Selective wave crest automatic soldering machine

Abstract

The invention provides a selective wave crest automatic soldering machine which comprises a platform, and a bearing mechanism used for bearing products, a soldering aid mechanism used for containing soldering flux and a selective wave crest tin furnace are sequentially arranged on the platform. The bearing mechanism comprises a supporting frame arranged on the platform and a bearing plate arranged on the supporting frame, the bearing plate is detachably installed on the supporting frame, a jig used for bearing a product is arranged on the bearing plate, the jig is detachably installed on the bearing plate, a plurality of installation holes used for installing the jig are formed in the bearing plate, and the jig is arranged in the installation holes. The platform is provided with a grabbing moving mechanism used for driving the bearing plate to move. The selective wave crest automatic tin soldering machine can be suitable for magnet ring type common mode inductor tin burning, has the advantages of being good in applicability and easy and convenient to operate, and can improve the tin soldering efficiency of batch products and isolate tin particles from polluting the products while ensuring the machining precision and the machining quality.

Description

Technical Field

[0001] The invention belongs to the technical field of soldering machines, and in particular relates to a selective wave crest automatic soldering machine. Background Art

[0002] In the field of electronic product processing, various processing equipment is often used, and soldering machines are one of the more important pieces of equipment. Soldering machines mainly include dip soldering machines and wave soldering machines. The existing Chinese invention patent application number 201410022812.6 discloses a linear soldering machine comprising a machine platform, which is sequentially equipped with a loading unit, a fluxing unit, and a soldering mechanism, capable of transporting jigs to a station to be clamped. A conveyor belt assembly is located between the loading unit and the fluxing mechanism, capable of transporting jigs with soldered components out of the soldering machine. A long support profile is also fixed to the machine platform. The loading unit, conveyor belt assembly, fluxing unit, and soldering unit are sequentially arranged on the same side of the support profile along its length. The support profile is equipped with a sliding robotic arm mechanism along its length, capable of gripping jigs at the loading unit and transporting them to the fluxing unit, soldering mechanism, and conveyor belt assembly. Although the above-mentioned soldering machine has the advantages of high degree of automation and high soldering efficiency, since the tinning position of the magnetic ring common-mode inductor is close to the magnetic ring, if the tinning method of the above-mentioned soldering machine is used, it is easy for tin particles to splash onto the surface of the magnetic ring, resulting in poor cleanliness of the product. Cleaning is required in subsequent processes, which increases processing costs and is not conducive to improving the processing efficiency of the magnetic ring common-mode inductor. Summary of the Invention

[0003] In view of this, the present invention aims to propose a selective wave automatic soldering machine to solve the problem that when the existing soldering machine is used to tin the common mode inductor of the magnetic ring type, tin particles easily splash onto the surface of the magnetic ring, causing adverse effects on the product.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0005] A selective wave soldering machine includes a platform, on which are sequentially provided a carrying mechanism for carrying a product, a soldering mechanism for holding soldering flux, and a selective wave soldering furnace; the carrying mechanism includes a support frame provided on the platform, and a carrying plate provided on the supporting frame, the carrying plate being detachably mounted on the supporting frame, a jig for carrying the product being provided on the carrying plate, the jig being detachably mounted on the carrying plate, a plurality of mounting holes for mounting the jig being provided on the carrying plate, and a grabbing and moving mechanism for driving the carrying plate to move.

[0006] Furthermore, the jig is provided with a detachable isolation plate, a positioning groove cooperating with the product is provided above the isolation plate, and the jig is passed through the bottom; a through hole is provided at a position corresponding to the positioning groove on the isolation plate to facilitate the passage of the product pin, and the through hole is connected to the positioning groove, and the diameter of the through hole is larger than the diameter of the product pin.

[0007] Furthermore, a chamfer is provided at a position below the isolation plate corresponding to the opening of the through hole.

[0008] Furthermore, a drainage groove is provided below the isolation plate, the drainage groove is provided corresponding to the chamfer, and the drainage groove is connected to the through hole through the chamfer.

[0009] Furthermore, the grabbing and moving mechanism includes a three-axis gantry platform, and a clamping assembly and a clamping assembly arranged on the three-axis gantry platform; the clamping assembly is arranged in at least two groups at intervals along the length direction of the supporting plate, and the clamping assembly is arranged in a one-to-one correspondence with the jig, and the edge of the jig is provided with a positioning edge that can cooperate with the clamping assembly.

[0010] Furthermore, the clamping assembly includes an equipment mounting frame, which is provided with a clamping plate for clamping the positioning fixture. The clamping plate is connected to the equipment mounting frame through a first spring telescopic rod. The clamping plate is provided with a clamping part for clamping the positioning product, and the clamping part is connected to the clamping plate through a second spring telescopic rod.

[0011] Furthermore, a positioning pin is provided under the clamping plate, and at least two positioning pins are provided on the left and right sides of the corresponding jig. A positioning hole that can cooperate with the positioning pin is provided on the positioning edge of the jig, and a positioning column that can cooperate with the positioning hole is provided on the supporting plate at the positions corresponding to the left and right sides of the jig.

[0012] Furthermore, a sensing mark is provided on the positioning edge, and a detection component for detecting the sensing mark is provided on the pressing plate.

[0013] Furthermore, the support frame is provided with a limiting groove that cooperates with the bearing plate, and a limiting column is provided at the position corresponding to the limiting groove on the support frame. At least two limiting columns are arranged corresponding to the left and right ends of the bearing plate, and the bearing plate is provided with a limiting hole that cooperates with the limiting column.

[0014] Furthermore, a stationary tin furnace and a scraping mechanism are provided on the platform at a position corresponding to the position between the soldering mechanism and the selective wave tin furnace. The scraping mechanism includes a scraping plate arranged obliquely above the stationary tin furnace, and a driving assembly for driving the scraping plate is provided on the platform; one end of the scraping plate extends obliquely downward into the stationary tin furnace, and the other end is connected to the driving assembly, and the end of the scraping plate extending into the stationary tin furnace is provided with an arc-shaped bending portion.

[0015] Compared with the prior art, the selective wave automatic soldering machine described in the present invention has the following advantages:

[0016] The selective wave soldering machine described in this invention is suitable for tinning common-mode inductors such as magnetic rings. It boasts excellent applicability and ease of operation, ensuring machining accuracy and quality while improving soldering efficiency for batch production and preventing tin particle contamination. Using a jig to support the product improves product stability during handling and movement. Furthermore, by setting the through-hole diameter larger than the product pin diameter and providing chamfers and drainage grooves, the machine ensures soldering to the base of the pin while preventing tin particles from splattering through the through-hole onto the magnetic ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which constitute part of the present invention, are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 This is a structural schematic diagram of a selective wave automatic soldering machine according to an embodiment of the present invention;

[0019] Figure 2 This is a structural schematic diagram of a carrier plate in a selective wave automatic soldering machine according to an embodiment of the present invention;

[0020] Figure 3 This is a structural schematic diagram of a support frame in a selective wave automatic soldering machine according to an embodiment of the present invention;

[0021] Figure 4 This is a structural schematic diagram of a fixture in a selective wave automatic soldering machine according to an embodiment of the present invention;

[0022] Figure 5 This is a structural schematic diagram of an isolation plate in a selective wave automatic soldering machine according to an embodiment of the present invention;

[0023] Figure 6 This is a structural diagram of a grabbing and moving mechanism in a selective wave automatic soldering machine according to an embodiment of the present invention;

[0024] Figure 7 This is a structural schematic diagram of a stationary tin furnace in a selective wave automatic soldering machine according to an embodiment of the present invention.

[0025] Description of reference numerals:

[0026] 1. Platform; 2. Carrying mechanism; 3. Soldering mechanism; 4. Selective wave tin furnace; 5. Grasping and moving mechanism; 6. Carrying plate; 7. Mounting hole; 8. Fixture; 9. Isolation plate; 10. Product; 11. Positioning hole; 12. Induction mark; 13. Support frame; 14. Limiting groove; 15. Limiting column; 16. Positioning groove; 17. Through hole; 18. Chamfer; 19. Drainage groove; 20. Clamping jaw assembly; 21. Clamping plate; 22. Equipment mounting frame; 23. First spring telescopic rod; 24. Clamping piece; 25. Second spring telescopic rod; 26. Detection assembly; 27. Stationary tin furnace; 28. Scraper plate; 29. ​​Bending part; 30. Linear module; 31. Lifting cylinder; 32. Three-axis gantry platform; 33. Locating pin; 34. Locating column. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein may be combined with each other.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0029] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0030] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0031] A selective wave automatic soldering machine, such as Figures 1 to 7As shown, it includes a platform 1, on which are sequentially provided a carrying mechanism 2 for carrying a product 10, a soldering mechanism 3 for holding soldering flux, and a selective wave soldering furnace 4; the carrying mechanism 2 includes a support frame 13 provided on the platform 1, and a carrying plate 6 provided on the support frame 13, the carrying plate 6 being detachably mounted on the support frame 13, the carrying plate 6 being provided with a jig 8 for carrying the product 10, the jig 8 being detachably mounted on the carrying plate 6, the carrying plate 6 being provided with a plurality of mounting holes 7 for mounting the jig 8, and the platform 1 being provided with a grabbing and moving mechanism 5 for driving the carrying plate 6 to move. Among them, the soldering mechanism 3 can adopt the dipping flux machine used on the existing soldering machine, and its installation and working methods are all existing technologies and will not be described in detail here.

[0032] During actual application, a handle can also be fixed on the carrier plate 6 to facilitate the operator to take and place the carrier plate 6. When in use, the operator can use the jig 8 to carry the product 10, and use the carrier plate 6 to carry multiple jigs 8. The selective wave tin furnace 4 can be set one by one corresponding to the jig 8. Each selective wave tin furnace 4 can be installed on the platform 1 using conventional methods such as screws. By setting up multiple selective wave tin furnaces 4, it is beneficial to improve the soldering efficiency of batch products 10 while ensuring processing accuracy and processing quality.

[0033] The soldering process of the specific product 10 can refer to the following steps: the product 10 can be placed in the positioning groove 16 of the isolation plate 9 on the jig 8, and the pins of the product 10 can be passed through the through holes 17. Then the jig 8 with the product 10 can be installed on the carrier plate 6. Finally, the grabbing and moving mechanism 5 is used to drive the carrier plate 6 to move, first move it to the fluxing mechanism 3 to dip the flux, and then move it to the selective wave tin furnace 4 for pin soldering. After the soldering is completed, the carrier plate 6 can be placed back on the support frame 13. The operation is very simple.

[0034] Preferably, the support frame 13 is provided with a limiting groove 14 that cooperates with the bearing plate 6, and the support frame 13 is provided with a limiting column 15 at a position corresponding to the limiting groove 14. At least two limiting columns 15 are provided corresponding to the left and right ends of the bearing plate 6, and the bearing plate 6 is provided with a limiting hole that cooperates with the limiting column 15. Exemplarily, two support frames 13 can be provided, and each support frame 13 can be fixed to the platform 1 by screws. Two limiting columns 15 are also provided, and each limiting column 15 is fixed to the support frame 13. By providing two support frames 13, it is convenient for the subsequent grabbing and moving mechanism to grab the bearing plate 6, and by providing the limiting groove 14 and the limiting column 15 on each support frame 13 to limit the bearing plate 6, it is beneficial to improve the stability of the bearing plate 6 on the support frame 13, and facilitate the grabbing and moving mechanism 5 to accurately grab and drive the bearing plate 6 to move.

[0035] Preferably, a detachable isolation plate 9 is provided on the jig 8, and a positioning groove 16 cooperating with the product 10 is provided on the top of the isolation plate 9, and the jig 8 is passed through the bottom; a through hole 17 is provided at a position corresponding to the positioning groove 16 on the isolation plate 9 to facilitate the passage of the pins of the product 10, and the through hole 17 is connected to the positioning groove 16, and the diameter of the through hole 17 is larger than the diameter of the pins of the product 10.

[0036] For example, isolation plate 9 can be made of a high-temperature resistant material such as synthetic stone. The diameter of through-hole 17 is 0.5 mm larger than the diameter of the pin of product 10. Persons skilled in the art can adjust this according to actual needs, and this will not be described in detail here. In actual use, the positioning groove 16 on isolation plate 9 can effectively position product 10, ensuring that product 10 can move stably with fixture 8. By setting the diameter of through-hole 17 larger than the diameter of the pin of product 10, tin is ensured to be soldered to the base of the pin while preventing tin particles from splashing through through-hole 17 and onto the magnetic ring.

[0037] Preferably, four raised portions are evenly arranged on the edge of the isolation plate 9, an assembly hole cooperating with the isolation plate 9 is provided in the middle of the jig 8, and a positioning portion cooperating with the raised portion is provided at the position corresponding to the assembly hole on the jig 8. By utilizing the raised portion to cooperate with the positioning portion and utilizing the assembly hole to limit the isolation plate 9, the isolation plate 9 can be stably positioned on the jig 8, ensuring that the jig 8 can support and limit the isolation plate 9.

[0038] During actual application, by using the jig 8 to install the isolation plate 9 on the supporting plate 6, the operator can replace the appropriate isolation plate 9 as needed without replacing the jig 8. The fit between the jig 8 and the mounting hole 7 on the supporting plate 6 can also ensure stability, and no fit error will occur due to the replacement of the isolation plate 9, which is conducive to improving the subsequent movement accuracy of the isolation plate 9.

[0039] Preferably, a chamfer 18 is provided below the isolation plate 9 at a position corresponding to the opening of the through hole 17. For example, the chamfer 18 can form a tapered depression at the end of the through hole 17, so that the chamfer 18 can play a good guiding role in soldering, guiding the solder to enter the through hole 17 stably and quickly, and flow to the root of the pin that needs soldering, which is beneficial to improving the soldering effect of the pin.

[0040] Preferably, a drainage groove 19 is further provided below the isolation plate 9. The drainage groove 19 is provided corresponding to the chamfer 18, and the drainage groove 19 is connected to the through hole 17 through the chamfer 18. Specifically, the drainage groove 19 can be provided corresponding to the edge of the isolation plate 9, with the opening facing the outside of the isolation plate 9. By providing the drainage groove 19, when the isolation plate 9 contacts the solder, the solder can quickly enter the chamfer 18 through the drainage groove 19, ensuring that the solder can enter the through hole 17 more evenly and ultimately contact the pin evenly, which is beneficial to improving the uniformity of the pin solder.

[0041] Preferably, the grabbing and moving mechanism 5 includes a three-axis gantry platform 32, and a clamping assembly 20 and a clamping assembly arranged on the three-axis gantry platform 32; the clamping assembly 20 is arranged in at least two groups at intervals along the length direction of the supporting plate 6, and the clamping assembly is arranged in a one-to-one correspondence with the jig 8. The isolation plate 9 is installed on the supporting plate 6 through the jig 8, and the isolation plate 9 and the jig 8 are detachably connected. The edge of the jig 8 is provided with a positioning edge that can cooperate with the clamping assembly.

[0042] Specifically, the three-axis gantry platform 32 can adopt an existing three-axis platform. The fixed end of the three-axis gantry platform 32 can be mounted on the platform 1 by conventional means such as screws. The clamping assembly 20 and the clamping assembly can both be mounted on the movable end of the three-axis gantry platform 32 by conventional means to achieve the movement and lifting of the clamping assembly 20 and the clamping assembly. The power supply and control methods thereof are all prior art and are therefore not described in detail here. Among them, the clamping assembly 20 can also adopt an existing pneumatic clamping jaw. The installation and control methods thereof are also prior art. Those skilled in the art can also select an appropriate clamping jaw assembly 20 according to actual needs to achieve the grasping of the carrier plate 6. The details are not described in detail here.

[0043] Preferably, the clamping assembly includes a device mounting frame 22, which is provided with a clamping plate 21 for clamping the positioning fixture 8. The clamping plate 21 is connected to the device mounting frame 22 via a first spring telescopic rod 23. The clamping plate 21 is provided with a clamping member 24 for clamping and positioning the product 10. The clamping member 24 is connected to the clamping plate 21 via a second spring telescopic rod 25. For example, the device mounting frame 22 can be fixed to the movable end of the three-axis gantry platform 32 via screws. Both the first spring telescopic rod 23 and the second spring telescopic rod 25 can be existing spring rods. The installation and operation of the spring rods are well known in the art and will not be further described here.

[0044] In actual use, both the left and right sides of the clamping plate 21 can be connected to the equipment mounting frame 22 via first spring telescopic rods 23 to ensure the stability of the clamping plate 21 as it moves up and down. By providing the first spring telescopic rods 23, when the clamping jaw assembly 20 needs to grasp the carrier plate 6, the clamping jaw assembly can first be driven to press down and fix the carrier plate 6, thereby improving the stability of the clamping jaw assembly 20 after grasping the carrier plate 6. Specifically, when the clamping plate 21 presses down on the jig 8 and its positioning edge, the two first spring telescopic rods 23 can provide effective buffering and guiding functions, and the reset force of the first spring telescopic rods 23 can also ensure that the clamping plate more stably compresses the carrier plate 6.

[0045] In addition, by arranging a liftable pressing member 24 on the pressing plate 21 and using a second spring telescopic rod 25 to connect the pressing member 24 and the pressing plate 21, the pressing member 24 can also press the product 10 on the jig 8, ensuring that the product 10 and the jig 8 remain stable when the clamping jaw assembly 20 grabs the supporting plate 6, which is beneficial to improve the stability of the product 10 during subsequent movement and soldering, and ensure the quality of soldering.

[0046] Preferably, a positioning pin 33 is provided under the clamping plate 21, and at least two positioning pins 33 are provided on the left and right sides of the jig 8. A positioning hole 11 that can cooperate with the positioning pin 33 is provided on the positioning edge of the jig 8, and a positioning column 34 that can cooperate with the positioning hole 11 is provided on the supporting plate 6 at the positions corresponding to the left and right sides of the jig 8. Exemplarily, two positioning pins 33 are provided, and each positioning pin 33 is fixed on the clamping plate 21 at one end, and is provided with a tapered end portion that is convenient for insertion into the positioning hole 11 at the other end. Correspondingly, two positioning holes 11 and two positioning columns 34 are also provided, wherein the positioning columns 34 are fixed on the supporting plate 6. The stable positioning of the jig 8 can be achieved by using two positioning columns 34 and the positioning pin 33 in cooperation with the positioning hole 11. Those skilled in the art can also choose to set multiple ones according to actual needs, which will not be described here.

[0047] In actual application, by providing a positioning column 34 on the carrier plate 6 and utilizing the positioning column 34 to cooperate with the positioning hole 11 on the jig 8, the jig 8 can be further limited, ensuring that the jig 8 is stably set on the carrier plate 6 and moves stably with the carrier plate 6. At the same time, by providing a positioning pin 33 below the clamping plate 21 and a positioning hole 11 on the positioning edge of the jig 8 that cooperates with the positioning pin 33, when the clamping plate 21 presses down to position the jig 8 and the product 10, the positioning pin 33 can pass through the positioning hole 11 on the positioning edge of the jig 8 and press the jig 8 so that the positioning column 34 and the positioning hole 11 are stably matched, thereby achieving a stable connection between the jig 8 and the carrier plate 6, which is beneficial to further improve the stability of the product 10 during the soldering process and prevent the soldering quality of the pins of the product 10 from being affected by accidental movement of the jig 8.

[0048] Preferably, a sensing mark 12 is provided on the positioning edge, and a detection assembly 26 for detecting the sensing mark 12 is provided on the pressing plate 21. Exemplarily, the detection assembly 26 includes a sensor mounted on the pressing plate 21. The sensor can be mounted using conventional means such as screws, and the sensing mark 12 can be mounted on the positioning edge using conventional means such as adhesive. Those skilled in the art can select a sensor that can identify the model of the sensing mark 12 based on the model of the sensing mark 12, and therefore, no further details are given here.

[0049] In actual application, by setting sensing marks 12 at different positions on the positioning edge and setting sensors that can identify different sensing marks 12 at corresponding positions on the clamping plate 21, the type of jig 8 can be identified, so that the operator can use different jigs 8 to carry jigs 8 with different products 10, and select the appropriate soldering procedure for soldering as needed, which is conducive to further improving the welding efficiency of batch products 10. Technical personnel in this field can also make settings according to actual needs, which will not be repeated here.

[0050] Preferably, a stationary tin pot 27 and a scraping mechanism are further provided on the platform 1 at a position corresponding to the position between the soldering mechanism 3 and the selective wave solder pot 4. The scraping mechanism includes a scraping plate 28 arranged obliquely above the stationary tin pot 27. The platform 1 is provided with a driving assembly for driving the scraping plate 28. One end of the scraping plate 28 extends obliquely downward into the stationary tin pot 27, and the other end is connected to the driving assembly. The end of the scraping plate 28 extending into the stationary tin pot 27 is provided with an arc-shaped bending portion 29. The provision of the scraping plate 28 is conducive to ensuring the soldering effect of the stationary tin pot 27. At the same time, the provision of the bending portion 29 on the scraping plate 28 is conducive to improving the scraping effect of the scraping plate 28 on the stationary tin pot 27.

[0051] In actual application, the drive assembly can be a combination of a linear module 30 and a lifting cylinder 31, wherein the fixed end of the lifting cylinder 31 can be mounted on the slide of the linear module 30 by conventional mounting methods such as screws, and the scraper plate 28 can be fixed to the telescopic end of the lifting cylinder 31 by conventional mounting methods such as screws. The fixed end of the linear module 30 and the stationary tin pot 27 can both be mounted on the platform 1 by conventional methods such as screws. For example, the stationary tin pot 27 can be a square or long strip tin pot. The operator can choose to perform soldering using the stationary tin pot 27 or the selective wave tin pot 4 according to the soldering requirements of different products 10 to improve efficiency.

[0052] In addition, the sensing mark 12 can be used in conjunction with the detection component 26 to carry the product 10 that needs to be soldered using the selective wave soldering pot 4 using the jig 8 and the jig 8 with the first sensing mark 12, and to carry the product 10 that needs to be soldered using the stationary soldering pot 27 using the jig 8 and the jig 8 with the second sensing mark 12. The pressing plate 21 is provided with sensors that can identify the first sensing mark 12 and the second sensing mark 12, respectively. In the process of using the grasping and moving mechanism 5 to grasp the carrier plate 6, the sensing mark 12 can be recognized by the sensor on the pressing plate 21. When the first sensing mark 12 is recognized, the carrier plate 6 can be finally moved to the selective wave soldering pot 4 for soldering. When the second sensing mark 12 is recognized, the carrier plate 6 can be finally moved to the stationary soldering pot 27 for soldering, thereby realizing the switching of soldering operations for different products 10.

[0053] The selective wave soldering machine described in this invention is suitable for tinning common-mode inductors such as magnetic rings. It boasts excellent applicability and ease of operation, ensuring machining accuracy and quality while improving soldering efficiency for batch production. Using a fixture to support the product improves product stability during handling and movement. Furthermore, by setting the through-hole diameter larger than the product pin diameter and providing chamfers and drainage grooves, it ensures soldering to the base of the pin while preventing tin particles from splattering through the through-hole onto the magnetic ring.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A selective wave automatic soldering machine, characterized in that: The invention comprises a platform (1), on which a carrying mechanism (2) for carrying a product (10), a soldering mechanism (3) for containing soldering flux, and a selective wave soldering furnace (4) are sequentially arranged; the carrying mechanism (2) comprises a support frame (13) arranged on the platform (1), and a carrying plate (6) arranged on the support frame (13), the carrying plate (6) being detachably mounted on the support frame (13), a jig (8) for carrying the product (10) being arranged on the carrying plate (6), the jig (8) being detachably mounted on the carrying plate (6), the carrying plate (6) being provided with a plurality of mounting holes (7) for mounting the jig (8), and a grabbing and moving mechanism (5) for driving the carrying plate (6) to move.

2. A selective wave soldering machine according to claim 1, characterized in that: The jig (8) is provided with a detachable isolation plate (9), the isolation plate (9) is provided with a positioning groove (16) matching with the product (10) on the top, and passes through the jig (8) at the bottom; the isolation plate (9) is provided with a through hole (17) at a position corresponding to the positioning groove (16) for facilitating the passage of a pin of the product (10), the through hole (17) is connected with the positioning groove (16), and the diameter of the through hole (17) is larger than the diameter of the pin of the product (10).

3. A selective wave soldering machine according to claim 2, characterized in that: A chamfer (18) is provided at a position below the isolation plate (9) corresponding to the opening of the through hole (17).

4. A selective wave soldering machine according to claim 3, characterized in that: A drainage groove (19) is also provided below the isolation plate (9), the drainage groove (19) is provided corresponding to the chamfer (18), and the drainage groove (19) is connected to the through hole (17) via the chamfer (18).

5. A selective wave soldering machine according to any one of claims 1 to 4, characterized in that: The grabbing and moving mechanism (5) comprises a three-axis gantry platform (32), and a clamping assembly (20) and a clamping assembly arranged on the three-axis gantry platform (32); the clamping assembly (20) is arranged in at least two groups at intervals along the length direction of the carrier plate (6); the clamping assembly is arranged in a one-to-one correspondence with the fixture (8); and the edge of the fixture (8) is provided with a positioning edge that can cooperate with the clamping assembly.

6. A selective wave soldering machine according to claim 5, characterized in that: The clamping assembly comprises an equipment mounting frame (22), a clamping plate (21) for clamping a positioning fixture (8) is provided on the equipment mounting frame (22), the clamping plate (21) is connected to the equipment mounting frame (22) via a first spring telescopic rod (23), a clamping piece (24) for clamping a positioning product (10) is provided on the clamping plate (21), and the clamping piece (24) is connected to the clamping plate (21) via a second spring telescopic rod (25).

7. The selective wave soldering machine according to claim 5, characterized in that: A positioning pin (33) is provided below the clamping plate (21), and at least two positioning pins (33) are provided on the left and right sides of the jig (8). A positioning hole (11) capable of cooperating with the positioning pin (33) is provided on the positioning edge of the jig (8), and positioning columns (34) capable of cooperating with the positioning holes (11) are provided on the supporting plate (6) at positions corresponding to the left and right sides of the jig (8).

8. The selective wave soldering machine according to claim 5, characterized in that: The positioning edge is also provided with a sensing mark (12), and the pressing plate (21) is provided with a detection component (26) for detecting the sensing mark (12).

9. The selective wave automatic soldering machine according to claim 1, characterized in that: The support frame (13) is provided with a limiting groove (14) that matches the bearing plate (6), and a limiting column (15) is provided on the support frame (13) at a position corresponding to the limiting groove (14). At least two limiting columns (15) are provided corresponding to the left and right ends of the bearing plate (6), and the bearing plate (6) is provided with a limiting hole that matches the limiting column (15).

10. The selective wave soldering machine according to claim 1, characterized in that: A stationary tin furnace (27) and a scraping mechanism are also provided on the platform (1) at a position corresponding to the position between the soldering mechanism (3) and the selective wave solder furnace (4); the scraping mechanism comprises a scraping plate (28) obliquely arranged above the stationary tin furnace (27); a driving component for driving the scraping plate (28) is provided on the platform (1); one end of the scraping plate (28) obliquely downward extends into the stationary tin furnace (27), and the other end is connected to the driving component; an arc-shaped bending portion (29) is provided at the end of the scraping plate (28) extending into the stationary tin furnace (27).

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