Inspection device and inspection method of semiconductor packaging test carrier

Abstract

The invention relates to the technical field of semiconductor packaging test equipment, and particularly discloses an inspection device and method for a semiconductor packaging test carrier, and the device comprises a pedestal, a conveying mechanism, a first inspection module, a resistance collection mechanism, and a control system. The conveying mechanism is fixed to the base and used for conveying the to-be-detected carrier to pass through the first detection module in the longitudinal direction. If the shape, the size and the arrangement position of the carrier groove of the to-be-detected carrier are abnormal, the defect, deformation and abrasion degree of the to-be-detected carrier can be quantitatively judged, the abnormity of the semiconductor packaging test carrier can be more accurately detected compared with manual work, measurement errors and subjective judgment of measurement results do not exist, and the detection accuracy is improved. The accuracy and the reliability of the abnormal detection of the carrier are relatively high; manual visual inspection or use is not needed, the conveying mechanism is matched with the first inspection module, the thrust sensor and the control system to automatically complete carrier abnormality inspection, efficient and rapid inspection is achieved, carriers can be inspected in batches, and production work benefits are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging and testing equipment, and in particular to an inspection device and an inspection method for a semiconductor packaging and testing carrier. Background Art

[0002] Semiconductor packaging and testing carriers are tools used to transport, support and position semiconductor products during the packaging and testing phases. The carriers ensure the precise alignment and stability of semiconductor devices during the testing process. In actual production applications, semiconductor products are pushed from the longitudinal channel of the carrier into the carrier's carrier slot, and the carrier carries the semiconductor products for transportation and packaging testing. After the packaging and testing of the semiconductor products are completed, the semiconductor products are longitudinally withdrawn, and the next batch of products to be produced are pushed longitudinally again. The semiconductor products are loaded repeatedly in this cycle. The carrier is prone to defects, deformation, wear and wrinkling and other abnormalities. The size and position of the carrier for batch loading of semiconductors are positioned according to the position requirements of the production line. When the semiconductor chip is loaded into the carrier, if the carrier has defects, deformation or wear and other abnormalities, the semiconductor loaded into the carrier is prone to packaging deviation due to carrier defects and collapse, extrusion due to carrier deformation, or scratches due to carrier wear and wrinkling. For example, the overall length, width and thickness of semiconductor products are relatively long, wide and thin. If the carrier is deformed or damaged, the product will bend, deform or tilt when it is automatically loaded into the carrier, which will eventually cause the batch of packaging and testing products to be scrapped. Therefore, the carrier needs to be regularly inspected and maintained for abnormalities to reduce the number of product damages and scraps and maintain the production efficiency of semiconductor packaging and testing.

[0003] According to the type of semiconductor products, there are many types of carriers with different sizes and shapes. The existing inspection or examination methods for carrier abnormalities mainly include visual inspection, sampling measurement, fixture observation, etc. Visual inspection can only observe relatively obvious defects, which is more dependent on the experience of the inspectors, and the effectiveness of the inspection is not high. The sampling measurement method measures the size and shape of the carrier. The measurement personnel often use a vernier caliper or a steel ruler to directly measure, which has a large measurement error and a limited sampling sample. There are abnormal carriers that are missed, and the abnormal carriers cannot be effectively screened out. The fixture observation is to manually put the carrier into a standard size fixture rack, observe with the human eye whether the appearance of the carrier meets the standard size requirements of the fixture, and rely on the operator's senses to judge whether the carrier has passed the inspection. The inspection results cannot be quantified, and the reliability of the inspection results is low. Summary of the invention

[0004] The purpose of the present invention is to provide an inspection device and method for a semiconductor packaging test carrier in view of the fact that the abnormal inspection of semiconductor packaging test carriers in the prior art relies on sensory testing and judgment or manual measurement by inspectors, which has the problems of large measurement errors and low reliability of measurement results.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is:

[0006] A semiconductor packaging test carrier inspection device, comprising: a base, a conveying mechanism, a first inspection module, a resistance collection mechanism and a control system; the conveying mechanism is fixed to the base, and the conveying mechanism is used to convey the carrier to be inspected through the first inspection module in the longitudinal direction;

[0007] The first inspection module comprises at least two templates arranged longitudinally on the plate surface; the inner sides of the templates are respectively fixed to the base; the outer sides of the two templates are for the side walls of the carrier to be inspected to pass longitudinally; the outer sides of the templates are provided with a plurality of detection sheets extending transversely; the shape, size and arrangement position of the detection sheets are all adapted to the shape, size and arrangement position of the loading slot of the standard carrier;

[0008] The resistance collection mechanism includes a push plate and a thrust sensor; the push plate is longitudinally slidably connected to the conveying mechanism, and can be pressed against the longitudinal end of the vehicle to be inspected; the thrust sensor fixes the side of the push plate close to the vehicle to be inspected; the thrust sensor is used to measure the longitudinal force of the vehicle to be inspected on the push plate; the thrust sensor can transmit the data of the longitudinal force to the control system through an electrical signal.

[0009] The inspection device for semiconductor packaging test carrier described in the present invention provides a first inspection module, and the outer sides of the two templates of the first inspection module are used for the side walls of the carrier to be inspected to pass longitudinally. If the shape, size and arrangement position of the carrier to be inspected are abnormal due to defects, deformation or wear and tear and do not conform to the standard carrier, the detection piece of the template and the shape, size and arrangement position of the carrier to be inspected are not compatible. Since the inner side of each template is fixed to the base, the side wall of the carrier to be inspected and the template or the detection piece will generate resistance due to the mismatch. By providing a push plate and a thrust sensor, the push plate is pressed against the longitudinal end of the carrier to be inspected, and the carrier to be inspected will be subjected to the resistance of the template or the detection piece, which is transmitted to the push plate to form a longitudinal force equal to the resistance, and is acquired by the thrust sensor. The thrust sensor is powered on and the data of the longitudinal force is transmitted to the control system, thereby The control system obtains the resistance of the carrier to be inspected through the first inspection module. If the resistance exceeds the resistance threshold set by the control system, the carrier to be inspected is judged to be unqualified. If the deformation, defect and wear are small, and the semiconductor product can still be successfully carried or placed in the carrier slot, it does not need to be judged as unqualified although it is abnormal. The device can quantitatively determine the degree of defect, deformation and wear of the carrier to be inspected, and inspect the deformation and damage of the semiconductor packaging test carrier more accurately than manual inspection. There is no measurement error and subjective judgment of the measurement result, which improves the accuracy and reliability of the carrier abnormality inspection. There is no need for manual visual inspection or use. The conveying mechanism cooperates with the first inspection module, thrust sensor and control system to automatically complete the carrier abnormality inspection, realize efficient and rapid inspection, and can inspect carriers in batches to improve production work efficiency.

[0010] Preferably, in the inspection device of the semiconductor packaging test carrier described in the present invention, a second inspection module is further provided on the longitudinal side of the first inspection module, and the second inspection module includes two scale plates erected on the base; the inner ridges of the scale plates are vertically perpendicular to the base; the inner side spacing of the two scale plates is adapted to the outer width of the standard carrier, so that the carrier to be inspected can pass through the gap inside the two scale plates.

[0011] As a preferred solution of the present invention, a second inspection module is arranged on the basis of the first inspection module, the inner ribs of the two scale plates of the second inspection module are vertically perpendicular to the base, and the inner spacing is adapted to the width of the standard carrier. If the two outer walls of the carrier to be inspected are bent, tilted or deformed due to damage, deformation or wear, the outer width of the mold to be tested and the inner spacing of the two scale plates will not match, and the inner surfaces of the two scale plates will produce a large friction resistance to the outer side of the carrier to be inspected. Similarly, the thrust sensor transmits the resistance to the control system, and by comparing the resistance thresholds, it can quickly determine the verticality or inclination abnormalities of the two side walls of the carrier to be inspected, thereby increasing the inspection of the abnormal types of the carrier. Compared with the traditional inspection that cannot detect abnormalities in verticality or inclination on one side, the device further improves the effectiveness of abnormality inspection.

[0012] Preferably, in the inspection device of the semiconductor packaging test carrier described in the present invention, the first inspection module also includes a fixing seat and a bracket; the inner sides of the two templates are fixed to the fixing seat; and the longitudinal end of the fixing seat is fixed to the base through the bracket.

[0013] As a preferred solution of the present invention, by fixing the inner sides of the two templates to a fixing seat, on the one hand, the stability of the fixing seat can be maintained, and the fixing seat supports the template from the inside to the outside, thereby avoiding the movement of the template due to the large deformation resistance of the carrier to be tested, thereby further ensuring the stability of the test, reducing the error in the resistance measurement caused by the shaking of the device or mechanical force, and further improving the accuracy of the inspection.

[0014] Preferably, in the inspection device of the semiconductor packaging test carrier described in the present invention, the bracket is fixed to the base through a sliding seat; one end of the bracket away from the fixed seat is vertically slidably connected to the sliding seat, thereby being able to move vertically.

[0015] As a preferred solution of the present invention, a sliding seat is provided, and one end of the bracket is vertically slidably connected to the sliding seat, so that it can move vertically, so that the other end of the bracket can drive the fixed seat to move vertically, and then adjust the vertical position of the template, so that the template can be suitable for the inspection of carriers with different height dimensions or different vertical positions of the loading slots, thereby increasing the universality of the device and enhancing its applicability.

[0016] Preferably, the inspection device for the semiconductor packaging test carrier described in the present invention is provided with a safety cover above the conveying mechanism; the safety cover can cover the outside of the carrier to be inspected and the first inspection module.

[0017] As a preferred solution of the present invention, by providing the safety cover, it is possible to avoid accidental touch that affects the resistance test of the vehicle during the transportation of the vehicle to be inspected. On the one hand, it effectively prevents safety hazards caused by accidental touch, and on the other hand, it improves the accuracy of the thrust sensor's measurement of the resistance exerted on the vehicle, further improving the reliability of the inspection results of the device for inspecting vehicle abnormalities.

[0018] Preferably, the inspection device for the semiconductor packaging test carrier described in the present invention further includes an automatic alarm; the electrical signal of the automatic alarm is connected to the control system; the automatic alarm outputs an alarm signal when the control system determines that the carrier to be inspected is unqualified.

[0019] As a preferred solution of the present invention, through the setting of the alarm, it is possible to cooperate with the control system to quickly output the inspection result of the vehicle being unqualified to the inspector through an alarm signal, so that the inspector can obtain the inspection result in a timely and intuitive manner, further improving the fast and efficient characteristics of the device and making it more convenient to use.

[0020] To achieve the purpose of the present invention, the present invention also provides a method for inspecting a semiconductor packaging test carrier, comprising the following steps:

[0021] S1. Setting a resistance threshold range according to a first resistance value obtained by testing an unqualified vehicle;

[0022] S2, placing the carrier to be inspected on the conveying mechanism, controlling the conveying mechanism, driving the push plate to press against the longitudinal end of the carrier to be inspected, so that the thrust sensor contacts the longitudinal end of the carrier to be inspected; moving the carrier to be inspected and the resistance collection mechanism together toward the first inspection module and the second inspection module;

[0023] S3, obtaining the longitudinal force of the vehicle to be inspected on the thrust sensor through the thrust sensor, and then obtaining the second resistance value encountered by the vehicle to be inspected during the process of passing through the first inspection module and the second inspection;

[0024] S4, determining whether the second resistance value exceeds the resistance threshold range;

[0025] S5. If the second resistance value exceeds the resistance threshold range, the carrier to be inspected is determined to be unqualified; if the second resistance value does not exceed the resistance threshold range, the carrier to be inspected is determined to be qualified.

[0026] The inspection method of the semiconductor packaging test carrier described in the present invention, through steps S2 and S3, enables the inspection of the carrier abnormality to be carried out through the first inspection module and the second inspection module, and then the second resistance value can be obtained, and then the resistance threshold range is set in conjunction with step S1 to judge whether the second resistance value exceeds the resistance threshold range. It can quickly and effectively determine whether the carrier to be inspected is qualified, so that the abnormal inspection of the carrier to be inspected can be quantified through the size of the resistance value, and the deformation and damage degree of the semiconductor packaging test carrier can be inspected more accurately than manual inspection, without measurement errors and subjective judgment of measurement results, thereby improving the accuracy and reliability of the inspection of carrier abnormalities.

[0027] Preferably, the inspection method of the semiconductor packaging test carrier of the present invention, obtaining the resistance threshold range, specifically comprises the following steps:

[0028] S11. Select at least ten qualified carriers and ten unqualified carriers respectively;

[0029] S12. According to steps S2 to S3, the third resistance value of each qualified carrier that passes the inspection is measured, and the first resistance value of each unqualified carrier that passes the inspection is measured; the maximum value of the third resistance value ≤ the resistance threshold range ≤ the minimum value of the first resistance value.

[0030] As a preferred embodiment of the present invention, the inspection method selects qualified carriers and unqualified carriers to participate in the inspection respectively, collects statistical data on the resistance value after the inspection of the carriers, analyzes the first resistance value corresponding to the unqualified carriers and the third resistance value corresponding to the qualified carriers, and obtains statistical resistance thresholds of multiple qualified and unqualified carriers after inspection, so that the resistance threshold range can be more in line with the actual situation of abnormal carriers, avoiding carriers that are slightly deformed but do not affect the use of semiconductor product testing from being judged as unqualified, further ensuring the validity of the resistance value of the mold to be inspected, and further enhancing the reliability and effectiveness of the carrier inspection.

[0031] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0032] 1. In the inspection device, if the shape, size and arrangement position of the carrier slot of the carrier to be inspected are abnormal due to defects, deformation or wear and do not conform to the standard carrier, the control system obtains the resistance of the carrier to be inspected through the first inspection module. If the resistance exceeds the resistance threshold set by the control system, the carrier to be inspected is judged to be unqualified; if the deformation, defect and wear are small, it does not need to be judged as unqualified. The device can quantitatively determine the degree of defect, deformation and wear of the carrier to be inspected, and inspect the deformation and damage degree of the semiconductor packaging test carrier more accurately than manual inspection. There is no measurement error and subjective judgment of the measurement result, which improves the accuracy and reliability of the inspection of the carrier abnormality;

[0033] 2. The inspection device does not require manual visual inspection or use. The conveying mechanism cooperates with the first inspection module, the thrust sensor and the control system to automatically complete the abnormal inspection of the carrier, realize efficient and rapid inspection, and can inspect carriers in batches, thereby improving the efficiency of production work;

[0034] 3. The inspection method can quickly and effectively determine whether the carrier to be inspected is qualified, so that the abnormal inspection of the carrier to be inspected can be quantified through the size of the resistance value, and the deformation and damage degree of the semiconductor packaging test carrier can be inspected more accurately than manual inspection. There is no measurement error and subjective judgment of the measurement results, and the carrier abnormality inspection is more accurate and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0036] Figure 2 is a longitudinal cross-sectional schematic diagram of the first inspection module of the present invention in use;

[0037] Figure 3 is a schematic diagram of the three-dimensional structure of the carrier of the present invention;

[0038] Figure 4 is a schematic diagram of the three-dimensional structure of the first inspection module of the present invention;

[0039] Figure 5 It is a schematic diagram of the inspection result of the semiconductor packaging test carrier used for inspecting the present invention;

[0040] Icons: 1. Base; 2. Conveying mechanism; 21. Driving motor; 211. First start button; 212. Second start button; 22. Guide rail; 3. First inspection module; 31. Template; 311. Detection sheet; 32. Fixed seat; 33. Bracket; 34. Sliding seat; 4. Resistance collection mechanism; 41. Push plate; 42. Thrust sensor; 5. Control system; 6. Second inspection module; 61. Scale plate; 7. Safety cover; 8. Automatic alarm; 100. Vehicle to be inspected; 101. Loading slot. DETAILED DESCRIPTION

[0041] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0042] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0043] Embodiment 1:

[0044] refer to Figures 1 to 4As shown, the present invention provides an inspection device for a semiconductor packaging test carrier, comprising: a base 1, a conveying mechanism 2, a first inspection module 3, a resistance collection mechanism 4 and a control system 5; the conveying mechanism 2 is fixed to the base 1, and the conveying mechanism 2 is used to convey the carrier 100 to be inspected through the first inspection module 3 in the longitudinal direction;

[0045] The first inspection module 3 includes at least two templates 31 arranged longitudinally on the plate surface; the inner sides of the templates 31 are respectively fixed to the base 1; the outer sides of the two templates 31 allow the side walls of the carrier 100 to be inspected to pass longitudinally; the outer sides of the templates 31 are provided with a plurality of detection sheets 311 extending transversely; the shape, size and arrangement position of the detection sheets 311 are adapted to the shape, size and arrangement position of the loading slot 101 of the standard carrier;

[0046] The resistance collection mechanism 4 includes a push plate 41 and a thrust sensor 42; the push plate 41 is longitudinally slidably connected to the conveying mechanism 2, and can then be pressed against the longitudinal end of the vehicle 100 to be inspected; the thrust sensor 42 fixes the push plate 41 to a side close to the vehicle 100 to be inspected; the thrust sensor 42 is used to measure the longitudinal force of the vehicle 100 to be inspected on the push plate 41; the thrust sensor 42 can transmit the data of the longitudinal force to the control system 5 via an electrical signal.

[0047] It should be noted that the conveying mechanism 2 is understood to have a transmission and drive structure, which can convey the carrier 100 to be inspected through the first inspection module 3 in the longitudinal direction, for example, a planar conveying structure in which a conveyor belt and a drive motor 21 cooperate; specifically, refer to Figure 1 As shown, the conveying structure of the present invention can be a driving motor 21, a screw and a guide rail 22 that cooperate with each other. The driving motor 21 drives the screw to transmit, so that the carrier 100 to be inspected placed on the guide rail 22 is driven along the longitudinal guide rail 22 and is sent in and pulled out to the first inspection module 3.

[0048] The control system described in the present invention is understood to be a conventional control system 5 with micro-computing and storage functions, which cooperates with the storage and display modules, and connects the resistance collection mechanism 4 and the conveying mechanism 2 through electrical signals to realize the control of the transportation of the vehicle 100 to be inspected and the control of the acquisition and processing of the collected resistance value data.

[0049] Specifically, a second inspection module 6 is further provided on one longitudinal side of the first inspection module 3, and the second inspection module 6 includes two scale plates 61 erected on the base 1; the inner side ridges of the scale plates 61 are vertically perpendicular to the base 1; the inner side spacing of the two scale plates 61 is adapted to the outer width of the standard carrier, so that the carrier 100 to be inspected can pass through the inner side gap of the two scale plates 61. It should be noted that the longitudinal direction is understood as follows: Figure 1 The vertical direction is the direction of left and right movement along the bottom plate. Figure 1 Up and down directions shown.

[0050] It should be noted that the standard carrier is understood as a carrier that does not have any abnormalities and can be placed and smoothly loaded with semiconductor products; the adaptation is understood as that the shape, size and arrangement position of the detection piece 311 are all set to be the same as the shape, size and arrangement position of any semiconductor product that needs to be loaded into the carrier's carrier slot 101, or the inner spacing of the scale plate 61 is equal to the outer width of the standard carrier, thereby simulating the state of the semiconductor product in the process of loading and passing through the first inspection module 3 and the second inspection module 6. The present invention realizes automatic pushing of the carrier 100 to be inspected, automatic judgment of whether the carrier is qualified or unqualified, and batch operation by designing the first inspection module 3, the second inspection module 6, the drive motor 21, and the thrust sensor 42 whose sizes match the standard carrier. It solves the problems of poor effectiveness of visual inspection, large manual measurement errors, limited sample size, manual fixtures can only rely on sensory judgment, and difficult to unify standards. In addition, automation has been achieved to greatly improve the inspection efficiency. Specifically, it also includes an automatic alarm 8; the automatic alarm 8 is electrically connected to the control system 5; the automatic alarm 8 outputs an alarm signal when the control system 5 determines that the carrier 100 to be inspected is unqualified.

[0051] The two outer sides of the first inspection module 3 of the present invention are used to inspect the carrier 100 to be inspected, and the inner side can pass through the inside of the carrier according to the internal hollow shape of the carrier. The inner side of the first inspection module 3 can be fixed to the base 1 by a fixing frame, etc., to achieve the fixing of the first inspection module 3. Specifically, as Figure 4 As shown, the first inspection module 3 also includes a fixing seat 32 and a bracket 33; the inner sides of the two templates 31 are fixed to the fixing seat 32; the longitudinal end of the fixing seat 32 is fixed to the base 1 through the bracket 33. In order to adapt to the inspection of carriers of different heights or the inspection of carriers with different internal heights, the bracket 33 and the fixing seat 32 can be set as a structure that can be moved vertically and fixed in position, for example, referring to Figure 4 As shown, more specifically, the bracket 33 is fixed to the base 1 through a sliding seat 34; one end of the bracket 33 away from the fixed seat 32 is vertically slidably connected to the sliding seat 34, thereby being able to move vertically.

[0052] Specifically, a safety cover 7 is provided above the conveying mechanism 2; the safety cover 7 can cover the outside of the carrier 100 to be inspected and the first inspection module 3. It should be noted that the above corresponding to the conveying mechanism 2 is understood as the above of the conveying mechanism 2 during the inspection process after the carrier is sent into the first inspection module 3. Specifically, refer to Figure 1 As shown, the safety cover 7 is arranged on the left side of the conveying mechanism 2.

[0053] The inventive concept of the present invention is to design a precise first inspection module 3 and / or second inspection module 6 according to the dimensional tolerance of the vehicle, and then according to the characteristics of the abnormal unqualified vehicle, cooperate with the thrust sensor 42 for real-time detection to measure the resistance of the unqualified vehicle when passing through the first inspection module 3 and / or the second inspection module 6, and cooperate with the data processing and simulation calculation of the control system 5 to realize automatic judgment of whether the vehicle is "qualified" or "unqualified", and realize the functions of automatic shutdown, alarm, and recording of inspection results, so as to realize batch operation. In addition, the first inspection module 3 or the second inspection module 6 adopts a split design, and different vehicles can have independently designed inspection modules for replacement. The device can be applied to the automatic inspection of multiple vehicles. Reference Figure 1 As shown, the part of the device used for conveying the carrier is designed with a safety cover 7, and the starting function of the drive motor 21 includes a first start button 211 and a second start button 212. The design of pressing both buttons simultaneously to start the device is adopted, which effectively prevents safety hazards caused by accidental touches. The inspection device described in the present invention has a simple structure, compact size, and is easy to maintain, and can be used with only a matching table or other platform.

[0054] Embodiment 2:

[0055] On the basis of Example 1, the present invention further provides a method for inspecting a semiconductor packaging test carrier, using the inspection device for the semiconductor packaging test carrier described in Example 1 to inspect the semiconductor packaging test carrier, comprising the following steps:

[0056] S1. Setting a resistance threshold range according to a first resistance value obtained by testing an unqualified vehicle;

[0057] S2, placing the carrier 100 to be inspected on the conveying mechanism 2, controlling the conveying mechanism 2, driving the push plate 41 to press against the longitudinal end of the carrier 100 to be inspected, so that the thrust sensor 42 contacts the longitudinal end of the carrier 100 to be inspected; and sending the carrier 100 to be inspected and the resistance collection mechanism 4 together to the first inspection module 3 and the second inspection module 6;

[0058] S3, obtaining the longitudinal force of the vehicle to be inspected 100 on the thrust sensor 42 through the thrust sensor 42, and then obtaining the second resistance value encountered by the vehicle to be inspected 100 during the process of passing through the first inspection module 3 and the second inspection;

[0059] S4, determining whether the second resistance value exceeds the resistance threshold range;

[0060] S5. If the second resistance value exceeds the resistance threshold range, the carrier 100 to be inspected is determined to be unqualified; if the second resistance value does not exceed the resistance threshold range, the carrier 100 to be inspected is determined to be qualified.

[0061] It should be noted that the first, second and third values ​​described in the present invention are only for clear description and no specific numerical interpretation is given. The first resistance value is understood to be the resistance value measured after the unqualified carrier passes through the inspection device. Since the problem of abnormal unqualified carriers is not limited to the same part or the same position, even if the unqualified carrier passes, the resistance value is not unique; therefore, in order to further and more accurately determine the unqualified carrier and obtain the resistance threshold range, the following steps are specifically included: S11, select at least ten qualified carriers and ten unqualified carriers respectively; S12, according to steps S2 to S3, measure the third resistance value of each qualified carrier passing the inspection, and measure the first resistance value of each unqualified carrier passing the inspection; the maximum value of the third resistance value ≤ the resistance threshold range ≤ the minimum value of the first resistance value; a resistance value within the resistance threshold range is selected and set as the reference value of the resistance threshold, which is used to check whether the carrier is qualified.

[0062] The inspection method can quantitatively inspect the abnormality of the vehicle, refer to Figure 5 As shown, the inspection result of the carrier 100 to be inspected can be outputted intuitively on the display system through the cooperation of the control system 5 and the common display system. Figure 5 The resistance value results of vehicles above the resistance threshold setting value are unqualified vehicles after inspection, and the resistance value results of vehicles below the resistance threshold setting value are qualified vehicles; on the one hand, it is convenient to obtain the inspection results, and on the other hand, it is convenient for inspectors to quantify and analyze the abnormal positions or characteristics of vehicles, and facilitate the handling and analysis of abnormal vehicle problems. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor packaging test carrier inspection device, characterized in that: include: A base (1), a conveying mechanism (2), a first inspection module (3), a resistance collection mechanism (4) and a control system (5); the conveying mechanism (2) is fixed to the base (1), and the conveying mechanism (2) is used to convey the carrier (100) to be inspected through the first inspection module (3) in the longitudinal direction; The first inspection module (3) comprises at least two templates (31) arranged longitudinally on the plate surface; the inner sides of the templates (31) are respectively fixed to the base (1); the outer sides of the two templates (31) allow the side walls of the carrier (100) to be inspected to pass longitudinally; the outer sides of the templates (31) are provided with a plurality of detection sheets (311) extending transversely; the shape, size and arrangement position of the detection sheets (311) are all adapted to the shape, size and arrangement position of the carrier slot (101) of the standard carrier; The resistance collection mechanism (4) comprises a push plate (41) and a thrust sensor (42); the push plate (41) is longitudinally slidably connected to the conveying mechanism (2) so as to be able to press against the longitudinal end of the vehicle to be inspected (100); the thrust sensor (42) fixes the push plate (41) on a side close to the vehicle to be inspected (100); the thrust sensor (42) is used to measure the longitudinal force of the vehicle to be inspected (100) on the push plate (41); the thrust sensor (42) can transmit the data of the longitudinal force to the control system (5) through an electrical signal.

2. The inspection device for semiconductor packaging test carrier according to claim 1, characterized in that: A second inspection module (6) is also provided on one longitudinal side of the first inspection module (3), and the second inspection module (6) comprises two scale plates (61) erected on the base (1); the inner ridges of the scale plates (61) are vertically perpendicular to the base (1); the inner spacing of the two scale plates (61) is adapted to the outer width of the standard carrier, so that the carrier (100) to be inspected can pass through the gap between the inner sides of the two scale plates (61).

3. The inspection device for semiconductor packaging test carrier according to claim 1, characterized in that: The first inspection module (3) further comprises a fixing seat (32) and a bracket (33); the inner sides of the two templates (31) are fixed to the fixing seat (32); and the longitudinal end of the fixing seat (32) is fixed to the base (1) via the bracket (33).

4. The inspection device for semiconductor packaging test carrier according to claim 3, characterized in that: The bracket (33) is fixed to the base (1) via a sliding seat (34); one end of the bracket (33) away from the fixed seat (32) is vertically slidably connected to the sliding seat (34), thereby being able to move vertically.

5. The inspection device for semiconductor packaging test carrier according to claim 1, characterized in that: A safety cover (7) is provided above the conveying mechanism (2); the safety cover (7) can cover the outside of the carrier to be inspected (100) and the first inspection module (3).

6. The inspection device for semiconductor packaging test carrier according to claim 1, characterized in that: It also includes an automatic alarm (8); the automatic alarm (8) is electrically connected to the control system (5); the automatic alarm (8) outputs an alarm signal when the control system (5) determines that the carrier (100) to be inspected is unqualified.

7. A method for inspecting a semiconductor packaging test carrier, characterized in that: Using the inspection device of the semiconductor packaging test carrier according to any one of claims 1 to 6, inspecting the semiconductor packaging test carrier comprises the following steps: S1. Setting a resistance threshold range according to a first resistance value obtained by testing an unqualified vehicle; S2, placing the carrier (100) to be inspected on the conveying mechanism (2), controlling the conveying mechanism (2), driving the push plate (41) to press against the longitudinal end of the carrier (100) to be inspected, and making the thrust sensor (42) contact the longitudinal end of the carrier (100) to be inspected; and moving the carrier (100) to be inspected and the resistance collection mechanism (4) together toward the first inspection module (3) and the second inspection module (6); S3, obtaining the longitudinal force of the vehicle to be inspected (100) on the thrust sensor (42) through the thrust sensor (42), and further obtaining the second resistance value encountered by the vehicle to be inspected (100) during the process of passing through the first inspection module (3) and the second inspection; S4, determining whether the second resistance value exceeds the resistance threshold range; S5. If the second resistance value exceeds the resistance threshold range, the carrier to be inspected (100) is determined to be unqualified; if the second resistance value does not exceed the resistance threshold range, the carrier to be inspected (100) is determined to be qualified.

8. The inspection method of a semiconductor packaging test carrier according to claim 7, characterized in that: Obtaining the resistance threshold range specifically includes the following steps: S11. Select at least ten qualified carriers and ten unqualified carriers respectively; S12. According to steps S2 to S3, the third resistance value of each qualified carrier that passes the inspection is measured, and the first resistance value of each unqualified carrier that passes the inspection is measured; the maximum value of the third resistance value ≤ the resistance threshold range ≤ the minimum value of the first resistance value.

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