Circuit board, circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board, a circuit board assembly and electronic equipment. The circuit board is used for arranging a first device or a second device, and is characterized by comprising a main board, a first type of bonding pad and a second type of bonding pad. And the first type of bonding pads and the second type of bonding pads are formed on the surface of the mainboard and are electrically connected with the mainboard. The first type of bonding pad comprises a first bonding pad and a first common bonding pad, and the second type of bonding pad comprises a second bonding pad and the first common bonding pad. The first common bonding pad comprises a first side and a second side, the first bonding pad and the second bonding pad are located on the first side and the second side respectively, and the first bonding pad and the first common bonding pad are arranged at intervals. The first bonding pad and the first common bonding pad are used for simultaneously connecting a first device, and the second bonding pad and the first common bonding pad are used for simultaneously connecting a second device. The circuit board provided by the invention can be adapted to different electronic devices, and the technical problem of low utilization rate of the circuit board in the prior art can be solved.

Description

Circuit boards, circuit board assemblies, and electronic devices

[0001] This application claims priority to a patent application filed with the China Patent Office on August 5, 2022, with application number 202210938637.X and application name “Circuit Board, Circuit Board Assembly and Electronic Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of communication technology, and in particular to a circuit board, a circuit board assembly, and an electronic device. Background Art

[0003] The motherboards of electronic devices like mobile phones typically connect to electronic components like motors and speakers via spring clips. The motherboard's solder pads, spring clips, and corresponding electronic components are typically positioned in a fixed, matched configuration. However, if there are two electronic components like motors, and they are oriented in different directions, the corresponding spring clips on the motherboard will be positioned differently. This requires different motherboards to accommodate different electronic components, resulting in low motherboard utilization.

[0004] Summary of the Invention

[0005] The present application provides a circuit board, a circuit board assembly and an electronic device to solve the technical problem of low utilization rate of the mainboard in the prior art.

[0006] The present application provides a circuit board, which is used to set a first device or a second device. The circuit board includes a mainboard, a first type of pad and a second type of pad. The first type of pad and the second type of pad are both formed on the surface of the mainboard and electrically connected to the mainboard. The first type of pad includes a first pad and a first common pad, and the second type of pad includes a second pad and the first common pad. The first common pad includes a first side and a second side, and the first pad and the second pad are respectively located on the first side and the second side and are spaced apart from the first common pad. The first pad and the first common pad are used to simultaneously connect the first device, and the second pad and the first common pad are used to simultaneously connect the second device.

[0007] In this embodiment, by providing a first common pad, and the first common pad being part of both the first type of pad and the second type of pad, it is possible to save pad area. Furthermore, when the first common pad is used together with the first pad, it can be used to connect the first device. When the first common pad is used together with the second pad, it can be used to connect the second device. This allows the same motherboard to be electrically connected to two different electronic devices, thereby improving the utilization rate of the motherboard and reducing costs. Furthermore, the first common pad is spaced apart from the first pad and the second pad, thereby preventing solder from floating during welding, resulting in large deviations in the welding position. This improves the accuracy of the spring clip welding position and ensures the stability of the spring clip connection.

[0008] In a possible implementation, when the first pad and the first common pad are used to simultaneously connect to a first device, the second pad is left vacant; and when the second pad and the first common pad are used to simultaneously connect to a second device, the first pad is left vacant.

[0009] In this embodiment, when the first common pad is used together with the first pad, it can be used to connect the first device; when the first common pad is used together with the second pad, it can be used to connect the second device, thereby enabling the same motherboard to be electrically connected to two different electronic devices, improving the utilization rate of the motherboard and reducing costs.

[0010] In a possible implementation manner, a first gap is provided between the first pad and the first common pad, and an area of ​​the first gap is less than or equal to 20% of a total area of ​​the first pad, the first gap, and the first common pad.

[0011] It is understood that the total area of ​​the first pad, the first common pad, and the first gap is the original area of ​​the first-type pad. The total area of ​​the first pad and the first common pad is the area occupied by the solder after the first-type pad is separated, that is, the welding area. In this embodiment, the area of ​​the first gap is less than or equal to 80% of the original area of ​​the first-type pad. In other words, the welding area of ​​the first-type pad is set to at least 80% of the original area of ​​the first-type pad, thereby ensuring welding strength.

[0012] In one possible implementation, the width of the first gap is 0.15 mm to 0.25 mm. In this embodiment, by setting the first gap between the first pad and the first common pad, the solder can be prevented from flowing between the first pad and the first common pad. At the same time, it can also prevent the spring from drifting toward the first pad when the spring is welded to the second pad when the first common pad is used as the second pad, causing a large deviation in the welding position. This improves the accuracy of the spring welding position, ensures the stability of the spring connection, and thus ensures the stability of the electrical connection between the electronic device and the motherboard.

[0013] In one possible implementation, solder resist oil is provided on the surface of the mainboard, and the solder resist oil is located in the first gap. In this embodiment, solder can be prevented from flowing between the first pad and the first common pad by filling the first gap with solder resist oil.

[0014] In one possible implementation, the length direction of the first type of pads intersects with the length direction of the second type of pads. In this embodiment, the length directions of the first type of pads intersect with the length directions of the second type of pads, so that the pads can be applied to two electronic devices with different electrode directions, further improving the utilization rate of the circuit board.

[0015] In one possible embodiment, the first pad includes a first sub-pad and a second sub-pad, and along the length direction of the first type of pad, the first sub-pad, the first common pad and the second sub-pad are arranged side by side and at intervals, and the first common pad is located between the first sub-pad and the second sub-pad, and the first side includes a first sub-side and a second sub-side, the first sub-pad is located on the first sub-side, and the second sub-pad is located on the second sub-side.

[0016] In this embodiment, by dividing the first pad into a first sub-pad and a second sub-pad, the distribution range of the first pad is increased, thereby improving the compatibility of the first pad with the first device. Furthermore, in this embodiment, the first sub-pad and the second sub-pad are spaced apart from the first common pad, thereby preventing solder floating during soldering, which could result in large deviations in the soldering position. This improves the accuracy of the spring clip's soldering position and ensures the stability of the spring clip's spring connection.

[0017] In one possible embodiment, the second pad includes a third sub-pad and a fourth sub-pad, and along the length direction of the second type of pad, the third sub-pad, the first common pad and the fourth sub-pad are arranged side by side and at intervals, and the first common pad is located between the third sub-pad and the fourth sub-pad, and the second side includes a third sub-side and a fourth sub-side, the third sub-pad is located on the third sub-side, and the fourth sub-pad is located on the fourth sub-side.

[0018] In this embodiment, by dividing the second pad into a third sub-pad and a fourth sub-pad, the distribution range of the second pad can be increased, thereby improving the compatibility between the second pad and the second device.

[0019] In one possible embodiment, the length direction of the first type of pad is parallel to the length direction of the second type of pad; along the length direction of the first type of pad, the first pad, the first common pad and the second pad are arranged side by side and at intervals, and the first common pad is located between the first pad and the second pad.

[0020] In this embodiment, the first pads, the first common pads and the second pads are arranged in a straight line, so that the first type of pads and the second type of pads are suitable for two electronic devices with the same electrode extension direction but different positions.

[0021] In one possible embodiment, the mainboard includes a positive circuit and a negative circuit, the first common pad is electrically connected to the positive circuit, and the first pad and the second pad are both insulated from the mainboard; or, the first common pad is electrically connected to the negative circuit, and the first pad and the second pad are both insulated from the mainboard.

[0022] In this embodiment, the first common pad is used as the electrical connection area and the other areas are used only as fixed connection areas, so that when the first common pad is used together with the first pad, it can be electrically connected to the first device, and when the first common pad is used together with the second pad, it can be electrically connected to the second device, thereby simplifying the structure of the pad.

[0023] In one possible embodiment, the mainboard includes a positive circuit and a negative circuit, the first solder pad is electrically connected to the positive circuit, the second solder pad is electrically connected to the negative circuit, and the first common solder pad is insulated from the mainboard; or, the first solder pad is electrically connected to the negative circuit, the second solder pad is electrically connected to the positive circuit, and the first common solder pad is insulated from the mainboard.

[0024] In this embodiment, by setting the first common pad to be insulated from the mainboard, the first common pad only serves as a fixed connection and does not serve as a conductive function, thereby avoiding short circuit when the first type of pad and the second type of pad are respectively connected to circuits of different polarities.

[0025] In one possible implementation, the second type of pads further includes a second common pad, the second common pad being spaced apart from the second pad and the first common pad, and the second common pad being used to simultaneously connect to the second device. The circuit board further includes a third type of pad, the third type of pad being formed on the surface of the mainboard and spaced apart from and parallel to the first type of pad, the third type of pad including a third pad and the second common pad, the third pad being spaced apart from the second common pad, and the second common pad and the third pad being used to simultaneously connect to the first device.

[0026] In this embodiment, a third type of pad is provided, and the third type of pad and the first type of pad can be simultaneously connected to the first device. In actual application, the third type of pad and the first type of pad can be electrically connected to the positive and negative electrodes of the first device, respectively, thereby forming a current loop between the first device and the mainboard, thereby achieving electrical connection between the first device and the mainboard. Furthermore, in this embodiment, a second common pad is provided, so that the second common pad serves as both a part of the second type of pad and a part of the third type of pad, thereby further reducing the pad area, saving space and material.

[0027] In one possible embodiment, there is a third gap between the first common pad and the second pad, and there is a fourth gap between the second pad and the second common pad; the total area of ​​the third gap and the third gap is less than or equal to 20% of the total area of ​​the first common pad, the second pad, the second common pad, the third gap and the fourth gap.

[0028] In this embodiment, the total area of ​​the second pad, the first common pad, and the second common pad is the actual welding area of ​​the second type pad. The total area of ​​the second pad, the first common pad, the second common pad, the third gap, and the fourth gap is the original area of ​​the second type pad. In this embodiment, the total area of ​​the third gap and the third gap is less than or equal to 20% of the total area of ​​the first common pad, the second pad, the second common pad, the third gap, and the fourth gap. That is, the welding area of ​​the second type pad is at least 80% of the original area of ​​the second type pad, thereby ensuring the strength of the welding between the spring and the second type pad.

[0029] In one possible embodiment, the area where the first pad and the first common pad are located is the first area, and the area where the second pad, the first common pad and the second common pad are located is the second area, and at least one of the length and width dimensions of the first area is different from the length dimension of the second area, or different from the width dimension of the second area.

[0030] In this embodiment, the first area and the second area have different sizes, so that the first area and the second area can adapt to springs of different sizes, so that the first type of pads and the second type of pads can be used to solder different electronic devices, thereby improving the applicability of the circuit board.

[0031] In one possible implementation, the third type of pads further includes a third common pad, the third common pad being spaced apart from the third pad and the second common pad, and the third common pad, the third pad, the third pad, and the second common pad being used to simultaneously connect to the first device. The circuit board further includes a fourth type of pad, the fourth type of pad being formed on the surface of the mainboard and spaced apart from and parallel to the second type of pad, the fourth type of pad including a fourth pad and the third common pad, the fourth pad being spaced apart from the third common pad, and the third common pad and the fourth pad being used to simultaneously connect to the second device.

[0032] In this embodiment, a fourth type of pad is provided, and the fourth type of pad and the second type of pad can be simultaneously connected to the second device. In actual application, the fourth type of pad and the second type of pad can be electrically connected to the positive and negative electrodes of the second device, respectively, thereby forming a current loop between the second device and the mainboard, thereby achieving electrical connection between the second device and the mainboard. Furthermore, in this embodiment, a third common pad is provided, so that the third common pad serves as both a part of the third type of pad and a part of the fourth type of pad, thereby further reducing the pad area, saving space and material.

[0033] In one possible embodiment, the main board includes a positive circuit and a negative circuit, the first common pad is electrically connected to the positive circuit, the third common pad is electrically connected to the negative circuit, and the first pad, the second pad, the third pad, the fourth pad and the third common pad are all insulated from the main board; or, the first common pad is electrically connected to the negative circuit, the third common pad is electrically connected to the positive circuit, and the first pad, the second pad, the third pad, the fourth pad and the third common pad are all insulated from the main board.

[0034] In this embodiment, by using the first common pad and the third common pad as electrical connection areas and other areas only as fixed connection areas, both the electrical connection between the first device and the mainboard and the electrical connection between the second device and the mainboard can be achieved, thereby simplifying the structure of the pads.

[0035] In one possible embodiment, the main board includes a positive circuit and a negative circuit, the first pad, the first common pad and the second pad are all electrically connected to the positive circuit, the third pad, the fourth pad and the third common pad are all electrically connected to the negative circuit, and the second common pad is insulated from the main board; or, the first pad, the first common pad and the second pad are all electrically connected to the negative circuit, the third pad, the fourth pad and the third common pad are all electrically connected to the positive circuit, and the second common pad is insulated from the main board.

[0036] In this embodiment, when the first device is connected to the first and third type pads, electrical connection to the mainboard is achieved through the first pad, the first common pad, and the third pad. When the second device is connected to the second and fourth type pads, electrical connection to the mainboard is achieved through the second pad, the first common pad, and the fourth pad. Furthermore, in this embodiment, by isolating the second common pad from the mainboard, short circuits can be avoided when the second and third type pads are connected to circuits of different polarities.

[0037] In one embodiment, the present application provides a circuit board assembly, including a spring clip and the above-mentioned circuit board, wherein the spring clip is a first spring clip or a second spring clip; when the spring clip is a first spring clip, the first spring clip is welded to the first solder pad and the first common solder pad; when the spring clip is a second spring clip, the second spring clip is welded to the second solder pad and the first common solder pad.

[0038] In this embodiment, the first common pad can be used to solder the first spring piece when used together with the first pad, and can be used to solder the second spring piece when used together with the second pad. In other words, the circuit board provided in this embodiment can be used to solder both the first spring piece and the second spring piece, thereby improving the utilization rate of the circuit board.

[0039] In one embodiment, the present application provides an electronic device, including an electronic device and the above-mentioned circuit board assembly, wherein the electronic device is a first device or a second device; when the spring clip is a first spring clip, the electronic device is a first device, and the first device is electrically connected to the first spring clip; when the spring clip is a second spring clip, the electronic device is a second device, and the second device is electrically connected to the second spring clip.

[0040] The circuit board in the electronic device provided in this embodiment can be welded with both the first spring piece and the second spring piece, so that the electronic device can select different first devices and second devices according to different usage scenarios, thereby improving the applicability of the electronic device, thereby improving the utilization rate of the circuit board components and saving costs.

[0041] In summary, the present application can save pad area by setting a first common pad, and the first common pad is used as both a part of the first type of pad and a part of the second type of pad. In addition, when the first common pad is used together with the first pad, it can be used to connect the first device. When the first common pad is used together with the second pad, it can be used to connect the second device. This allows the same motherboard to be electrically connected to two different electronic devices, improving the utilization rate of the motherboard and reducing costs. In addition, the first common pad is spaced apart from the first pad and the second pad, thereby avoiding large deviations in the welding position caused by solder floating during welding, improving the accuracy of the spring clip welding position, and ensuring the stability of the spring clip connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0043] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0044] FIG2 is a schematic diagram of a portion of the structure of the electronic device shown in FIG1 ;

[0045] FIG3 is a schematic structural diagram of a circuit board assembly in the electronic device shown in FIG1 in a first scenario;

[0046] FIG4 is a schematic structural diagram of the circuit board assembly shown in FIG3 in a second scenario;

[0047] FIG5 is a schematic structural diagram of a circuit board in the circuit board assembly shown in FIG3 ;

[0048] FIG6 is an enlarged structural diagram of the pads in the circuit board shown in FIG5 ;

[0049] FIG7 is a schematic diagram of a partial structure of a circuit board provided in a second embodiment of the present application;

[0050] FIG8 is a schematic diagram of a partial structure of a circuit board provided in a third embodiment of the present application;

[0051] FIG9 is a schematic diagram of a partial structure of a circuit board provided in the fourth embodiment of the present application. DETAILED DESCRIPTION

[0052] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0053] Please refer to Figures 1 and 2. Figure 1 is a structural diagram of an electronic device 500 provided in an embodiment of the present application, and Figure 2 is a partial structural diagram of the electronic device 500 shown in Figure 1.

[0054] The present application provides an electronic device 500. The electronic device 500 includes, but is not limited to, electronic products such as a cell phone, a notebook computer, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), or a wearable device. The following description assumes that the electronic device 500 is a cell phone.

[0055] The electronic device 500 includes a housing 300, a display screen 310, a circuit board assembly 200, and an electronic device 320. The display screen 310 is mounted on the housing 300 and encloses the housing 300 together to form a receiving space (not shown). The circuit board assembly 200 and the electronic device 320 are both located in the receiving space and fixedly connected to the housing 300, and the electronic device 320 is electrically connected to the circuit board assembly 200. In this embodiment, the electronic device 320 is a motor. In other embodiments, the electronic device 320 may also be a speaker or other electronic component. The electronic device 320 may be a first device (not shown) or a second device 320b. The electronic device 320 shown in Figure 2 is the second device 320b.

[0056] The first device includes a first body, a first circuit board, and a first electrode (not shown). The first circuit board is a flexible printed circuit (FPC). The first electrode includes a first positive electrode and a first negative electrode. The first positive electrode and the first negative electrode are arranged side by side and spaced apart, and the first positive electrode and the first negative electrode are both provided on the first circuit board and electrically connected to the first circuit board. The first circuit board is fixedly connected and electrically connected to the first body. The first electrode is used to electrically connect to the mainboard, thereby achieving electrical connection between the first device and the mainboard.

[0057] The second device 320b includes a second body 3201b, a second circuit board 3202b, and a second electrode (not shown). The second electrode includes a second positive electrode and a second negative electrode. The second positive electrode and the second negative electrode are arranged side by side and spaced apart, and the second positive electrode and the second negative electrode are both provided on the second circuit board 3202b and electrically connected to the second circuit board 3202b. The second circuit board 3202b is fixedly connected and electrically connected to the second body 3201b. The second electrode is used to electrically connect to the mainboard, thereby achieving electrical connection between the second device 320b and the mainboard.

[0058] The second device 320b and the first device can be the same type of electronic devices with different circuit board and electrode orientations, or they can be different types of electronic devices. In this embodiment, the second device 320b differs from the first device in that the first circuit board and the second circuit board 3202b are positioned differently relative to the first body, and the first and second electrodes are oriented differently. In this embodiment, the first and second circuit boards 3202b are mirror-symmetrical structures, and the first and second electrodes are mirror-symmetrical structures. That is, when the first and second devices 320b are mounted on the circuit board assembly 200, the first and second electrodes have different positions on the corresponding circuit boards.

[0059] Please refer to Figures 3 and 4. Figure 3 is a structural diagram of the circuit board assembly 200 in the electronic device 500 shown in Figure 1 in a first scenario, and Figure 4 is a structural diagram of the circuit board assembly 200 shown in Figure 3 in a second scenario.

[0060] The circuit board assembly 200 includes a circuit board 100 and a spring clip 110. The circuit board 100 includes a mainboard 101 and a solder pad 102. The solder pad 102 is disposed on the surface of the mainboard 101 and is electrically connected to the mainboard 101. The spring clip 110 is soldered to the solder pad 102 and is fixedly and electrically connected to the solder pad 102. The spring clip 110 is used to electrically connect to the electronic device 320 to achieve an electrical connection between the electronic device 320 and the mainboard 101. The spring clip 110 can be a first spring clip 110a or a second spring clip 110b.

[0061] As shown in Figure 3, in the first scenario, the electronic device 320 is the second device 320b, and the spring 110 is the second spring 110b. In this embodiment, the second spring 110b includes a second positive spring 1103 and a second negative spring 1104. The second positive spring 1103 and the second negative spring 1104 are both fixedly connected and electrically connected to the solder pad 102, and the second positive spring 1103 and the second negative spring 1104 are arranged side by side and spaced apart. The second positive spring 1103 is used to electrically connect to the second positive electrode of the second device 320b, and the second negative spring 1104 is used to electrically connect to the second negative electrode, thereby achieving electrical connection between the second device 320b and the motherboard 101.

[0062] As shown in Figure 4, in the second scenario, the electronic device 320 is a first device, and the spring 110 is a first spring 110a. In this embodiment, the first spring 110a includes a first positive spring 1101 and a first negative spring 1102. The first positive spring 1101 and the first negative spring 1102 are both fixedly connected and electrically connected to the solder pad 102, and the first positive spring 1101 and the first negative spring 1102 are arranged side by side and spaced apart. The first positive spring 1101 is used to electrically connect to the first positive electrode of the first device, and the first negative spring 1102 is used to electrically connect to the first negative electrode, thereby achieving electrical connection between the first device and the motherboard 101.

[0063] The structure of the circuit board 100 is described in detail below.

[0064] Please refer to FIG. 5 and FIG. 6 . FIG. 5 is a schematic structural diagram of the circuit board 100 in the circuit board assembly 200 shown in FIG. 3 , and FIG. 6 is an enlarged schematic structural diagram of the solder pad 102 in the circuit board 100 shown in FIG. 5 .

[0065] The circuit board 100 includes a mainboard 101 and a soldering pad 102. The soldering pad 102 is provided on the mainboard 101 and is fixedly connected and electrically connected to the mainboard 101. In this embodiment, the mainboard 101 is a printed circuit board (PCB). In other embodiments, the mainboard 101 may also be a flexible circuit board. The mainboard 101 includes a first surface 103 and a second surface 104. The first surface 103 and the second surface 104 are arranged opposite to each other. The mainboard 101 is provided with a mounting groove 105. The mounting groove 105 is provided on the side of the mainboard 101 and passes through the first surface 103 and the second surface 104. The mounting groove 105 is used to install the electronic device 320. The mainboard 101 is provided with a circuit. The circuit includes a positive circuit and a negative circuit (not shown). The soldering pad 102 is provided on the first surface 103 of the mainboard 101 and is electrically connected to the circuit of the mainboard 101.

[0066] The pads 102 include a first type of pad 10, a second type of pad 20, a third type of pad 30, and a fourth type of pad 40. The first type of pad 10 and the third type of pad 30 are arranged side by side and spaced apart. In this embodiment, the outer contours of the first type of pad 10 and the third type of pad 30 are both rectangular. In other embodiments, the outer contours of the first type of pad 10 and the third type of pad 30 may also be elliptical, circular, "convex" shaped, or other shapes. The first type of pad 10 and the third type of pad 30 are used to simultaneously connect to the first device. The second type of pad 20 and the fourth type of pad 40 are arranged side by side and spaced apart. In this embodiment, the outer contours of the second type of pad 20 and the fourth type of pad 40 are both "convex" shaped. In other embodiments, the outer contours of the second type of pad 20 and the fourth type of pad 40 may also be rectangular, elliptical, or other shapes. The second type of pad 20 and the fourth type of pad 40 are used to simultaneously connect to the second device 320b.

[0067] The first-type pad 10 includes a first pad 11 and a first common pad 1. The first common pad 1 includes a first side 1a and a second side 1b. The first pad 11 is located on the first side 1a. The first side 1a includes a first sub-side 106 and a second sub-side 108. The first pad 11 includes a first sub-pad 111 and a second sub-pad 112. The first sub-pad 111 is located on the first sub-side 106, and the second sub-pad 112 is located on the second sub-side 108. The first common pad 1 is located between the first sub-pad 111 and the second sub-pad 112, and is spaced apart from the first sub-pad 111 and the second sub-pad 112. A first gap is defined between the first pad 11 and the first common pad 1. The first gap includes a first sub-gap 13 and a second sub-gap 14. The first sub-gap 13 is the gap between the first sub-pad 111 and the first common pad 1. The width of the first sub-gap 13 is 0.15 mm to 0.25 mm. The second sub-gap 14 is the gap between the second sub-pad 112 and the first common pad 1. The width of the second sub-gap 14 is 0.15 mm to 0.25 mm. The first sub-gap 13 and the second sub-gap 14 surround the first side 1a of the first common pad 1. It can be understood that the first sub-gap 13 and the second sub-gap 14 separate the first-type pad 10 into the first sub-pad 111, the second sub-pad 112, and the first common pad 1.

[0068] The first pad 11 and the first common pad 1 are both made of solder. In this embodiment, the solder is tin. In other embodiments, the material of the solder may also be copper or silver. The first sub-gap 13 and the second sub-gap 14 are both filled with solder resist. In this embodiment, by providing a gap between the first pad 11 and the first common pad 1 and providing solder resist in the gap, the first pad 11 and the first common pad 1 can be isolated to prevent solder from flowing between the first pad 11 and the first common pad 1.

[0069] In this embodiment, the ratio of the total area of ​​the first pad 11 and the first common pad 1 to the total area of ​​the first pad 11, the first common pad 1, the first sub-gap 13, and the second sub-gap 14 is greater than or equal to 80%. That is, the total area of ​​the first sub-gap 13 and the second sub-gap 14 is less than or equal to 20% of the total area of ​​the first pad 11, the first common pad 1, the first sub-gap 13, and the second sub-gap 14. It will be understood that the total area of ​​the first pad 11, the first common pad 1, the first sub-gap 13, and the second sub-gap 14 is the original area of ​​the first-type pad 10, and the total area of ​​the first pad 11 and the first common pad 1 is the area occupied by the solder after the first-type pad 10 is separated, that is, the welding area. In this embodiment, by setting the welding area of ​​the first-type pad 10 to at least 80% of the original area of ​​the first-type pad 10, the strength of the welding can be guaranteed.

[0070] The second type of pad 20 includes a first common pad 1, a second common pad 2, and a second pad 21. The second pad 21 is located on the second side 1b of the first common pad 1 and is spaced apart from the first common pad 1. The second pad 21 includes a first extension 211 and a second extension 212. The first extension 211 and the second extension 212 are fixedly connected. The first common pad 1 and the second common pad 2 are arranged side by side and spaced apart along the length direction of the second type of pad 20. The second common pad 2 and the first extension 211 are arranged side by side along the width direction of the third type of pad 30. The second extension 212 is located between the first common pad 1 and the second common pad 2. A third gap 22 is defined between the second pad 21 and the first common pad 1. The width of the third gap 22 is 0.15 mm to 0.25 mm. A fourth gap 23 is defined between the second pad 21 and the second common pad 2. The width of the fourth gap 23 is 0.15 mm to 0.25 mm. It can be understood that the third gap 22 and the fourth gap 23 separate the second-type pad 20 into the second pad 21 , the first common pad 1 and the second common pad 2 .

[0071] The first common pad 1, the second common pad 2, and the second pad 21 are all filled with solder. The third gap 22 and the fourth gap 23 are both filled with solder resist. In this embodiment, by providing gaps between the second pad 21 and the first common pad 1 and the second common pad 2, and providing solder resist in the gaps, the second pad 21 can be isolated from the first common pad 1 and the second common pad 2, thereby preventing solder from flowing between the second pad 21 and the first common pad 1, or between the second pad 21 and the second common pad 2.

[0072] In this embodiment, the total area of ​​the second pad 21, the first common pad 1, and the second common pad 2 is the actual soldering area of ​​the second type pad 20. The total area of ​​the second pad 21, the first common pad 1, the second common pad 2, the third gap 22, and the fourth gap 23 is the original area of ​​the second type pad 20. In this embodiment, the soldering area of ​​the second type pad 20 is at least 80% of the original area of ​​the second type pad 20, thereby ensuring the strength of the soldering. In other words, the total area of ​​the third gap 22 and the fourth gap 23 is less than or equal to 20% of the total area of ​​the first common pad 1, the second pad 21, the second common pad 2, the third gap 22, and the fourth gap 23.

[0073] The length direction of the second type of pad 20 intersects with the length direction of the first type of pad 10. The first common pad 1 is a common pad for the first type of pad 10 and the second type of pad 20. That is to say, the first common pad 1 serves as both a part of the first type of pad 10 and a part of the second type of pad 20. The first common pad 1 and the first pad 11 are used to be connected to the first device at the same time. The first common pad 1, the second common pad 2 and the second pad 21 are used to be connected to the second device 320b at the same time. In this embodiment, by providing the first common pad 1, and the first common pad 1 serving as both a part of the first type of pad 10 and a part of the second type of pad 20, the area of ​​the pad 102 can be saved.

[0074] The area where the first pad 11 and the first common pad 1 are located is the first area, and the area where the second pad 21, the first common pad 1, and the second common pad 2 are located is the second area. In this embodiment, the first area and the second area have different lengths and widths. In other embodiments, the first area and the second area may have different lengths and the same width, or they may have the same width and different lengths.

[0075] Continuing with Figure 6, the third type of pads 30 includes a third pad 31, a second common pad 2, and a third common pad 3. The third pad 31 includes a seventh sub-pad 311 and an eighth sub-pad 312. The seventh sub-pad 311, the third common pad 3, the eighth sub-pad 312, and the second common pad 2 are spaced apart along the length of the third type of pads 30. A first gap 32 is defined between the seventh sub-pad 311 and the third common pad 3. The width of the first gap 32 is 0.15 mm to 0.25 mm. A second gap 33 is defined between the eighth sub-pad 312 and the third common pad 3. The width of the second gap 33 is 0.15 mm to 0.25 mm. A third gap 34 is defined between the second common pad 2 and the third common pad 3 and the eighth sub-pad 312. The width of the third gap 34 is 0.15 mm to 0.25 mm. It can be understood that the first gap 32 , the second gap 33 and the third gap 34 separate the third type pad 30 into four parts: the seventh sub-pad 311 , the second common pad 2 , the eighth sub-pad 312 and the third common pad 3 .

[0076] The third pad 31, the second common pad 2, and the third common pad 3 are all filled with solder. The first gap 32, the second gap 33, and the third gap 34 are all filled with solder resist. In this embodiment, by providing gaps between the third pad 31, the second common pad 2, and the third common pad 3, and providing solder resist in the gaps, the third pad 31, the second common pad 2, and the third common pad 3 are isolated, preventing solder from flowing between any two adjacent areas of the third pad 31, the second common pad 2, and the third common pad 3.

[0077] In this embodiment, the total area of ​​the third pad 31, the second common pad 2, and the third common pad 3 is the actual soldering area of ​​the third type pad 30. The total area of ​​the third pad 31, the second common pad 2, the third common pad 3, the first gap 32, the second gap 33, and the third gap 34 is the original area of ​​the third type pad 30. In this embodiment, the soldering area of ​​the third type pad 30 is at least 80% of the original area of ​​the third type pad 30, thereby ensuring the strength of the soldering. In other words, the total area of ​​the first gap 32, the second gap 33, and the third gap 34 is less than or equal to 20% of the total area of ​​the third pad 31, the second common pad 2, the third common pad 3, the first gap 32, the second gap 33, and the third gap 34.

[0078] As shown in Figure 6, the length direction of the third type of pad 30 is parallel to the length direction of the first type of pad 10, and is arranged side by side and at intervals with the first type of pad 10. The length direction of the third type of pad 30 intersects with the length direction of the second type of pad 20. Among them, the second common pad 2 is a common pad 102 for the second type of pad 20 and the third type of pad 30. In other words, the second common pad 2 serves as both a part of the second type of pad 20 and a part of the third type of pad 30. The second common pad 2, the first common pad 1 and the second pad 21 are used to connect to the second device 320b at the same time. The second common pad 2, the third common pad 3 and the third pad 31 are used to connect to the first device at the same time. In this embodiment, by providing the second common pad 102, and the second common pad 102 serving as a part of the second type of pad 20 and the third type of pad 30 at the same time, the area of ​​the pad 102 can be saved.

[0079] The fourth type of pad 40 includes a third common pad 3 and a fourth pad 41. The fourth pad 41 includes a fifth sub-pad 411 and a sixth sub-pad 412. The fifth sub-pad 411, the third common pad 3, and the sixth sub-pad 412 are spaced apart along the length of the fourth type of pad 40, with the third common pad 3 located between the fifth sub-pad 411 and the sixth sub-pad 412. A fourth gap 42 is defined between the fifth sub-pad 411 and the third common pad 3. The width of the fourth gap 42 ranges from 0.15 mm to 0.25 mm. A fifth gap 43 is defined between the sixth sub-pad 412 and the third common pad 3. The width of the fifth gap 43 ranges from 0.15 mm to 0.25 mm.

[0080] The third common pad 3 and the fourth pad 41 are both filled with solder. The space between the fourth gap 42 and the fifth gap 43 is filled with solder resist. In this embodiment, by providing a gap between the fourth pad 41 and the third common pad 3 and placing solder resist in the gap, the fourth pad 41 and the third common pad 3 are isolated, preventing solder from flowing between the fourth pad 41 and the third common pad 3.

[0081] In this embodiment, the total area of ​​the fourth pad 41 and the third common pad 3 is the actual soldering area of ​​the fourth type pad 40. The total area of ​​the fourth pad 41, the third common pad 3, the fourth gap 42, and the fifth gap 43 is the original area of ​​the fourth type pad 40. In this embodiment, the soldering area of ​​the fourth type pad 40 is at least 80% of the original area of ​​the fourth type pad 40, thereby ensuring the strength of the soldering. In other words, the total area of ​​the fourth gap 42 and the fifth gap 43 is less than or equal to 20% of the total area of ​​the fourth pad 41, the third common pad 3, the fourth gap 42, and the fifth gap 43.

[0082] The length direction of the fourth type of pad 40 is parallel to the length direction of the second type of pad 20, and is arranged side by side and at intervals with the second type of pad 20. The length direction of the fourth type of pad 40 intersects with the length direction of the third type of pad 30. Among them, the third common pad 3 is a common pad 102 for the third type of pad 30 and the fourth type of pad 40. In other words, the third common pad 3 serves as both a part of the third type of pad 30 and a part of the fourth type of pad 40. The third common pad 3 and the fourth pad 41 are used to connect to the second device 320b at the same time. The third common pad 3, the second common pad 2 and the third pad 31 are used to connect to the first device at the same time. In this embodiment, by providing the third common pad 3, and the third common pad 3 serving as both a part of the third type of pad 30 and the fourth type of pad 40, the area of ​​the pad 102 can be saved.

[0083] The first type pad 10 and the third type pad 30 are used to connect to the first device at the same time. In this case, the second pad 21 and the fourth pad 41 are left vacant. The second type pad 20 and the fourth type pad 40 are used to connect to the second device 320b at the same time. In this case, the first pad 11 and the third pad 31 are left vacant. This embodiment can be implemented as follows.

[0084] In the first embodiment, the first sub-pad 111, the second sub-pad 112, the first common pad 1, and the second pad 21 are all electrically connected to the positive circuit of the mainboard 101, serving as the positive electrode of the mainboard 101. The seventh sub-pad 311, the eighth sub-pad 312, the fifth sub-pad 411, the sixth sub-pad 412, and the third common pad 3 are all electrically connected to the negative circuit of the mainboard 101, serving as the negative electrode of the mainboard 101. The second common pad 2 is insulated from the mainboard 101 and is neither electrically connected to the positive circuit nor to the negative circuit of the mainboard 101. In other words, the second common pad 2 serves as a fixed connection and does not serve as either the positive or negative electrode of the mainboard 101.

[0085] Please refer to Figures 4 and 6 together. When the electronic device 320 is the first device, the spring 110 is the first spring 110a. The first positive spring 1101 is soldered to the first type pad 10, and the first negative spring 1102 is soldered to the third type pad 30. The first positive electrode of the first device is electrically connected to the first positive spring 1101, and the first negative electrode is electrically connected to the first negative spring 1102. The first positive spring 1101 is simultaneously soldered to the first sub-pad 111, the first common pad 1, and the second sub-pad 112 of the first type pad 10. The positive circuit of the motherboard 101 is simultaneously connected to the first positive spring 1101 through the first sub-pad 111, the second sub-pad 112, and the first common pad 1, thereby connecting to the first positive electrode of the first device. The first negative spring 1102 is simultaneously soldered to the seventh sub-pad 311, the eighth sub-pad 312, the second common pad 2, and the third common pad 3 of the third type pad 30. The negative circuit of the mainboard 101 is simultaneously connected to the first negative spring 1102 through the seventh sub-pad 311, the eighth sub-pad 312 and the third common pad 3, thereby being connected to the first negative electrode of the first device, thereby realizing electrical connection between the first device and the mainboard 101.

[0086] Please refer to Figures 3 and 6 together. When the electronic device 320 is the second device 320b, the spring 110 is the second spring 110b. The second positive spring 1103 is soldered to the second type pad 20, and the second negative spring 1104 is soldered to the fourth type pad 40. The second positive electrode of the second device 320b is electrically connected to the second positive spring 1103, and the second negative electrode is electrically connected to the second negative spring 1104. The second positive spring 1103 is simultaneously soldered to the first common pad 1, the second common pad 21, and the second common pad 2 of the second type pad 20. The positive circuit of the motherboard 101 is simultaneously connected to the second positive spring 1103 through the first common pad 1 and the second pad 21, thereby connecting to the second positive electrode of the second device 320b. The second negative spring 1104 is simultaneously soldered to the fifth sub-pad 411, the third common pad 3, and the sixth sub-pad 412 of the fourth type pad 40. The negative circuit of the mainboard 101 is simultaneously connected to the second negative spring 1104 through the fifth sub-pad 411, the third common pad 3 and the sixth sub-pad 412, thereby being connected to the second negative electrode of the second device 320b, thereby realizing electrical connection between the second device 320b and the mainboard 101.

[0087] In this embodiment, by providing a first common pad 1, a second common pad 2, and a third common pad 3, and the first type of pad 10 and the second type of pad 20 share the first common pad 1, the second type of pad 20 and the third type of pad 30 share the second common pad 2, and the third type of pad 30 and the fourth type of pad 40 share the third common pad 3, and the pad 102 is divided, so that the pad 102 can be welded with two different springs 110, thereby achieving electrical connection between the same motherboard 101 and two different electronic devices 320, reducing the area of ​​the pad 102, and improving the utilization rate of the motherboard 101, thereby reducing costs. In addition, each type of pad 102 has approximately the same area as the corresponding spring 110, and the pads 102 are separated, so that the solder floating during welding can be avoided, resulting in a large deviation in the welding position, improving the accuracy of the welding position of the spring 110, and ensuring the stability of the spring connection of the spring 110.

[0088] At the same time, in this embodiment, by setting the second common pad 2 to be insulated from the main board 101, the second common pad 2 only plays a fixed connection role and does not play a conductive role, thereby avoiding the second common pad 2 from short-circuiting when the second type of pad 20 is electrically connected to the positive circuit and the third type of pad 30 is electrically connected to the negative circuit.

[0089] In the second embodiment, this embodiment differs from the first embodiment in that the first sub-pad 111, the second sub-pad 112, the first common pad 1, and the second pad 21 are all electrically connected to the negative circuit of the mainboard 101, serving as the negative electrode of the mainboard 101. The seventh sub-pad 311, the eighth sub-pad 312, the fifth sub-pad 411, the sixth sub-pad 412, and the third common pad 3 are all electrically connected to the positive circuit of the mainboard 101, serving as the positive electrode of the mainboard 101. The second common pad 2 is insulated from the mainboard 101. When the electronic device 320 is the first device, the first positive spring 1101 is welded to the third type of pad 30, and the first negative spring 1102 is welded to the first type of pad 10. When the electronic device 320 is the second device 320b, the second positive spring 1103 is welded to the fourth type of pad 40, and the second negative spring 1104 is welded to the second type of pad 20.

[0090] In the third embodiment, the first common pad 1 is electrically connected to the positive circuit of the mainboard 101, serving as the positive electrode of the mainboard 101. The third common pad 3 is electrically connected to the negative circuit of the mainboard 101, serving as the negative electrode of the mainboard 101. The first pad 11, second pad 21, third pad 31, fourth pad 41, and second common pad 2 are all insulated from the mainboard 101 and serve neither as the positive nor the negative electrode of the mainboard 101, but rather as a fixed connection.

[0091] When electronic device 320 is a first device, first positive spring clip 1101 is soldered to first-type pad 10, and first negative spring clip 1102 is soldered to third-type pad 30. The positive circuit of motherboard 101 is electrically connected to first positive spring clip 1101 via first common pad 1, thereby electrically connecting to the first positive terminal of the first device. The negative circuit of motherboard 101 is electrically connected to first negative spring clip 1102 via third common pad 3, thereby electrically connecting to the first negative terminal of the first device, thereby establishing an electrical connection between the first device and motherboard 101.

[0092] When the electronic device 320 is the second device 320b, the second positive spring clip 1103 is soldered to the second type of pad 20, and the second negative spring clip 1104 is soldered to the fourth type of pad 40. The positive circuit of the motherboard 101 is electrically connected to the second positive spring clip 1103 via the first common pad 1, thereby electrically connecting to the second positive electrode of the second device 320b. The negative circuit of the motherboard 101 is electrically connected to the second negative spring clip 1104 via the third common pad 3, thereby electrically connecting to the second negative electrode of the second device 320b, thereby achieving electrical connection between the second device 320b and the motherboard 101.

[0093] In this embodiment, by using the first common pad 1 and the third common pad 3 as electrical connection areas and other areas only as fixed connection areas, the first common pad 1 can electrically connect the first positive spring clip 1101 to the main board 101, and the second positive spring clip 1103 to the main board 101, and the third common pad 3 can electrically connect the first negative spring clip 1102 to the main board 101, and the second negative spring clip 1104 to the main board 101, thereby simplifying the structure of the pad 102.

[0094] In the fourth embodiment, this embodiment differs from the third embodiment in that the first common pad 1 is electrically connected to the negative circuit of the mainboard 101, serving as the negative electrode of the mainboard 101. The third common pad 3 is electrically connected to the positive circuit of the mainboard 101, serving as the positive electrode of the mainboard 101. The first pad 11, second pad 21, third pad 31, fourth pad 41, and second common pad 2 are all insulated from the mainboard 101. When the electronic device 320 is a first device, the first positive spring 1101 is welded to the third type of pad 30, and the first negative spring 1102 is welded to the first type of pad 10. When the electronic device 320 is a second device 320b, the second positive spring 1103 is welded to the fourth type of pad 40, and the second negative spring 1104 is welded to the second type of pad 20.

[0095] Please refer to FIG. 7 , which is a schematic diagram of a partial structure of a circuit board 100 provided in a second embodiment of the present application.

[0096] The difference between this embodiment and the embodiment shown in Figure 5 is that the pad 102 includes a first type of pad 10 and a second type of pad 20. The first type of pad 10 includes a first pad 11 and a first common pad 1. The second type of pad 20 includes a first common pad 1 and a second pad 21. The length direction of the first type of pad 10 is parallel to the length direction of the second type of pad 20. The first common pad 1 includes a first side 1a and a second side 1b, and the first side 1a and the second side 1b are arranged opposite to each other. The first pad 11, the first common pad 1 and the second pad 21 are arranged side by side and spaced apart along the length direction of the first type of pad 10, and the first common pad 1 is located between the first pad 11 and the second pad 21. The first pad 11 is located on the first side 1a, and the second pad 21 is located on the second side 1b. That is, the first pad 11, the first common pad 1 and the second pad 21 are arranged in a straight line. The width of the gap between the first common pad 1 and the first pad 11 is 0.15 mm to 0.25 mm, and the width of the gap between the first common pad 1 and the second pad 21 is 0.15 mm to 0.25 mm. The gap between the first common pad 1 and the first pad 11, and the gap between the first common pad 1 and the second pad 21 are filled with solder resist to isolate the first common pad 1 from the first pad 11 and the second pad 21, and to prevent solder from flowing between the first common pad 1 and the first pad 11, and between the first common pad 1 and the second pad 21.

[0097] The first pad 11 and the first common pad 1 are used to connect to the first device at the same time, and the second pad 21 is vacant. The second pad 21 and the first common pad 1 are used to connect to the second device 320b at the same time, and the first pad 11 is vacant. This embodiment can be implemented as follows.

[0098] In the first embodiment, the first pad 11, the first common pad 1, and the second pad 21 are all electrically connected to the positive circuit of the mainboard 101, serving as the positive electrode of the mainboard 101. When the electronic device 320 is a first device, the first positive spring 1101 is simultaneously welded and electrically connected to the first pad 11 and the first common pad 1. The first positive electrode of the first device is electrically conductive to the first positive spring 1101, thereby achieving an electrical connection between the first device and the mainboard 101. When the electronic device 320 is a second device 320b, the second positive spring 1103 is simultaneously welded and electrically connected to the second pad 21 and the first common pad 1. The second positive electrode of the second device 320b is electrically conductive to the second negative spring 1104, thereby achieving an electrical connection between the second device 320b and the mainboard 101.

[0099] In this embodiment, by providing a first common pad 1, and the first common pad 1 serves as both a part of the first type of pad 10 and a part of the second type of pad 20, the area of ​​the pad 102 can be saved. In addition, when the first common pad 1 is used together with the first pad 11, it can be used to connect the first device. When the first common pad 1 is used together with the second pad 21, it can be used to connect the second device 320b. This allows the same motherboard 101 to be electrically connected to two different electronic devices 320, thereby improving the utilization rate of the motherboard 101 and reducing costs. In addition, the first common pad 1 is spaced apart from the first pad 11 and the second pad 21, thereby avoiding large deviations in the welding position caused by solder floating during welding, improving the accuracy of the welding position of the spring clip 110, and ensuring the stability of the spring connection of the spring clip 110.

[0100] In the second embodiment, this embodiment differs from the first embodiment in that the first pad 11, the first common pad 1, and the second pad 21 are all electrically connected to the negative circuit of the mainboard 101, serving as the negative electrode of the mainboard 101. When the electronic device 320 is the first device, the first negative spring 1102 is simultaneously welded and electrically connected to the first pad 11 and the first common pad 1. When the electronic device 320 is the second device 320b, the second negative spring 1104 is simultaneously welded and electrically connected to the second pad 21 and the first common pad 1.

[0101] In the third embodiment, the first common pad 1 is electrically connected to the positive circuit of the mainboard 101, serving as the positive electrode of the mainboard 101. The first pad 11 and the second pad 21 are both insulated from the mainboard 101. When the electronic device 320 is a first device, the first positive spring 1101 is welded to the first-type pad 10 and electrically connected to the first common pad 1, thereby establishing electrical connection between the mainboard 101 and the first positive electrode of the first device. When the electronic device 320 is a second device 320b, the second positive spring 1103 is welded to the second-type pad 20 and electrically connected to the first common pad 1, thereby establishing electrical connection between the mainboard 101 and the second positive electrode of the second device 320b.

[0102] In the fourth embodiment, the difference between this embodiment and the third embodiment is that the first common pad 1 is electrically connected to the negative circuit of the mainboard 101 and serves as the negative electrode of the mainboard 101. The first pad 11 and the second pad 21 are both insulated from the mainboard 101.

[0103] In the fifth embodiment, the first solder pad 11 is electrically connected to the positive circuit of the mainboard 101, serving as the positive electrode of the mainboard 101. The second solder pad 21 is electrically connected to the negative circuit of the mainboard 101, serving as the negative electrode of the mainboard 101. The first common solder pad 1 is insulated from the mainboard 101. When the electronic device 320 is a first device, the first positive spring 1101 is welded to the first solder pad 11 and the first common solder pad 1, and is electrically connected to the first solder pad 11. The first positive electrode of the first device is electrically connected to the first positive spring 1101, thereby achieving electrical connection between the first device and the mainboard 101. When the electronic device 320 is a second device 320b, the second negative spring 1104 is welded to the second solder pad 21 and the second common solder pad 2, and is electrically connected to the second solder pad 21. The second negative electrode of the second device 320b is electrically connected to the second negative spring 1104, thereby achieving electrical connection between the second device 320b and the mainboard 101.

[0104] In other embodiments, the first solder pad 11 may be electrically connected to the negative circuit of the mainboard 101, the second solder pad 21 may be electrically connected to the positive circuit of the mainboard 101, and the first common dry pad may be insulated from the mainboard 101. In short, when the polarities of the first solder pad 11 and the second solder pad 21 are different, the first common solder pad 11 and the mainboard 101 may be insulated.

[0105] Please refer to FIG. 8 , which is a schematic diagram of a partial structure of a circuit board 100 provided in a third embodiment of the present application.

[0106] The difference between this embodiment and the second embodiment is that, in this embodiment, the length direction of the first type of pad 10 intersects with the length direction of the second type of pad 20. The first type of pad 10 includes a first sub-pad 111 and a second sub-pad 112. The first common pad 1 includes a first side 1a and a second side 1b. The first side 1a includes a first sub-side 106 and a second sub-side 108. The first sub-pad 111 is located on the first sub-side 106, and the second sub-pad 112 is located on the second sub-side 108. Along the length direction of the first type of pad 10, the first sub-pad 111, the first common pad 1, and the second sub-pad 112 are arranged side by side and spaced apart. The second pad 21 is located on the second side 1b of the first common pad 1, and is arranged side by side with the first common pad 1 and spaced apart.

[0107] The first sub-pad 111, the first common pad 1, and the second sub-pad 112 are used to simultaneously connect to the first device, and the second pad 21 and the first common pad 1 are used to simultaneously connect to the second device 320b. In one embodiment, the first sub-pad 111, the second sub-pad 112, the first common pad 1, and the second pad 21 are all electrically connected to the positive circuit of the mainboard 101. When the electronic device 320 is the first device, the first positive spring 1101 is simultaneously welded and electrically connected to the first sub-pad 111, the first common pad 1, and the second sub-pad 112. The first positive spring 1101 is electrically connected to the first positive electrode of the first device, thereby realizing the electrical connection between the first device and the mainboard 101. When the electronic device 320 is the second device 320b, the second positive spring 1103 is simultaneously welded and electrically connected to the second pad 21 and the first common pad 1. The second positive elastic piece 1103 is electrically connected to the second positive electrode of the second device 320 b , thereby achieving electrical connection between the second device 320 b and the mainboard 101 .

[0108] In other embodiments, the first sub-pad 111, the second sub-pad 112, the first common pad 1, and the second pad 21 may all be electrically connected to the negative circuit of the mainboard 101. Alternatively, the first common pad 1 is electrically connected to the positive circuit or the negative circuit of the mainboard 101, and the first sub-pad 111, the second sub-pad 112, and the second pad 21 are insulated from the mainboard 101. Alternatively, the first sub-pad 111 and the second sub-pad 112 are both electrically connected to the positive circuit of the mainboard 101, the second pad 21 is electrically connected to the negative circuit of the mainboard 101, the first common pad 1 is insulated from the mainboard 101, the first type of pad 10 is used to connect to the first positive spring clip 1101, and the second type of pad 20 is used to connect to the second negative spring clip 1104. Alternatively, the second sub-pad 112 and the second sub-pad 112 are both electrically connected to the negative circuit of the main board 101, the second pad 21 is electrically connected to the positive circuit of the main board 101, the first common pad 1 is insulated from the main board 101, the first type of pad 10 is used to connect to the first negative spring clip 1102, and the second type of pad 20 is used to connect to the second positive spring clip 1103.

[0109] In this embodiment, by providing a first common pad 1, and the first common pad 1 serves as both a part of the first type of pad 10 and a part of the second type of pad 20, the area of ​​the pad 102 can be saved. In addition, when the first common pad 1 is used together with the first pad 11, it can be used to connect the first device. When the first common pad 1 is used together with the second pad 21, it can be used to connect the second device 320b. This allows the same motherboard 101 to be electrically connected to two different electronic devices 320, thereby improving the utilization rate of the motherboard 101 and reducing costs. At the same time, in this embodiment, the length direction of the first type of pad 10 and the length direction of the second type of pad 20 intersect, so that the pad 102 can be used for two different electronic devices 320, thereby improving the utilization rate of the circuit board 100.

[0110] Please refer to FIG. 9 , which is a schematic diagram of a partial structure of a circuit board 100 provided in a fourth embodiment of the present application.

[0111] The difference between this embodiment and the third embodiment is that, in this embodiment, the second pad 21 includes a third sub-pad 213 and a fourth sub-pad 214. The length direction of the first type of pad 10 intersects with the length direction of the second type of pad 20, together forming an "X"-shaped structure. Among them, the first common pad 1 is a parallelogram. The first common pad 1 includes a first side 1a and a second side 1b. The first side 1a includes a first sub-side 106 and a second sub-side 108. The second side 1b includes a third sub-side 107 and a fourth sub-side 109. The first sub-side 106, the third sub-side 107, the second sub-side 108 and the fourth sub-side 109 are connected end to end. The first sub-side 106 and the second sub-side 108 are arranged opposite to each other, and the third sub-side 107 and the fourth sub-side 109 are arranged opposite to each other. The seventh sub-pad 311, the first common pad 1, and the second sub-pad 112 are arranged side by side and spaced apart. The first sub-pad 111 is located on a side of the first common pad 1 close to the first sub-side 106 and spaced apart from the first sub-side 106. The second sub-pad 112 is located on a side close to the second sub-side 108 and spaced apart from the second sub-side 108. The third sub-pad 213, the first common pad 1, and the fourth sub-pad 214 are arranged side by side and spaced apart. The third sub-pad 213 is located on a side of the first common pad 1 close to the third sub-side 107 and spaced apart from the third sub-side 107. The fourth sub-pad 214 is located on a side close to the fourth sub-side 109 and spaced apart from the fourth sub-side 109.

[0112] The first sub-pad 111, the first common pad 1, and the second sub-pad 112 are used to simultaneously connect to the first device. In this case, the third sub-pad 213 and the fourth sub-pad 214 are left vacant. The third sub-pad 213, the fourth sub-pad 214, and the first common pad 1 are used to simultaneously connect to the second device 320b. In this case, the first sub-pad 111 and the second sub-pad 112 are left vacant.

[0113] In this embodiment, by providing a first common pad 1, which serves as both a part of the first type of pad 10 and a part of the second type of pad 20, the area of ​​the pad 102 can be reduced. Furthermore, when used together with the first pad 11, the first common pad 1 can be used to connect the first device. When used together with the second pad 21, the first common pad 1 can be used to connect the second device 320b. This allows the same motherboard 101 to be electrically connected to two different electronic devices 320, improving the utilization of the motherboard 101 and reducing costs. Furthermore, in this embodiment, the length directions of the first type of pad 10 and the second type of pad 20 intersect, allowing the pad 102 to be used for two different electronic devices 320, thereby improving the utilization of the circuit board 100. Furthermore, the first common pad 1 is spaced apart from the first pad 11 and the second pad 21, thereby preventing solder from floating during soldering, resulting in large deviations in the soldering position. This improves the accuracy of the soldering position of the spring clip 110 and ensures the stability of the spring clip 110's connection.

[0114] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A circuit board, wherein the circuit board is used to set a first device or a second device, characterized in that: The circuit board includes a main board, a first type of soldering pad and a second type of soldering pad; The first type of soldering pads and the second type of soldering pads are both formed on the surface of the mainboard and electrically connected to the mainboard; The first type of pads includes a first pad and a first common pad, and the second type of pads includes a second pad and the first common pad; the first common pad includes a first side and a second side, the first pad and the second pad are located on the first side and the second side, respectively, and are spaced apart from the first common pad; The first pad and the first common pad are used to simultaneously connect to the first device, and the second pad and the first common pad are used to simultaneously connect to the second device.

2. The circuit board according to claim 1, wherein: When the first pad and the first common pad are used to simultaneously connect to a first device, the second pad is left vacant; when the second pad and the first common pad are used to simultaneously connect to a second device, the first pad is left vacant.

3. The circuit board according to claim 1, wherein: A first gap is defined between the first pad and the first common pad, and an area of ​​the first gap is less than or equal to 20% of a total area of ​​the first pad, the first gap, and the first common pad.

4. The circuit board according to claim 3, wherein: The width of the first gap is 0.15 mm to 0.25 mm.

5. The circuit board according to claim 4, characterized in that The surface of the mainboard is provided with solder resist oil, and the solder resist oil is located in the first gap.

6. The circuit board according to any one of claims 1 to 5, characterized in that: The length direction of the first type of pads intersects with the length direction of the second type of pads.

7. The circuit board according to claim 6, wherein: The first pad includes a first sub-pad and a second sub-pad. Along the length direction of the first type of pad, the first sub-pad, the first common pad and the second sub-pad are arranged side by side and spaced apart, and the first common pad is located between the first sub-pad and the second sub-pad. The first side includes a first sub-side and a second sub-side. The first sub-pad is located on the first sub-side and the second sub-pad is located on the second sub-side.

8. The circuit board according to claim 7, wherein: The second pad includes a third sub-pad and a fourth sub-pad. Along the length direction of the second type of pad, the third sub-pad, the first common pad and the fourth sub-pad are arranged side by side and at intervals, and the first common pad is located between the third sub-pad and the fourth sub-pad. The second side includes a third sub-side and a fourth sub-side. The third sub-pad is located on the third sub-side, and the fourth sub-pad is located on the fourth sub-side.

9. The circuit board according to any one of claims 1 to 5, characterized in that: The length direction of the first type of pad is parallel to the length direction of the second type of pad; along the length direction of the first type of pad, the first pad, the first common pad and the second pad are arranged side by side and spaced apart, and the first common pad is located between the first pad and the second pad.

10. The circuit board according to any one of claims 1 to 5, characterized in that: The mainboard includes a positive circuit and a negative circuit, the first common pad is electrically connected to the positive circuit, and the first pad and the second pad are both insulated from the mainboard; or, the first common pad is electrically connected to the negative circuit, and the first pad and the second pad are both insulated from the mainboard.

11. The circuit board according to any one of claims 1 to 5, characterized in that: The mainboard includes a positive circuit and a negative circuit, the first solder pad is electrically connected to the positive circuit, the second solder pad is electrically connected to the negative circuit, and the first common solder pad is insulated from the mainboard; or, the first solder pad is electrically connected to the negative circuit, the second solder pad is electrically connected to the positive circuit, and the first common solder pad is insulated from the mainboard.

12. The circuit board according to any one of claims 1 to 5, characterized in that: The second type of pads further includes a second common pad, the second common pad is spaced apart from the second pad and the first common pad, and the second common pad, the second pad and the first common pad are used to simultaneously connect to the second device; The circuit board also includes a third type of solder pad, which is formed on the surface of the main board and is arranged side by side and spaced apart from the first type of solder pad. The third type of solder pad includes a third solder pad and the second common solder pad, and the third solder pad is spaced apart from the second common solder pad. The second common solder pad and the third solder pad are used to simultaneously connect the first device.

13. The circuit board according to claim 12, wherein: There is a third gap between the first common pad and the second pad, and there is a fourth gap between the second pad and the second common pad; the total area of ​​the third gap and the third gap is less than or equal to 20% of the total area of ​​the first common pad, the second pad, the second common pad, the third gap and the fourth gap.

14. The circuit board according to claim 12, wherein: The area where the first pad and the first common pad are located is the first area, and the area where the second pad, the first common pad and the second common pad are located is the second area, and at least one of the length and width dimensions of the first area is different from the length dimension of the second area, or different from the width dimension of the second area.

15. The circuit board according to claim 12, wherein: The third type of pads further includes a third common pad, the third common pad is spaced apart from the third pad and the second common pad, and the third common pad, the third pad and the second common pad are used to connect to the first device at the same time; The circuit board also includes a fourth type of solder pad, which is formed on the surface of the main board and is arranged side by side and spaced apart from the second type of solder pad. The fourth type of solder pad includes a fourth solder pad and the third common solder pad, and the fourth solder pad is spaced apart from the third common solder pad. The third common solder pad and the fourth solder pad are used to simultaneously connect the second device.

16. The circuit board according to claim 15, characterized in that The mainboard includes a positive circuit and a negative circuit, the first common pad is electrically connected to the positive circuit, the third common pad is electrically connected to the negative circuit, and the first pad, the second pad, the third pad, the fourth pad and the third common pad are all insulated from the mainboard; or, the first common pad is electrically connected to the negative circuit, the third common pad is electrically connected to the positive circuit, and the first pad, the second pad, the third pad, the fourth pad and the third common pad are all insulated from the mainboard.

17. The circuit board according to claim 15, wherein: The main board includes a positive circuit and a negative circuit, the first solder pad, the first common solder pad and the second solder pad are all electrically connected to the positive circuit, the third solder pad, the fourth solder pad and the third common solder pad are all electrically connected to the negative circuit, and the second common solder pad is insulated from the main board; or, the first solder pad, the first common solder pad and the second solder pad are all electrically connected to the negative circuit, the third solder pad, the fourth solder pad and the third common solder pad are all electrically connected to the positive circuit, and the second common solder pad is insulated from the main board.

18. A circuit board assembly, characterized in that: It includes a spring piece and a circuit board as described in any one of claims 1 to 17, wherein the spring piece is a first spring piece or a second spring piece; when the spring piece is the first spring piece, the first spring piece is welded to the first solder pad and the first common solder pad; when the spring piece is the second spring piece, the second spring piece is welded to the second solder pad and the first common solder pad.

19. An electronic device, characterized in that: It includes an electronic device and a circuit board assembly as described in claim 18, wherein the electronic device is a first device or a second device; when the spring clip is a first spring clip, the electronic device is a first device, and the first device is electrically connected to the first spring clip; when the spring clip is a second spring clip, the electronic device is a second device, and the second device is electrically connected to the second spring clip.

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