Sensor element and physical quantity sensor

Abstract

The invention provides a sensor element and a physical quantity sensor. Noise caused by a driving signal is not easily mixed into a detection signal. The sensor element includes: a base portion; a driving vibration part connected with the base part; a detection vibration portion connected to the base portion; a drive signal electrode which is disposed on the drive vibration unit and to which a drive signal is applied; a detection signal electrode that is disposed on the detection vibration unit and outputs a detection signal; a drive signal electrode pad disposed on the base portion and electrically connected to the drive signal electrode; and a detection signal electrode pad disposed on the base portion and electrically connected to the detection signal electrode, the width of at least one of the drive signal electrode pad and the detection signal electrode pad being 30 [mu] m or more and 100 [mu] m or less.

Description

Technical Field

[0001] The present invention relates to a sensor element and a physical quantity sensor. Background Art

[0002] The vibration device described in Patent Document 1 has a box-shaped base, a support substrate supported on the base, and a vibration element supported on the support substrate. The vibration element is an angular velocity detection element that detects the angular velocity around the Z axis, and has: a base located in the center; a pair of detection arms extending from the base to both sides of the Y direction; a pair of connecting arms extending from the base to both sides of the X direction; a pair of driving arms extending from the end of one connecting arm to both sides of the Y direction; and a pair of driving arms extending from the end of the other connecting arm to both sides of the Y direction. In addition, the vibration element has 6 electrode pads arranged on the lower surface of the support portion, and each of these terminals is connected to the later-described element mounting portion of the support substrate via a conductive bonding component such as a metal bump.

[0003] The supporting substrate is a gimbal structure, comprising: an element mounting portion, which carries a vibration element; a frame-shaped supporting portion, which is located outside the element mounting portion and fixed to a base; a frame portion, which is located between the element mounting portion and the supporting portion and is in a frame shape surrounding the element mounting portion; a pair of inner beam portions, which extend from the element mounting portion to both sides in the X direction to connect the element mounting portion and the frame portion; and a pair of outer beam portions, which extend from the frame portion to both sides in the Y direction to connect the frame portion and the supporting portion.

[0004] By interposing the support substrate between the vibration element and the base in this manner, stress is less likely to be transmitted to the vibration element, thereby improving the detection characteristics of the vibration device.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-117070

[0006] However, in the vibration device 1 such as Patent Document 1, the area is small, and the separation distance between the electrode pads, especially the separation distance between the electrode pad to which the drive signal is applied and the electrode pad to which the detection signal is output, is small. Therefore, due to the electrostatic capacitance between the electrode pad for the drive signal and the electrode pad for the detection signal, noise is generated in the detection signal. Patent Document 1 does not consider the size of the electrode pad for reducing such electrostatic capacitance and improving the detection characteristics of the vibration device. Summary of the invention

[0007] The sensor element of the present invention comprises: a base; a driving vibration portion connected to the base; a detection vibration portion connected to the base; a driving signal electrode, which is arranged on the driving vibration portion and is applied with a driving signal; a detection signal electrode, which is arranged on the detection vibration portion and outputs a detection signal; a driving signal electrode pad, which is arranged on the base and electrically connected to the driving signal electrode; and a detection signal electrode pad, which is arranged on the base and electrically connected to the detection signal electrode, wherein the width of at least one of the driving signal electrode pad and the detection signal electrode pad is greater than 30 μm and less than 100 μm.

[0008] The physical quantity sensor of the present invention comprises: a package; a support substrate housed in the package and bonded to the package; and the sensor element housed in the package and bonded to the support substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a cross-sectional view of the physical quantity sensor according to the first embodiment.

[0010] Figure 2 It is a top view showing the interior of the physical quantity sensor.

[0011] Figure 3 1 is a plan view showing a support substrate.

[0012] Figure 4 is a top view showing a sensor element.

[0013] Figure 5 is a perspective view showing a sensor element.

[0014] Figure 6 is a schematic diagram showing a driving vibration mode of a sensor element.

[0015] Figure 7 is a schematic diagram showing a detection vibration mode of a sensor element.

[0016] Figure 8 is an enlarged perspective view showing the base of the sensor element.

[0017] Fig. 9 is a graph showing the relationship between the width of the electrode pad and the electrostatic capacitance.

[0018] Fig.10 It is a plan view showing a support substrate included in the physical quantity sensor according to the second embodiment.

[0019] Fig.11 is an enlarged perspective view showing the base of the sensor element.

[0020] Fig.12It is a graph showing the relationship between the width W and the bonding area.

[0021] Fig.13 : is a graph showing the relationship between the width W and the electrostatic capacitance.

[0022] Fig.14 is an enlarged perspective view showing a base portion of a sensor element according to a third embodiment.

[0023] Fig.15 It is a plan view showing the interior of a physical quantity sensor according to a fourth embodiment.

[0024] Fig.16 1 is a plan view showing a support substrate.

[0025] Fig.17 It is an enlarged plan view showing the base of the support substrate.

[0026] Description of symbols

[0027] 1: physical quantity sensor; 2: package; 21: base; 211: recess; 211a: recess; 211b: recess; 211c: recess; 22: cover; 23: joining member; 241: internal terminal; 242: internal terminal; 243: external terminal; 3: circuit element; 4: supporting substrate; 41: lead; 42: lead; 43: lead; 44: lead; 45: lead; 46: lead; 47: lead; 48: lead; 49: substrate; 491: opening; 5: wiring; 511: element side terminal; 512: base side terminal; 521: element side terminal; 522: base side terminal; 531: element side terminal ; 541: element side terminal; 542: base side terminal; 551: element side terminal; 561: element side terminal; 562: base side terminal; 571: element side terminal; 572: base side terminal; 581: element side terminal; 582: base side terminal; 6: sensor element; 61: detection vibration part; 62: drive vibration part; 7: vibration substrate; 70: base; 70a: first side; 70b: second side; 70c: third side; 70d: fourth side; 71: first detection vibration arm; 72: second detection vibration arm; 73: first connecting arm; 74: second connecting arm; 75: first drive vibration arm; 76: second drive Vibration arm; 77: third drive vibration arm; 78: fourth drive vibration arm; 8: electrode; 811: drive signal electrode; 812: drive signal electrode pad; 821: drive ground electrode; 822: drive ground electrode pad; 823: drive ground wiring; 831: first detection signal electrode; 832: first detection signal electrode pad; 841: first detection ground electrode; 841a: third detection signal electrode; 842: first detection ground electrode pad; 842a: third detection signal electrode pad; 843: first detection ground wiring; 851: second detection signal electrode; 852: second detection signal electrode pad Electrode pad; 861: second detection ground electrode; 861a: fourth detection signal electrode; 862: second detection ground electrode pad; 862a: fourth detection signal electrode pad; 863: second detection ground wiring; 873: first ground wiring; 883: second ground wiring; 9: supporting substrate; 90: base; 91: supporting portion; 921: beam portion; 922: beam portion; 923: beam portion; 924: beam portion; B1: joining component; B1a: joining component; B1b: joining component; B1c: joining component; B1d: joining component; B2: joining component; O: center; S: internal space; ωz: angular velocity. DETAILED DESCRIPTION

[0028] Hereinafter, a sensor element and a physical quantity sensor according to the present invention will be described in detail based on the embodiments shown in the drawings.

[0029] <First Embodiment>

[0030] Figure 1 It is a cross-sectional view of the physical quantity sensor according to the first embodiment. Figure 2 It is a top view showing the interior of the physical quantity sensor. Figure 3 1 is a plan view showing a support substrate. Figure 4 is a top view showing a sensor element. Figure 5 is a perspective view showing a sensor element. Figure 6 is a schematic diagram showing a driving vibration mode of a sensor element. Figure 7 is a schematic diagram showing a detection vibration mode of a sensor element. Figure 8 is an enlarged perspective view showing the base of the sensor element. Fig. 9 is a graph showing the relationship between the width of the electrode pad and the electrostatic capacitance.

[0031] In addition, for the sake of convenience, three mutually perpendicular axes, namely, the X-axis, the Y-axis, and the Z-axis, are shown in each figure. In addition, hereinafter, the arrow side of each axis is also referred to as the "positive side", and the opposite side is referred to as the "negative side". In addition, the positive side of the Z-axis direction is also referred to as the "upper", and the negative side is referred to as the "lower". In addition, the top view from the Z-axis direction is also referred to as the "top view".

[0032] Figure 1 The physical quantity sensor 1 shown is an angular velocity sensor that detects an angular velocity ωz about the Z axis. Such a physical quantity sensor 1 includes a package 2 , a circuit element 3 housed in the package 2 , a support substrate 4 , and a sensor element 6 .

[0033] Encapsulation 2

[0034] The package 2 includes a base 21 having a recess 211 opened on the upper surface, and a cover 22 bonded to the upper surface of the base 21 via a bonding member 23 in a manner that closes the opening of the recess 211. An internal space S is formed by the recess 211 inside the package 2, and the circuit element 3, the support substrate 4, and the sensor element 6 are accommodated in the internal space S. In addition, the base 21 can be made of ceramics such as alumina, and the cover 22 can be made of a metal material such as kovar. However, the constituent materials of the base 21 and the cover 22 are not particularly limited.

[0035] The internal space S is airtight and is in a reduced pressure state, preferably a state closer to a vacuum. This reduces the viscous resistance and improves the vibration characteristics of the sensor element 6. However, the atmosphere of the internal space S is not particularly limited, and may be, for example, an atmospheric pressure state or a pressurized state.

[0036] The recess 211 is composed of a plurality of recesses, including a recess 211a that opens on the upper surface of the base 21, a recess 211b that opens on the bottom surface of the recess 211a and has a smaller opening width than the recess 211a, and a recess 211c that opens on the bottom surface of the recess 211b and has a smaller opening width than the recess 211b. The support substrate 4 is fixed to the bottom surface of the recess 211a in a state of supporting the sensor element 6, and the circuit element 3 is fixed to the bottom surface of the recess 211c.

[0037] In addition, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, a plurality of internal terminals 242 are arranged on the bottom surface of the recess 211b, and a plurality of external terminals 243 are arranged on the lower surface of the base 21. Each internal terminal 242 is electrically connected to the internal terminal 241 or the external terminal 243 via a wiring (not shown) formed in the base 21.

[0038] "Support Base 4"

[0039] like Figure 1 As shown, the support substrate 4 is a substrate for TAB (Tape Automated Bonding) mounting. Figure 2 and Figure 3 As shown, there are: a plate frame-shaped substrate 49 having an opening 491; and six leads 41, 42, 43, 44, 45, 46 supported by the substrate 49. In addition, the substrate 49 is made of a flexible resin such as polyimide, and the leads 41, 42, 43, 44, 45, 46 are made of copper foil, for example. Moreover, the sensor element 6 is bonded to the end portion of each lead 41, 42, 43, 44, 45, 46 via a conductive bonding component B1, and the substrate 49 is bonded to the bottom surface of the recess 211a via a conductive bonding component B2. The support substrate 4 is located on the lower side of the sensor element 6 and supports the sensor element 6 in a manner of lifting from the lower side. In this way, by interposing the support substrate 4 between the sensor element 6 and the base 21, the support substrate 4 absorbs or relaxes the stress transmitted from the base 21, and the stress is difficult to be transmitted to the sensor element 6. Therefore, the reduction and change of the vibration characteristics of the sensor element 6 can be effectively suppressed, and stable vibration characteristics can be exerted.

[0040] In addition, as the bonding parts B1 and B2, there is no particular limitation as long as they have both conductivity and bonding properties. For example, various metal bumps such as gold bumps, silver bumps, copper bumps, solder bumps, and conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives of polyimide, epoxy, silicone, and acrylic systems can be used. In this embodiment, the former metal bump is used as the bonding part B1, and the latter conductive adhesive is used as the bonding part B2. By using a metal bump as the bonding part B1, the generation of gas from the bonding part B1 can be suppressed, and the environmental changes of the internal space S, especially the increase in pressure, can be effectively suppressed. In addition, the bonding part B1 can also be reduced in diameter. In addition, by using a conductive adhesive as the bonding part B2, the bonding of the support substrate 4 and the base 21 becomes easy.

[0041] The leads 41, 42, 43, 44, 45, 46 are bonded to the lower surface of the substrate 49 by an adhesive (not shown). The leads 41, 42, 43, 44, 45, 46 are electrically connected to the corresponding internal terminals 241 via the bonding member B2.

[0042] In addition, when viewed from the Z-axis direction, the ends of the leads 41, 42, 43, 44, 45, and 46 extend in the opening 491. In addition, the leads 41, 42, 43, 44, 45, and 46 are bent and tilted in the middle, and the ends pass through the opening 491 and are located above the substrate 49. Furthermore, the base 70 of the sensor element 6 is fixed to the ends of the leads 41, 42, 43, 44, 45, and 46 via the bonding member B1.

[0043] 《Sensor Element 6》

[0044] The sensor element 6 is an angular velocity sensor element that detects the angular velocity ωz around the Z axis. Figure 4 and Figure 5 As shown, the sensor element 6 has a vibration substrate 7 and an electrode 8 arranged on the surface of the vibration substrate 7. The vibration substrate 7 is composed of, for example, a Z-cut quartz substrate, and has a base 70 located in the center of the element, a detection vibration portion 61 extending from the base 70, and a driving vibration portion 62 extending from the base 70. In addition, the base 70 is bonded to the end portions of the leads 41, 42, 43, 44, 45, and 46 of the support substrate 4 via six bonding members B1.

[0045] In addition, the detection vibration part 61 has a first detection vibration arm 71 and a second detection vibration arm 72 extending from the base 70 to both sides of the Y-axis direction. In addition, the driving vibration part 62 has: a first connection arm 73 and a second connection arm 74, which extend from the base 70 to both sides of the X-axis direction; a first driving vibration arm 75 and a second driving vibration arm 76, which extend from the end portion of the first connection arm 73 to both sides of the Y-axis direction; and a third driving vibration arm 77 and a fourth driving vibration arm 78, which extend from the end portion of the second connection arm 74 to both sides of the Y-axis direction.

[0046] In addition, the base 70 is a rectangle, having a first side 70a located on the positive side of the Y-axis direction, a second side 70b located on the negative side of the Y-axis direction and opposite to the first side 70a, a third side 70c located on the positive side of the X-axis direction, and a fourth side 70d located on the negative side of the X-axis direction and opposite to the third side 70c. In addition, the first side 70a and the second side 70b extend in the X-axis direction, respectively, and the third side 70c and the fourth side 70d extend in the Y-axis direction, respectively. In addition, the third side 70c connects the ends of the first side 70a and the second side 70b on the positive side of the X-axis direction, and the fourth side 70d connects the ends of the first side 70a and the second side 70b on the negative side of the X-axis direction. In addition, the "rectangle" refers to a shape that is substantially considered as a rectangle, such as a shape in which at least one corner is chamfered, a shape in which at least one corner deviates from a right angle, etc., in addition to the case that is consistent with a rectangle.

[0047] In the base 70 of this shape, the first detection vibration arm 71 extends from the first side 70a toward the positive side in the Y-axis direction, the second detection vibration arm 72 extends from the second side 70b toward the negative side in the Y-axis direction, the first connecting arm 73 extends from the third side 70c toward the positive side in the X-axis direction, and the second connecting arm 74 extends from the fourth side 70d toward the negative side in the X-axis direction.

[0048] In addition, the electrode 8 has a driving signal electrode 811, a driving ground electrode 821, a first detection signal electrode 831 as a detection signal electrode, a first detection ground electrode 841 as a detection ground electrode, a second detection signal electrode 851 as a detection signal electrode, and a second detection ground electrode 861 as a detection ground electrode.

[0049] The driving signal electrode 811 is arranged on the upper and lower surfaces of the first and second driving vibration arms 75 and 76 and on both side surfaces of the third and fourth driving vibration arms 77 and 78. On the other hand, the driving ground electrode 821 is arranged on both side surfaces of the first and second driving vibration arms 75 and 76 and on the upper and lower surfaces of the third and fourth driving vibration arms 77 and 78. The driving signal electrode 811 is an electrode to which a driving signal is applied, and the driving ground electrode 821 is connected to a potential that is ground relative to the driving signal electrode 811. In the present embodiment, the circuit element 3 detects the driving state of the driving vibration portion 62 based on the signal output from the driving ground electrode 821 when being driven in the driving vibration mode described later.

[0050] In addition, the first detection signal electrode 831 is arranged on the upper and lower surfaces of the first detection vibration arm 71, and the first detection ground electrode 841 is arranged on both side surfaces of the first detection vibration arm 71. The first detection signal electrode 831 is an electrode that outputs a first detection signal in the detection vibration mode described later, and the first detection ground electrode 841 is connected to a potential that is ground relative to the first detection signal electrode 831, especially connected to the ground in this embodiment. In addition, the second detection signal electrode 851 is arranged on the upper and lower surfaces of the second detection vibration arm 72, and the second detection ground electrode 861 is arranged on both side surfaces of the second detection vibration arm 72. The second detection signal electrode 851 is an electrode that outputs a second detection signal in the detection vibration mode described later, and the second detection ground electrode 861 is connected to a potential that is ground relative to the second detection signal electrode 851, especially connected to the ground in this embodiment.

[0051] Such a sensor element 6 detects the angular velocity ωz in the following manner. When a driving signal is applied between the driving signal electrode 811 and the driving ground electrode 821, a driving vibration mode is excited. In the driving vibration mode, Figure 6 As shown, the first and second driving vibration arms 75, 76 and the third and fourth driving vibration arms 77, 78 perform bending vibration in opposite phases along the XY plane. In this state, the vibrations of the first, second, third, and fourth driving vibration arms 75, 76, 77, 78 are offset, and the first and second detection vibration arms 71, 72 do not vibrate substantially. When the angular velocity ωz is applied to the sensor element 6 in the state of driving in the driving vibration mode, the detection vibration mode is re-excited. In the detection vibration mode, as Figure 7 As shown, the Coriolis force acts on the first, second, third and fourth driving vibration arms 75, 76, 77 and 78 to excite bending vibration in the Y-axis direction, and the first and second detection vibration arms 71 and 72 perform bending vibration in the X-axis direction in response to the bending vibration.

[0052] Return to the description of electrode 8, as Figure 8As shown, the electrode 8 has four electrode pads arranged on the lower surface of the base 70. The four electrode pads include a drive signal electrode pad 812, a drive ground electrode pad 822, a first detection signal electrode pad 832, and a second detection signal electrode pad 852. The drive signal electrode pad 812 is electrically connected to the drive signal electrode 811, the drive ground electrode pad 822 is electrically connected to the drive ground electrode 821, the first detection signal electrode pad 832 is electrically connected to the first detection signal electrode 831, and the second detection signal electrode pad 852 is electrically connected to the second detection signal electrode 851. Moreover, the drive signal electrode pad 812 and the lead 41, the drive ground electrode pad 822 and the lead 44, the first detection signal electrode pad 832 and the lead 45, and the second detection signal electrode pad 852 and the lead 46 are mechanically bonded and electrically connected via the bonding component B1, respectively.

[0053] In addition, the driving signal electrode pad 812 is located on the X-axis intersecting the center O of the sensor element 6 and is arranged along the third side 70c. In contrast, the driving grounding electrode pad 822 is located on the X-axis intersecting the center O of the sensor element 6 and is arranged along the fourth side 70d. That is, the driving signal electrode pad 812 is arranged closer to the third side 70c than the fourth side 70d and in the middle of the first side 70a and the second side 70b, and the driving grounding electrode pad 822 is arranged closer to the fourth side 70d than the third side 70c and in the middle of the first side 70a and the second side 70b.

[0054] In addition, the first detection signal electrode pad 832 is arranged at the corner of the first side 70a and the fourth side 70d. In contrast, the second detection signal electrode pad 852 is arranged at the corner of the second side 70b and the fourth side 70d. That is, the first detection signal electrode pad 832 is arranged at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, and the second detection signal electrode pad 852 is arranged at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c. In addition, the first and second detection signal electrode pads 832 and 852 are respectively arranged slightly offset to the third side 70c side (positive side in the X-axis direction) relative to the driving grounding electrode pad 822.

[0055] By forming the four electrode pads 812, 822, 832, and 852 in the above-described configuration, the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be configured as far apart as possible in the base 70. Therefore, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed, so that the noise caused by the drive signal is not easily mixed into the first and second detection signals.

[0056] In particular, in the present embodiment, when viewed from above, the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 are circular. In this way, by setting the electrode pads 812, 832, and 852 to be circular, it is easy to increase the separation distance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852. Therefore, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed, so that the noise caused by the drive signal is not easily mixed into the first and second detection signals. In addition, the shape of the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is not particularly limited. For example, at least one of them can be a rectangle such as a square or a rectangle, or a triangle, a pentagon, a polygon above it, or an ellipse, an oblong, an irregular shape, etc.

[0057] In addition, the width W of the driving signal electrode pad 812, the driving grounding electrode pad 822, the first detection signal electrode pad 832, and the second detection signal electrode pad 852 is greater than 30 μm and less than 100 μm. By setting the width W to such a numerical range, the separation distance between the driving signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be sufficiently increased, and the electrostatic capacitance between the driving signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be effectively reduced. In addition, the separation distance between the driving grounding electrode pad 822 and the first and second detection signal electrode pads 832 and 852 can be sufficiently increased, and the electrostatic capacitance between the driving grounding electrode pad 822 and the first and second detection signal electrode pads 832 and 852 can be effectively reduced. However, the signal output from the driving grounding electrode pad 822 is weak, so it has almost no effect on the first and second detection signals.

[0058] here, Fig. 9The measurement results of the electrostatic capacitance of the driving signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 are shown. In addition, the measurement result is a calculation result obtained by simulation. It can be seen from the figure that by setting the width W to less than 100μm, the electrostatic capacitance can be suppressed to less than 1.25fF. Therefore, the electrostatic capacitance can be suppressed to be small enough, and the noise caused by the driving signal is not easily mixed into the first and second detection signals. In addition, in the area where the width W is less than 30μm, the reduction rate of the electrostatic capacitance relative to the width W is significantly reduced. Therefore, compared with the above-mentioned advantages of reducing the electrostatic capacitance, the disadvantage of reducing the width W is greater. As the above-mentioned disadvantages, for example, the reduction in bonding strength caused by the reduction in the bonding area with the bonding component B1 can be cited.

[0059] The width W may be 30 μm to 100 μm, and is preferably 80 μm or less. This can further reduce the capacitance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852, thereby further suppressing the noise of the first and second detection signals.

[0060] In addition, in the present embodiment, the width W of all of the drive signal electrode pad 812, the first detection signal electrode pad 832, and the second detection signal electrode pad 852 is 30 μm or more and 100 μm or less, but the present invention is not limited thereto, as long as the width W of at least one of the drive signal electrode pad 812, the first detection signal electrode pad 832, and the second detection signal electrode pad 852 is 30 μm or more and 100 μm or less. In such a case, the same effect as that of the present embodiment can be achieved.

[0061] In addition, the electrode 8 has a plurality of wirings arranged on the lower surface of the base 70. The plurality of wirings include: a first detection grounding wiring 843, which is arranged on the lower surface of the base 70 and electrically connected to the first detection grounding electrode 841; and a second detection grounding wiring 863, which is arranged on the lower surface of the base 70 and electrically connected to the second detection grounding electrode 861. Moreover, the first detection grounding wiring 843 and the lead 42, and the second detection grounding wiring 863 and the lead 43 are respectively mechanically joined and electrically connected via a joining component B1. In addition, when an axis passing through the center O of the sensor element 6 and extending in the Y-axis direction is set as an imaginary central axis, the joining component B1 joined to the first detection signal electrode pad 832 and the joining component B1 joined to the first detection grounding wiring 843, the joining component B1 joined to the second detection signal electrode pad 852, and the joining component B1 joined to the second detection grounding wiring 863 are respectively arranged symmetrically with respect to the imaginary central axis.

[0062] Among them, the first detection grounding wiring 843 is located between the driving signal electrode pad 812, the driving grounding electrode pad 822 and the first detection signal electrode pad 832, and is extended and configured in a manner that fills the substantially entire area of ​​the gap between them. Similarly, the second detection grounding wiring 863 is located between the driving signal electrode pad 812, the driving grounding electrode pad 822 and the second detection signal electrode pad 852, and is extended and configured in a manner that fills the substantially entire area of ​​the gap between them. In this way, by configuring the first and second detection grounding wirings 843 and 863 connected to the ground between the driving signal electrode pad 812 to which the driving signal is applied and the first and second detection signal electrode pads 832 and 852 that output the first and second detection signals, the capacitive coupling between the driving signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed, thereby making it difficult for the noise generated by the driving signal to be mixed into the first and second detection signals. Therefore, the reduction in the detection characteristics of the angular velocity ωz can be effectively suppressed. In particular, since the first and second detection signals are extremely weak compared to the driving signal, the above-mentioned effect is more significantly exerted.

[0063] In addition, the electrode 8 has a driving ground wiring 823 connecting the driving ground electrode 821 and the driving ground electrode pad 822. The driving ground wiring 823 is configured to surround the driving signal electrode pad 812. More specifically, the driving ground wiring 823 extends from the driving ground electrode pad 822 to the positive side of the X-axis direction, and before colliding with the driving signal electrode pad 812, it goes around the two sides of the driving signal electrode pad 812 and further extends to the positive side of the X-axis direction. In addition, the first detection ground wiring 843 is located between the driving ground wiring 823 and the first detection signal electrode pad 832, and the second detection ground wiring 863 is located between the driving ground wiring 823 and the second detection signal electrode pad 852. As a result, the capacitive coupling between the driving ground wiring 823 and the first and second detection signal electrode pads 832 and 852 is suppressed, so that the noise caused by the signal output from the driving ground electrode 821 is not easily mixed into the first and second detection signals.

[0064] 《Circuit Components 3》

[0065] like Figure 1 As shown, the circuit element 3 is fixed to the bottom surface of the recess 211c. In addition, the circuit element 3 includes a driving / detecting circuit that applies driving vibration to the sensor element 6 to drive the sensor element 6, and detects the angular velocity ωz based on the first and second detection signals output from the sensor element 6. However, the structure of the circuit element 3 is not particularly limited, and for example, other circuits such as a temperature compensation circuit may be included.

[0066] The physical quantity sensor 1 has been described above. As described above, the sensor element 6 included in such a physical quantity sensor 1 includes: a base 70; a driving vibration part 62 connected to the base 70; a detection vibration part 61 connected to the base 70; a driving signal electrode 811 arranged on the driving vibration part 62 to which a driving signal is applied; first and second detection signal electrodes 831 and 851 as detection signal electrodes arranged on the detection vibration part 61 to output first and second detection signals as detection signals; a driving signal electrode pad 812 arranged on the base 70 and electrically connected to the driving signal electrode 811; and first and second detection signal electrode pads 832 and 852 as detection signal electrode pads arranged on the base 70 and electrically connected to the first and second detection signal electrodes 831 and 851. Moreover, the width of at least one of the driving signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is 30 μm or more and 100 μm or less. In this way, by setting the width W to be greater than 30 μm and less than 100 μm, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed, thereby making it difficult for the noise generated by the drive signal to be mixed into the first and second detection signals. Therefore, the reduction in the detection characteristics of the angular velocity ωz can be effectively suppressed.

[0067] In addition, as described above, the width W of the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is 30 μm or more and 100 μm or less. According to such a structure, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be more effectively suppressed, so that the noise generated by the drive signal is not easily mixed into the first and second detection signals. Therefore, the reduction in the detection characteristics of the angular velocity ωz can be effectively suppressed.

[0068] In addition, as described above, the width W of the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is 80 μm or less. According to such a structure, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be more effectively suppressed, so that the noise generated by the drive signal is not easily mixed into the first and second detection signals. Therefore, the reduction in the detection characteristics of the angular velocity ωz can be effectively suppressed.

[0069] In addition, as described above, when the base 70 is viewed from above, that is, viewed from the Z-axis direction, the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 are circular. According to this structure, it is easy to increase the separation distance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852. Therefore, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed, so that the noise caused by the drive signal is not easily mixed into the first and second detection signals.

[0070] In addition, as described above, the sensor element 6 has: the first and second detection ground electrodes 841 and 861 as detection ground electrodes, which are arranged on the detection vibration part 61 and connected to the potential as the ground relative to the first and second detection signal electrodes 831 and 851; and the first and second detection ground wirings 843 and 863 as detection ground wirings, which are arranged on the base 70 and electrically connected to the first and second detection ground electrodes 841 and 861. Moreover, the first and second detection ground wirings 843 and 863 are arranged between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852. According to this structure, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed by the first detection ground wiring 843 and the second detection ground wiring 863, thereby making it difficult for the noise generated by the drive signal to be mixed into the first detection signal and the second detection signal. Therefore, it is possible to effectively suppress the reduction of the detection characteristics of the angular velocity ωz.

[0071] In addition, as described above, the sensor element 6 includes: a driving ground electrode 821, which is arranged on the driving vibration portion 62 and connected to a potential that is a ground relative to the driving signal electrode 811; and a driving ground electrode pad 822, which is arranged on the base 70 and electrically connected to the driving ground electrode 821. In addition, the driving signal electrode pad 812 is surrounded by a driving ground wiring 823 that connects the driving ground electrode 821 and the driving ground electrode pad 822, and the first and second detection ground wirings 843 and 863 are arranged between the driving ground wiring 823 and the first and second detection signal electrode pads 832 and 852. According to such a structure, the capacitive coupling between the driving ground wiring 823 and the first and second detection signal electrode pads 832 and 852 is suppressed, so that the noise caused by the signal output from the driving ground electrode 821 is not easily mixed into the first and second detection signals.

[0072] In addition, as described above, when the base 70 is viewed from above, that is, when the base 70 is viewed from the Z-axis direction, the base 70 has a first side 70a, a second side 70b opposite to the first side 70a, a third side 70c intersecting the first side 70a, and a fourth side 70d opposite to the third side 70c. In addition, the detection vibration portion 61 has a first detection vibration arm 71 extending from the first side 70a, and a second detection vibration arm 72 extending from the second side 70b. In addition, the detection signal electrode has a first detection signal electrode 831 configured on the first detection vibration arm 71, and a second detection signal electrode 851 configured on the second detection vibration arm 72. In addition, the detection signal electrode pad has a first detection signal electrode pad 832 electrically connected to the first detection signal electrode 831, and a second detection signal electrode pad 852 electrically connected to the second detection signal electrode 851. In addition, the driving vibration part 62 includes: a first connecting arm 73 extending from the third side 70c; a first driving vibration arm 75 and a second driving vibration arm 76 extending from the first connecting arm 73 to opposite sides; a second connecting arm 74 extending from the fourth side 70d; a third driving vibration arm 77 and a fourth driving vibration arm 78 extending from the second connecting arm 74 to opposite sides. In addition, the driving signal electrode pad 812 is arranged at a position closer to the third side 70c than the fourth side 70d and in the middle of the first side 70a and the second side 70b, and the driving grounding electrode pad 822 is arranged at a position closer to the fourth side 70d than the third side 70c and in the middle of the first side 70a and the second side 70b. In addition, the first detection signal electrode pad 832 is arranged at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, and the second detection signal electrode pad 852 is arranged at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c. According to such a structure, the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be arranged as separately as possible in the base 70. Therefore, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed, so that the noise caused by the drive signal is not easily mixed into the first and second detection signals.

[0073] Furthermore, as described above, the physical quantity sensor 1 includes: the package 2; the support substrate 4 housed in the package 2 and bonded to the package 2; and the sensor element 6 housed in the package 2 and bonded to the support substrate 4. With such a structure, the effect of the sensor element 6 described above can be enjoyed, and the reduction in the physical quantity detection characteristics of the physical quantity sensor 1 can be effectively suppressed.

[0074] <Second Embodiment>

[0075] Fig.10It is a plan view showing a support substrate included in the physical quantity sensor according to the second embodiment. Fig.11 is an enlarged perspective view showing the base of the sensor element. Fig.12 It is a graph showing the relationship between the width W and the bonding area. Fig.13 : is a graph showing the relationship between the width W and the electrostatic capacitance.

[0076] This embodiment is the same as the first embodiment described above, except that the number of bonding parts B1 that bond the sensor element 6 to the support substrate 4 and the number of leads of the support substrate 4 are different. In addition, in the following description, the description of this embodiment is centered on the differences from the first embodiment described above, and the description of the same matters is omitted. In addition, in each figure of this embodiment, the same figure mark is marked for the same structure as the above embodiment.

[0077] like Fig.10 As shown, the support substrate 4 of this embodiment has eight leads 41, 42, 43, 44, 45, 46, 47, 48. The sensor element 6 is bonded to the ends of the leads 41, 42, 43, 44, 45, 46, 47, 48 via eight bonding members B1. Fig.11 As shown, in this embodiment, two bonding members B1 are bonded to the first detection ground wiring 843 , and two bonding members B1 are bonded to the second detection ground wiring 863 .

[0078] A bonding component B1a bonded to the first detection grounding wiring 843 is arranged at the corner of the first side 70a and the third side 70c. That is, the bonding component B1a is arranged at a position closer to the first side 70a than the second side 70b and closer to the third side 70c than the fourth side 70d. In contrast, another bonding component B1b is arranged at a position closer to the first side 70a than the second side 70b and in the middle of the third side 70c and the fourth side 70d. Moreover, the first detection grounding wiring 843 is bonded to the lead 42 via the bonding component B1a, and is bonded to the lead 47 via the bonding component B1b.

[0079] Similarly, a bonding component B1c bonded to the second detection grounding wiring 863 is arranged at the corner of the second side 70b and the third side 70c. That is, the bonding component B1c is arranged at a position closer to the second side 70b than the first side 70a and closer to the third side 70c than the fourth side 70d. In contrast, another bonding component B1d is arranged at a position closer to the second side 70b than the first side 70a and in the middle of the third side 70c and the fourth side 70d. Moreover, the second detection grounding wiring 863 is bonded to the lead 43 via the bonding component B1c, and is bonded to the lead 48 via the bonding component B1d.

[0080] In addition, these eight bonding members B1 are arranged symmetrically with respect to the center O of the sensor element 6. Thus, the sensor element 6 can be supported in a well-balanced manner.

[0081] Thus, by using eight bonding members B1, it is easy to ensure the bonding strength between the sensor element 6 and the support substrate 4. Therefore, the width W of each electrode pad 812, 822, 832, 852 can be reduced while maintaining sufficient bonding strength. Fig.12 is a graph showing the relationship between the width W and the bonding area. In addition, the "bonding area" is the bonding area between the electrode 8 and the bonding member B1. In this graph, the diameter of the bonding member B1 is set to 80 μm. In addition, Fig.13 : is a graph showing the relationship between the width W and the electrostatic capacitance. In addition, the “electrostatic capacitance” is the electrostatic capacitance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 .

[0082] from Fig.12 It can be seen that when the number of bonding parts B1 is 8, in order to obtain a bonding strength exceeding the width W=80 μm when the number of bonding parts B1 is 6, the width W needs to be 67 μm or more. Fig.13 It can be seen that the electrostatic capacitance at a width of W = 67 μm when the number of bonding parts B1 is 8 is smaller than the electrostatic capacitance at a width of W = 80 μm when the number of bonding parts B1 is 6. Thus, according to this embodiment, the electrostatic capacitance can be effectively reduced while ensuring sufficient bonding strength.

[0083] According to the second embodiment as described above, it is also possible to produce the same effects as those of the first embodiment described above.

[0084] <Third Embodiment>

[0085] Fig.14 is an enlarged perspective view showing a base portion of a sensor element according to a third embodiment.

[0086] This embodiment is the same as the second embodiment except that the structure of the sensor element 6 is different. In addition, in the following description, the present embodiment is described mainly with respect to the differences from the above-mentioned embodiment, and the description of the same matters is omitted. In addition, in the figures of this embodiment, the same reference numerals are given to the same structures as those in the above-mentioned embodiment.

[0087] like Fig.14As shown, in the present embodiment, the electrode 8 has 6 electrode pads arranged on the lower surface of the base 70. The 6 electrode pads include a drive signal electrode pad 812, a drive ground electrode pad 822, a first detection signal electrode pad 832, a first detection ground electrode pad 842, a second detection signal electrode pad 852, and a second detection ground electrode pad 862. The first detection ground electrode pad 842 is electrically connected to the first detection ground electrode 841, and the second detection ground electrode pad 862 is electrically connected to the second detection ground electrode 861. In addition, the first detection ground electrode pad 842 and the lead 47, and the second detection ground electrode pad 862 and the lead 48 are mechanically bonded and electrically connected via the bonding component B1, respectively. Regarding the other electrode pads, it is the same as the aforementioned embodiment.

[0088] In addition, the electrode 8 has a plurality of wirings arranged on the lower surface of the base 70. The plurality of wirings include a first ground wiring 873 and a second ground wiring 883. The first ground wiring 873 and the lead 42, and the second ground wiring 883 and the lead 43 are respectively mechanically bonded and electrically connected via a bonding member B1. The first ground wiring 873 and the second ground wiring 883 are respectively grounded.

[0089] The first ground wiring 873 is arranged between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832 and the first detection ground electrode pad 842. Similarly, the second ground wiring 883 is arranged between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852 and the second detection ground electrode pad 862. According to such a structure, the capacitive coupling between the drive signal electrode pad 812 and the first detection signal electrode pad 832 and the second detection signal electrode pad 852 is suppressed by the first ground wiring 873 and the second ground wiring 883, thereby making it difficult for the noise generated by the drive signal to be mixed into the first detection signal and the second detection signal. Therefore, it is possible to effectively suppress the reduction of the detection characteristics of the angular velocity ωz.

[0090] In such a structure, the first and second detection ground electrodes 841 and 861 can be used as detection signal electrodes instead of ground electrodes. When the first and second detection ground electrodes 841 and 861 are used as detection signal electrodes, the first detection ground electrode 841 is called the third detection signal electrode 841a, the second detection ground electrode 861 is called the fourth detection signal electrode 861a, the first detection ground electrode pad 842 is called the third detection signal electrode pad 842a, and the second detection ground electrode pad 862 is called the fourth detection signal electrode pad 862a.

[0091] When the first and second detection ground electrodes 841 and 861 are used as the third and fourth detection signal electrodes 841a and 861a, the first detection signal is obtained by adding the detection signal output from the first detection signal electrode 831 and the detection signal output from the fourth detection signal electrode 861a, and the second detection signal is obtained by adding the detection signal output from the second detection signal electrode 851 and the detection signal output from the third detection signal electrode 841a. Thus, the first and second detection signals with twice the charge amount can be obtained compared to the first embodiment described above. Therefore, the detection sensitivity of the sensor element 6 can be improved.

[0092] In particular, since the first ground wiring 873 is arranged between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832 and the third detection signal electrode pad 842a, and the second ground wiring 883 is arranged between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852 and the fourth detection signal electrode pad 862a, the capacitive coupling between the drive signal electrode pad 812 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a is suppressed by the first and second ground wirings 873 and 883, so that the noise caused by the drive signal is not easily mixed into the detection signal. Therefore, the reduction in the detection characteristics of the angular velocity ωz can be effectively suppressed.

[0093] In addition, the width W of the driving signal electrode pad 812, the driving ground electrode pad 822, the first detection signal electrode pad 832, the first detection ground electrode pad 842, the second detection signal electrode pad 852, and the second detection ground electrode pad 862 is 30 μm or more and 100 μm or less. Thus, the separation distance between the driving signal electrode pad 812 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a can be sufficiently increased, thereby effectively reducing the electrostatic capacitance between the driving signal electrode pad 812 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a. In addition, the separation distance between the driving grounding electrode pad 822 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a can be fully increased, and the electrostatic capacitance between the driving grounding electrode pad 822 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a can be effectively reduced.

[0094] As described above, when the first and second detection ground electrodes 841 and 861 are not used as detection signal electrodes, the sensor element 6 of the present embodiment has a first side 70a, a second side 70b opposite to the first side 70a, a third side 70c intersecting the first side 70a, and a fourth side 70d opposite to the third side 70c when the base 70 is viewed from above. In addition, the detection vibration portion 61 has a first detection vibration arm 71 extending from the first side 70a, and a second detection vibration arm 72 extending from the second side 70b. In addition, the detection signal electrode has a first detection signal electrode 831 configured on the first detection vibration arm 71, and a second detection signal electrode 851 configured on the second detection vibration arm 72. In addition, the detection signal electrode pad has a first detection signal electrode pad 832 electrically connected to the first detection signal electrode 831, and a second detection signal electrode pad 852 electrically connected to the second detection signal electrode 851. In addition, the driving vibration portion 62 has: a first connecting arm 73, which extends from the third side 70c; a first driving vibration arm 75 and a second driving vibration arm 76, which extend from the first connecting arm 73 to opposite sides; a second connecting arm 74, which extends from the fourth side 70d; and a third driving vibration arm 77 and a fourth driving vibration arm 78, which extend from the second connecting arm 74 to opposite sides. In addition, the sensor element 6 further includes: a first detection ground electrode 841, which is arranged on the first detection vibration arm 71 and connected to a potential that is ground relative to the first detection signal electrode 831; a first detection ground electrode pad 842, which is arranged on the base 70 and electrically connected to the first detection ground electrode 841; a second detection ground electrode 861, which is arranged on the second detection vibration arm 72 and connected to a potential that is ground relative to the second detection signal electrode 851; a second detection ground electrode pad 862, which is arranged on the base 70 and electrically connected to the second detection ground electrode 861; and a first ground wiring 873 and a second ground wiring 883, which are arranged on the base 70 and connected to the ground. In addition, the drive signal electrode pad 812 is arranged at a position closer to the third side 70c than the fourth side 70d and at a midpoint between the first side 70a and the second side 70b, and the drive ground electrode pad 822 is arranged at a position closer to the fourth side 70d than the third side 70c and at a midpoint between the first side 70a and the second side 70b. In addition, the first detection signal electrode pad 832 is configured at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, and the first detection grounding electrode pad 842 is configured at a position closer to the first side 70a than the second side 70b and in the middle of the third side 70c and the fourth side 70d.In addition, the second detection signal electrode pad 852 is arranged at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c, and the second detection grounding electrode pad 862 is arranged at a position closer to the second side 70b than the first side 70a and in the middle of the third side 70c and the fourth side 70d. In addition, the first ground wiring 873 is arranged between the drive signal electrode pad 812 and the drive grounding electrode pad 822 and the first detection signal electrode pad 832 and the first detection grounding electrode pad 842, and the second ground wiring 883 is arranged between the drive signal electrode pad 812 and the drive grounding electrode pad 822 and the second detection signal electrode pad 852 and the second detection grounding electrode pad 862. According to such a structure, the capacitive coupling between the drive signal electrode pad 812 and the first detection signal electrode pad 832 and the second detection signal electrode pad 852 is suppressed by the first ground wiring 873 and the second ground wiring 883, thereby making it difficult for noise generated by the drive signal to be mixed into the detection signal. Therefore, it is possible to effectively suppress the reduction of the detection characteristics of the angular velocity ωz.

[0095] On the other hand, when the first and second detection ground electrodes 841 and 861 are used as detection signal electrodes, when the base 70 is viewed from above, the base 70 of the sensor element 6 of the present embodiment has a first side 70a, a second side 70b opposite to the first side 70a, a third side 70c intersecting the first side 70a, and a fourth side 70d opposite to the third side 70c. In addition, the detection vibration portion 61 has a first detection vibration arm 71 extending from the first side 70a, and a second detection vibration arm 72 extending from the second side 70b. In addition, the detection signal electrode has a first detection signal electrode 831 configured on the first detection vibration arm 71, and a second detection signal electrode 851 configured on the second detection vibration arm 72. In addition, the detection signal electrode pad has a first detection signal electrode pad 832 electrically connected to the first detection signal electrode 831, and a second detection signal electrode pad 852 electrically connected to the second detection signal electrode 851. In addition, the driving vibration part 62 has: a first connection arm 73 extending from the third side 70c; a first driving vibration arm 75 and a second driving vibration arm 76 extending from the first connection arm 73 to opposite sides; a second connection arm 74 extending from the fourth side 70d; a third driving vibration arm 77 and a fourth driving vibration arm 78 extending from the second connection arm 74 to opposite sides. In addition, the sensor element 6 also has: a third detection signal electrode 841a arranged on the first detection vibration arm 71; a third detection signal electrode pad 842a arranged on the base 70 and electrically connected to the third detection signal electrode 841a; a fourth detection signal electrode 861a arranged on the second detection vibration arm 72; a fourth detection signal electrode pad 862a arranged on the base 70 and electrically connected to the fourth detection signal electrode 861a; and a first ground wiring 873 and a second ground wiring 883 arranged on the base 70 and connected to the ground. Furthermore, the driving signal electrode pad 812 is arranged at a position closer to the third side 70c than the fourth side 70d and in the middle of the first side 70a and the second side 70b, and the driving grounding electrode pad 822 is arranged at a position closer to the fourth side 70d than the third side 70c and in the middle of the first side 70a and the second side 70b. In addition, the first detection signal electrode pad 832 is arranged at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, and the third detection signal electrode pad 842a is arranged at a position closer to the first side 70a than the second side 70b and in the middle of the third side 70c and the fourth side 70d. In addition, the second detection signal electrode pad 852 is configured at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c, and the fourth detection signal electrode pad 862a is configured at a position closer to the second side 70b than the first side 70a and in the middle of the third side 70c and the fourth side 70d.In addition, the first ground wiring 873 is arranged between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832 and the third detection signal electrode pad 842a, and the second ground wiring 883 is arranged between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852 and the fourth detection signal electrode pad 862a. According to such a structure, the capacitive coupling between the drive signal electrode pad 812 and the first detection signal electrode pad 832 and the second detection signal electrode pad 852 is suppressed by the first ground wiring 873 and the second ground wiring 883, thereby making it difficult for the noise generated by the drive signal to be mixed into the first detection signal and the second detection signal. Therefore, it is possible to effectively suppress the reduction of the detection characteristics of the angular velocity ωz.

[0096] According to the third embodiment as described above, it is also possible to produce the same effects as those of the first embodiment described above.

[0097] <Fourth Embodiment>

[0098] Fig.15 It is a plan view showing the interior of a physical quantity sensor according to a fourth embodiment. Fig.16 1 is a plan view showing a support substrate. Fig.17 It is an enlarged plan view showing the base of the support substrate.

[0099] This embodiment is the same as the third embodiment except that a support substrate 9 is used instead of the support substrate 4. In addition, in the following description, the present embodiment is described mainly with respect to the differences from the above-mentioned embodiment, and the description of the same matters is omitted. In addition, in each figure of this embodiment, the same reference numerals are marked for the same structures as those in the above-mentioned embodiment.

[0100] like Fig.15 and Fig.16 As shown, the support substrate 9 includes: a base 90 located in the center; a frame-shaped support portion 91 surrounding the base 90; beam portions 921 and 922 connecting the base 90 and the support portion 91 on the positive side of the base 90 in the X-axis direction; and beam portions 923 and 924 connecting the base 90 and the support portion 91 on the negative side of the base 90 in the X-axis direction. Furthermore, the base 70 of the sensor element 6 is fixed to the base 90 via the bonding member B1, and the support portion 91 is fixed to the bottom surface of the recessed portion 211a via the bonding member B2.

[0101] Such a support substrate 9 is formed of a quartz substrate similarly to the vibration substrate 7. Thus, the thermal expansion coefficients of the support substrate 9 and the vibration substrate 7 can be made equal. Therefore, thermal stress caused by the difference in thermal expansion coefficients between the support substrate 9 and the vibration substrate 7 is substantially not generated, and the sensor element 6 is less susceptible to stress. Therefore, the sensor element 6 can exhibit stable vibration characteristics. However, the constituent material of the support substrate 9 is not particularly limited.

[0102] Furthermore, the wiring 5 for electrically connecting the sensor element 6 and the internal terminal 241 is arranged on the support substrate 9 as described above. Fig.17 As shown, the wiring 5 has eight element side terminals 511, 521, 531, 541, 551, 561, 571, and 581 arranged on the upper surface of the base 90. In addition, the element side terminal 511 and the driving signal electrode pad 812, the element side terminal 521 and the driving grounding electrode pad 822, the element side terminal 541 and the first detection signal electrode pad 832, the element side terminal 531 and the first detection grounding electrode pad 842, the element side terminal 561 and the second detection signal electrode pad 852, the element side terminal 551 and the second detection grounding electrode pad 862, the element side terminal 571 and the first ground wiring 873, and the element side terminal 581 and the second ground wiring 883 are respectively mechanically bonded and electrically connected via the bonding component B1. In addition, when the first and second detection ground electrodes 841 and 861 are used as the third and fourth detection signal electrodes 841a and 861a, as shown in the figure, the element side terminals 531 and 561 are electrically connected and gathered into one terminal, and the element side terminals 541 and 551 are electrically connected and gathered into one terminal. This can reduce the number of wirings described later.

[0103] In addition, if Fig.15 and Fig.16 As shown, the wiring 5 has six base-side terminals 512, 522, 542, 562, 572, and 582 arranged on the lower surface of the support portion 91. In addition, the wiring 5 has six wirings (not shown) that respectively connect the element-side terminal 511 and the base-side terminal 512, the element-side terminal 521 and the base-side terminal 522, the element-side terminal 541 and the base-side terminal 542, the element-side terminal 561 and the base-side terminal 562, the element-side terminal 571 and the base-side terminal 572, and the element-side terminal 581 and the base-side terminal 582. Each wiring passes through any one of the beams 921, 922, 923, and 924 and is led from the base 90 to the support portion 91.

[0104] According to the fourth embodiment as described above, it is also possible to produce the same effects as those of the first embodiment described above.

[0105] The sensor element and the physical quantity sensor of the present invention are described above according to the illustrated embodiments, but the present invention is not limited thereto, and the structure of each part can be replaced with any structure having the same function. In addition, other arbitrary structures can also be added to the present invention. In addition, the various embodiments can also be appropriately combined.

Claims

1. A sensor element, characterized in that: have: base; A driving vibration part connected to the base; A vibration detection part connected to the base; a driving signal electrode, which is disposed on the driving vibration portion and to which a driving signal is applied; A detection signal electrode, which is disposed on the detection vibration portion and outputs a detection signal; a driving signal electrode pad, which is disposed on the base and electrically connected to the driving signal electrode; as well as a detection signal electrode pad, which is disposed on the base and electrically connected to the detection signal electrode; A width of at least one of the drive signal electrode pad and the detection signal electrode pad is greater than or equal to 30 μm and less than or equal to 100 μm.

2. The sensor element according to claim 1, wherein: The widths of the drive signal electrode pad and the detection signal electrode pad are respectively greater than or equal to 30 μm and less than or equal to 100 μm.

3. The sensor element according to claim 2, wherein: The widths of the drive signal electrode pad and the detection signal electrode pad are each 80 μm or less.

4. The sensor element according to claim 1, wherein: When looking down at the base, The driving signal electrode pad and the detection signal electrode pad are each circular.

5. The sensor element according to claim 1, wherein The sensor element has: a detection ground electrode disposed on the detection vibration portion and connected to a potential that is a ground relative to the detection signal electrode; as well as a detection ground wiring, which is arranged on the base portion and electrically connected to the detection ground electrode; The detection ground wiring is arranged between the drive signal electrode pad and the detection signal electrode pad.

6. The sensor element according to claim 5, wherein: The sensor element has: a driving ground electrode disposed on the driving vibration portion and connected to a potential that is a ground relative to the driving signal electrode; and a driving ground electrode pad, which is disposed on the base portion and is electrically connected to the driving ground electrode; The driving signal electrode pad is surrounded by a driving ground wiring that connects the driving ground electrode and the driving ground electrode pad. The detection ground wiring is arranged between the drive ground wiring and the detection signal electrode pad.

7. The sensor element according to claim 6, wherein: When looking down at the base, The base has a first side, a second side opposite to the first side, a third side intersecting the first side, and a fourth side opposite to the third side. The detection vibration part has: a first detection vibration arm extending from the first side; and a second detection vibration arm extending from the second side, The detection signal electrode comprises: a first detection signal electrode, which is arranged on the first detection vibration arm; and a second detection signal electrode, which is arranged on the second detection vibration arm. The detection signal electrode pad comprises: a first detection signal electrode pad electrically connected to the first detection signal electrode; and a second detection signal electrode pad electrically connected to the second detection signal electrode. The driving vibration part includes: a first connecting arm extending from the third side; a first driving vibration arm and a second driving vibration arm extending from the first connecting arm to opposite sides; and a second connecting arm extending from the fourth side; and a third driving vibration arm and a fourth driving vibration arm extending from the second connecting arm to opposite sides thereof, One of the driving signal electrode pad and the driving grounding electrode pad is arranged at a position closer to the third side than the fourth side and in the middle of the first side and the second side, and the other is arranged at a position closer to the fourth side than the third side and in the middle of the first side and the second side, The first detection signal electrode pad is arranged at a position closer to the first side than the second side and closer to the fourth side than the third side. The second detection signal electrode pad is arranged at a position closer to the second side than to the first side and closer to the fourth side than to the third side.

8. The sensor element according to claim 1, wherein When looking down at the base, The base has a first side, a second side opposite to the first side, a third side intersecting the first side, and a fourth side opposite to the third side. The detection vibration part has: a first detection vibration arm extending from the first side; and a second detection vibration arm extending from the second side, The detection signal electrode comprises: a first detection signal electrode, which is arranged on the first detection vibration arm; and a second detection signal electrode, which is arranged on the second detection vibration arm. The detection signal electrode pad comprises: a first detection signal electrode pad electrically connected to the first detection signal electrode; and a second detection signal electrode pad electrically connected to the second detection signal electrode. The driving vibration part includes: a first connecting arm extending from the third side; a first driving vibration arm and a second driving vibration arm extending from the first connecting arm to opposite sides; and a second connecting arm extending from the fourth side; and a third driving vibration arm and a fourth driving vibration arm extending from the second connecting arm to opposite sides thereof, The sensor element has: a first detection ground electrode, which is disposed on the first detection vibration arm and is connected to a potential that is a ground relative to the first detection signal electrode; a first detection ground electrode pad, which is disposed on the base portion and is electrically connected to the first detection ground electrode; a second detection ground electrode, which is disposed on the second detection vibration arm and is connected to a potential that is a ground relative to the second detection signal electrode; a second detection grounding electrode pad, which is disposed on the base portion and is electrically connected to the second detection grounding electrode; as well as A first ground wiring and a second ground wiring are arranged on the base and connected to the ground. The driving signal electrode pad is arranged at a position closer to the third side than to the fourth side and in the middle of the first side and the second side. The driving grounding electrode pad is arranged at a position closer to the fourth side than the third side and in the middle of the first side and the second side. The first detection signal electrode pad is arranged at a position closer to the first side than the second side and closer to the fourth side than the third side. The first detection grounding electrode pad is arranged at a position closer to the first side than the second side and in the middle of the third side and the fourth side. The second detection signal electrode pad is arranged at a position closer to the second side than the first side and closer to the fourth side than the third side. The second detection grounding electrode pad is arranged at a position closer to the second side than the first side and in the middle of the third side and the fourth side. The first ground wiring is arranged between the driving signal electrode pad and the driving ground electrode pad and the first detection signal electrode pad and the first detection ground electrode pad. The second ground wiring is arranged between the drive signal electrode pad and the drive ground electrode pad and the second detection signal electrode pad and the second detection ground electrode pad.

9. The sensor element according to claim 1, wherein: When looking down at the base, The base has a first side, a second side opposite to the first side, a third side intersecting the first side, and a fourth side opposite to the third side. The detection vibration part has: a first detection vibration arm extending from the first side; and a second detection vibration arm extending from the second side, The detection signal electrode comprises: a first detection signal electrode, which is arranged on the first detection vibration arm; and a second detection signal electrode, which is arranged on the second detection vibration arm. The detection signal electrode pad comprises: a first detection signal electrode pad electrically connected to the first detection signal electrode; and a second detection signal electrode pad electrically connected to the second detection signal electrode. The driving vibration part includes: a first connecting arm extending from the third side; a first driving vibration arm and a second driving vibration arm extending from the first connecting arm to opposite sides; and a second connecting arm extending from the fourth side; and a third driving vibration arm and a fourth driving vibration arm extending from the second connecting arm to opposite sides thereof, The sensor element has: A third detection signal electrode, which is disposed on the first detection vibration arm; A third detection signal electrode pad, which is disposed on the base and electrically connected to the third detection signal electrode; a fourth detection signal electrode, which is disposed on the second detection vibration arm; a fourth detection signal electrode pad, which is disposed on the base and electrically connected to the fourth detection signal electrode; as well as A first ground wiring and a second ground wiring are arranged on the base and connected to the ground. The driving signal electrode pad is arranged at a position closer to the third side than to the fourth side and in the middle of the first side and the second side. The driving grounding electrode pad is arranged at a position closer to the fourth side than the third side and in the middle of the first side and the second side. The first detection signal electrode pad is arranged at a position closer to the first side than the second side and closer to the fourth side than the third side. The third detection signal electrode pad is arranged at a position closer to the first side than the second side and in the middle of the third side and the fourth side. The second detection signal electrode pad is arranged at a position closer to the second side than the first side and closer to the fourth side than the third side. The fourth detection signal electrode pad is arranged at a position closer to the second side than the first side and in the middle of the third side and the fourth side. The first ground wiring is arranged between the drive signal electrode pad and the drive ground electrode pad and the first detection signal electrode pad and the third detection signal electrode pad. The second ground wiring is arranged between the drive signal electrode pad and the drive ground electrode pad and the second detection signal electrode pad and the fourth detection signal electrode pad.

10. A physical quantity sensor, characterized in that: have: Encapsulation; a supporting substrate housed in the package and bonded to the package; as well as The sensor element according to any one of claims 1 to 9 is housed in the package and bonded to the support substrate.

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