Film coating equipment and method for performing sealing adjustment on wafers in multiple reaction cavities

Abstract

The invention belongs to the technical field of semiconductors, and discloses a coating device and method for sealing adjustment of wafers in a plurality of reaction units, and the coating device comprises a transmission cavity, a plurality of reaction cavities and two transfer sealing cavities. The transmission cavity comprises two transfer pieces, and the two transfer pieces can work at the same time to transfer different wafers; the number of the reaction cavities is larger than or equal to 3 and smaller than or equal to 8, the reaction cavities are used for deposition reaction of wafers in the reaction cavities, the multiple reaction cavities are connected with the transmission cavity, and the two transfer pieces can be in butt joint with the multiple reaction cavities to take and place the wafers; the two transfer sealing cavities are respectively connected with the transmission cavity, each transfer sealing cavity comprises a transfer assembly, each transfer assembly comprises a driving mechanism and a rotating mechanism, the driving mechanisms can drive the rotating mechanisms to rotate, and the rotating mechanisms are used for bearing wafers and driving the wafers to horizontally rotate; the two transfer pieces can be in butt joint with the two transfer sealing cavities to take and place the wafers, and the deposition efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a coating device and method for sealing and adjusting wafers in a plurality of reaction chambers. Background Art

[0002] Semiconductor deposition equipment includes a gas supply system and a reaction chamber. The gas supply system supplies reaction gas into the reaction chamber, and the wafer undergoes deposition reaction in the reaction chamber to deposit a thin film on the surface of the wafer. However, due to various non-uniformity problems that may occur in the reaction chamber, such as uneven distribution of reaction gas supplied by the gas supply system in the reaction chamber, RF electrode shape design, and asymmetric coupling between RF and the reaction chamber, the film on the surface of the wafer is ultimately uneven, affecting the wafer quality.

[0003] In the related art, the semiconductor deposition equipment also includes a rotating mechanism and a transfer mechanism. After the wafer reacts in the reaction chamber, the transfer mechanism takes the wafer out of the reaction chamber and puts it into the rotating mechanism. The rotating mechanism drives the wafer to rotate an angle, and then the transfer mechanism takes the wafer out of the rotating mechanism and puts it into the reaction chamber for another deposition reaction. Even if the wafer is deposited in the reaction chamber at different angles, the uniformity of the film on the wafer surface can be ensured.

[0004] However, in the above process, the wafer is taken out of the reaction chamber and then put into the reaction chamber. During this period, the reaction chamber is always in a wafer-free state, which reduces the deposition efficiency. Especially when depositing multiple wafers, the above process will seriously prolong the overall wafer deposition reaction time and seriously affect the overall wafer deposition efficiency. Summary of the invention

[0005] The object of the present invention is to provide a coating device and method for sealing and adjusting wafers in multiple reaction chambers, thereby improving the uniformity of thin films on the wafer surfaces, ensuring the quality of wafer coating, and improving deposition efficiency.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A coating device for sealing and adjusting wafers in a plurality of reaction chambers, comprising:

[0008] A transfer chamber, wherein the transfer chamber includes two transfer pieces, and the two transfer pieces can operate simultaneously to transfer different wafers;

[0009] A plurality of reaction chambers, the number of the reaction chambers is greater than or equal to 3 and less than or equal to 8, the reaction chambers are used for the wafers to undergo deposition reactions therein, the plurality of reaction chambers are respectively connected to the transfer chambers, and the two transfer members can dock with the plurality of reaction chambers to take and place the wafers;

[0010] Two transfer sealed chambers, the two transfer sealed chambers are respectively connected to the transmission chamber, the transfer sealed chamber includes a transfer component, the transfer component includes a driving mechanism and a rotating mechanism, the driving mechanism can drive the rotating mechanism to rotate, the rotating mechanism is used to carry the wafer and drive the wafer to rotate horizontally; the two transfer parts can be docked with the two transfer sealed chambers to take and place the wafer.

[0011] In some possible implementations, the transmission cavity is a polygonal cavity having multiple side surfaces, and the multiple reaction cavities and the two transfer sealing cavities are correspondingly disposed on the multiple side surfaces of the transmission cavity.

[0012] In some possible embodiments, the rotating mechanism includes a rotating shaft and a supporting component on the rotating shaft, the supporting component includes a supporting member and a guiding member; along the radial direction of the rotating shaft, the supporting member is arranged on the side of the guiding member close to the rotating shaft; the guiding member can guide the wafer to the supporting member, so that the wafer is supported on the supporting member, and the wafer and the rotating shaft are arranged coaxially.

[0013] In some possible embodiments, at least three bearing assemblies are circumferentially provided at the end of the rotating shaft, and the bearing assembly also includes a connecting rod, and the bearing member and the guide member are both provided on the connecting rod, and the connecting rod is connected to the rotating shaft and extends radially along the rotating shaft.

[0014] In some possible implementations, the carrier is cylindrical, and the plane of the upper surface is used to support the wafer. The guide member is provided with a guide slope, and the guide slope is inclined downward in a direction from the guide member to the carrier.

[0015] In some possible embodiments, the transfer sealed chamber includes a first shell and a second shell that are sealed to each other, the supporting assembly is arranged in the first shell, the driving mechanism is arranged in the second shell, the rotating shaft is rotationally sealed and connected to the first shell, the first shell is provided with an opening, and the transfer member enters and exits the transfer sealed chamber from the opening to transfer the wafer.

[0016] In some possible implementations, the transfer sealing cavity further includes a rotary sealing mechanism, and the rotary shaft is sealedly connected to the first shell through the rotary sealing mechanism.

[0017] In some possible embodiments, the rotary sealing mechanism includes a support assembly and a seal, the support assembly is sealingly connected to the first shell; a flange is provided on the outer periphery of the rotating shaft, and a boss spaced apart from the rotating shaft is provided on the bottom of the flange; the rotating shaft passes through the support assembly and the seal, and the seal is clamped between the boss and the support assembly so that the seal is sealingly connected to the outer periphery of the rotating shaft.

[0018] In some possible implementations, the seal includes a sealing portion and a clamping portion whose cross sections are arranged at an angle, the sealing portion is sleeved on the rotating shaft and arranged at an angle to the rotating shaft, and the clamping portion is clamped between the boss and the support assembly.

[0019] In some possible embodiments, the support assembly includes a support base and a support member, the support base is sealingly connected to the first shell, the clamping portion is clamped between the boss and the support base, and the support member is supported between the support base and the sealing portion.

[0020] In some possible implementations, at least two seals are provided, the rotating shaft passes through at least two seals, and at least two seals are clamped between the boss and the support assembly.

[0021] In some possible embodiments, an observation hole is provided at the top of the transit sealing cavity, and the transit sealing cavity also includes an observation window, the observation window includes a window body, a sealing ring, an annular pressure plate and a first fastener, the window body is clamped between the annular pressure plate and the transit sealing cavity, the annular pressure plate is connected to the transit sealing cavity through the first fastener, and the window body is provided at the observation hole; the sealing ring is provided between the window and the transit sealing cavity.

[0022] A coating method for sealing and adjusting wafers in multiple reaction chambers, using the coating device for sealing and adjusting wafers in multiple reaction chambers as described in any one of the above items, the multiple reaction chambers are respectively a first reaction chamber, a second reaction chamber, a third reaction chamber ... an Nth reaction chamber, N is greater than or equal to 3 and less than or equal to 8; the two transport parts are respectively a first transport part and a second transport part; the two transfer sealing chambers are respectively a first transfer sealing chamber and a second transfer sealing chamber; the coating method for sealing and adjusting wafers in multiple reaction chambers includes:

[0023] The first transfer member transfers the first wafer from the first reaction chamber to the transfer chamber, and then to the first transfer sealed chamber. The rotating mechanism in the first transfer sealed chamber rotates the first wafer by a certain angle, and the first transfer member transfers the first wafer from the transfer sealed chamber to the transfer chamber. While the first transfer member takes the first wafer out of the first reaction chamber, the second transfer member transfers the second wafer to any empty reaction chamber among the first reaction chamber, the second reaction chamber, the third reaction chamber, ... the Nth reaction chamber;

[0024] The first transfer member then transfers the first wafer from the transmission chamber to any remaining empty reaction chamber among the first reaction chamber, the second reaction chamber, the third reaction chamber, ... the Nth reaction chamber.

[0025] In some possible implementations, when the second transporter transfers the second wafer to any empty reaction chamber, the second wafer is a wafer entering the transmission chamber from the outside, or the second wafer is a wafer entering the transmission chamber from the second transfer sealing chamber.

[0026] In some possible implementations, when there are wafers undergoing reactions in the first reaction chamber and the second reaction chamber, wafers entering the transmission chamber from the outside are transferred to the third reaction chamber for reaction through a transfer member, and the above cycle is repeated until there are wafers undergoing reactions in N reaction chambers, so that N+2 wafers can be operated on simultaneously.

[0027] In some possible implementations, the first transport member transfers the first wafer in the first preset posture from the first reaction chamber to the rotating mechanism of the transfer sealing chamber;

[0028] The rotating mechanism drives the wafer to rotate by a preset angle;

[0029] The first transfer member moves the wafer from the rotating mechanism to the first transfer sealing chamber, and then transfers it to any remaining empty reaction chamber in the first reaction chamber, the second reaction chamber, the third reaction chamber ... the Nth reaction chamber, so that the wafer is located in the reaction chamber in a second preset position and reacts.

[0030] A coating device for sealing and adjusting wafers in a plurality of reaction chambers, comprising:

[0031] A transfer chamber, wherein the transfer chamber includes two transfer pieces, and the two transfer pieces can simultaneously transfer different wafers;

[0032] A plurality of reaction chambers, the number of the reaction chambers is greater than or equal to 3 and less than or equal to 8, the reaction chambers are used for the wafers to undergo deposition reactions therein, the plurality of reaction chambers are respectively connected to the transfer chambers, and the two transfer members can dock with the plurality of reaction chambers to take and place the wafers;

[0033] A transfer sealed chamber, the transfer sealed chamber is connected to the transmission chamber, the transfer sealed chamber includes two sets of transfer components, each set of the transfer components includes a driving mechanism and a rotating mechanism, the driving mechanism can drive the rotating mechanism to rotate, the rotating mechanism is used to carry the wafer and drive the wafer to rotate horizontally; the two transfer parts can be docked with the two rotating mechanisms to take and place the wafer.

[0034] Beneficial effects of the present invention:

[0035] The present invention provides a coating device for sealing and adjusting wafers in multiple reaction chambers. The wafer reacts in the reaction chamber, rotates a certain angle in the rotating mechanism of the transfer sealing chamber, and is transferred between the rotating mechanism of the transfer sealing chamber and the reaction chamber by a transfer member. For example, the wafer is located in the reaction chamber in an initial posture for reaction, and then the transfer member transfers the wafer in the initial posture to the rotating mechanism, the rotating mechanism drives the wafer to rotate to a first preset angle, and the transfer member transfers the wafer to the reaction chamber, so that the wafer reacts in the reaction chamber in the first preset posture, thereby realizing the change of the wafer from the initial posture to the first preset posture, that is, adjusting the posture of the wafer in the reaction chamber. Further, the wafer in the first preset posture can be transferred to the rotating mechanism again by the transfer member, the rotating mechanism drives the wafer to rotate to a second preset angle, and the transfer member transfers the wafer to the reaction chamber, so that the wafer reacts in the reaction chamber in the second preset posture, thereby realizing the change of the wafer from the first preset posture to the second preset posture, that is, adjusting the posture of the wafer in the reaction chamber again.

[0036] The transfer part is docked with the transfer sealed chamber and the reaction chamber respectively to transfer the wafer between the transfer sealed chamber and the reaction chamber, so that after the wafer is adjusted in position by the transfer sealed chamber, it is located in the reaction chamber in at least two different preset positions. In the case where there are multiple uneven coatings in the reaction chamber, a certain degree of rotating averaging can be achieved through the transfer sealed chamber, that is, the coating on the surface of the wafer is uniformed by a certain number of wafer rotations, ensuring the uniformity of the deposited film on the surface of the wafer and the quality of the coating on the wafer. Specifically, the position of the wafer can be adjusted multiple times according to actual conditions to ensure the uniformity of the reaction of the wafer in the reaction chamber, that is, to ensure the uniformity of the film on the surface of the wafer.

[0037] On the other hand, the transfer sealing chamber is connected to the transmission chamber, and the wafer is transferred between the reaction chamber and the transfer sealing chamber through the handling system. Therefore, the transfer sealing chamber will not be affected by the high temperature and high corrosion environment generated during the reaction inside the reaction chamber, thereby ensuring the service life of the transfer sealing chamber; the transfer sealing chamber in the transfer sealing chamber is connected to the vacuum chamber to ensure the vacuum of the transfer sealing chamber and protect the wafers in the transfer sealing chamber. In addition, the transfer sealing chamber is not connected to the reaction chamber, and the transfer sealing chamber can protect the internal driving mechanism and rotating mechanism to prevent the high temperature and high corrosion environment in the reaction chamber from affecting the service life, thereby improving the quality of the coating equipment for sealing and adjusting the wafers in multiple reaction chambers, reducing maintenance and repair, and improving production efficiency. In addition, the transfer sealing chamber is not connected to the reaction chamber, and there is no need to use high temperature resistant components, which reduces the implementation cost.

[0038] By providing multiple reaction chambers, multiple reaction chambers correspond to multiple wafers one by one, and multiple wafers can be deposited at the same time; or, each reaction chamber corresponds to multiple wafers, which further increases the number of wafers that are deposited at the same time, thereby improving work efficiency. In addition, by providing two transfer sealed chambers and two transfer parts, both transfer parts can dock with multiple reaction chambers and two transfer sealed chambers, transfer wafers at the same time through two transfer parts, rotate different wafers at the same time by two transfer sealed chambers, and deposit multiple wafers at the same time by multiple reaction chambers, thereby improving work efficiency. Further, a transfer part takes out a wafer from a reaction chamber and puts it into a transfer sealed chamber, and at the same time, another transfer part takes out a wafer from a transfer sealed chamber and puts it back into a reaction chamber. The two transfer parts work at the same time but perform different processes to ensure that N reaction chambers have wafers reacting, so that the coating equipment can operate N+2 wafers at the same time, avoiding the idle reaction chamber, making it fully used, and improving work efficiency.

[0039] The present invention provides a coating method for sealing and adjusting wafers in multiple reaction chambers. By adopting the above-mentioned coating equipment for sealing and adjusting wafers in multiple reaction chambers, the reaction chambers can be prevented from being idle through the cooperation of the above two transfer parts, that is, they can be fully utilized, thereby improving the deposition efficiency of the equipment on multiple wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the docking state of the transfer sealing cavity and the transfer member provided by a specific embodiment of the present invention;

[0041] Figure 2 is an exploded view of a transfer sealing cavity provided by a specific embodiment of the present invention;

[0042] Figure 3 is a partial schematic diagram of a first housing and an observation window provided in a specific embodiment of the present invention;

[0043] Figure 4 is a partial schematic diagram of a rotating mechanism provided in a specific embodiment of the present invention;

[0044] Figure 5 yes Figure 4 A magnified image of point A;

[0045] Figure 6 It is a partial schematic diagram of the assembly of the rotary sealing mechanism and the rotary shaft provided by a specific embodiment of the present invention;

[0046] Figure 7 It is a schematic diagram of a state where a transfer member and a wafer provided by a specific embodiment of the present invention are located outside a transfer sealing cavity;

[0047] Figure 8 It is a schematic diagram of the state where the transfer member and the wafer provided by the specific embodiment of the present invention are located in the transfer sealing chamber;

[0048] Fig. 9 It is a schematic diagram of a state in which a wafer is driven to rotate by a rotating mechanism provided in a specific embodiment of the present invention;

[0049] Fig.10 is a schematic diagram of a coating device for sealing and adjusting wafers in a plurality of reaction units provided by a specific embodiment of the present invention;

[0050] Fig.11 It is a flow chart of a semiconductor deposition method provided by a specific embodiment of the present invention.

[0051] In the figure:

[0052] 100, transfer sealing chamber; 200, wafer; 300, transfer piece; 400, transmission chamber; 500, reaction chamber;

[0053] 11. first housing; 111. opening; 12. second housing; 13. third fastener;

[0054] 2. Rotating mechanism; 21. Rotating shaft; 211. Flange; 212. Boss; M. First surface; N. Second surface; 22. Carrying assembly; 221. Carrying member; 222. Guide member; 2221. Guide slope; 223. Connecting rod; 224. Adapter plate; 225. Second fastener;

[0055] 3. Rotary sealing mechanism; 31. Support assembly; 311. Support base; X. First convex surface; Y. Second convex surface; Z. Third convex surface; P. Raised surface; 312. First supporting ring; 3121. Annular seam; 3122. First supporting part; 3123. Connecting part; 3124. Second supporting part; 313. Second supporting ring; 32. Sealing member; 321. Sealing part; 322. Pressing part;

[0056] 4. Observation window; 41. Window body; 42. Sealing ring; 43. Annular pressure plate; 44. First fastener. DETAILED DESCRIPTION

[0057] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0058] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0060] Embodiment 1

[0061] like Figure 1-Figure 10As shown, this embodiment provides a coating device for sealing and adjusting wafers 200 in multiple reaction chambers 500, including a transmission chamber 400, multiple reaction chambers 500 and two transfer sealing chambers 100. The transmission chamber 400 includes two transfer pieces 300, and the two transfer pieces 300 can work simultaneously to transfer different wafers 200. The number of reaction chambers 500 is greater than or equal to 3 and less than or equal to 8. The reaction chamber 500 is used for the wafer 200 to perform deposition reaction therein. The multiple reaction chambers 500 are respectively connected to the transmission chamber 400, and the two transfer pieces 300 can dock with the multiple reaction chambers 500 to take and place the wafers 200. The two transfer sealed chambers 100 are respectively connected to the transmission chamber 400. The transfer sealed chamber 100 includes a transfer component, which includes a driving mechanism and a rotating mechanism 2. The driving mechanism can drive the rotating mechanism 2 to rotate. The rotating mechanism 2 is used to carry the wafer 200 and drive the wafer 200 to rotate horizontally. The two transfer parts 300 can be docked with the two transfer sealed chambers 100 to take and place the wafer 200.

[0062] Optionally, the coating device for sealing and adjusting the wafers 200 in the multiple reaction chambers 500 further includes a gas supply system. The gas supply system is used to provide reaction medium to the reaction chamber 500, and the reaction chamber 500 is used for the wafers 200 to perform deposition reactions in the reaction chamber 500; the deposition reactions can be various deposition coating reactions.

[0063] Particle impurities may be generated in the reaction chamber 500. For this reason, the coating equipment for sealing and adjusting the wafers 200 in the multiple reaction chambers 500 is also provided with a cleaning system for regularly cleaning the inside of the reaction chamber 500 to avoid the generation of particle impurities as much as possible. Placing particle impurities will affect the process reaction. Optionally, the cleaning system and the gas supply system are both located in the middle position between the multiple reaction chambers 500, and the multiple reaction chambers 500 are surrounded by the cleaning system and the gas supply system to ensure the reliability of cleaning, reduce the cleaning dead corners, make the cleaning more thorough, and ensure the uniformity of the construction period. The gas supply system and the cleaning system can be set according to the actual situation and will not be described in detail.

[0064] The wafer 200 can be transferred between the rotating mechanism 2 of the transfer sealing chamber 100 and the reaction chamber 500 through the transfer member 300, so that the wafer 200 reacts in the reaction chamber 500, or rotates a certain angle in the rotating mechanism 2. For example, the wafer 200 is located in the reaction chamber 500 in an initial position for reaction, and then the transfer member 300 transfers the wafer 200 in the initial position to the rotating mechanism 2. The rotating mechanism 2 drives the wafer 200 to rotate to a first preset angle. The transfer member 300 transfers the wafer 200 to the reaction chamber 500, so that the wafer 200 reacts in the reaction chamber 500 in the first preset position, thereby realizing the change of the wafer 200 from the initial position to the first preset position, that is, adjusting the position of the wafer 200 in the reaction chamber 500.

[0065] Furthermore, the wafer 200 in the first preset position can be transferred to the rotating mechanism 2 again through the transfer member 300, the rotating mechanism 2 drives the wafer 200 to rotate to the second preset angle, and the transfer member 300 transfers the wafer 200 to the reaction chamber 500, so that the wafer 200 reacts in the reaction chamber 500 in the second preset position, thereby realizing the change of the wafer 200 from the first preset position to the second preset position, that is, the position of the wafer 200 in the reaction chamber 500 is adjusted again.

[0066] The transfer member 300 can be docked with the transfer sealing chamber 100 and the reaction chamber 500 respectively to transfer the wafer 200 between the rotating mechanism 2 and the reaction chamber 500, so that the wafer 200 is positioned in the reaction chamber 500 in at least two different preset positions after being adjusted by the rotating mechanism 2, and in the case where the reaction gas is unevenly distributed in the reaction chamber 500, the film on the surface of the wafer 200 is ensured to be uniform, and the quality of the wafer 200 is ensured. Specifically, the position of the wafer 200 can be adjusted multiple times according to actual conditions to ensure the reaction uniformity of the wafer 200 in the reaction chamber 500, that is, to ensure the uniformity of the film on the surface of the wafer 200.

[0067] The above is only an exemplary description of the process of transferring the wafer 200 between the reaction chamber 500 and the rotating mechanism 2. The number of times the wafer 200 is transferred to the rotating mechanism 2 for rotation and posture adjustment can also be preset. The angle and rotation direction of the rotating mechanism 2 driving the wafer 200 to rotate can also be preset without limitation.

[0068] The process by which the wafer 200 can be transferred between the rotating mechanism 2 of the transfer sealed chamber 100 and the reaction chamber 500 through the transfer component 300 is as follows: the transfer component 300 can take out the wafer 200 in the reaction chamber 500 and transfer it to the transmission chamber 400, and then transfer it from the transmission chamber 400 to the transfer sealed chamber 100. After the rotating mechanism 2 drives the wafer 200 to rotate a preset angle, the transfer component 300 takes out the wafer 200 from the transfer sealed chamber 100 and transfers it to the transmission chamber 400, and finally transfers the wafer 200 from the transmission chamber 400 to the reaction chamber 500.

[0069] Since the transfer sealed chamber 100 is connected to the transmission chamber 400, the vacuum of the transfer sealed chamber 100 is guaranteed, and the wafer 200 located in the transfer sealed chamber 100 can be protected. In addition, the transfer sealed chamber 100 can protect the internal driving mechanism and the rotating mechanism 2 to prevent the high temperature and high corrosion environment in the reaction chamber 500 from affecting the service life, thereby improving the quality of the coating equipment for sealing and adjusting the wafers 200 in multiple reaction chambers 500, reducing maintenance and repair, and improving production efficiency.

[0070] By providing multiple reaction chambers 500, multiple reaction chambers 500 correspond to multiple wafers 200 one by one, it is possible to achieve deposition reaction of multiple wafers 200 at the same time; or, each reaction chamber 500 corresponds to multiple wafers 200, further increasing the number of wafers 200 that are simultaneously subjected to deposition reaction, thereby improving work efficiency. In addition, by providing two transfer sealed chambers 100 and two transport parts 300, both transport parts 300 can be used with multiple reaction chambers 500 and two transfer sealed chambers 100, transfer wafers 200 at the same time through two transport parts 300, two transfer sealed chambers 100 rotate different wafers 200 at the same time, and multiple reaction chambers 500 simultaneously perform deposition reaction on multiple wafers 200, thereby improving work efficiency. Furthermore, a transfer component 300 takes the wafer 200 out of the reaction chamber 500 and places it into the transfer sealed chamber 100. At the same time, another transfer component 300 takes the wafer 200 out of the transfer sealed chamber 100 and places it back into the reaction chamber 500. The two transfer components 300 work simultaneously but perform different process steps to ensure that N reaction chambers 500 all have wafers 200 undergoing reaction, so that the coating equipment can operate on N+2 wafers 200 at the same time, avoiding the reaction chamber 500 from being idle, making full use of it, and improving work efficiency.

[0071] Multiple reaction chambers 500 and two transfer sealed chambers 100 can be arranged in a ring shape, and the transmission chamber 400 is located in the middle position between the multiple reaction chambers 500, so that the multiple reaction chambers 500 and the two transfer sealed chambers 100 are surrounded by the transmission chamber 400 to ensure that the distance between the transfer part 300 and the multiple reaction chambers 500 and the two transfer sealed chambers 100 is equal, so as to facilitate the placement of the wafer 200.

[0072] Further, the transmission cavity 400 is a polygonal cavity with multiple sides, and the multiple reaction cavities 500 and the two transfer sealing cavities 100 are correspondingly arranged on the multiple sides of the transmission cavity 400. Exemplarily, the transmission cavity 400 has P sides, and the total number of the reaction cavity 500 and the two transfer sealing cavities 100 is Q, then P is greater than or equal to Q. Fig.10 As shown, P=Q+1, one side of the reaction chamber 500 is docked with the external structure to transfer the external wafer 200 to the transmission chamber 400, or to transfer the wafer 200 in the reaction chamber 500 to the outside. Optionally, multiple reaction chambers 500 are arranged adjacent to each other, two transfer sealed chambers 100 are arranged adjacent to each other, or the reaction chambers 500 and the transfer sealed chambers 100 are arranged alternately, and the number of reaction chambers 500 can be 3, 4, 5, 6, 7 or 8, which can be selected according to the needs without limitation.

[0073] like Figure 2 , Figure 4 and Figure 5 As shown, in one embodiment, the rotating mechanism 2 includes a rotating shaft 21 and a bearing assembly 22 on the rotating shaft 21, and the bearing assembly 22 is used to bear the wafer 200. The driving mechanism can be a servo motor, a stepper motor, a motor plus a transmission structure, a rotary cylinder or other power source. For example, the driving mechanism is a stepper motor that directly drives the rotating shaft 21 to rotate, thereby driving the bearing assembly 22 and the wafer 200 thereon to rotate. The axis of the rotating shaft 21 extends in the vertical direction, so that the wafer 200 can be rotated horizontally. Fig. 9 As shown, the motor can rotate in forward / reverse directions, thereby driving the rotating shaft 21, the supporting assembly 22 and the wafer 200 thereon to rotate in the direction M1 / M2.

[0074] The bearing assembly 22 includes a bearing member 221 and a guide member 222; along the radial direction of the rotating shaft 21, the bearing member 221 is arranged on the side of the guide member 222 close to the rotating shaft 21; the guide member 222 can guide the wafer 200 to the bearing member 221, so that the wafer 200 is supported on the bearing member 221, and the wafer 200 and the rotating shaft 21 are arranged on the same center line. If the transfer member 300 places the wafer 200 on the bearing assembly 22 and the position is offset, under the action of the gravity of the wafer 200 itself and the guiding action of the guide member 222, the wafer 200 slides from the guide member 222 to the bearing member 221, and the wafer 200 and the rotating shaft 21 are arranged on the same center line, that is, the wafer 200 is centered and positioned in the transfer sealing chamber 100, which improves the position accuracy of the wafer 200 when it is transferred between the reaction chamber 500 and the rotating mechanism 2 through the transfer member 300.

[0075] In one embodiment, at least three bearing assemblies 22 are provided at the end of the rotating shaft 21 along the circumferential direction, and the bearing assembly 22 further includes a connecting rod 223, and the bearing member 221 and the guide member 222 are both provided on the connecting rod 223, and the connecting rod 223 is connected to the rotating shaft 21 and extends along the radial direction of the rotating shaft 21. The bearing members 221 on at least three bearing assemblies 22 form a bearing plane for supporting the wafer 200 to ensure the stability of the wafer 200. In other embodiments, the bearing member 221 is a disc, and the guide member 222 is provided around the disc.

[0076] In some possible embodiments, the carrier 221 is cylindrical, and the plane of its upper surface is used to support the wafer 200 to ensure the stability of the support. The guide member 222 is provided with a guide slope 2221, and the guide slope 2221 is inclined downward from the guide member 222 to the carrier 221. Optionally, the guide slope 2221 can be a plane or an arc surface, as long as the guide slope 2221 is ensured to be inclined downward from the guide member 222 to the carrier 221. In this way, when transferring the wafer 200, the wafer 200 can be more conveniently descended along the guide slope 2221 along its own edge to be fixed on the carrier 221. After the wafer 200 lands on the carrier 221, the lower part of the guide member 222 itself can limit the edge of the wafer 200, so that the wafer 200 will not move horizontally at will. Exemplarily, the guide member 222 includes a cylinder and a cone provided at the top of the cylinder, and the top of the cone is higher than the bearing surface of the carrier 221. Exemplarily, at least two guide members 222 are provided, and at least two guide members 222 are arranged along the circumference of the rotating shaft 21 . By increasing the number of guide members 222 , the guiding effect is improved.

[0077] Optionally, the support member 221 and the guide member 222 are both threadedly connected to the connecting rod 223 for easy installation, and the height of the support member 221 and the guide member 222 can be adjusted by threads during use to ensure that the wafer 200 is in a horizontal state when placed / rotated.

[0078] Optionally, the bearing assembly 22 further includes an adapter plate 224 and a second fastener 225, and the adapter plate 224 is detachably connected to the connecting rod 223 through the second fastener 225 such as a screw, and the bearing member 221 and the guide member 222 are both threadedly connected to the adapter plate 224. During assembly, the bearing member 221 and the guide member 222 are both threadedly connected to the adapter plate 224, and then the adapter plate 224 is connected to the connecting rod 223. After being used for a period of time, the adapter plate 224 and the bearing member 221 and the guide member 222 thereon can be disassembled and replaced with a new adapter plate 224 and the bearing member 221 and the guide member 222 thereon, so as to prevent the bearing member 221 and the guide member 222 from being used for a long time, resulting in structural wear and affecting the centering accuracy of the wafer 200 in the transfer sealing chamber 100.

[0079] Optionally, in the vertical direction, the connecting rod 223 is set at an angle with the end of the rotating shaft 21, and the end of the connecting rod 223 away from the rotating shaft 21 is tilted upward, so that the guide member 222 and the supporting member 221 are separated from the end of the rotating shaft 21 through the connecting rod 223, so that the subsequent adapter is located at the end of the rotating shaft 21 and between the guide member 222 and the supporting member 221 in the vertical direction to facilitate the wafer 200 to be taken and placed.

[0080] like Figure 7 and Figure 8 As shown, when placing the wafer 200, the transfer member 300 moves along the X1 direction to the top of the carrier assembly 22, and then the transfer member 300 moves downward along the Y1 direction. After the wafer 200 is placed on the carrier assembly 22, the transfer member 300 is pulled out from the wafer 200 and the end of the rotating shaft 21 along the X2 direction. When taking away the wafer 200, the transfer member 300 moves along the X1 direction and is inserted from the wafer 200 and the end of the rotating shaft 21. The transfer member 300 moves upward to make the wafer 200 fall on the transfer member 300, and then the transfer member 300 moves along the X2 direction to carry the wafer 200 away from the carrier assembly 22.

[0081] Optionally, the rotating shaft 21 can be made of aluminum alloy, and the processing method can be machined to ensure accuracy. Because the temperature of the wafer 200 just removed from the reaction chamber 500 is extremely high, the temperature of the wafer 200 may still be around 400°C when arriving at the transfer sealing chamber 100, the structures that need to contact with the wafer 200, such as the carrier 221 and the guide 222, are made of heat-resistant materials such as aluminum oxide or aluminum nitride ceramics.

[0082] like Figure 1-Figure 3As shown, in some possible embodiments, the transfer sealed chamber 100 includes a first shell 11 and a second shell 12 which are sealed and connected to each other, the bearing assembly 22 is arranged on the first shell 11, the driving mechanism is arranged on the second shell 12, the rotating shaft 21 is rotatably and sealedly connected to the first shell 11, the first shell 11 is provided with an opening 111, and the transfer member 300 enters and exits the transfer sealed chamber 100 from the opening 111 to transfer the wafer 200. The first shell 11 can be connected to the vacuum chamber through the opening 111, that is, when the opening 111 is opened, the transfer member 300 enters and exits the first shell 11. When the opening 111 is closed, the vacuum inside the first shell 11 is ensured to prevent impurities and the like from contaminating the wafer 200. When there is a problem with the internal structure of the transfer sealed chamber 100, the transfer sealed chamber 100 can be entered through the opening 111 to adjust the internal structure of the transfer sealed chamber 100.

[0083] Optionally, the first shell 11 and the second shell 12 are connected by a third fastener 13 , which may be a bolt or the like. A sealing strip is provided between the two shells for sealing to ensure the vacuum property of the first shell 11 .

[0084] The transfer sealing chamber 100 also includes an observation window 4 provided on the transfer sealing chamber 100, through which the internal operation of the transfer sealing chamber 100 can be monitored. Specifically, an observation hole is provided on the transfer sealing chamber 100, and the observation window 4 is provided at the observation hole. The observation hole is provided at the top of the transfer sealing chamber 100, that is, the observation window 4 is provided at the top of the transfer sealing chamber 100, which is convenient for viewing. The observation window 4 is detachable and sealedly connected to the transfer sealing chamber 100. Before the observation window 4 is installed, the observation hole is used to install the rotating mechanism 2.

[0085] Optionally, the observation window 4 further includes a window 41, an annular pressure plate 43 and a first fastener 44, the window 41 is sandwiched between the annular pressure plate 43 and the transfer sealing cavity 100, the annular pressure plate 43 is connected to the transfer sealing cavity 100 through the first fastener 44, and the window 41 is arranged at the observation hole. Specifically, the window 41 is made of a transparent material, such as plastic. Optionally, the observation window 4 further includes a sealing ring 42, which is arranged between the window 41 and the transfer sealing cavity 100 to ensure the vacuum of the first shell 11.

[0086] like Figure 6 As shown, in one embodiment, the transfer sealing chamber 100 also includes a rotating sealing mechanism 3, and the rotating shaft 21 is sealed and connected to the first shell 11 through the rotating sealing mechanism 3, thereby ensuring the sealing connection between the rotating shaft 21 and the first shell 11, thereby ensuring the vacuum of the first shell 11.

[0087] The rotary sealing mechanism 3 includes a support assembly 31 and a seal 32. The support assembly 31 is sealed and connected to the first housing 11. For example, the support assembly 31 and the first housing 11 are connected by screws, and a sealing strip is provided between the two to achieve sealing between the support assembly 31 and the first housing 11. A flange 211 is provided on the outer periphery of the rotating shaft 21, and a boss 212 spaced from the rotating shaft 21 is provided at the bottom of the flange 211; the rotating shaft 21 is passed through the support assembly 31 and the seal 32, and the seal 32 is clamped between the boss 212 and the support assembly 31, so that the seal 32 is sealed and connected to the outer periphery of the rotating shaft 21. The boss 212 is pressed against the seal 32 by the gravity of the rotating shaft 21, and the boss 212 and the rotating shaft 21 are spaced apart, so that the part of the seal 32 located between the boss 212 and the rotating shaft 21 is tightly connected to the rotating shaft 21, and the rotating shaft 21 rotates relative to the seal 32, thereby improving the rotary sealing performance between the two.

[0088] In some possible embodiments, the seal 32 includes a sealing portion 321 and a pressing portion 322, the cross sections of which are set at an angle, the sealing portion 321 is sleeved on the rotating shaft 21 and is set at an angle with the rotating shaft 21, and the pressing portion 322 is clamped between the boss 212 and the support assembly 31. Optionally, the pressing portion 322 is designed to adapt to the shape of the boss 212 and the support assembly 31, and the sealing portion 321 is set at an angle with the rotating shaft 21. When the pressing portion 322 is pressed, it is easier for the sealing portion 321 to hold the rotating shaft 21, thereby improving the sealing performance. Exemplarily, the cross sections of the sealing portion 321 and the pressing portion 322 are J-shaped.

[0089] Furthermore, the support assembly 31 includes a support base 311 and a support member. The support base 311 and the first shell 11 are sealed and connected. The clamping portion 322 is clamped between the boss 212 and the support base 311. The support member is supported between the support base 311 and the sealing portion 321 to prevent the sealing portion 321 from deforming and ensure the sealing performance of the sealing portion 321.

[0090] During the rotation of the rotating shaft 21, the rotating shaft 21 rotates relative to the sealing member 32, causing wear between the two. Therefore, at least two sealing members 32 are provided, and the rotating shaft 21 passes through at least two sealing members 32. At least two sealing members 32 are clamped between the boss 212 and the supporting assembly 31. By increasing the number of sealing members 32, the sealing performance is improved.

[0091] In this embodiment, the support base 311 is provided with a mounting groove, and the notch of the mounting groove faces the flange 211. The boss 212 is annular and can be arranged at the middle position or other position of the lower surface of the flange 211, so that one end of the boss 212 abuts against the notch of the mounting groove. There are two seals 32, and the support member includes a first support ring 312 and a second support ring 313. The two seals 32 and the first support ring 312 and the second support ring 313 are all arranged in the mounting groove. The sealing part 321 of the first seal 32, i.e. the lower seal 32, is supported on the second support ring 313, and the pressing part 322 of the first seal 32 is sandwiched between the first support ring 312 and the support base 311, i.e. the bottom of the mounting groove. The sealing part 321 of the second seal 32, i.e. the upper seal 32, is supported on the first support ring 312, and the pressing part 322 of the second seal 32 is sandwiched between the first support ring 312 and the boss 212. The first support ring 312 includes a first support portion 3122, a connection portion 3123, and a second support portion 3124 connected in sequence, wherein the first support portion 3122 is used to support the sealing portion 321 of the second sealing member 32, and the second support portion 3124 is clamped between the pressing portion 322 of the first sealing member 32 and the pressing portion 322 of the second sealing member 32. The connection portion 3123 is used to connect the first support portion 3122 and the second support portion 3124, and the first support ring 312 and the second support ring 313 can be adaptively arranged according to the structure of the sealing member 32.

[0092] Optionally, an annular gap 3121 is provided between the first support ring 312 and the support base 311 to facilitate installation of the first support ring 312 .

[0093] The rotary sealing mechanism 3 is described above through specific component relationships. This embodiment further describes the rotary sealing mechanism 3 through upper and lower connection relationships to facilitate understanding of the sealing implementation of this embodiment.

[0094] Specifically, a boss 212 is provided at the lower part of the flange 211, and the boss 212 divides the lower surface of the flange 211 into two sections, wherein the section between the boss 212 and the rotating shaft 21 is the first surface M of the flange 211, and the section between the boss 212 and the outermost edge of the flange 211 is the second surface N.

[0095] The support base 311 includes a first convex surface X set upward from the bottom, a second convex surface Y set upward along the first convex surface X, and a third convex surface Z set upward along the second convex surface Y. The first convex surface X corresponds to the upper and lower positions of the first surface M, the second convex surface Y corresponds to the upper and lower positions of the lower surface of the boss 212, the third convex surface Z is completely connected and fits with the second surface N, and the portion of the raised surface P between the second convex surface Y and the third convex surface Z is tightly fitted with the surface of the boss 212, so that a sealed space is formed between the first convex surface X and the second convex surface Y at the bottom and the first surface M and the lower surface of the boss 212 at the top.

[0096] A second support ring 313 is provided in the sealed space, the lower surface of the second support ring 313 is correspondingly fitted with the first convex surface X, the upper surface of the second support ring 313 is a slope, and the bottom of the slope is flush with the second convex surface Y, and the slope extends from the second convex surface Y toward the rotation axis 21, so that the slope and the second convex surface Y form a continuous connection surface. That is, the connection surface includes a slope portion where a plane portion is connected to a plane portion.

[0097] A sealing member 32 is provided on the continuous surface, the lower surface of the sealing member 32 is completely in correspondence with the connection surface, and the upper surface of the sealing member 32 is a surface similar or identical to the shape of the connection surface. A first support ring 312 is provided on the sealing member 32, the lower surface of the first support ring 312 is completely in correspondence with the plane portion of the upper surface of the sealing member 32, and the upper surface of the first support ring 312 is the same or similar surface as the connection surface. Another sealing member 32 is provided on the upper surface of the first support ring 312, the lower surface of the sealing member 32 is corresponding to the upper surface of the first support ring 312, the upper surface of the sealing member 32 is the same or similar to the connection surface, and the plane portion of the upper surface of the sealing member 32 is corresponding to the lower surface of the boss 212.

[0098] The above sealing arrangement has a multiple sealing effect, that is, the above sealing space is the first sealing, and the two sealing members 32 constitute a double sealing, so that the sealing effect is good. At the same time, the first support ring 312 forms a downward pressure and seal on the lower sealing member 32, and forms a support and seal on the upper sealing member 32, ensuring sufficient support and sealing effect.

[0099] like Figure 7-Figure 9 As shown, the transfer member 300 may be a four-axis manipulator or a six-axis manipulator. The docking process of the transmission chamber 400 with the transfer sealing chamber 100 and the reaction chamber 500 is as follows:

[0100] After the transfer member 300 takes out the wafer 200 from the reaction chamber 500, the transfer member 300 supports the wafer 200 through the opening 111 into the first shell 11 and is placed above the bearing assembly 22. The transfer member 300 moves downward so that the wafer 200 is located on the bearing assembly 22. The transfer member 300 moves downward and is pulled out backward, that is, passes through the two connecting rods 223 and moves out from the opening 111. After the rotating mechanism 2 rotates the wafer 200, the transfer member 300 moves forward, that is, enters the transfer sealing chamber 100 from the opening 111 and passes between the two connecting rods 223. Then the transfer member 300 moves upward, holds up the wafer 200, pulls it out backward and moves out from the exit. After that, the wafer 200 is transferred to the transmission chamber 400, and finally the transfer member 300 is docked with the reaction chamber 500, and the wafer 200 is placed on the reaction chamber 500 to continue the process.

[0101] For the convenience of description, the multiple reaction chambers 500 are respectively a first reaction chamber 500, a second reaction chamber 500, a third reaction chamber 500...the Nth reaction chamber 500, where N is greater than or equal to 3 and less than or equal to 8; the two transfer components 300 are respectively a first transfer component 300 and a second transfer component 300; the two transfer sealed chambers 100 are respectively a first transfer sealed chamber 100 and a second transfer sealed chamber 100.

[0102] like Fig.11 As shown, this embodiment provides a coating method for sealing and adjusting wafers 200 in a plurality of reaction chambers 500, comprising the following steps:

[0103] S1. The first transfer member 300 transfers the first wafer 200 from the first reaction chamber 500 to the transfer chamber 400, and then to the first transfer sealed chamber 100. The rotating mechanism 2 in the first transfer sealed chamber 100 rotates the first wafer 200 by a certain angle, and the first transfer member 300 transfers the first wafer 200 from the transfer sealed chamber 100 to the transfer chamber 400. While the first transfer member 300 takes the first wafer 200 out of the first reaction chamber 500, the second transfer member 300 transfers the second wafer 200 to any empty reaction chamber 500 among the first reaction chamber 500, the second reaction chamber 500, the third reaction chamber 500, ... the Nth reaction chamber 500.

[0104] S2 , the first transfer member 300 transfers the first wafer 200 from the transmission chamber 400 to any remaining empty reaction chamber 500 among the first reaction chamber 500 , the second reaction chamber 500 , the third reaction chamber 500 . . . the Nth reaction chamber 500 .

[0105] When both the first reaction chamber 500 and the second reaction chamber 500 have wafers 200 reacting, the wafers 200 entering the transmission chamber 400 from the outside are transferred to the third reaction chamber 500 through the transfer member 300 for reaction, and the above cycle is repeated until all N reaction chambers 500 have wafers 200 reacting, so that N+2 wafers 200 can be operated at the same time. It is ensured that all reaction chambers 500 have wafers 200 reacting, and the utilization rate of each reaction chamber 500 is improved, thereby improving work efficiency.

[0106] In step S1, when the second transporter 300 transfers the second wafer 200 to any empty reaction chamber 500, the second wafer 200 is a wafer 200 entering the transmission chamber 400 from the outside, or the second wafer 200 is a wafer 200 entering the transmission chamber 400 from the second transfer sealed chamber 100. When the number of wafers 200 in the coating equipment is N+2, the second wafer 200 is the wafer 200 in the second transfer sealed chamber 100. When the number of wafers 200 in the coating equipment is less than N+2, the second wafer 200 can be the wafer 200 in the second transfer sealed chamber 100, or the wafer 200 entering the transmission chamber 400 from the outside.

[0107] Exemplarily, after the external first wafer 200 enters the transfer chamber 400 , the transfer member 300 in the transfer chamber 400 transfers the first wafer 200 to the first reaction chamber 500 for reaction.

[0108] Afterwards, one of the transfer pieces 300, such as the first transfer piece 300, transfers the first wafer 200 out of the first reaction chamber 500, and transfers it to the transmission chamber 400, and then transfers it to one of the transfer sealed chambers 100, such as the first transfer sealed chamber 100. The rotating mechanism 2 in the first transfer sealed chamber 100 rotates the first wafer 200 by a certain angle, and the first transfer piece 300 then transfers the first wafer 200 to the transmission chamber 400 and enters the second reaction chamber 500 (the second reaction chamber 500 is currently empty) for reaction.

[0109] At the same time, after the first transfer component 300 transfers the first wafer 200 out of the first reaction chamber 500, another transfer component 300, i.e., the second transfer component 300, simultaneously transfers another external wafer 200, i.e., the second wafer 200, to the first reaction chamber 500 for reaction, or another transfer component 300, i.e., the second professional component transfers the wafer 200 rotated by the rotating mechanism 2 in another transfer sealed chamber 100, i.e., the second transfer sealed chamber 100, to the transmission chamber 400 and then enters the first reaction chamber 500 (the current first reaction chamber 500 is empty) for reaction.

[0110] When both the first reaction chamber 500 and the second reaction chamber 500 have wafers 200 undergoing reactions, the transfer member 300 transfers the wafers 200 entering the transmission chamber 400 from the outside to the third reaction chamber 500 for reaction, and the above cycle is repeated until all the N reaction chambers 500 have wafers 200 undergoing reactions, so that the coating equipment can operate on N+2 wafers 200 at the same time.

[0111] Through the cooperation of the above two transfer members 300 , the reaction chamber 500 can be prevented from being idle, that is, it can be fully utilized, thereby improving the deposition efficiency of the equipment on multiple wafers 200 .

[0112] For the first wafer 200 alone, its deposition reaction process in the coating equipment is as follows: in step S1, it also includes: the first transfer member 300 transfers the first wafer 200 in the first preset position from the first reaction chamber 500 to the rotating mechanism 2 of the transfer sealing chamber 100; the rotating mechanism 2 drives the wafer 200 to rotate a preset angle;.

[0113] Step S2 also includes: the first transfer member 300 moves the wafer 200 from the rotating mechanism 2 to the first transfer sealing chamber 100, and then transfers it to any remaining empty reaction chamber 500 in the first reaction chamber 500, the second reaction chamber 500, the third reaction chamber 500...the Nth reaction chamber 500, so that the wafer 200 is located in the reaction chamber 500 in the second preset position and reacts.

[0114] The wafer 200 is transferred between the reaction chamber 500 and the rotating mechanism 2 by the transport member 300, and the rotating mechanism 2 drives the wafer 200 to rotate at a preset angle, so that the wafer 200 is located in the reaction chamber 500 at two different preset positions. In the case where there are multiple conditions in the reaction chamber 500 that lead to uneven coating, the film on the surface of the wafer 200 is ensured to be uniform, and the quality of the wafer 200 is ensured. Specifically, the above steps can be repeated multiple times according to actual conditions, that is, the position of the wafer 200 in the reaction chamber 500 is adjusted multiple times to ensure the reaction uniformity of the wafer 200 in the reaction chamber 500, that is, to ensure the uniformity of the film on the surface of the wafer 200.

[0115] Embodiment 2

[0116] The present embodiment provides a coating device for sealing and adjusting wafers 200 in multiple reaction chambers 500, which includes a transmission chamber 400, multiple reaction chambers 500 and a transfer sealing chamber 100. The transmission chamber 400 includes two transport parts 300, and the two transport parts 300 can simultaneously operate and transport different wafers 200. The number of reaction chambers 500 is greater than or equal to 3 and less than or equal to 8. The reaction chamber 500 is used for the wafer 200 to perform a deposition reaction therein. The multiple reaction chambers 500 are respectively connected to the transmission chamber 400, and the two transport parts 300 can dock with the multiple reaction chambers 500 to take and place the wafer 200. The transfer sealed chamber 100 is connected to the transmission chamber 400. The transfer sealed chamber 100 includes two sets of transfer components. Each set of transfer components includes a driving mechanism and a rotating mechanism 2. The driving mechanism can drive the rotating mechanism 2 to rotate. The rotating mechanism 2 is used to carry the wafer 200 and drive the wafer 200 to rotate horizontally. The two transfer parts 300 can be docked with the two rotating mechanisms 2 to take and place the wafer 200.

[0117] By providing multiple reaction chambers 500, multiple reaction chambers 500 correspond to multiple wafers 200 one by one, it is possible to achieve deposition reaction of multiple wafers 200 at the same time; or, each reaction chamber 500 corresponds to multiple wafers 200, further increasing the number of wafers 200 that are simultaneously subjected to deposition reaction, thereby improving work efficiency. In addition, by providing a transfer sealed chamber 100 and two transfer parts 300, a transfer sealed chamber 100 has two transfer components, and both transfer parts 300 can dock with multiple reaction chambers 500 and two transfer components, wafers 200 are transferred simultaneously through two transfer parts 300, two transfer components rotate different wafers 200 at the same time, and multiple reaction chambers 500 simultaneously perform deposition reaction on multiple wafers 200, thereby improving work efficiency. Furthermore, a transfer component 300 takes the wafer 200 out of the reaction chamber 500 and places it into the transfer sealed chamber 100. At the same time, another transfer component 300 takes the wafer 200 out of the transfer sealed chamber 100 and places it back into the reaction chamber 500. The two transfer components 300 work simultaneously but perform different process steps to ensure that N reaction chambers 500 all have wafers 200 undergoing reaction, so that the coating equipment can operate on N+2 wafers 200 at the same time, avoiding the reaction chamber 500 from being idle, making full use of it, and improving work efficiency.

[0118] And the wafer 200 can react in the reaction chamber 500 at at least two different preset angles, that is, the coating on the surface of the wafer 200 is uniformed by rotating the wafer 200 a certain number of times, ensuring the uniformity of the deposited film on the surface of the wafer 200 and the coating quality of the wafer 200.

[0119] This embodiment also provides a coating method for sealing and adjusting the wafers 200 in a plurality of reaction chambers 500 , which can be performed with reference to the method in the first embodiment and will not be described in detail.

[0120] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A coating device for sealing and adjusting wafers in multiple reaction chambers, characterized in that: include: A transport chamber (400), the transport chamber (400) comprising two transport members (300), the two transport members (300) being capable of operating simultaneously to transport different wafers (200); A plurality of reaction chambers (500), the number of the reaction chambers (500) being greater than or equal to 3 and less than or equal to 8, the reaction chambers (500) being used for the wafers (200) to perform deposition reactions therein, the plurality of reaction chambers (500) being respectively connected to the transmission chambers (400), and the two transporters (300) being able to dock with the plurality of reaction chambers (500) to take and place the wafers (200); Two transfer sealed chambers (100), the two transfer sealed chambers (100) are respectively connected to the transmission chamber (400), the transfer sealed chamber (100) comprises a transfer component, the transfer component comprises a driving mechanism and a rotating mechanism (2), the driving mechanism can drive the rotating mechanism (2) to rotate, the rotating mechanism (2) is used to carry the wafer (200) and drive the wafer (200) to rotate horizontally; the two transfer parts (300) can both dock with the two transfer sealed chambers (100) to take and place the wafer.

2. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 1, characterized in that: The transmission cavity (400) is a polygonal cavity having a plurality of side surfaces, and the plurality of reaction cavities (500) and the two transfer sealing cavities (100) are correspondingly arranged on the plurality of side surfaces of the transmission cavity (400).

3. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 1, characterized in that: The rotating mechanism (2) comprises a rotating shaft (21) and a bearing assembly (22) arranged on the rotating shaft (21), wherein the bearing assembly (22) comprises a bearing member (221) and a guide member (222); along the radial direction of the rotating shaft (21), the bearing member (221) is arranged on a side of the guide member (222) close to the rotating shaft (21); the guide member (222) can guide the wafer (200) to the bearing member (221), so that the wafer (200) is supported on the bearing member (221), and the wafer (200) and the rotating shaft (21) are arranged coaxially.

4. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 3, characterized in that: At least three bearing assemblies (22) are circumferentially arranged at the end of the rotating shaft (21), and the bearing assembly (22) further comprises a connecting rod (223). The bearing member (221) and the guide member (222) are both arranged on the connecting rod (223), and the connecting rod (223) is connected to the rotating shaft (21) and is extended radially along the rotating shaft (21).

5. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 3, characterized in that: The carrier (221) is cylindrical, and the plane of its upper surface is used to support the wafer (200). The guide member (222) is provided with a guide slope (2221), and the guide slope (2221) is inclined downward in a direction from the guide member (222) to the carrier (221).

6. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 3, characterized in that: The transfer sealed chamber (100) comprises a first shell (11) and a second shell (12) which are sealed to each other, the bearing assembly (22) is arranged on the first shell (11), the driving mechanism is arranged on the second shell (12), the rotating shaft (21) is rotationally sealed to the first shell (11), the first shell (11) is provided with an opening (111), and the transfer member (300) enters and exits the transfer sealed chamber (100) from the opening (111) to transfer the wafer (200).

7. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 6, characterized in that: The transfer sealing cavity (100) further comprises a rotary sealing mechanism (3), and the rotary shaft (21) is sealedly connected to the first shell (11) via the rotary sealing mechanism (3).

8. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 7, characterized in that: The rotary sealing mechanism (3) comprises a supporting assembly (31) and a sealing member (32), wherein the supporting assembly (31) is sealedly connected to the first shell (11); a flange (211) is provided on the outer periphery of the rotary shaft (21), and a boss (212) is provided at the bottom of the flange (211) and is spaced apart from the rotary shaft (21); the rotary shaft (21) is passed through the supporting assembly (31) and the sealing member (32), and the sealing member (32) is clamped between the boss (212) and the supporting assembly (31), so that the sealing member (32) is sealedly connected to the outer periphery of the rotary shaft (21).

9. The film coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 8, characterized in that: The sealing member (32) comprises a sealing portion (321) and a pressing portion (322) whose cross sections are arranged at an angle, wherein the sealing portion (321) is sleeved on the rotating shaft (21) and is arranged at an angle with the rotating shaft (21), and the pressing portion (322) is clamped between the boss (212) and the support assembly (31).

10. The coating device for sealing and adjusting wafers in multiple reaction chambers according to claim 9, characterized in that: The support assembly (31) comprises a support base (311) and a support member, the support base (311) and the first shell (11) are sealed and connected, the clamping portion (322) is clamped between the boss (212) and the support base (311), and the support member is supported between the support base (311) and the sealing portion (321).

11. The film coating device for sealing and adjusting wafers in a plurality of reaction chambers according to claim 8, characterized in that: At least two of the sealing members (32) are provided, the rotating shaft (21) passes through at least two of the sealing members (32), and at least two of the sealing members (32) are clamped between the boss (212) and the supporting assembly (31).

12. The coating device for sealing and adjusting wafers in a plurality of reaction chambers according to any one of claims 1 to 11, characterized in that: An observation hole is provided at the top of the transfer sealing cavity (100), and the transfer sealing cavity (100) also includes an observation window (4), and the observation window (4) includes a window (41), a sealing ring (42), an annular pressure plate (43) and a first fastener (44), the window (41) is clamped between the annular pressure plate (43) and the transfer sealing cavity (100), the annular pressure plate (43) is connected to the transfer sealing cavity (100) through the first fastener (44), and the window (41) is arranged at the observation hole; the sealing ring (42) is arranged between the window (41) and the transfer sealing cavity (100).

13. A coating method for sealing and adjusting wafers in multiple reaction chambers, characterized in that: A coating device for sealing and adjusting wafers in a plurality of reaction chambers as claimed in any one of claims 1 to 11 is used, wherein the plurality of reaction chambers (500) are respectively a first reaction chamber (500), a second reaction chamber (500), a third reaction chamber (500) ... an Nth reaction chamber (500), N being greater than or equal to 3 and less than or equal to 8; the two transport components (300) are respectively a first transport component (300) and a second transport component (300); the two transfer sealing chambers (100) are respectively a first transfer sealing chamber (100) and a second transfer sealing chamber (100); the coating method for sealing and adjusting wafers in a plurality of reaction chambers comprises: The first transfer component (300) transfers the first wafer from the first reaction chamber (500) to the transmission chamber (400), and then to the first transfer sealed chamber (100); the rotating mechanism in the first transfer sealed chamber (100) rotates the first wafer by a certain angle, and the first transfer component (300) then transfers the first wafer from the transfer sealed chamber (100) to the transmission chamber (400); while the first transfer component (300) takes the first wafer out of the first reaction chamber (500), the second transfer component (300) transfers the second wafer to any empty reaction chamber (500) among the first reaction chamber (500), the second reaction chamber (500), the third reaction chamber (500) ... the Nth reaction chamber (500); The first transfer member (300) then transfers the first wafer from the transmission chamber (400) to any remaining empty reaction chamber (500) among the first reaction chamber (500), the second reaction chamber (500), the third reaction chamber (500) ... the Nth reaction chamber (500).

14. The film coating method for sealing and adjusting wafers in a plurality of reaction chambers according to claim 13, characterized in that: When the second transfer member (300) transfers the second wafer to any empty reaction chamber (500), the second wafer is a wafer that enters the transmission chamber (400) from the outside, or the second wafer is a wafer that enters the transmission chamber (400) from the second transfer sealing chamber (100).

15. The film coating method for sealing and adjusting wafers in a plurality of reaction chambers according to claim 13, characterized in that: When both the first reaction chamber (500) and the second reaction chamber (500) have wafers undergoing reaction, the wafers entering the transmission chamber (400) from the outside are transferred to the third reaction chamber (500) through the transfer member for reaction, and the above cycle is repeated until all N reaction chambers (500) have wafers undergoing reaction, so that N+2 wafers can be operated simultaneously.

16. The film coating method for sealing and adjusting wafers in a plurality of reaction chambers according to claim 13, characterized in that: The first transfer member (300) transfers the first wafer (200) in a first preset posture from the first reaction chamber (500) to the rotating mechanism (2) of the transfer sealing chamber (100); the rotating mechanism (2) drives the wafer (200) to rotate by a preset angle; The first transfer member (300) moves the wafer (200) from the rotating mechanism (2) to the first transfer sealing chamber (100), and then transfers it to any remaining empty reaction chamber (500) among the first reaction chamber (500), the second reaction chamber (500), the third reaction chamber (500) ... the Nth reaction chamber (500), so that the wafer (200) is located in the reaction chamber (500) in a second preset position and reacts.

17. A coating device for sealing and adjusting wafers in multiple reaction chambers, characterized in that: include: A transport chamber (400), wherein the transport chamber (400) comprises two transport members (300), and the two transport members (300) are capable of simultaneously operating to transport different wafers (200); A plurality of reaction chambers (500), the number of the reaction chambers (500) being greater than or equal to 3 and less than or equal to 8, the reaction chambers (500) being used for the wafers (200) to perform deposition reactions therein, the plurality of reaction chambers (500) being respectively connected to the transmission chambers (400), and the two transporters (300) being able to dock with the plurality of reaction chambers (500) to take and place the wafers (200); A transfer sealed chamber (100), the transfer sealed chamber (100) is connected to the transmission chamber (400), the transfer sealed chamber (100) includes two sets of transfer components, each set of the transfer components includes a driving mechanism and a rotating mechanism (2), the driving mechanism can drive the rotating mechanism (2) to rotate, the rotating mechanism (2) is used to carry the wafer (200) and drive the wafer (200) to rotate horizontally; the two transfer members (300) can both dock with the two rotating mechanisms (2) to take and place the wafer.

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