Tinned copper alloy wire defect detection method and equipment

Abstract

The invention is suitable for the technical field of tinned copper alloy wire detection, and particularly relates to a tinned copper alloy wire defect detection method and equipment, and the method comprises the steps: obtaining the historical production information of a tinned copper alloy wire; performing simulated production of the tinned copper alloy wire based on the historical production information to obtain simulated production information; wherein the simulation production information is used for indicating the established three-dimensional model of the tin-plated copper alloy wire; performing defect detection on the simulation production information to obtain model defect information; wherein the model defect information is used for reflecting the predicted defect condition of the tinned copper alloy wire in simulated production; actual defect information is obtained, and the actual defect information is obtained by conducting comparison detection on the actually-produced tinned copper alloy wire based on the model defect information. According to the tin-plated copper alloy wire defect detection method provided by the invention, the accuracy of tin-plated copper alloy wires needing defect detection can be improved, and the time waste is reduced, so that the detection efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of tinned copper alloy wire detection, and in particular, relates to a method and device for detecting defects in tinned copper alloy wire. Background Art

[0002] Tinned copper alloy wire is a conductive material mainly made of copper alloy; tinned copper alloy wire is plated with a thin layer of tin on its surface. Tin plating can improve the corrosion resistance, oxidation resistance and welding performance of copper wire; tinned copper alloy wire can be used in high-end automotive connectors, precision electronic industrial devices, power transmission, communication equipment, automotive electronic systems and wiring harnesses.

[0003] In the related art, when tinned copper alloy wires are produced, the quality of the produced tinned copper alloy wires is unstable due to the influence of production equipment or other environmental factors. Therefore, when operators perform defect detection on the tinned copper alloy wires, they cannot accurately determine which tinned copper alloy wires need to be detected for defects, resulting in a long time and low detection efficiency. Summary of the invention

[0004] The embodiments of the present application provide a tin-plated copper alloy wire defect detection method and device, which can solve the problem of long detection time caused by the operator's inability to accurately determine which tin-copper alloy wires need to be detected.

[0005] In a first aspect, an embodiment of the present application provides a method for detecting defects in a tinned copper alloy wire, comprising:

[0006] Obtaining historical production information of the tinned copper alloy wire; wherein the historical production information is used to indicate the production equipment, production conditions and process flow used in the previous actual production of the tinned copper alloy wire;

[0007] Based on the historical production information, simulated production of the tinned copper alloy wire is performed to obtain simulated production information; wherein the simulated production information is used to indicate a three-dimensional model of the tinned copper alloy wire that has been established;

[0008] Performing defect detection on the simulated production information to obtain model defect information; wherein the model defect information is used to reflect the predicted defect conditions of the tin-plated copper alloy wire produced in the simulated production;

[0009] Actual defect information is obtained, wherein the actual defect information is obtained by comparing and testing the tin-plated copper alloy wire actually produced based on the model defect information.

[0010] The defect detection method of tinned copper alloy wire provided by the present application obtains the historical production information of tinned copper alloy wire, can optimize the production process by analyzing the historical data, and can also help technicians to maintain and upgrade the equipment, paving the way for subsequent defect detection; based on the historical production information, simulated production of tinned copper alloy wire is performed to obtain simulated production information, which can discover possible problems in the production process in advance and optimize the production parameters, thereby improving the detection efficiency and product quality. In addition, it can reduce errors and accidents in actual production, realize accurate control of the production process of tinned copper alloy wire, and improve the consistency and reliability of products. Defect detection is performed on the simulated production information to obtain model defect information, which can realize early warning and diagnosis of defects that may occur in the production process. By analyzing the model defect information, the production parameters can be adjusted and the process flow can be optimized, thereby reducing the scrap rate and improving the product quality; obtaining actual defect information, the defects that may occur in the production process, such as cracks, bubbles, inclusions, etc., can be found through this comparative detection, so that measures can be taken to correct them before the problem expands, which can improve the detection accuracy of tinned copper alloy wire, and can accurately determine which tinned copper alloy wires need to be detected for defects, thereby improving the detection efficiency.

[0011] In a possible implementation manner of the first aspect, the simulating production of the tinned copper alloy wire based on the historical production information, before obtaining the simulated production information, includes:

[0012] According to the production equipment indicated in the historical production information, first simulation information is obtained; wherein the first simulation information is used to indicate the equipment type and equipment production parameters of the production equipment used in simulating the production of tinned copper alloy wire;

[0013] Perform condition simulation based on the production conditions and the process flow indicated in the historical production information to obtain second simulation information; wherein the second simulation information is used to indicate the workshop production environment when simulating the production of tin-plated copper alloy wire;

[0014] A simulation is created based on the first simulation information and the second simulation information to obtain simulation line information; wherein the simulation line information is used to indicate a simulation production line created by the simulation.

[0015] In a possible implementation manner of the first aspect, the simulating production of the tinned copper alloy wire based on the historical production information, after obtaining the simulated production information, includes:

[0016] Acquire application information of the tinned copper alloy wire; wherein the application information is used to indicate specific environmental requirements for the application of the tinned copper alloy wire;

[0017] The simulated production information is input into the evaluation model as the evaluation object, and the evaluation model uses the application scenario information as the evaluation condition to evaluate the evaluation object; wherein the evaluation model is a machine learning model obtained by training as a sample;

[0018] After the evaluation of the evaluation model is completed, the evaluation model outputs evaluation status information. If the evaluation status information is valid information, the simulated production information is confirmed as a three-dimensional model that can be used for defect detection.

[0019] In a possible implementation manner of the first aspect, the method further includes:

[0020] After the evaluation of the evaluation model is completed, the evaluation model outputs evaluation status information. If the evaluation status information is invalid information, invalid reason information is obtained, wherein the invalid reason information is used to reflect the situation of the evaluation value of the application scenario of the simulated production information.

[0021] In a possible implementation manner of the first aspect, performing defect detection on the simulated production information to obtain model defect information includes:

[0022] Acquire the orientation information of the three-dimensional model indicated by the simulated production information; wherein the orientation information is used to indicate the coordinate position of the three-dimensional model in the modeling space;

[0023] Detecting surface state information of the three-dimensional model based on the orientation information; wherein the surface state information is used to reflect scratch defects on the surface of the three-dimensional model;

[0024] Detecting internal state information of the three-dimensional model based on the orientation information; wherein the internal state information is used to reflect crack defects inside the three-dimensional model;

[0025] The model defect information is obtained according to the surface state information and the internal state information.

[0026] In a possible implementation manner of the first aspect, obtaining actual defect information includes:

[0027] Acquire first defect information; wherein the first defect information is obtained after surface detection and analysis of the scratch defect indicated by the surface state information and the tin-plated copper alloy wire actually produced;

[0028] Acquire second defect information; wherein the second defect information is obtained after internal detection and analysis of the crack defect indicated by the internal state information and the tin-plated copper alloy wire actually produced;

[0029] The actual defect information is obtained according to the first defect information and the second defect information.

[0030] In a possible implementation manner of the first aspect, obtaining the first defect information includes:

[0031] Establishing a simulation platform in a three-dimensional space, placing the three-dimensional model on the simulation platform, and determining a critical position of the three-dimensional model;

[0032] Placing the tinned copper alloy wire actually produced on the detection platform, and determining the critical position on the tinned copper alloy wire actually produced; wherein the simulation platform is consistent with the detection platform in direction and position, and the critical position is the contact position between the tinned layer and the copper alloy wire;

[0033] Detecting the distance value between the tin-plated layer and the critical position in the three-dimensional model, and then detecting the distance value between the tin-plated layer and the critical position in the actually produced tin-plated copper alloy wire. If the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than a preset value, and the distance value between the tin-plated layer and the critical position of the actually produced tin-plated copper alloy wire is less than the preset value, the three-dimensional model and the actually produced tin-plated copper alloy wire both have scratch defects, which proves that the surface defect condition reflected by the model defect information is predicted correctly, and the first defect information is obtained;

[0034] If only the distance value between the tinned layer of the tinned copper alloy wire actually produced and the critical position is less than the preset value, the tinned copper alloy wire actually produced has a scratch defect and the three-dimensional model has no scratch defect, and the surface defect situation reflected by the model defect information is predicted incorrectly, and the first detection error information is obtained; wherein the first detection error information is used to remind the operator to detect the defect step;

[0035] If only the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than a preset value, the three-dimensional model has a scratch defect but the actually produced tin-plated copper alloy wire has no scratch defect, and the surface defect situation reflected by the model defect information is predicted incorrectly, and a second detection error message is obtained; wherein, the detection error message is used to remind the operator to detect the simulation environment.

[0036] In a possible implementation manner of the first aspect, obtaining the second defect information includes:

[0037] The three-dimensional model is placed on a simulation platform, and the tinned copper alloy wire actually produced is placed on a detection platform, a dividing mark is established in the middle of the three-dimensional model, and the three-dimensional model is divided into a left area and a right area with the dividing mark as a boundary, heat is applied from the position of the left area or from the position of the right area, and the standing time is obtained according to the length of the three-dimensional model and the heat diffusion speed;

[0038] After the standing time is over, the temperature values ​​and heat flow paths of the left area and the right area are detected to obtain model crack information; wherein the model crack information is used to reflect the existence of cracks inside the three-dimensional model;

[0039] Then, placing the actually produced tin-plated copper alloy wire of the same length on the detection platform, making a boundary mark in the middle of the actually produced tin-plated copper alloy wire, dividing the actually produced tin-plated copper alloy wire into a left section and a right section with the boundary mark as the boundary, applying detection conditions to the actually produced tin-plated copper alloy wire, applying heat from the position of the left section or applying heat from the position of the right section;

[0040] After the standing time is over, the temperature values ​​and heat flow paths of the left area and the right area are detected to obtain actual wire crack information; wherein the actual wire crack information is used to reflect the existence of cracks inside the tinned copper alloy wire actually produced;

[0041] The model crack information is compared with the actual wire crack information. If the model crack information is the same as the actual wire crack information, the internal defect situation reflected by the model defect information is predicted correctly, and the second defect information is obtained.

[0042] In a possible implementation manner of the first aspect, the method further includes:

[0043] The model crack information is compared with the actual wire crack information. If the model crack information is different from the actual wire crack information, the internal defect situation reflected by the model defect information is predicted incorrectly, and internal defect error information is obtained; wherein the internal defect error information is used to remind the operator to check the internal defect detection process.

[0044] In a second aspect, an embodiment of the present application provides a tinned copper alloy wire defect detection system, comprising:

[0045] An acquisition unit, used for acquiring historical production information of the tinned copper alloy wire; wherein the historical production information is used for indicating the production equipment, production conditions and process flow used in the previous actual production of the tinned copper alloy wire;

[0046] A simulation unit, used for performing simulated production of tinned copper alloy wire based on the historical production information to obtain simulated production information; wherein the simulated production information is used to indicate a three-dimensional model of the tinned copper alloy wire that has been established;

[0047] A detection unit, used to perform defect detection on the simulated production information to obtain model defect information; wherein the model defect information is used to reflect the predicted defect conditions of the tinned copper alloy wire produced in the simulated production;

[0048] The result unit is used to obtain actual defect information, wherein the actual defect information is obtained by comparing and testing the actually produced tin-plated copper alloy wire based on the model defect information.

[0049] In a third aspect, an embodiment of the present application provides a tin-plated copper alloy wire defect detection device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements a method as described in any one of the first aspects above.

[0050] In a fourth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on a tin-plated copper alloy wire defect detection device, the tin-plated copper alloy wire defect detection device performs the tin-plated copper alloy wire defect detection method described in any one of the first aspects above.

[0051] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0053] Figure 1 It is a schematic flow chart of a defect detection method for tinned copper alloy wire provided in one embodiment of the present application;

[0054] Figure 2 It is a schematic diagram of the implementation process before step S200 in the tinned copper alloy wire defect detection method provided in one embodiment of the present application;

[0055] Figure 3 It is a schematic diagram of the implementation process after step S200 in the tin-plated copper alloy wire defect detection method provided in one embodiment of the present application;

[0056] Figure 4 It is a schematic diagram of the implementation process of step S300 in the tin-plated copper alloy wire defect detection method provided in one embodiment of the present application;

[0057] Figure 5It is a schematic diagram of the implementation process of step S400 in the tin-plated copper alloy wire defect detection method provided in one embodiment of the present application;

[0058] Figure 6 It is a schematic diagram of the implementation process of step S410 in the tin-plated copper alloy wire defect detection method provided in one embodiment of the present application;

[0059] Figure 7 It is a schematic diagram of the implementation process of step S420 in the tin-plated copper alloy wire defect detection method provided in one embodiment of the present application;

[0060] Figure 8 It is a structural schematic diagram of a tinned copper alloy wire defect detection system provided in an embodiment of the present application;

[0061] Fig. 9 It is a schematic diagram of the structure of the tinned copper alloy wire defect detection device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0062] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0063] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0064] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0065] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0066] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0067] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0068] Tinned copper alloy wire is a conductive material mainly made of copper alloy; tinned copper alloy wire is plated with a thin layer of tin on its surface. Tin plating can improve the corrosion resistance, oxidation resistance and welding performance of copper wire; tinned copper alloy wire can be used in high-end automotive connectors, precision electronic industrial devices, power transmission, communication equipment, automotive electronic systems and wiring harnesses.

[0069] In the related art, when tinned copper alloy wires are produced, the quality of the produced tinned copper alloy wires is unstable due to the influence of production equipment or other environmental factors. Therefore, when operators perform defect detection on the tinned copper alloy wires, they cannot accurately determine which tinned copper alloy wires need to be detected for defects, resulting in a long time and low detection efficiency.

[0070] To solve the above problems, the embodiment of the present application provides a tinned copper alloy wire defect detection method and device. In this method, the historical production information of the tinned copper alloy wire is obtained, the production process can be optimized by analyzing the historical data, and the technical personnel can be helped to maintain and upgrade the equipment, paving the way for subsequent defect detection; based on the historical production information, the simulated production of the tinned copper alloy wire is carried out to obtain the simulated production information, which can discover the problems that may occur in the production process in advance and optimize the production parameters, thereby improving the detection efficiency and product quality. In addition, it can reduce the errors and accidents in the actual production, realize the precise control of the tinned copper alloy wire production process, and improve the consistency and reliability of the product. By performing defect detection on the simulated production information and obtaining model defect information, early warning and diagnosis of defects that may occur in the production process can be achieved. By analyzing the model defect information, production parameters can be adjusted and the process flow can be optimized, thereby reducing the scrap rate and improving product quality. By obtaining actual defect information, defects that may occur in the production process, such as cracks, bubbles, inclusions, etc., can be discovered through this comparative detection, so that measures can be taken to correct the problem before it expands. The detection accuracy of tinned copper alloy wires can be improved, and it can be accurately determined which tinned copper alloy wires need to be detected for defects, thereby improving detection efficiency.

[0071] The tin-plated copper alloy wire defect detection method provided in the embodiment of the present application can be applied to a tin-plated copper alloy wire defect detection device. At this time, the tin-plated copper alloy wire defect detection device is the executor of the tin-plated copper alloy wire defect detection method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the tin-plated copper alloy wire defect detection device.

[0072] For example, the tinned copper alloy wire defect detection equipment can be an operating platform, a control panel in a control room, a tablet computer, a laptop computer, a netbook, a desktop computer, a smart screen, a computer, a laptop computer, a handheld computing device, etc., but not limited to these.

[0073] In order to better understand the tin-plated copper alloy wire defect detection method provided in the embodiment of the present application, the specific implementation process of the tin-plated copper alloy wire defect detection method provided in the embodiment of the present application is exemplarily introduced below.

[0074] Figure 1 A schematic flow chart of a tinned copper alloy wire defect detection method provided in an embodiment of the present application is shown, and the tinned copper alloy wire defect detection method includes:

[0075] S100, obtaining historical production information of the tinned copper alloy wire; wherein the historical production information is used to indicate the production equipment, production conditions and process flow used in the previous actual production of the tinned copper alloy wire.

[0076] For example, historical production information of tinned copper alloy wire can be obtained through the Internet; Internet acquisition can be obtained through websites or URLs; it can also be queried through the production management system database. Most modern production lines are equipped with advanced production management systems, which record detailed production information of each batch of products, including the production equipment used, production conditions and process flow. By accessing these databases, historical production information of a specific batch of tinned copper alloy wire can be extracted. It can also be done by using production log files; during the production process, operators and engineers usually record production logs, which record parameters and abnormal conditions during the production process. By analyzing these log files, detailed information on the production process of tinned copper alloy wire can be obtained.

[0077] S200, performing simulated production of tinned copper alloy wire based on historical production information to obtain simulated production information; wherein the simulated production information is used to indicate a three-dimensional model of the tinned copper alloy wire that has been established.

[0078] It can be understood that the historical production information is input into the mold production software, and the simulated production is performed according to the simulation software to obtain the simulated production information. The simulated production according to the simulation software can be to build a model of the geometric shape, size and surface treatment of the wire; the simulation software can be a three-dimensional modeling software or a software with modeling function, such as UG, ANSYS, etc., but not limited thereto. The model building can be to simulate the production of tinned copper alloy wire through the geometric shape, size and surface treatment.

[0079] In one possible implementation, see Figure 2 , based on historical production information, simulated production of tinned copper alloy wire is carried out. Before obtaining the simulated production information, it includes:

[0080] S201A, obtaining first simulation information according to the production equipment indicated in the historical production information; wherein the first simulation information is used to indicate the equipment type and equipment production parameters of the production equipment used in simulating the production of tin-plated copper alloy wire.

[0081] Exemplarily, historical production conditions can be collected, corresponding historical production information can be searched, the production equipment used in historical production can be determined, and the information of the production equipment can be viewed. The information of the production equipment includes but is not limited to equipment type, production parameters, production speed, temperature, pressure and other indicators. The equipment type, production parameters, production speed, temperature, pressure and other information obtained from the information of the production equipment are integrated to obtain the first simulation information; wherein, the equipment type, production parameters, production speed, temperature, pressure and other information obtained from the information of the production equipment are integrated, and the integration is to type the information into the simulation software or simulation platform.

[0082] S202A, performing condition simulation based on the production conditions and process flow indicated in the historical production information to obtain second simulation information; wherein the second simulation information is used to indicate the workshop production environment when simulating the production of tin-plated copper alloy wire.

[0083] It can be understood that conditional simulation can be understood as typing the production conditions during historical production into the simulation software or simulation platform for simulation in a one-to-one restoration degree; the second simulation information can be obtained by collecting historical production conditions, finding the corresponding historical production information, determining the production conditions and process flow used in historical production, combining the production conditions and process flow with the simulation software or simulation platform, and then performing conditional simulation to obtain the second simulation information; the workshop production environment when simulating the production of tin-plated copper alloy wire includes but is not limited to key parameters such as temperature, pressure, speed, time, etc., and these data will be used as the basic input for the simulation to make the simulation environment as close to the actual production conditions as possible.

[0084] S203A, performing simulation creation based on the first simulation information and the second simulation information to obtain simulation line information; wherein the simulation line information is used to indicate a simulation production line created by simulation.

[0085] Exemplarily, the first simulation information and the second simulation information can be input into a simulation environment by using simulation software, and different production conditions can be simulated and tested through the simulation function of the software to obtain a simulated production line; wherein the simulation software can be finite element analysis software; in addition, there are certain differences between the workshop production environment when simulating the production of tin-plated copper alloy wire and the environment during historical production. Each parameter can be adjusted one by one in the simulation environment, and the simulation results under different parameter combinations can be compared.

[0086] In one possible implementation, see Figure 3 , based on historical production information, simulate the production of tinned copper alloy wire. After obtaining the simulated production information, it includes:

[0087] S210A, obtaining application scenario information of the tinned copper alloy wire; wherein the application scenario information is used to indicate specific environmental requirements for the application of the tinned copper alloy wire.

[0088] It can be understood that the specific environmental requirements for the application of tinned copper alloy wire can be the application requirements of tinned copper alloy wire in a certain field. In addition, by consulting relevant industry standards and product catalogs, you can learn about tinned copper alloy wires of different specifications and performances. You can also consult professional manufacturers or suppliers. In addition, participating in industry exhibitions and seminars is also an effective way to understand the application occasions of tinned copper alloy wire; you can also find a lot of information about the application of tinned copper alloy wire through online searches and professional forums.

[0089] S220A, input the simulated production information as the evaluation object into the evaluation model, and the evaluation model uses the application scenario information as the evaluation condition to evaluate the evaluation object; wherein the evaluation model is a machine learning model obtained by training as a sample.

[0090] Exemplarily, the simulated production information is input into the evaluation model as the evaluation object, and the evaluation object is evaluated according to the required application scenario information as the evaluation condition; wherein the evaluation model is a machine learning model obtained by training as a sample, and during the training process, a supervised learning method can be used, wherein the model predicts the performance of the product under specific conditions based on the input production information and application scenario information. During the training process, these data include but are not limited to parameters such as temperature, pressure, speed, etc. in the production process, as well as the performance test results of the final product. The application scenario information covers the environmental conditions in which the product will be used, such as temperature range, humidity, the presence of chemically corrosive substances, etc., for training to obtain a machine learning model, and the simulated production information is input into the trained and verified evaluation model to output the evaluation results.

[0091] S230A, after the evaluation of the evaluation model is completed, the evaluation model outputs evaluation status information. If the evaluation status information is valid information, the simulated production information is confirmed as a three-dimensional model that can be used for defect detection.

[0092] Exemplarily, after the evaluation of the evaluation model is completed, the evaluation model can generate whether the information meets the requirements based on the analysis. For example, the chemical corrosion ability, temperature range, humidity, etc. of the three-dimensional model all meet the requirements and can be considered to be in good condition. The evaluation status information can be considered to be valid information, and this simulated production information is confirmed as a three-dimensional model that can be used for defect detection.

[0093] In a possible implementation, the method further includes:

[0094] S230B, after the evaluation of the evaluation model is completed, the evaluation model outputs evaluation status information. If the evaluation status information is invalid information, invalid reason information is obtained, wherein the invalid reason information is used to reflect the situation of the evaluation value of the application scenario of the simulated production information.

[0095] Exemplarily, after the evaluation of the evaluation model is completed, the evaluation model can generate information based on the analysis to determine whether it meets the requirements. For example, the chemical corrosion capacity, temperature range, humidity, etc. of the three-dimensional model do not meet the requirements and can be considered to be in poor condition. The evaluation status information can be considered invalid information. The invalid information will be analyzed to know the evaluation value of the application scenario of the simulated production information. The invalid information will be analyzed for reasons, including but not limited to inconsistencies in the data set, anomalies in the model training process, and abnormal fluctuations in the evaluation values, so as to identify the specific reasons that lead to the invalid evaluation status. For example, if the evaluation value deviates from the normal range in a specific application scenario, this situation will be recorded and used as invalid reason information. In addition, the representativeness of the data set will be checked to cover enough production scenarios to avoid invalid evaluation due to data set deviation.

[0096] S300, performing defect detection on the simulated production information to obtain model defect information; wherein the model defect information is used to reflect the predicted defect conditions of the tin-plated copper alloy wire produced in the simulated production.

[0097] It can be understood that the predicted defect situation can be a performance prediction based on the simulated production information, and the model defect information can be obtained based on the performance prediction. For example, it can be a feedback mechanism. When the model finds that the predicted defects are inconsistent with the actual defects in actual applications, these situations will be automatically recorded and fed back to the model as new training data. The model can continuously adapt to new production situations and improve the accuracy of defect detection. Effectively perform defect detection on simulated production information and obtain accurate model defect information. This not only helps to discover and solve problems in the production process, but also provides a basis for improving the overall quality of tinned copper alloy wire.

[0098] In one possible implementation, see Figure 4 , perform defect detection on the simulated production information to obtain model defect information, including:

[0099] S310, obtaining the orientation information of the three-dimensional model indicated by the simulated production information; wherein the orientation information is used to indicate the coordinate position of the three-dimensional model in the modeling space.

[0100] For example, to obtain the orientation information of the three-dimensional model indicated by the simulated production information, computer vision and image processing technology can be used to process and analyze the point cloud data; wherein, the processing and analysis include filtering, denoising, feature extraction, etc. of the point cloud data, in order to more accurately identify the feature points and edges of the model. Through these feature points and edges, the orientation information of the model can be obtained, that is, the specific coordinate position of the model in the modeling space. The orientation information can also be determined according to the coordinate system on the three-dimensional software.

[0101] S320, detecting surface state information of the three-dimensional model based on the orientation information; wherein the surface state information is used to reflect scratch defects on the surface of the three-dimensional model.

[0102] For example, after determining the orientation information, the surface state information of the three-dimensional model can be detected by identifying the difference in the surface state of the three-dimensional model; wherein such difference analysis can be completed using computer-aided design software, which will detect any deviations on the surface of the model and intuitively display these deviations in a color-coded manner. For example, scratch defects may be highlighted in red, while slight wear and tear may be indicated in yellow.

[0103] S330, detecting internal state information of the three-dimensional model based on the orientation information; wherein the internal state information is used to reflect crack defects inside the three-dimensional model.

[0104] For example, the internal state information of the 3D model can be detected by using computer vision technology, by collecting the internal scanning data of the 3D model, the data covers models of different orientations and different crack defects, and using these data to train the deep learning network so that it can identify and locate the crack defects inside the model; wherein, during the training process, the convolutional neural network (CNN) can be used as the main network architecture, because CNN is more complete in image recognition and feature extraction. Finally, the test can be carried out to obtain the location, size and direction of the crack, which provides an important reference for subsequent repair and quality control.

[0105] S340, obtaining model defect information according to the surface state information and the internal state information.

[0106] Exemplarily, a correlation analysis is performed on the surface state information and the internal state information to obtain the model defect information; wherein, to extract the model defect information from the surface state information and the internal state information, a convolutional neural network technology can be used to extract features from the surface scan image and the internal scan image respectively. For the surface image defects, they can be cracks, scratches and other visible defects, while for the internal image, they can be the incompleteness or abnormality of the internal structure. The extracted surface and internal features are sent to a fusion layer, which combines the two features through a fully connected network. The fusion layer is designed to capture the correlation between surface and internal defects, thereby improving the accuracy of defect detection, and then the model can be identified based on the fused features. Whether there are defects, and the defects can be classified (such as cracks, holes, etc.), that is, defects in the internal structure, and then the internal and surface defects are obtained, and the model defect information can be obtained.

[0107] S400, obtaining actual defect information, wherein the actual defect information is obtained by comparing and testing the actually produced tin-plated copper alloy wire based on the model defect information.

[0108] Exemplarily, actual defect information can be obtained by collecting image data of tin-plated copper alloy wire; wherein the image data can include surface image data and internal image data of the tin-plated copper alloy wire; then, based on the model defect information obtained by defect detection on simulated production information, image conversion technology is used to extract defect features from the surface image data and internal image data of the tin-plated copper alloy wire, and the defect images of the tin-plated copper alloy wire are compared with the model defect information to obtain actual defect information; defect features are extracted from the defect images of the tin-plated copper alloy wire, and the defect features can be surface scratches, cracks, etc., and can also be internal structural fractures, gaps, etc.

[0109] In one possible implementation, see Figure 5 , S400, obtain actual defect information, including:

[0110] S410, obtaining first defect information; wherein the first defect information is obtained after surface detection and analysis of the scratch defect indicated by the surface state information and the tin-plated copper alloy wire actually produced.

[0111] Exemplarily, in the process of obtaining the first defect information, a high-resolution image acquisition system can be used. The high-resolution image acquisition system can detect tiny scratches on the surface of the tin-plated copper alloy wire, and then the surface detection and analysis of the actually produced tin-plated copper alloy wire is performed based on the scratch defects indicated by the surface state information to obtain the first defect information; wherein, the collected images can be analyzed by image processing software, and the scratch defects can be identified and located by using an edge detection algorithm, the difference between the scratch and the normal surface texture can be distinguished, and the length, width and depth of the scratch can be quantified.

[0112] In one possible implementation, see Figure 6 , S410, obtaining first defect information, including:

[0113] S411, establishing a simulation platform in the three-dimensional space, placing the three-dimensional model on the simulation platform, and then determining the critical position of the three-dimensional model.

[0114] It can be understood that the simulation platform can be a model platform established in a three-dimensional space; illustratively, by establishing a simulation platform in a three-dimensional space in a three-dimensional modeling software, the position of the three-dimensional model on the simulation platform is obtained (which can be a specific coordinate point, etc.), and the critical position of the three-dimensional model can be determined; wherein, the position of the three-dimensional model on the simulation platform, for example, the coordinate area formed by the simulation platform can be regarded as a new three-dimensional space, and the three-dimensional model is placed on the simulation platform to understand the specific coordinates of the three-dimensional model, and then the contour points, edges and feature points of the three-dimensional model are extracted to obtain the critical position of the three-dimensional model; the critical position of the three-dimensional model can be obtained by extracting the contact position between the tin-plated layer and the copper alloy wire of the three-dimensional model.

[0115] S412, placing the tinned copper alloy wire actually produced on the detection platform, and determining the critical position on the tinned copper alloy wire actually produced; wherein the simulation platform and the detection platform have the same direction and position, and the critical position is the contact position between the tinned layer and the copper alloy wire.

[0116] It can be understood that the direction of the simulation platform and the detection platform are consistent, for example, the structures of the simulation platform and the detection platform are both rectangular structures, one side of the detection platform has four words of actual production, and one side of the simulation platform has four words of simulated production, so the simulation platform and the detection platform will face the side with the words in the same direction, and the position of the simulation platform and the detection platform are consistent, which can be understood as the placement of the simulation platform and the detection platform are consistent, and the simulation platform can be placed according to the placement position of the detection platform, or the detection platform can be placed according to the placement position of the simulation platform. Exemplarily, the tinned copper alloy wire actually produced is placed on the detection platform, and the critical position of the tinned copper alloy wire on the detection platform is determined; the critical position can be determined by observing the contact area between the tinned layer and the copper alloy wire through X-ray imaging.

[0117] S413, detect the distance value between the tin-plated layer and the critical position in the three-dimensional model, and then detect the distance value between the tin-plated layer and the critical position in the tin-plated copper alloy wire actually produced. If the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than a preset value, and the distance value between the tin-plated layer and the critical position of the tin-plated copper alloy wire actually produced is less than the preset value, then both the three-dimensional model and the tin-plated copper alloy wire actually produced have scratch defects, which proves that the surface defect situation reflected by the model defect information is predicted correctly, and the first defect information is obtained.

[0118] Exemplarily, the distance value between the tin-plated layer and the critical position in the three-dimensional model is measured by the measurement function in the three-dimensional software, and the distance value between the tin-plated layer and the critical position in the tin-plated copper alloy wire actually produced is detected by the detection tool. If the distance value between the tin-plated layer and the critical position in the three-dimensional model and the distance value between the tin-plated layer and the critical position of the tin-plated copper alloy wire actually produced are both less than the preset value, the three-dimensional model and the tin-plated copper alloy wire actually produced both have scratch defects, which proves that the surface defect situation reflected by the model defect information is predicted correctly, and the first defect information is obtained; the detection tool can be a laser rangefinder, etc. Among them, the distance value between the tin-plated layer and the critical position in the three-dimensional model and the distance value between the tin-plated layer and the critical position of the tin-plated copper alloy wire actually produced are both less than the preset value. The distance value between the tin-plated layer and the critical position in the preset value can represent the thickness of the tin-plated layer, that is, the distance from the outer surface of the tin-plated layer to the critical position (the critical position is the contact position between the tin-plated layer and the copper alloy wire, which can also be understood as the distance from the outer surface of the tin-plated layer to the copper alloy wire, that is, the distance value between the tin-plated layer and the critical position described above is less than the preset value, that is, the thickness value of the tin-plated layer). If both the three-dimensional model and the tin-plated copper alloy wire actually produced have scratch defects, it proves that the surface defect situation reflected by the model defect information is correctly predicted. Because the defect detection is carried out on the simulated production information to obtain the predicted defect situation of the tin-plated copper alloy wire, the three-dimensional model predicts the defects that may be encountered in actual production. Therefore, when the three-dimensional model has a scratch defect, it proves that the tin-plated copper alloy wire actually produced must also have defects. Therefore, when the distance value between the tin-plated layer and the critical position in the three-dimensional model and the distance value between the tin-plated layer and the critical position of the tin-plated copper alloy wire actually produced are both less than the preset value, it proves that the surface defect situation reflected by the model defect information is correctly predicted, and the first defect information can be obtained.

[0119] S414, if only the distance value between the tin-plated layer of the tin-plated copper alloy wire actually produced and the critical position is less than the preset value, the tin-plated copper alloy wire actually produced has a scratch defect and the three-dimensional model has no scratch defect, and the surface defect situation reflected by the model defect information is predicted incorrectly, and the first detection error information is obtained; wherein, the first detection error information is used to remind the operator to detect the defect step.

[0120] Exemplarily, when it is detected that only the distance value between the tin-plated layer of the actually produced tin-plated copper alloy wire and the critical position is less than the preset value, it can be obtained that the actually produced tin-plated copper alloy wire has a scratch defect while the three-dimensional model has no scratch defect, so it is proved that the surface defect situation reflected by the model defect information is predicted incorrectly, and the first detection error information is obtained; wherein, only the distance value between the tin-plated layer of the actually produced tin-plated copper alloy wire and the critical position is less than the preset value, so the actually produced tin-plated copper alloy wire has a scratch defect, which proves that the surface defect situation reflected by the model defect information is predicted incorrectly, because defect detection is performed on the simulated production information, but through the detection, only the distance value between the tin-plated layer of the actually produced tin-plated copper alloy wire and the critical position is less than the preset value, so the three-dimensional model has no scratch defect, so the actually produced tin-plated copper alloy wire should also have no scratch defect, so the surface defect situation is predicted incorrectly, and the first detection error information can be obtained.

[0121] S415, if only the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than the preset value, the three-dimensional model has a scratch defect but the actually produced tin-plated copper alloy wire has no scratch defect, then the surface defect situation reflected by the model defect information is predicted incorrectly, and a second detection error message is obtained; wherein, the detection error message is used to remind the operator to detect the simulation environment.

[0122] Exemplarily, when it is detected that only the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than the preset value, it can be obtained that the three-dimensional model has a scratch defect while the actually produced tin-plated copper alloy wire has no scratch defect, so it is proved that the surface defect situation reflected by the model defect information is predicted incorrectly, and the second detection error information is obtained; wherein, only the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than the preset value, so the three-dimensional model has a scratch defect, which proves that the surface defect situation is predicted incorrectly, because defect detection is performed on the simulated production information, but through detection only the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than the preset value, so the three-dimensional model has a scratch defect, and the actually produced tin-plated copper alloy wire should also have a scratch defect, so the surface defect situation is predicted incorrectly, and the second detection error information can be obtained.

[0123] S420, obtaining second defect information; wherein the second defect information is obtained after internal detection and analysis of the crack defect indicated by the internal state information and the tin-plated copper alloy wire actually produced.

[0124] Exemplarily, the second defect information can be obtained by adopting nondestructive testing technology; wherein, the tin-plated copper alloy wire is scanned by high-resolution X-ray imaging technology to capture subtle changes in the internal structure, and the position and shape of the crack defect can be clearly identified, and then the X-ray image is processed by computer-aided image analysis software to extract the precise size and depth information of the crack defect; in addition, multi-angle scanning technology can be used to image the tin-plated copper alloy wire from different directions to eliminate possible blind spots, which is helpful to obtain comprehensive information about the internal crack defects of the tin-plated copper alloy wire, thereby providing reliable data support for subsequent defect analysis and quality control, which not only improves the accuracy of detection, but also greatly improves the detection efficiency and product quality.

[0125] In one possible implementation, see Figure 7 , S420, obtaining second defect information, including:

[0126] S421, placing the three-dimensional model on the simulation platform, establishing a dividing mark in the middle of the three-dimensional model, dividing the three-dimensional model into a left area and a right area with the dividing mark as the boundary, applying heat from the left area position or applying heat from the right area position, and obtaining the static time according to the length of the three-dimensional model and the heat diffusion rate.

[0127] It can be understood that establishing a dividing mark in the middle of the three-dimensional model can be understood as dividing the three-dimensional model into two halves. The dividing mark is limited only as a mark, and can be a dividing line or other mark marked on the three-dimensional model using the display function, but is not limited to this. The left area and the right area of ​​the three-dimensional model can be understood as the three-dimensional model is divided into two sections, the left area represents the left half of the three-dimensional model, and the right area represents the right half of the three-dimensional model. The rest time is obtained according to the length of the three-dimensional model and the heat diffusion rate. It can be understood that the length of the three-dimensional model and the heat diffusion rate can be used to know how long it takes for the heat (or the heat propagation time) to be transferred from the left area to the right area or from the right area to the left area, that is, the time consumed is the rest time.

[0128] S422, after the static time is over, the temperature values ​​and heat flow paths of the left area and the right area are detected to obtain model crack information; wherein the model crack information is used to reflect the existence of cracks inside the three-dimensional model.

[0129] For example, after the static time is over, the temperature values ​​and heat flow paths of the left and right areas are detected through the corresponding detection functions to obtain the model crack information; wherein, by real-time monitoring and recording the temperature changes of the left and right areas, the path and intensity of the heat flow can be captured and transmitted to the computer system for processing. In addition, the analysis software will simulate the temperature field and heat flow field distribution inside the model based on the temperature and heat flow data, combined with the geometric parameters and material properties of the three-dimensional model, using the heat conduction equation and the finite element analysis method to obtain the model crack information.

[0130] S423, placing the actually produced tin-plated copper alloy wire of the same length on the detection platform, making a boundary mark in the middle of the actually produced tin-plated copper alloy wire, dividing the actually produced tin-plated copper alloy wire into a left section and a right section with the boundary mark as the boundary, applying detection conditions to the actually produced tin-plated copper alloy wire, applying heat from the left section position or applying heat from the right section position.

[0131] Exemplarily, the tinned copper alloy wire to be tested is placed on a dedicated testing platform, a boundary mark is made in the middle of the tinned copper alloy wire, the wire is divided into a left section and a right section, and heat is applied to the tinned copper alloy wire; wherein, the boundary mark in the middle of the tinned copper alloy wire can be completed by using a marking pen or the like. The heat can be applied by an electric heating element, an infrared heater or other suitable heating method; when applying heat, it can be applied from the left or right section respectively, but not at the same time. In addition, while applying heat, a thermal imaging camera or other thermal imaging equipment is used to monitor the tinned copper alloy wire in real time. The thermal imaging equipment can capture the temperature distribution on the surface of the wire and convert it into a color map. In the map, different colors represent different temperatures or heat flux intensities, so that the location and degree of cracks inside the wire can be clearly identified.

[0132] S424, after the standing time is over, the temperature values ​​and heat flow paths of the left area and the right area are detected to obtain actual wire crack information; wherein the actual wire crack information is used to reflect the existence of cracks inside the tinned copper alloy wire actually produced.

[0133] For example, after the standing time is over, the temperature values ​​and heat flow paths of the left and right areas are checked to obtain the existence of cracks inside the tinned copper alloy wire actually produced. Among them, the temperature values ​​and heat flow paths of the left and right areas can be obtained by real-time monitoring using an infrared thermal imager; the method of using the infrared thermal imager can be to aim the infrared thermal imager at the tinned copper alloy wire to be tested so that it can cover the entire detection area, set a suitable temperature range and sensitivity to capture subtle temperature differences, and after the standing time is over, start the real-time monitoring mode of the infrared thermal imager, record the temperature change curves of the left and right areas, and observe the temperature fluctuations to obtain the heat flow path; abnormal changes in the heat flow path often indicate the presence of cracks inside the wire. The abnormality of the heat flow path can be that a gap appears in any part of a complete heat flow path, indicating that the structure may be broken, or the curve fluctuates, indicating the instability of the internal structure, etc.

[0134] S425, comparing the model crack information with the actual wire crack information. If the model crack information is the same as the actual wire crack information, the internal defect situation reflected by the model defect information is predicted correctly, and the second defect information is obtained.

[0135] Exemplarily, according to the model crack information and the actual wire crack information obtained in the above steps, the processed model crack information and the actual wire crack information are registered, and compared after registration to obtain the second defect information; wherein, in the registration process, the model crack information and the actual wire crack information can be first converted into images (which can be converted into crack images predicted by the model and actual wire images), and feature point matching algorithms, such as SIFT (scale invariant feature transform) or SURF (accelerated robust features), are used to identify the corresponding points between the two images. Through these corresponding points, a transformation matrix can be calculated to map the crack image predicted by the model to the actual wire image. Comparison after registration can be to compare the pixel differences of the two images to evaluate the accuracy of the model prediction. If the crack position predicted by the model is highly consistent with the actual crack position, and the shape and size of the crack are also basically the same, then it can be considered that the model defect information correctly reflects the internal defect situation, thereby obtaining the second defect information.

[0136] In a possible implementation, the method further includes:

[0137] S425A, comparing the model crack information with the actual wire crack information. If the model crack information is different from the actual wire crack information, the internal defect situation reflected by the model defect information is predicted incorrectly, and internal defect error information is obtained; wherein the internal defect error information is used to remind the operator to check the internal defect detection process.

[0138] Exemplarily, the specific steps are similar to S425; according to the model crack information and the actual wire crack information obtained in the above steps, the processed model crack information and the actual wire crack information are registered, and compared after registration to obtain internal defect error information; wherein, in the registration process, the model crack information and the actual wire crack information can be first converted into images (which can be converted into crack images predicted by the model and actual wire images), and a feature point matching algorithm, such as SIFT (scale invariant feature transform) or SURF (accelerated robust feature), is used to identify the corresponding points between the two images. A transformation matrix is ​​calculated through these corresponding points to map the crack image predicted by the model to the actual wire image. After registration, the comparison can be made by comparing the pixel difference between the two images to evaluate the accuracy of the model prediction. If the crack position predicted by the model and the actual crack position match less than 40%, and the shape and size of the crack are also quite different, then it can be considered that the internal defect reflected by the model defect information is different from the internal defect of the tinned copper alloy wire actually produced, thereby obtaining internal defect error information.

[0139] S430, obtaining actual defect information according to the first defect information and the second defect information.

[0140] Exemplarily, the first defect information and the second defect information are comprehensively analyzed to obtain actual defect information; the comprehensive analysis can be a data fusion technology that integrates data from different detection methods and types to obtain a more comprehensive and accurate defect description; a pattern recognition algorithm can be used to analyze the extracted features to determine the type and severity of the defects, obtain feature analysis results of the first defect information and the second defect information, and use weighted average to distribute defect weights to obtain more accurate defect information.

[0141] With such settings, through the description of the above steps, the production parameters can be adjusted to optimize the process flow, thereby reducing the scrap rate and improving product quality. This comparative detection can be used to discover defects that may occur in the production process, such as cracks, bubbles, inclusions, etc., so that measures can be taken to correct the problem before it expands, so as to accurately determine which tinned copper alloy wires need to be inspected for defects, thereby improving the inspection efficiency and the inspection accuracy of tinned copper alloy wires.

[0142] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0143] Corresponding to the tin-plated copper alloy wire defect detection method described in the above embodiment, the embodiment of the present application also provides a tin-plated copper alloy wire defect detection system, and each unit of the system can implement each step of the tin-plated copper alloy wire defect detection method. Figure 8 A structural block diagram of a tin-plated copper alloy wire defect detection system provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0144] Reference Figure 8 , the tinned copper alloy wire defect detection system includes:

[0145] An acquisition unit, used for acquiring historical production information of the tinned copper alloy wire; wherein the historical production information is used for indicating the production equipment, production conditions and process flow used in the previous actual production of the tinned copper alloy wire;

[0146] A simulation unit, used for simulating the production of tinned copper alloy wire based on historical production information to obtain simulated production information; wherein the simulated production information is used to indicate a three-dimensional model of the tinned copper alloy wire that has been established;

[0147] A detection unit, used to perform defect detection on the simulated production information to obtain model defect information; wherein the model defect information is used to reflect the predicted defect conditions of the tinned copper alloy wire produced in the simulated production;

[0148] The result unit is used to obtain actual defect information, wherein the actual defect information is obtained by comparing and testing the actually produced tin-plated copper alloy wire based on the model defect information.

[0149] It should be noted that the information interaction, execution process, etc. between the above-mentioned systems / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0150] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0151] The present application also provides a tinned copper alloy wire defect detection device, Fig. 9This is a schematic diagram of the structure of a tinned copper alloy wire defect detection device provided in one embodiment of the present application. Fig. 9 As shown, the tinned copper alloy wire defect detection device 6 of this embodiment includes: at least one processor 60 ( Fig. 9 Only one is shown), at least one memory 61 ( Fig. 9 Only one is shown) and a computer program 62 stored in the at least one memory 61 and executable on the at least one processor 60. When the processor 60 executes the computer program 62, the tin-plated copper alloy wire defect detection device 6 implements the steps in any of the above-mentioned tin-plated copper alloy wire defect detection method embodiments, or the tin-plated copper alloy wire defect detection device 6 implements the functions of each module / unit in the above-mentioned device embodiments.

[0152] Exemplarily, the computer program 62 may be divided into one or more modules / units, which are stored in the memory 61 and executed by the processor 60 to complete the present application. The one or more modules / units may be a series of computer program instruction segments capable of completing specific functions, which are used to describe the execution process of the computer program 62 in the tinned copper alloy wire defect detection device 6.

[0153] The tinned copper alloy wire defect detection device 6 can be a desktop computer, a notebook, a palm computer, etc. The tinned copper alloy wire defect detection device can include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art can understand that Fig. 9 It is only an example of the tinned copper alloy wire defect detection device 6 and does not constitute a limitation of the tinned copper alloy wire defect detection device 6. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components, for example, it may also include input and output devices, network access devices, buses, etc.

[0154] The processor 60 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0155] In some embodiments, the memory 61 may be an internal storage unit of the tinned copper alloy wire defect detection device 6, such as a hard disk or memory of the tinned copper alloy wire defect detection device 6. In other embodiments, the memory 61 may also be an external storage device of the tinned copper alloy wire defect detection device 6, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the tinned copper alloy wire defect detection device 6. Further, the memory 61 may also include both the internal storage unit of the tinned copper alloy wire defect detection device 6 and an external storage device. The memory 61 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program, etc. The memory 61 may also be used to temporarily store data that has been output or is to be output.

[0156] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0157] An embodiment of the present application provides a computer program product. When the computer program product is run on a tinned copper alloy wire defect detection device, the tinned copper alloy wire defect detection device implements the steps in any of the above-mentioned method embodiments.

[0158] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor, the steps of the above-mentioned various method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying the computer program code to the tinned copper alloy wire defect detection device, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0159] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0160] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0161] In the embodiments provided in the present application, it should be understood that the disclosed tin-plated copper alloy wire defect detection system, equipment and method can be implemented in other ways. For example, the tin-plated copper alloy wire defect detection system and equipment embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0162] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0163] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for detecting defects in tinned copper alloy wires, characterized in that: include: Obtaining historical production information of the tinned copper alloy wire; wherein the historical production information is used to indicate the production equipment, production conditions and process flow used in the previous actual production of the tinned copper alloy wire; Based on the historical production information, simulated production of the tinned copper alloy wire is performed to obtain simulated production information; wherein the simulated production information is used to indicate a three-dimensional model of the tinned copper alloy wire that has been established; Performing defect detection on the simulated production information to obtain model defect information; wherein the model defect information is used to reflect the predicted defect conditions of the tin-plated copper alloy wire produced in the simulated production; Actual defect information is obtained, wherein the actual defect information is obtained by comparing and testing the tin-plated copper alloy wire actually produced based on the model defect information.

2. The tin-plated copper alloy wire defect detection method according to claim 1, characterized in that: The method of performing simulated production of tinned copper alloy wire based on the historical production information, before obtaining the simulated production information, includes: According to the production equipment indicated in the historical production information, first simulation information is obtained; wherein the first simulation information is used to indicate the equipment type and equipment production parameters of the production equipment used in simulating the production of tinned copper alloy wire; Perform condition simulation based on the production conditions and the process flow indicated in the historical production information to obtain second simulation information; wherein the second simulation information is used to indicate the workshop production environment when simulating the production of tin-plated copper alloy wire; A simulation is created based on the first simulation information and the second simulation information to obtain simulation line information; wherein the simulation line information is used to indicate a simulation production line created by the simulation.

3. The tin-plated copper alloy wire defect detection method according to claim 1, characterized in that: The method of performing simulated production of tinned copper alloy wire based on the historical production information, after obtaining the simulated production information, comprises: Acquire application information of the tinned copper alloy wire; wherein the application information is used to indicate specific environmental requirements for the application of the tinned copper alloy wire; The simulated production information is input into the evaluation model as the evaluation object, and the evaluation model uses the application scenario information as the evaluation condition to evaluate the evaluation object; wherein the evaluation model is a machine learning model obtained by training as a sample; After the evaluation of the evaluation model is completed, the evaluation model outputs evaluation status information. If the evaluation status information is valid information, the simulated production information is confirmed as a three-dimensional model that can be used for defect detection.

4. The tin-plated copper alloy wire defect detection method according to claim 3, characterized in that: The method further comprises: After the evaluation of the evaluation model is completed, the evaluation model outputs evaluation status information. If the evaluation status information is invalid information, invalid reason information is obtained, wherein the invalid reason information is used to reflect the situation of the evaluation value of the application scenario of the simulated production information.

5. The tin-plated copper alloy wire defect detection method according to claim 1, characterized in that: The performing defect detection on the simulated production information to obtain model defect information includes: Acquire the orientation information of the three-dimensional model indicated by the simulated production information; wherein the orientation information is used to indicate the coordinate position of the three-dimensional model in the modeling space; Detecting surface state information of the three-dimensional model based on the orientation information; wherein the surface state information is used to reflect scratch defects on the surface of the three-dimensional model; Detecting internal state information of the three-dimensional model based on the orientation information; wherein the internal state information is used to reflect crack defects inside the three-dimensional model; The model defect information is obtained according to the surface state information and the internal state information.

6. The tin-plated copper alloy wire defect detection method according to claim 5, characterized in that: The obtaining of actual defect information includes: Acquire first defect information; wherein the first defect information is obtained after surface detection and analysis of the scratch defect indicated by the surface state information and the tin-plated copper alloy wire actually produced; Acquire second defect information; wherein the second defect information is obtained after internal detection and analysis of the crack defect indicated by the internal state information and the tin-plated copper alloy wire actually produced; The actual defect information is obtained according to the first defect information and the second defect information.

7. The tin-plated copper alloy wire defect detection method according to claim 6, characterized in that: The obtaining of first defect information includes: Establishing a simulation platform in a three-dimensional space, placing the three-dimensional model on the simulation platform, and determining a critical position of the three-dimensional model; Placing the tinned copper alloy wire actually produced on the detection platform, and determining the critical position on the tinned copper alloy wire actually produced; wherein the simulation platform is consistent with the detection platform in direction and position, and the critical position is the contact position between the tinned layer and the copper alloy wire; Detecting the distance value between the tin-plated layer and the critical position in the three-dimensional model, and then detecting the distance value between the tin-plated layer and the critical position in the actually produced tin-plated copper alloy wire. If the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than a preset value, and the distance value between the tin-plated layer and the critical position of the actually produced tin-plated copper alloy wire is less than the preset value, the three-dimensional model and the actually produced tin-plated copper alloy wire both have scratch defects, which proves that the surface defect condition reflected by the model defect information is predicted correctly, and the first defect information is obtained; If only the distance value between the tinned layer of the tinned copper alloy wire actually produced and the critical position is less than the preset value, the tinned copper alloy wire actually produced has a scratch defect and the three-dimensional model has no scratch defect, and the surface defect situation reflected by the model defect information is predicted incorrectly, and the first detection error information is obtained; wherein the first detection error information is used to remind the operator to detect the defect step; If only the distance value between the tin-plated layer and the critical position in the three-dimensional model is less than a preset value, the three-dimensional model has a scratch defect but the actually produced tin-plated copper alloy wire has no scratch defect, and the surface defect situation reflected by the model defect information is predicted incorrectly, and a second detection error message is obtained; wherein, the detection error message is used to remind the operator to detect the simulation environment.

8. The tin-plated copper alloy wire defect detection method according to claim 7, characterized in that: The obtaining of the second defect information includes: The three-dimensional model is placed on a simulation platform, and the tinned copper alloy wire actually produced is placed on a detection platform, a dividing mark is established in the middle of the three-dimensional model, and the three-dimensional model is divided into a left area and a right area with the dividing mark as a boundary, heat is applied from the position of the left area or from the position of the right area, and the standing time is obtained according to the length of the three-dimensional model and the heat diffusion speed; After the standing time is over, the temperature values ​​and heat flow paths of the left area and the right area are detected to obtain model crack information; wherein the model crack information is used to reflect the existence of cracks inside the three-dimensional model; Then, placing the actually produced tin-plated copper alloy wire of the same length on the detection platform, making a boundary mark in the middle of the actually produced tin-plated copper alloy wire, dividing the actually produced tin-plated copper alloy wire into a left section and a right section with the boundary mark as the boundary, applying detection conditions to the actually produced tin-plated copper alloy wire, applying heat from the position of the left section or applying heat from the position of the right section; After the standing time is over, the temperature values ​​and heat flow paths of the left area and the right area are detected to obtain actual wire crack information; wherein the actual wire crack information is used to reflect the existence of cracks inside the tinned copper alloy wire actually produced; The model crack information is compared with the actual wire crack information. If the model crack information is the same as the actual wire crack information, the internal defect situation reflected by the model defect information is predicted correctly, and the second defect information is obtained.

9. The tin-plated copper alloy wire defect detection method according to claim 8, characterized in that: The method further comprises: The model crack information is compared with the actual wire crack information. If the model crack information is different from the actual wire crack information, the internal defect situation reflected by the model defect information is predicted incorrectly, and internal defect error information is obtained; wherein the internal defect error information is used to remind the operator to check the internal defect detection process.

10. A tinned copper alloy wire defect detection device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 9 is implemented.

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