Module for a delivery system and related method

Abstract

A system includes a chemical supply cabinet (e.g., e.g., a chemical supply cabinet configured to contain an ampoule); a module configured to modify the surface; and a control unit connected to the module, where the control unit is configured to direct the modification of the surface.

Description

Technical Field

[0001] The present disclosure relates generally to delivery systems.

[0002] Related Literature

[0003] This disclosure claims priority from U.S. Provisional Patent Application No. 63 / 356,256, filed on June 28, 2022, which is incorporated herein by reference. Background Art

[0004] Delivery systems designed to transport solid precursor materials can be used in the manufacturing process. Such systems can include ampoules configured to contain solid precursor materials. Summary of the invention

[0005] Delivery systems designed to carry vapors from solid or liquid precursor materials can be used in the manufacturing process. Delivery systems can be placed in enclosures or cabinets to isolate different potential hazards from each other and from the occupied manufacturing area. Some examples include separating potential leaks of toxic or flammable vapors from ignition sources or human interaction. Delivery systems can also be located in different parts of a factory, such as sub-manufacturing areas of a semiconductor manufacturing plant. Such delivery systems can include ampoules configured to hold solid precursor materials.

[0006] In addition to being potentially toxic or flammable, steam can also be corrosive. Where steam is corrosive or reacts with piping or "wet" surfaces from the cabinet to the point of use, surface treatments and coatings can be used to inhibit or eliminate the corrosion or reaction. Currently available surface treatments and coatings require time-intensive and sometimes harmful processes to effectively coat or treat all wet surfaces from and including the delivery system, piping from one area of ​​the plant to another, and all required surfaces at the point of steam use. In addition, installing and removing surface treatment systems introduces contamination and sometimes leaves small areas of wet surfaces untreated.

[0007] Steam delivered from chemical supply cabinets can be corrosive. In some instances, when tool or line maintenance is performed, the lines are exposed to manufacturing air. Despite fully pumping clean lines at high temperatures, there are still reaction byproducts (e.g., FeCl 3 or CrCl 3 ). Reaction byproducts can promote corrosion during exposure to manufacturing air or after subsequent high temperature cycling.

[0008] Some embodiments of the delivery system include a chemical supply cabinet (e.g., a chemical supply cabinet configured to contain ampoules (e.g., ampoules containing vapor source materials)) and a module configured to modify a surface. In some embodiments, a control unit may be connected to the module, and the control unit is configured to direct the modification of the surface.

[0009] In some examples, the coating may be applied to the sections prior to installation, thereby significantly reducing corrosion. However, some lines are extremely long and are welded in situ from the manufacturing process or installation. Other parts of the delivery system (e.g., lines and manifolds) may have uncoated connections.

[0010] One solution is to coat portions of the manufacturing system after the manufacturing system is fully installed. Wetted components may be heated, including lines and / or valves from the chemical supply cabinet to the tool, lines and / or valves in the cabinet, and / or lines and / or valves in the tool. Coating may be performed after the original installation of the manufacturing system. Recoating may be performed after specific maintenance events, after a predetermined amount of time, and / or after specific events (e.g., corrosion is detected on the surfaces of the manufacturing system including the delivery system or the tool). Other surface treatment options may also be incorporated into the cabinet, such as steam (e.g., fluorine (F 2 ) or nitrogen (N 2 ))'s surface deposition.

[0011] At least some of these embodiments of the delivery system are used in atomic layer deposition (ALD), chemical vapor deposition (CVD), or both processes. The solid precursor material can be used in the manufacture of microelectronic devices. In some embodiments, the solid precursor material is various organic precursors, inorganic precursors, metal organic precursors, or combinations thereof.

[0012] In some aspects, the technology described herein relates to a system comprising: a chemical supply cabinet; a module configured to modify a surface; and a control unit connected to the module, wherein the control unit is configured to direct the modification of the surface.

[0013] In some aspects, the techniques described herein relate to a system, wherein the system is configured to connect to a semiconductor processing tool.

[0014] In some aspects, the technology described herein relates to a system wherein the surface comprises an interior surface of the semiconductor processing tool.

[0015] In some aspects, the technology described herein relates to a system wherein the module is configured to modify the surface by altering the composition of the surface.

[0016] In some aspects, the technology described herein relates to a system wherein the module is configured to modify a surface by forming a coating on the surface.

[0017] In some aspects, the technology described herein relates to a system wherein the module is an atomic layer deposition coating module.

[0018] In some aspects, the technology described herein relates to a system wherein the module is configured to connect to the chemical supply cabinet from outside of the chemical supply cabinet.

[0019] In some aspects, the technology described herein relates to a system wherein the control unit is configured to automatically direct the modules to modify the surface of the system.

[0020] In some aspects, the technology described herein relates to a method comprising: connecting a module to a chemical supply cabinet; after connecting the module to the chemical supply cabinet, controlling the module to modify a surface; and modifying the surface via the module.

[0021] In some aspects, the technology described herein relates to a method wherein the module is an atomic layer deposition coating module.

[0022] In some aspects, the technology described herein relates to a method wherein said modifying the surface comprises forming a coating on the surface.

[0023] In some aspects, the technology described herein relates to a method wherein the forming the coating on the surface comprises using atomic layer deposition.

[0024] In some aspects, the technology described herein relates to a method further comprising connecting an ampoule to the chemical supply cabinet, connecting a supply line to the chemical supply cabinet, connecting a tool to the supply line, or a combination thereof.

[0025] In some aspects, the technology described herein relates to a method wherein the connecting the module to the chemical supply cabinet includes connecting the module to the chemical supply cabinet while the module remains on an exterior of the chemical supply cabinet.

[0026] In some aspects, the technology described herein relates to a method, wherein the controlling the module includes controlling the module via a control unit to automatically modify the surface.

[0027] In some aspects, the technology described herein relates to a system comprising: a chemical supply cabinet, wherein the structure of the chemical supply cabinet defines an interior volume of the chemical supply cabinet; a module connected to the interior volume of the chemical supply cabinet; a tool connected to the module; and a supply line connecting the chemical supply cabinet to the tool, wherein after the module is connected to the chemical supply cabinet, the module is configured to modify a surface.

[0028] In some aspects, the technology described herein relates to a system wherein a control unit is connected to the module, and wherein the control unit is configured to direct the module.

[0029] In some aspects, the technology described herein relates to a system wherein the module is an atomic layer deposition coating module.

[0030] In some aspects, the techniques described herein relate to a system in which the tool is a semiconductor processing tool.

[0031] In some aspects, the technology described herein relates to a system wherein the surface comprises an interior surface of the chemical supply cabinet, an interior surface of the supply line, a wettable surface of the tool, or a combination thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Some embodiments of the present disclosure are described herein with reference to the accompanying drawings only by way of example. With specific reference to the drawings in detail, it should be emphasized that the embodiments shown are by way of example and are used for illustrative discussion of the embodiments of the present disclosure. In this regard, the description together with the drawings makes it clear to those skilled in the art how the embodiments of the present disclosure can be practiced. Throughout the text, the same reference numerals represent the same or similar parts.

[0033] Figure 1 A manufacturing system according to some embodiments is presented.

[0034] Figure 2 A chemical supply cabinet is shown according to some embodiments.

[0035] Figure 3 A chemical supply cabinet is shown according to some embodiments.

[0036] Figure 4 Modules according to some embodiments are shown.

[0037] Figure 5 A flow chart is shown according to some embodiments of a method for modifying a surface. DETAILED DESCRIPTION

[0038] In addition to the benefits and improvements disclosed, other objects and advantages of the present disclosure will be apparent from the following description in conjunction with the accompanying drawings. Detailed embodiments of the present disclosure are disclosed herein, however, it should be understood that the disclosed embodiments are merely illustrative of the present disclosure that can be embodied in various forms. In addition, each of the examples is given in view of the various embodiments of the present disclosure that are intended to be illustrative rather than limiting.

[0039] In the specification and claims, unless the context clearly indicates otherwise, the following terms adopt the meanings clearly associated herein. The phrases "in one embodiment", "in an embodiment" and "in some embodiments" used herein may not all refer to the same embodiment, but they may refer to the same embodiment. In addition, the phrases "in another embodiment" and "in some other embodiments" used herein may not refer to different embodiments, but they may refer to different embodiments. All embodiments of the present disclosure are intended to be combined without departing from the scope or spirit of the present disclosure.

[0040] As used herein, the term "ampoule" means a sealed container containing a chemical (eg, a liquid chemical, a solid chemical, or a gaseous chemical).

[0041] As used herein, the term "based on" is non-exclusive and allows for being based on additional factors not described, unless the context clearly indicates otherwise. In addition, throughout the specification, the meanings of "a", "an", and "the" include plural referents. The meaning of "in..." includes "in..." and "on...".

[0042] As used herein, the term "between" does not necessarily need to be placed directly adjacent to other elements. Generally speaking, this term means a configuration in which something is sandwiched by two or more other things. In this case, the term "between" can describe something that is directly adjacent to two opposing things. Therefore, in any one or more of the embodiments disclosed herein, a specific structural component is placed between two other structural elements may be:

[0043] being disposed directly between the two other structural elements so that the particular structural component is in direct contact with both of the two other structural elements;

[0044] being disposed in direct proximity to only one of the two other structural elements such that the particular structural component is in direct contact with only one of the two other structural elements;

[0045] being disposed only indirectly adjacent to one of the two other structural elements, such that the particular structural component is only not in direct contact with one of the two other structural elements, and there is another element juxtaposed with the particular structural component and one of the two other structural elements;

[0046] Disposed indirectly between the two other structural elements, such that the particular structural component is not in direct contact with both of the two other structural elements, and other features may be disposed therebetween; or

[0047] Any combination thereof.

[0048] As used herein, "embedded" means that a first material is distributed throughout a second material.

[0049] Figure 1 A manufacturing system 100 having a delivery system 102 is shown according to some embodiments. The delivery system 102 includes a chemical supply cabinet 110 and a supply line 120. The manufacturing system 100 further includes a tool 130, a vacuum pump line 140, and a vacuum pump 150. The chemical supply cabinet 110 includes a first ampoule 112A, a second ampoule 112B (the first ampoule 112A and the second ampoule 112B are collectively referred to as ampoules 112), a module 114, and a control unit 116. In some embodiments, the chemical supply cabinet 110 does not include the control unit 116.

[0050] Ampoule 112 is configured to modify the surface by changing the composition (e.g., chemical composition) of the surface. In some embodiments, the surface is a surface of manufacturing system 100. For example, the surface may be all wettable surfaces of manufacturing system 100. In some embodiments, the wettable surfaces of manufacturing system 100 include interior surfaces within chemical supply cabinet 110 (e.g., processing lines of chemical supply cabinet 110), interior surfaces of supply line 120, wettable surfaces of tool 130. In some embodiments, the surface is a surface of delivery system 102 (i.e., surfaces within chemical supply cabinet 110 and supply line 120) and a surface of tool 130. The surface of chemical supply cabinet 110 may refer to the lines of chemical supply cabinet 110. For example, see Figure 2 The processing line 260 of the chemical supply cabinet 210, Figure 3 Supply cabinet 310, processing line 360 ​​and Figure 4 The processing line 460 of the module 414 is shown in FIG.

[0051] In some embodiments, the structure of chemical supply cabinet 110 defines an interior volume of chemical supply cabinet 110. In some embodiments, module 114 is connected to the interior volume of chemical supply cabinet 110. In some embodiments, tool 130 may be connected to module 114 (e.g., via a processing line). In some embodiments, supply line 120 connects chemical supply cabinet 110 to tool 130. In some embodiments, after module 114 is connected to chemical supply cabinet 110 (wherein module 114 may be held on the exterior of chemical supply cabinet 110 or positioned in the interior of chemical supply cabinet 110), module 114 is configured to modify the surface.

[0052] In some embodiments, the ampoule 112 is a precursor ampoule. In some embodiments, the first ampoule 112A and the second ampoule 112B are the same ampoule. In some embodiments, the first ampoule 112A and the second ampoule 112B are different. For example, the size, shape, and contents of the first ampoule 112A and the second ampoule 112B may be different from each other. In some embodiments, the ampoule 112 is metal (e.g., a sealed metal container). The ampoule 112 is not limited to a particular shape and / or size.

[0053] In some embodiments, the precursor includes a precursor that can be vaporized by applying thermal energy and irradiation. The vaporizable precursor can exist as a solid, as a liquid, or as a solid and a liquid. For example, in some embodiments, the vaporizable precursor includes a vaporizable solid precursor. In some embodiments, the vaporizable precursor includes a vaporizable liquid precursor. In some embodiments, the vaporizable precursor includes a vaporizable solid precursor and a vaporizable liquid precursor. It should be understood that other types of vaporizable precursors can be used herein without departing from the scope of the present disclosure.

[0054] The vaporizable precursor can include, consist of, or consist essentially of at least one of an elemental metal, a metal halide, a metal oxyhalide, an organometallic compound, a metal-organic complex, or any combination thereof.

[0055] In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of: dimethylhydrazine, trimethylaluminum (TMA), hafnium chloride (HfCl 4 ), zirconium chloride (ZrCl 4 ), indium trichloride, indium monochloride, aluminum trichloride, titanium iodide, tungsten carbonyl, Ba(DPM) 2 、Strontium di-di-tert-valerylmethyl (Sr(DPM) 2 )、TiO(DPM) 2 、Tetrakis(di-tert-valerylmethyl)zirconium(Zr(DPM) 4 ), decaborane, octadecaborane, indium, antimony, sodium tetrafluoroborate, precursors incorporating alkylamide ligands, organometallic precursors, tert-butyl zirconium (Zr(t-OBu) 4 ), Tetrakis(diethylamino)zirconium(Zr(Net 2 ) 4 ), Hafnium tetradiethylamine (Hf(Net 2 ) 4 ), tetrakis(dimethylamino)titanium (TDMAT), tert-butylamide(diethylamino)tantalum (TBTDET), penta(dimethylamino)tantalum (PDMAT), penta(ethylmethylamino)tantalum (PEMAT), tetrakis(dimethylamino)zirconium (Zr(NMe 2 )4 ), Hafnium tert-butylate (Hf(tOBu) 4 ), Xenon difluoride (XeF 2 ), xenon tetrafluoride (XeF 4 ), xenon hexafluoride (XeF 6 ), or any combination thereof.

[0056] In some embodiments, the vaporizable precursor includes, consists of, or consists essentially of at least one of decaborane, hafnium tetrachloride, zirconium tetrachloride, indium trichloride, a metal organic β-diketonate complex, tungsten hexafluoride, cyclopentadienylcycloheptatrienyl titanium (CpTiCht), aluminum trichloride, titanium iodide, cyclooctatetraenylcyclopentadienyl titanium, biscyclopentadienyl titanium dichloride, trimethylgallium, trimethylindium, alkylaluminum (such as trimethylaluminum), triethylaluminum, trimethylamine alane, dimethylzinc, tetramethyltin, trimethylantimony, diethylcadmium, tungsten carbonyl, or a combination thereof.

[0057] In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of elemental boron, phosphorus, decaborane, gallium halide, indium halide, antimony halide, arsenic halide, gallium halide, aluminum iodide, titanium iodide, MoO 2 Cl 2 、MoOCl 4 、MoCl 5 、WCl 5 WOCl 4 、WCl 6 , cyclopentadienyl cycloheptatrienyl titanium (CpTiCht), cyclooctatetraenyl cyclopentadienyl titanium, biscyclopentadienyl titanium dichloride, In(CH 3 ) 2 (hfac), dibromomethyl antimonide, carbonyl tungsten, metal organic β-diketonate complex, metal organic alkoxide complex, metal organic carboxylic acid complex, metal organic aryl complex, metal organic amide complex, or any combination thereof. In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of the following: MoO 2 Cl 2 、MoOCl 4 , WO 2 Cl 2 WOCl 4 or any combination thereof.

[0058] In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of: 10 H14 ), pentaborane (B 5 H 9 ), octadecadiene (B 18 H 22 ), boric acid (H 3 BO 3 )、SbCl 3 、SbCl 5 or any combination thereof. In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of the following: AsCl 3 , AsBr 3 , AsF 3 , AsF 5 , AsH 3 、As 4 O 6 、As 2 Se 3 As 2 S 2 、As 2 S 3 、As 2 S 5 、As 2 Te 3 , B 4 H 11 , B 4 H 10 , B 3 H 6 N 3 , BBr 3 , BCl 3 , BF 3 , BF 3 .O(C 2 H 5 ) 2 , BF 3 .HOCH 3 , B 2 H 6 、F 2 , HF, GeBr 4 、GeCl 4 , GeF 4 , GeH 4 , H 2 , HCl, H 2 Se, H 2 Te, H 2 S.W.F. 6 、SiH 4 、SiH 2 Cl 2、SiHCl 3 、SiCl 4 、SiH 3 Cl、NH 3 、NH 3 、Ar、Br 2 、HBr、BrF 5 、CO 2 、CO、COCl 2 、COF 2 、Cl 2 、ClF 3 、CF 4 、C 2 F 6 、C 3 F 8 、C 4 F 8 、C 5 F 8 、CHF 3 、CH 2 F 2 、CH 3 F、CH 4 、SiH 6 、He、HCN、Kr、Ne、Ni(CO) 4 、HNO 3 、NO、N 2 、NO 2 、NF 3 、N 2 O、C 8 H 24 THEIR 4 Flaw 4 、PH 3 、POCl 3 、PCl 5 、PF 3 、PFS、SbH 3 、SO 2 、SF 6 、SF 4 、Si(OC 2 H 5 ) 4 、C 4 H 16 Flaw 4 THEIR 4 、Si(CH 3 ) 4 、SiH(CH 3 ) 3 、TiCl 4 、Xe、SiF 4 、WOF 4 、TaBr 5、TaCl 5 、TaF 5 、Sb(C 2 H 5 ) 3 、Sb(CH 3 ) 3 、In(CH 3 ) 3 , PBr 5 , PBr 3 , RuF 5 or any combination thereof.

[0059] In some embodiments, module 114 can modify the surface by forming a coating on the surface. For example, module 114 can modify the surface by coating the inner surface of the wet flow path. In some embodiments, module 114 is an atomic layer deposition coating module.

[0060] In some embodiments, module 114 can be used to provide other surface treatment options besides providing a coating. For example, module 114 can be used to provide passivation of delivery system 102 and manufacturing system 100. The material on the surface can react with the steam to form a chemically resistant layer. Some examples of useful reactions are forming or improving a passivating oxide layer (e.g., trioxide (O 3 ), peroxides or permanganates). Other reactions can form stable carbides or nitrides on the surface, such as from nitrogen (N 2 ), carbides or nitrides of methane, ammonia, etc. Additional reactions can form stable halides on the surface, such as from fluorine (F 2 ), NF 3 Plasma or XeF 2 Other useful reactions allow the surface to be terminated with inert chemical species, such as the well-known hexamethyldisilane.

[0061] In some embodiments, modifying the surface includes applying a chemical source from module 114 to a surface within manufacturing system 100 , such as delivery system 102 (eg, chemical supply cabinet 110 ).

[0062] In some embodiments, modifying the surface may include exposure to a single chemical species on a passivated or chemisorbed surface. Modifying the surface may include cyclic exposure to at least two different species (e.g., fluorine gas (F 2 ) and nitrogen (N 2 )).

[0063] In some embodiments, modifying the surface comprises modifying the surface without adding a material to the surface. For example, modifying the surface may comprise modifying the surface without adding a particular coating.

[0064] In some embodiments, more than one module 114 may be used. In some embodiments, more than one module 114 may be identical to one another. In some embodiments, more than one module 114 may be different from one another. For example, a first module 114 may be a coating module (e.g., an atomic layer deposition coating module) and a second module 114 may be a module for vapor deposition (e.g., a chemical vapor deposition module).

[0065] In some embodiments, module 114 may be connected to chemical supply cabinet 110 from the outside of chemical supply cabinet 110. Alternatively, module 114 may be connected to chemical supply cabinet 110 from the inside of chemical supply cabinet 110.

[0066] The control unit 116 includes a microprocessor with non-volatile program memory and read / write memory for variable storage. In some embodiments, the control unit 116 is configured to automatically direct the module 114 to modify a surface (e.g., a surface of the manufacturing system 100). In some embodiments, the control unit 116 is connected to the module 114 via Wi-Fi, Bluetooth, a network, the cloud, etc. For example, the control unit 116 may be physically separated from the module 114 and connected via Wi-Fi, Bluetooth, a network, the cloud, etc. In some embodiments, the control unit 116 controls the module 114 by controlling the module 114 to automatically modify the surface via the control unit 116. The control unit 116 may also be used to manually control the module 114.

[0067] In some embodiments, the control unit 116 is used to control the passivation process when the module 114 is used to change the composition of the surface. For example, the control unit 116 can be used to automate the passivation process. In some embodiments, the passivation process includes the following steps. The first step may be to isolate the ampoule 112 (e.g., a chemical ampoule) in the chemical supply cabinet 110 (e.g., via a valve function). The second step may include cleaning the supply line 120. In some embodiments, cleaning requires establishing a connection to a pump (which is downstream of the tool 130). In some embodiments, it is not desirable to modify (e.g., coat) the inner surface of the tool 130. In some embodiments, this can be done by establishing a bypass connection (through various valve switching functions) so that the materials (e.g., chemicals) required for modification / coating are not pumped through the tool 130.

[0068] The third step may include turning on the module 114 to perform the modification / coating / passivation sequence. In some embodiments, more than one module 114 is used during the execution of the modification / coating / passivation sequence. In some embodiments, the sequence may include at least two options. These options include using a processing line connected to the module 114. The processing line connecting the module 114 and the supply line 120 may include gas lines, manifolds, valves, orifices, pressure sensors, and other supply line machinery.

[0069] Option 1 may include the following steps: (i) establish a flow of carrier gas (e.g., an inert gas called "Chemical A", such as nitrogen or argon); (ii) [pulse carrier gas (e.g., "Chemical A") "x" seconds - wait - pulse "Chemical B" "y" seconds - wait"] "n" times; in some embodiments, all of this must pass through a bypass line before it enters tool 130. In some embodiments, "wait" is about 5 seconds to about 60 seconds. In some embodiments, "n" is between 1 and 10,000. In some embodiments, "x" and "y" seconds may vary from less than 1 second to greater than 120 seconds.

[0070] In some embodiments, Option 1 can provide a thickness in a range from 1 nanometer to 1 micrometer. In some embodiments, the thickness is in a range from 20 nanometers to 120 nanometers.

[0071] For Option 1, "Chemical A" and "Chemical B" are different from each other. Chemical A and Chemical B may be any compound or chemical element described herein.

[0072] In some embodiments, after pulsing a carrier gas (e.g., "Chemical A") for "x" seconds and after a "wait," the method may include purging or evacuating the carrier gas. Purging may include flowing new gas to exhaust "Chemical A." Evacuating may include pulling a vacuum to draw out "Chemical A." Similarly, the method may include purging or evacuating "Chemical B" after pulsing "Chemical B" for "y" seconds.

[0073] Option 2 may include the following steps: (i) Close pump valve; (ii) Pulse "Chemical A" for "x" seconds - Wait (extended period, e.g., several minutes to hours); (iii) Open pump valve, then drain or purge "Chemical A"; (iv) Repeat steps (i) to (iii) "n" times. In some embodiments, "wait" is about 5 seconds to about 60 seconds. In some embodiments, "n" may range from 1 to 10,000. In some embodiments, "x" seconds may vary from less than 1 second to greater than 120 seconds. "Chemical A" may be any compound or chemical element described herein.

[0074] In some embodiments, Option 2 may provide a single monolayer or multiple monolayers. In some embodiments, a single monolayer may have a thickness of up to 50 nanometers. In some embodiments, multiple monolayers may have a cumulative thickness of several microns.

[0075] In some embodiments, the coatings of the present disclosure, such as protective coatings, may include one or more coating materials selected from the group consisting of each of the following: 2 O 3 ; an oxide of formula MO, wherein M is Ca, Mg or Be; formula M′O 2An oxide of wherein M′ is a stoichiometrically acceptable metal; and the formula Ln 2 O 3 wherein Ln is a lanthanide, such as La, Sc, or Y. More specifically, the coating may include a metal oxide having a free energy of reaction greater than or equal to zero with a material of a contact surface (e.g., a metal surface) during operation of the system.

[0076] The metal oxide, nitride, or halide in various embodiments may include at least one oxide, nitride, or halide of one or more of Cr, Fe, Co, and Ni, and in other embodiments may include at least one oxide, nitride, or halide of one or more of Cr, Fe, and Ni, or any other suitable metal oxide, nitride, or halide species. The gas that reacts with the metal oxide, nitride, or halide to form a reaction product that is harmful to the structure, material, or system and its use or operation may include Al 2 Cl 6 、WCl 5 、MoCl 5 、WCl 6 、MoO 2 Cl 2 、MoOCl 4 or WOCl 4 .

[0077] The coating in the above method (e.g., a protective coating applied to a surface) may include one or more coating materials selected from the group consisting of each of the following: 2 O 3 ; an oxide of formula MO, wherein M is Ca, Mg or Be; formula M′O 2 An oxide of wherein M′ is a stoichiometrically acceptable metal; and the formula Ln 2 O 3 wherein Ln is a lanthanide, such as La, Sc, or Y. More specifically, the protective coating may include a metal oxide having a free energy of reaction greater than or equal to zero with a gas contacting a surface (e.g., a metal surface) during use or operation of the structure, material, or system.

[0078] The fourth step may include shutting down at least one module 114 (e.g., module 114 may be a reactant source for delivery system 102) and removing the reactants from the chemical supply cabinet 110 by pumping (through a bypass line) or by using an inert gas introduced from the chemical supply cabinet 110 (e.g., see Figure 2 Inert gas line 270 and Figure 3 The supply line 120 is cleaned by a pumping and cleaning cycle of the inert gas line 370).

[0079] The fifth step may include implementing a leak-back sequence of the supply line 120 .

[0080] A sixth step may include opening (eg, via valve function) an ampoule 112 (eg, a chemical ampoule) in the chemical supply cabinet 110 and optionally pulsing (either into the tool 130 or still through a bypass connection) to reestablish proper chemical gas line conditions for the supply line 120 .

[0081] The supply line 120 may include gas lines, manifolds, valves, orifices, pressure sensors, and other supply line machinery.

[0082] In some embodiments, the tool 130 may be a processing tool, such as a semiconductor processing tool. In some embodiments, the surface may be a surface of the tool 130 (eg, a surface of a semiconductor processing tool).

[0083] The vacuum pump line 140 may include gas lines, manifolds, valves, orifices, pressure sensors, and other supply line machinery.

[0084] Figure 2 The conveying system 202 is shown. To keep this description simple, the previously described components will not be described in detail unless otherwise specifically indicated. Figure 1 Features of the delivery system 202 are described. The delivery system 202 includes a chemical supply cabinet 210 and a supply line 220. The chemical supply cabinet 210 may include a first ampoule 212A, a second ampoule 212B (the first ampoule 212A and the second ampoule 212B are collectively referred to as ampoules 212), a module 214, a control unit 216, a processing line 260, and an inert gas line 270. In some embodiments, the chemical supply cabinet 110 does not include the control unit 116.

[0085] In some embodiments, only one ampoule is connected to the supply line 220. For example, after the first ampoule 212A is depleted, the first ampoule 212A can be disconnected from the supply line 220. Then, the second ampoule 212B can be connected to the supply line 220. The processing line 260 can include gas lines, manifolds, valves, orifices, pressure sensors, and other supply line machinery.

[0086] Figure 3 The conveying system 302 is shown. To simplify the description, the previously described components will not be described in detail unless otherwise specifically indicated. Figure 1 and 23. The features of the delivery system 302 are described. The delivery system 302 includes a chemical supply cabinet 310 and a supply line 320. The chemical supply cabinet 310 may include an ampoule 312, a module 314, a control unit 316, a processing line 360, and an inert gas line 370. In some embodiments, the delivery system 302 does not include the control unit 316. During use of the delivery system 302, the ampoule 312 may be disconnected from the processing line 360 ​​and the module 314 may be connected to the processing line 360. Alternatively, the ampoule 312 may be connected to the processing line 360 ​​and the module 314 may be disconnected from the processing line 360.

[0087] Figure 4 Display module 414. To simplify this description, unless otherwise specifically indicated, the previously described Figures 1 to 3 Module 414 may be an atomic layer deposition coating module. In some embodiments, module 414 may include a precursor source 406 and a co-reactant source 408. In some embodiments, precursor source 406 and / or co-reactant source 408 may be an ampoule. Module 414 may include an inert gas line 470A connected to precursor source 406. Module 414 may include an inert gas line 470B connected to co-reactant source 408. Module 414 may include a processing line 460, which may be configured to be embedded in a chemical supply cabinet (e.g., supply cabinet 110, supply cabinet 210, or supply cabinet 310) to connect to another device, such as a supply line (e.g., supply line 120, supply line 220, or supply line 320).

[0088] In some embodiments, module 414 may be externally connected to the chemical supply cabinet rather than being embedded in the chemical supply cabinet.

[0089] Figure 5 An exemplary flow chart according to some embodiments of a method 500 for modifying a surface is shown. The method includes connecting 510 a module to a chemical supply cabinet. The method further includes, after connecting the module to the chemical supply cabinet, controlling 520 the module to modify the surface. The method further includes modifying 530 the surface via the module modifying the surface.

[0090] In some embodiments, the module is an atomic layer deposition coating module. Modifying the surface may include forming a coating on the surface. Forming a coating on the surface may include using atomic layer deposition.

[0091] In some embodiments, the module is a chemical vapor deposition module. Modifying the surface includes changing the composition of the surface, for example via vapor from the chemical vapor deposition module.

[0092] In some embodiments, method 500 includes connecting an ampoule to a chemical supply cabinet, connecting a supply line to the chemical supply cabinet, connecting a tool to the supply line, or a combination thereof. In some embodiments, connecting the module to the chemical supply cabinet includes connecting the module to the chemical supply cabinet while the module is held on the exterior of the chemical supply cabinet. In some embodiments, method 500 includes controlling the module (e.g., controlling the module via a control unit) to automatically modify the surface.

[0093] aspect

[0094] Various aspects will be described below. It should be understood that any one or more of the features recited in the following aspects may be combined with any one or more other aspects.

[0095] Aspect 1. A system comprising: a chemical supply cabinet; a module configured to modify a surface; and a control unit connected to the module, wherein the control unit is configured to direct the modification of the surface.

[0096] Aspect 2. The system of aspect 1, wherein the system is configured to be connected to a semiconductor processing tool.

[0097] Aspect 3. The system of aspect 1 or aspect 2, wherein the surface comprises an interior surface of the semiconductor processing tool.

[0098] Aspect 4. The system according to any of the preceding aspects, wherein the module is configured to modify the surface by changing the composition of the surface.

[0099] Aspect 5. The system according to any of the preceding aspects, wherein the module is configured to modify the surface by forming a coating on the surface.

[0100] Aspect 6. The system according to any of the preceding aspects, wherein the module is an atomic layer deposition coating module.

[0101] Aspect 7. The system of any of the preceding aspects, wherein the module is configured to be connected to the chemical supply cabinet from outside the chemical supply cabinet.

[0102] Aspect 8. The system according to any of the preceding aspects, wherein the control unit is configured to automatically direct the modules to modify the surface of the system.

[0103] Aspect 9. A method comprising: connecting a module to a chemical supply cabinet; after connecting the module to the chemical supply cabinet, controlling the module to modify a surface; and modifying the surface via the module.

[0104] Aspect 10. The method according to aspect 9, wherein the module is an atomic layer deposition coating module.

[0105] Aspect 11. The method according to aspect 9 or aspect 10, wherein modifying the surface comprises forming a coating on the surface.

[0106] Aspect 12. The method according to aspect 11, wherein forming the coating on the surface comprises using atomic layer deposition.

[0107] Aspect 13. The method according to any of the preceding aspects, further comprising connecting an ampoule to the chemical supply cabinet, connecting a supply line to the chemical supply cabinet, connecting a tool to the supply line, or a combination thereof.

[0108] Aspect 14. The method of any of the preceding aspects, wherein connecting the module to the chemical supply cabinet comprises connecting the module to the chemical supply cabinet while the module remains on the exterior of the chemical supply cabinet.

[0109] Aspect 15. The method according to any one of the preceding aspects, wherein controlling the module comprises controlling the module to automatically modify the surface via a control unit.

[0110] Aspect 16. A system comprising: a chemical supply cabinet, wherein the structure of the chemical supply cabinet defines an interior volume of the chemical supply cabinet; a module connected to the interior volume of the chemical supply cabinet; a tool connected to the module; and a supply line connecting the chemical supply cabinet to the tool, wherein, after connecting the module to the chemical supply cabinet, the module is configured to modify a surface.

[0111] Aspect 17. The system according to aspect 16, wherein a control unit is connected to the module, and wherein the control unit is configured to direct the module.

[0112] Aspect 18. The system according to aspect 16 or aspect 17, wherein the module is an atomic layer deposition coating module.

[0113] Aspect 19. The system according to any of the preceding aspects, wherein the tool is a semiconductor processing tool.

[0114] Aspect 20. The system of any of the preceding aspects, wherein the surface comprises an interior surface of the chemical supply cabinet, an interior surface of the supply line, a wettable surface of the tool, or a combination thereof.

[0115] The terms used herein are intended to describe embodiments and are not intended to be limiting. Unless otherwise expressly indicated, the terms "a", "an" and "the" also include plural forms. The term "comprising" used in this specification specifically refers to the presence of the features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements and / or components.

[0116] It should be understood that any of the embodiments or any portion thereof may be combined with any of the other embodiments without departing from the scope of the present disclosure. It should also be understood that changes may be made to the details (especially with respect to the construction materials employed) and the shapes, sizes, and arrangements of the parts without departing from the scope of the present disclosure. This specification and the described embodiments are examples, and the true scope and spirit of the present disclosure is indicated by the appended claims.

Claims

1. A system comprising: Chemical supply cabinets; a module configured to modify a surface; and A control unit is connected to the module, wherein the control unit is configured to direct the modification of the surface.

2. The system of claim 1, wherein the system is configured to connect to a semiconductor processing tool.

3. The system of claim 2, wherein the surface comprises an interior surface of the semiconductor processing tool.

4. The system of claim 1, wherein the module is configured to modify the surface by altering the composition of the surface.

5. The system of claim 1, wherein the module is configured to modify the surface by forming a coating on the surface.

6. The system of claim 1, wherein the module is an atomic layer deposition coating module.

7. The system of claim 1, wherein the module is configured to connect to the chemical supply cabinet from outside the chemical supply cabinet.

8. The system of claim 1, wherein the control unit is configured to automatically direct the modules to modify the surface of the system.

9. A method comprising: Connect the module to the chemical supply cabinet; After connecting the module to the chemical supply cabinet, controlling the module to modify the surface; and The surface is modified via the module.

10. The method of claim 9, wherein the module is an atomic layer deposition coating module.

11. The method of claim 9, wherein said modifying said surface comprises forming a coating on said surface.

12. The method of claim 11, wherein said forming said coating on said surface comprises using atomic layer deposition.

13. The method of claim 9, further comprising connecting an ampoule to the chemical supply cabinet, connecting a supply line to the chemical supply cabinet, connecting a tool to the supply line, or a combination thereof.

14. The method of claim 9, wherein the connecting the module to the chemical supply cabinet comprises connecting the module to the chemical supply cabinet while the module remains on an exterior of the chemical supply cabinet.

15. The method of claim 9, wherein the controlling the module comprises controlling the module to automatically modify the surface via a control unit.

16. A system comprising: a chemical supply cabinet, wherein the structure of the chemical supply cabinet defines an interior volume of the chemical supply cabinet; a module connected to the interior volume of the chemical supply cabinet; a tool connected to the module; and a supply line connecting the chemical supply cabinet to the tool, Wherein, after connecting the module to the chemical supply cabinet, the module is configured to modify the surface.

17. The system of claim 16, wherein a control unit is connected to the module, and wherein the control unit is configured to direct the module.

18. The system of claim 16, wherein the module is an atomic layer deposition coating module.

19. The system of claim 16, wherein the tool is a semiconductor processing tool.

20. The system of claim 16, wherein the surface comprises an interior surface of the chemical supply cabinet, an interior surface of the supply line, a wettable surface of the tool, or a combination thereof.

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