are not within the receiving area 123 of the corresponding wafer groove 12.

[0061] In other words, in this embodiment, each of the blocking portions 21 does not directly contact the wafer W placed within the corresponding wafer trench 12, thereby effectively reducing the contact area between the blocking portion 21 and the wafer W, and thus not completely suppressing the warpage of the wafer W. Furthermore, each of the blocking portions 21 is separated from the center line L12 of the corresponding wafer trench 12 by a limiting distance D21, which is less than the trench radius D12 of the corresponding wafer trench 12, but greater than or equal to 95% of the trench radius D12.

[0062] It should be further noted that the airflow generated by the device body 200 during operation mostly flows from top to bottom toward the center 111 of the support disk 1, and then flows along the top surface 11 of the support disk 1. Therefore, the inner section 1211 of each wafer trench 12 intersects the direction of the airflow at a large angle, making it easier for the wafer W portion adjacent to the inner section 1211 to be blown up by the airflow.

[0063] As described above, in this embodiment, the wafer carrier assembly 100 is configured with a blocking portion 21 that meets the default conditions (e.g., the limiting distance D21 is less than the groove radius D12, but greater than or equal to 95% of the groove radius D12) in the inner segment 1211 of each wafer slot 12, thereby configuring the protective member 2 with almost no impact on the epitaxial operation, and thus effectively reducing the possibility of the wafer W detaching from the wafer carrier assembly 100 (or flying off).

[0064] Furthermore, since the plurality of blocking portions 21 employ substantially the same structure in this embodiment, for ease of explanation, only the structure of one blocking portion 21 and its connection relationship with the corresponding wafer trench 12 will be described below, but the present invention is not limited thereto. In other embodiments of the present invention not illustrated, the structures of the plurality of blocking portions 21 may also differ slightly.

[0065] In this embodiment, in order to reduce the impact of the protective member 2 on the epitaxial operation and effectively prevent the wafer W from detaching, the blocking part 21 preferably has at least a portion having the following technical features.

[0066] like Figure 4 and Figure 4A As shown, the blocking portion 21 protrudes from the top surface 11 of the carrier disk 1 at a distance D21' less than or equal to 3 millimeters (mm) from the top edge 121 of the wafer trench 12; that is, the blocking portion 21 falls above the buffer area 124 at the distance D21'. Furthermore, along the direction parallel to the center line L12 (e.g., the thickness direction T), the blocking portion 21 is separated from the receiving area 123 of the wafer trench 12 by a spacing G, which is preferably greater than 0 and less than or equal to 5% of the trench radius D12.

[0067] Furthermore, in this embodiment Figure 4 and Figure 4A In this case, the blocking portion 21 is not located within the buffer region 124 corresponding to the wafer trench 12, but the present invention is not limited thereto. For example, as Figure 5 and Figure 5A As shown, in order to further reduce the contact area between the blocking part 21 and the wafer W, the bottom edge of the blocking part 21 may be formed with an arc-shaped protrusion 211, which is located in the buffer area 124 of the wafer trench 12, but not within the receiving area 123 of the wafer trench 12.

[0068] To put it another way, such as Figures 2 to 4A As shown, the blocking portion 21 covers up to 25% of the top edge 121 of the wafer trench 12 along a direction parallel to the center line L12 (e.g., the thickness direction T). The blocking portion 21 has a central angle σ21 relative to the center line L12 of the wafer trench 12, preferably greater than 0 degrees and less than or equal to 5 degrees, and is disposed above the predetermined radial direction P12 of the wafer trench 12. For example, if the central angle of the top edge 121 is 360 degrees, then when the central angle σ21 of the blocking portion 21 is 5 degrees, the blocking portion 21 covers approximately 1.4% of the top edge 121 of the trench along the thickness direction T (i.e., 5 degrees / 360 degrees).

[0069] In other words, in this embodiment, the wafer carrier assembly 100, through the structural design of the blocking portion 21 and the constraints of its location, effectively prevents the wafer W from detaching by providing only a single blocking portion 21 to each wafer slot 12. However, this invention is not limited to this. For example, in other embodiments not illustrated in this invention, any wafer slot 12 may be configured with such... Figure 3 and Figure 3A In addition to the single blocking portion 21 shown, other blocking portions are further provided.

[0070] The plurality of blocking portions 21 may be a single-piece graphite structure integrally connected to the outer edge of the mounting portion 22, and the protective member 2 preferably has a height H2 of less than or equal to 1.5 mm relative to the top surface 11 of the bearing plate 1, but the present invention is not limited thereto. Furthermore, as Figure 6 and Figure 6A As shown, in order to avoid the mounting part 22 from obstructing the flow of airflow, the mounting part 22 may further have a guide surface 221 away from the blocking part 21, which is separated from the top surface 11 by a guide angle σ221 of less than or equal to 45 degrees.

[0071] Furthermore, such as Figures 2 to 4A As shown, the mounting part 22 is screwed in a direction R2 opposite to the rotation direction 100 (e.g.: Figure 3 The protective component 2 is screwed clockwise onto the mounting plate 1 (the assembly slot 13) and surrounds the outer side of the center 111 to prevent the protective component 2 from becoming loose relative to the mounting plate 1 during rotation by the device body 200, but this is not a limitation. For example, such as Figure 7 and Figure 7A As shown, the mounting part 22 can also be screwed into the center 111 of the bearing plate 1 along the screwing direction R2.

[0072] More specifically, in this embodiment, the mounting part 22 includes a screw-locking ring 222 and an operating ring 223 that are rotatable relative to each other. The screw-locking ring 222 is screwed onto the bearing plate 1 (e.g., the assembly groove 13). The outer edge of the operating ring 223 is connected to a plurality of the blocking parts 21, and the operating ring 223 is sleeved on the outside of the screw-locking ring 222 so that the operating ring 223 can rotate relative to the screw-locking ring 222 about the rotation axis L1.

[0073] Furthermore, the operating ring 223 can be pressed against the screw-locking ring 222 in a direction parallel to the rotation axis L1 (e.g., the thickness direction T) to move from a disengaged position to an engaged position (e.g., ...). Figure 4 and Figure 4A Specifically, when the operating ring 223 is in the disengaged position, the locking ring 222 can only be pushed by the operating ring 223 rotating along the locking direction R2; when the operating ring 223 is in the engaged position, the locking ring 222 can be pushed by the operating ring 223 rotating along the rotation direction 100 or the locking direction R2. Accordingly, the wafer carrier assembly 100 can further prevent the protective member 2 from becoming loose relative to the carrier disk 1 during the rotation of the device body 200.

[0074] It should be noted that the protective component 2 described above is a single-piece structure in which one mounting part 22 connects multiple blocking parts 21. However, the structure of the protective component 2 can be adjusted and changed according to design requirements. For example, such as Figure 8 and Figure 8A As shown, the protective member 2 may have a plurality of mounting portions 22 spaced apart from each other, each connected to a plurality of blocking portions 21. Each mounting portion 22 is screwed into the carrier plate 1 in the screwing direction R2. That is, the protective member 2 may comprise a plurality of components, preferably equal to the number of the plurality of wafer trenches 12.

[0075] [Example 2]

[0076] Please see Figures 9 to 13A As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0077] In this embodiment, as Figure 9 and Figure 10 As shown, the wafer carrier assembly 100 includes a carrier disk 1 and a plurality of protective members 2 each detachably mounted on the carrier disk 1. It should be noted that the structure of the carrier disk 1 is generally the same as that described in Embodiment 1 above, except that the carrier disk 1 has a plurality of assembly slots 13; wherein each assembly slot 13 surrounds the outside of a wafer slot 12, and the center of each assembly slot 13 falls on the centerline L12 of the corresponding wafer slot 12.

[0078] Furthermore, since the multiple protective components 2 adopt approximately the same structure in this embodiment, for ease of explanation, only the structure of one protective component 2 and its connection relationship with the corresponding assembly slot 13 will be described below, but the present invention is not limited thereto. In other embodiments of the present invention not shown, the structures of the multiple protective components 2 may also differ slightly.

[0079] like Figures 10 to 12A As shown, the protective member 2 has an annular mounting portion 22 and a plurality of blocking portions 21 (at intervals) connected to the inner edge of the mounting portion 22. In this embodiment, the plurality of blocking portions 21 may be a single-piece graphite structure integrally connected to the mounting portion 22, and the protective member 2 preferably has a height H2 of less than or equal to 1.5 mm relative to the top surface 11 of the support plate 1, but the present invention is not limited thereto.

[0080] Furthermore, the mounting portion 22 is screwed onto the mounting tray 1 (the assembly slot 13), and the mounting portion 22 surrounds the outer side of one of the wafer slots 12. A plurality of blocking portions 21 cross the top edge 121 of the wafer slot 12, but are not within the receiving area 123 of the wafer slot 12. Each blocking portion 21 is separated from the centerline L12 of the wafer slot 12 by a limiting distance D21, which is less than the corresponding slot radius D12 of the wafer slot 12, but greater than or equal to 95% of the slot radius D12.

[0081] Accordingly, in this embodiment, the wafer carrier assembly 100 is configured with a plurality of blocking portions 21 in each wafer slot 12 that meet default conditions (e.g., the limiting distance D21 is less than the slot radius D12, but greater than or equal to 95% of the slot radius D12). This allows the protective element 2 to be configured with minimal impact on the epitaxial operation, thereby effectively reducing the possibility of the wafer W detaching from the wafer carrier assembly 100 (or flying off). Furthermore, the construction of the protective element 2 of the wafer carrier assembly 100 allows the positions of its plurality of blocking portions 21 to be free from the indentation section as described in Embodiment 1.

[0082] In this embodiment, in order to reduce the impact of the protective member 2 on the epitaxial operation and effectively prevent the wafer W from detaching, the plurality of blocking portions 21 of the protective member 2 preferably have at least some of the following technical features.

[0083] The number of the plurality of blocking portions 21 of the protective member 2 is defined as n, where n is a positive integer greater than 1. Preferably, the protective member 2 is n-fold rotational symmetric with respect to the center line L12 of the wafer trench 12, and n can be further limited to between 3 and 15.

[0084] More specifically, the plurality of blocking portions 21 of the protective member 2 shield up to 25% of the top edge 121 of the corresponding wafer trench 12 along a direction parallel to the center line L12 (e.g., the thickness direction T). Furthermore, the plurality of blocking portions 21 of the protective member 2 have a sum of central angles relative to the center line L12 of the corresponding wafer trench 12 (e.g., the sum of the plurality of central angles σ21), which is greater than 0 degrees and less than or equal to 75 degrees. For example, if the central angle of the top edge 121 is 360 degrees, then when the sum of the central angles of the plurality of blocking portions 21 is 75 degrees, the plurality of blocking portions 21 shield approximately 20.8% of the top edge 121 of the trench along the thickness direction T (i.e., 75 degrees / 360 degrees).

[0085] Furthermore, the structure of the mounting portion 22 in this embodiment is preferably similar to that of Embodiment 1 described above. Figure 4 As shown. Specifically, as Figures 10 to 12A As shown, in this embodiment, the mounting part 22 includes a screw-locking ring 222 and an operating ring 223 that are rotatable relative to each other. The screw-locking ring 222 is screwed onto the bearing plate 1 (e.g., the assembly groove 13) along the screw-locking direction R2. The operating ring 223 (with its inner edge) is connected to a plurality of the blocking parts 21, and the operating ring 223 is sleeved on the outer side of the screw-locking ring 222 so that the operating ring 223 can rotate relative to the screw-locking ring 222 about the center line L12.

[0086] Furthermore, the operating ring 223 can be pressed against the screw-locking ring 222 in a direction parallel to the rotation axis L1 (e.g., the thickness direction T) to move from a disengaged position to an engaged position (e.g., ...). Figure 12 Specifically, when the operating ring 223 is in the disengaged position, the locking ring 222 can only be pushed by the operating ring 223 rotating along the locking direction R2; when the operating ring 223 is in the engaged position, the locking ring 222 can be pushed by the operating ring 223 rotating along the rotation direction 100 or the locking direction R2. Accordingly, the wafer carrier assembly 100 can further prevent the protective member 2 from becoming loose relative to the carrier disk 1 during the rotation of the device body 200.

[0087] In addition, such as Figure 13 and Figure 13A As shown, in order to avoid the mounting part 22 from obstructing the flow of air, the mounting part 22 in this embodiment may further have a guide surface 221 away from the blocking part 21, which is separated from the top surface 11 of the bearing plate 1 by a guide angle σ221 of less than or equal to 45 degrees, but is not limited thereto.

[0088] [Technical Effects of the Embodiments of the Invention]

[0089] In summary, the rotary epitaxial device and wafer carrier assembly disclosed in the embodiments of the present invention are configured with at least one blocking part that meets the default conditions (e.g., the limiting distance is less than the wafer radius, but greater than or equal to 95% of the wafer radius) in the inner section (or top edge of the wafer slot) of each wafer slot, thereby configuring at least one of the protective components with almost no impact on the epitaxial operation, thereby effectively reducing the possibility of the wafer detaching from the wafer carrier assembly (or flying off).

[0090] The above-disclosed content is only a preferred and feasible embodiment of the present invention and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A rotary epitaxial wafer, characterized in that, The rotary epitaxial device includes: A carrier disk has a plurality of wafer slots recessed from its top surface, and the carrier disk can define two tangent lines through the center of the top surface and the top edge of each wafer slot; wherein the top edge of each wafer slot has an inner tangent segment adjacent to the center and located between the two tangent lines; the centerline of each wafer slot is separated from the top edge by a slot radius; wherein each wafer slot includes: A receiving area for housing a wafer therein; and A buffer region is located between the top surface and the receiving region, and the buffer region is connected to the receiving region and has the top edge of the groove; A protective member, detachably mounted to the carrier tray; wherein the protective member has a plurality of blocking portions, each spanning the inner segments of a plurality of wafer trenches but not within the receiving area of ​​the corresponding wafer trench; wherein each blocking portion is spaced from the centerline of the corresponding wafer trench by a limiting distance less than the trench radius of the corresponding wafer trench but greater than or equal to 95% of the trench radius; and A device body is defined with a rotation axis, and the support disk is mounted on the device body; wherein the center of the support disk is located on the rotation axis, so that the device body can drive the support disk to rotate in a rotation direction about the rotation axis.

2. The rotary epitaxial wafer according to claim 1, characterized in that, The protective component has a plurality of mounting portions spaced apart from each other, the plurality of mounting portions being connected to a plurality of blocking portions respectively, and each mounting portion being screwed onto the bearing plate in a screwing direction opposite to the rotation direction.

3. The rotary epitaxial wafer according to claim 1, characterized in that, The protective member has a mounting portion connecting the plurality of the blocking portions, and the mounting portion is screwed to the center of the bearing disk along the rotation axis in a screwing direction opposite to the rotation direction.

4. The rotary epitaxial wafer according to claim 1, characterized in that, The protective member has a mounting portion that connects a plurality of the blocking portions, and the mounting portion is screwed onto the bearing plate in a screwing direction opposite to the rotation direction and surrounds the outer side of the center.

5. The rotary epitaxial wafer according to claim 4, characterized in that, The mounting portion has a guide surface away from the blocking portion, and the guide surface and the top surface are separated by a guide angle of less than or equal to 45 degrees.

6. The rotary epitaxial wafer according to claim 4, characterized in that, The mounting part includes: A screw-locking ring body, which is screwed onto the bearing plate; and An operating ring body is connected to a plurality of said blocking parts, and the operating ring body can be pressed against the screw-locking ring body in a direction parallel to the rotation axis to move from a disengaged position to an engaged position; Specifically, when the operating ring is in the separated position, the screw-locking ring can only be pushed by the operating ring rotating along the screw-locking direction; when the operating ring is in the engaged position, the screw-locking ring can be pushed by the operating ring rotating along the rotation direction or the screw-locking direction.

7. The rotary epitaxial wafer according to claim 1, characterized in that, Each of the aforementioned blocking portions is not located within the buffer area corresponding to the wafer trench.

8. A wafer carrier component, characterized in that, The wafer carrier assembly includes: A carrier disk has a plurality of wafer slots recessed from its top surface, and the carrier disk can define two tangent lines through the center of the top surface and the top edge of each wafer slot; wherein the top edge of each wafer slot has an inner tangent segment adjacent to the center and located between the two tangent lines; the centerline of each wafer slot is separated from the top edge by a slot radius; wherein each wafer slot includes: A receiving area for housing a wafer therein; and A buffer region located between the top surface and the receiving region, the buffer region communicating with the receiving region and having the top edge of the groove; and A protective component is detachably mounted on the carrier tray; wherein the protective component has a plurality of blocking portions, each of the blocking portions crossing the inner segments of a plurality of wafer trenches but not within the receiving area of ​​the corresponding wafer trench; wherein each of the blocking portions is spaced from the center line of the corresponding wafer trench by a limiting distance, which is less than the trench radius of the corresponding wafer trench but greater than or equal to 95% of the trench radius.

9. The wafer carrier assembly according to claim 8, characterized in that, Each of the blocking portions has a central angle relative to the centerline of the corresponding wafer trench, which is greater than 0 degrees and less than or equal to 5 degrees.

10. The wafer carrier assembly according to claim 8, characterized in that, Each of the wafer trenches is defined with a predetermined radial direction passing through the center line and the center of the circle, and each of the blocking portions is disposed on the predetermined radial direction corresponding to the wafer trench.

11. The wafer carrier assembly according to claim 8, characterized in that, Each of the blocking portions shields up to 25% of the top edge of the corresponding wafer trench along a direction parallel to any of the center lines.

12. The wafer carrier assembly according to claim 8, characterized in that, Along a direction parallel to any of the center lines, each of the blocking portions is separated from the receiving area of ​​the corresponding wafer trench by a gap greater than 0 and less than or equal to 5% of the trench radius.

13. The wafer carrier assembly according to claim 8, characterized in that, The blocking portion has an arc-shaped protrusion located in the buffer area corresponding to the wafer trench, but not within the receiving area corresponding to the wafer trench.

14. The wafer carrier assembly according to claim 8, characterized in that, Each of the blocking portions protrudes from the top surface at a distance of less than or equal to 3 mm from the top edge of the corresponding wafer trench, and the protective member has a height of less than or equal to 1.5 mm relative to the top surface of the carrier disk.

15. A wafer carrier component, characterized in that, The wafer carrier assembly includes: A carrier disk having a plurality of wafer slots recessed from its top surface; wherein the centerline of each wafer slot is separated from its top edge by a slot radius; wherein each wafer slot includes: A receiving area for housing a wafer therein; and A buffer region located between the top surface and the receiving region, the buffer region communicating with the receiving region and having the top edge of the groove; and Multiple protective components, each detachably mounted to the carrier plate; wherein each of the protective components has: A mounting portion, which is annular and screwed onto the carrier disk, and the mounting portion surrounds the outer side of one of the wafer trenches; and Multiple blocking portions are connected to the inner edge of the mounting portion, and the multiple blocking portions cross the top edge of the corresponding wafer trench, but are not within the receiving area of ​​the corresponding wafer trench; Each of the blocking portions is separated from the center line of the corresponding wafer trench by a limiting distance, which is less than the trench radius of the corresponding wafer trench but greater than or equal to 95% of the trench radius.

16. The wafer carrier assembly according to claim 15, characterized in that, The mounting part includes: A screw-locking ring body, which is screwed onto the bearing plate along a screw-locking direction; and An operating ring body is connected to a plurality of said blocking parts, and the operating ring body can be pressed against the screw-locking ring body in a direction parallel to any one of said center lines, so as to move from a disengaged position to an engaged position; Specifically, when the operating ring is in the separated position, the screw-locking ring can only be pushed by the operating ring rotating along the screw-locking direction; when the operating ring is in the engaged position, the screw-locking ring can be pushed by the operating ring rotating along the screw-locking direction or in a rotational direction opposite to the screw-locking direction.

17. The wafer carrier assembly according to claim 15, characterized in that, In each of the protective elements, the plurality of the blocking portions have a sum of central angles relative to the center line of the corresponding wafer trench, which is greater than 0 degrees and less than or equal to 75 degrees.

18. The wafer carrier assembly according to claim 15, characterized in that, In each of the protective elements, a plurality of the blocking portions shield up to 25% of the top edge of the corresponding wafer trench along a direction parallel to any one of the center lines.

19. The wafer carrier assembly according to claim 15, characterized in that, The number of the plurality of blocking portions of each of the protective elements is defined as n, where n is a positive integer greater than 1; wherein each of the protective elements is n-fold rotationally symmetric with respect to the center line of the corresponding wafer trench.

20. The wafer carrier assembly according to claim 19, characterized in that, n is further limited to between 3 and 15.

Images