Method for sticking <111> type crystal rod and stick rod machine system

Abstract

The application provides a <111> type crystal bar sticking method and a stick bar machine system, and belongs to the field of semiconductors. The <111> type crystal bar sticking method comprises providing a <111> type crystal bar. The crystal bar also has a Notch groove. The Notch groove is upward. The stick bar machine system obtains a deviation value and an initial rotation angle of the crystal bar, and sets an initial orientation angle of the Y axis of the crystal bar. In the stick bar machine system, the orientation angle of the Y axis is constantly reset until the real-time rotation angle of the crystal bar is within a target rotation angle range. The crystal bar is rotated based on the angle of rotation of the crystal bar around the circumferential direction of the crystal bar. A slope is arranged in the resin strip based on the target orientation angle, so as to correct the target orientation angle to 0°. By obtaining the target orientation angle of the crystal bar and the height of the crystal bar tilting along the length direction, the application can improve the probability of the crystal bar being at the optimal rotation angle when sawing, the elastic modulus of the materials on both sides of the sawed crystal bar is symmetrical, and the problem of wafer warping is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and particularly to a... <111> Method for bonding crystal rods and rod bonding machine system. Background Technology

[0002] When wire sawing silicon wafers, the cutting direction of the dicing line is parallel to the surface of the silicon wafer being cut and opposite to the feed direction of the silicon rod. Before the silicon rod is attached, it can be rotated to make the dicing line cut along a specific crystal plane and crystal orientation, thus determining the cutting direction of the dicing line. The semi-circular groove formed during wire sawing can be divided into many small planes parallel to the dicing line. Due to the anisotropy of single-crystal silicon, these discrete small planes parallel to the dicing line represent different crystal planes, with different elastic moduli, hardness, and fracture toughness values, and will exhibit different properties during sawing. Therefore, the choice of the cutting direction of the dicing line will affect the geometric parameters of the silicon wafer, such as WARP.

[0003] Existing <111> When cutting crystal rods, the random distribution of crystal orientation on the incoming material and the random distribution of the crystal rod's rotation angles result in different elastic moduli on the two sides of the cut, which causes the silicon wafer to warp.

[0004] It should be noted that the information disclosed in the background section of this invention is intended only to enhance the understanding of the general background of this invention, and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a <111> A method for bonding crystal rods and a rod bonding machine system to solve the problem. <111> When cutting crystal rods, the random distribution of crystal orientation on the incoming crystal planes causes the elastic modulus of the material on both sides of the cut to be different, which in turn causes the silicon wafer to warp.

[0006] To solve the above-mentioned technical problems, the present invention provides a <111> Methods for attaching crystal rods include:

[0007] Provide one <111> A crystal rod, wherein the crystal rod has a first end face and a second end face disposed opposite to each other, the first end face is defined as a reference face, and the vertical crystal direction of the crystal rod is defined as the Y-axis crystal direction;

[0008] The crystal rod also has a Notch groove. With the Notch groove facing upwards, the sticking machine system obtains the actual value of the crystal orientation of the crystal rod and the deviation value of the standard angle, as well as the initial rotation angle of the crystal orientation of the crystal rod, and sets the initial orientation angle of the Y-axis of the crystal rod.

[0009] In the rod bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod is within the target rotation angle range in order to correct the Y-axis crystal orientation and obtain the angle of rotation of the crystal rod around its own circumferential direction. The Y-axis orientation angle of the crystal rod when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the optimal sawing direction of the crystal rod during sawing.

[0010] The crystal rod is rotated based on the angle of rotation of the crystal rod around its own circumference.

[0011] Based on the target orientation angle, adjust the height of the crystal rod tilted along its length to correct the target orientation angle to 0°;

[0012] Based on the height of the tilt of the crystal rod, the crystal rod is glued and fixed.

[0013] Preferably, the crystal rod also has a Notch groove. With the Notch groove facing upwards, the rod bonding machine system obtains the deviation value of the actual crystal orientation of the crystal rod from the standard angle and the initial rotation angle of the crystal orientation, and sets the initial Y-axis orientation angle of the crystal rod, including:

[0014] The crystal rod is placed in a rod bonding machine, which includes an X-Ray orientation instrument. The X-Ray orientation instrument is used to obtain the actual value of the crystal orientation of the crystal rod and the deviation value of the standard angle, as well as the initial rotation angle of the crystal orientation of the crystal rod. The initial orientation angle of the Y-axis of the crystal rod is set in the rod bonding machine system.

[0015] Preferably, the initial orientation angle of the Y-axis is set to 0°.

[0016] Preferably, the angle at which the crystal rod rotates clockwise along the reference plane is defined as positive, and the angle at which the crystal rod rotates counterclockwise along the reference plane is defined as negative. The angle at which the Notch groove of the crystal rod rotates on the sticking machine is -90° to 90°.

[0017] Preferably, in the rod bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod's orientation is within the target rotation angle range to correct the Y-axis orientation and obtain the angle of rotation of the crystal rod around its own circumferential direction. The Y-axis orientation angle of the crystal rod within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle at which the optimal sawing direction of the crystal rod is located during sawing, including:

[0018] Reset the Y-axis orientation angle and set it to a positive value. If the real-time rotation angle of the crystal ingot is close to the target rotation angle, continue to increase the orientation angle until the real-time rotation angle of the crystal ingot is within the target rotation angle range. If the real-time rotation angle of the crystal ingot deviates from the target rotation angle, set the orientation angle to a negative value and continue to decrease the orientation angle until the real-time rotation angle of the crystal ingot is within the target rotation angle range.

[0019] Preferably, the target turning angle range includes 0°±5°, 60°±5°, and -60°±5°.

[0020] Preferably, adjusting the height of the crystal rod tilted along its length direction based on the target orientation angle to correct the target orientation angle to 0° includes:

[0021] If the target orientation angle is positive, then the first end face of the crystal rod is higher than the second end face;

[0022] If the target orientation angle is negative, then the first end face of the crystal rod is lower than the second end face.

[0023] Preferably, adjusting the height of the crystal rod tilted along its length direction based on the target orientation angle to correct the target orientation angle to 0° further includes:

[0024] Based on the target orientation angle, a resin strip is fabricated, and a slope is set in the resin strip to correct the target orientation angle to 0°, wherein the height of the slope is equal to the height of the crystal rod tilted along its length.

[0025] The height of the resin strip located on the first end face is set as H1, and the height of the resin strip located on the second end face is set as H2.

[0026] If the target orientation angle is greater than 0°, then H1 is greater than H2;

[0027] If the target orientation angle is less than 0°, then H1 is less than H2.

[0028] Preferably, the height of the slope is:

[0029] H = L * tan(θ), where L is the length of the crystal rod and θ is the absolute value of the target orientation angle.

[0030] Preferably, the stick bonding machine further includes a workpiece, and after the crystal rod and the resin strip are bonded and fixed to one side with a slope, the other side of the resin strip is bonded and fixed to the workpiece.

[0031] The present invention also provides a sticking machine system, comprising:

[0032] The measuring device is used to obtain the deviation between the actual value and the standard angle of the crystal rod's crystal orientation and the initial rotation angle of the crystal rod's crystal orientation, and to set the initial orientation angle of the crystal rod's Y-axis.

[0033] The crystal orientation algorithm module continuously resets the Y-axis orientation angle until the real-time rotation angle of the crystal rod is within the target rotation angle range to correct the Y-axis crystal orientation. It also acquires the angle of rotation of the crystal rod around its circumferential direction and defines the Y-axis orientation angle of the crystal rod within the target rotation angle range as the target orientation angle. The target rotation angle is the angle of the optimal sawing direction of the crystal rod during sawing. Based on the angle of rotation of the crystal rod around its circumferential direction, the module rotates the crystal rod. Based on the target orientation angle, it adjusts the height of the crystal rod's tilt along its length direction to correct the target orientation angle to 0°.

[0034] A bonding device for bonding and fixing crystal rods based on the height of the tilt of the crystal rod.

[0035] Compared with the prior art, the present invention <111> The method of bonding crystal rods has the following advantages:

[0036] This invention provides a <111> A crystal rod is provided, having a first end face and a second end face arranged opposite to each other, with the first end face defined as a reference surface. The crystal rod also has a Notch groove. With the Notch groove facing upwards, the bonding machine system acquires the deviation value of the actual crystal orientation from the standard angle and the initial rotation angle of the crystal orientation, and sets the initial Y-axis orientation angle of the crystal rod. In the bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal orientation is within the target rotation angle range to correct the Y-axis crystal orientation. The system also acquires the angle of rotation of the crystal rod around its circumference, defining the Y-axis orientation angle of the crystal rod within the target rotation angle range as the target orientation angle, where the target rotation angle is the angle of the optimal sawing direction of the crystal rod during sawing. Based on the angle of rotation of the crystal rod around its circumference, the crystal rod is rotated; based on the target orientation angle, the height of the tilt of the crystal rod along its length direction is adjusted to correct the target orientation angle to 0°; based on the height of the tilt of the crystal rod, the crystal rod is bonded and fixed. This allows the crystal rod's rotation angle to be rotated from a random distribution to a specified angle, thereby increasing the probability that the crystal rod is at the optimal rotation angle during sawing. The elastic modulus of the material on both sides of the sawn crystal rod is symmetrical, avoiding the problem of silicon wafer warping.

[0037] The sticking machine system provided by this invention and the sticking machine system provided by this invention <111> The methods for bonding crystal rods belong to the same inventive concept. Therefore, the bonding machine system provided by this invention can avoid the problem of silicon wafer warping during crystal rod sawing. Attached Figure Description

[0038] Figure 1 The saw wire is cut from different directions. <110> A schematic diagram of the structure for cutting a crystal rod;

[0039] Figure 2 yes Figure 1 In <110> Elastic modulus distribution diagram of the crystal rod after cutting;

[0040] Figure 3 The saw wire is cut from different directions. <111> A schematic diagram of the structure for cutting a crystal rod;

[0041] Figure 4 for Figure 3 In <111> Elastic modulus distribution diagram of the crystal rod after cutting;

[0042] Figure 5 yes <111> A schematic diagram of the optimal cutting direction during the sawing of a crystal rod;

[0043] Figure 6 yes <111> Schematic diagram of the sawing direction and angle of a crystal rod versus its elastic modulus structure;

[0044] Figure 7 yes <111> The probability distribution of the rotation angle of a crystal rod randomly falling into the optimal rotation angle;

[0045] Figure 8 This is one embodiment of the present invention. <111> Flowchart of the method for bonding crystal rods;

[0046] Figure 9 This is a schematic diagram of the structure of the resin strip in one embodiment of the present invention;

[0047] Figure 10 This is a schematic diagram of the structure of the resin strip in another embodiment of the present invention;

[0048] Figure 11 This is a schematic diagram of the structure in which the crystal rod is pasted and fixed in one embodiment of the present invention;

[0049] Figure 12 This is a schematic diagram of the crystal rod in the cutting state according to one embodiment of the present invention;

[0050] In the picture,

[0051] 100 - Workpiece; 200 - Resin strip;

[0052] 300 - Crystal rod; 310 - Notch;

[0053] 320 - First end face; 400 - Saw wire. Detailed Implementation

[0054] To make the objectives, advantages, and features of the present invention clearer, the following further elaborates on the <111> type crystal bar pasting method and the stick-pasting machine system proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the objectives of the embodiments of the present invention. It should be understood that the drawings in the specification do not necessarily show the specific structure of the present invention in proportion, and the illustrative features used to explain certain principles of the present invention in the drawings of the specification will also adopt a slightly simplified drawing method. The specific design features of the present invention disclosed herein, such as specific dimensions, directions, positions, and shapes, will be partially determined by the specific application and usage environment. Also, in the following described embodiments, sometimes the same reference numerals are used commonly between different drawings to represent the same part or parts with the same functions, and the repeated description thereof is omitted. In this specification, similar reference numerals and letters are used to represent similar items. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0055] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0056] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0057] As shown Figures 1 to 6 in Figure 1 FIG. is a schematic structural diagram of a <110> type crystal bar being cut by saw wires from different directions. Figure 2 FIG. is Figure 1 the elastic modulus distribution diagram of the <110> type crystal bar after cutting in Figure 3 FIG. is a schematic structural diagram of a <111> type crystal bar being cut by saw wires from different directions. Figure 4 FIG. is Figure 3The elastic modulus distribution diagram of the <111> type crystal bar after cutting. From Figure 2 It can be seen that for the <110> type crystal bar, the elastic modulus distribution of the materials on both sides of the crystal bar can be symmetric regardless of the cutting direction of the saw wire. However, from Figure 3 and Figure 4 It can be seen that for the <111> type crystal bar, only when the cutting direction of the saw wire is 0°, 60°, 120°, 180°, 240°, 300°, the elastic modulus distribution of the materials on both sides of the saw cut is symmetric.

[0058] Refer Figures 5 to 7 as shown, Figure 5 is a schematic structural diagram of the best cutting-in direction when sawing the <111> type crystal bar. Figure 6 is a schematic diagram of the sawing direction - rotation angle vs elastic modulus of the <111> type crystal bar. Among them, Figure (6a) is the elastic modulus distribution diagram with a rotation angle of 0° or 60°; Figure (6b) is the elastic modulus distribution diagram with a rotation angle of 20°; Figure (6c) is the elastic modulus distribution diagram with an elastic modulus of 40°. Figure 7 is the probability distribution diagram of the rotation angle of the <111> type crystal bar randomly falling into the best rotation angle. From Figure 6 It can be seen that when the rotation angle is 0° or 60°, the elastic modulus is symmetrically distributed. From Figure 7 It can be seen that when the rotation angle of the crystal bar is randomly distributed, the probability of falling into the best rotation angle is only 15%.

[0059] Refer Figures 8 to 12 to a specific implementation manner of a <111> type crystal bar pasting method disclosed. The <111> type crystal bar pasting method includes the following steps S1 to step S6.

[0060] Step S1: Provide a <111> type crystal bar 300. The crystal bar 300 has a first end face 320 and a second end face (not marked in the figure) arranged oppositely. Define the first end face 320 as the reference face, and define the vertical crystal direction of the crystal bar 300 as the Y-axis crystal direction. [[ID=\\(31\\)]]

[0061] Specifically, refer Figure 8 and Figure 11 as shown, provide a <111> type crystal bar 300. The crystal bar 300 has a first end face 320 and a second end face arranged oppositely. Define the first end face 320 as the reference face. For the convenience of description, define the vertical crystal direction of the crystal bar 300 as the Y-axis crystal direction.

[0062] Among them, the crystal bar 300 has a first end face 320 and a second end face. There is a notch 310 on both the first end face 320 and the second end face. The notch 310 serves as a physical reference point and can indicate the crystal direction or other properties of the crystal bar 300.

[0063] Step S2: The crystal rod 300 also has a Notch groove. With the Notch groove facing upwards, the sticking machine system obtains the actual value of the crystal orientation of the crystal rod and the deviation value of the standard angle, as well as the initial rotation angle of the crystal orientation of the crystal rod, and sets the initial orientation angle of the Y-axis of the crystal rod 300.

[0064] Specifically, continue to participate Figure 8 , Figure 9 and Figure 11 As shown, the Notch groove is a surface formed by a notch 310 provided on the surface of the crystal ingot 300. The notch 310 serves as a physical reference point and can indicate the crystal orientation or other properties of the crystal ingot 300.

[0065] The crystal rod 300 is placed in a bonding machine. The bonding machine includes a workpiece 100, a resin strip 200, a rotary table (not shown), a roller (not shown), an angle measuring mechanism (not shown), a fixing mechanism (not shown), and bonding equipment (not shown). The workpiece 100 is fixed on the rotary table, and the rotary table can rotate the workpiece 100 in a horizontal plane. The resin strip 200 is fixed to the workpiece 100 by bonding and is used to bond the crystal rod 300. The fixing mechanism extends along the length of the crystal rod 300 (i.e., Figure 9 The crystal rod 300 is fixed at both ends (in the direction of the arrow X). The fixing mechanism includes two suction cups that are attached to both ends of the crystal rod 300 and can rotate with it, acting as a position sensor. The roller and angle measuring mechanism are located outside the crystal rod 300, with the roller extending parallel to it and supporting it to allow axial rotation. The rotary table can rotate the workpiece 100. The bonding device is used to bond and fix the crystal rod 300 to both the workpiece 100 and the resin strip 200. In this step, the crystal rod 300 is fixed to the bonding machine by the fixing mechanism but not to the workpiece 100 by the resin strip 200; that is, the crystal rod 300 has not yet undergone bonding processing.

[0066] The crystal rod 300 is rotated using a rod-attaching machine, with the Notch groove facing upwards, as its initial position. Next, the deviation between the actual crystal orientation of the crystal rod 300 and the standard angle is obtained using an angle measuring mechanism, such as an X-ray orienter. <111> The standard angle for the crystal orientation of the crystal rod is 14°14′. The deviation value is the difference between the measured actual value of the crystal orientation and the standard angle. The measurement data is transmitted to the rod bonding machine system. Finally, the initial Y-axis orientation angle of the crystal rod 300 is set. In this embodiment, the initial Y-axis orientation angle is generally set to 0°. Of course, in some other embodiments, the initial orientation angle can be set to other values.

[0067] Step S3: In the rod gluing machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod 300 is within the target rotation angle range to correct the Y-axis crystal orientation and obtain the angle of rotation of the crystal rod 300 around its own circumferential direction. The Y-axis orientation angle of the crystal rod 300 when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the optimal sawing direction of the crystal rod 300 during sawing.

[0068] Specifically, refer to Figure 8 and Figure 11 As shown, the sawing process is suitable for severing or slicing, and can be single-wire severing or multi-wire slicing. The optimal sawing direction is the optimal feed direction for diamond wire or slurry wire cutting. In the rod bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod's crystal orientation is within the target rotation angle range. Obtaining the angle of rotation of the crystal rod 300 around its own circumference includes:

[0069] Reset the Y-axis orientation angle and set it to a positive value. If the real-time rotation angle of the crystal ingot's crystal orientation is close to the target rotation angle, continue to increase the Y-axis orientation angle until the real-time rotation angle of the crystal ingot's crystal orientation is within the target rotation angle range. If the real-time rotation angle of the crystal ingot's crystal orientation deviates from the target rotation angle, set the Y-axis orientation angle to a negative value and continue to decrease the Y-axis orientation angle until the real-time rotation angle of the crystal ingot's crystal orientation is within the target rotation angle. In step S2 above, the initial orientation angle has already been set to 0° in the sticking machine system. Next, in the sticking machine system, the Y-axis orientation angle can be set to a positive value, for example, the orientation angle can be set to 0.2°. And the real-time rotation angle of the crystal ingot 300 is measured by the orientation instrument to determine whether the real-time rotation angle of the crystal ingot's crystal orientation is close to or deviates from the target rotation angle. If the real-time rotation angle of the crystal ingot's crystal orientation is close to the target rotation angle, the orientation angle is continuously set and increased through the sticking machine system until the real-time rotation angle of the crystal ingot's crystal orientation is within the target rotation angle. If the real-time rotation angle of the crystal rod's crystal orientation deviates from the target rotation angle, the Y-axis orientation angle can be set to a negative value, for example, -0.2°. The Y-axis orientation angle can be continuously reduced within the sticking machine system until the real-time rotation angle of the crystal rod's crystal orientation is within the target rotation angle. For example, ... Figure 11 As shown, when the real-time rotation angle of the crystal orientation of the crystal rod is α, the real-time rotation angle of the crystal orientation of the crystal rod 300 is within the target rotation angle range. When the real-time rotation angle of the crystal orientation of the crystal rod is within the target rotation angle range, the set Y-axis orientation angle is the target orientation angle.

[0070] The angle of clockwise rotation of the crystal ingot 300 along the reference plane is defined as positive, and the angle of counterclockwise rotation of the crystal ingot 300 along the reference plane is defined as negative. Since the Notch groove of the crystal ingot 300 rotates at an angle of -90° to 90° on the ingot bonding machine, the optimal rotation angles for the crystal orientation of the crystal ingot are 0°, 60°, and -60°. Setting the tolerance range near the optimal rotation angle reduces the probability of warping of the crystal ingot 300. In this embodiment, the preferred tolerance range is ±5°. Therefore, the target rotation angle range includes 0°±5°, 60°±5°, and -60°±5°.

[0071] The following explanation uses the example of a target rotation angle of 0°, a tolerance range of ±5° (i.e., a target rotation angle range of 0° ± 5°), and an initial orientation angle of 0° on the Y-axis.

[0072] The simulation results on the sticking machine system are shown in Table 1. Table 1 shows the change of the Y-axis rotation angle with the reset Y-axis orientation angle.

[0073] Table 1 shows the change of the Y-axis rotation angle with the reset Y-direction angle.

[0074]

[0075] It should be noted that the Y-axis rotation angle is the real-time rotation angle of the crystal rod's crystal orientation. The Y-orientation angle is the orientation angle described above. Test1, Test2, Test3, Test4, and Test5 in this example are data obtained by measuring the same crystal rod during crystal rod adjustment.

[0076] As shown in Table 1, with the Notch slot facing upwards, when the Y-axis crystal orientation of the crystal rod 300 is -0.355 (meaning the deviation between the actual value of the crystal orientation and the standard angle is -0.355), the Y-axis rotation angle is 23.764°, and the initial orientation angle is set to 0°. The Y-axis orientation angle is then reset; for example, it can be set to 0.2°. The Y-axis rotation angle is 34.479°, deviating from the target rotation angle, so the Y-axis orientation angle needs to be reset. For example, it can be set to -0.2°, which reduces the Y-axis rotation angle, bringing it closer to the target rotation angle. This process of setting the orientation angle is repeated until the Y-axis rotation angle of the crystal rod 300 reaches the range of 0°±5°, i.e., 4.816°, and the target orientation angle is obtained. In the embodiment shown in Table 1, the target orientation deviation angle is -0.3°. Simultaneously, the angle of rotation of the crystal rod 300 around its circumference is obtained at this point.

[0077] Step S4: Rotate the crystal rod 300 based on the angle of rotation of the crystal rod 300 around its own circumference.

[0078] By coordinating the turntable and rollers, and based on the angle at which the crystal rod 300 rotates around its circumference, the crystal orientation of the crystal rod is rotated to within the target rotation angle range. The target rotation angle is the angle at which the crystal rod 300 is located during sawing, representing the optimal sawing direction.

[0079] Step S5: Based on the target orientation angle, adjust the height of the crystal rod 300 tilted along its length to correct the target orientation angle to 0°.

[0080] Specifically, refer to Figures 8 to 12 As shown, taking a target rotation angle range of 0°±5° as an example. Based on the target orientation angle, the crystal rod 300 is adjusted along its length direction (i.e., Figure 1 The height of the tilt (in the direction of the X-axis) to correct the Y-axis re-inspection value to 0° includes: if the target orientation angle is positive, the first end face 320 of the crystal rod is higher than the second end face; if the target orientation angle is negative, the first end face 320 of the crystal rod 300 is lower than the second end face.

[0081] As one embodiment, adjusting the tilt height of the crystal rod 300 along its length direction based on the target orientation angle to correct the target orientation angle to 0° includes: fabricating a resin strip 200 based on the target orientation angle, and setting a ramp (not shown in the figure) within the resin strip 200 to correct the target orientation angle to 0°, wherein the height of the ramp is equal to the tilt height of the crystal rod 300 along its length direction. That is, fixing the crystal rod 300 to the ramped side of the resin strip 200, and fixing the other side of the resin strip 200 to the workpiece 100. The deviation value between the actual value of the crystal orientation and the standard angle can be measured using an X-ray orientation instrument to obtain the Y-axis re-inspection value to verify whether the Y-axis re-inspection value is 0°. That is, by correcting the target orientation angle to 0°, the Y-axis re-inspection value is corrected to 0°.

[0082] The height of the ramp is: H = L * tan(θ), where L is the length of the crystal rod 300 and θ is the absolute value of the target orientation angle. When the target rotation angle is 0°, the Y-axis re-inspection value is corrected to 0° by setting a ramp in the resin strip and adjusting the tilt height of the crystal rod 300.

[0083] The height of the resin strip 200 located on the first end face 320 is set as H1, and the height of the resin strip 200 located on the second end face is set as H2.

[0084] like Figure 9 As shown, if the target orientation angle θ is greater than 0°, then H1 is greater than H2;

[0085] like Figure 10 As shown, if the target orientation angle θ is less than 0°, then H1 is less than H2.

[0086] As another embodiment, adjusting the height of the crystal rod 300 tilted along its length direction based on the target orientation angle to correct the target orientation angle to 0° also includes: the sticking machine also includes a slicing machine, in which a feeler gauge is inserted into the dovetail groove of the workpiece 100 clamped by the slicing machine to adjust the height of the crystal rod 300 tilted along its length direction to correct the target orientation angle to 0°.

[0087] In this embodiment, the resin strip 200 is a conventional resin strip 200 without a slope. Inserting a feeler gauge into the dovetail groove of the workpiece 100 clamped by the slicer at the head or tail can also help correct the target orientation angle.

[0088] If the target orientation angle θ is greater than 0°, then H1 is greater than H2. Place the feeler gauge at the head of the dovetail groove and correct the target orientation angle to 0°.

[0089] If the target orientation angle θ is less than 0°, then H1 is less than H2. Place the feeler gauge at the tail of the dovetail groove and correct the target orientation angle to 0°.

[0090] Step S6: Based on the tilt height of the crystal rod 300, glue and fix the crystal rod 300.

[0091] Specifically, refer to Figures 8 to 12 As shown, based on the tilt height of the crystal rod 300, the bonding of the crystal rod 300 includes: the bonding machine has a bonding device, and the crystal rod 300 and the resin strip 200 with the sloping side are bonded and fixed by the bonding device. The prepared resin strip 200 is bonded and fixed to the workpiece 100 on the bonding machine. Finally, the resin strip 200 is bonded and fixed to the crystal rod 300, that is, the bonding of the crystal rod 300 is completed. In the actual cutting, the workpiece 100, the resin strip 200 and the crystal rod 300 are rotated 180°, and the saw wire 400 of the bonding machine cuts in the specified cutting direction (i.e., Figure 12 The crystal rod 300 is cut in the direction of the middle arrow d.

[0092] This embodiment first obtains the deviation value of the actual crystal orientation from the standard angle and the initial rotation angle of the crystal rod's crystal orientation, and sets the initial Y-axis orientation angle of the crystal rod 300 at this initial rotation angle. Then, in the rod bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod's crystal orientation is within the target rotation angle range to correct the Y-axis crystal orientation. The angle of rotation of the crystal rod 300 around its own circumferential direction is obtained, and the Y-axis orientation angle of the crystal rod 300 within the target rotation angle range is defined as the target orientation angle, where the target rotation angle is the angle of the optimal sawing direction of the crystal rod 300 during sawing. Based on the angle of rotation of the crystal rod 300 around its own circumferential direction, the crystal rod 300 is rotated. Based on the target orientation angle, a ramp is set within the resin strip 200 to correct the target orientation angle to 0°. By attaching and fixing the crystal rod 300 to the sloping side of the resin strip 200, the probability of the crystal rod 300 being at the optimal turning angle during sawing is increased. The elastic modulus of the materials on both sides of the sawn crystal rod 300 is symmetrical, thus avoiding the problem of warping of the silicon wafer.

[0093] This embodiment also discloses a rod gluing machine system, including a measuring device for acquiring the deviation value of the actual value of the crystal orientation of the crystal rod from the standard angle and the initial rotation angle of the crystal orientation of the crystal rod, and setting the initial Y-axis orientation angle of the crystal rod 300. A crystal orientation algorithm module is used to continuously reset the Y-axis orientation angle until the real-time rotation angle of the crystal rod's crystal orientation is within the target rotation angle range to correct the Y-axis crystal orientation, and to acquire the angle of rotation of the crystal rod 300 around its own circumferential direction. The Y-axis orientation angle of the crystal rod 300 within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the optimal sawing direction of the crystal rod 300 during sawing; based on the angle of rotation of the crystal rod 300 around its own circumferential direction, the crystal rod 300 is rotated; based on the target orientation angle, the height of the tilt of the crystal rod 300 along its length direction is adjusted to correct the target orientation angle to 0°. A gluing device is used to glue and fix the crystal rod 300 based on the height of its tilt.

[0094] The sticking machine system provided in this embodiment is different from the one provided in this embodiment. <111> The methods for bonding the crystal rods belong to the same inventive concept. Therefore, the bonding machine system provided in this embodiment can avoid the problem of silicon wafer warping when the crystal rod is cut at 300mm.

[0095] In summary, the above embodiments address the following: <111> The different configurations of the crystal rod bonding method and the rod bonding machine system have been described in detail. Of course, the above description is only a description of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. The present invention includes but is not limited to the configurations listed in the above embodiments. Those skilled in the art can draw inferences from the above embodiments. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A kind <111> The method for bonding crystal rods is characterized by, include: Provide one <111> A crystal rod, wherein the crystal rod has a first end face and a second end face disposed opposite to each other, the first end face is defined as a reference face, and the vertical crystal direction of the crystal rod is defined as the Y-axis crystal direction; The rod bonding machine system obtains the deviation value of the actual value of the crystal orientation of the rod from the standard angle and the initial rotation angle of the crystal orientation of the rod, and sets the initial orientation angle of the Y-axis of the rod. In the rod bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod is within the target rotation angle range in order to correct the Y-axis crystal orientation and obtain the angle of rotation of the crystal rod around its own circumferential direction. The Y-axis orientation angle of the crystal rod when it is within the target rotation angle range is defined as the target orientation angle, wherein the target rotation angle is the angle of the optimal sawing direction of the crystal rod during sawing. The crystal rod is rotated based on the angle of rotation of the crystal rod around its own circumference. Based on the target orientation angle, adjust the height of the crystal rod tilted along its length to correct the target orientation angle to 0°; Based on the height of the tilt of the crystal rod, the crystal rod is glued and fixed.

2. As described in claim 1 <111> The method for bonding crystal rods is characterized by, The crystal rod also has a Notch groove. With the Notch groove facing upwards, the rod bonding machine system obtains the deviation value of the actual crystal orientation of the crystal rod from the standard angle and the initial rotation angle of the crystal orientation, and sets the initial Y-axis orientation angle of the crystal rod, including: The crystal rod is placed in a rod bonding machine, which includes an X-Ray orientation instrument. The X-Ray orientation instrument is used to obtain the actual value of the crystal orientation of the crystal rod and the deviation value of the standard angle, as well as the initial rotation angle of the crystal orientation of the crystal rod. The initial orientation angle of the Y-axis of the crystal rod is set in the rod bonding machine system.

3. As described in claim 2 <111> The method for bonding crystal rods is characterized by, The initial orientation angle of the Y-axis is set to 0°.

4. As described in claim 1 <111> The method for bonding crystal rods is characterized by, The angle at which the crystal rod rotates clockwise along the reference plane is defined as positive, and the angle at which the crystal rod rotates counterclockwise along the reference plane is defined as negative. The angle at which the Notch groove of the crystal rod rotates on the sticking machine is -90° to 90°.

5. The method according to claim 4 <111> The method for bonding crystal rods is characterized by, In the rod bonding machine system, the Y-axis orientation angle is continuously reset until the real-time rotation angle of the crystal rod's orientation is within the target rotation angle range to correct the Y-axis orientation. The angle at which the crystal rod rotates around its circumferential direction is obtained, and the Y-axis orientation angle of the crystal rod within the target rotation angle range is defined as the target orientation angle. The target rotation angle is the angle at which the optimal sawing direction of the crystal rod is located during sawing, including: Reset the Y-axis orientation angle and set it to a positive value. If the real-time rotation angle of the crystal ingot is close to the target rotation angle, continue to increase the orientation angle until the real-time rotation angle of the crystal ingot is within the target rotation angle range. If the real-time rotation angle of the crystal ingot deviates from the target rotation angle, set the orientation angle to a negative value and continue to decrease the orientation angle until the real-time rotation angle of the crystal ingot is within the target rotation angle range.

6. The method according to claim 5 <111> The method for bonding crystal rods is characterized by, The target turning angle range includes 0°±5°, 60°±5°, and -60°±5°.

7. The method according to claim 1 <111> The method for bonding crystal rods is characterized by, The step of adjusting the height of the crystal rod tilt along its length direction based on the target orientation angle to correct the target orientation angle to 0° includes: If the target orientation angle is positive, then the first end face of the crystal rod is higher than the second end face; If the target orientation angle is negative, then the first end face of the crystal rod is lower than the second end face.

8. The method according to claim 1 <111> The method for bonding crystal rods is characterized by, The step of adjusting the height of the crystal rod tilted along its length direction based on the target orientation angle to correct the target orientation angle to 0° also includes: Based on the target orientation angle, a resin strip is fabricated, and a slope is set in the resin strip to correct the target orientation angle to 0°, wherein the height of the slope is equal to the height of the crystal rod tilted along its length. The height of the resin strip located on the first end face is set as H1, and the height of the resin strip located on the second end face is set as H2. If the target orientation angle is greater than 0°, then H1 is greater than H2; If the target orientation angle is less than 0°, then H1 is less than H2.

9. The method according to claim 8 <111> The method for bonding crystal rods is characterized by, The height of the slope is: H = L * tan(θ), where L is the length of the crystal rod and θ is the absolute value of the target orientation angle.

10. The claim 9 <111> The method for bonding crystal rods is characterized by, The sticking machine also includes a workpiece. After the crystal rod and the resin strip are glued and fixed to one side with a slope, the other side of the resin strip is glued and fixed to the workpiece. The workpiece is fixed on a rotary table, and the rotary table can drive the workpiece to rotate in a horizontal plane.

11. A stick-sticking machine system, characterized in that, include: The measuring device is used to obtain the deviation between the actual value and the standard angle of the crystal rod's crystal orientation and the initial rotation angle of the crystal rod's crystal orientation, and to set the initial orientation angle of the crystal rod's Y-axis. The crystal orientation algorithm module continuously resets the Y-axis orientation angle until the real-time rotation angle of the crystal rod is within the target rotation angle range to correct the Y-axis crystal orientation. It also obtains the angle of rotation of the crystal rod around its own circumferential direction and defines the Y-axis orientation angle of the crystal rod when it is within the target rotation angle range as the target orientation angle. The target rotation angle is the angle of the optimal sawing direction of the crystal rod during sawing. Based on the angle of rotation of the crystal rod around its own circumferential direction, the crystal rod is rotated. Based on the target orientation angle, the height of the tilt of the crystal rod along its length direction is adjusted to correct the target orientation angle to 0°. A bonding device for bonding and fixing crystal rods based on the height of the tilt of the crystal rod.

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