Solder resist printing method of AMB ceramic substrate

Abstract

The invention belongs to the technical field of circuit board solder resist processing, and particularly relates to a solder resist printing method of an AMB ceramic substrate, which comprises the following steps: S1, board placement: placing the AMB ceramic substrate below a screen; s2, ink laying: pouring solder resist ink at a non-opening position on the front surface of the silk screen, and pulling and scraping the ink from one side of the opening of the silk screen to the other side of the opening of the silk screen, so that the ink fills the openings of the opening of the silk screen; s3, bottom scraping, wherein redundant ink leaking to the back face of the silk screen plate is scraped off; s4, printing: printing and transferring the printing ink in the opening meshes of the silk screen to the AMB ceramic substrate by avoiding the printing ink pile on the silk screen plate; wherein in the step S4, the height distance between the back surface of the silk screen plate and the upper surface of the AMB ceramic substrate is 3-8 mm. According to the method, the solder resist ink is printed on the copper surface, and the solder resist ink is not printed on the ceramic, so that the solder resist ink is prevented from overflowing to the side surface of the copper surface and even a ceramic insulating groove region in the printing process.

Description

Technical Field

[0001] The invention relates to the field of patterning processing of AMB ceramic substrates, and more specifically, to a solder resist printing method for AMB ceramic substrates. Background Art

[0002] Ceramic copper-clad laminates have both the excellent electrical conductivity of copper and the excellent insulation properties of ceramics, and are important lining materials for packaging power devices in the field of power electronics. The active metal brazing (AMB) process used in the preparation of ceramic copper-clad substrates is one of the important production processes for ceramic metallization, especially suitable for non-oxide ceramics AlN and Si3N4 commonly used in the field of high reliability. It uses active brazing filler metal to braze the ceramic plate and metal copper foil together, and the combined reliability is significantly better than other metallization processes.

[0003] The solder resist process is to apply a layer of solder resist ink on the circuits and substrates on the surface of the substrate that do not need to be soldered, which plays the role of solder resist insulation, oxidation prevention, and beautification of the appearance. It generally includes processes such as solder resist printing, baking curing, and exposure and development. Solder resist printing is generally applied to the substrate by screen printing. The specific screen printing method is to pour the solder resist ink on the non-opening position on the mesh surface of the front of the screen, and use a printing scraper to pull a large amount of accumulated solder resist ink from one side of the screen opening to the other side so that the solder resist ink is printed on the substrate through the mesh opening of the screen. When printing, it is necessary to ensure that the screen surface contacts the surface of the substrate. Usually, two printing scrapers are used to print alternately left and right. The screen printing process is mature and generally automated. In order to improve production efficiency, the staff generally pours more ink on the screen. Each time the printing scraper prints, all the accumulated ink on the screen is directly transferred to the surface of the substrate, which is convenient for rapid printing. Screen printing equipment can also be used for solder resist printing of AMB ceramic substrates.

[0004] The copper thickness of traditional PCB boards is small, usually tens of microns. The height difference between the ceramic surface and the copper surface is small, and the overall board surface is close to a flat structure, which is easy to make a full-surface solder mask structure. Therefore, a large-area solder mask design is usually adopted. The insulating grooves and copper lines are covered with solder mask ink, leaving only the functional copper window positions exposed for patch, welding, wiring and other purposes.

[0005] After the same full-page large-area solder mask printing process is extended to the AMB ceramic substrate, due to the large copper thickness of the AMB ceramic substrate, usually more than 0.1mm, and a more three-dimensional structure, the surface height difference between the ceramic and copper is large, and the groove is deep. When printing the solder mask, there will be a large difference in thickness between the solder mask ink at the groove and the solder mask ink on the copper surface, resulting in uneven curing of the solder mask ink and poor filling effect of the solder mask ink at the groove. Therefore, for the AMB ceramic substrate, the solder mask ink is generally only printed on the copper, and not on the ceramic.

[0006] According to this method of printing solder mask ink only on copper, during the solder mask printing process on AMB ceramic substrates, for AMB ceramic substrates with a copper thickness of more than 0.3mm, due to the large surface height difference between the ceramic and copper surfaces, when printing solder mask ink on the copper surface, the solder mask ink can be well controlled not to overflow to the copper side, or even overflow to the ceramic surface. However, for printed substrates with a copper thickness of 0.1-0.3mm, due to the small surface height difference between the ceramic and copper surfaces, when printing solder mask ink only on copper, it is very easy for the solder mask ink to overflow to the copper side or even the ceramic surface near the copper. However, it is difficult for the solder mask ink to fill the ceramic surface at the groove position, resulting in the difficulty in ensuring the printing uniformity and consistency of the solder mask ink at different positions on the AMB ceramic substrate surface, and even the solder mask ink may exceed the copper edge and warp up after curing (such as Figure 1 In this case, the lifted part of the cured solder mask ink is easily broken and fallen off by external force, which has serious consequences for the subsequent packaging process. Summary of the invention

[0007] The object of the present invention is to overcome the deficiencies of the above-mentioned prior art and provide a solder resist printing method for an AMB ceramic substrate. By adding ink laying and bottom scraping steps and controlling the height distance between the back of the silk screen and the upper surface of the AMB ceramic substrate, solder resist ink is printed on the copper surface, while solder resist ink is not printed on the ceramic, thereby preventing the solder resist ink from overflowing to the side of the copper surface or even the ceramic insulating groove area during the printing process, thereby preventing the solder resist ink from exceeding the copper edge and curling up and falling off after curing.

[0008] The above-mentioned object of the present invention is achieved by the following technical solutions: A method for printing solder mask on an AMB ceramic substrate comprises the following steps: S1. Place the board: place the AMB ceramic substrate under the stencil; S2. Spreading ink: Pour solder mask ink on the non-opening position on the front surface of the screen, and scrape the ink from one side of the screen opening to the other side to fill the mesh opening of the screen with ink; S3. Scrape the bottom: scrape off the excess ink that leaks to the back of the screen; S4. Printing: Avoid the ink pile on the screen plate and transfer the ink in the screen opening mesh to the AMB ceramic substrate; Wherein, the copper coating thickness of the AMB ceramic substrate in step S1 is 0.1-0.3 mm; In step S4, the height distance between the back surface of the silk screen plate and the upper surface of the AMB ceramic substrate is 3-8 mm.

[0009] Since the solder resist ink is printed on the copper surface of the AMB ceramic substrate with a copper coating thickness of 0.1-0.3mm, but the solder resist ink is not printed on the groove ceramic surface, it is more likely that the solder resist ink will overflow onto the copper side or even the ceramic surface near the copper. Therefore, the method of the present invention is particularly suitable for solder resist printing on the AMB ceramic substrate with a copper coating thickness of 0.1-0.3mm.

[0010] The present invention adds the ink spreading action of step S2 and the bottom scraping action of step S3, so that the solder resist ink to be transferred to the copper surface of the AMB ceramic substrate is almost all in the opening mesh of the screen, and there is almost no excess ink on the upper surface and the back surface of the opening mesh of the screen, so that the solder resist ink in the opening mesh of the screen can be transferred to the copper surface of the AMB ceramic substrate underneath during printing in step S4, and the amount of ink leaked through the screen to the copper surface of the AMB ceramic substrate can be strictly controlled to avoid excessively thick solder resist ink overflowing from the edge of the copper surface to the side of the copper surface, and to avoid the solder resist ink attached to the back of the screen from being squeezed to the side of the copper surface when it contacts the substrate.

[0011] The present invention also increases the distance between the silk screen mesh plate and the upper surface of the AMB ceramic substrate so that when printing in step S4, the silk screen mesh surface forms a larger deformation curvature, thereby ensuring that the solder resist ink that has been missed on the copper surface is completely separated from the silk screen mesh surface near the position where the silk screen mesh surface and the AMB ceramic substrate surface are in line contact, thereby preventing the solder resist ink on the copper surface from sticking to the silk screen over a large area, completely separating the local silk screen from the copper surface of the AMB ceramic substrate, and not destroying the continuous printing state, thereby preventing the stuck position from damaging the copper surface where the solder resist ink has been printed when the silk screen is lifted and forcibly separated.

[0012] Therefore, the solder resist printing method of the AMB ceramic substrate can ensure that the ink at the groove position on the AMB ceramic substrate is still in the mesh of the silk screen, that is, the solder resist ink is only printed on the copper surface of the AMB ceramic substrate, and there is no solder resist ink on the ceramic surface of the groove of the AMB ceramic substrate, thereby avoiding the problem that the ceramic groove is deep and difficult to fill with ink, and further preventing the solder resist ink from unevenly overflowing to the ceramic surface at the groove position, resulting in poor consistency of solder resist at different positions and uneven curing.

[0013] In summary, when the solder resist ink is printed on a large-area entire page, the solder resist ink is not likely to overflow onto the copper side or even the ceramic surface near the copper. The printing uniformity and consistency of the solder resist ink at different positions on the board surface are excellent, and the solder resist ink will not exceed the copper edge and warp up after curing, thereby preventing the warped part of the solder resist ink from being easily broken and falling off by external force, causing adverse effects on subsequent packaging.

[0014] In practical applications, when the AMB ceramic substrate is placed on the vacuum adsorption platform of the printing table in step S1, the height distance between the back of the screen plate and the upper surface of the AMB ceramic substrate is controlled to be H0. When scraping the bottom in step S3, the screen plate can be appropriately lifted for ease of operation. When the screen plate is placed again in step S4, the height distance between the back of the screen plate and the upper surface of the AMB ceramic substrate can be controlled by the printing press and the printing table to remain at the above distance H0.

[0015] In practical applications, after the solder resist printing is completed, the solder resist ink printed on the AMB ceramic substrate is initially baked and cured to achieve the curing degree required for exposure and development.

[0016] In practical applications, after baking and curing, the solder resist ink on the AMB ceramic substrate is exposed and developed according to a desired solder resist pattern to obtain an AMB ceramic substrate with a desired solder resist ink pattern.

[0017] In step S4, the height distance between the back side of the screen plate and the upper surface of the AMB ceramic substrate can be 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, and more preferably 4-6 mm.

[0018] The copper coating thickness of AMB ceramic substrate can be 0.1mm, 0.15mm, 0.2mm, 0.25mm, and 0.3mm.

[0019] Preferably, the solder resist ink is composed of a main agent, a curing agent and a degreased oil solution, and the added amount of the degreased oil solution is 0.5wt%-2wt% of the sum of the main agent and the curing agent.

[0020] The mass addition amount of the oil-opening water is 0.5wt%, 0.7wt%, 1wt%, 1.1wt%, 1.3wt%, 1.5wt%, 1.7wt%, and 2wt% of the sum of the main agent and the curing agent.

[0021] The amount of diluent used is determined by the state of the ink on the screen during actual printing.

[0022] The mass ratio of the main agent to the curing agent may adopt the commercially recommended ratio, for example, 3:1.

[0023] Preferably, after step S2 or step S3, the process further includes using a scraper to push the ink back to the starting position.

[0024] The purpose of using a spatula to push the ink back to the starting position is to facilitate the next round of ink spreading and printing.

[0025] More preferably, after step S3, the ink is shoveled back to the starting position with a shovel.

[0026] Preferably, the angle between the shoveling direction of the blade and the plane of the blade is 90-150 degrees.

[0027] This angle setting is to prevent too much ink from being pressed into the stencil by the spatula, causing excessive ink to leak through the back of the stencil or even drip from the back of the stencil.

[0028] The shoveling direction of the blade and the angle of the blade plane can be 90 degrees, 100 degrees, 110 degrees, 120 degrees, 130 degrees, 140 degrees, or 150 degrees.

[0029] Preferably, in step S2, a printing scraper is used to scrape the ink from one side of the screen opening to the other side so that the ink fills the mesh holes of the screen opening, and the printing angle of the printing scraper is 60-85 degrees.

[0030] In step S2, the printing angle is slightly larger, which can not only spread the solder resist ink into the mesh of the silk screen, but also prevent excessive ink from leaking through the silk screen plate to the back of the silk screen.

[0031] In step S2, the printing angle of the printing scraper can be 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, or 85 degrees.

[0032] In step S2, the printing pressure can be controlled to be slightly smaller so that the screen will not contact the AMB ceramic substrate when the printing scraper is scraping and spreading the ink.

[0033] Preferably, in step S4, the ink in the opening mesh of the screen is transferred to the AMB ceramic substrate by printing with a printing scraper, and the printing angle of the printing scraper is 45-70 degrees.

[0034] In step S4, by controlling the printing angle of the printing scraper and combining it with a larger printing pressure, it is beneficial to transfer all the ink in the mesh of the screen to the copper surface of the AMB ceramic substrate.

[0035] In step S4, the printing angle of the printing scraper is 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, and 70 degrees.

[0036] Preferably, in step S3, the excess ink leaking onto the back of the screen plate is scraped off and then recycled to the front of the screen, which is helpful to prevent ink waste.

[0037] In step S3, a printing scraper may be used to scrape off excess ink leaking onto the back of the screen plate.

[0038] Preferably, the wire mesh plate may be made of nylon or stainless steel.

[0039] Since the present invention is a large-area whole-board printing, a large screen pitch is required to make the screen deform greatly during printing and present a large screen drop, so that there is a significant line contact with the AMB ceramic substrate surface, avoiding the ink that has been printed on the copper from falling off the screen and sticking to damage the printed solder mask surface.

[0040] Nylon material has more excellent elasticity and is more suitable for the method of the present invention.

[0041] In practical applications, the mesh number of the silk screen plate in step S1 is 80-200 meshes.

[0042] The method of the present invention is particularly suitable for large-area whole-plate printing.

[0043] In this field, a screen plate opening with a length of 180-190 mm and a width of 130-140 mm is generally referred to as a large area.

[0044] In practical applications, the opening size of the screen mesh plate is the same as the outer size of the AMB ceramic substrate.

[0045] Preferably, the printing scraper in steps S2, S3 and S4 is a polyurethane scraper with a thickness of 5-10 mm.

[0046] Preferably, in step S2, the scraper is a thin stainless steel sheet with a thickness of 0.05-0.2 mm.

[0047] Preferably, the solder resist printing method of the AMB ceramic substrate comprises the following steps: S1. Place the board: adsorb the AMB ceramic substrate onto the vacuum adsorption platform of the printing table and adjust the height of the screen; S2. Spreading ink: Pour solder mask ink on the non-opening position of the screen surface on the front of the screen, and use a printing scraper to pull the ink from one side of the screen opening to the other side to fill the mesh opening of the screen with ink; S3. Scrape the bottom: lift the screen plate, use a printing scraper to scrape off the excess ink on the back of the screen plate and return it to the front of the screen, and then use a scraper to push the ink back to the starting position; S4. Printing: Put down the screen plate, use a printing scraper to avoid the ink pile on the screen plate, and transfer the ink in the open mesh of the screen to the AMB ceramic substrate under the screen plate.

[0048] The present invention also protects the AMB ceramic substrate obtained by processing the solder resist printing method of the AMB ceramic substrate described in any one of the above items.

[0049] The present invention also protects the application of the above-mentioned AMB ceramic substrate in power device packaging in the field of power electronics.

[0050] Compared with the prior art, the present invention has the following beneficial effects: The invention discloses a solder resist printing method for an AMB ceramic substrate. By adding ink spreading and bottom scraping processes and controlling the height distance between the back of a silk screen and the upper surface of an AMB ceramic substrate, solder resist ink is printed on a copper surface, while solder resist ink is not printed on ceramics, so that solder resist ink is prevented from overflowing to the side of the copper surface or even to the ceramic insulating groove area during the printing process, thereby preventing the solder resist ink from exceeding the copper edge and warping and falling off after curing. At the same time, the problem of incomplete filling of solder resist ink in the insulating groove area and uneven curing caused by the large difference in solder resist ink thickness compared with the copper surface area when the solder resist process of a conventional PCB circuit board is used for an AMB ceramic substrate is avoided.

[0051] The invention is simple to operate, easy to automate, and suitable for batch production. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 This is a picture of the solder resist ink overflowing beyond the copper edge of the AMB ceramic substrate to the side and the edge lifting after curing.

[0053] Figure 2 Schematic diagram of the operation flow of the solder resist printing method for the AMB ceramic substrate in Example 1.

[0054] Figure 3 It is the implementation effect diagram of Examples 1 to 5.

[0055] Figure 4 This is the implementation effect diagram of Comparative Example 1.

[0056] Figure 5 This is the implementation effect diagram of Comparative Example 2.

[0057] Figure 6 and Figure 7 This is the implementation effect diagram of Comparative Example 3. DETAILED DESCRIPTION

[0058] In order to more clearly and completely describe the technical solution of the present invention, the present invention is further described in detail through specific embodiments below. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention. Various changes can be made within the scope of the rights of the present invention.

[0059] Example 1 like Figure 2 As shown, a method for printing solder mask on an AMB ceramic substrate comprises the following steps: S1. Place the board and adjust the machine: adsorb the AMB ceramic substrate with an outer dimension of 190x140mm and a copper coating thickness of 0.2mm onto the vacuum adsorption platform of the printing table, and use a 100-mesh nylon screen with an opening of 190x140mm to set the height distance between the back of the screen plate and the upper surface of the AMB ceramic substrate to 5mm; S2. Ink spreading: Pour the prepared solder mask ink with a mass ratio of 3:1 between the main agent and the curing agent and 1wt% of the open oil water on the non-opening position of the screen on the front of the screen, use a polyurethane printing scraper to control the printing angle of about 70° and use a small printing pressure to scrape the ink from one side of the screen opening to the other side so that the ink fills the mesh opening of the screen, and then use a 0.1mm thick thin steel scraper to push the ink accumulated on the screen back to the printing starting position at a shoveling angle of about 120°; S3. Scrape the bottom: lift the screen plate, use the printing scraper to scrape off the excess ink on the back of the screen plate and recycle it to the front of the screen; S4. Printing: Lower the screen plate so that the height distance between the back of the screen plate and the upper surface of the AMB ceramic substrate is 5 mm. Use a printing scraper to avoid the ink pile on the screen plate and only transfer the ink in the opening mesh of the screen to the AMB ceramic substrate under the screen plate; the printing angle is 60°.

[0060] S5. Baking and curing: The solder mask ink printed on the AMB ceramic substrate is preliminarily baked and cured to achieve the curing degree required for exposure and development; S6. Exposure and development: the solder resist ink on the AMB ceramic substrate is exposed and developed according to the required solder resist pattern to obtain an AMB ceramic substrate with the required solder resist ink pattern.

[0061] Example 2 A method for printing solder mask on an AMB ceramic substrate is substantially the same as that of Embodiment 1, except that step S2 and step S3 are as follows: S2. Ink spreading: Pour the prepared solder mask ink with a mass ratio of 3:1 between the main agent and the curing agent and 1wt% of the open oil water on the non-opening position of the mesh surface on the front of the screen, and use a polyurethane printing scraper to control the printing angle to about 70° and use a small printing pressure to scrape the ink from one side of the screen opening to the other side so that the ink fills the mesh opening of the screen; S3. Scrape the bottom: lift the screen plate, use a printing scraper to scrape off the excess ink that has leaked to the back of the screen plate and recover it to the front of the screen, then use a 0.1mm thick thin steel scraper to push the ink accumulated on the screen surface back to the starting position of printing at a shoveling angle of about 120°.

[0062] The rest is the same as Example 1 and will not be described again here.

[0063] Example 3 A method for printing solder resist on an AMB ceramic substrate is substantially the same as that of Embodiment 1, except that the stencil is made of stainless steel.

[0064] Example 4 A method for printing solder mask on an AMB ceramic substrate is substantially the same as that in Example 1, except that: In step S1, the copper coating thickness of the AMB ceramic substrate is 0.1 mm.

[0065] In step S2, the angle between the scraping direction of the scraper and the scraper plane is 90 degrees.

[0066] In step S2, the printing angle of the printing scraper is 60 degrees.

[0067] In step S4, the height distance between the back surface of the silk screen plate and the upper surface of the AMB ceramic substrate is 3 mm.

[0068] In step S4, the printing angle of the printing scraper is 45 degrees.

[0069] Example 5 A method for printing solder mask on an AMB ceramic substrate is substantially the same as that in Example 1, except that: In step S1, the copper coating thickness of the AMB ceramic substrate is 0.3 mm.

[0070] In step S2, the angle between the scraping direction of the scraper and the scraper plane is 150 degrees.

[0071] In step S2, the printing angle of the printing scraper is 85 degrees.

[0072] In step S4, the height distance between the back surface of the silk screen plate and the upper surface of the AMB ceramic substrate is 8 mm.

[0073] In step S4, the printing angle of the printing scraper is 70 degrees.

[0074] Comparative Example 1 A method for printing solder mask on an AMB ceramic substrate is substantially the same as that of Embodiment 1, except that in step S4, the height distance between the back surface of the screen plate and the upper surface of the AMB ceramic substrate is 2 mm.

[0075] Comparative Example 2 A method for printing solder resist on an AMB ceramic substrate is substantially the same as that of Embodiment 1, except that the bottom scraping action in step S3 is not performed.

[0076] Comparative Example 3 A method for printing solder resist on an AMB ceramic substrate is disclosed. The method is operated in a conventional printing manner. The difference from Example 1 is that in S4, the height distance between the back of the screen plate and the upper surface of the AMB ceramic substrate is 2 mm. The ink spreading and bottom scraping actions of steps S2 and S3 are not performed. A printing scraper is directly used to scrape the solder resist ink pile poured on the screen surface at the printing starting position to print the ink onto the AMB ceramic substrate.

[0077] Test Results The implementation effects of Examples 1 to 5 are as follows: Figure 3 As shown, the solder resist ink is only printed on the copper surface, and is not printed or overflows onto the copper side or the ceramic surface at the groove position.

[0078] The implementation effect of comparative example 1 is as follows Figure 4 As shown in the figure, as indicated by the arrow position, the solder resist ink overflows to the copper side.

[0079] The implementation effect of comparative example 2 is as follows Figure 5 As shown, a large area of ​​solder mask ink is severely and unevenly missed on the copper side and the ceramic surface at the groove position.

[0080] The implementation effect of comparative example 3 is as follows Figure 6 and Figure 7 As shown, the solder resist ink overflows onto the copper side of the entire board, and some ink leaks onto the ceramic surface at the groove position in some local locations.

[0081] Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A solder mask printing method for an AMB ceramic substrate, characterized in that: The steps include: S1. Place the board: place the AMB ceramic substrate under the stencil; S2. Spreading ink: Pour solder mask ink on the non-opening position on the front surface of the screen, and scrape the ink from one side of the screen opening to the other side to fill the mesh opening of the screen with ink; S3. Scrape the bottom: scrape off the excess ink that leaks to the back of the screen; S4. Printing: Avoid the ink pile on the screen plate and transfer the ink in the screen opening mesh to the AMB ceramic substrate; Wherein, the copper coating thickness of the AMB ceramic substrate in step S1 is 0.1-0.3 mm; In step S4, the height distance between the back surface of the silk screen plate and the upper surface of the AMB ceramic substrate is 3-8 mm.

2. The solder resist printing method for the AMB ceramic substrate according to claim 1, characterized in that: The solder resist ink is composed of a main agent, a curing agent and a degreased oil solution, and the added amount of the degreased oil solution is 0.5wt%-2wt% of the sum of the main agent and the curing agent.

3. The solder resist printing method for the AMB ceramic substrate according to claim 1, characterized in that: After step S2 or step S3, the method further includes using a scraper to push the ink back to the starting position.

4. The solder resist printing method for the AMB ceramic substrate according to claim 3, characterized in that: The angle between the scraping direction of the scraper and the scraper plane is 90-150 degrees.

5. The solder mask printing method for the AMB ceramic substrate according to claim 1, characterized in that: In step S2, a printing scraper is used to scrape the ink from one side of the screen opening to the other side so that the ink fills the mesh holes of the screen opening. The printing angle of the printing scraper is 60-85 degrees.

6. The solder resist printing method for the AMB ceramic substrate according to claim 1, characterized in that: In step S4, the ink in the opening mesh of the screen is transferred to the AMB ceramic substrate by printing with a printing scraper, and the printing angle of the printing scraper is 45-70 degrees.

7. The solder resist printing method for the AMB ceramic substrate according to claim 1, characterized in that: In step S3, the excess ink leaking onto the back of the screen plate is scraped off and recovered onto the front of the screen.

8. The solder resist printing method for the AMB ceramic substrate according to claim 1, characterized in that: The wire mesh plate in step S1 is a nylon wire mesh.

9. An AMB ceramic substrate obtained by the solder resist printing method for an AMB ceramic substrate according to any one of claims 1 to 8.

10. Application of the AMB ceramic substrate according to claim 9 in power device packaging in the field of power electronics.

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