Data center temperature monitoring system for liquid-cooled rack-mounted components

Abstract

Data center temperature monitoring systems and methods for rack-mounted components. The temperature monitoring system includes: a power distribution unit configured to distribute power to each of the rack-mounted components; and a temperature regulation unit electrically connected to the power distribution unit and configured to detect a temperature of one or more of the rack mounted components, in response to the temperature regulation unit detecting that the temperature of one of the rack-mounted components exceeds the high temperature threshold, the temperature regulation unit disconnects the corresponding rack-mounted component from the PDU.

Description

Technical Field

[0001] The present technology relates to a temperature monitoring system for data center rack mounted processing components. In particular, the present technology relates to a temperature monitoring system that monitors the temperature of a data center rack mounted component and interrupts power supplied to the rack mounted component if an overheating temperature is detected. Background Art

[0002] Electronic equipment (e.g., processing servers, memory banks, computer disks, etc.) are typically arranged in electronic equipment racks. Large data centers and other large computer facilities may house thousands of racks that support thousands or even tens of thousands of processing servers. These electronic equipment racks typically consume a large amount of power and generate a large amount of heat. Some electronic devices (such as processors) generate so much heat that they may fail within seconds due to overheating.

[0003] Therefore, cooling measures are adopted to control the heat generated by such electronic equipment. Such a cooling measure (direct liquid cooling block, especially water cooling) has been used as a supplement or alternative to traditional forced air cooling. A cold plate (for example, a water block with an internal channel for channelized water circulation) can be installed on a heat generating component (such as a processor) to transfer heat from the processor toward a heat exchanger. In addition, immersion cooling (sometimes referred to as immersive cooling) has also been adopted. That is, the electronic component is inserted into a container that is completely or partially filled with a non-conductive cooling liquid (for example, an oil-based dielectric cooling liquid). Effective thermal contact is obtained between the electronic component and the dielectric cooling liquid. The immersion cooling system is usually in the form of a large can-shaped piece, and the electronic equipment is immersed in the large can-shaped piece. Even in other cooling measures, a hybrid cooling system involving both water cooling and immersion cooling technology has been adopted to improve the cooling efficiency of the heat generating electronic component.

[0004] However, such liquid cooling systems may be susceptible to certain failures, such as, for example, water block failure, dielectric cooling liquid leakage, etc. Therefore, temperature monitoring systems for liquid-cooled electronic devices are currently being designed.

[0005] Existing cooling monitoring systems for liquid-cooled electronic equipment typically require a large number of sensors and controllers and corresponding wiring, which limits rack utilization and increases operating costs. Therefore, there is interest in developing alternative low-cost, individually addressable temperature monitoring systems that do not require complex sensors and controllers, yet are able to provide adequate protection in the event of overheating.

[0006] The subject matter discussed in the background section should not be considered as prior art simply because it is mentioned in the background section. Similarly, the problems mentioned in the background section or problems associated with the subject matter in the background section should not be considered as having been previously recognized in the prior art. The subject matter in the background section merely represents different approaches. Summary of the invention

[0007] The implementation of the present technology was developed based on the developers' recognition of the shortcomings associated with the existing technology.

[0008] According to a first broad aspect of the present technology, a data center temperature monitoring system for rack-mounted components is provided, the data center temperature monitoring system comprising: a power distribution unit (PDU) configured to distribute power to each of the rack-mounted components; and a temperature regulating unit electrically connected to the PDU and configured to detect the temperature of one or more of the rack-mounted components. In response to the temperature regulating unit detecting that the temperature of one of the rack-mounted components exceeds a high temperature threshold, the temperature regulating unit disconnects the corresponding rack-mounted component from the PDU.

[0009] In some non-limiting implementations, disconnection of a corresponding rack-mounted component from the PDU is isolated to the corresponding rack-mounted component without affecting power distribution to a plurality of other rack-mounted components.

[0010] In some non-limiting implementations, the temperature regulating unit includes a bimetallic snap-action thermostat mounted on a front of each of the rack-mounted components.

[0011] In some non-limiting embodiments, a bimetallic snap-acting temperature regulator includes two metal parts having different thermal expansion coefficients joined together to provide a bimetallic element, wherein the bimetallic element is configured to bend due to the different thermal expansion coefficients based on a detected temperature level.

[0012] In some non-limiting implementations, in response to the bimetallic element bending beyond a displacement threshold due to the detected temperature level, the displacement disconnects the rack-mounted component from the PDU.

[0013] In some non-limiting implementations, in response to the bimetallic element bending beyond a displacement threshold due to the detected temperature level, the displacement dislocates the first rod element and the second rod element and the displacement interrupts the optical rack-mount component locating beam, thereby indicating the location of the rack-mount component disconnected from the PDU.

[0014] In some non-limiting implementations, the second rod element includes a rod portion having a hole that allows the optical rack-mount assembly positioning beam to travel therethrough during normal operation.

[0015] In some non-limiting implementations, the rack-mounted assembly requires operator intervention to manually reconnect the PDU after being disconnected.

[0016] In some non-limiting implementations, the high temperature threshold is set between about 50 degrees Celsius and about 80 degrees Celsius.

[0017] In some non-limiting implementations, the rack-mounted components each include an electronic processing board at least partially immersed in an immersion housing that contains an immersion cooling liquid for cooling the rack-mounted components.

[0018] The present invention also relates to a method for monitoring the temperature of rack-mounted components for a data center, the method comprising: distributing power to a plurality of rack-mounted components through a power distribution unit (PDU), a temperature regulating unit being installed on the plurality of rack-mounted components, the temperature regulating unit being configured to detect the temperature of the corresponding rack-mounted components; and in response to the temperature regulating unit detecting that the temperature of the corresponding rack-mounted component exceeds a high temperature threshold, the temperature regulating unit disconnects the corresponding rack-mounted component from the PDU.

[0019] In some non-limiting implementations, disconnection of a respective rack-mounted component from the PDU is limited to the respective rack-mounted component only without affecting power distribution to the plurality of other rack-mounted components.

[0020] In some non-limiting implementations, each temperature adjustment unit includes a bimetallic snap-action temperature adjuster, which includes two metal parts with different thermal expansion coefficients, and the two metal parts are joined together to provide a bimetallic element, wherein the bimetallic element is configured to cause bending due to the different thermal expansion coefficients based on the detected temperature level.

[0021] In some non-limiting implementations, in response to the bimetallic element bending beyond a displacement threshold due to the detected temperature level, the displacement disconnects the rack-mount component from the PDU and the displacement simultaneously dislocates the first rod element and the second rod element and interrupts the optical rack-mount component locating beam, thereby indicating the position of the rack-mount component disconnected from the PDU.

[0022] In some non-limiting implementations, disconnected rack-mounted components require operator intervention to manually reconnect the PDU after being disconnected.

[0023] In the context of this specification, unless otherwise expressly specified, a computer system may refer to but is not limited to an "electronic device", "operating system", "system", "computer-based system", "controller unit", "monitoring device", "control device" and / or any combination thereof suitable for the current relevant task.

[0024] In the context of this specification, unless expressly provided otherwise, the expressions "computer-readable medium" and "memory" are intended to include media of any nature and kind, non-limiting examples of which include RAM, ROM, disks (CD-ROM, DVD, floppy disks, hard disk drives, etc.), USB keys, flash memories, solid-state drives, and tape drives. Still in the context of this specification, "a" computer-readable medium and "the" computer-readable medium should not be interpreted as the same computer-readable medium. On the contrary, and where appropriate, "a" computer-readable medium and "the" computer-readable medium may also be interpreted as a first computer-readable medium and a second computer-readable medium.

[0025] In the context of this specification, unless expressly specified otherwise, the words "first", "second", "third" etc. have been used as adjectives merely for the purpose of allowing the nouns they modify to be distinguished from each other, rather than for the purpose of describing any specific relationship between these nouns.

[0026] The embodiments of the present technology each have at least one of the above-mentioned purposes and / or aspects, but not necessarily all of them. It should be understood that some aspects of the present technology generated by attempting to achieve the above-mentioned purposes may not meet the purposes and / or may meet other purposes not specifically described herein.

[0027] Additional and / or alternative features, aspects, and advantages of implementations of the present techniques will become apparent from the following description, drawings, and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] These and other features, aspects and advantages of the present technology will become better understood with regard to the following description, appended claims and accompanying drawings, in which:

[0029] Figure 1 depicts a perspective view of a data center rack system housing a large number of rack-mounted components with a temperature monitoring system according to an embodiment of the present disclosure;

[0030] Figure 2depicts a perspective view of a rack-mounted assembly with a temperature monitoring system according to an embodiment of the present disclosure;

[0031] Figure 3A depicts a side view of an exemplary temperature monitoring system for rack-mounted components according to an embodiment of the present disclosure;

[0032] Figure 3B depicts a perspective view of an exemplary temperature monitoring system for rack-mounted components according to an embodiment of the present disclosure; and

[0033] Figure 4 Depicted is a functional block diagram of a temperature monitoring system with respect to electrical connections of electronic components carried by a rack-mounted assembly in accordance with an embodiment of the present disclosure.

[0034] It should also be noted that the accompanying drawings are not drawn to scale unless explicitly stated otherwise herein. DETAILED DESCRIPTION

[0035] The examples and conditional language described herein are primarily intended to help the reader understand the principles of the present technology, rather than limiting its scope to such specific examples and conditions described herein. It will be appreciated that those skilled in the art may design various arrangements that, although not explicitly described or shown herein, still embody the principles of the present technology.

[0036] In addition, to facilitate understanding, the following description may describe relatively simplified implementations of the present technology. It will be appreciated by those skilled in the art that various implementations of the present technology may have greater complexity.

[0037] In some cases, examples that are considered helpful for modifications of the present technology may also be set forth. This is done solely to aid understanding, and is not intended to limit the scope of the present technology or set forth its boundaries. These modifications are not an exhaustive list, and those skilled in the art may make other modifications that remain within the scope of the present technology. In addition, if no examples of modifications are set forth, it should not be interpreted that modifications are impossible and / or that what is described is the only way to implement that element of the present technology.

[0038] In addition, all statements describing the principles, aspects, and implementations of the present technology and specific examples thereof are intended to encompass both structural and functional equivalents thereof, whether currently known or developed in the future. Thus, for example, it will be understood by those skilled in the art that any block diagram herein represents a conceptual view of an illustrative system embodying the principles of the present technology.

[0039] With this basic knowledge in mind, we will now consider some non-limiting examples to illustrate various implementations of aspects of the present disclosure.

[0040] Figure 1 A perspective view of a rack system 100 for housing a large number of rack-mounted components 104 with corresponding temperature monitoring systems 200 is shown in accordance with an embodiment of the present disclosure. As shown, the rack system 100 may include a rack frame 102, rack-mounted components 104, liquid cooling inlet ducts 106, and liquid cooling outlet ducts 108. The rack-mounted components 104 may be oriented vertically relative to the rack frame 102 similar to books on a library shelf. This arrangement may provide for mounting a large number of such rack-mounted components 104 in a rack frame 102 relative to conventional arrangements, particularly relative to conventional arrangements of immersion-cooled rack-mounted components.

[0041] In addition, as shown, the rack system 100 may also include: a power distribution unit (PDU) 110 and a liquid coolant inlet / outlet connector 112. It is worth noting that the rack system 100 may include other components, such as a heat exchanger, cables, pumps, or the like, but for the sake of clarity, Figure 1 This component has been omitted. Figure 1 As shown in , the rack frame 102 may include a rack shelf 103 for housing one or more rack-mounted components 104. As noted above, one or more rack-mounted components 104 may be arranged vertically relative to the rack shelf 103. In some embodiments, guide members (not shown) may be used on the rack shelf 103 to guide the rack-mounted components 104 to the proper position during loading and unloading and to provide proper spacing between the rack-mounted components 104 for loading and unloading.

[0042] As in Figure 1 As further shown in FIG. 1 , the rack frame 102 may also include rack columns 105 for supporting rack shelves 103. Mounted on the rack columns 105 are optical transmitters 202 and optical receivers 204, of which only one optical transmitter 202 and one optical receiver 204 are shown for each rack column for clarity. As described more fully below, the optical transmitters 202 and optical receivers 204 are arranged to cooperate with the temperature monitoring system 200 to indicate the location of an overheated rack-mounted component 104.

[0043] Figure 2A perspective view of a rack-mount assembly 104 with a temperature monitoring system 200 is shown in accordance with an embodiment of the present disclosure. As shown, the rack-mount assembly 104 includes a removable frame or "plate" 118 of an electronic device 120 and an immersion housing 116 on which the temperature monitoring system 200 is mounted. Preferably, the temperature monitoring system 200 is mounted on the top front face of the immersion housing 116 (not shown) and at the level of the immersion cooling liquid to account for thermal convection. The plate 118 holds the heat-generating electronic components 122 of the electronic device 120, and the plate 118 can be immersed in the immersion cooling liquid within the immersion housing 116. Although the immersion housing 116, the plate 118, and the electronic components 122 are shown as separate components, it will be understood by those of ordinary skill in the art that in some embodiments, two or more of these components may be combined together. For example, the electronic components 122 may be directly fixed to the plate 118 and / or the immersion housing 116.

[0044] It is contemplated that the electronic devices 120 of the rack-mounted components 104 may generate a significant amount of heat. Therefore, the rack system 100 may utilize a cooling system to cool the electronic devices 120 to prevent the electronic devices 120 from overheating and being damaged. As described more fully below, in the event of a failure of the corresponding cooling system, such as, for example, in the event of a potential overheating event being detected, the temperature monitoring system 200 can disconnect the corresponding electronic device 120 from the power supply to protect the electronic device 120 from malfunctioning due to overheating.

[0045] Figure 3A and Figure 3B An exemplary temperature monitoring system 200 for a rack-mounted assembly 104 according to an embodiment of the present disclosure is shown. As shown, for each electronic device 120, the temperature monitoring system 200 employs a thermostat 210 and a first rod element 211 and a second rod element 212 that are mechanically coupled to the thermostat 210. In a non-limiting example, the thermostat 210 may include a manual reset bimetallic snap-action thermostat or other similarly operated thermostat device.

[0046] Each thermostat unit 210 of the temperature monitoring system 200 is mounted on a corresponding rack-mounted component 104, for example, each thermostat unit 210 of the temperature monitoring system 200 is mounted on the top front face of the immersion housing 116 and is located at the level of the immersion cooling liquid, as previously discussed, and each thermostat unit 210 of the temperature monitoring system 200 is electrically connected to the PDU 110 via the PDU input 208 to receive power from the PDU 110. Figure 3B As shown, the PDU input 208 is electrically connected to the thermostat unit 210 via the electrical connection 222 when in use. More specifically, the temperature monitoring system 200 may include a receiving power inlet 255 to establish the electrical connection 222. In this non-limiting implementation, the receiving power inlet 255 may be a C13 female plug that is used to mate with the PDU input 208 (i.e., a C13 male plug in this implementation). The thermostat unit 210 is also electrically connected to the rack-mounted component 104 via the electrical connection 244, and more specifically, the thermostat unit 210 is also electrically connected to the electronic device 120 via the electrical connection 244. Therefore, the PDU input 208 is electrically connected to the electronic device 120 via the electrical connection 222, the thermostat unit 210, and the electrical connection 244, so that the thermostat unit 210 can selectively disconnect the electronic device 120 from the PDU 110 in response to detecting that the temperature of the rack-mounted component 104 exceeds the high temperature threshold. It can be said that the temperature regulating unit 210 provides thermal safety for the electrical connection between the PDU 110 and the electronic device 120 .

[0047] As mentioned previously and as in Figure 3A and Figure 3B , the first rod element 211 and the second rod element 212 are mechanically coupled to the temperature regulating unit 210. The first rod element 211 is attached to the protective housing 213 of the temperature monitoring system 200, such as, for example, the first rod element 211 is attached to the protective housing 213 of the temperature monitoring system 200 at a pivot point 216, and the first rod element 211 abuts a button portion 215 of the temperature regulating unit 210. The first rod element 211 is also configured to contact and retain the second rod element 212. The second rod element 212 is configured with a rod portion 212a, which includes a hole 214. As described more fully below, under normal operating conditions, the hole 214 allows the optical rack-mounted component positioning beam 206 to travel through the hole 214. The optical rack-mount component locating light beam 206 originates from the optical transmitter 202 and travels to the optical receiver 204 where it is detected.

[0048] Figure 4 1 is a schematic diagram of the electrical connections of the temperature monitoring system 200 according to an embodiment of the present disclosure relative to the electronic devices 120 (e.g., servers) of the rack-mounted components 104 carried in the rack system 100. As shown, each electronic device 120 is electrically connected to the PDU 110 in parallel with one or more other electronic devices 120. Multiple PDUs 110 can be used to distribute power to all of the electronic devices 120 carried in the rack system 100. Figure 4 In this illustrative example, three PDUs 110 receive power from the same or different power supplies and the three PDUs 110 distribute power to a plurality of corresponding electronic devices 120 of the rack-mounted components 104 .

[0049] In turn, each electronic device 120 of the rack-mounted assembly 104 is electrically connected to a corresponding PDU 110 via a thermostat 210. Each thermostat 210 is configured to selectively disconnect the corresponding electronic device 120 from the PDU 110 upon detecting an overheating problem based on the monitored temperature exceeding a specified high temperature threshold.

[0050] As noted above, each thermostat 210 is configured to selectively disconnect the corresponding electronic device 120 from the PDU 110 upon detecting an overheating problem based on the monitored temperature exceeding a specified high temperature threshold. That is, in operation, each thermostat 210 is configured with two metal parts joined together. Both metal parts exhibit different thermal expansion coefficients, and together they form a bimetallic element that bends or breaks depending on how temperature changes affect the thermal coefficients of the respective metal parts. With this configuration, once the thermostat 210 detects a predetermined high temperature limit (e.g., a high temperature threshold of about 50 degrees Celsius to about 80 degrees Celsius), the bent bimetallic element of the thermostat 210 operates to displace an actuator rod (not shown), thereby disconnecting the electrical connection between the terminals of the thermostat 210. In this way, the power supply from the PDU 110 and the corresponding rack-mounted component 104 is interrupted.

[0051] At the same time, the displaced actuator rod also dislocates the button portion 215 of the temperature adjustment unit 210, and the adjacent first rod element 211 rotates around the fixed pivot point 216. The rotation of the first rod element 211 also compresses the spring 218 attached to the protective housing 213 of the temperature monitoring system 200 and the rotation of the first rod element 211 releases the second rod element 212, thereby translating the second rod element 212 downward.

[0052] Under normal operating conditions, the first rod element 211 and the second rod element 212 and the rod portion 212a of the second rod element 212 having the hole 214 are oriented so as to allow the optical rack-mounted component locating beam 206 to pass through the hole 214. However, when the second rod element 212 is released, for example, in the event that the actuator rod of the thermostat unit 210 is displaced, the rod portion 212a of the second rod element 212 blocks the beam 206. When the optical rack-mounted component locating beam 206 strikes the rod portion 212a, the interrupted beam 206 alerts the operator that there is a problem associated with the rack system 100 and indicates the exact location of the rack-mounted component 104 that is disconnected from the PDU 110.

[0053] In some non-limiting embodiments, the optical receiver 204 is connected to a controller (not shown). When the optical rack-mounted component locating beam 206 is detected by the optical receiver 204, the rack system 100 operates normally. However, when the optical rack-mounted component locating beam 206 is interrupted, the optical receiver 204 does not detect any beam. In response to the absence of the beam, the controller can send an alarm signal to an operator device that is communicatively connected to the controller to indicate the occurrence of an abnormality to an operator of the data center.

[0054] In a given rack system (e.g., rack system 100), the temperature regulating unit 210 selectively disconnects the electronic device 120 from the power supply device in the event of a temperature anomaly (e.g., when an overheating event is detected). In the event that the temperature monitoring system 200 detects that the temperature value of the rack-mounted component 104 exceeds the high temperature threshold, the corresponding electronic device 120 is disconnected from the power supply device without affecting the operation of other electronic devices 120 in other rack-mounted components 104 of the rack system 100. For example, by individually disconnecting a given electronic device 120 (e.g., a server) in a data center from the corresponding power supply device, the spread of potential damage caused by overheating in the server can be limited.

[0055] In the disclosed embodiment, even if the rack-mounted component 104 has been sufficiently cooled, that is, the temperature value of the rack-mounted component 104 has dropped below the high temperature threshold, the actuator rod of the thermostat unit 210 will remain displaced, the circuit will remain disconnected, and the spring 218 will continue to be in a compressed state, thereby preventing the electronic device 120 (e.g., a server) from being reconnected to the power supply device without operator intervention. That is, once a particular rack-mounted component 104 is disconnected from the PDU 110, the operator is required to manually reset the thermostat unit 210 and the first rod element 211 and the second rod element 212 to reconnect the rack-mounted component 104 to the PDU 110. For example, the operator can push the second rod element 212 upward. In this way, the second rod element 212 will push the first rod element 211, and the first rod element 211 will compress the spring 218. Therefore, the first rod element 211 and the second rod element 212 will interlock, as shown in FIG. Figure 3A shown.

[0056] It should be understood that the operations and functions of the described data center temperature monitoring system 200, its components, and related processes may be implemented by one or more of hardware-based elements, software-based elements, and firmware-based elements. Such operational alternatives do not limit the scope of the present disclosure in any way.

[0057] It will be further understood that although the embodiments presented herein have been described with reference to specific features and structures, various modifications and combinations may be made without departing from the present disclosure. For example, it is contemplated that in some embodiments, two or more of the temperature monitoring systems described above may be used in any combination. Therefore, the specification and drawings should be regarded only as illustrations of the implementations or embodiments discussed and the principles thereof as defined by the appended claims, and the specification and drawings are intended to cover any and all modifications, variations, combinations or equivalents falling within the scope of the present disclosure.

Claims

1. A data center temperature monitoring system (200) for a rack-mounted component (104), the data center temperature monitoring system (200) comprising: a power distribution unit (PDU) (110) configured to distribute power to each of the rack-mounted components (104); as well as A temperature regulating unit (210) is electrically connected to the PDU (110) and is configured to detect the temperature of one or more of the rack-mounted components (104), wherein, in response to the temperature regulating unit (210) detecting that the temperature of one of the rack-mounted components (104) exceeds a high temperature threshold, the temperature regulating unit (210) disconnects the corresponding rack-mounted component (104) from the PDU (110).

2. The data center temperature monitoring system (200) according to claim 1, wherein: Disconnection of the corresponding rack-mounted component (104) from the PDU (110) is limited to the corresponding rack-mounted component (104) without affecting the power distribution of multiple other rack-mounted components (104).

3. The data center temperature monitoring system (200) according to claim 1, wherein: The temperature regulating unit (210) includes a bimetallic fast-acting temperature regulator (210) mounted on the front of each of the rack-mounted components (104).

4. The data center temperature monitoring system (200) according to claim 3, wherein: The bimetallic snap-action temperature regulator (210) comprises two metal parts having different coefficients of thermal expansion, the two metal parts being joined together to provide a bimetallic element, wherein the bimetallic element is configured to bend due to the different coefficients of thermal expansion based on a detected temperature level.

5. The data center temperature monitoring system (200) according to claim 3, wherein: In response to the bimetallic element bending beyond a displacement threshold due to the detected temperature level, the displacement disconnects the rack-mounted component (104) from the PDU (110).

6. The data center temperature monitoring system (200) according to claim 3, wherein: In response to the bimetallic element bending beyond a displacement threshold due to the detected temperature level, the displacement dislocates the first rod element (211) and the second rod element (212) and the displacement interrupts the optical rack mount component locating light beam (206), thereby indicating the position of the rack mount component (104) disconnected from the PDU (110).

7. The data center temperature monitoring system (200) according to claim 6, wherein: The second rod element (212) includes a rod portion (212a) having a hole (214) that allows the optical rack-mount assembly positioning beam (206) to travel through the hole (214) during normal operation.

8. The data center temperature monitoring system (200) according to claim 1, wherein: The rack-mount assembly (104) requires operator intervention to manually reconnect the PDU (110) after being disconnected.

9. The data center temperature monitoring system (200) according to claim 1, wherein: The high temperature threshold is set at about 50 degrees Celsius to about 80 degrees Celsius.

10. The data center temperature monitoring system (200) according to claim 1, wherein: The rack-mounted components (104) each include an electronic processing board (118) that is at least partially immersed in an immersion housing (116) that contains an immersion cooling liquid for cooling the rack-mounted components (104).

11. A method for monitoring the temperature of a rack-mounted component (104) for a data center, the method comprising: Power is distributed to a plurality of rack-mounted components (104) through a power distribution unit (PDU) (110), a temperature regulating unit (210) is installed on the plurality of rack-mounted components (104), and the temperature regulating unit (210) is configured to detect the temperature of the corresponding rack-mounted components (104); and In response to the thermostat (210) detecting that the temperature of the corresponding rack-mounted component (104) exceeds a high temperature threshold, the thermostat (210) disconnects the corresponding rack-mounted component (104) from the PDU (110).

12. The method according to claim 11, wherein: Disconnection of the corresponding rack-mounted component (104) from the PDU (110) is limited to the corresponding rack-mounted component (104) without affecting the power distribution of multiple other rack-mounted components (104).

13. The method according to claim 11, wherein: Each temperature regulating unit (210) comprises a bimetallic snap-action temperature regulator (210), the bimetallic snap-action temperature regulator (210) comprising two metal parts having different thermal expansion coefficients, the two metal parts being joined together to provide a bimetallic element, wherein the bimetallic element is configured to cause bending due to the different thermal expansion coefficients based on the detected temperature level.

14. The method according to claim 13, wherein: In response to the bimetallic element bending beyond a displacement threshold due to the detected temperature level, the displacement disconnects the rack-mounted component (104) from the PDU (110), and the displacement simultaneously dislocates the first rod element (211) and the second rod element (212) and the displacement interrupts the optical rack-mounted component locating light beam (206), thereby indicating the position of the rack-mounted component (104) disconnected from the PDU (110).

15. The method according to claim 11, wherein: The disconnected rack-mounted components (104) require operator intervention to manually reconnect the PDU (110) after being disconnected.

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