Chip packaging detection equipment for visual module processing and detection method thereof

Abstract

The invention relates to the technical field of chip packaging detection, and discloses chip packaging detection equipment for visual module processing and a detection method thereof.The chip packaging detection equipment comprises a heating mechanism, and the heating mechanism further comprises an equipment base. Before the equipment is used, a chip shell is placed on the surface of the conveying belt, an output line and a power source of the power motor are connected, the heating plate generates different temperatures due to diameter changes of the external output line, the thicker the output line is, the higher the temperature generated by the heating plate is, and the power motor drives the conveying belt to conduct the conveying function through the second pin roller. At the moment, the chip shell enters the equipment along with the displacement of the conveying belt, due to the influence of the thickness of the chip shell, when the chip shell enters the equipment, the chip shell is driven by the conveying belt to make contact with the rotating belt, and force borne by the rotating belt pushes the pressing plate to move upwards.

Description

Technical Field

[0001] This invention relates to the field of chip packaging and testing equipment technology, specifically to a chip packaging and testing equipment and method for visual module processing. Background Technology

[0002] Chip packaging refers to the process of encapsulating an integrated circuit chip (IC chip) in a protective casing. This casing is usually made of plastic, ceramic, or metal materials, and its main function is to protect the internal circuit structure of the chip while providing pins for connection with external circuits. The main purpose of chip packaging is to protect the chip from mechanical damage, moisture, dust, and other environmental factors, while also facilitating chip insertion, removal, and soldering, enabling its easy application in various electronic devices.

[0003] Most of these chips have plastic casings and use snap-fit ​​designs to improve packaging efficiency, such as those used in lighting chips or circuit boards. However, these snap-fit ​​designs are prone to detachment when exposed to high temperatures due to the softening of the plastic casing, affecting the casing's resistance to mechanical damage, moisture, and dust. To address these issues, the following solutions are proposed. Summary of the Invention

[0004] To solve the above technical problems, the present invention provides a chip packaging and inspection device for visual module processing, including a heating mechanism, the heating mechanism further including a device base, a fixed bracket fixedly connected to the top of the device base, and a plurality of output lines fixedly connected to the top of the fixed bracket. The pressure applying mechanism includes a support tube fixedly connected to the top of the equipment base, a detector fixedly connected to the side wall of the support tube, a sliding rod slidably connected to the inner wall of the support tube, and the outer wall of the sliding rod slidably connected to the inner wall of the detector. The cleaning mechanism includes a slide rail fixedly connected to the side wall of the support tube, a special-shaped rail fixedly connected to the side wall of the slide rail, and a cleaning arc rod fixedly connected to the side wall of the special-shaped rail.

[0005] Preferably, the heating mechanism further includes a heating plate fixedly connected to the end of the fixed bracket away from the equipment base, a plurality of output lines fixedly connected to the side wall of the heating plate at the end away from the fixed bracket, and a roller rotatably connected to the top of the equipment base.

[0006] Preferably, the heating mechanism further includes a second roller rotatably connected to the top of the equipment base. A transmission belt is fitted on the outer wall of the second roller. A power motor is fixedly connected to the top of the equipment base. The output shaft of the power motor is fixedly connected to the outer wall of the second roller. A discharge port is opened on the side wall of the equipment base. A chip shell is placed on the top of the transmission belt. Taking advantage of the multi-clamp design of the plastic shell, if the outer wall of the chip shell softens due to high temperature during high-temperature and high-pressure testing, the internal clamps of the chip shell will loosen.

[0007] Preferably, the pressure applying mechanism further includes a support plate fixedly connected to the end of the sliding rod away from the support tube, a roller assembly rotatably connected to the side wall of the support plate, and a rotating belt sleeved on the outer wall of the roller assembly.

[0008] Preferably, the pressure applying mechanism further includes a tension spring fixedly connected to the side wall of the support plate. A pressure plate is fixedly connected to the side wall of the support plate, and the end of the tension spring away from the support plate is fixedly connected to the top of the equipment base. Taking advantage of the fact that the detection material is mostly plastic, a heating plate and a pressure applying mechanism are set inside the equipment. Before using the equipment, the chip shell is placed on the surface of the transmission belt, and the power supply of the output line and the power motor is turned on. The heating plate generates different temperatures depending on the diameter of the external output line. The thicker the output line, the higher the temperature generated by the heating plate. The power motor drives the transmission belt for transmission through rollers. Functionally, the chip casing will enter the equipment along with the displacement of the conveyor belt. Due to the thickness of the chip casing itself, when the chip casing enters the equipment, it will come into contact with the rotating belt under the drive of the conveyor belt. The force on the rotating belt will push the pressure plate upward. During this process, the chip casing will still move outward with the conveyor belt. Through the application of the above components, after the chip casing is deeply inserted into the equipment, the tension spring will generate a stretching force. This force will act on the surface of the chip casing through the pressure plate, realizing the detection of the plastic casing's resistance to pressure under different high temperature conditions.

[0009] Preferably, the cleaning mechanism further includes a baffle fixedly connected to the inner wall of the discharge port, a plurality of cleaning grooves are formed on the outer wall of the conveyor belt, cleaning slide rods are slidably connected to the inner walls of the plurality of cleaning grooves, and scrapers are fixedly connected to the side walls of the cleaning slide rods. When the conveyor belt is used for transmission, the cross-sectional position of the cleaning slide rod is always in motion. When the cleaning slide rod moves to the position of the irregular track, due to the outward extension characteristic of the irregular track, the cleaning slide rod will drive the scraper to move laterally along the inner wall of the cleaning groove, such as... Figure 7 As shown, during this process, the scraper will scrape the inner wall of the cleaning chute. The application of the above components prevents the thermally softened chip shell from sticking to the surface of the conveyor belt, which would increase the impurities on the outer wall of the conveyor belt and increase its thickness. When the chip shell is placed on the conveyor belt, the pressure on the tension spring will increase, affecting the measurement accuracy.

[0010] Preferably, the cleaning mechanism further includes a scraping column rotatably connected to the inner wall of the equipment base. A power belt is fitted onto the outer wall of the scraping column. The end of the power belt away from the scraping column is rotatably connected to the outer wall of the roller. The end of the cleaning slide rod away from the scraper is slidably connected to the inside of the slide rail. After the equipment completes the scraping, due to the high stickiness of the heat-softened plastic, some of the accumulated impurities are removed from the equipment by the scraping of the cleaning arc rod, while the rest remain stuck to the outer wall of the scraper. As the transmission belt runs, the cleaning slide rod, constrained by the shape of the irregular rail, pushes the scraper outward. During this process, the scraper moves the impurities to the side of the equipment. Inside the equipment, the scraping column and power belt are controlled by the scraping column, causing the contact position of the power belt to run in opposite directions. As the scraper moves the impurities toward the center of the equipment, the impurities come into contact with the scraping column. The rotating scraping column knocks away the sticky impurities, causing them to come into contact with the baffle. Through the application of the above components, the equipment can autonomously remove impurities, preventing large particles of impurities from hardening and affecting the operating efficiency of the equipment.

[0011] A detection method for a chip packaging inspection device for visual module processing includes the following steps: S1: Before use, place the chip casing on the surface of the conveyor belt and connect the output line to the power motor. The heating plate will generate different temperatures depending on the diameter of the external output line. The thicker the output line, the higher the temperature generated by the heating plate. S2: The power motor drives the transmission belt through the rollers to perform the transmission function. At this time, the chip shell will enter the equipment with the displacement of the transmission belt. Due to the thickness of the chip shell itself, when the chip shell enters the equipment, it will come into contact with the rotating belt under the drive of the transmission belt. S3: The force on the rotating belt will push the pressure plate upward. During this process, the chip casing will continue to move outward with the conveyor belt. After the chip casing is inserted into the equipment, the tension spring will generate a stretching force. This force will act on the surface of the chip casing through the pressure plate.

[0012] The present invention has the following beneficial effects: (1) This invention utilizes the characteristic that the detection material is mostly plastic. A heating plate and a pressure mechanism are set inside the device. Before using the device, the chip shell is placed on the surface of the conveyor belt and the power supply of the output line and the power motor are connected. The heating plate generates different temperatures due to the change in the diameter of the external output line. The thicker the output line, the higher the temperature generated by the heating plate. The power motor drives the conveyor belt through the rollers to perform the transmission function. At this time, the chip shell will enter the device with the displacement of the conveyor belt. Due to the influence of the thickness of the chip shell itself, when the chip shell enters the device, it will contact the rotating belt under the drive of the conveyor belt. The force on the rotating belt will push the pressure plate to move upward. During this process, the chip shell still moves outward with the conveyor belt. Through the application of the above components, after the chip shell is deeply inserted into the device, the tension spring will generate a stretching force. This force acts on the surface of the chip shell through the pressure plate, realizing the detection of the plastic shell's resistance to pressure under different high temperature states.

[0013] (2) This invention utilizes the multi-clamp design of the plastic shell. When the equipment is subjected to high temperature and high pressure testing, if the outer wall of the chip shell softens due to high temperature, the buckles inside the chip shell will loosen. The pressure applied by the pressure plate will force the chip shell to deform. During this process, the support plate will move slowly and for a long time under the drive of the tension spring. When the chip shell enters the equipment and is discharged, since the chip shell directly enters the equipment, the support plate will move quickly and for a short time under the control of the tension spring. The detector achieves rapid detection of the equipment by detecting the above two changes.

[0014] (3) In this invention, when the conveyor belt is used for transmission, the cross-sectional position of the cleaning slide bar is always in motion. When the cleaning slide bar moves to the position of the irregular track, due to the outward extension characteristic of the irregular track, the cleaning slide bar will drive the scraper to move laterally along the inner wall of the cleaning chute, such as... Figure 7 As shown, during this process, the scraper will scrape the inner wall of the cleaning chute. The application of the above components prevents the thermally softened chip shell from sticking to the surface of the conveyor belt, which would increase the impurities on the outer wall of the conveyor belt and increase its thickness. When the chip shell is placed on the conveyor belt, the pressure on the tension spring will increase, affecting the measurement accuracy.

[0015] (4) After the equipment completes the scraping, due to the high viscosity of the heat-softened plastic, some of the accumulated impurities are removed from the equipment by the scraping of the cleaning arc rod, while the other part remains stuck to the outer wall of the scraper. As the conveyor belt runs, the cleaning slide rod is restricted by the shape of the irregular rail, pushing the scraper to move outward. During this process, the scraper drives the impurities to move to the side of the equipment. The equipment is equipped with a scraping column and a power belt. Under the control of the scraping column, the contact position of the power belt is reversed. When the scraper drives the impurities to move towards the center of the equipment, the impurities come into contact with the scraping column. The rotating scraping column will knock away the stuck impurities, causing the impurities to come into contact with the baffle. Through the application of the above components, the equipment can autonomously remove impurities, avoiding the hardening of large particles of impurities and affecting the operating efficiency of the equipment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is an exploded view of the overall structural components of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention; Figure 3 This is a schematic diagram of the internal components of the heating mechanism of the present invention; Figure 4 This is a schematic diagram of the pressure application mechanism of the present invention; Figure 5 This is a schematic diagram of the internal components of the pressure application mechanism of the present invention; Figure 6 This is a cross-sectional schematic diagram of the cleaning mechanism of the present invention; Figure 7 For the present invention Figure 6 Enlarged diagram of A in the middle; Figure 8 This is a schematic diagram of the workflow of the present invention.

[0018] In the accompanying drawings, the components represented by the reference numerals are as follows: In the diagram: 1. Heating mechanism; 101. Equipment base; 102. Fixed bracket; 103. Output line; 104. Heating plate; 105. Roller one; 106. Roller two; 107. Transmission belt; 108. Power motor; 109. Discharge port; 110. Chip shell; 2. Pressing mechanism; 201. Support tube; 202. Detector; 203. Sliding rod; 204. Support plate; 205. Roller assembly; 206. Tension spring; 207. Pressing plate; 208. Rotating belt; 3. Cleaning mechanism; 301. Slide rail; 302. Irregular rail; 303. Baffle; 304. Cleaning chute; 305. Cleaning slide bar; 306. Scraper; 307. Scraping column; 308. Power belt; 309. Cleaning arc bar. Detailed Implementation

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] For example 1, please refer to Figure 1 - Figure 3 The present invention is a chip packaging and testing device for visual module processing, including a heating mechanism 1, the heating mechanism 1 further including a device base 101, a fixed bracket 102 fixedly connected to the top of the device base 101, and a plurality of output lines 103 fixedly connected to the top of the fixed bracket 102. The pressure applying mechanism 2 includes a support tube 201 fixedly connected to the top of the equipment base 101, a detector 202 fixedly connected to the side wall of the support tube 201, and a sliding rod 203 slidably connected to the inner wall of the support tube 201. The outer wall of the sliding rod 203 is slidably connected to the inner wall of the detector 202. The cleaning mechanism 3 includes a slide rail 301 fixedly connected to the side wall of the support tube 201, a special-shaped rail 302 fixedly connected to the side wall of the slide rail 301, and a cleaning arc rod 309 fixedly connected to the side wall of the special-shaped rail 302.

[0021] The heating mechanism 1 also includes a heating plate 104 fixedly connected to the end of the fixed bracket 102 away from the equipment base 101, and a plurality of output lines 103 fixedly connected to the side wall of the heating plate 104 at the end away from the fixed bracket 102. A roller 105 is rotatably connected to the top of the equipment base 101.

[0022] The heating mechanism 1 also includes a second roller 106 rotatably connected to the top of the equipment base 101. A transmission belt 107 is fitted on the outer wall of the second roller 106. A power motor 108 is fixedly connected to the top of the equipment base 101. The output shaft of the power motor 108 is fixedly connected to the outer wall of the second roller 106. A discharge port 109 is opened on the side wall of the equipment base 101. A chip shell 110 is placed on the top of the transmission belt 107. Taking advantage of the multi-clamp design of the plastic shell, if the outer wall of the chip shell 110 softens due to high temperature during high-temperature and high-pressure testing, the clips inside the chip shell 110 will loosen.

[0023] Example 2, please refer to Figure 4 - Figure 8 The present invention is a chip packaging and testing device for visual module processing. Based on the first embodiment, the pressure mechanism 2 further includes a support plate 204 fixedly connected to the end of the sliding rod 203 away from the support tube 201. A roller assembly 205 is rotatably connected to the side wall of the support plate 204, and a rotating belt 208 is sleeved on the outer wall of the roller assembly 205.

[0024] The pressure mechanism 2 also includes a tension spring 206 fixedly connected to the side wall of the support plate 204. A pressure plate 207 is fixedly connected to the side wall of the support plate 204. The end of the tension spring 206 away from the support plate 204 is fixedly connected to the top of the equipment base 101. Taking advantage of the fact that the detection material is mostly plastic, a heating plate 104 and a pressure mechanism 2 are set inside the equipment. Before using the equipment, the chip shell 110 is placed on the surface of the transmission belt 107, and the power supply of the output line 103 and the power motor 108 is connected. The heating plate 104 generates different temperatures due to the change in the diameter of the external output line 103. The thicker the output line 103, the higher the temperature generated by the heating plate 104. The power motor 108 drives the transmission belt 107 through the roller 106. 7. During the transmission function, the chip casing 110 will enter the equipment along with the displacement of the conveyor belt 107. Due to the thickness of the chip casing 110 itself, when the chip casing 110 enters the equipment, it will come into contact with the rotating belt 208 under the drive of the conveyor belt 107. The force on the rotating belt 208 will push the pressure plate 207 upward. During this process, the chip casing 110 will still move outward with the conveyor belt 107. Through the application of the above components, after the chip casing 110 enters the equipment, the tension spring 206 will generate a stretching force. This force will act on the surface of the chip casing 110 through the pressure plate 207, so as to detect the resistance of the plastic casing to pressure under different high temperature conditions.

[0025] The cleaning mechanism 3 also includes a baffle 303 fixedly connected to the inner wall of the discharge port 109. Several cleaning grooves 304 are formed on the outer wall of the conveyor belt 107. Cleaning rods 305 are slidably connected to the inner walls of the cleaning grooves 304. Scrapers 306 are fixedly connected to the side walls of the cleaning rods 305. When transported by the conveyor belt 107, the cross-sectional position of the cleaning rods 305 is always in motion. When the cleaning rods 305 move to the position of the shaped rail 302, due to the outward extension of the shaped rail 302, the cleaning rods 305 will drive the scrapers 306 to move laterally along the inner wall of the cleaning grooves 304. Figure 7 As shown, during this process, the scraper 306 will scrape the inner wall of the cleaning chute 304. Through the application of the above components, the heat-softened chip shell 110 is prevented from sticking to the surface of the transmission belt 107, which would increase the impurities on the outer wall of the transmission belt 107 and increase its thickness. Subsequently, when the chip shell 110 is placed on the transmission belt 107, the pressure on the tension spring 206 will increase, affecting the measurement accuracy.

[0026] The cleaning mechanism 3 also includes a scraping column 307 rotatably connected to the inner wall of the equipment base 101. A power belt 308 is fitted onto the outer wall of the scraping column 307. One end of the power belt 308 away from the scraping column 307 is rotatably connected to the outer wall of the roller 105. The end of the cleaning slide bar 305 away from the scraper 306 is slidably connected to the inside of the slide rail 301. After the equipment completes the scraping, due to the high stickiness of the heat-softened plastic, some of the accumulated impurities are removed from the equipment by the scraping of the cleaning arc bar 309, while the other part remains stuck to the outer wall of the scraper 306. As the transmission belt 107 runs, the cleaning slide bar 305, constrained by the shape of the irregular rail 302, pushes the scraper 306 outward. During this process, the scraper 306 moves the impurities to the side of the equipment. The scraping column 307 and the power belt 308 are installed inside the equipment. Under the control of the scraping column 307, the contact position of the power belt 308 runs in the opposite direction. When the scraper 306 moves the impurities toward the center of the equipment, the impurities come into contact with the scraping column 307. The rotating scraping column 307 will knock away the sticky impurities, causing the impurities to come into contact with the baffle 303. Through the application of the above components, the equipment can autonomously remove impurities, avoiding the hardening of large particles of impurities and affecting the operating efficiency of the equipment.

[0027] The testing method of this packaging testing device includes the following steps: S1: Before use, place the chip shell 110 on the surface of the transmission belt 107 and connect the power supply of the output line 103 and the power motor 108. The heating plate 104 generates different temperatures due to the change in the diameter of the external output line 103. The thicker the output line 103, the higher the temperature generated by the heating plate 104. S2: The power motor 108 drives the transmission belt 107 through the roller 106 to perform the transmission function. At this time, the chip shell 110 will enter the equipment with the displacement of the transmission belt 107. Due to the thickness of the chip shell 110 itself, when the chip shell 110 enters the equipment, it will come into contact with the rotating belt 208 under the drive of the transmission belt 107. S3: The force on the rotating belt 208 will push the pressure plate 207 to move upward. During this process, the chip casing 110 will still follow the transmission belt 107 to move outward. After the chip casing 110 is deeply inside the equipment, the tension spring 206 will generate a stretching force. This force will act on the surface of the chip casing 110 through the pressure plate 207.

[0028] One specific application of this embodiment is as follows: Taking advantage of the fact that the detection material is mostly plastic, the device includes a heating plate 104 and a pressure mechanism 2. Before using the device, the chip casing 110 is placed on the surface of the transmission belt 107, and the power supply to the output line 103 and the power motor 108 is connected. The heating plate 104 generates different temperatures depending on the diameter of the external output line 103; the thicker the output line 103, the higher the temperature generated by the heating plate 104. The power motor 108 drives the transmission belt 107 via rollers 106 for transmission. At this time, the chip casing 110 will enter the device along with the displacement of the transmission belt 107. In this part, due to the thickness of the chip casing 110 itself, when the chip casing 110 enters the equipment, it will come into contact with the rotating belt 208 under the drive of the conveyor belt 107. The force on the rotating belt 208 will push the pressure plate 207 to move upward. During this process, the chip casing 110 still moves outward with the conveyor belt 107. Through the application of the above components, after the chip casing 110 enters the equipment, the tension spring 206 will generate a stretching force. This force acts on the surface of the chip casing 110 through the pressure plate 207, so as to detect the resistance of the plastic casing to pressure under different high temperature conditions.

[0029] Utilizing the multi-clamp design of the plastic shell, during high-temperature and high-pressure testing, if the outer wall of the chip shell 110 softens due to high temperature, the internal clamps of the chip shell 110 will loosen. The pressure applied by the pressure plate 207 will force the chip shell 110 to deform. During this process, the support plate 204, driven by the tension spring 206, will move slowly and for a long time downwards. However, when the chip shell 110 enters the equipment and exits, since it directly enters the equipment, the support plate 204, controlled by the tension spring 206, will move quickly and for a short time up and down. The detector 202 detects these two changes to achieve rapid testing. When using the conveyor belt 107 for transmission, the cross-sectional position of the cleaning slide bar 305 is always in motion. When the cleaning slide bar 305 moves to the position of the shaped rail 302, due to the outward extension of the shaped rail 302, the cleaning slide bar 305 will drive the scraper 306 to move laterally along the inner wall of the cleaning chute 304. Figure 7 As shown, during this process, the scraper 306 will scrape the inner wall of the cleaning chute 304. Through the application of the above components, the heat-softened chip shell 110 is prevented from sticking to the surface of the transmission belt 107, which would increase the impurities on the outer wall of the transmission belt 107 and increase its thickness. Subsequently, when the chip shell 110 is placed on the transmission belt 107, the pressure on the tension spring 206 will increase, affecting the measurement accuracy.

[0030] After the equipment completes the scraping process, due to the high stickiness of the softened plastic, some of the accumulated impurities are removed from the equipment by the scraping of the cleaning arc rod 309, while others remain stuck to the outer wall of the scraper 306. As the conveyor belt 107 runs, the cleaning slide rod 305, constrained by the shape of the irregular rail 302, pushes the scraper 306 outward. During this process, the scraper 306 moves the impurities to the side of the equipment. Inside the equipment, there is a scraping column 307 and a power belt 308. Controlled by the scraping column 307, the contact position of the power belt 308 is reversed. When the scraper 306 moves the impurities towards the center of the equipment, the impurities come into contact with the scraping column 307. The rotating scraping column 307 knocks away the stuck impurities, causing them to come into contact with the baffle 303. Through the application of the above components, the equipment can autonomously remove impurities, preventing large particles of impurities from hardening and affecting the operating efficiency of the equipment.

[0031] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A chip packaging detection device for visual module processing, comprising a heating mechanism (1), the heating mechanism (1) also comprising a device base (101), the top of the device base (101) being fixedly connected to a fixed bracket (102), the top of the fixed bracket (102) being fixedly connected to a plurality of output lines (103), characterized in that: Also includes: A pressure mechanism (2), the pressure mechanism (2) comprising a support tube (201) fixedly connected to the top of the device base (101), a detector (202) fixedly connected to the side wall of the support tube (201), a sliding rod (203) slidably connected to the inner wall of the support tube (201), and an outer wall of the sliding rod (203) slidably connected to the inner wall of the detector (202); A cleaning mechanism (3), the cleaning mechanism (3) comprising a slide rail (301) fixedly connected to a side wall of a support tube (201), a profiled rail (302) fixedly connected to the side wall of the slide rail (301), and a cleaning arc rod (309) fixedly connected to the side wall of the profiled rail (302).

2. The chip packaging detection equipment for visual module processing according to claim 1 is characterized in that: The heating mechanism (1) further comprises a heating plate (104) fixedly connected to an end of the fixed bracket (102) away from the device base (101); one end of a plurality of output lines (103) away from the fixed bracket (102) is fixedly connected to a side wall of the heating plate (104); and a roller 1 (105) is rotatably connected to the top of the device base (101).

3. The chip packaging detection equipment for visual module processing according to claim 2 is characterized in that: The heating mechanism (1) further comprises a second roller (106) rotatably connected to the top of the device base (101); a transmission belt (107) is sleeved on the outer wall of the second roller (106); a power motor (108) is fixedly connected to the top of the device base (101); an output shaft of the power motor (108) is fixedly connected to the outer wall of the second roller (106); a discharge port (109) is provided on the side wall of the device base (101); and a chip housing (110) is placed on the top of the transmission belt (107).

4. The chip packaging detection equipment for visual module processing according to claim 3 is characterized in that: The pressure-applying mechanism (2) further comprises a support plate (204) fixedly connected to an end of the sliding rod (203) away from the support tube (201); a roller group (205) is rotatably connected to a side wall of the support plate (204); and a rotating belt (208) is sleeved on an outer wall of the roller group (205).

5. The chip packaging detection equipment for visual module processing according to claim 4 is characterized in that: The pressure mechanism (2) further comprises a pulling spring (206) fixedly connected to the side wall of the support plate (204), a pressure plate (207) being fixedly connected to the side wall of the support plate (204), and one end of the pulling spring (206) away from the support plate (204) being fixedly connected to the top of the device base (101).

6. The chip packaging detection equipment for visual module processing according to claim 5, characterized in that: The cleaning mechanism (3) further comprises a baffle (303) fixedly connected to the inner wall of the discharge port (109); a plurality of cleaning chutes (304) are provided on the outer wall of the transmission belt (107); cleaning slide bars (305) are slidably connected to the inner walls of the plurality of cleaning chutes (304); and a scraper (306) is fixedly connected to the side wall of the cleaning slide bar (305).

7. The chip packaging detection equipment for visual module processing according to claim 6 is characterized in that: The cleaning mechanism (3) further comprises a scratch column (307) rotatably connected to the inner wall of the device base (101); a power belt (308) is sleeved on the outer wall of the scratch column (307); an end of the power belt (308) away from the scratch column (307) is rotatably connected to the outer wall of the roller (105); and an end of the cleaning slide rod (305) away from the scraper (306) is slidably connected to the inside of the slide rail (301).

8. A chip packaging detection method for visual module processing, using a chip packaging detection device for visual module processing as claimed in claim 7, characterized in that: The steps include: S1: Before use, the chip housing (110) is placed on the surface of the transmission belt (107), and the output line (103) and the power supply of the power motor (108) are turned on, wherein the heating plate (104) generates different temperatures due to the change in the diameter of the external output line (103), and the thicker the output line (103), the higher the temperature generated by the heating plate (104); S2: The power motor (108) drives the transmission belt (107) to perform the transmission function through the second roller (106). At this time, the chip housing (110) will enter the interior of the device along with the displacement of the transmission belt (107). Due to the thickness of the chip housing (110), when the chip housing (110) enters the interior of the device, the chip housing (110) will contact the rotating belt (208) under the drive of the transmission belt (107); S3: The force exerted on the rotating belt (208) will push the pressure plate (207) to move upwards. During this process, the chip housing (110) will continue to move outwards along with the transmission belt (107). After the chip housing (110) penetrates into the interior of the device, the pulling spring (206) will generate a telescopic force, which acts on the surface of the chip housing (110) through the pressure plate (207).

Images