Manifold fluid module

Abstract

The invention relates to a manifold fluid module. A manifold fluid module according to one embodiment of the present invention may comprise: a manifold plate in which a plurality of fluid flow paths are formed and a temperature of a fluid moving through each of the fluid flow paths is different; and a heat transfer suppressor formed between the high-temperature flow path and the low-temperature flow path in order to prevent heat from the flow path through which the high-temperature fluid flows from being transferred to the flow path through which the low-temperature fluid flows.

Description

Technical Field

[0001] The present invention relates to a manifold fluid module, and more particularly, to a manifold fluid module in which components such as a heat exchanger and a valve are modularized into a single component. Background Art

[0002] With the development and research of environmentally friendly technologies and alternative energy sources for replacing fossil raw materials, electric vehicles and hybrid vehicles are considered to be the most attractive areas of the vehicle industry recently. Batteries are installed in electric vehicles and hybrid vehicles to provide driving force. The power of the battery is used not only to drive the vehicle but also to cool or heat the interior of the vehicle.

[0003] When the battery is used as a heat source to cool or heat the interior of a vehicle that provides driving force using the battery, the driving distance is reduced to a certain extent. In order to solve this problem, a method of applying a heat pump system to a vehicle has been proposed, which has been widely used as a home cooling or heating device in the related art.

[0004] For reference, a heat pump refers to a process of absorbing low-temperature heat and transferring the absorbed heat to a high-temperature location. For example, a heat pump implements a cycle in which a liquid fluid becomes a gaseous fluid by evaporating in an evaporator and absorbing heat from the surroundings, and the gaseous fluid becomes a liquid fluid by dissipating heat to the surroundings with the help of a condenser. Applying a thermal management system to an electric or hybrid vehicle can advantageously ensure that the heat source in a general air conditioning device in the related art is insufficient.

[0005] In the modular configuration of current heat pump systems for electric vehicles, important components (valves, reservoirs, coolers, condensers, internal heat exchangers, sensors, etc.) are connected in a partially modular manner through pipes. In order to connect the pipes, fittings and connectors need to be configured separately and define appropriate intervals to connect the components. For this reason, there are disadvantages in terms of packaging, cost and processability.

[0006] In order to cope with these disadvantages, a technology of modularizing the manifold is being developed. However, there is a problem in that performance may be degraded due to thermal interference between high temperature fluid and low temperature fluid during the modularization process. Summary of the invention

[0007] Technical issues

[0008] An object of one embodiment of the present invention is to provide a manifold fluid module capable of dividing a region of a fluid into a high temperature region and a low temperature region, thereby minimizing thermal interference between refrigerants and improving heat pump performance.

[0009] Technical Solution

[0010] One embodiment of the present invention provides a manifold fluid module, which includes: a manifold plate having multiple fluid flow paths, and fluids with different temperatures move through the multiple fluid flow paths; and a heat transfer suppression member, which is arranged between a high-temperature fluid flow path and a low-temperature fluid flow path to block heat transfer from a flow path through which the high-temperature fluid moves to a flow path through which the low-temperature fluid moves, wherein the high-temperature fluid flow path and the low-temperature fluid flow path are connected by a connecting portion.

[0011] The connection portion may connect portions of the manifold plate separated by the heat transfer suppressor, and the fluid may move toward the connection portion.

[0012] In a thermal management system including a compressor, a plurality of heat exchangers, a plurality of valves, and an expansion valve, at least one heat exchanger, at least one valve, and the expansion valve may be coupled to the manifold plate.

[0013] The fluid may move toward the connection in a heating mode of the thermal management system, and the fluid may not move toward the connection in a cooling mode.

[0014] The manifold fluid module may also include: a first heat exchanger, which is connected to the manifold plate and is configured to allow the first fluid and the second fluid to exchange heat with each other; and a second heat exchanger, which is connected to the manifold plate and is configured to allow the first fluid discharged from the first heat exchanger to exchange heat with the second fluid.

[0015] The manifold plate may include a main plate having the plurality of fluid flow paths therein, and a bottom plate coupled to one surface of the main plate and configured to cover the fluid flow paths.

[0016] The main board may include: a first main board, along which a high-temperature first fluid passing through the first heat exchanger moves; and a second main board, along which a low-temperature first fluid passing through the second heat exchanger moves, and wherein the heat transfer inhibitor may be formed between the first main board and the second main board.

[0017] The base plate may include: a first base plate, the first base plate is connected to cover at least one surface of the first main board; and a second base plate, the second base plate is connected to cover at least one surface of the second main board, and wherein the heat transfer suppression member may be formed between the first base plate and the second base plate.

[0018] One side of the first bottom plate and one side of the second bottom plate may be communicated with each other through the connection portion.

[0019] The connection portion may have a tubular shape.

[0020] The fluid may move toward the connection in a heating mode, and the fluid may not move toward the connection in a cooling mode.

[0021] The manifold fluid module may also include: a first expansion valve, which is configured to expand the first fluid introduced into the first heat exchanger; and a second expansion valve, which is configured to expand the first fluid introduced into the second heat exchanger, wherein the first expansion valve is arranged above the first heat exchanger and the second expansion valve is arranged above the second heat exchanger, so that the first fluid introduced into the first heat exchanger and the second heat exchanger moves from top to bottom.

[0022] The manifold fluid module may also include: a first reversing valve and a second reversing valve, wherein the first reversing valve and the second reversing valve are configured to control the direction of the first fluid discharged from the first heat exchanger, wherein the first reversing valve is arranged below the second heat exchanger and the second reversing valve is arranged above the second heat exchanger.

[0023] The second main board may have a reservoir port through which the first fluid is discharged to a reservoir, and the connection portion may be provided to allow the second switching valve and the reservoir port to communicate with each other.

[0024] The connection portion may be disposed between the second switching valve and the second heat exchanger.

[0025] The manifold plate may have an opening portion formed in a portion where the second heat exchanger is arranged, and the heat transfer suppressor may include a first heat transfer suppressor and a second heat transfer suppressor formed above and below the opening portion, respectively.

[0026] The manifold plate may have an opening portion, which is formed in a portion where the second heat exchanger is arranged, and the heat transfer inhibitor may include a first heat transfer inhibitor and a second heat transfer inhibitor formed above and below the opening portion, respectively, the first heat transfer inhibitor may be formed to cut off a portion between the second expansion valve and the first reversing valve, and the second heat transfer inhibitor may be formed to cut off a portion between the second heat exchanger and the first reversing valve.

[0027] Beneficial effects

[0028] The manifold fluid module according to the embodiment of the present invention adopts a structure capable of blocking heat conduction between a high-temperature fluid and a low-temperature fluid, thereby improving heat pump performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a diagram showing a front surface of a manifold fluid module according to an embodiment of the present invention.

[0030] Figure 2 is a diagram showing a rear surface of a main board of a manifold fluid module according to an embodiment of the present invention.

[0031] Figure 3 is a diagram illustrating a state in which refrigerant is discharged from a manifold fluid module according to an embodiment of the present invention to an accumulator port.

[0032] Figure 4 The bottom plate is shown connected to Figure 2 The diagram shows the status of the main board.

[0033] Figure 5 is a graph showing the amount of heat transfer before a cutout structure is applied to a manifold fluid module according to an embodiment of the present invention.

[0034] Figure 6 is a graph showing the amount of heat transfer after a cutout structure is applied to a manifold fluid module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The present invention may be modified in various ways and may have various embodiments, and the specific embodiments shown in the accompanying drawings will be described in detail below. However, the description of the exemplary embodiments is not intended to limit the present invention to specific exemplary embodiments, but it should be understood that the present invention will cover all modifications, equivalents and alternatives that fall within the spirit and technical scope of the present invention. In the description of the present invention, when it is determined that the specific description of the known related art may obscure the subject matter of the present invention, the specific description will be omitted.

[0036] Terms such as "first" and "second" may be used to describe various constituent elements, but the constituent elements should not be limited by these terms. These terms are only used to distinguish one constituent element from another constituent element.

[0037] The terms used herein are only used to describe specific example embodiments and are not intended to be limiting. Singular expressions include plural expressions unless explicitly described as different meanings in the context. In this application, the terms "comprises," "includes," "contains," "has," "has" or other variations thereof are inclusive, thereby specifying the presence of the features, integers, steps, operations, elements, parts and / or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or combinations thereof.

[0038] In addition, throughout the specification, when a constituent element is referred to as being “connected to” another constituent element, one constituent element may be “directly connected to” another constituent element, and one constituent element may also be “indirectly connected to”, “physically connected to”, or “electrically connected to” another element with other elements present therebetween. Furthermore, constituent elements are defined as different names depending on their positions or functions, but the constituent elements may be integrated.

[0039] Hereinafter, embodiments of a manifold fluid module according to the present invention will be described in detail with reference to the accompanying drawings. In the description of exemplary embodiments with reference to the accompanying drawings, the same or corresponding constituent elements are given the same reference numerals, and repeated description thereof will be omitted.

[0040] Figure 1 is a diagram showing the front surface of a manifold fluid module according to an embodiment of the present invention, Figure 2 is a diagram showing the rear surface of a main board of a manifold fluid module according to an embodiment of the present invention, Figure 3 is a diagram showing a state in which refrigerant is discharged from a manifold fluid module according to an embodiment of the present invention to a accumulator port, and Figure 4 The bottom plate is shown connected to Figure 2 The diagram shows the status of the main board.

[0041] As shown in the figure, the manifold fluid module according to the embodiment of the present invention may include: a manifold plate 1 or 100, in which a plurality of fluid flow paths for fluids having different temperatures to flow through; and heat transfer inhibitors 90 and 92, which are arranged between the high-temperature side flow path and the low-temperature side flow path and are configured to block heat transfer from the flow path through which the high-temperature fluid flows to the flow path through which the low-temperature fluid flows. The high-temperature side flow path and the low-temperature side flow path may be connected by a connection portion 130.

[0042] The manifold plate 1 or 100 includes an assembly consisting of a main plate 1 and a bottom plate 100. The manifold plate may be manufactured by coupling the assembly using brazing, a structural bonding agent (structural adhesive), a gasket, etc. In addition, various materials such as aluminum, thermoplastics, or stainless steel may be applied as the material of the manifold plate 1 or 100 according to a manufacturing method, use, and function.

[0043] The main board 1 has a plate shape in which a fluid flow path is generally recessed inward, and the main board 1 has a predetermined thickness. As described above, the first heat exchanger 20 and the second heat exchanger 60, the expansion valves 30 and 70, and the reversing valves 40 and 50 as heat exchange devices of the heat pump system are connected to the main board 1 and modularized, so that the number of processes for manufacturing products can be reduced, and the number of processes for the vehicle assembly line can be reduced. In addition, because the main board 1 plays the role of a pipe, a fitting, and a housing at the same time, the cost can be reduced, and the workability can be improved. That is, in a thermal management system including a compressor, a plurality of heat exchangers, a plurality of valves, and an expansion valve, one or more heat exchangers 20 and 60, one or more reversing valves 40 and 50, and one or more expansion valves 30 and 70 can be connected to the manifold plate 1 or 100.

[0044] Reference Figure 2 , a fluid inlet port 6 is provided on the rear surface of the main board 1, and a high-temperature, high-pressure gas-phase fluid discharged from a compressor or an internal condenser is introduced into the fluid inlet port 6. In addition, a fluid flow path may be formed in the rear surface of the main board 1, and guide the flow of the fluid that undergoes heat exchange, expansion, introduction, and discharge.

[0045] In addition, various types of fluid ports may be provided on the rear surface of the main board 1 to introduce and discharge fluids. In the present embodiment, an external heat exchanger discharge port 8 through which the first fluid is discharged to an external heat exchanger (air-cooled condenser) and an external heat exchanger inlet port 10 through which the first fluid is introduced from the external heat exchanger are provided. In addition, an evaporator discharge port 12 through which the first fluid is discharged to an evaporator (not shown) and an evaporator inlet port 14 through which the first fluid is introduced from the evaporator are provided. The layout of the evaporator inlet port 14 will be described in more detail below. In addition, a reservoir port 18 through which the first fluid is discharged from the second heat exchanger 60 to a reservoir (not shown) is provided.

[0046] Refer to Figure 1 , the first heat exchanger 20 and the second heat exchanger 60 as heat exchanging means are coupled to the manifold plate 1 or 100. The first fluid and the second fluid may exchange heat with each other while passing through the first heat exchanger 20 and the second heat exchanger 60.

[0047] In the present embodiment, a water-cooled condenser may be used as the first heat exchanger 20, and a cooler may be used as the second heat exchanger 60. The water-cooled condenser is used to condense a high-temperature, high-pressure gas-phase fluid (refrigerant) discharged from a compressor or an internal condenser into a high-pressure liquid by allowing the gas-phase fluid to exchange heat with an external heat source. A cooler refers to a device configured to be supplied with a low-temperature, low-pressure fluid and to exchange heat with a fluid (coolant) flowing along a coolant circulation line (not shown). The coolant that has exchanged heat with the cooler can circulate through the coolant circulation line and exchange heat with the battery.

[0048] Meanwhile, refrigerant, coolant, etc. may be applied as the first fluid and the second fluid. In the present embodiment, refrigerant is applied as the first fluid, and coolant is applied as the second fluid.

[0049] The first heat exchanger 20 has a first fluid port through which the first fluid is introduced and discharged. The first fluid port includes a first inlet port 21 and a first discharge port 22 respectively provided at the upper end and the lower end of the first heat exchanger 20. The first inlet port 21 refers to a portion through which the first fluid that has passed through the first expansion valve 30 is introduced, and the first discharge port 22 refers to a portion through which the first fluid that has exchanged heat with the first heat exchanger 20 is discharged. The first inlet port 21 and the first discharge port 22 may be formed in a hole shape at the upper end and the lower end of the first heat exchanger 20, respectively.

[0050] In this case, in consideration of thermal interference, the first inlet port 21 may be formed at one side close to the first expansion valve 30, and the first discharge port 22 may be formed at the other side away from the first expansion valve 30. More specifically, the first inlet port 21 may be arranged closer to the first expansion valve 30 than the first discharge port 22 is to the first expansion valve 30. For example, the distance from the first expansion valve 30 to the first inlet port 21 may be shorter than the distance from the first expansion valve 30 to the first discharge port 22.

[0051] In addition, the first heat exchanger 20 has a second fluid port through which the second fluid is introduced and discharged. The second fluid port includes a second inlet port 23 and a second discharge port 24 respectively provided at the lower end and the upper end of the first heat exchanger 20. The second inlet port 23 refers to a portion through which the second fluid is introduced, and the second discharge port 24 refers to a portion through which the second fluid that has exchanged heat with the first fluid is discharged. The second fluid exchanges heat with the first fluid while flowing in a direction opposite to the direction in which the first fluid flows (from bottom to top).

[0052] Since the first fluid port and the second fluid port are arranged to be spaced apart from each other, the assemblability of the first fluid pipe and the second fluid pipe can be improved.

[0053] The first expansion valve 30 is used to control whether to expand the refrigerant to be introduced into the first heat exchanger 20. The first expansion valve 30 may be arranged above the first heat exchanger 20, and expand the first fluid introduced through the fluid inlet port 6, or allow the first fluid to pass therethrough. The first fluid introduced through the first expansion valve 30 may perform heat exchange while passing through the first heat exchanger 20 or flow to an external heat exchanger.

[0054] The first fluid discharged through the first discharge end 22 of the first heat exchanger 20 is introduced into the first reversing valve 40. The first reversing valve 40 is used to control the direction of the first fluid discharged from the first heat exchanger 20. In the cooling mode, the first reversing valve 40 discharges the first fluid to the external heat exchanger (air-cooled condenser) through the external heat exchanger discharge port 8. In the heat pump mode, the first reversing valve 40 changes the direction of the first fluid toward the reservoir port 18 and discharges the first fluid to the reservoir. The first fluid is introduced into the low-temperature fluid flow path 84 through the first fluid inlet port 42 formed on the manifold plate 1 or 100.

[0055] In addition, the first fluid introduced into the first expansion valve 30 may move toward the second switching valve 50 and then move toward the evaporator in the dehumidification mode.

[0056] The low temperature, low pressure fluid is supplied to the second heat exchanger 60 and exchanges heat with the coolant moving through the coolant circulation line (not shown). The coolant that has exchanged heat with the second heat exchanger 60 may circulate through the coolant circulation line and exchange heat with the battery. The first fluid that has exchanged heat with the external heat exchanger is introduced into the second expansion valve 70, and the first fluid expanded by the second expansion valve 70 is introduced into the second heat exchanger 60. The first fluid that has exchanged heat with the second heat exchanger 60 is discharged through the lower end and introduced into the reservoir (not shown).

[0057] To this end, the second heat exchanger 60 has a first fluid port through which the first fluid is introduced and discharged. The first fluid port includes a first inlet port 61 and a first discharge port 62 respectively provided at the upper end and the lower end of the second heat exchanger 60. The first inlet port 61 refers to a portion through which the first fluid is introduced, and the first discharge port 62 refers to a portion through which the first fluid that has exchanged heat with the second heat exchanger 60 is discharged. The first inlet port 61 and the first discharge port 62 may be formed as a hole shape at the upper end and the lower end of the second heat exchanger 60, respectively.

[0058] In this case, considering thermal interference, the first inlet end 61 of the second heat exchanger 60 may be formed at one side close to the second expansion valve 70, and the first discharge end 62 may be formed at the other side away from the second expansion valve 70. More specifically, the first inlet end 61 may be arranged closer to the second expansion valve 70 than the first discharge end 62 is to the second expansion valve 70. For example, the distance from the second expansion valve 70 to the first inlet end 61 may be shorter than the distance from the second expansion valve 70 to the first discharge end 62.

[0059] In addition, the second heat exchanger 60 has a second fluid port through which the second fluid is introduced and discharged. The second fluid port includes a second inlet port 63 and a second discharge port 64 respectively provided at the lower end and the upper end of the second heat exchanger 60. The second inlet port 63 refers to a portion through which the second fluid is introduced, and the second discharge port 64 refers to a portion through which the second fluid that has exchanged heat with the first fluid is discharged. The second fluid exchanges heat with the first fluid while flowing in a direction opposite to the direction in which the first fluid flows (from bottom to top).

[0060] Refer to Figure 1 In the present embodiment, the first expansion valve 30, the second reversing valve 50, and the second expansion valve 70 may be arranged on the upper portion of the manifold plate 1 or 100, the first heat exchanger 20 may be arranged at one side of the lower portion of the manifold plate 1 or 100, and the second heat exchanger 60 and the first reversing valve 40 may be arranged at the other side of the lower portion of the manifold plate 1 or 100. In this case, the first reversing valve 40 may be arranged below the second heat exchanger 60, and the second reversing valve 50 may be arranged above the second heat exchanger 60.

[0061] When the above components are arranged on the manifold plate 1 or 100, since the components can be optimally arranged in the smallest space, the space efficiency can be maximized, and since the flow of the fluid is formed from top to bottom as a whole, the flow of the fluid can be optimized.

[0062] In particular, the first heat exchanger 20 is arranged in a vertical direction at one side of the lower portion of the manifold plate 1 or 100, and the second heat exchanger 60 is arranged in a horizontal direction at the other side of the lower portion of the manifold plate 1 or 100, so that the fluid module packaging can be optimized. That is, the second heat exchanger 60 can be arranged in a lateral direction of the first heat exchanger 20, thereby improving space efficiency. In addition, the first expansion valve 30 is arranged above the first heat exchanger 20, and the second expansion valve 70 is arranged above the second heat exchanger 60, so that the flow of the first fluid can be naturally formed from top to bottom.

[0063] An imaginary reference line L is formed on the manifold plate 1 or 100. Based on the imaginary reference line L, the first heat exchanger 20, the first expansion valve 30, the first switching valve 40 and the second switching valve 50 may be arranged at one side, and the second heat exchanger 60 and the second expansion valve 70 may be arranged at the other side.

[0064] More specifically, in the cooling mode, a high temperature region in which a high temperature first fluid flows and a low temperature region in which a low temperature first fluid flows are separated based on an imaginary reference line L. A high temperature fluid flow path 82 through which the high temperature first fluid moves is formed in the high temperature region, and a low temperature fluid flow path 84 through which the low temperature first fluid moves is formed in the low temperature region. In addition, a component element for moving the high temperature first fluid may be arranged in the high temperature region, and a component element for moving the low temperature first fluid may be arranged in the low temperature region. Therefore, thermal interference between the high temperature first fluid and the low temperature first fluid may be minimized, and the performance of the heat pump system may be improved. In the figure, the high temperature region may include a left side portion and a lower end portion, and the low temperature region may include a right side portion excluding the lower right end.

[0065] Reference Figures 2 to 4 , the main board 1 may include: a first main board 2 along which the high-temperature first fluid passing through the first heat exchanger 20 moves; and a second main board 4 along which the low-temperature first fluid passing through the second heat exchanger 60 moves. In this case, a portion between the first main board 2 and the second main board 4 is cut off so that the first main board 2 and the second main board 4 can be physically separated from each other.

[0066] As described above, when the first main board 2 and the second main board 4 are separated by means of the cutout structure, the direct heat transfer route between the high temperature area and the low temperature area is blocked, which can improve the heat pump performance.

[0067] The cutout structure between the first main board 2 and the second main board 4 can be implemented in various ways. Referring to the present drawing, heat transfer suppressing members 90 and 92 are provided between the first main board 2 and the second main board 4. The heat transfer suppressing members 90 and 92 can be provided at two portions to effectively block heat transfer between the high temperature area and the low temperature area.

[0068] The portion of the manifold plate 1 or 100 where the second heat exchanger 60 is arranged may have an opening portion 80 that is open forward and backward in most areas. The opening portion 80 refers to a portion formed to prevent interference between the second inlet end 63 and the second discharge end 64 of the second heat exchanger 60. The opening portion 80 refers to a portion formed to allow the high temperature area and the low temperature area of ​​the manifold plate 1 or 100 to be spaced apart from each other to the greatest extent.

[0069] The heat transfer suppressors 90 and 92 may be formed above and below the opening portion 80, respectively. The first heat transfer suppressor 90 may be formed above the opening portion 80 in a substantially vertical direction, and the second heat transfer suppressor 92 may be formed at one side of the lower portion of the opening portion 80 in a substantially horizontal direction. Of course, the positions of the heat transfer suppressors 90 and 92 are not limited to the positions shown in the present drawing. The positions of the heat transfer suppressors 90 and 92 may be any positions as long as the heat transfer suppressors 90 and 92 can separate the high temperature area and the low temperature area.

[0070] That is, because the heat transfer suppressors 90 and 92 are respectively formed above and below the opening portion 80 formed in the central portion of the manifold plate 1 or 100 , the high temperature area at the left side and the low temperature area at the right side can be separated from each other.

[0071] Meanwhile, the heat transfer suppressing members 90 and 92 may be formed at positions relative to the components arranged on the manifold plate 1 or 100. The first heat transfer suppressing member 90 may be formed to cut off a portion between the second expansion valve 70 and the second reversing valve 50, and the second heat transfer suppressing member 92 may be formed to cut off a portion between the second heat exchanger 60 and the first reversing valve 40. This is to block the heat transfer route by allowing the heat transfer suppressing members 90 and 92 to cut off a portion between a configuration in which the high-temperature first fluid moves and a configuration in which the low-temperature first fluid moves.

[0072] In addition, in order to minimize the heat transfer route between the high temperature area and the low temperature area, the evaporator inlet port 14 can be arranged as follows. The evaporator inlet port 14 is arranged in the low temperature fluid flow path 84, and the low temperature first fluid introduced through the evaporator inlet port 14 moves downward and is discharged to the outside through the reservoir port 18. In this case, as the section in which the first fluid moves is extended, the low temperature first fluid can receive heat from the high temperature first fluid. Therefore, in the present embodiment, the evaporator inlet port 14 is arranged to be as close to the reservoir port 18 as possible, so that the section in which the low temperature first fluid moves is minimized.

[0073] The low-temperature fluid flow path 84 may be connected to a plurality of fluid inlet ports, and the fluid inlet ports may include the first fluid inlet port 42, the first discharge end 62 of the second heat exchanger 60, and the evaporator inlet port 14. Among the fluid inlet ports, the evaporator inlet port 14 is connected to the discharge port of the evaporator so that the first fluid that has exchanged heat with the evaporator is introduced into the evaporator inlet port 14.

[0074] The evaporator inlet port 14 may be substantially arranged on the second main plate 4 along which the low-temperature first fluid moves. The evaporator inlet port 14 may be arranged adjacent to the first inlet end 61 of the second heat exchanger 60. More specifically, the evaporator inlet port 14 may be arranged between the first inlet end 61 and the first discharge end 62 of the second heat exchanger 60. That is, because the evaporator inlet port 14 is arranged adjacent to the second heat exchanger 60 that exchanges heat with the low-temperature first fluid, the degree to which the first fluid introduced into the evaporator inlet port 14 receives heat may be minimized.

[0075] The distance D1 between the evaporator inlet port 14 and the reservoir port 18 may be equal to or less than the distance D2 between the first discharge end 62 of the second heat exchanger 60 and the reservoir port 18. This is to minimize heat transfer from the first fluid discharged from the second heat exchanger 60 to the first fluid introduced into the evaporator inlet port 14.

[0076] Reference Figure 4 , the bottom plate 100 is coupled to one surface (i.e., the rear surface) of the main board 1 and covers the fluid flow path. The bottom plate 100 may include a first bottom plate 110 coupled to cover at least one surface of the first main board 2 and a second bottom plate 120 coupled to cover at least one surface of the second main board 4. As clearly shown in the figure, the first bottom plate 110 and the second bottom plate 120 may be coupled to cover most of the area of ​​one surface of each of the first main board 2 and the second main board 4.

[0077] In this case, one side of the first bottom plate 110 and one side of the second bottom plate 120 may be connected to each other through the connection portion 130. Since the main board 1 is divided by the heat transfer suppressing members 90 and 92, the bottom plate 100 coupled to the main board 1 may also be divided. In this case, in the heat pump mode, the route through which the first fluid moves from the first reversing valve 40 to the reservoir port 18 is blocked. Therefore, in the present embodiment, the first bottom plate 110 and the second bottom plate 120 are connected to each other through the connection portion 130 to ensure the flow path of the first fluid.

[0078] The connection portion 130 allows the first fluid to flow in the heating mode of the thermal management system, i.e., when the fluid temperature difference between the high temperature flow path and the low temperature flow path is small. In the cooling mode, i.e., when the fluid temperature difference between the high temperature flow path and the low temperature flow path is large, the first fluid does not flow.

[0079] As shown in this figure, the connection part 130 is formed in a tubular shape so that a flow path of the first fluid can be ensured in the connection part 130. In addition, one side of the first bottom plate 110 and one side of the second bottom plate 120 are connected in a plate shape, and a flow path can be formed in the connection part 130.

[0080] The connection portion 130 functions as a flow path as described above, and also serves to improve the durability of the manifold plate 1 or 100. More specifically, in the present embodiment, since the manifold plate 1 or 100 is divided into two parts, the coupling structure is maintained only by the part coupled to the manifold plate 1 or 100. In this case, the manifold plate 1 or 100 may be susceptible to external impact and not be rigid. Therefore, the connection portion 130 may connect the two separated parts of the manifold plate 1 or 100, thereby more firmly maintaining the coupling structure.

[0081] As described above, the configuration in which the manifold plate 1 or 100 is configured by coupling the main plate 1 and the bottom plate 100 and the connection portion 130 is provided on the bottom plate 100 has been described. However, the present invention is not limited thereto. For example, the connection portion 130 may be provided on the main plate 1. Alternatively, the manifold plate 1 or 100 may be provided as a single plate, and the connection portion 130 may be provided on the manifold plate 1 or 100.

[0082] Figure 5 is a graph showing the amount of heat transfer before the cutout structure is applied to the manifold fluid module according to the embodiment of the present invention, and Figure 6 is a graph showing the amount of heat transfer after a cutout structure is applied to a manifold fluid module according to an embodiment of the present invention.

[0083] Reference Figure 5 and Figure 6 Before the cutout structure is applied to the manifold fluid module, the portion of the manifold plate 1 or 100 through which the low-temperature first fluid moves has a relatively high temperature.

[0084] In contrast, it can be determined that after the cutout structure is applied to the manifold fluid module, the portion of the manifold plate 1 or 100 through which the low-temperature first fluid moves has a relatively low temperature. This is because the cutout structure blocks heat transfer from the high-temperature first fluid to the low-temperature first fluid. In addition, heat transfer can be minimized by maximally shortening the section through which the low-temperature first fluid introduced into the evaporator inlet port 14 moves.

[0085] Although the present invention has been described above with reference to specific embodiments, it will be appreciated by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the invention disclosed in the claims.

[0086] [Explanation of Reference Numerals]

[0087] 1: Main board, 2: First main board

[0088] 4: First main board, 6: Fluid inlet port

[0089] 8: External heat exchanger discharge port, 10: External heat exchanger inlet port

[0090] 12: Evaporator discharge port, 14: Evaporator inlet port

[0091] 18: Liquid reservoir port, 20: First heat exchanger

[0092] 21: First inlet port, 22: First discharge port

[0093] 23: Second inlet port, 24: Second discharge port

[0094] 30: First expansion valve, 40: First reversing valve

[0095] 50: second reversing valve, 60: second heat exchanger

[0096] 61: first inlet end, 62: first discharge end

[0097] 63: Second inlet port, 64: Second discharge port

[0098] 70: second expansion valve, 80: opening portion

[0099] 82: High temperature fluid flow path, 84: Low temperature fluid flow path

[0100] 90: first heat transfer suppressing member, 92: second heat transfer suppressing member

[0101] 100: bottom plate, 110: first bottom plate

[0102] 120: second bottom plate, 130: connection part

Claims

1. A manifold fluid module, comprising: a manifold plate having a plurality of fluid flow paths therein through which fluids having different temperatures move; as well as a heat transfer inhibiting member disposed between a high-temperature fluid flow path and a low-temperature fluid flow path to block heat transfer from the flow path through which the high-temperature fluid moves to the flow path through which the low-temperature fluid moves, Wherein, the high-temperature fluid flow path and the low-temperature fluid flow path are connected through a connecting portion.

2. The manifold fluid module according to claim 1, wherein: The connection portion connects portions of the manifold plate separated by the heat transfer suppressing member, and the fluid moves toward the connection portion.

3. The manifold fluid module of claim 1, wherein: In a thermal management system including a compressor, a plurality of heat exchangers, a plurality of valves, and an expansion valve, at least one heat exchanger, at least one valve, and the expansion valve are coupled to the manifold plate.

4. The manifold fluid module according to claim 3, wherein: The fluid moves toward the connection in a heating mode of the thermal management system, and the fluid does not move toward the connection in a cooling mode.

5. The manifold fluid module of claim 1 , further comprising: a first heat exchanger coupled to the manifold plate and configured to allow a first fluid and a second fluid to exchange heat with each other; as well as A second heat exchanger is coupled to the manifold plate and is configured to allow the first fluid discharged from the first heat exchanger to exchange heat with the second fluid.

6. The manifold fluid module of claim 5, wherein: The manifold plate comprises: a main plate having the plurality of fluid flow paths therein; and A bottom plate is coupled to one surface of the main plate and is configured to cover the fluid flow path.

7. The manifold fluid module of claim 6, wherein: The main board comprises: a first main plate along which the high-temperature first fluid passing through the first heat exchanger moves; and a second main plate, along which the low-temperature first fluid passing through the second heat exchanger moves, and The heat transfer suppressing member is formed between the first main board and the second main board.

8. The manifold fluid module of claim 7, wherein: The bottom plate comprises: a first bottom plate coupled to cover at least one surface of the first main board; and a second bottom plate, the second bottom plate being coupled to cover at least one surface of the second main board, and The heat transfer suppressing member is formed between the first bottom plate and the second bottom plate.

9. The manifold fluid module of claim 8, wherein: One side of the first bottom plate and one side of the second bottom plate are communicated with each other through the connection portion.

10. The manifold fluid module of claim 9, wherein: The connecting portion has a tubular shape.

11. The manifold fluid module of claim 9, wherein: The fluid moves toward the connection in a heating mode, and the fluid does not move toward the connection in a cooling mode.

12. The manifold fluid module of claim 9, further comprising: a first expansion valve configured to expand the first fluid introduced into the first heat exchanger; as well as a second expansion valve configured to expand the first fluid introduced into the second heat exchanger, The first expansion valve is arranged above the first heat exchanger, and the second expansion valve is arranged above the second heat exchanger, so that the first fluid introduced into the first heat exchanger and the second heat exchanger moves from top to bottom.

13. The manifold fluid module of claim 12, further comprising: a first reversing valve and a second reversing valve, the first reversing valve and the second reversing valve being configured to control a direction of the first fluid discharged from the first heat exchanger, The first reversing valve is arranged below the second heat exchanger, and the second reversing valve is arranged above the second heat exchanger.

14. The manifold fluid module of claim 13, wherein: The second main plate has a reservoir port through which the first fluid is discharged to a reservoir, and the connection portion is provided to allow the second switching valve and the reservoir port to communicate with each other.

15. The manifold fluid module of claim 13, wherein: The connecting portion is arranged between the second reversing valve and the second heat exchanger.

16. A manifold fluid module according to any one of claims 5 to 15, wherein: The manifold plate has an opening portion formed in a portion where the second heat exchanger is arranged, and the heat transfer suppressing member includes a first heat transfer suppressing member and a second heat transfer suppressing member formed above and below the opening portion, respectively.

17. The manifold fluid module of claim 13, wherein: The manifold plate has an opening portion, which is formed in a portion where the second heat exchanger is arranged, and the heat transfer inhibitor includes a first heat transfer inhibitor and a second heat transfer inhibitor respectively formed above and below the opening portion, the first heat transfer inhibitor is formed to cut off a portion between the second expansion valve and the first reversing valve, and the second heat transfer inhibitor is formed to cut off a portion between the second heat exchanger and the first reversing valve.

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