Wafer flipping device

Abstract

The present application relates to a kind of wafer turnover device, it includes wafer fixing assembly.Wafer fixing assembly includes material feeding assembly, material taking assembly and connecting frame, material feeding assembly includes material feeding position fixing frame, material feeding chuck, electromagnetic locking device and magnetic spring, material taking assembly includes material taking position fixing frame, voice coil motor, wafer receiving column support and wafer receiving column.Electromagnetic locking device is used to make material feeding position fixing frame and material feeding chuck keep relative fixed before and during turnover, and magnetic spring is used to offset the sum of the gravity of magnetic spring moving end, material feeding chuck and wafer adsorbed to material feeding chuck after wafer turnover action is completed to make it in suspended state.The present application is through electromagnetic locking device cooperation magnetic spring to deal with the height difference when wafer turnover is followed by the next process, and through the up and down of wafer receiving column, the stable accurate receiving after wafer turnover action is completed is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to a turnover device, in particular to a wafer turnover device. BACKGROUND

[0002] In the process of wafer manufacturing, testing, processing, packaging and other processes, accurate, efficient and non-destructive turnover of the wafer is required. The existing wafer turnover device has some limitations in the turnover process, mainly including the following aspects:

[0003] First, the existing wafer turnover device has a certain height difference when the wafer completes the turnover and connects to the next process, which increases the risk of wafer damage during handover.

[0004] Second, the existing wafer turnover device cannot meet the high-precision requirements, and small deviations may cause damage to the wafer surface, affecting the accuracy of subsequent processes and thus reducing product quality and yield.

[0005] Third, the existing wafer turnover device lacks flexibility in adapting to different sizes and specifications of wafers, and many devices can only be used for specific sizes and types of wafers, limiting their application range.

[0006] Fourth, the existing wafer turnover device has a complex structure, which not only increases the manufacturing and maintenance costs, but also is prone to failure during operation, affecting the continuity of production, and the operation is complicated, requiring multiple complex steps to complete the wafer turnover, which undoubtedly reduces production efficiency and increases labor and time costs.

[0007] Therefore, it is necessary to improve the wafer turnover device. SUMMARY

[0008] To solve at least one of the above technical problems, the present application provides a wafer turnover device.

[0009] The wafer turnover device comprises:

[0010] The wafer fixing assembly comprises a feeding assembly, a taking assembly and a connecting frame, the feeding assembly comprises a feeding position fixing frame, a feeding chuck, an electromagnetic locking device and a magnetic spring; the feeding chuck is used to adsorb the wafer placed thereon; the electromagnetic locking device comprises an electromagnetic locking fixed end and an electromagnetic locking movable end, the electromagnetic locking fixed end is arranged on the feeding position fixing frame, the electromagnetic locking movable end is connected with the feeding chuck, the electromagnetic locking movable end and the electromagnetic locking fixed end can be attracted and locked to keep the feeding chuck and the feeding position fixing frame relatively fixed, and can be released from the attraction and locking to release the relative fixing relationship between the feeding chuck and the feeding position fixing frame; the magnetic spring comprises a magnetic spring fixed end and a magnetic spring movable end, the magnetic spring fixed end is arranged on the feeding position fixing frame, the magnetic spring movable end is connected with the feeding chuck, the magnetic spring offsets the gravity of the magnetic spring movable end, the gravity of the feeding chuck and the gravity of the wafer adsorbed by the feeding chuck through the magnetic force between the magnetic spring fixed end and the magnetic spring movable end, and thus the magnetic spring movable end, the feeding chuck and the wafer are in a suspended state when the electromagnetic locking movable end and the electromagnetic locking fixed end are released from the attraction and locking; the taking assembly comprises a taking position fixing frame, a voice coil motor, a wafer receiving column support and a wafer receiving column; the voice coil motor is arranged on the taking position fixing frame and is used to drive the wafer receiving column support to move up and down, the wafer receiving column is arranged on the wafer receiving column support and is used to receive the wafer in the suspended state; the feeding position fixing frame and the taking position fixing frame are connected with the connecting frame. In short, the electromagnetic locking device is used to keep the feeding position fixing frame and the feeding chuck relatively fixed before and during the turning over, and the magnetic spring is used to offset the gravity of the magnetic spring movable end, the feeding chuck and the wafer thereon to make them in the suspended state after the wafer turning over action is completed. The height difference occurring when the wafer is connected to the next process after the wafer turning over is solved by the electromagnetic locking device cooperating with the magnetic spring, and the stable and accurate receiving of the wafer after the wafer turning over action is completed is realized by the up and down movement of the wafer receiving column.

[0011] In some embodiments, the device skeleton is further included, which comprises a bottom plate and a support frame, the support frame is arranged on the bottom plate; the turning over driving assembly comprises a synchronous wheel assembly, a synchronous belt, a turning over motor, a turning over motor support and a connecting shaft; the connecting shaft is arranged on the support frame, the turning over motor is fixed on the bottom plate through the turning over motor support arranged on the bottom plate; the synchronous wheel assembly comprises a first synchronous wheel and a second synchronous wheel, the first synchronous wheel is arranged on the turning over motor, the second synchronous wheel is arranged on the connecting shaft, and the first synchronous wheel and the second synchronous wheel are connected with the synchronous belt; the connecting frame is connected with the connecting shaft, the turning over motor drives the synchronous wheel assembly, the synchronous belt and the connecting shaft to rotate in transmission connection, and thus the wafer fixing assembly is synchronously rotated to realize the turning over of the wafer.

[0012] In some embodiments, the number of wafer receiving columns is at least 3.

[0013] In some embodiments, the wafer receiving column is a vacuum suction, and a surface of the wafer receiving column in contact with the wafer is provided with a vacuum suction hole.

[0014] In some embodiments, the voice coil motor includes a voice coil motor fixed end and a voice coil motor moving end, the voice coil motor fixed end is arranged on the material taking position fixed frame, and the voice coil motor moving end is connected with the wafer receiving column support.

[0015] In some embodiments, a grating ruler is arranged on the magnetic spring, and the grating ruler includes a ruler grating and an indicating grating; one of the ruler grating and the indicating grating is arranged on the magnetic spring fixed end, and the other is arranged on the magnetic spring moving end, so as to determine whether the wafer receiving column has contacted the wafer by whether the reading of the grating ruler changes.

[0016] In some embodiments, a control module is further included; the control module is connected with the electromagnetic locking device and the magnetic spring signal, and is used to regulate the magnetic force between the magnetic spring fixed end and the magnetic spring moving end after the wafer is turned over, so that the magnetic force is sufficient to offset the sum of the gravity of the magnetic spring moving end, the gravity of the material releasing suction disc, and the gravity of the wafer adsorbed by the material releasing suction disc, and the control module is used to release the suction locking of the electromagnetic locking moving end and the electromagnetic locking fixed end in response, so that the magnetic spring moving end, the material releasing suction disc and the wafer are in a suspended state. In this paper, “in response” means that the control module starts to release the suction locking of the electromagnetic locking moving end and the electromagnetic locking fixed end after the condition that the magnetic force between the magnetic spring fixed end and the magnetic spring moving end is sufficient to offset the sum of the gravity of the magnetic spring moving end, the gravity of the material releasing suction disc, and the gravity of the wafer adsorbed by the material releasing suction disc is met, so that the magnetic spring moving end, the material releasing suction disc and the wafer are in a suspended state without causing accidents caused by the premature release of the suction locking of the electromagnetic locking moving end and the electromagnetic locking fixed end.

[0017] In some embodiments, the control module is connected with the turning motor signal, and is used to control the turning motor.

[0018] In some embodiments, the control module is connected with the voice coil motor signal, and is used to control the voice coil motor.

[0019] In some embodiments, the control module is connected with the grating ruler and the material releasing suction disc respectively, and is used to weaken or close the adsorption force of the material releasing suction disc to the wafer when the reading change of the grating ruler is sensed, so that the wafer is separated from the material releasing suction disc and transferred to the wafer receiving column.

[0020] In some embodiments, the control module is connected with the electromagnetic locking device signal, and is used to control the suction locking of the electromagnetic locking moving end and the electromagnetic locking fixed end. In this paragraph, “control” includes keeping the suction locking state of the electromagnetic locking moving end and the electromagnetic locking fixed end, and releasing the suction locking state of the electromagnetic locking moving end and the electromagnetic locking fixed end.

[0021] In some embodiments, the control module is also connected with the magnetic spring signal for controlling the magnetic force between the fixed end of the magnetic spring and the moving end of the magnetic spring. The "control" in this paragraph includes regulating the magnitude of the magnetic force between the fixed end of the magnetic spring and the moving end of the magnetic spring, and further includes regulating the presence or absence of the magnetic force.

[0022] In some embodiments, the control module is used to cause the electromagnetic locking moving end and the electromagnetic locking fixed end to attract and lock before and during the turning of the wafer fixing assembly; is also used to control the turning motor to realize the turning of the wafer fixing assembly; is also used to regulate the magnetic force between the fixed end of the magnetic spring and the moving end of the magnetic spring after the turning of the wafer fixing assembly so that the magnetic force is sufficient to offset the sum of the gravity of the moving end of the magnetic spring, the gravity of the unloading chuck, and the gravity of the wafer adsorbed by the unloading chuck, and responsively release the attraction and locking of the electromagnetic locking moving end and the electromagnetic locking fixed end, so that the moving end of the magnetic spring, the unloading chuck, and the wafer are all in a suspended state; is also used to control the voice coil motor, specifically, the control module controls the voice coil motor to open and drive upward when the control module controls the turning motor to close, so that the wafer receiving column support moves upward, and when the reading change of the grating ruler is sensed, the upward driving of the voice coil motor is closed, at the same time, the adsorption force of the unloading chuck to the wafer is weakened or closed, and the magnetic spring is controlled to be closed so that the magnetic force generated by the magnetic spring disappears, and then the voice coil motor is controlled to open and drive downward so that the wafer receiving column support moves downward, so that the wafer receiving column contacts the wafer and completes the receiving action; is also used to weaken or close the adsorption force of the unloading chuck to the wafer when the reading change of the grating ruler is sensed, so that the wafer is separated from the unloading chuck and transferred to the wafer receiving column.

[0023] In some embodiments, one or more of the electromagnetic locking device, the magnetic spring, the turning motor, the voice coil motor, and the unloading chuck is manually regulated in its working operation. The "manual regulation" here is set in relation to the automatic control by the "control module" mentioned above, that is, the present application can be applied to automatic control or non-automatic control. The working operation of the electromagnetic locking device refers to the attraction and locking or release of the attraction and locking of the electromagnetic locking moving end and the electromagnetic locking fixed end. The working operation of the magnetic spring includes and especially refers to regulating the magnetic force between the fixed end of the magnetic spring and the moving end of the magnetic spring so that the magnetic force is sufficient to offset the sum of the gravity of the moving end of the magnetic spring, the gravity of the unloading chuck, and the gravity of the wafer adsorbed by the unloading chuck. The working operation of the turning motor refers to the rotation of the synchronous wheel assembly, the synchronous belt, and the connecting shaft driven by the turning motor, and further refers to the synchronous rotation of the wafer fixing assembly to realize the turning of the wafer. The working operation of the voice coil motor refers to driving the wafer receiving column support to move up and down. The working operation of the unloading chuck refers to enhancing, weakening, starting, and / or closing the adsorption force of the unloading chuck to the wafer.

[0024] Compared with the prior art, the beneficial effects of the present invention are reflected in: First, the present invention adopts an electromagnetic locking device in conjunction with a magnetic spring to deal with the height difference that occurs when the wafer is flipped and connected to the next process. Specifically, before and during the flipping process, the electromagnetic locking movable end and the electromagnetic locking fixed end are attracted and locked so that the discharge suction cup and the discharge position fixing frame connected thereto remain relatively fixed. After the flipping is completed, the magnetic spring generates an upward force (that is, the magnetic force generated inside the magnetic spring) by adjusting the current flux of the magnetic spring to offset the sum of the gravity of the magnetic spring movable end, the discharge suction cup and the gravity of the wafer adsorbed thereon. At the same time, or in response to the magnetic force (sufficient to offset the sum of the gravity), the electromagnetic locking device releases the attraction and locking so that the magnetic spring movable end, the discharge suction cup and the wafer are in a suspended state and can float up and down without being squeezed when pushed by an external force. Therefore, when the wafer receiving column performs the wafer receiving action, since the moving end of the magnetic spring, the discharge suction cup and the wafer are in a suspended state, they can float slightly upward with the same amplitude as the contact of the wafer receiving column and the slight upward movement of the wafer receiving column, thereby achieving a smooth connection while ensuring that the wafer will not be squeezed upward; secondly, the present invention reduces the requirement for accuracy in the connection process by making the wafer in a suspended state, improves the fault tolerance of the connection process, and thus protects the wafer from being squeezed and damaged; thirdly, the present invention adopts a discharge component, a material picking component and a flipping drive component to realize the flipping action of the wafer, which is simple to operate, low in maintenance cost, high in work efficiency, and has no requirements on the size and type of the wafer. It adapts to wafers of different types and specifications by adjusting the electromagnetic locking device and the amount of current passing through the magnetic spring. Therefore, it is widely used and has high adaptability.

[0025] In addition, in some embodiments of the present invention, after the flipping is completed, the vacuum adsorption hole on the wafer receiving column can be used to achieve further smooth connection and firm adsorption; by setting a grating scale on the magnetic spring, the contact action of the wafer receiving column when receiving the wafer can be accurately fed back, and the design of the electromagnetic locking device and the magnetic spring can be used to avoid squeezing damage to the wafer when receiving the wafer.

[0026] The concept, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Schematic diagram of the structure of the wafer flipping device after flipping according to the first embodiment of the present invention.

[0028] Figure 2 for Figure 1 The structure diagram of the wafer flipping device before flipping is shown.

[0029] Figure 3 for Figure 1 Top view shown.

[0030] Figure 4 is a sectional view along the A-A line of Figure 3

[0031] Figure 5 is a sectional view along the B-B line of Figure 3

[0032] FIG. 1 is a schematic diagram of the device skeleton; FIG. 2 is a schematic diagram of the wafer fixing assembly; FIG. 3 is a schematic diagram of the turnover driving assembly; FIG. 4 is a schematic diagram of the wafer loading assembly; FIG. 5 is a schematic diagram of the wafer taking assembly; FIG. 6 is a schematic diagram of the connection frame; FIG. 7 is a schematic diagram of the wafer loading position fixing frame; FIG. 8 is a schematic diagram of the wafer loading suction disc; FIG. 9 is a schematic diagram of the electromagnetic locking device; FIG. 10 is a schematic diagram of the magnetic spring; FIG. 11 is a schematic diagram of the wafer taking position fixing frame; FIG. 12 is a schematic diagram of the voice coil motor; FIG. 13 is a schematic diagram of the wafer supporting column support; FIG. 14 is a schematic diagram of the wafer supporting column; FIG. 15 is a schematic diagram of the synchronous wheel assembly; FIG. 16 is a schematic diagram of the synchronous belt; FIG. 17 is a schematic diagram of the turnover motor; FIG. 18 is a schematic diagram of the turnover motor support; FIG. 19 is a schematic diagram of the connecting shaft; FIG. 20 is a schematic diagram of the first synchronous wheel; and FIG. 21 is a schematic diagram of the second synchronous wheel. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, purposes and effects of the application easy to understand, the following further describes the application in combination with specific drawings. However, the application is not limited to the following cases.

[0034] It should be understood that the structures, proportions, sizes, etc. shown in the drawings attached to the present specification are only used to cooperate with the content disclosed in the specification, to be understood and read by those skilled in the art, and do not have technical substantive significance. Any modification of the structure, change of the proportion relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the application, should still fall within the scope of the technical content disclosed by the application.

[0035] The terms such as "comprising" and "including" mean that the technical solution of the application does not exclude the presence of other components that are not directly or explicitly stated in the specification and claims.

[0036] ​​Moreover, the terms "first", "second", etc. are used herein only to describe different entities or operations, and are not used to indicate or imply relative importance or a number of the technical features indicated, or any actual relationship or order between the entities or operations. For any single technical feature described or implied in the embodiments mentioned herein, or any single technical feature shown or implied in the drawings, the present application still allows any combination or deletion between these technical features (or their equivalents) to continue without any technical obstacles, so it should be considered that more embodiments according to the present application are also within the scope of the description herein.

[0037] The present application provides a wafer flipping device, mainly used to solve the problems of the existing wafer flipping device, and provides the following technical solutions, which will be described in detail below: Figures 1-5

[0038] Embodiment 1

[0039] Figures 1-3 The wafer flipping device structure disclosed in this embodiment is shown, wherein Figure 2 Before flipping, Figure 1 After flipping, Figure 3 is a top view. In this embodiment, the wafer flipping device includes a device skeleton 1, a wafer fixing assembly 2, and a flipping driving assembly 3.

[0040] Among them, referring to Figure 1 , the device skeleton 1 includes a base 11 and a support frame 12, the support frame 12 is arranged on the base 11, the wafer fixing assembly 2 includes a feeding assembly 21, a taking assembly 22, and a connecting frame 23, the feeding assembly 21 includes a feeding position fixing frame 211, a feeding suction cup 212, an electromagnetic locking device 213, and a magnetic spring 214, the feeding suction cup 212 adsorbs and fixes the wafer placed thereon, referring to Figure 5 , the electromagnetic locking device 213 includes an electromagnetic locking fixed end 2131 and an electromagnetic locking moving end 2132, the electromagnetic locking fixed end 2131 is arranged on the feeding position fixing frame 211, the electromagnetic locking moving end 2132 is connected with the feeding suction cup 212, the electromagnetic locking device 213 functions to keep the relative fixation of the feeding suction cup 212 and the feeding position fixing frame 211 before and during the flipping of the wafer, specifically, the electromagnetic locking device 213 locks and controls the feeding position fixing frame 211 and the feeding suction cup 212 connected therewith respectively by attracting and locking the electromagnetic locking fixed end 2131 and the electromagnetic locking moving end 2132, so as to keep the relative fixation of their positions. Referring to Figure 4 ​, the magnetic spring 214 includes a magnetic spring fixed end 2141 and a magnetic spring moving end 2142, the magnetic spring fixed end 2141 is arranged on the unloading position fixed frame 211, the magnetic spring moving end 2142 is connected with the unloading chuck 212, the magnetic spring 214 functions to offset the sum of the gravity of the magnetic spring moving end 2142, the gravity of the unloading chuck 212 and the gravity of the wafer absorbed by the unloading chuck 212 through the magnetic force generated between the magnetic spring fixed end 2141 and the magnetic spring moving end 2142, so that the magnetic spring moving end 2132, the unloading chuck 212 and the wafer absorbed by the unloading chuck 212 are in a suspended state in the case that the electromagnetic locking moving end 2132 and the electromagnetic locking fixed end 2131 are released from the attraction locking, specifically, when the overturning action is completed, the magnetic spring 214 generates upward magnetic force, the magnetic force is sufficient to offset the sum of the gravity of the magnetic spring moving end 2142, the unloading chuck 212 and the wafer absorbed thereby, the electromagnetic locking device 213 responds to release the attraction locking of the electromagnetic locking fixed end 2131 and the electromagnetic locking moving end 2132, so that the relative fixed relationship between the unloading position fixed frame 211 and the unloading chuck 212 is released, at this time, the magnetic force generated by the magnetic spring 214 makes the magnetic spring moving end 2142, the unloading chuck 212 and the wafer thereon all in a suspended state. See Figure 1 , the taking component 22 includes a taking position fixed frame 221, a voice coil motor 222, a wafer supporting column support 223 and a wafer supporting column 224, see Figure 4, the voice coil motor 222 includes a voice coil motor fixed end 2221 and a voice coil motor moving end 2222, the voice coil motor fixed end 2221 is arranged on the material taking position fixed frame 221, the voice coil motor moving end 2222 is connected with the wafer supporting column support 223, the voice coil motor 222 drives the wafer supporting column support 223 to move up and down, specifically, the voice coil motor 222 drives the wafer supporting column 224 arranged on the wafer supporting column support 223 to move up and contact the wafer in the suspended state, and then the voice coil motor 222 drives the wafer supporting column support 223 to drive the wafer supporting column 224 arranged thereon to move down to complete the stable supporting action of the wafer. Further, the surface of the wafer supporting column 224 in contact with the wafer is provided with a vacuum suction hole, which further suction fixes the wafer during the supporting process. During the material taking process, when the wafer supporting column 224 moves up to contact the wafer, a slight upward force is generated on the wafer, the material taking chuck 212 and the magnetic spring moving end 2142 connected to the material taking chuck 212, since the wafer, the material taking chuck 212 and the magnetic spring moving end 2142 connected to the material taking chuck 212 are all in the suspended state without gravity and there is a gap between the material taking chuck 212 above and the material taking position fixed frame 211, and there is a gap between the magnetic spring moving end 2142 above and the magnetic spring fixed end 2141, so that the magnetic spring moving end 2142, the material taking chuck 212 and the wafer suctioned thereon can move upward with the same amplitude when the wafer supporting column 224 contacts the wafer to generate an upward force, and will not press the wafer. For different types or sizes of wafers, the current flow size of the electromagnetic locking device 213 and the magnetic spring 214 is changed to match the required magnetic force. The material taking position fixed frame 211 and the material taking position fixed frame 221 are connected with the connecting frame 23, so that the material taking position fixed frame 211 and the material taking position fixed frame 221 are synchronously turned over during the wafer turning over process. Referring to Figure 1 , the turning over driving assembly 3 includes a synchronous wheel assembly 31, a synchronous belt 32, a turning over motor 33, a turning over motor support 34 and a connecting shaft 35, the connecting shaft 35 is connected with the connecting frame 23 in the wafer fixing assembly 2, and the connecting shaft 35 is arranged on the support frame 12, one end of the connecting shaft 35 is provided with a second synchronous wheel 312, the second synchronous wheel 312 is connected with a first synchronous wheel 311 through the synchronous belt 32, and the first synchronous wheel 311 is connected with the turning over motor 33. The function of the turning over driving assembly 3 is to provide power for the turning over of the wafer fixing assembly 2. Specifically, the first synchronous wheel 311 rotates through the driving of the turning over motor 33 to drive the synchronous belt 32 and the second synchronous wheel 312 connected in transmission to rotate together, so that the connecting shaft 35 connected with the second synchronous wheel 312 rotates to drive the wafer fixing assembly 2 connected thereto to rotate synchronously, realizing the turning over action of the wafer. From Figure 2It can be seen that, before the turnover, from top to bottom in turn are wafer receiving column support 223, material taking position fixing frame 221, wafer, material placing chuck 212, material placing position fixing frame 211; one end of wafer receiving column 224 is arranged on wafer receiving column support 223, and the other end can pass through material taking position fixing frame 221 for receiving wafer after the turnover.

[0041] In normal operation, the wafer is placed on the material placing chuck 212, the material placing chuck 212 opens the vacuum adsorption to fix the wafer placed thereon, the electromagnetic locking device 213 starts to work, the electromagnetic locking fixed end 2131 and the electromagnetic locking moving end 2132 are attracted and locked, so that the material placing position fixing frame 211 and the material placing chuck 212 connected with the above two ends respectively remain relatively fixed. The turnover motor 33 drives the transmission connection of the first synchronous wheel 311, the synchronous belt 32, the second synchronous wheel 312, the connecting shaft 35 to rotate, and then drives the wafer fixing assembly 2 connected with the connecting shaft 35 to make a vertical direction turnover action. During the turnover process, the electromagnetic locking device 213 always attracts and locks the material placing position fixing frame 211 and the material placing chuck 212 to remain relatively fixed. When the turnover action rotates to 180 degrees, the magnetic spring 214 starts to work, the magnetic force between the magnetic spring fixed end 2141 and the magnetic spring moving end 2142 vertically upward, which offsets the sum of the weight of the magnetic spring moving end 2142, the material placing chuck 212 and the wafer adsorbed to the material placing chuck 212. In response, the turnover motor 33 stops working, the electromagnetic locking device 213 releases the attraction and locking of the material placing position fixing frame 211 and the material placing chuck 212, and the magnetic spring moving end 2142, the material placing chuck 212 and the wafer adsorbed to the material placing chuck 212 all enter the suspended state. Thereafter, the voice coil motor 222 starts to work, and the wafer receiving column support 223 connected to the voice coil motor moving end 2222 is driven to move upward, so that the wafer receiving column 224 arranged on the wafer receiving column support 223 contacts the wafer. Since there is a distance between the material placing chuck 212 and the material placing position fixing frame 211, and there is a distance between the magnetic spring moving end 2142 and the magnetic spring fixed end 2141, when the wafer receiving column 224 contacts the wafer, the magnetic spring moving end 2142, the material placing chuck 212 and the wafer adsorbed to the material placing chuck will produce a slight floating with the same amplitude as the wafer receiving column 224 is slightly pushed upward, so as to eliminate the height difference generated when the wafer is received, and avoid damage to the wafer caused by extrusion. At this time, the voice coil motor 222 stops working, the adsorption of the material placing chuck 212 to the wafer is released, the magnetic spring 214 stops working, and the upward magnetic force generated by the magnetic spring 214 disappears. The wafer receiving column 224 opens the vacuum adsorption, adsorbs the wafer in contact therewith to the surface of the wafer receiving column 224, and then the voice coil motor 222 starts to work, drives the wafer receiving column support 223 to descend, thereby realizing the stable transfer of the wafer after the turnover.

[0042] Example 2

[0043] In the present embodiment, the number of wafer receiving columns is set to be more than 3, and the rest is the same as that of Embodiment 1.

[0044] Embodiment 3

[0045] In the present embodiment, a grating ruler is arranged on the magnetic spring, the grating ruler includes a scale grating and an indicating grating, one of the scale grating and the indicating grating is arranged on the fixed end of the magnetic spring, and the other is arranged on the moving end of the magnetic spring, so as to judge whether the wafer receiving column has contacted the wafer by whether the reading of the grating ruler changes, and the rest is the same as that of Embodiment 1.

[0046] Embodiment 4

[0047] In the present embodiment, a control module is further included, the control module is connected with the electromagnetic locking device, the magnetic spring, the overturning motor, the voice coil motor, the grating ruler and the unloading chuck respectively, specifically, the wafer is placed on the unloading chuck, the control module controls the unloading chuck to open the vacuum adsorption to fix the wafer placed thereon, at the same time, the control module controls the electromagnetic locking moving end and the electromagnetic locking fixed end to open the suction and locking to make the unloading chuck and the unloading position fixed frame keep relative fixation, then, the control module controls the overturning motor to open to drive the wafer to overturn, when the overturning is completed, the control module controls the overturning motor to close, and controls the magnetic spring to open, adjusts and controls the magnetic force between the magnetic spring fixed end and the magnetic spring moving end to make the magnetic force be enough to offset the sum of the gravity of the magnetic spring moving end, the gravity of the unloading chuck and the gravity of the wafer adsorbed by the unloading chuck, and responsively releases the suction and locking of the electromagnetic locking moving end and the electromagnetic locking fixed end, so that the magnetic spring moving end, the unloading chuck and the wafer are all in the suspended state, then, the control module controls the voice coil motor to open to drive upwardly to make the wafer receiving column support move upwardly, and closes the upward driving of the voice coil motor when the reading change of the grating ruler is sensed, at the same time, the control module weakens or closes the adsorption force of the unloading chuck to the wafer and controls the magnetic spring to close to make the magnetic force generated by the magnetic spring disappear, so as to make the wafer separate from the unloading chuck and be transferred to the wafer receiving column, at the same time, the control module controls the voice coil motor to open to drive downwardly to make the wafer receiving column support move downwardly to complete the stable receiving of the wafer, and the rest is the same as that of Embodiment 1.

[0048] The preferred embodiments of the present application are described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and variations without creative labor based on the concept of the present application. Therefore, any technical solution obtained by logical analysis, reasoning or limited experiment based on the prior art according to the concept of the present application shall be within the protection scope determined by the claims.

Claims

1. A wafer flipping device, characterized by, The application relates to a wafer fixing assembly (2) comprising a feeding assembly (21), a taking assembly (22) and a connecting frame (23), wherein the feeding assembly (21) comprises a feeding position fixing frame (211), a feeding suction disc (212), an electromagnetic locking device (213) and a magnetic spring (214); the feeding suction disc (212) is used for adsorbing a wafer placed thereon; the electromagnetic locking device (213) comprises an electromagnetic locking fixed end (2131) and an electromagnetic locking movable end (2132), the electromagnetic locking fixed end (2131) is arranged on the feeding position fixing frame (211), the electromagnetic locking movable end (2132) is connected with the feeding suction disc (212), the electromagnetic locking movable end (2132) and the electromagnetic locking fixed end (2131) can be attracted and locked to keep the feeding suction disc (212) and the feeding position fixing frame (211) relatively fixed, and can be released from the attraction and locking to release the relative fixed relationship between the feeding suction disc (212) and the feeding position fixing frame (211); the magnetic spring (214) comprises a magnetic spring fixed end (2141) and a magnetic spring movable end (2142), the magnetic spring fixed end (2141) is arranged on the feeding position fixing frame (211), the magnetic spring movable end (2142) is connected with the feeding suction disc (212), the magnetic spring (214) offsets the gravity of the magnetic spring movable end (2142), the gravity of the feeding suction disc (212) and the gravity of the wafer adsorbed by the feeding suction disc (212) through the magnetic force between the magnetic spring fixed end (2141) and the magnetic spring movable end (2142), so that the magnetic spring movable end (2142), the feeding suction disc (212) and the wafer are in a suspended state when the electromagnetic locking movable end (2132) and the electromagnetic locking fixed end (2131) are released from the attraction and locking; the taking assembly (22) comprises a taking position fixing frame (221), a voice coil motor (222), a wafer receiving column support (223) and a wafer receiving column (224); the voice coil motor (222) is arranged on the taking position fixing frame (221) and is used for driving the wafer receiving column support (223) to move up and down; the wafer receiving column (224) is arranged on the wafer receiving column support (223) and is used for receiving the wafer in the suspended state; the feeding position fixing frame (211) and the taking position fixing frame (221) are connected with the connecting frame (23). The application further relates to an equipment framework (1) comprising a bottom plate (11) and a support frame (12), wherein the support frame (12) is arranged on the bottom plate (11).

2. The wafer flip device of claim 1, wherein, ​ ​ The turnover driving assembly (3) comprises a synchronous wheel assembly (31), a synchronous belt (32), a turnover motor (33), a turnover motor support (34) and a connecting shaft (35); the connecting shaft (35) is arranged on the support frame (12), the turnover motor (33) is fixed on the bottom plate (11) through the turnover motor support (34) arranged on the bottom plate (11); the synchronous wheel assembly (31) comprises a first synchronous wheel (311) and a second synchronous wheel (312), the first synchronous wheel (311) is arranged on the turnover motor (33), the second synchronous wheel (312) is arranged on the connecting shaft (35), and the first synchronous wheel (311) and the second synchronous wheel (312) are connected with the synchronous belt (32); the connecting frame (23) is connected with the connecting shaft (35), the turnover motor (33) drives the synchronous wheel assembly (31), the synchronous belt (32) and the connecting shaft (35) to rotate in a transmission connection mode, and then the wafer fixing assembly (2) is synchronously rotated to realize turnover of the wafer.

3. The wafer flip device of claim 1, wherein, The number of the wafer supporting columns (224) is at least three.

4. The wafer flip device of claim 1, wherein, The wafer supporting columns (224) are in a vacuum adsorption mode, and a surface of the wafer supporting columns (224) in contact with the wafer is provided with vacuum adsorption holes.

5. The wafer flip device of claim 1, wherein, The voice coil motor (222) comprises a voice coil motor fixed end (2221) and a voice coil motor moving end (2222), the voice coil motor fixed end (2221) is arranged on the material taking position fixed frame (221), and the voice coil motor moving end (2222) is connected with the wafer supporting column support (223).

6. The wafer flip device of claim 2, wherein, A grating ruler is arranged on the magnetic spring (214), the grating ruler comprises a ruler grating and an indicating grating, one of the ruler grating and the indicating grating is arranged on the magnetic spring fixed end (2141), and the other is arranged on the magnetic spring moving end (2142), so that whether the wafer supporting column (224) has contacted the wafer is judged according to whether the reading of the grating ruler changes.

7. The wafer flip device of claim 6, wherein, The control module is further connected with the electromagnetic locking device (213) and the magnetic spring (214) in a signal connection mode, is used for regulating the magnetic force between the magnetic spring fixed end (2141) and the magnetic spring moving end (2142) after the wafer is turned over, so that the magnetic force is sufficient to offset the sum of the gravity of the magnetic spring moving end (2142), the gravity of the material discharging suction disc (212) and the gravity of the wafer adsorbed by the material discharging suction disc (212), and the electromagnetic locking moving end (2132) and the electromagnetic locking fixed end (2131) are released from the suction locking in response, so that the magnetic spring moving end (2142), the material discharging suction disc (212) and the wafer are in a suspended state.

8. The wafer flip device of claim 7, wherein, The control module is connected with the turnover motor (33) in a signal connection mode, and is used for controlling the turnover motor (33).

9. The wafer flip device of claim 7 or 8, wherein, The control module is connected with the voice coil motor (222) in a signal connection mode, and is used for controlling the voice coil motor (222).

10. The wafer flip device of claim 7, wherein, The control module is respectively connected with the grating ruler and the feeding chuck (212) in signal, and is used for weakening or closing the adsorption force of the feeding chuck (212) to the wafer when the reading change of the grating ruler is sensed, so that the wafer is separated from the feeding chuck (212) and is transferred to the wafer supporting column (224).

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