System and method for manufacturing workpiece layer and cover layer

Abstract

The invention relates to a process and system for manufacturing a flexible circuit, in particular to a process and system for cutting and / or ablating a material when manufacturing a flexible circuit.

Description

Field of the Invention

[0001] The present invention relates to a process and system for manufacturing flexible circuits, and more particularly, to a process and system for cutting and / or ablating materials when manufacturing flexible circuits. Background Art

[0002] Some existing manufacturing processes first cut one or more patterns on a layer of material, and then laminate the patterned layer with other layers to form a flexible circuit at a later stage of the manufacturing process.

[0003] One manufacturing process for flexible circuits uses a roll-to-roll system. In a roll-to-roll system, layer alignment for lamination is prone to high tolerance due to the challenges and difficulties of stacking and aligning layers in a continuous run. In addition, in a roll-to-roll system, the range of position adjustment for cutting after layer alignment is also limited due to the tension required for the sheets or layers. In some embodiments, the range of position adjustment after cutting is limited and very small, such as only a few millimeters at most. The high tolerance limitation hinders the yield rate and is also an obstacle to achieving finer patterns.

[0004] Some existing manufacturing processes require the use of a covering / supporting layer, such as a disposable sacrificial layer opposite a cutting device. This sacrificial layer provides structural connection for discontinuous patterns and holds the patterns in dedicated locations as required by the process. However, this sacrificial layer is a waste material because it is removed and disposed of during the manufacturing process. Since the existing process involves a sacrificial layer for support, if the existing process includes a sub-process that requires replacing the covering / supporting sacrificial layer from bottom lamination to top lamination (or vice versa), another sacrificial layer and an additional process are required, which together make the process more complicated and the material cost higher.

[0005] Therefore, there is a need for a manufacturing process that can easily confirm the alignment of the layers in a flexible circuit before cutting the layers. In addition, there is a need for a manufacturing process that can stack multiple layers together before cutting or ablating one of the layers.

[0006] In one aspect of the present invention, a method for manufacturing a flexible circuit includes the following steps: providing a first material; providing a second material, which is a covering layer of the flexible circuit; laminating the first material onto the second material to form a laminated product; moving the laminated product to the vicinity of a camera; inspecting the laminated product by a camera to identify target information of the second material; determining whether a cutting device needs to be repositioned based on the detected target information; and cutting the first material by a cutting device.

[0007] In one embodiment, the method further comprises the step of repositioning the cutting device prior to the step of cutting the first material.

[0008] In another embodiment, the method further comprises the step of removing first material waste after the step of cutting the first material.

[0009] In another embodiment, the step of supplying the first material involves supplying the first material from a first reel, and the method further comprises the step of collecting the laminated product after the step of cutting the first material, the step of collecting the laminated product comprising collecting the laminated product on a second reel.

[0010] In another embodiment, the step of cutting the first material by the cutting device includes cutting the first material after laminating the first material with the second material, wherein the second material is not cut by the cutting device when the cutting device cuts the first material.

[0011] In another aspect of the present invention, a system for manufacturing a flexible circuit includes a first material source, a second material source, the second material being a cover layer of the flexible circuit, the second material including target information, a lamination assembly, the lamination assembly being useful for laminating the first material to the second material to form a laminated product; a camera; computer system operating software that analyzes the output of the camera to identify the target information of the second material; and a cutting device that can remove a portion of the first material from the laminated product.

[0012] In one embodiment, the system includes a repositioning mechanism coupled to the cutting device, the repositioning mechanism being operable by software to move the cutting device to a specific position based on the detected target information of the second material.

[0013] In another embodiment, the system includes a waste removal mechanism for removing waste of the first material after cutting the first material.

[0014] In another embodiment, the source of the first material includes the first material on a first reel, and the laminated product is collected on a second reel after a cutting device removes a portion of the first material from the laminated product.

[0015] In one aspect of the present disclosure, a method of manufacturing a flexible circuit includes the steps of providing a first material; providing a second material (the second material is a cover layer); laminating the second material onto the first material to form a laminated product; and cutting the first material.

[0016] In one embodiment, the step of cutting the first material comprises ablating a portion of the first material using a laser. In another embodiment, the waste of the first material is peeled off together with a portion of the second material. In another embodiment, the laminating step comprises laminating the second material onto the first material from the top. In another embodiment, the second material is a patterned polyester (PET) layer. In another embodiment, the second material is a non-patterned PET layer.

[0017] In another embodiment, the method further comprises the step of removing the second material by cutting or rastering areas of the second material from the top and bottom of the laminated product.

[0018] In another embodiment, the method further comprises the step of performing a sacrificial cut to remove waste material.

[0019] In another embodiment, the method further comprises the steps of cutting or rastering an area of ​​the second material using a laser, and if the scrap of the first material is aligned with the scrap of the second material, removing the scrap of the second material and the scrap of the first material using a sacrificial layer.

[0020] In another embodiment, the method further comprises the step of performing a sacrificial cut to remove waste material.

[0021] In another embodiment, the method further comprises the steps of cutting or rastering an area of ​​the second material using a laser, and if the flakes of the first material are aligned with the flakes of the second material, removing the flakes of the second material and the flakes of the first material using a sacrificial layer.

[0022] In another aspect of the present disclosure, a method for manufacturing a flexible circuit includes the following steps: providing a first material, the first material being a workpiece metal layer, the first material having an expected spring chip area after the first material is cut, and welding a sacrificial metal layer near the expected waste area before cutting the first material.

[0023] In one embodiment, the method further comprises the steps of ablating a portion of the first material and a portion of the sacrificial metal layer using a laser, and stripping off a waste of the first material and a portion of the sacrificial metal layer adjacent to the waste of the first material.

[0024] In another embodiment, the method further includes the step of laminating a patterned insulating layer to the first material, wherein the patterned insulating layer is one of a single-sided insulating layer or a double-sided insulating layer.

[0025] In another aspect of the present disclosure, a method for manufacturing a flexible circuit includes the following steps: providing a metal layer; cutting portions of the metal layer to remove waste material on the metal layer, the metal layer being formed into a pattern, the pattern including one or more connecting strips for holding portions of the metal layer pattern together; and laminating an insulating layer onto the metal layer pattern, wherein the insulating layer is patterned or unpatterned.

[0026] In one embodiment, the one or more connecting strips are located above the insulating layer. In another embodiment, the method further comprises the step of ablating the one or more connecting strips by cutting any unwanted portions or by evaporating the one or more connecting strips. In another embodiment, the method further comprises the step of laminating a sacrificial layer onto the insulating layer. In another embodiment, the method further comprises the step of removing the sacrificial layer and the connecting strips.

[0027] In another aspect of the present disclosure, a method for manufacturing a flexible circuit includes the following steps: providing a metal layer; cutting portions of the metal layer into a pattern, the pattern including one or more connecting strips holding portions of the metal layer together; laminating an insulating material to the metal layer; and cutting the insulating material by a vector cutting process or a raster cutting process.

[0028] In one embodiment, the insulating material and the metal layer are removed by breaking one or more connecting strips. In another embodiment, the insulating material includes a sacrificial portion and a heat-set portion, and the adhesion of the sacrificial portion and the heat-set portion causes the one or more connecting strips to break.

[0029] In another aspect of the present disclosure, a method of manufacturing a flexible circuit includes the steps of providing a metal layer, cutting portions of the metal layer into a pattern including one or more connecting strips holding the portions of the metal layer together, providing an insulating material, cutting the insulating material, and removing waste of the insulating material after the cutting step.

[0030] In one embodiment, the method further comprises the step of laminating the insulating material to the metal layer after removing the block of insulating material. In another embodiment, the method further comprises breaking the one or more connecting strips using a die after the laminating step. In another embodiment, the die is one of a male / female combination or a male and air combination.

[0031] In another aspect of the present disclosure, a method for manufacturing a flexible circuit includes the following steps: providing a first metal layer; cutting portions of the first metal layer into a pattern including one or more connecting strips, which hold portions of the first metal layer together; providing a second metal layer; welding the second metal layer to the first metal layer in specific areas; and removing the second metal layer, thereby removing the first metal layer welded to the second metal layer.

[0032] In one embodiment, the first metal layer has a top surface and a bottom surface, and the method further comprises the step of laminating a pattern insulator to the first metal layer after the step of removing the second metal layer, wherein the pattern insulator is laminated to the top surface of the first metal layer or the bottom surface of the first metal layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to make the description more complete and to better understand the present application, a set of drawings is provided. These drawings constitute an integral part of the description and illustrate embodiments of the present application, but these drawings should not be interpreted as limiting the scope of the present invention, but are only used as examples. The drawings include the following figures:

[0034] Figure 1 A schematic diagram of an embodiment of a flexible circuit board manufacturing system according to one aspect of the present disclosure is shown.

[0035] Figure 2 Shows Figure 1 A schematic diagram of several elements of the manufacturing system is shown in FIG.

[0036] Figure 3 An exemplary embodiment of a manufacturing process according to one aspect of the present disclosure is shown.

[0037] Figure 4 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0038] Figure 5 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0039] Figure 6 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0040] Figure 7 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0041] Figure 8 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0042] Fig. 9 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0043] Fig.10 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0044] Fig.11 A schematic diagram of another embodiment of a manufacturing system and process according to an aspect of the present disclosure is shown.

[0045] Throughout this disclosure, like reference numerals are used to identify like elements. DETAILED DESCRIPTION

[0046] The following description is not limiting and is merely intended to illustrate the broad principles of the invention. Embodiments of the invention will be exemplified with reference to the above-mentioned accompanying drawings which illustrate elements and results according to the invention.

[0047] In one aspect, the present invention relates to a laser cutting or ablation process in a flexible circuit roll-to-roll manufacturing system. The process can cut and / or ablate a workpiece according to features of a specific pattern of the workpiece. In another embodiment, the manufacturing system can include a mechanism for removing waste after the laser cutting process.

[0048] In another aspect of the invention, the cutting or ablation process can be performed on pre-laminated layers. In this regard, the layers of the product stack can be first laminated before any pattern cutting is performed. The process can use one or more targets or target information on the cover layers in the product stack to adjust the cutting pattern position of the cutting device. Due to the use of targets, the resulting product stack alignment is more accurate.

[0049] In one exemplary embodiment, a workpiece is laminated with a pre-cut pattern layer as a cover layer for the workpiece. The pre-cut pattern layer is included in the product laminate. Target information on the cover layer is used as reference data to ensure that the pattern on the workpiece is properly aligned. Various features, including small and narrow features, can be patterned using laser ablation technology. For small and narrow features, no waste removal is required. Pattern features that produce waste can be cut with a laser. Then, an additional waste removal process can be used to extract the waste. The waste removal process can break the lamination bond between the workpiece and the cover layer, thereby allowing waste to be removed from the workpiece.

[0050] First Look Figure 1 , an exemplary manufacturing system according to the present invention is shown in the figure. The manufacturing system is used to manufacture flexible circuits. In this embodiment, the manufacturing system 10 includes two raw material sources laminated together. One raw material source is placed on a reel 12. This raw material is the workpiece of the flexible circuit, on which cutting will be performed. The workpiece can be called layer A 100, which is continuously supplied to the manufacturing system 10. At the same time, another raw material is also supplied to the manufacturing system 10. As described below, this raw material is a covering layer laminated with the workpiece. This raw material is called layer B 110, which is a single layer material patterned with one or more target features. In other embodiments, layer B can be a multilayer laminated material with one or more target feature patterns.

[0051] Layer A 100 and layer B 110 are directed or moved to a lamination process 20 in the system 10. Process 20 includes laminating an assembly of laminate A 100 to laminate B 110. Lamination occurs on the same side of the product as the cutting device. The product coming out of the lamination process 20 is a laminated product including laminate A 100 laminated to laminate B 110. The laminated product is then conveyed to a location near a camera 120 in the manufacturing system 10 where a target positioning process 30 is performed.

[0052] The target positioning process 30 utilizes a camera 120 directed toward the laminate product. The camera 120 is positioned so that it can generate one or more images or video outputs showing a portion of the laminate B 110. In particular, the camera 120 is used to generate an output that captures target information on the layer B 110, which can be used as position data.

[0053] See also Figure 2 , which is a schematic perspective view of several components. The layers 100 and 110 in the figure are separated, but it can be understood that they are laminated together after the lamination process. The lower surface 105 of layer A 100 is connected to the upper surface 115 of layer B 110. The targets 120 and 122 are shown on the upper surface 115, which faces the direction of the camera 120.

[0054] Replay Figure 1 , the camera 120 is connected to a computing device 130 that is running a software program. Figure 1 One embodiment of the computing device 130 is shown, but it should be understood that in different embodiments, the computing device 130 can have any shape or configuration and can be mobile or fixed. The software analyzes the images and / or video output by the camera 120 to identify and determine the location of any target information on the B layer 110. The software operated by the computing device 130 analyzes the target information and determines whether the cutting device needs to be moved relative to the B layer 110 based on the analysis results. If it is determined that repositioning is required, the computer software moves the cutting device so that the pattern it cuts is located in the appropriate position relative to the B layer 110.

[0055] The laminated product is conveyed to part 40 of the manufacturing system 10, where one or more cutting and / or ablation processes are performed. One or more cutting devices 140 (such as lasers) are located in part 40. The laser 140 is used to cut and / or ablate layer A100 (workpiece) or layer A100 (workpiece) and layer B110 (covering layer). The stacked A layer 100 and B layer 110 enter the laser scanning / cutting process, and laser cutting / ablation is performed using the pattern adjusted by the software. Using the calibration position of the laser 140 in the software, the laser 140 can cut / ablate with reference to the position of layer B110. Depending on the pattern features, the process of part 40 can cut or ablate the workpiece, or cut and ablate the workpiece at the same time.

[0056] In addition, each laser 140 cuts or ablates the A layer 100 at the top and controls the penetration depth to ensure the integrity of the B layer 110. In one embodiment, the cutting / ablation process 40 is limited to the layer A 100. In another embodiment, the cutting / ablation process is performed on the layer A 100 and the layer B 110 simultaneously. If the product and process require the cutting and ablation of the B layer 110, the B layer 110 can be cut and ablated in the same process. The section 40 also includes a dust control component 150 to suck the cutting or ablation waste away from the laminated product.

[0057] The laser cutting or ablation process can be applied to a pre-laminated stack. As described above, the product stack of layer A 100 and layer B 110 is first laminated before any pattern cutting is performed. The cutting and ablation processes can use targets on the cover layers in the product stack to adjust the position of the cutting equipment. Since the targets can be used, the stack alignment can be more accurate.

[0058] It will be appreciated that the process disclosed herein does not require a disposable sacrificial support layer. The workpiece is positioned on top of other product layers as a covering layer thereof.

[0059] The manufacturing system 10 also includes a waste removal process 50, the result of which is the separation and removal of waste or waste material 160. In different embodiments, different waste removal processes 50 can be selected depending on the specific laser process. The finished product 170 is collected on the reel 14.

[0060] refer to Figure 3 , an exemplary embodiment of a manufacturing process according to one aspect of the present invention is shown in the figure. The process is used to manufacture a product having layer A and layer B, wherein layer B is patterned using target features in a separate process.

[0061] In this embodiment, the manufacturing process 200 includes several exemplary steps. Initially, in step 210, a first material (layer A) is continuously supplied from a reel. Layer A is a flexible material and is referred to as a workpiece. Simultaneously, in step 212, a second material (layer B) is supplied, and in some embodiments, layer B may also be continuously supplied from a reel. Layer B is a flexible material and is a different material from layer A. Layer B is a pattern layer and may be referred to as a cover layer.

[0062] In one embodiment of the process disclosed herein, step 214 involves lamination of layer A and layer B. After lamination of layer A and layer B, the laminated product is moved to the vicinity of a camera that can capture images and / or video of the layers, particularly layer B (see step 216). The camera is positioned so that it can capture target information on layer B. The camera is connected to a computing device that runs software capable of identifying and analyzing target information on layer B.

[0063] As part of the analysis of the target information, the software determines whether any repositioning needs to be performed in step 220. This determination is based on the detected locations of the target information and then comparing these detected locations with the expected locations of the information. In step 220, if it is determined that repositioning is required, the computer software moves the cutting pattern to match the target information of layer B110 by adjusting the cutting device using the adjustment mechanism.

[0064] In step 222, a cutting device (e.g., a laser) of the manufacturing system is used to cut and / or ablate one or more portions of layer A that need to be removed. The amount of layer A that is cut or ablated depends on the desired pattern of layer A. In step 224, waste material is removed from the workflow for subsequent processing. In another embodiment, the manufacturing process does not include any waste material removal as described in step 224.

[0065] In step 226, the finished product is collected, including laminate layer A and laminate layer B (both of which are flexible material layers). In one embodiment, the finished product is collected on a reel. Therefore, the manufacturing process is a reel-to-reel process.

[0066] In different embodiments, the manufacturing system and process may have different steps, thereby producing different variations. Figure 4-11 , illustrates schematic diagrams of different embodiments of manufacturing systems and processes according to the present disclosure. Each schematic diagram is a different embodiment because it has a different combination of process steps, which will be discussed in detail below. These processes involve different steps and different timings for certain processes, such as when to pattern the insulating layer (before or after lamination to the metal layer), whether and when to use tie bars, when to remove metal plugs and insulator plugs, and when to use one or more sacrificial material layers.

[0067] The terms "insulator", "insulating layer" and "insulating layer" and similar variations are used interchangeably below. Figure 4-11 Each of the processes shown begins with a metal layer, which may also be referred to as a "workpiece metal layer." Some alternative embodiments refer to a sacrificial metal layer, which is different from the initial metal layer or workpiece metal layer of the process. In the following description, the relative position of materials is referred to in terms of a "top surface" or "upper surface" and a "bottom surface" or "lower surface." It should be understood that while "top surface" or "bottom surface" are used to describe the position of materials, alternative arrangements of "bottom surface" or "top surface" are also contemplated. In addition, while the term "laser" is used, any suitable cutting equipment may be used to perform the cutting and ablation referred to, provided that the cutting equipment is capable of correctly and accurately making the desired cuts in one or more layers.

[0068] An alternative manufacturing system and process includes laminating a patterned polyester (PET) layer to the metal layer A. It should be understood that although the insulating layer or thermal insulation layer is made of polyester (PET) material, in different embodiments, the insulating layer or thermal insulation layer can be made of different thermal insulation materials. Using laser ablation, layer A with a portion of the sacrificial layer is peeled off. The patterned PET is laminated to the A layer from the top. See Figure 4 , a schematic diagram of the manufacturing system and process is shown in FIG. 300. Process 300 includes step 302 of providing a metal or metal layer, in this embodiment, a metal layer 350 is placed on a reel. The line representing the metal layer 350 runs through the entire process until the finished product 370. Step 304 includes providing a patterned insulator 352 from Figure 4 As can be seen in FIG. 304 , the pattern insulator 352 extends all the way to a portion of the finished product 370. In this embodiment, the pattern insulator 352 is a PET layer that has been patterned before being laminated to the metal layer 350. In step 304, the pattern insulator 352 is laminated to the metal layer 350, particularly the bottom surface of the metal layer 350.

[0069] After the pattern insulator 352 is attached, step 306 involves cutting of the metal layer 350. In this step, a portion of the metal layer 350 is cut using a laser 330 to form a pattern therein. The cut portion of the metal layer 350 (also referred to as "waste") is not removed yet.

[0070] Step 308 is to apply a sacrificial layer 354 material to the metal layer 350. In this embodiment, the sacrificial layer 354 is applied or coupled to the top surface of the metal layer 350. Then, in step 310, the sacrificial layer 354 is removed from the metal layer 350. When the sacrificial layer 354 is removed, the metal scraps generated by cutting step 306 from the metal layer 350 are removed along with the sacrificial layer 354.

[0071] After removing the metal scrap and sacrificial layer 354, in step 312, a pattern insulator 356 is laminated to the upper surface of metal layer 350. Thus, the finished product 370 of process 300 includes a layer of pattern insulator 356 on top of the cut metal layer 350 and another pattern insulator 352 on the bottom of metal layer 350.

[0072] Go to Figure 5 , illustrates a schematic diagram of another manufacturing system and process according to the present disclosure. In this process, an unpatterned insulator is laminated to a metal layer and then patterned while being laminated to the metal layer. The finished product has patterned insulators on the top and bottom of the metal layer. The process also uses multiple different sacrificial layers.

[0073] In this process 400, an initial step 402 includes providing or supplying a metal layer 450, which may be on a reel. A line representing the metal layer 450 runs through the entire process until a finished product 470. Step 404 includes providing an unpatterned insulator 452, which also extends to a portion of the finished product 470. In this embodiment, the unpatterned insulator 452 is laminated to the metal layer 450, particularly the bottom surface of the metal layer 450.

[0074] After the unpatterned insulator 452 is attached, step 406 involves cutting of the metal layer 450. In this step, a portion of the metal layer 450 is cut using a laser 430 by ablating the metal layer 450 and forming a small hole in the metal layer 450. The cut portion of the metal layer 450 or the scrap material 450 is not removed at this time.

[0075] Step 408 includes coupling a sacrificial material layer 454 to the upper surface of the metal layer 450. Then, in step 410, the sacrificial material layer 454 is removed from the metal layer 450. When the sacrificial material layer 454 is removed, the metal waste generated by the cutting step 406 on the metal layer 450 is also removed along with the sacrificial material layer 454. In other words, in this process 400, the sacrificial layer is used to remove the metal waste from the metal layer.

[0076] After removing the metal scrap and the sacrificial layer 454, at step 412, an unpatterned insulator 456 is laminated to the upper surface of the metal layer 450. At step 414, one or more specific portions of the unpatterned insulator 456 are cut using a laser 432 to form a pattern, thereby patterning the insulator 456 after laminating with the metal layer 450. Similarly, at step 416, one or more specific portions of the unpatterned insulator 452 are cut using a laser 434 to form a pattern, thereby patterning the insulator 452 after laminating with the metal layer 450.

[0077] After the insulator 456 is cut, another sacrificial layer 458 is connected to the insulator 456 at step 418. Similarly, after the insulator 452 is cut, another sacrificial layer 460 is connected to the insulator 452 at step 420. At step 422, the sacrificial layer 458 is removed from the insulator 456, and the waste insulator 456 generated by the cutting step 414 is removed. Similarly, in step 424, the sacrificial layer 460 is removed from the insulator 452, thereby removing one or more wastes of the insulator 452 generated by the cutting step 416. Therefore, the finished product 470 of the process 400 includes a patterned insulator 456 layer located on top of the cut metal layer 450, and another patterned insulator 452 located at the bottom of the metal layer 450.

[0078] Go to Figure 6 , illustrates a schematic diagram of another embodiment of a manufacturing system and process according to the present disclosure. In this process, an unpatterned insulator is laminated with a metal layer at different points in the process and then patterned. At the same time, after the insulator is patterned, a sacrificial material layer is used to clean any waste material on the metal layer and the insulator.

[0079] In this process 500, an initial step 502 includes providing or supplying metal 550, which may be located on a reel. A line representing the metal 550 layer extends throughout the process to a finished product 570. Step 504 includes providing an unpatterned insulator 552, which also extends to a portion of the finished product 570. In this embodiment, the unpatterned insulator 552 is laminated with the metal layer 550, particularly the bottom surface of the metal layer 550.

[0080] After the unpatterned insulator 552 is attached, step 506 involves cutting the metal layer 550 to form a pattern. In this step, a portion of the metal layer 550 is cut using a laser 530 by ablating the metal layer 550 and forming a small hole in the metal layer 550. At this time, the cut portion or waste material of the metal layer 550 is not removed.

[0081] In step 508, an unpatterned insulator 554 is laminated to the top surface of the metal layer 550. In step 510, one or more specific portions of the unpatterned insulator 554 are cut and / or rastered using a laser 532 to form a pattern, thereby patterning the insulator 554 after lamination with the metal layer 550. Similarly, in step 512, one or more specific portions of the unpatterned insulator 552 are cut and / or rastered using another laser 534 to form a pattern, thereby patterning the insulator 552 after lamination with the metal layer 550.

[0082] Step 514 includes coupling a sacrificial layer 556 material to the upper surface of metal layer 550. Similarly, step 516 couples another sacrificial layer 558 to the lower surface of metal layer 550.

[0083] Moving to step 518, sacrificial layer 556 is removed from metal layer 550. When sacrificial layer 556 is removed, the metal scraps of insulator 554 produced by cutting step 510 and the metal scraps of metal layer 550 produced by cutting step 506 (if aligned with the insulator metal scraps) are removed with sacrificial layer 556. Similarly, in step 520, sacrificial layer 558 is removed from metal layer 550. When sacrificial layer 558 is removed, the scraps of insulator 552 produced by cutting step 512 are removed with sacrificial layer 558. If the metal scraps on metal layer 550 have not been removed and are aligned with the metal scraps on insulator 552, when sacrificial layer 558 is removed, the metal scraps are also removed with the metal scraps on insulator 552. Therefore, the finished product 570 of process 500 includes insulator layer 554 patterned on top of metal layer 550 after lamination, and another layer of insulator 552 patterned on the bottom of metal layer 550 after lamination.

[0084] Go to Figure 7 , illustrates a schematic diagram of another embodiment of a manufacturing system and process according to the present disclosure. In this process, a sacrificial layer made of metal is used early in the process. The sacrificial metal layer is used to remove metal layer waste. After removing the metal wedges, a prefabricated insulator is laminated onto the metal layer.

[0085] In this process 600, an initial step 602 includes providing a metal layer 650, which may be located on a reel. A line representing the metal layer 650 extends through the entire process to a finished product 670. Step 604 includes providing a sacrificial metal layer 652 adjacent to the workpiece metal layer 650. In this embodiment, the sacrificial metal layer 652 may be located near the bottom surface of the metal layer 650.

[0086] Step 606 involves welding a sacrificial metal layer 652 in specific areas. In this step, a laser 630 is used to weld the sacrificial metal layer 652 to the metal layer 650 in the expected scrap area. Step 608 involves ablation of the metal layer 650 and the sacrificial metal layer 652. In this process 600, the ablation in step 608 uses a laser 632. After the ablation occurs, step 610 is performed to remove or strip the sacrificial metal layer 652 and the scrap metal formed by the ablation in step 608. At this point, only the workpiece metal layer 650 exists.

[0087] =In step 612, pattern insulator 654 is laminated to the top surface of metal layer 650. Similarly, in step 614, pattern insulator 656 is laminated to the bottom surface of metal layer 650. Pattern insulators 654 and 656 can be single-sided or double-sided insulating layers laminated to metal layer 650. Therefore, the finished product 670 of process 600 includes a pattern insulator layer 654 laminated on the top of metal layer 650 and another pattern insulator layer 656 laminated on the bottom of metal layer 650.

[0088] Go to Figure 8 , illustrates a schematic diagram of another manufacturing system and process according to the present disclosure. In this process, a metal layer is cut to form one or more connecting bars. A pre-patterned or unpatterned insulator is laminated to the metal layer and then cut. An artificial material layer is used to remove any connecting bars and insulator waste. The finished product has insulators on the top and bottom of the metal layer.

[0089] =In the process 700, an initial step 702 includes providing or supplying metal 750, which may be on a reel. A line representing the metal layer 750 runs through the entire process until the finished product 770. Step 704 includes cutting the metal layer 750 into a mesh pattern with connecting strips. The cutting step 704 is performed using a laser 730. In step 706, the waste material on the metal layer 750 is removed, leaving the connecting strips cut in step 704. The cut metal pattern is held together by the connecting strips.

[0090] Turning to step 708, a plain or patterned insulator 752 is laminated on the upper surface of the metal layer 750. Similarly, step 710 involves another plain or patterned insulator 754 being laminated to the lower surface of the metal layer 750. Connecting strips are located above the insulating layer 752. Step 712 is to cut a pattern on the insulator 752 using a laser 732. Similarly, step 714 is to cut a pattern on the insulator 754 using a laser 734. In step 716, another laser 736 is used to ablate the connecting strips of the metal layer by cutting off the unwanted portions. Alternatively, the connecting strips can also be ablated by vaporizing each connecting strip.

[0091] Step 718 includes coupling sacrificial layer 756 to the top surface of insulator 752. Similarly, step 720 couples sacrificial layer 758 to the bottom surface of insulator 754. Then, in step 722, sacrificial layer 756 is removed from insulator 752. In the process of removing sacrificial layer 756, if desired, connecting bars and any waste material on insulator 752 may also be removed. The connecting bars are removed with sacrificial layer 756 because the connecting bars are located on the outer surface of insulator 752. Similarly, in step 724, sacrificial layer 758 is also removed from insulator 754. When sacrificial layer 758 is removed, any waste material on insulator 754 is also removed. Therefore, the finished product 770 of process 700 includes insulator 752 located on top of metal layer 750 and another insulator 754 located at the bottom of metal layer 750.

[0092] Go to Fig. 9 , illustrates another embodiment of a manufacturing system and process according to the present disclosure. In this process, the finished product has an insulator on the top and bottom of the metal layer.

[0093] In the process 800, an initial step 802 includes providing or supplying metal 850, which may be on a reel. A line representing a layer of metal 850 is passed through the entire process until a finished product 870. Step 804 includes cutting the metal layer 850 into a mesh pattern with one or more connecting strips. The cutting step 804 is performed using a laser 830. At this time, the metal waste on the metal layer 850 is not removed. The cut metal pattern is held together by the connecting strips.

[0094] Turning to step 806, a non-patterned or patterned insulator 852 is laminated on the upper surface of the metal layer 850. Similarly, step 808 involves another non-patterned or patterned insulator 854 being laminated to the lower surface of the metal layer 850. Step 810 is to cut a pattern on the insulator 852 using a laser 832. The insulator 852 can be vector cut or raster cut. Similarly, step 812 is to cut a pattern on the insulator 854 using a laser 834. Like the insulator 852, the insulator 854 is also vector cut or raster cut.

[0095] Step 814 includes coupling sacrificial layer 856 to the top surface of insulator 852. Similarly, step 816 couples sacrificial layer 858 to the bottom surface of insulator 854. Then, in step 818, sacrificial layer 856 is removed from insulator 852. The remaining insulator scrap and metal layer scrap are removed by breaking the connecting strip. The adhesion of the PET sacrificial layer and the PET thermosetting layer pulls the connecting strip apart. The connecting strip is removed together with the sacrificial layer 856 because the connecting strip is located on the outer surface of insulator 852. Fig. 9As shown, in step 820, the connecting strip is pulled apart by the adhesion of the insulator 852. In step 822, the sacrificial layer 858 is removed from the insulator 854. When the sacrificial layer 858 is removed, any waste material on the insulator 854 is also removed. Therefore, the finished product 870 of the process 800 includes the insulator 852 located on the top of the metal layer 850 and another insulator 854 located on the bottom of the metal layer 850.

[0096] Go to Fig.10 , illustrates another embodiment of a manufacturing system and process according to the present disclosure. In this process, the metal layer is cut before laminating the prefabricated insulator to the metal layer. The finished product has insulators on the top and bottom of the metal layer.

[0097] In the process 900, an initial step 902 includes providing a metal layer 950, which may be on a reel. A line representing the metal layer 950 is passed through the entire process to a finished product 970. Step 904 includes cutting the metal layer 950 into a mesh pattern with one or more connecting strips. The cutting step 904 is performed using a laser 930. Metal waste on the metal layer 950 is removed. The cut metal pattern is held together by the connecting strips.

[0098] Turning to step 906, a patterned insulator 952 is laminated on the upper surface of the metal layer 950. Similarly, in step 908, another patterned insulator 954 is attached to the lower surface of the metal layer 950.

[0099] Steps 910 and 912 are to disconnect the connecting strip using a die cutting system including die assemblies 932 and 934. In step 910, insulator 952 is cut using die assembly 932. Similarly, in step 912, insulator 954 is cut using die assembly 934. The cutting die assemblies 932 and 934 can be a male-female combination, a male-air combination, or other die structures. When the connecting strip or connecting strips are disconnected, any remaining waste can be removed. The finished product 970 of process 900 includes insulator 952 located on top of metal layer 950 and another insulator 954 located at the bottom of metal layer 950.

[0100] Go to Fig.11 , illustrates a schematic diagram of another embodiment of a manufacturing system and process according to the present disclosure. In this process, a sacrificial metal layer is used to remove a waste from the metal layer. After the metal layer is prepared, a pre-patterned insulator is laminated to the metal layer.

[0101] In the process 1000, an initial step 1002 includes providing or supplying a metal layer 1050, which may be on a reel. A line representing the metal layer 1050 is passed through the entire process until the finished product 1070. Step 1004 is to cut the metal layer 1050 into a mesh pattern with one or more connecting strips. The cutting step 1004 is performed using a laser 1030. At this time, the metal waste on the metal layer 1050 is not removed. The cut metal pattern is held together by the connecting strips.

[0102] Step 1006 includes providing a sacrificial metal layer 1052 adjacent to the workpiece metal layer 1050. In this embodiment, the sacrificial metal layer 1052 may be positioned adjacent to a bottom surface of the metal layer 1050.

[0103] Step 1008 involves welding the sacrificial metal layer 1052 in specific areas. In this step, the sacrificial metal layer 1052 is welded to the metal layer 1050 in the expected scrap area using the laser 1032. Step 1010 is performed to remove or strip the sacrificial metal layer 1052 and the metal scrap formed by the ablation in step 1008. At this point, only the workpiece metal layer 1050 exists.

[0104] In step 1012, a pattern insulator 1054 is laminated to the upper surface of the metal layer 1050. Similarly, in step 1014, a pattern insulator 1056 is laminated to the lower surface of the metal layer 1050. The pattern insulators 1054 and 1056 can be single-sided or double-sided insulating layers laminated to the metal layer 1050. Therefore, the finished product 1070 of the process 1000 includes a pattern insulating layer 1054 located on the top of the metal layer 1050 and another pattern insulating layer 1056 located on the bottom of the metal layer 1050.

[0105] One advantage of the above manufacturing process and system is that tolerance control is better. Since the workpiece layers can be patterned after lamination, the patterned layers can be cut to the target of any underlying layer. Therefore, the tolerance of the patterned layer in the product stack assembly is much better.

[0106] Another advantage of the manufacturing process and system is that the patterned layer is laminated with other product layers before the ablation process. No sacrificial layer is required because the other laminated layers can provide the structural strength required for the pattern. The laser ablation process can control the ablation depth and prevent the laser from damaging other layers.

[0107] Although the present invention has been described in detail and with reference to specific embodiments thereof, it is not intended that the present invention be limited to the details shown, as it will be apparent that various modifications and structural changes may be made to the present invention without departing from the scope of the present invention and the scope and equivalents of the claims. In addition, various features of one embodiment may also be incorporated into another embodiment. Therefore, it is appropriate that the appended claims be interpreted broadly in a manner consistent with the disclosure of the following claims.

[0108] Likewise, the present invention is intended to cover modifications and variations of the present invention within the scope of the appended claims and their equivalents. For example, it should be understood that terms that may be used herein, such as "left", "right", "up", "down", "front", "back", "side", "high", "long", "wide", "up", "down", "inside", "outside", "inside", "outside", etc., are only used to describe reference points and do not limit the present invention to any particular direction or configuration. In addition, the term "example" is used herein to describe an example or illustration. Any embodiment described as an example herein is not to be understood as a preferred or advantageous embodiment, but can only be understood as an example or illustration of a possible embodiment of the present invention.

[0109] Finally, the term "include" and its derivatives (such as "comprising", etc.) used herein should not be understood as excluding the possibility that the described and defined content may include further elements, steps, etc. At the same time, the term "approximately" and its series of terms (such as "approximately", etc.) used herein should be understood to mean values ​​that are very close to the above terms. In other words, deviations from the exact value within a reasonable range are acceptable, because those skilled in the art know that deviations from the indicated numerical values ​​are inevitable due to inaccurate measurements, etc. The same applies to "approximately", "about" and "substantially".

Claims

1. A method for manufacturing a flexible circuit, characterized in that: The method comprises the following steps: Provide the first material providing a second material, the second material being a covering layer; laminating a second material to the first material to form a laminated product; and Cut the first material.

2. The method according to claim 1, characterized in that Wherein the step of cutting the first material comprises ablating a portion of the first material using a laser.

3. The method according to claim 2, characterized in that Wherein waste material of the first material is stripped together with a portion of the second material.

4. The method according to claim 1, characterized in that: The laminating step includes laminating the second material onto the first material from the top.

5. The method according to claim 4, characterized in that The second material is a patterned polyester (PET) layer.

6. The method according to claim 4, characterized in that The second material is a non-patterned PET layer.

7. The method of claim 1, further comprising the steps of: The second material is removed by cutting or rastering areas of the second material from the top and bottom of the laminate product.

8. The method according to claim 7, characterized in that The following steps are also included: Sacrificial cuts are made to remove waste material.

9. The method according to claim 1, characterized in that: It also includes the following steps: cutting or rastering an area of ​​the second material using a laser; and If the scrap of the first material is aligned with the scrap of the second material, the scrap of the second material and the scrap of the first material are removed using a sacrificial layer.

10. A method for manufacturing a flexible circuit, characterized in that: The method comprises the following steps: providing a first material, the first material being a workpiece metal layer, the first material having an expected scrap area due to cutting of the first material; and Before cutting the first material, a sacrificial metal layer is welded near the expected scrap area.

11. The method according to claim 10, characterized in that Further comprising the steps of: ablating a portion of the first material and a portion of the sacrificial metal layer using a laser; as well as The scrap of the first material and the portion of the sacrificial metal layer adjacent to the scrap of the first material are stripped off.

12. The method according to claim 11, further comprising the steps of: A patterned insulating layer is laminated onto the first material, wherein the patterned insulating layer is one of a single-sided insulating layer or a double-sided insulating layer.

13. A method for manufacturing a flexible circuit, the method comprising the steps of: providing a metal layer; cutting portions of the metal layer to remove waste material from the metal layer, the metal layer forming a pattern including one or more connecting strips for holding portions of the metal layer pattern together; as well as An insulating layer is laminated onto the metal layer pattern, wherein the insulating layer can be patterned or unpatterned.

14. The method according to claim 13, characterized in that One or more connecting strips are located above the insulating layer.

15. The method according to claim 14, characterized in that The following steps are also included: The one or more connecting strips are ablated by cutting off any unwanted portions or by vaporizing the one or more connecting strips.

16. The method according to claim 14, characterized in that The following steps are also included: The sacrificial layer is laminated to the insulating layer.

17. The method according to claim 16, characterized in that The following steps are also included: Remove the waste material from the sacrificial layer and the connecting tape.

18. A method for manufacturing a flexible circuit, the method comprising the steps of: Provide metal layer cutting a portion of the metal layer into a pattern, the pattern comprising one or more connecting bands for holding the portion of the metal layer together; laminating an insulating material onto the metal layer; as well as Cut the insulating material using a vector cutting process or a raster cutting process.

19. The method according to claim 18, characterized in that The thin sheets of insulating material and the thin sheets of metal layer are removed by breaking off one or more connecting strips.

20. The method according to claim 19, characterized in that The insulating material includes a sacrificial portion and a heat-setting portion, and the adhesion between the sacrificial portion and the heat-setting portion destroys one or more connecting strips.

21. A method for manufacturing a flexible circuit, characterized in that: The method comprises the following steps: providing a metal layer; cutting a portion of the metal layer into a pattern including one or more connecting strips for holding the portion of the metal layer together; Provide insulation material Cutting of insulating materials; and Small pieces of insulating material are removed after the cutting step.

22. The method according to claim 21, characterized in that The following steps are also included After the insulating material is removed, an insulating material is laminated onto the metal layer.

23. The method according to claim 22, characterized in that Further including: After the lamination step, a die is used to break off the one or more connecting strips.

24. The method according to claim 23, characterized in that The mold is one of a male / female combination or a male and air combination.

25. A method for manufacturing a flexible circuit, characterized in that: The method comprises the following steps: providing a first metal layer; cutting portions of the first metal layer into a pattern including one or more connecting bands for holding the portions of the first metal layer together; providing a second metal layer; welding the second metal layer to the first metal layer at specific areas; and The second metal layer is removed, thereby removing the first metal layer welded on the second metal layer.

26. The method according to claim 25, characterized in that The first metal layer has a top surface and a bottom surface, and the method further comprises the following steps: After the step of removing the second metal layer, a pattern insulator is laminated on the first metal layer, wherein the pattern insulator is laminated on a top surface of the first metal layer or a bottom surface of the first metal layer.

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