Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment, and belongs to the technical field of electronics. The circuit board assembly comprises a flexible circuit board, a first circuit board and a second circuit board, the first circuit board and the second circuit board are stacked in the thickness direction of the circuit board assembly, the second circuit board is provided with a containing groove, and the containing groove is used for containing at least part of components on the first circuit board; at least one of the first circuit board and the second circuit board is provided with a groove, and the first part of the flexible circuit board extends into the groove and is connected and electrically conducted with at least one of the first circuit board and the second circuit board.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to a circuit board assembly and an electronic device. Background Art

[0002] Flexible Printed Circuit (FPC) is used as a connecting component to connect components to Printed Circuit Board (PCB), or to connect two circuit boards. Flexible printed circuits have the advantages of being bendable and taking up little space, so they are widely used in electronic devices such as mobile phones and computers.

[0003] In the related art, the circuit board assembly includes a main circuit board and a flexible circuit board, and the main circuit board and the flexible circuit board can be connected through a BTB (Board To Board) connector. The BTB connector includes a BTB male socket and a BTB female socket, the BTB female socket is arranged on the main circuit board, and the BTB male socket is arranged on the flexible circuit board. The main circuit board and the flexible circuit board are interconnected by buckling the BTB female socket and the BTB male socket along the thickness direction of the main circuit board.

[0004] However, the BTB connector is relatively thick, which may easily increase the thickness of the circuit board assembly and further increase the thickness of the electronic device, which is not conducive to the thinness of the electronic device. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a circuit board assembly and an electronic device, which can solve the problem in the related art that the thickness of the BTB connector is relatively large, which easily leads to an increase in the thickness of the circuit board assembly.

[0006] In a first aspect, an embodiment of the present application provides a circuit board assembly, comprising a flexible circuit board, a first circuit board and a second circuit board stacked along a thickness direction of the circuit board assembly, wherein the second circuit board is provided with a receiving groove, and the receiving groove is used to receive at least part of the components on the first circuit board; A groove is provided on at least one of the first circuit board and the second circuit board, and the first part of the flexible circuit board extends into the groove and is connected and electrically conducted with at least one of the first circuit board and the second circuit board.

[0007] In a second aspect, an embodiment of the present application further provides an electronic device, comprising a housing and the above-mentioned circuit board assembly, wherein the circuit board assembly is located inside the housing.

[0008] In an embodiment of the present application, a groove is provided on at least one of the first circuit board and the second circuit board, and the first part of the flexible circuit board extends into the groove and is electrically connected to at least one of the first circuit board and the second circuit board, so that the first circuit board and / or the second circuit board can be interconnected with the flexible circuit board. In this way, there is no need to provide a connector on the first circuit board and / or the second circuit board, which is beneficial to reducing the thickness of the circuit board assembly, thereby facilitating the thinning of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is one of the cross-sectional views of the circuit board assembly disclosed in the embodiment of the present application (the second connection surface of the first part is provided with a reinforcement plate); Figure 2 It is one of the structural schematic diagrams of the first connecting surface of the first part disclosed in the embodiment of the present application (the second connecting surface of the first part is provided with a reinforcing plate); Figure 3 It is one of the structural schematic diagrams of the second connecting surface of the first part disclosed in the embodiment of the present application (the second connecting surface of the first part is provided with a reinforcing plate); Figure 4 It is one of the side views of the first part disclosed in the embodiment of the present application (the second connecting surface of the first part is provided with a reinforcing plate); Figure 5 This is the second cross-sectional view of the circuit board assembly disclosed in the embodiment of the present application (the second connection surface of the first part is provided with a reinforcement plate); Figure 6 This is the third cross-sectional view of the circuit board assembly disclosed in the embodiment of the present application (the first connection surface and the second connection surface of the first part are both provided with a reinforcement plate); Figure 7 This is the second structural schematic diagram of the first connecting surface of the first part disclosed in the embodiment of the present application (the first connecting surface and the second connecting surface of the first part are both provided with a reinforcing plate); Figure 8 This is the second structural schematic diagram of the second connecting surface of the first part disclosed in the embodiment of the present application (the first connecting surface and the second connecting surface of the first part are both provided with a reinforcing plate); Fig. 9 This is the second side view of the first part disclosed in the embodiment of the present application (the first connecting surface and the second connecting surface of the first part are both provided with a reinforcing plate); Fig.10 This is the fourth cross-sectional view of the circuit board assembly disclosed in the embodiment of the present application (the first connection surface and the second connection surface of the first part are both provided with a reinforcement plate); Fig.11 This is the fifth cross-sectional view of the circuit board assembly disclosed in the embodiment of the present application (neither the first connection surface nor the second connection surface of the first part is provided with a reinforcing plate); Fig.12 This is the third structural schematic diagram of the first connecting surface of the first part disclosed in the embodiment of the present application (neither the first connecting surface nor the second connecting surface of the first part is provided with a reinforcing plate); Fig.13 This is the third structural schematic diagram of the second connecting surface of the first part disclosed in the embodiment of the present application (neither the first connecting surface nor the second connecting surface of the first part is provided with a reinforcing plate); Fig.14 It is one of the connection relationship diagrams of the flexible circuit board and the second circuit board disclosed in the embodiment of the present application (the first connection surface of the first part is provided with a reinforcing plate); Fig.15 This is the second connection relationship diagram between the flexible circuit board and the second circuit board disclosed in the embodiment of the present application (the second connection surface of the first part is provided with a reinforcing plate); Fig.16 is a cross-sectional view of a second circuit board disclosed in an embodiment of the present application; Fig.17 is a cross-sectional view of a first circuit board disclosed in an embodiment of the present application; Fig.18 This is the sixth cross-sectional view of the circuit board assembly disclosed in the embodiment of the present application (the solder between the first part and the first circuit board is hidden).

[0010] Description of reference numerals: 100-main circuit board; 110-first circuit board; 120-second circuit board; 121-accommodating slot; 122-groove; 130-first component; 140-second component; 150-third component; 160 - first shielding cover; 170 - second shielding cover; 180 - first electrical connector; 190 - signal connector; 1100 - second electrical connector; 200 - flexible circuit board; 210 - first portion; 211 - first connection surface; 212 - second connection surface; 220 - first welding portion; 230 - reinforcement plate; 231 - avoidance hole. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0013] The circuit board assembly and the electronic device provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0014] refer to Figure 1-Figure 18 A circuit board assembly provided in an embodiment of the present application may include a flexible circuit board 200, a first circuit board 110 and a second circuit board 120, and the flexible circuit board 200 may be interconnected with at least one of the first circuit board 110 and the second circuit board 120.

[0015] Among them, the first circuit board 110 and the second circuit board 120 can be stacked along the thickness direction of the circuit board assembly, so that the space in the thickness direction of the electronic device can be effectively utilized, which is beneficial to reducing the space occupied by the circuit board assembly in the length and width directions of the electronic device.

[0016] A first component 130 may be disposed on the first surface of the first circuit board 110, a second component 140 may be disposed on the second surface of the first circuit board 110, a third component 150 may be disposed on the surface of the second circuit board 120 facing away from the first circuit board 110, and the second circuit board 120 may be connected to the first circuit board 110 and electrically conductive, so that the third component 150 may be interconnected with the first component 130 and the second component 140. It should be noted that the number of the first component 130, the second component 140 and the third component 150 may be at least one. Here, the first circuit board 110 and the second circuit board 120 are electrically connected to form a main circuit board 100 of the electronic device, that is, the motherboard of the electronic device.

[0017] Furthermore, the second circuit board 120 is provided with a receiving groove 121, and the receiving groove 121 is used for embedding at least some components on the first circuit board 110. Specifically, the receiving groove 121 can be used for embedding the second component 140 on the second surface of the first circuit board 110. In this way, on the basis of reducing the space occupied by the circuit board assembly in the length direction and the width direction of the electronic device, the space occupied by the circuit board assembly in the thickness direction of the electronic device can be further reduced, which is more conducive to making the electronic device lighter and thinner.

[0018] Optionally, the second circuit board 120 may be a bent structure to form a receiving groove 121 . Specifically, the receiving groove 121 is formed between the second circuit board 120 and the first circuit board 110 .

[0019] It should be noted that the receiving groove 121 can be formed by bending the second circuit board 120. Of course, the receiving groove 121 can also be formed by digging on the second circuit board 120 using a tool, or the receiving groove 121 can also be formed by mold injection when the second circuit board 120 is injected.

[0020] At least one of the first circuit board 110 and the second circuit board 120 may be provided with a groove 122, and the first portion 210 of the flexible circuit board 200 may extend into the groove 122, and the flexible circuit board 200 may be connected and electrically connected to at least one of the first circuit board 110 and the second circuit board 120. In this way, the first circuit board 110 and / or the second circuit board 120 and the flexible circuit board 200 may be interconnected without providing a connector, which is conducive to reducing the thickness of the circuit board assembly, thereby facilitating the thinness of the electronic device; at the same time, since the connector is omitted, the cost of the circuit board assembly can be reduced.

[0021] It should be noted that the groove 122 can be directly opened on the first circuit board 110 and / or the second circuit board 120. Specifically, the groove 122 can be formed by directly digging on the first circuit board 110 and / or the second circuit board 120 using a tool, or can be formed by injection molding of a mold when the first circuit board 110 and / or the second circuit board 120 are injection molded. In this way, the groove 122 is formed between the first circuit board 110 and the second circuit board 120 without using other supporting parts to separate the first circuit board 110 and the second circuit board 120, which is conducive to further reducing the thickness of the circuit board assembly.

[0022] In an optional embodiment, the groove 122 may be provided on the side of the second circuit board 120, and the groove 122 may be provided close to the first circuit board 110. In this way, it is convenient for the first portion 210 located in the groove 122 to be connected to the first circuit board 110, and further convenient for the flexible circuit board 200 to be interconnected with the first circuit board 110. In addition, since the second circuit board 120 is a bent structure, its side surface has a larger area, so it is more conducive to providing the groove 122 without affecting the structural strength of the second circuit board 120.

[0023] Of course, the groove 122 may not be disposed on the side of the second circuit board 120 , but may be disposed on a side of the second circuit board 120 facing away from the first circuit board 110 , that is, the groove 122 may be a sink groove on the second circuit board 120 .

[0024] Optionally, the flexible circuit board 200 can be electrically connected to a battery of the electronic device, and the height of the groove 122 in the thickness direction of the circuit board assembly can be the same as the height of the battery in the thickness direction of the circuit board assembly. In this way, when the first part 210 of the flexible circuit board 200 is installed in the groove 122, it is beneficial to reduce the number of bending times of the flexible circuit board 200 and reduce the bending degree of the flexible circuit board 200, which is beneficial to extend the service life of the flexible circuit board 200.

[0025] In another optional embodiment, the groove 122 may be provided on the first circuit board 110, and the groove 122 may be provided close to the second circuit board 120. In this way, the first portion 210 located in the groove 122 is conveniently connected to the second circuit board 120, thereby facilitating the interconnection between the flexible circuit board 200 and the second circuit board 120.

[0026] Of course, the groove 122 may also be arranged away from the second circuit board 120 .

[0027] In another optional embodiment, the first circuit board 110 and the second circuit board 120 may be provided with a groove 122, the two grooves 122 are connected, and the first part 210 may be located in the two grooves 122. This arrangement is conducive to reducing the size of a single groove 122, thereby avoiding the reduction of the strength of the first circuit board 110 or the second circuit board 120 due to the groove size of the groove 122 being too large.

[0028] Of course, the groove 122 may also be disposed on only one of the first circuit board 110 and the second circuit board 120 .

[0029] In an optional embodiment, the circuit board assembly may include at least two flexible circuit boards 200, and at least two grooves 122 may be provided on the main circuit board 100, and the first portion 210 of each flexible circuit board 200 is respectively located in each groove 122. Optionally, the at least two flexible circuit boards 200 may include a flexible circuit board 200 electrically connected to a battery of the electronic device and a flexible circuit board 200 electrically connected to a key of the electronic device. Of course, the at least two flexible circuit boards 200 may also include flexible circuit boards 200 with other functions.

[0030] Here, each groove 122 may be provided on the second circuit board 120 , or each groove 122 may be provided on the first circuit board 110 , or at least one groove 122 may be provided on each of the first circuit board 110 and the second circuit board 120 .

[0031] It should be noted that the position of each groove 122 can be set according to actual needs. For example, each groove 122 can be set close to each flexible circuit board 200 to reduce the number of bending times of each flexible circuit board 200 and reduce the bending degree of each flexible circuit board 200.

[0032] In an optional embodiment of the present application, the circuit board assembly may further include a reinforcing plate 230, which may be disposed on the first portion 210 and connected to one of the first circuit board 110 and the second circuit board 120. This arrangement may improve the strength of the first portion 210, thereby improving the strength of the flexible circuit board 200, and may also improve the connection stability between the flexible circuit board 200 and the first circuit board 110 or the second circuit board 120.

[0033] In other embodiments, the circuit board assembly may not include the reinforcing plate 230 .

[0034] In an optional embodiment, the first part 210 has a first connecting surface 211 and a second connecting surface 212, and a first welding portion 220 can be provided on at least one of the first connecting surface 211 and the second connecting surface 212. The first part 210 can be electrically connected to at least one of the first circuit board 110 and the second circuit board 120 through the first welding portion 220. Here, the first welding portion 220 can be electrically connected to at least one of the first circuit board 110 and the second circuit board 120 through solder.

[0035] Furthermore, the reinforcing plate 230 may be disposed on one of the first connection surface 211 and the second connection surface 212 to improve the strength of the first portion 210. In this embodiment, the reinforcing plate 230 may be bonded to the first connection surface 211 or the second connection surface 212, and the reinforcing plate 230 may be welded to the first circuit board 110 or the second circuit board 120.

[0036] In one way, such as Figure 1-Figure 5 As shown, the reinforcing plate 230 and the first welding portion 220 can be located on opposite sides of the first portion 210, that is, when one of the first connecting surface 211 and the second connecting surface 212 is provided with the first welding portion 220, the reinforcing plate 230 is provided on the other of the first connecting surface 211 and the second connecting surface 212. This arrangement is conducive to simplifying the structure of the reinforcing plate 230.

[0037] In another embodiment, the reinforcing plate 230 and the first welding portion 220 are located on the same side of the first portion 210, and the reinforcing plate 230 is provided with an avoidance hole 231 for avoiding the first welding portion 220, and an insulating layer is provided on the hole wall of the avoidance hole 231. In this way, it is possible to avoid the reinforcing plate 230 and the first welding portion 220 from forming an electrical connection and causing a short circuit between the flexible circuit board 200 and the first circuit board 110 or the second circuit board 120.

[0038] Optionally, a first welding portion 220 and a reinforcement plate 230 may be provided on the first connecting surface 211, and the first welding portion 220 and the reinforcement plate 230 are not provided on the second connecting surface 212. This is beneficial to reducing the space occupied by the first part 210 and the reinforcement plate 230, and further beneficial to reducing the size of the groove 122, thereby facilitating improving the strength of the first circuit board 110 and / or the second circuit board 120.

[0039] Further optionally, a first welding portion 220 may be provided on both the first connecting surface 211 and the second connecting surface 212, and the two first welding portions 220 may be electrically connected to the first circuit board 110 and the second circuit board 120, respectively. In this way, the flexible circuit board 200 may be interconnected with the first circuit board 110 and the second circuit board 120 at the same time, thereby improving the electrical conductivity between the flexible circuit board 200 and the main circuit board 100, and the first welding portions 220 are provided on both the first connecting surface 211 and the second connecting surface 212, so that the flexible circuit board 200 can be electrically connected to one of the first circuit board 110 and the second circuit board 120, or can be connected to both of them, thereby improving the flexibility of connecting the flexible circuit board 200 with the main circuit board 100.

[0040] Here, the reinforcing plate 230 may be provided on any one of the first connection surface 211 and the second connection surface 212 .

[0041] It should be noted that the locations of the reinforcing plate 230 and the first welding portion 220 may be determined according to actual wiring conditions on the first portion 210 .

[0042] In another optional embodiment, if Figure 6-Figure 10As shown, the first part 210 has a first connecting surface 211 and a second connecting surface 212, and a reinforcing plate 230 can be provided on the first connecting surface 211 and the second connecting surface 212, so that the strength of the first part 210 can be further improved, and the stability of the connection between the first part 210 and the first circuit board 110 and the second circuit board 120 can be improved.

[0043] In addition, a first welding portion 220 may be provided on at least one of the first connecting surface 211 and the second connecting surface 212, and the first portion 210 may be electrically connected to at least one of the first circuit board 110 and the second circuit board 120 through the first welding portion 220 to achieve interconnection between the flexible circuit board 200 and the first circuit board 110 and / or the second circuit board 120.

[0044] Here, if Fig. 9 As shown, the reinforcement plate 230 may be provided with an avoidance hole 231 for avoiding the first welding portion 220. Specifically, the reinforcement plate 230 located on the same side as the first welding portion 220 is provided with an avoidance hole 231, and an insulating layer may be provided on the hole wall of the avoidance hole 231. In this way, it can be avoided that the reinforcement plate 230 and the first welding portion 220 form an electrical connection, which may cause a short circuit between the flexible circuit board 200 and the first circuit board 110 or the second circuit board 120.

[0045] In one embodiment, a first welding portion 220 is provided on one of the first connecting surface 211 and the second connecting surface 212, and an avoidance hole 231 is provided on the reinforcement plate 230 located on the same side as the first welding portion 220. For example, a first welding portion 220 is provided on the first connecting surface 211, and an avoidance hole 231 is provided on the reinforcement plate 230 on the first connecting surface 211.

[0046] In another embodiment, the first connection surface 211 and the second connection surface 212 are both provided with the first welding portion 220, and in this case, the two reinforcing plates 230 are both provided with the avoidance hole 231. In this way, the flexibility of the connection between the flexible circuit board 200 and the main circuit board 100 can be improved while further improving the strength of the first part 210.

[0047] In yet another optional embodiment, Figure 11-13As shown, the first part 210 has a first connection surface 211 and a second connection surface 212, and the first connection surface 211 and the second connection surface 212 can be provided with a first welding portion 220, and the two first welding portions 220 can be electrically connected to the first circuit board 110 and the second circuit board 120 respectively. In this way, the flexible circuit board 200 can be electrically connected to one of the first circuit board 110 and the second circuit board 120, or both of them, thereby improving the flexibility of connecting the flexible circuit board 200 with the main circuit board 100; and, no reinforcing plate 230 is provided on the first connection surface 211 and the second connection surface 212, which is conducive to reducing the space occupied by the first part 210, thereby reducing the size of the groove 122, and thus improving the strength of the first circuit board 110 and / or the second circuit board 120.

[0048] In other embodiments, only one of the first connection surface 211 and the second connection surface 212 may be provided with the first welding portion 220 .

[0049] In an optional embodiment of the present application, a plurality of first soldering portions 220 distributed at intervals may be provided on the first part 210, a plurality of second soldering portions may be provided on the first circuit board 110, the second soldering portions may be located in the groove 122, and the plurality of second soldering portions may correspond one-to-one to and be electrically connected to the plurality of first soldering portions 220, and / or a plurality of third soldering portions may be provided on the second circuit board 120, the third soldering portions may be located in the groove 122, and the plurality of third soldering portions may correspond one-to-one to and be electrically connected to the plurality of first soldering portions 220. In this way, the gaps between the first soldering portions 220 on the first part 210 can be made the same as the gaps between the second soldering portions on the first circuit board 110 and / or the gaps between the third soldering portions on the second circuit board 120, thereby ensuring the accuracy of the docking between the first soldering portions 220 and the second soldering portions and / or the third soldering portions, thereby improving the electrical conductivity between the first part 210 and the first circuit board 110 and / or the second circuit board 120, and reducing the risk of short circuit or open circuit between the first part 210 and the first circuit board 110 and / or the second circuit board 120.

[0050] In one embodiment, a plurality of first soldering portions 220 are disposed on the first connection surface 211 of the first portion 210, and the plurality of first soldering portions 220 correspond one-to-one to and are electrically connected to the plurality of second soldering portions on the first circuit board 110. Alternatively, a plurality of first soldering portions 220 are disposed on the second connection surface 212 of the first portion 210, and the plurality of first soldering portions 220 correspond one-to-one to and are electrically connected to the plurality of third soldering portions on the second circuit board 120.

[0051] In another embodiment, a plurality of first soldering portions 220 are disposed on the first connecting surface 211 and the second connecting surface 212 of the first part 210. The plurality of first soldering portions 220 on the first connecting surface 211 correspond one-to-one to and are electrically connected to the plurality of second soldering portions on the first circuit board 110. The plurality of first soldering portions 220 on the second connecting surface 212 correspond one-to-one to and are electrically connected to the plurality of third soldering portions on the second circuit board 120.

[0052] It should be noted that the first connecting surface 211 is the side of the first part 210 facing the first circuit board 110, the second connecting surface 212 is the side of the first part 210 facing away from the first circuit board 110, the first welding portion 220 can be a welding pad on the first part 210, the second welding portion can be a welding pad on the first circuit board 110, and the third welding portion can be a welding pad on the second circuit board 120.

[0053] In other embodiments, the plurality of second welding portions may not correspond one-to-one to the plurality of first welding portions 220 , and / or the plurality of third welding portions may not correspond one-to-one to the plurality of first welding portions 220 .

[0054] In the embodiment of the present application, the groove 122 can be arranged on the side of the second circuit board 120, and the side of the second circuit board 120 can be provided with a plurality of third welding portions, and the plurality of third welding portions are located in the groove 122. When connecting the flexible circuit board 200 and the second circuit board 120, the first part 210 of the flexible circuit board 200 can be first extended into the groove 122, and the plurality of first welding portions 220 on the first part 210 are aligned with the plurality of third welding portions and welded by soldering, thereby realizing the interconnection between the flexible circuit board 200 and the second circuit board 120. Then, the second circuit board 120 and the flexible circuit board 200 are stacked on the first circuit board 110 together, so that the second component 140 on the second surface of the first circuit board 110 extends into the accommodating groove 121 of the second circuit board 120, and then the first circuit board 110 and the second circuit board 120 are welded, thereby forming a circuit board assembly.

[0055] In an optional embodiment of the present application, the circuit board assembly may further include a first shielding cover 160, which may be disposed on a side of the first circuit board 110 away from the second circuit board 120, and the first shielding cover 160 may be disposed outside the first component 130, and the first shielding cover 160 may be electrically connected to the grounding circuit of the first circuit board 110. In this way, the first shielding cover 160 may have an electromagnetic shielding effect on the first component 130, so as to prevent the first component 130 from being interfered with by the outside world and to prevent the first component 130 from interfering with other components.

[0056] The circuit board assembly may further include a second shielding cover 170, which may be disposed on a side of the second circuit board 120 away from the first circuit board 110, and the second shielding cover 170 may be disposed outside the third component 150, and the second shielding cover 170 may be electrically connected to the grounding circuit of the second circuit board 120. In this way, the second shielding cover 170 may provide electromagnetic shielding for the third component 150, so as to prevent the third component 150 from being interfered with by the outside world and to prevent the third component 150 from interfering with other components.

[0057] The circuit board assembly may further include an annular shielding member, which may be disposed around the connection between the first circuit board 110 and the second circuit board 120, and the annular shielding member may be connected to the first circuit board 110 and the second circuit board 120, respectively, and the annular shielding member may be electrically connected to the ground circuit of at least one of the first circuit board 110 and the second circuit board 120. In this way, the annular shielding member may seal the connection between the first circuit board 110 and the second circuit board 120 to prevent external electromagnetic signals from entering the receiving groove 121 through the connection between the first circuit board 110 and the second circuit board 120 and interfering with the second component 140, or prevent electromagnetic signals of the second component 140 from leaking through the connection between the first circuit board 110 and the second circuit board 120 and interfering with other components.

[0058] Here, an insulating layer is provided on the side of the first shielding cover 160 close to the first component 130, so that the first shielding cover 160 can be prevented from forming an electrical connection with other components and leads on the first circuit board 110; an insulating layer is provided on the side of the second shielding cover 170 close to the third component 150, so that the second shielding cover 170 can be prevented from forming an electrical connection with other components and leads on the second circuit board 120; an insulating layer is provided on the side of the annular shielding member close to the accommodating groove 121, so that the annular shielding member can be prevented from forming an electrical connection with other parts and leads on the first circuit board 110 and the second circuit board 120.

[0059] In this embodiment, the annular shielding member may be a shielding coating, which facilitates the arrangement of the annular shielding member. Of course, the first shielding cover 160 and the second shielding cover 170 may also be shielding coatings, which is beneficial to reducing the thickness of the main circuit board 100.

[0060] Optionally, a first ground lead and a first signal lead may also be provided on the first circuit board 110. Both the first ground lead and the first signal lead may be provided around the second component 140, and the first signal lead may be located on a side of the first ground lead close to the second component 140. The first ground lead may be electrically connected to the ground circuit of the first circuit board 110, and the first signal lead may be electrically connected to the first component 130 and the second component 140.

[0061] A second ground lead and a second signal lead may also be provided on the second circuit board 120. The second ground lead and the second signal lead may both be provided around the second component 140. The second signal lead may be located on a side of the second ground lead close to the second component 140. The second ground lead may be electrically connected to the ground circuit of the second circuit board 120. The second signal lead may be electrically connected to the third component 150.

[0062] The first ground lead and the second ground lead may correspond to and be electrically connected, the first signal lead and the second signal lead may correspond to and be electrically connected, and the annular shield may be electrically connected to at least one of the first ground lead and the second ground lead.

[0063] Such a configuration allows the annular shielding component to play an electromagnetic shielding role for the electrical signals transmitted between the first circuit board 110 and the second circuit board 120, thereby preventing the electrical signals between the first circuit board 110 and the second circuit board 120 from being interfered with by external electromagnetic interference, and is also beneficial for improving the connection stability between the annular shielding component and the grounding circuit of the first circuit board 110 and / or the second circuit board 120, and improving the electrical conductivity between the first circuit board 110 and the second circuit board 120.

[0064] Further optionally, a third grounding lead may be provided on the first circuit board 110, the third grounding lead may be provided around the second component 140, and the third grounding lead may be located on the side of the first signal lead close to the second component 140; a fourth grounding lead may be provided on the second circuit board 120, the fourth grounding lead may be provided around the second component 140, and the fourth grounding lead may be located on the side of the second signal lead close to the second component 140, and the third grounding lead and the fourth grounding lead may correspond to and be electrically connected. In this way, after the third grounding lead and the fourth grounding lead are connected, they can play an electromagnetic shielding role for the electrical signal transmitted between the first circuit board 110 and the second circuit board 120, thereby preventing the electrical signal between the first circuit board 110 and the second circuit board 120 from being electromagnetically interfered by the second component 140 or preventing the electrical signal between the first circuit board 110 and the second circuit board 120 from affecting the second component 140, thereby facilitating improving the stability of the electrical signal transmitted between the first circuit board 110 and the second circuit board 120.

[0065] In this embodiment, the first ground lead and the second ground lead can be electrically connected through the first electrical connector 180 , the third ground lead and the fourth ground lead can be electrically connected through the second electrical connector 1100 , and the first signal lead and the second signal lead can be electrically connected through the signal connector 190 .

[0066] It should be noted that the first electrical connector 180 , the second electrical connector 1100 and the signal connector 190 may all be solder.

[0067] Optionally, when multiple first welding portions 220 are provided on the first connecting surface 211 and multiple second welding portions are provided on the first circuit board 110, the multiple second welding portions may include a first ground pad, a first signal pad and a second ground pad, the first ground pad may be a part of the first ground lead, the first signal pad may be a part of the first signal lead, and the second ground pad may be a part of the second ground lead; the multiple first welding portions 220 on the first connecting surfaces 211 may include a first pad electrically connected to the first ground pad, a second pad electrically connected to the first signal pad and a third pad electrically connected to the second ground pad.

[0068] When multiple first welding parts 220 are arranged on the second connecting surface 212 and multiple third welding parts are arranged on the second circuit board 120, the multiple third welding parts may include a third ground pad, a second signal pad and a fourth ground pad, the third ground pad may be a part of the third ground lead, the second signal pad may be a part of the second signal lead, and the fourth ground pad may be a part of the fourth ground lead; the multiple first welding parts 220 on the second connecting surfaces 212 may include a fourth pad electrically connected to the third ground pad, a fifth pad electrically connected to the second signal pad and a sixth pad electrically connected to the fourth ground pad.

[0069] Such an arrangement can further improve the electromagnetic shielding effect of the first circuit board 110 and the second circuit board 120 .

[0070] Based on the circuit board assembly provided in the embodiment of the present application, the embodiment of the present application also provides an electronic device. The electronic device may include a housing and the circuit board assembly described in any of the above embodiments. The circuit board assembly may be located inside the housing.

[0071] The beneficial effects achieved by the electronic device provided by the embodiment of the present application are consistent with the beneficial effects achieved by the circuit board assembly provided by the embodiment of the present application, and will not be repeated here.

[0072] The electronic device in the embodiment of the present application may be a terminal or other device other than a terminal. The above-mentioned electronic device may be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR) / virtual reality (virtual reality, VR) device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc. The non-mobile electronic device may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0073] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A circuit board assembly, characterized in that: Comprising a flexible circuit board (200), a first circuit board (110) and a second circuit board (120) stacked along the thickness direction of the circuit board assembly, wherein the second circuit board (120) is provided with a receiving groove (121), and the receiving groove (121) is used to receive at least part of the components on the first circuit board (110); At least one of the first circuit board (110) and the second circuit board (120) is provided with a groove (122), and the first part (210) of the flexible circuit board (200) extends into the groove (122) and is connected to and electrically connected with at least one of the first circuit board (110) and the second circuit board (120).

2. The circuit board assembly according to claim 1, characterized in that: The groove (122) is arranged on a side of the second circuit board (120), and the groove (122) is arranged close to the first circuit board (110).

3. The circuit board assembly according to claim 1, characterized in that: The groove (122) is arranged on the first circuit board (110), and the groove (122) is arranged close to the second circuit board (120).

4. The circuit board assembly according to claim 1, characterized in that: The first circuit board (110) and the second circuit board (120) are both provided with the groove (122), the two grooves (122) are connected, and the first part (210) is located in the two grooves (122).

5. The circuit board assembly according to claim 1, characterized in that: The first part (210) has a first connection surface (211) and a second connection surface (212), and the first connection surface (211) and the second connection surface (212) are both provided with first welding portions (220), and the two first welding portions (220) are respectively electrically connected to the first circuit board (110) and the second circuit board (120).

6. The circuit board assembly according to claim 1, characterized in that: The first portion (210) is provided with a plurality of first welding portions (220) distributed at intervals; A plurality of second welding portions are provided on the first circuit board (110), the second welding portions are located in the groove (122), and the plurality of second welding portions correspond one-to-one to the plurality of first welding portions (220) and are electrically connected; and / or, A plurality of third welding portions are provided on the second circuit board (120), the third welding portions are located in the groove (122), and the plurality of third welding portions correspond one-to-one to the plurality of first welding portions (220) and are electrically connected.

7. The circuit board assembly according to claim 1, characterized in that: The circuit board assembly further comprises a reinforcing plate (230), wherein the reinforcing plate (230) is arranged on the first part (210), and the reinforcing plate (230) is connected to one of the first circuit board (110) and the second circuit board (120).

8. The circuit board assembly according to claim 7, characterized in that: The first part (210) has a first connection surface (211) and a second connection surface (212); a first welding portion (220) is provided on at least one of the first connection surface (211) and the second connection surface (212); the first part (210) is electrically connected to at least one of the first circuit board (110) and the second circuit board (120) via the first welding portion (220); and the reinforcing plate (230) is provided on one of the first connection surface (211) and the second connection surface (212); The reinforcing plate (230) and the first welding portion (220) are located on opposite sides of the first portion (210); or, the reinforcing plate (230) and the first welding portion (220) are located on the same side of the first portion (210), and the reinforcing plate (230) is provided with an avoidance hole (231) for avoiding the first welding portion (220), and an insulating layer is provided on the hole wall of the avoidance hole (231).

9. The circuit board assembly according to claim 7, characterized in that: The first part (210) has a first connection surface (211) and a second connection surface (212); the first connection surface (211) and the second connection surface (212) are both provided with the reinforcing plate (230); and at least one of the first connection surface (211) and the second connection surface (212) is also provided with a first welding portion (220); the first part (210) is electrically connected to at least one of the first circuit board (110) and the second circuit board (120) via the first welding portion (220); the reinforcing plate (230) is provided with an avoidance hole (231) for avoiding the first welding portion (220); and an insulating layer is provided on the hole wall of the avoidance hole (231).

10. An electronic device, characterized in that: It comprises a housing and the circuit board assembly according to any one of claims 1 to 9, wherein the circuit board assembly is located in the housing.

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