Bending-resistant reinforced carrier plate

Abstract

An anti-bending reinforced carrier plate comprises a substrate, a plurality of hard insulating plates, a plurality of metal columns, a resin layer, a first circuit layer and a second circuit layer. A plurality of positioning areas are defined on the upper surface of the substrate, and the substrate is provided with a first through hole penetrating through the substrate. The hard insulating plate is arranged on the positioning area and is provided with a plurality of second through holes penetrating through the hard insulating plate; the metal column is filled in the second through hole. The resin layer covers the hard insulating plate and the upper surface of the substrate, and the resin layer comprises a plurality of openings. The first circuit layer is located on the surface of the resin layer and in the opening and connected with the metal columns. The second circuit layer is located on the lower surface of the substrate and in the first through hole and connected with the metal columns. By embedding the hard insulating plate, the stability during heating is maintained, the mechanical strength is increased, high coplanarity can be provided, and the packaging structure is suitable for being applied to advanced wafer packaging.

Description

Technical Field

[0001] The invention relates to the field of chip packaging, in particular to an anti-bending reinforced carrier board. Background Art

[0002] After the emergence of the demand for semiconductor chip 2.0D to 3.0D packaging, the density and complexity have increased significantly. In order to meet the packaging requirements of semiconductor chips, an interposer is usually introduced to package small chips and large chips.

[0003] However, the demand for criss-cross large-area splicing poses the biggest challenge to advanced packaging, which is the flatness and stability of the material base, especially in the face of large temperature changes in the welding process. At present, the industry hopes to increase the thickness of the core board to improve the assembly process, actual product operation, and the coplanarity and stability of the packaging plane. However, at present, the core board is made of glass fiber, and thermal stability is its biggest disadvantage. When facing small chips and large-area packaging, high coplanarity and stability are necessary characteristics. Therefore, improving the temperature resistance and mechanical strength of the carrier board is a major challenge today. Summary of the invention

[0004] In order to solve the problems faced by the prior art, an anti-bending and strengthening carrier is provided. The anti-bending and strengthening carrier includes a substrate, a plurality of hard insulating plates, a plurality of metal pillars, a resin layer, a first circuit layer, and a second circuit layer.

[0005] The substrate has an upper surface and a lower surface, and the upper surface is defined with a plurality of positioning areas. The substrate also has a plurality of first through holes that penetrate the upper surface and the lower surface. The rigid insulating plates are respectively arranged on the positioning areas, and each rigid insulating plate is provided with a plurality of second through holes that penetrate the first surface and the second surface of the rigid insulating plate. The metal pillars are respectively filled in the second through holes. The resin layer is located on the upper surface of the substrate and the rigid insulating plate, covering the rigid insulating plate and the upper surface of the substrate, and the resin layer includes a plurality of openings. The first circuit layer is located on a portion of the surface of the resin layer and in the opening, and is connected to the metal pillar. The second circuit layer is located on a portion of the lower surface of the substrate and in the first through hole, and is connected to the metal pillar.

[0006] In some embodiments, positions of the openings correspond to the second through holes respectively.

[0007] In some embodiments, the first surface of each rigid insulating board further includes a third circuit layer, the third circuit layer connects the metal column in the second through hole and the first circuit layer. Further, in some embodiments, the second surface of each rigid insulating board further includes a fourth circuit layer, the fourth circuit layer connects the metal column in the second through hole and the second circuit layer.

[0008] In some embodiments, a coating is further included between the sidewall surface of the second through hole and the metal column. Preferably, in some embodiments, the coating is a resin coating.

[0009] In some embodiments, a plurality of grooves are formed on the upper surface of the substrate, the grooves define positioning areas, and the hard insulating plates are respectively clamped in the grooves.

[0010] In some embodiments, the anti-bending reinforced carrier further includes a first solder mask layer, a first pad layer, a second solder mask layer and a second pad layer. The first solder mask layer is located on the resin layer and has a plurality of first pad openings, the first pad layer is filled in the first pad openings and is electrically connected to the first circuit layer. The second solder mask layer is located on the lower surface of the substrate and has a plurality of second pad openings, the second pad layer is filled in the second pad openings and is electrically connected to the second circuit layer.

[0011] Further, in some embodiments, the first pad layer includes a plurality of first pads, the first pads protrude from the first solder mask layer, the second pad layer includes a plurality of second pads, the second pads protrude from the second solder mask layer, and the first spacing between the first pads is smaller than the second spacing between the second pads.

[0012] Further, in some embodiments, the anti-bending reinforced carrier also includes a first protective layer, a first redistribution layer, a second protective layer and a second redistribution layer. The first protective layer is located between the resin layer and the first solder mask layer, covers the first circuit layer, and has a plurality of first openings. The first redistribution layer is located on a portion of the first protective layer and fills the first opening, connecting the first circuit layer and the first pad layer. The second protective layer is located between the lower surface of the substrate and the second solder mask layer, covers the second circuit layer, and has a plurality of second openings. The second redistribution layer is located on a portion of the second protective layer and fills the second opening, connecting the second circuit layer and the second pad layer.

[0013] In more detail, in some embodiments, the positions of the first openings correspond to the first pad openings, respectively, and the positions of the second openings correspond to the second pad openings, respectively.

[0014] In some embodiments, each rigid insulating plate is a ceramic plate, a glass plate, or a silicon carbide plate.

[0015] In some embodiments, the length and width of each rigid insulating board range from 3 to 100 cm, and the thickness ranges from 0.1 to 0.5 mm.

[0016] As shown in the aforementioned embodiments, the anti-bending reinforced carrier can effectively maintain thermal stability when heated and increase mechanical strength through the embedded hard insulating plate, thereby providing high coplanarity and stability for small chips and large area packaging, and is suitable for application in high-density advanced chip packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A top view of a first embodiment of an anti-bending reinforced carrier plate;

[0018] Figure 2 A partial cross-sectional view of a first embodiment of an anti-bending reinforced carrier plate;

[0019] Figure 3 A partial cross-sectional view of a second embodiment of an anti-bending reinforced carrier plate;

[0020] Figure 4 A partial cross-sectional view of a third embodiment of an anti-bending reinforced carrier plate;

[0021] Figure 5 and Figure 6 Partial cross-sectional views of different implementations of a rigid insulating board;

[0022] Figure 7 This is a comparison chart of the thermal bending resistance test.

[0023]

Explanation of symbols

[0024] 1: Anti-bending reinforced carrier board

[0025] 10:Substrate

[0026] 11: Upper surface

[0027] 13: Lower surface

[0028] 15: Positioning area

[0029] 17: First through hole

[0030] 19: Groove

[0031] 191:Wall

[0032] 20: Rigid insulation board

[0033] 21: First surface

[0034] 23: Second surface

[0035] 25: Second through hole

[0036] 251: Side wall

[0037] 255: Coating

[0038] 30:Metal column

[0039] 40: Resin layer

[0040] 45: Opening

[0041] 51: First circuit layer

[0042] 53: Second circuit layer

[0043] 55: The third circuit layer

[0044] 57: Fourth circuit layer

[0045] 61: First solder mask layer

[0046] 615: first pad opening

[0047] 71: first pad layer

[0048] 711: first pad

[0049] 63: Second solder mask layer

[0050] 635: second pad opening

[0051] 73: Second solder pad layer

[0052] 731: Second welding pad

[0053] 81: First protective layer

[0054] 815: First Opening

[0055] 91: First redistribution layer

[0056] 83: Second protective layer

[0057] 835: Second opening

[0058] 93: Second redistribution layer

[0059] D1: First spacing

[0060] D2: Second spacing DETAILED DESCRIPTION

[0061] It should be understood that when an element is referred to as being "disposed" or "connected" to another element, it may mean that the element is directly located on the other element, or there may be an intermediate element through which the element and the other element are connected. Conversely, when an element is referred to as being "directly disposed / connected to another element" or "directly disposed / connected to another element", it should be understood that it is clearly defined that there is no intermediate element.

[0062] In addition, the terms "first", "second", "third" are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part, rather than to indicate a necessary order of precedence. In addition, relative terms such as "lower" and "upper" may be used herein to describe the relationship between one element and another element, and it should be understood that the relative terms are intended to include different orientations of the device in addition to the orientation shown in the figure. For example, if a device in a figure is flipped, the element described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. This only represents a relative orientation relationship, not an absolute orientation relationship.

[0063] Figure 1 FIG. 1 is a top view of a first embodiment of an anti-bending reinforced carrier plate. Figure 2 FIG. 1 is a partial cross-sectional view of the first embodiment of the anti-bending reinforced carrier plate. Figure 1 and Figure 2 As shown, the anti-bending reinforced carrier 1 includes a substrate 10 , a plurality of hard insulating plates 20 , a plurality of metal pillars 30 , a resin layer 40 , a first circuit layer 51 , and a second circuit layer 53 . Figure 1 Only to clearly show the relative positions of the substrate 10 and the rigid insulating board 20 , other elements are omitted.

[0064] like Figure 1 and Figure 2 As shown, the substrate 10 has an upper surface 11 and a lower surface 13, and a plurality of positioning areas 15 are defined on the upper surface. The substrate 10 also has a plurality of first through holes 17 that penetrate the upper surface 11 and the lower surface 13. The rigid insulating plates 20 are respectively arranged on the positioning areas 15, and each rigid insulating plate 20 is provided with a plurality of second through holes 25 that penetrate the first surface 21 and the second surface 23 of the rigid insulating plate 20. The metal pillars 30 are respectively filled in the second through holes 25. Here, the rigid insulating plate 20 can be a ceramic plate, a glass plate, or a silicon carbide plate. In addition, the length and width of the rigid insulating plate 20 range from 3 to 100 cm, and the thickness is 0.1 to 0.5 mm. However, this is only an example, not a limitation, and the actual size of the rigid insulating plate 20 will be determined according to the actual product requirements.

[0065] The resin layer 40 is located on the upper surface 11 of the substrate 10 and the rigid insulating plate 20, covering the rigid insulating plate 20 and the upper surface 11 of the substrate 10. The resin layer 40 includes a plurality of openings 45. The first circuit layer 51 is located on a portion of the surface of the resin layer 40 and in the openings 45, and is connected to the metal column 30. The second circuit layer 53 is located on a portion of the lower surface 13 of the substrate 10 and in the first through hole 17, and is connected to the metal column 30.

[0066] Here, the metal column 30 can be made by thick film technology filled with conductive paste, or by electroplating, and the main material is copper or aluminum. In other words, in terms of the order of the manufacturing method, the metal column 30 can be formed by laser drilling in the hard insulating board 20 and then filling the conductive paste. Then the resin layer 40 is formed thereon. Alternatively, after forming the resin layer 40, after laser drilling, the metal layer is filled by electroplating to form the metal column 30 and the first circuit layer 51. If the latter method is used, the opening 45 and the second through hole 25 are formed at the same time, and the position of the opening 45 corresponds to the second through hole 25 respectively.

[0067] A single, large-area rigid insulating board 20 may be subjected to greater stress in subsequent manufacturing processes, resulting in local cracking. The risk of cracking can be reduced by using multiple rigid insulating boards 20. Furthermore, by coating with the resin layer 40, the edges of the rigid insulating board 20 can be ensured not to be exposed, thereby avoiding cracking of the interface.

[0068] Figure 3 This is a partial cross-sectional view of the second embodiment of the anti-bending reinforced carrier. Figure 2 ,like Figure 3 As shown, the difference from the first embodiment is that a plurality of grooves 19 are provided on the upper surface 11 of the substrate 10, and the grooves 19 define the positioning areas 15, and the rigid insulating plates 20 are respectively clamped in the grooves 19. In other words, the side edges of the rigid insulating plates 20 are in contact with the wall surfaces 191 of the grooves 19. It can be understood that the first embodiment is formed by placing the rigid insulating plates 20 on the upper surface 11 of the substrate 10 and then pouring the resin layer 40. In the second embodiment, the rigid insulating plates 20 are clamped in the grooves 19 and then the resin layer 40 is formed thereon.

[0069] Figure 4 FIG. 1 is a partial cross-sectional view of the third embodiment of the anti-bending reinforced carrier plate. Figure 4 As shown, refer to Figure 2 and Figure 3 , which is different from the first embodiment and the second embodiment in that the third embodiment further includes a third circuit layer 55 on the first surface 21 of the rigid insulating board 20, and the third circuit layer 55 connects the metal column 30 in the second through hole 25 and the first circuit layer 51. Here, it can be understood that the rigid insulating board 20 can form a metal film on the first surface 21 by thick film technology after laser drilling, and fill the second through hole 25 to form the metal column 30. Then, the third circuit layer 55 can be formed thereon by laser ablation. Further, in some embodiments, the second surface 23 of each rigid insulating board 20 also includes a fourth circuit layer 57, and the fourth circuit layer 57 connects the metal column 30 in the second through hole 25 and the second circuit layer 53.

[0070] Refer again Figures 2 to 4, the above-mentioned substrate 10, multiple rigid insulating plates 20, multiple metal pillars 30, resin layer 40, first circuit layer 51, and second circuit layer 53 can be considered as a core board. Further, layers can be added thereon, for example, the anti-bending reinforced carrier 1 also includes a first solder mask layer 61, a first pad layer 71, a second solder mask layer 63, and a second pad layer 73. The first solder mask layer 61 is located on the resin layer 40 and has multiple first pad openings 615. The first pad layer 71 is filled in the first pad opening 615 and is electrically connected to the first circuit layer 51. The second solder mask layer 63 is located on the lower surface 13 of the substrate 10 and has multiple second pad openings 635. The second pad layer 73 is filled in the second pad opening 635 and is electrically connected to the second circuit layer 53.

[0071] In more detail, the first pad layer 71 includes a plurality of first pads 711, the first pads 711 protrude from the first solder mask layer 61, the second pad layer 73 includes a plurality of second pads 731, the second pads 731 protrude from the second solder mask layer 63, and the first spacing D1 between the first pads 711 is smaller than the second spacing D2 between the second pads 731. In other words, the anti-bending reinforcement carrier 1 can be used as an interposer between the chip and the system motherboard, and the spacing distribution function is achieved through the first circuit layer 51 and the second circuit layer 53.

[0072] Further, in some embodiments, the anti-bending reinforced carrier 1 further includes a first protective layer 81, a first redistribution layer 91, a second protective layer 83 and a second redistribution layer 93. The first protective layer 81 is located between the resin layer 40 and the first solder mask layer 61, covers the first circuit layer 51, and has a plurality of first openings 815. The first redistribution layer 91 is located on a portion of the first protective layer 81 and fills the first openings 815, connecting the first circuit layer 51 and the first pad layer 71. The second protective layer 83 is located between the lower surface 13 of the substrate 10 and the second solder mask layer 63, covers the second circuit layer 53, and has a plurality of second openings 835. The second redistribution layer 93 is located on a portion of the second protective layer 83 and fills the second openings 835, connecting the second circuit layer 53 and the second pad layer 73.

[0073] In fact, the first redistribution layer 91 and the second redistribution layer 93 are mainly used to match the design of the chip and the system pins, and to lead the circuits to different positions and match the positions and spacings of the different first pads 711 and the second pads 731. In actual situations, multiple layers of the first protection layer 81, the first redistribution layer 91, the second protection layer 83, and the second redistribution layer 93 may be provided.

[0074] In some embodiments, the positions of the first openings 815 correspond to the first pad openings 615 , and the positions of the second openings 835 correspond to the second pad openings 635 . However, this is only an example and not intended to be limiting.

[0075] Figure 5 and Figure 6 2 is a partial cross-sectional view of different embodiments of the rigid insulating plate 20. Figure 5 and Figure 6 As shown, for different precisions, drilling and filling types, the second through hole 25 may be as follows Figure 5 As shown, only the metal pillar 30 is filled. Alternatively, Figure 6 As shown, a coating 255 is further included between the sidewall surface 251 of the second through hole 25 and the metal pillar 30. Preferably, the coating 255 can be a resin coating.

[0076] Figure 7 This is a comparison chart of the heat bending test. In this heat bending test, the structure of the first embodiment is used as an example, and the ceramic plate is used as the hard insulating plate 20; a full glass fiber substrate with a 2 cm thick core area is used as a comparison example to simulate the temperature rise and fall of welding to compare the warping of the carrier board. Figure 7 As shown, it is obvious that the warpage of the comparative example changes significantly from temperature increase to temperature decrease, while the warpage of the embodiment is close to no change and is almost within the error range of the test equipment.

[0077] In summary, the anti-bending reinforced carrier 1 can effectively maintain thermal stability when heated and increase mechanical strength by embedding multiple hard insulating plates 20, thereby providing high coplanarity and stability for small chips and large area packaging, and is suitable for application in high-density advanced chip packaging.

[0078] Although the technical contents of the present invention have been disclosed as above in the preferred embodiments, they are not used to limit the present invention. Any slight changes and modifications made by anyone familiar with this technology without departing from the spirit of the present invention should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be based on the scope defined by the attached claims.

Claims

1. A bending-resistant reinforced carrier plate, characterized in that: Include: A substrate having an upper surface and a lower surface, wherein the upper surface defines a plurality of positioning areas, and the substrate further has a plurality of first through holes penetrating the upper surface and the lower surface; A plurality of rigid insulating plates are respectively disposed on the plurality of positioning areas, each of the rigid insulating plates is provided with a plurality of second through holes penetrating through a first surface and a second surface of each of the rigid insulating plates; A plurality of metal pillars, wherein the plurality of metal pillars are respectively filled in the plurality of second through holes; a resin layer, located on the upper surface of the substrate and the plurality of rigid insulating plates, covering the plurality of rigid insulating plates and the upper surface of the substrate, the resin layer being provided with a plurality of openings; a first circuit layer, located on a portion of a surface of the resin layer and in the plurality of openings, and connected to the plurality of metal pillars; as well as A second circuit layer is located on a portion of the lower surface of the substrate and in the plurality of first through holes and is connected to the plurality of metal pillars.

2. The anti-bending reinforced carrier plate according to claim 1, characterized in that: Positions of the plurality of openings correspond to the plurality of second through holes respectively.

3. The anti-bending reinforced carrier plate according to claim 1, characterized in that: The first surface of each of the rigid insulating plates further includes a third circuit layer, and the third circuit layer connects the metal pillars in the plurality of second through holes and the first circuit layer.

4. The anti-bending reinforced carrier plate according to claim 3, characterized in that: The second surface of each of the rigid insulating plates further includes a fourth circuit layer, and the fourth circuit layer connects the metal pillars in the plurality of second through holes and the second circuit layer.

5. The anti-bending reinforced carrier plate according to claim 1, characterized in that: A coating is also included between one side wall of the plurality of second through holes and the metal column.

6. The anti-bending reinforced carrier plate according to claim 5, characterized in that: The coating is a resin coating.

7. The anti-bending reinforced carrier plate according to claim 1, characterized in that: The upper surface of the base plate is provided with a plurality of grooves, the plurality of grooves define the plurality of positioning areas, and the plurality of hard insulating plates are respectively clamped in the plurality of grooves.

8. The anti-bending reinforced carrier plate according to claim 1, characterized in that: It also includes a first solder resist paint layer, a first solder pad layer, a second solder resist paint layer and a second solder pad layer. The first solder resist paint layer is located on the resin layer and has a plurality of first solder pad openings. The first solder pad layer is filled in the plurality of first solder pad openings and is electrically connected to the first circuit layer. The second solder resist paint layer is located on the lower surface of the substrate and has a plurality of second solder pad openings. The second solder pad layer is filled in the plurality of second solder pad openings and is electrically connected to the second circuit layer.

9. The anti-bending reinforced carrier plate according to claim 8, characterized in that: The first pad layer includes a plurality of first pads, the plurality of first pads protrude from the first solder mask layer, the second pad layer includes a plurality of second pads, the plurality of second pads protrude from the second solder mask layer, and a first spacing between the plurality of first pads is smaller than a second spacing between the plurality of second pads.

10. The anti-bending reinforced carrier plate according to claim 8, characterized in that: It also includes a first protective layer, a first redistribution layer, a second protective layer and a second redistribution layer. The first protective layer is located between the resin layer and the first solder mask layer, covers the first circuit layer, and has a plurality of first openings. The first redistribution layer is located on a portion of the first protective layer and fills in the plurality of first openings, connecting the first circuit layer and the first pad layer. The second protective layer is located between the lower surface of the substrate and the second solder mask layer, covers the second circuit layer, and has a plurality of second openings. The second redistribution layer is located on a portion of the second protective layer and fills in the plurality of second openings, connecting the second circuit layer and the second pad layer.

11. The anti-bending reinforced carrier plate according to claim 10, characterized in that: The positions of the plurality of first openings correspond to the plurality of first pad openings respectively, and the positions of the plurality of second openings correspond to the plurality of second pad openings respectively.

12. The anti-bending reinforced carrier plate according to claim 1, characterized in that: Each of the hard insulating plates is a ceramic plate, a glass plate, or a silicon carbide plate.

13. The anti-bending reinforced carrier plate according to claim 1, characterized in that: The length and width of each rigid insulating board range from 3 to 100 cm, and the thickness ranges from 0.1 to 0.5 mm.

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