Automatic detection device for semiconductor wafer

Abstract

The invention discloses an automatic detection device for semiconductor wafers, relates to the field of semiconductor wafers, solves the problem that the existing detection device is difficult to detect the continuous flatness of wafers, comprises: a device housing and a detection host, a detection disk is installed on the outer side of the detection host, a plurality of wafer detection cavities are arranged on the surface of the detection disk, a wafer positioning ring is arranged on the inner side of the wafer detection cavity, two first mounting frames are installed on the top of the detection host, and a flatness detector is installed on the outer side of the first mounting frame; further comprises: a flipping mechanism, which is used for automatically flipping the wafer in the wafer positioning ring, and the flipping mechanism is installed on the inner side of the detection disk; the invention uses the flipping mechanism to enable the first flatness detector to perform flatness detection on the top of the wafer, and in the process of rotating the detection disk, the wafer positioning ring is rotated half a circle, and the second flatness detector can detect the bottom of the wafer, thereby achieving the effect of continuous detection and double-sided detection.

Description

Technical Field

[0001] The invention relates to the field of semiconductor wafers, and in particular to an automatic detection device for semiconductor wafers. Background Art

[0002] Semiconductor wafers are the basic materials used to manufacture integrated circuits. They are usually made of high-purity single-crystal silicon and are round in shape. The most common semiconductor material is silicon, but other materials such as gallium nitride and silicon carbide can also be used. The wafer manufacturing process involves extracting high-purity polycrystalline silicon from silicon dioxide ore, and then making single-crystal silicon wafers through processes such as crystal pulling and slicing.

[0003] When semiconductor wafers are produced, a series of processes such as wafer slicing, grinding, polishing, layering, photolithography, dicing and heat treatment are required. This process may cause defects on the surface of the semiconductor wafer, so a detection device is needed to screen out the defective semiconductor wafers. The existing Chinese patent application document: CN117030738A discloses an automatically converted multifunctional semiconductor wafer detection device, which is provided with an adjustable visual detection mechanism connected to an encoder on one side of the mounting table, and a wafer flatness detection mechanism is provided on the mounting table, and the detection table is located inside the wafer flatness detection mechanism. The adjustable visual detection mechanism can detect whether the appearance of the wafer is damaged, and the flatness detection mechanism can detect the flatness of the wafer. However, when the wafer is tested for flatness, only one side of the wafer can be detected, and the above-mentioned detection device is difficult to turn over the wafer, so it is necessary to turn the wafer over after the wafer is tested, and detect the wafer again. This process requires re-loading and feeding, and the detection efficiency is low. Summary of the invention

[0004] The object of the present invention is to provide an automatic detection device for semiconductor wafers to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An automatic detection device for semiconductor wafers, comprising: a device housing and a detection host fixedly mounted on the inner side of the device housing, a detection disk rotatably mounted on the outer side of the detection host, a plurality of wafer detection cavities symmetrically distributed in the center are opened on the surface of the detection disk, a wafer positioning ring is arranged on the inner side of the wafer detection cavity, two symmetrically distributed first mounting frames are fixedly mounted on the top of the detection host, and a flatness detector is fixedly mounted on the outer side of the first mounting frame;

[0007] Also includes:

[0008] A flipping mechanism, used for automatically flipping the wafer in the wafer positioning ring, wherein the flipping mechanism is installed on the inner side of the detection plate;

[0009] A clamping mechanism, used for automatically clamping, positioning and unloading the wafer in the wafer positioning ring, the clamping mechanism being installed on the inner side of the wafer positioning ring;

[0010] The sealing mechanism is used for detecting damage to the wafer in the wafer positioning ring, and the sealing mechanism is installed on the top of the detection plate.

[0011] Preferably, the flipping mechanism includes a first mounting rod fixedly mounted on the outer side of the wafer positioning ring, the first mounting rod is rotatably mounted on the inner side of the detection disk, a bevel gear is fixedly mounted on the end of the first mounting rod away from the wafer positioning ring, an annular groove for the movement of the bevel gear is provided on the outer side of the detection host, an arc-shaped rack matching the bevel gear is fixedly mounted on the inner side of the annular groove, and the arc-shaped rack can make the bevel gear rotate half a circle, a gear ring is fixedly mounted on the top of the detection disk, a driving motor is fixedly mounted on the top of the detection host, an adjusting gear is fixedly mounted on the output end of the driving motor, the adjusting gear is meshed with the teeth of the gear ring, and a fixed rod assembly for providing positioning for the wafer positioning ring is also provided on the inner side of the detection disk.

[0012] The cam is an axially movable member which is fixedly mounted on the outside of the two guide rails and is adapted to move relative to the outer ends of the two guide rails so as to allow the two guide rails to move relative to each other.

[0013] Preferably, the sealing mechanism comprises an arc-shaped top cover fixedly mounted on the top of the device housing, a plurality of openings corresponding to the wafer detection chamber are formed on the surface of the arc-shaped top cover, two symmetrically distributed annular boxes are fixedly mounted on the top of the arc-shaped top cover, the annular boxes are located above the adjacent wafer detection chambers, a slip ring is slidably mounted on the inner side of the annular box, a top cover is fixedly mounted on the inner side of the slip ring, the top cover is a hollow frustum structure, a plurality of centrally symmetrically distributed support rods are fixedly mounted on the top of the slip ring, the support rods slide through the top of the annular box, the top of the support rods is aligned with the annular box A second spring is fixedly installed between the tops of the detection host, two symmetrically distributed second mounting brackets are fixedly installed on the top of the detection host, a visual detection probe is fixedly installed on the end of the second mounting bracket away from the detection host, a circular shell is fixedly installed on the outer side of the visual detection probe, the outer side of the circular shell is in contact with the top opening of the top cover, the slip ring and the bottom of the top cover are fixedly installed with detection light boards, two symmetrically distributed sealing plates are fixedly installed on the outer side of the detection host, the sealing plate is located directly below the visual detection probe, and the top of the sealing plate is in contact with the bottom of the detection disk.

[0014] Preferably, the fixed rod assembly includes a second mounting rod fixedly mounted on the outer side of the wafer positioning ring, the second mounting rod is rotatably mounted on the inner side of the detection disk, the second mounting rod and the first mounting rod are symmetrically distributed on both sides of the wafer positioning ring, two symmetrically distributed elastic abutment rods are arranged on both sides of the first mounting rod and the second mounting rod, the elastic abutment rod has a hemispherical structure at one end close to the first mounting rod, and spherical grooves for limiting and inserting the elastic abutment rod are provided on the outer sides of the first mounting rod and the second mounting rod, and the elastic abutment rod is slidably mounted on the inner side of the detection disk.

[0015] Preferably, a protective cushion is fixedly mounted on one end of the arc-shaped clamping plate away from the sliding rod.

[0016] Preferably, a rubber ring is fixedly mounted on one end of the sliding block close to the sliding rod, and one end of the rubber ring away from the sliding block is in contact with the inner side of the mounting tube.

[0017] Preferably, an arc-shaped pad is fixedly installed on the top of the arc-shaped bottom plate, and an annular groove for limiting the sliding of the arc-shaped pad is opened on the outer side of the wafer positioning ring and the bottom of the detection plate, and the arc-shaped pad is located below the two adjacent wafer positioning rings.

[0018] Preferably, a material taking opening is provided at the top of the arc-shaped bottom plate, the inner side of the material taking opening is sealed by a circular soft cushion, and the material taking opening is located on the left side of the arc-shaped pad.

[0019] Preferably, a support bar is fixedly installed between the two ends of the arc-shaped bottom plate, the support bar is in an arc-shaped structure, and the top of the support bar is in contact with the bottom of the detection plate.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention uses a flipping mechanism to enable multiple wafer positioning rings on a testing disk to be loaded with multiple wafers to be tested in turn. As the testing disk rotates, the first flatness detector performs flatness detection on the top of the wafer. During the rotation of the testing disk, the wafer positioning ring rotates half a circle, and the second flatness detector can detect the bottom of the wafer, thereby solving the problem that traditional testing devices are difficult to flip over the wafer, thereby achieving the effect of continuous detection and double-sided detection.

[0022] The present invention uses a clamping mechanism, during the rotation of the detection disk, to clamp the outer side of the wafer in the wafer positioning ring through two arc-shaped clamping plates, which is convenient for loading and realizes automatic fixation of the wafer. After the wafer detection is completed, the pulley rod is brought into contact with the arc-shaped blocking bar, and the two arc-shaped clamping plates can release the wafer body after the detection is completed, which is convenient for taking out the material, thereby achieving the effect of facilitating loading, positioning and taking out the material.

[0023] The present invention uses a sealing mechanism to transport the wafer to the top of the annular box on the inspection plate, cooperate with the inspection light board to illuminate the wafer, cooperate with the sealing plate to position the wafer ring, so that the visual inspection probe can fully inspect the wafer, and then cooperate with the flipping of the wafer positioning ring to enable another visual inspection probe to inspect the wafer again, thereby achieving a multi-functional inspection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the structure of the housing and sealing plate of the device in the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of the wafer positioning ring and the detection host in the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the arc-shaped top cover and the detection plate in the present invention;

[0028] Figure 5 It is a schematic diagram of the structure of the arc-shaped clamping plate and the first mounting rod in the present invention;

[0029] Figure 6 It is a schematic diagram of the structure of the arc bottom plate and the arc baffle in the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of the installation cylinder and the pulley rod in the present invention;

[0031] Figure 8 It is a schematic diagram of the structure of the annular box and the top cover in the present invention.

[0032] In the figure: 1. device housing; 2. detection host; 3. detection plate; 4. wafer positioning ring; 5. first mounting frame; 6. flatness detector; 7. first mounting rod; 8. bevel gear; 9. arc rack; 10. gear ring; 11. drive motor; 12. adjustment gear; 13. mounting cylinder; 14. slider; 15. slide rod; 16. arc clamping plate; 17. first spring; 18. pulley rod; 19. arc bottom plate; 20. arc stop; 21. arc top cover; 22. ring box; 23. slip ring; 24. top cover; 25. support rod; 26. second spring; 27. second mounting frame; 28. visual inspection probe; 29. ​​round shell; 30. detection lamp board; 31. sealing plate; 32. second mounting rod; 33. elastic push rod; 34. protective cushion; 35. rubber ring; 36. arc pad; 37. support bar. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1: Please refer to Figure 1-Figure 7 , an automatic detection device for semiconductor wafers shown in the figure comprises a device housing 1 and a detection host 2 fixedly mounted on the inner side of the device housing 1, the detection host 2 is used to detect and analyze the data detected by the wafer, a detection disk 3 is rotatably mounted on the outer side of the detection host 2, the detection disk 3 is annular in structure, a plurality of wafer detection cavities symmetrically distributed in the center are provided on the surface of the detection disk 3, the wafer detection cavity is a circular structure, a wafer positioning ring 4 is arranged on the inner side of the wafer detection cavity, two symmetrically distributed first mounting frames 5 are fixedly mounted on the top of the detection host 2, a flatness detector 6 is fixedly mounted on the outer side of the first mounting frame 5, when the wafer in the wafer positioning ring 4 is aligned with the flatness detector 6, the first mounting frame 5 detects the top of the wafer through the flatness detector 6, and feeds back the detection data to the detection host 2, wherein the flatness detector 6 is a commonly used detector in the prior art; further comprising: a flipping mechanism, used to automatically flip the wafer in the wafer positioning ring 4, the flipping mechanism is mounted on the inner side of the detection disk 3;

[0035] The flip mechanism includes a first mounting rod 7 fixedly mounted on the outer side of the wafer positioning ring 4, the first mounting rod 7 is rotatably mounted on the inner side of the detection disk 3, one end of the first mounting rod 7 away from the wafer positioning ring 4 extends to the inner ring of the detection disk 3, and one end of the first mounting rod 7 away from the wafer positioning ring 4 is fixedly mounted with a bevel gear 8, and an annular groove for the bevel gear 8 to move is opened on the outer side of the detection host 2 to provide a moving space for the bevel gear 8, and an arc rack 9 matching the bevel gear 8 is fixedly mounted on the inner side of the annular groove, and the arc rack 9 can make the bevel gear 8 rotate Half a circle, when the bevel gear 8 contacts the arc rack 9, as the bevel gear 8 moves, the arc rack 9 drives the bevel gear 8 to rotate half a circle, so that the wafer positioning ring 4 is turned over, and the wafer inside the wafer positioning ring 4 can rotate half a circle. A gear ring 10 is fixedly installed on the top of the detection disk 3, and a driving motor 11 is fixedly installed on the top of the detection host 2. An adjusting gear 12 is fixedly installed on the output end of the driving motor 11. The adjusting gear 12 is meshed with the teeth of the gear ring 10. The driving motor 11 can drive the gear ring 10 to rotate intermittently through the adjusting gear 12. The gear ring 10 drives the detection disk 3 to rotate synchronously. The inner side of the detection disk 3 is also provided with a fixed rod assembly for providing positioning for the wafer positioning ring 4. The fixed rod assembly includes a second mounting rod 32 fixedly mounted on the outer side of the wafer positioning ring 4. The second mounting rod 32 is rotatably mounted on the inner side of the detection disk 3. The second mounting rod 32 and the first mounting rod 7 are symmetrically distributed on both sides of the wafer positioning ring 4. Two symmetrically distributed elastic abutment rods 33 are arranged on both sides of the first mounting rod 7 and the second mounting rod 32. The elastic abutment rod 33 has a hemispherical structure at one end close to the first mounting rod 7. The outer sides of the first mounting rod 7 and the second mounting rod 32 are both provided with spherical grooves for the elastic push rod 33 to limit and insert, so that when the first mounting rod 7 and the second mounting rod 32 rotate, the elastic push rod 33 can be squeezed through the spherical grooves, and when the first mounting rod 7 and the second mounting rod 32 stop rotating, the elastic push rod 33 is inserted into the spherical grooves at the corresponding positions by utilizing the rebound force of the elastic push rod 33, so as to realize the positioning of the first mounting rod 7 and the second mounting rod 32 and prevent the wafer positioning ring 4 from being skewed. The elastic push rod 33 is slidably installed on the inner side of the detection plate 3.

[0036] Example 2: Please refer to Figure 2-Figure 7, this embodiment further explains the first embodiment. The clamping mechanism shown in the figure includes two mounting tubes 13 symmetrically fixedly mounted on the inner side of the wafer positioning ring 4. A slider 14 is slidably mounted on the inner side of the mounting tube 13. A slide bar 15 is fixedly mounted on the outer side of the slide bar 14. The end of the slide bar 15 away from the slide bar 14 slides and extends to the outer side of the mounting tube 13. An arc-shaped clamping plate 16 is fixedly mounted on the end of the slide bar 15 away from the slide bar 14. The two arc-shaped clamping plates 16 are symmetrically pressed against the outer side of the wafer to achieve the clamping and positioning of the wafer. A protective cushion 34 is fixedly mounted on the end of the arc-shaped clamping plate 16 away from the slide bar 15 to prevent the arc-shaped clamping plate 16 from clamping the wafer too much, thereby providing protection for the wafer. A rubber ring 35 is fixedly mounted on the end of the slide bar 14 close to the slide bar 15. One end of the rubber ring 35 away from the slider 14 contacts the inner side of the mounting tube 13, and a first spring 17 is fixedly installed between the side of the slider 14 away from the slide rod 15 and the inner side of the mounting tube 13. The elasticity of the first spring 17 is used to enable the arc-shaped clamping plate 16 to clamp and position the outer side of the wafer, and during the movement of the slider 14, the rubber ring 35 can provide a buffer for the movement of the slider 14 to ensure the safety of the arc-shaped clamping plate 16 clamping the wafer. Two symmetrically distributed pulley rods 18 are fixedly installed on the outer side of the slider 14, and a long groove for the pulley rod 18 to limit the sliding of the pulley rod 18 is provided on the outer side of the mounting tube 13. The pulley rod 18 extends to the outer side of the mounting tube 13, and an arc-shaped bottom plate 19 is fixedly installed on the inner side of the device housing 1, and the top of the arc-shaped bottom plate 19 is aligned with the detection disk 3, two symmetrically distributed arc-shaped baffles 20 are fixedly installed on the top of the arc-shaped bottom plate 19, and the left end of the arc-shaped baffle 20 is an arc-shaped structure. The pulley ends on the two adjacent pulley rods 18 on the outside of the two arc-shaped baffles 20 are in contact, so that when the pulley rod 18 contacts the arc-shaped baffle 20, it can push the pulley rod 18 to move along the long groove on the installation cylinder 13, and the pulley rod 18 can pull the slider 14 to move, so that the two arc-shaped clamping plates 16 can be away from the wafer, so as to realize the unloading and automatic clamping of the wafer. An arc-shaped pad 36 is fixedly installed on the top of the arc-shaped bottom plate 19. When the wafer is loaded, the arc-shaped pad 36 can provide support for the bottom of the wafer, so that the two arc-shaped clamping plates 16 can clamp the wafer, and the outer side of the wafer positioning ring 4 is in contact with the detection The bottom of the disk 3 is provided with an annular groove for the limited sliding of the arc-shaped pad 36. The arc-shaped pad 36 is located below the two adjacent wafer positioning rings 4. A material removal port is provided on the top of the arc-shaped bottom plate 19. The inner side of the material removal port is sealed by a circular soft pad. When the wafer after inspection is aligned with the material removal port, the two pulley rods 18 corresponding to the wafer are respectively in contact with the two arc-shaped baffle bars 20, so that the two arc-shaped clamping plates 16 are separated, and the circular soft pad on the material removal port can receive the wafer after inspection. The material removal port is located on the left side of the arc-shaped pad 36. A support bar 37 is fixedly installed between the two ends of the arc-shaped bottom plate 19. The support bar 37 is an arc-shaped structure. The top of the support bar 37 contacts the bottom of the inspection disk 3 to provide auxiliary support for the bottom of the inspection disk 3.Improve the stability of the rotation of the detection disk 3.

[0037] Example 3: Please refer to Figure 1 , Figure 2 and Figure 8 , this embodiment further illustrates other embodiments. The sealing mechanism shown in the figure includes an arc-shaped top cover 21 fixedly mounted on the top of the device housing 1. The end of the arc-shaped top cover 21 is convenient for the wafer positioning ring 4 to rotate. The surface of the arc-shaped top cover 21 is provided with a plurality of openings corresponding to the wafer detection cavities. Two symmetrically distributed annular boxes 22 are fixedly mounted on the top of the arc-shaped top cover 21. The annular boxes 22 are located above the adjacent wafer detection cavities. A slip ring 23 is slidably mounted on the inner side of the annular box 22. A The top cover 24 is a hollow truncated cone structure. A plurality of support rods 25 symmetrically distributed in the center are fixedly installed on the top of the slip ring 23. The support rods 25 slide through the top of the annular box 22. A second spring 26 is fixedly installed between the top of the support rod 25 and the top of the annular box 22. The elasticity of the second spring 26 facilitates the movement and reset of the top cover 24. Two symmetrically distributed second mounting brackets 27 are fixedly installed on the top of the detection host 2. A visual detection probe 28 is fixedly installed on the end of the second mounting bracket 27 away from the detection host 2 A circular shell 29 is fixedly installed on the outer side of the visual inspection probe 28. The outer side of the circular shell 29 contacts the top opening of the top cover 24, so that the circular shell 29 abuts against the top opening of the top cover 24. By utilizing the elasticity of the second spring 26, the staff can press the top cover 24 to move downward, so that the circular shell 29 is separated from the top cover 24, which is convenient for disassembly and replacement of the visual inspection probe 28. The visual inspection probe 28 can detect the wafer directly below through the opening. The bottom of the slip ring 23 and the top cover 24 are both fixedly installed with inspection The testing light board 30 and the detection host 2 are fixedly mounted with two symmetrically distributed sealing plates 31 on the outside. The sealing plates 31 are located directly below the visual inspection probe 28. The top of the sealing plate 31 contacts the bottom of the inspection disk 3, so that the sealing plate 31 can provide a seal for the bottom of the wafer. The detection light board 30 is used to fully illuminate the wafer, making it easier for the visual inspection probe 28 to detect whether there are cracks and damages on the surface of the wafer. There can be multiple sealing plates 31, which are distributed below the two flatness detectors 6 to provide support for the bottom of the wafer.

[0038] Working principle: First, the staff puts the wafer above the left end of the arc pad 36 and into the wafer positioning ring 4, and aligns the wafer with the two adjacent arc clamping plates 16. Then, the staff starts the drive motor 11, so that the drive motor 11 drives the adjusting gear 12 to rotate, and the adjusting gear 12 drives the gear ring 10 to rotate, so that the gear ring 10 drives the detection disk 3 to rotate along the top of the arc bottom plate 19 and the bottom of the arc top cover 21, and the two arc clamping plates 16 on the outside of the wafer push the wafer to move along the surface of the arc pad 36. At this time, the wafer positioning ring 4 with the wafer drives the installation cylinder 13 to move, so that the installation cylinder 13 drives the two pulley rods 18 on the outside of the slider 14 to move along the outside of the arc block bar 20, and when the pulley rod 18 is separated from the arc block bar 20, the first A spring 17 pushes the slider 14 to move along the inner side of the mounting tube 13, so that the pulley rod 18 moves along the long groove on the mounting tube 13. At the same time, the slider 14 pushes the arc-shaped clamping plate 16 to move through the slide rod 15, and the slider 14 pushes the rubber ring 35 to contact the inner side of the mounting tube 13, providing a buffer for the arc-shaped clamping plate 16, so that the two arc-shaped clamping plates 16 can safely clamp and position the wafer. As the detection plate 3 rotates, the wafer positioning ring 4 with the wafer moves away from the arc-shaped pad 36, and the other wafer positioning ring 4 is aligned with the arc-shaped pad 36. The staff can then load the next wafer into the wafer positioning ring 4, thereby continuously loading the wafers. Then, the wafer positioning ring 4 with the wafer moves to the bottom of the top cover 24 and the top of the sealing plate 31, sealing. The plate 31 provides a seal for the bottom of the wafer positioning ring 4. At this time, the visual inspection probe 28 and the inspection light board 30 are turned on. Through the cooperation of the inspection light board 30 and the sealing plate 31, the visual inspection probe 28 detects whether the wafer has cracks and damage. Subsequently, the inspection disk 3 rotates again, and the wafer positioning ring 4 with the wafer is moved to the bottom of the flatness detector 6, so that the flatness detector 6 monitors the flatness of the top of the wafer. Thus, after completing the flatness detection, the inspection disk 3 rotates again. During the movement, the wafer positioning ring 4 drives the first mounting rod 7 and the second mounting rod 32 to move synchronously, so that the first mounting rod 7 drives the bevel gear 8 to move along the annular groove on the inspection host 2. When the bevel gear 8 contacts the arc rack 9, as the conical gear 8 contacts the arc rack 9, the conical gear 8 contacts the arc rack 9. The movement of the gear 8 causes the arc-shaped rack 9 to drive the bevel gear 8 to rotate half a circle, and the bevel gear 8 drives the first mounting rod 7 to rotate synchronously, so that the first mounting rod 7 drives the wafer positioning ring 4 and the second mounting rod 32 to rotate half a circle, and the wafer between the two arc-shaped clamping plates 16 can be turned over. At the same time, the spherical grooves on the first mounting rod 7 and the second mounting rod 32 push the elastic push rod 33 to compress, and after the first mounting rod 7 and the second mounting rod 32 stop rotating, the elastic push rod 33 is inserted into the spherical groove by utilizing the elasticity of the elastic push rod 33 to prevent the first mounting rod 7 and the second mounting rod 32 from being skewed, thereby ensuring that the wafer is in a horizontal state. Subsequently, the inspection plate 3 moves the wafer to the bottom of another flatness detector 6 and another visual inspection probe 28.A secondary inspection is performed on the other side of the wafer, thereby realizing continuous inspection of the wafer and improving the comprehensiveness and convenience of wafer inspection. Finally, the wafer that has been inspected is aligned with the material removal port of the arc bottom plate 19, and the two pulley rods 18 on the outside of the wafer are in contact with the arc end of the arc baffle 20, so that the arc baffle 20 pushes the pulley rod 18 to move, and the pulley rod 18 drives the slider 14 to move along the inner side of the mounting tube 13, so that the slider 14 compresses the first spring 17, and pulls the arc clamping plate 16 away from the outside of the wafer through the slide bar 15, so that the wafer is released, and the wafer that has been inspected can fall on the circular soft pad of the material removal port. Therefore, with the intermittent rotation of the inspection disk 3, the staff can continuously load, inspect and remove the wafer, thereby achieving the effect of continuous and comprehensive inspection, improving the inspection efficiency of the wafer, and realizing the automatic inspection of the wafer.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic detection device for semiconductor wafers, characterized in that: include: The device housing and the detection host installed inside the device housing, the detection host is installed with a detection plate on the outside, the detection plate is provided with a plurality of wafer detection cavities on the surface, the wafer detection cavity is provided with a wafer positioning ring inside, the top of the detection host is provided with two first mounting frames, and the outside of the first mounting frames is provided with a flatness detector; Also includes: A flip mechanism is installed on the inner side of the detection plate, and the flip mechanism includes a first mounting rod installed on the outer side of the wafer positioning ring, a bevel gear is fixedly installed on one end of the first mounting rod, an arc-shaped rack is installed on the outer side of the detection host, a gear ring is installed on the top of the detection plate, a drive motor is installed on the top of the detection host, an adjustment gear is fixedly installed on the output end of the drive motor, and a fixed rod assembly for providing positioning for the wafer positioning ring is also provided on the inner side of the detection plate; A material clamping mechanism, the material clamping mechanism is installed on the inner side of the wafer positioning ring, the material clamping mechanism includes two mounting tubes installed on the inner side of the wafer positioning ring, a slider is slidably installed on the inner side of the mounting tube, a slide bar is fixedly installed on the outer side of the slide bar, an arc-shaped clamping plate is fixedly installed on one end of the slide bar, a first spring is fixedly installed between one side of the slide bar and the inner side of the mounting tube, two pulley rods are installed on the outer side of the slide bar, an arc-shaped bottom plate is installed on the inner side of the device housing, and two arc-shaped blocking bars are fixedly installed on the top of the arc-shaped bottom plate; A sealing mechanism is installed on the top of the detection disk. The sealing mechanism includes an arc-shaped top cover installed on the top of the device shell, two annular boxes are installed on the top of the arc-shaped top cover, a slip ring is slidably installed on the inner side of the annular box, a top cover is fixedly installed on the inner side of the slip ring, a plurality of support rods are fixedly installed on the top of the slip ring, a second spring is fixedly installed between the top of the support rod and the top of the annular box, two second mounting frames are installed on the top of the detection host, a visual detection probe is installed at one end of the second mounting frame, detection light boards are installed on the bottom of the slip ring and the top cover, and two sealing plates are fixedly installed on the outer side of the detection host.

2. The automatic detection device for semiconductor wafers according to claim 1, characterized in that: The fixed rod assembly includes a second mounting rod installed on the outside of the wafer positioning ring, two elastic abutment rods are arranged on both sides of the first mounting rod and the second mounting rod, and spherical grooves for the elastic abutment rods to limit and insert are opened on the outside of the first mounting rod and the second mounting rod.

3. The automatic detection device for semiconductor wafers according to claim 1, characterized in that: A protective cushion is fixedly mounted on one end of the arc-shaped clamping plate.

4. The automatic detection device for semiconductor wafers according to claim 1, characterized in that: A rubber ring is fixedly mounted on one end of the sliding block.

5. The automatic detection device for semiconductor wafers according to claim 1, characterized in that: An arc-shaped pad is fixedly mounted on the top of the arc-shaped bottom plate.

6. The automatic detection device for semiconductor wafers according to claim 1, characterized in that: A material taking opening is provided on the top of the arc-shaped bottom plate, and the inner side of the material taking opening is sealed by a circular soft pad.

7. The automatic detection device for semiconductor wafers according to claim 1, characterized in that: A support bar is installed between the two ends of the arc bottom plate, and the top of the support bar is in contact with the bottom of the detection plate.

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