Multilayer ceramic capacitor

Abstract

The present disclosure provides a multilayer ceramic capacitor. The multi-layer ceramic capacitor comprises a ceramic main body, comprising a first surface and a second surface which are opposite to each other in a first direction, a third surface and a fourth surface which are opposite to each other in a second direction and are connected with the first surface and the second surface, and a fifth surface and a sixth surface which are opposite to each other in a third direction and are connected with the first surface and the second surface; the inner electrode is arranged inside the ceramic main body; a protective layer disposed on the third surface and the fourth surface of the ceramic body; and a connection electrode covering the protective layer. The protective layer includes a first protective layer disposed on the third surface and a second protective layer disposed on the fourth surface, and one or more openings are formed at portions on the third surface and the fourth surface where the protective layer is not disposed.

Description

Technical Field

[0001] The present disclosure relates to a multilayer ceramic capacitor. Background Art

[0002] As the size of electronic products tends to decrease, multilayer ceramic capacitors are required to be reduced in size but still have large capacity. In accordance with the demand for miniaturization and high capacitance of multilayer ceramic capacitors, the outer electrodes of multilayer ceramic capacitors also need to be thinner.

[0003] The paste forming the external electrode uses a conductive metal such as copper (Cu) as its main material to ensure sealing performance and electrical connectivity with the ceramic body. In addition, glass is used as an auxiliary material to fill the empty space during the sintering shrinkage of the conductive metal while providing a bonding force between the external electrode and the ceramic body.

[0004] Multilayer ceramic capacitors are classified based on their length and width. Therefore, even in a multilayer ceramic capacitor having the same length or width, the size of the ceramic body may vary according to the thickness of the external electrode, and the capacitance may vary accordingly. Therefore, in order to increase the capacitance while maintaining the length and width, the external electrode must be made thin. However, if the external electrode is thinned, the risk of moisture penetrating into the inside of the ceramic body may increase. Summary of the invention

[0005] The present disclosure provides a ceramic capacitor capable of improving moisture resistance reliability by suppressing penetration of moisture into a ceramic body.

[0006] However, the embodiments of the present disclosure are not limited to the described embodiments and can be variously extended within the scope of the technical concept included in the present disclosure.

[0007] The multilayer ceramic capacitor according to the embodiment includes: a ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; an inner electrode disposed inside the ceramic body; a protective layer disposed on the third surface and the fourth surface of the ceramic body; and a connecting electrode covering the protective layer. The protective layer includes a first protective layer disposed on the third surface and a second protective layer disposed on the fourth surface, and one or more openings are formed at portions of the third surface and the fourth surface where the protective layer is not disposed.

[0008] The first protective layer may include a first portion extending from the third surface to the first surface and a second portion extending from the third surface to the second surface, and the second protective layer may include a first portion extending from the fourth surface to the first surface and a second portion extending from the fourth surface to the second surface.

[0009] The inner electrode may be connected to the connecting electrode through the one or more openings.

[0010] The protective layer may include silicon oxide.

[0011] The protective layer may have a thickness less than 10 -7 The conductivity is S / cm.

[0012] The protective layer may further include sodium oxide (Na2O).

[0013] The protective layer may further include copper (II) oxide (CuO).

[0014] The connection electrode may include particles of the same material as the protection layer.

[0015] The connecting electrode may include a first connecting electrode at least partially covering the first protective layer and a second connecting electrode at least partially covering the second protective layer, the first protective layer may have a portion on the first surface and the second surface of the ceramic body that protrudes farther than the first connecting electrode in a direction toward the fourth surface, and the second protective layer may have a portion on the first surface and the second surface of the ceramic body that protrudes farther than the second connecting electrode in a direction toward the third surface.

[0016] The multilayer ceramic capacitor may further include: a first plated electrode and a second plated electrode, the first plated electrode at least partially covering the first connecting electrode, the second plated electrode at least partially covering the second connecting electrode. The first protective layer may have a portion protruding further than the first plated electrode in a direction toward the fourth surface on the first and second surfaces of the ceramic body, and the second protective layer may have a portion protruding further than the second plated electrode in a direction toward the third surface on the first and second surfaces of the ceramic body.

[0017] The first protective layer and the second protective layer may have portions in contact with the ceramic body.

[0018] The first portion and the second portion of the first protective layer may each extend continuously without an opening, and the first portion and the second portion of the second protective layer may each extend continuously without an opening.

[0019] The protective layer may include glass including sodium (Na), copper (II) (Cu), and silicon (Si).

[0020] A multilayer ceramic capacitor according to another embodiment includes: a ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; an internal electrode disposed inside the ceramic body; a protective layer disposed on a portion of the third surface and a portion of the fourth surface of the ceramic body; and a connecting electrode covering the protective layer. The connecting electrode includes a portion contacting the internal electrode through a portion of the third surface and the fourth surface of the ceramic body where the protective layer is not disposed.

[0021] The protection layer may include a portion extending from the third surface or the fourth surface onto the first surface and the second surface.

[0022] The opening is provided at a portion of the third surface and the fourth surface of the ceramic body where the protective layer is not provided, and the protective layer may have a portion extending continuously from one end of the protective layer located on the first surface or the second surface to the other end of the protective layer located on one side of the opening.

[0023] The protective layer may include a first protective layer extending along the first surface, the third surface, and the second surface, and a second protective layer extending along the first surface, the fourth surface, and the second surface. The connection electrode may include a first connection electrode covering the first protective layer and a second connection electrode covering the second protective layer, the first protective layer may have a portion protruding further than the first connection electrode on the first surface and the second surface in a direction toward the fourth surface, and the second protective layer may have a portion protruding further than the second connection electrode on the first surface and the second surface in a direction toward the third surface.

[0024] The multilayer ceramic capacitor may further include: a first plated electrode and a second plated electrode, the first plated electrode covering the first connecting electrode, the second plated electrode covering the second connecting electrode. The first protective layer may have a portion protruding further than the first plated electrode on the first surface and the second surface in a direction toward the fourth surface, and the second protective layer may have a portion protruding further than the second plated electrode on the first surface and the second surface in a direction toward the third surface.

[0025] The portion of the protective layer may continuously extend from the third surface or the fourth surface to the first surface and the second surface without an opening.

[0026] The protective layer may include glass including sodium (Na), copper (II) (Cu), and silicon (Si).

[0027] In the multilayer ceramic capacitor according to the embodiment, even when the external electrodes are formed thin, it is possible to prevent moisture from penetrating into the ceramic body.

[0028] Furthermore, defects such as the external electrode peeling off during the sintering of the external electrode and the plating diffusion to an unintended region of the ceramic body when forming the plated electrode can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a perspective view of a multilayer ceramic capacitor according to an embodiment.

[0030] Figure 2 is along Figure 1 A cross-sectional view taken along line II-II'.

[0031] Figure 3 is along Figure 1 A cross-sectional view taken along line III-III'.

[0032] Figure 4 yes Figure 2 An enlarged partial cross-sectional view of portion A.

[0033] Figure 5 yes Figure 2 An enlarged partial cross-sectional view of portion B.

[0034] Figure 6 2 is a diagram illustrating a method of manufacturing a multilayer ceramic capacitor according to an embodiment. DETAILED DESCRIPTION

[0035] Hereinafter, the present disclosure will be described in detail below with reference to the accompanying drawings, in which embodiments of the present disclosure are shown. The accompanying drawings and descriptions are considered to be illustrative rather than restrictive in nature. Throughout the specification, the same reference numerals represent the same elements. In the accompanying drawings, some constituent elements are enlarged, omitted or schematically shown, and the size of each constituent element does not fully reflect the actual size.

[0036] The drawings are intended only to facilitate understanding of the exemplary embodiments disclosed in this specification, and it should be understood that the technical concepts disclosed herein are not limited to the drawings, and include all modifications, equivalents, or replacements within the scope of the concepts and technologies of the present disclosure.

[0037] Although the terms "first", "second", etc. are used to explain various constituent elements, the constituent elements are not limited by these terms. These terms are only used to distinguish one constituent element from another constituent element.

[0038] Additionally, it should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements. Furthermore, when an element is referred to as being "on" or "above" a reference element, the element can be located above or below the reference element and is not necessarily referred to as being "on" or "above" in a direction opposite to gravity.

[0039] Throughout the specification, the terms "include" or "have" are intended to specify the presence of stated features, integers, steps, operations, constituent elements, components, or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, constituent elements, components, and / or combinations thereof. Therefore, unless explicitly described to the contrary, the word "include" and variations such as "include" or "have" will be understood to imply the inclusion of the stated constituent elements but not the exclusion of any other constituent elements.

[0040] Furthermore, throughout the specification, the phrase “in a plan view” or “on a plane” means observing a target portion from the top, and the phrase “in a cross-sectional view” or “on a cross section” means observing a cross section formed by vertically cutting the target portion from the side.

[0041] Throughout the specification, the term "connected" not only means that two or more constituent elements are directly connected, but may also mean that two or more constituent elements are indirectly connected through another constituent element, that two or more constituent elements are electrically connected as well as physically connected, or that two or more constituent elements are represented by different names but are united by position or function.

[0042] Figure 1 is a perspective view schematically showing a multilayer ceramic capacitor according to an embodiment. Figure 2 is along Figure 1 A cross-sectional view taken along line II-II'. Figure 3 is along Figure 1 A cross-sectional view taken along line III-III'.

[0043] Reference Figures 1 to 3 , the multilayer ceramic capacitor 1000 according to the embodiment includes a ceramic body 10 , a plurality of internal electrodes 150 and 160 , protective layers 210 and 310 , a first external electrode 20 , and a second external electrode 30 .

[0044] First, directions are defined to clearly describe the present embodiment, and the L-axis, W-axis, and T-axis shown in the accompanying drawings respectively refer to axes representing the length direction (e.g., the second direction), the width direction (e.g., the third direction), and the thickness direction (e.g., the first direction) of the multilayer ceramic capacitor 1000.

[0045] The thickness direction (T-axis direction) may be a direction perpendicular to the wide surface (main surface) of the sheet member. For example, the thickness direction (T-axis direction) may be the same direction as the direction in which the dielectric layer 140 is stacked.

[0046] The length direction (L-axis direction) is a direction parallel to the wide surface (main surface) of the sheet component, and may be a direction intersecting or perpendicular to the thickness direction (T-axis direction). For example, the length direction (L-axis direction) may be a direction in which the first external electrode 20 and the second external electrode 30 are opposite to each other.

[0047] The width direction (W-axis direction) is a direction parallel to the wide surface (main surface) of the sheet component and may be a direction intersecting or perpendicular to the thickness direction (T-axis direction) and the length direction (L-axis direction).

[0048] The ceramic body 10 may have a substantially hexahedral shape, but the present embodiment is not limited thereto. Due to shrinkage during sintering, the ceramic body 10 may not have a completely hexahedral shape, but may have a substantially hexahedral shape. For example, the ceramic body 10 may have a substantially rectangular parallelepiped shape, but portions corresponding to corners or vertices may have a rounded shape.

[0049] For better understanding and ease of description, in this embodiment, surfaces opposite to each other in the thickness direction (T-axis direction, for example, the first direction) are defined as a first surface 11 and a second surface 12, surfaces opposite to each other in the length direction (L-axis direction, for example, the second direction) and connecting the first surface 11 and the second surface 12 are defined as a third surface 13 and a fourth surface 14, and surfaces opposite to each other in the width direction (W-axis direction, for example, the third direction) and intersecting with the third surface 13 and the fourth surface 14 are defined as a fifth surface 15 and a sixth surface 16.

[0050] Therefore, the first direction relative to the first surface 11 and the second surface 12 can be the thickness direction (T-axis direction), and the second direction and the third direction perpendicular to the first direction and to each other can be the length direction (L-axis direction) and the width direction (W-axis direction), respectively.

[0051] The length of the ceramic body 10 may be represented by: based on an optical microscope or scanning electron microscope (SEM) photograph of a length direction (L axis direction)-thickness direction (T axis direction) cross section at the center portion of the width direction (W axis direction) of the ceramic body 10, the maximum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph that are opposite in the length direction (L axis direction) and parallel to the length direction (L axis direction). In addition, the length of the ceramic body 10 may be represented by: the minimum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph that are opposite in the length direction (L axis direction) and parallel to the length direction (L axis direction). In addition, the length of the ceramic body 10 may be represented by: the arithmetic mean of the lengths of at least two of the plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph that are opposite in the length direction (L axis direction) and parallel to the length direction (L axis direction).

[0052] The thickness of the ceramic body 10 may be represented by: based on an optical microscope or SEM photograph of a length direction (L axis direction)-thickness direction (T axis direction) cross section at the center portion of the ceramic body 10 in the width direction (W axis direction), the maximum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph in the thickness direction (T axis direction) and parallel to the thickness direction (T axis direction). In addition, the thickness of the ceramic body 10 may be represented by: the minimum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph in the thickness direction (T axis direction) and parallel to the thickness direction (T axis direction). In addition, the thickness of the ceramic body 10 may be represented by: the arithmetic mean of the lengths of at least two of the plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph in the thickness direction (T axis direction) and parallel to the thickness direction (T axis direction).

[0053] The width of the ceramic body 10 may be represented by: based on an optical microscope or SEM photograph of a length direction (L axis direction)-width direction (W axis direction) cross section at the center portion of the ceramic body 10 in the thickness direction (T axis direction), the maximum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph in the width direction (W axis direction) and parallel to the width direction (W axis direction). In addition, the width of the ceramic body 10 may be represented by: the minimum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph in the width direction (W axis direction) and parallel to the width direction (W axis direction). In addition, the width of the ceramic body 10 may be represented by: the arithmetic mean of the lengths of at least two of the plurality of line segments each connecting the two outermost boundary lines of the ceramic body 10 shown in the above cross-sectional photograph in the width direction (W axis direction) and parallel to the width direction (W axis direction).

[0054] The ceramic body 10 may be formed by stacking a plurality of dielectric layers 140 in a thickness direction (T-axis direction) and then sintering them. Here, a plurality of adjacent dielectric layers 140 of the ceramic body 10 may be integrated with each other without clear boundaries. In other words, the adjacent dielectric layers 140 of the ceramic body 10 may be integrated to such an extent that it is difficult to distinguish the boundaries between the adjacent dielectric layers 140 without using SEM.

[0055] The internal electrodes 150 and 160 include first internal electrodes 150 and second internal electrodes 160 having different polarities. A plurality of first internal electrodes 150 and a plurality of second internal electrodes 160 may be alternately arranged in the thickness direction (T-axis direction) within the ceramic body 10 with the dielectric layer 140 interposed between the first internal electrodes 150 and the second internal electrodes 160. The first internal electrodes 150 and the second internal electrodes 160 adjacent to each other may be electrically insulated from each other by the dielectric layer 140 disposed therebetween.

[0056] The plurality of first internal electrodes 150 and the plurality of second internal electrodes 160 may be alternately disposed with the dielectric layer 140 interposed therebetween to partially overlap each other in the thickness direction (T-axis direction). Ends of the plurality of first internal electrodes 150 may be exposed through the third surface 13 of the ceramic body 10, and ends of the plurality of second internal electrodes 160 may be exposed through the fourth surface 14 of the ceramic body 10. Ends of the plurality of first internal electrodes 150 and ends of the plurality of second internal electrodes 160 alternately exposed through the third surface 13 and the fourth surface 14 of the ceramic body 10 may be electrically connected to the first connection portion 21 of the first external electrode 20 on the third surface 13 of the ceramic body 10 and the second connection portion 31 of the second external electrode 30 on the fourth surface 14 of the ceramic body 10, respectively.

[0057] The first and second internal electrodes 150 and 160 may be formed by printing a conductive paste including a conductive metal on the surface of the dielectric layer 140. For example, the internal electrodes may be formed by printing a conductive paste including nickel (Ni) or a nickel (Ni) alloy on the surface of the dielectric layer using a screen printing method or a gravure printing method. However, the embodiment is not limited thereto.

[0058] For example, the first and second internal electrodes 150 and 160 may have an average thickness of approximately 0.1 μm or more and 2 μm or less.

[0059] According to the above configuration, when a voltage is applied to the first external electrode 20 and the second external electrode 30, charges are accumulated between the first internal electrode 150 and the second internal electrode 160 facing each other. The capacitance of the multilayer ceramic capacitor 1000 is proportional to the overlapping area of ​​the first internal electrode 150 and the second internal electrode 160 overlapping each other in the thickness direction (T-axis direction).

[0060] The multilayer ceramic capacitor 1000 includes an active region where the plurality of first internal electrodes 150 and the plurality of second internal electrodes 160 are stacked along the thickness direction (T-axis direction) and an edge region between the active region and the third and fourth surfaces 13 and 14 of the ceramic body 10.

[0061] The first cover layer 143 and the second cover layer 145 may be disposed on both sides outside the plurality of first internal electrodes 150 and the plurality of second internal electrodes 160 in the thickness direction (T-axis direction) in the ceramic body 10 , respectively.

[0062] That is, the first cover layer 143 may be disposed under the lowermost internal electrode, and the second cover layer 145 may be disposed over the uppermost internal electrode in the ceramic body 10. The first cover layer 143 and the second cover layer 145 may have the same composition as the dielectric layer 140, and may be formed by stacking one or more dielectric layers without internal electrodes formed thereon, respectively, under the lowermost internal electrode and over the uppermost internal electrode of the ceramic body 10.

[0063] The first and second capping layers 143 and 145 may serve to prevent damage to the first and second internal electrodes 150 and 160 that may occur due to physical stress or chemical stress.

[0064] The dielectric layer 140 may include a high dielectric constant ceramic material. For example, the ceramic material may include a dielectric ceramic including a component such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. In addition, these components may also include a secondary component such as a Mn compound, a Fe compound, a Cr compound, a Co compound, and a Ni compound. For example, the dielectric layer may include a BaTiO3 in which Ca (calcium), Zr (zirconium), etc. are partially dissolved in the BaTiO3.1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1- y Zr y )O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1). However, the present disclosure is not limited thereto.

[0065] In addition, the dielectric layer 140 may further include one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. For example, the ceramic additive may include a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), or aluminum (Al).

[0066] For example, the average thickness of the dielectric layer 140 may be from 0.1 μm to 10 μm, but this embodiment is not limited thereto.

[0067] The outer electrodes 20 and 30 are disposed outside the ceramic body 10 and include a first outer electrode 20 and a second outer electrode 30. The first outer electrode 20 and the second outer electrode 30 are disposed on the third surface 13 and the fourth surface 14 of the ceramic body 10 in the length direction (L-axis direction) and may extend to the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16. In another embodiment, the first outer electrode 20 and the second outer electrode 30 may extend to a part of the first surface 11 or a part of the second surface 12.

[0068] The first outer electrode 20 includes a first connection portion 21, a first belt portion 23, and a first corner portion 25, and the second outer electrode 30 includes a second connection portion 31, a second belt portion 33, and a second corner portion 35.

[0069] The first connection portion 21 covers the third surface 13 of the ceramic body 10 and is electrically connected to the exposed ends of the plurality of first inner electrodes 150. The second connection portion 31 covers the fourth surface 14 of the ceramic body 10 and is electrically connected to the exposed ends of the plurality of second inner electrodes 160. In another embodiment, the first connection portion 21 and the second connection portion 31 may respectively cover a part of the third surface 13 and a part of the fourth surface 14.

[0070] The first band portion 23 extends from the first connection portion 21 and covers at least a portion of the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10, and the second band portion 33 extends from the second connection portion 31 and covers at least a portion of the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10. The first band portion 23 can make the first external electrode 20 adhere to the ceramic body 10 more firmly, and the second band portion 33 can make the second external electrode 30 adhere to the ceramic body 10 more firmly.

[0071] The first band portion 23 may extend from the first connection portion 21 and cover at least a portion of each of the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10. The second band portion 33 may extend from the second connection portion 31 and cover at least a portion of each of the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10.

[0072] The first corner portion 25 may be a portion connecting the first connection portion 21 and the first belt portion 23 , and the second corner portion 35 may be a portion connecting the second connection portion 31 and the second belt portion 33 .

[0073] Based on an optical microscope or SEM photograph of a length direction (L axis direction)-thickness direction (T axis direction) cross section at a center portion in the width direction (W axis direction) of the multilayer ceramic capacitor 1000, in the multilayer ceramic capacitor 1000 shown in the above cross-sectional photograph, the first connection portion 21 and the second connection portion 31 may have a shape substantially parallel to the thickness direction (T axis direction), the first band portion 23 and the second band portion 33 may have a shape substantially parallel to the length direction (L axis direction), and the first corner portion 25 and the second corner portion 35 may have a curved shape. The above curved shape may be a curved shape having a tangent line whose direction changes from a direction parallel to the thickness direction (T axis direction) to a direction parallel to the length direction (L axis direction) (or from a direction parallel to the length direction (L axis direction) to a direction parallel to the thickness direction (T axis direction)).

[0074] The external electrodes 20 and 30 may include connecting electrodes 230 and 330 and plated electrodes 250 and 350. The corresponding parts of the first connecting electrode 230 and the first plated electrode 250 may respectively constitute the first connecting portion 21, the first band portion 23 and the first corner portion 25, and the corresponding parts of the second connecting electrode 330 and the second plated electrode 350 may respectively constitute the second connecting portion 31, the second band portion 33 and the second corner portion 35.

[0075] The first external electrode 20 may include a first connection electrode 230 and a first plated electrode 250 , and the second external electrode 30 may include a second connection electrode 330 and a second plated electrode 350 .

[0076] The connection electrodes 230 and 330 may include copper (Cu). In addition, the connection electrodes 230 and 330 include copper (Cu) as a main component and may include one or more materials of nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof.

[0077] The connection electrodes 230 and 330 may include protective particles 235 and 335. The protective particles 235 and 335 may include a glass component having a mixed composition of oxides, and the protective particles 235 and 335 may include a combination of one or more components selected from the group consisting of boron oxide, aluminum oxide, transition metal oxides, alkali metal oxides, and alkaline earth metal oxides and silicon oxide. For example, the protective particles 235 and 335 may include, but are not limited to, a combination of one or more components of barium oxide (BaO), calcium oxide (CaO), zinc oxide (ZnO), aluminum oxide (Al2O3), boron oxide (B2O3), sodium oxide (Na2O), and copper (II) oxide (CuO) and silicon dioxide (SiO2).

[0078] In addition, the protective particles 235 and 335 may include more than 10 mol % of sodium oxide (Na 2 O) and more than 4 mol % of copper (II) oxide (CuO), but are not limited thereto.

[0079] The protective particles 235 and 335 may be particles of a glass material, and may be particles of the same material as the protective layers 210 and 310 which will be described later.

[0080] For example, a method of forming the connection electrodes 230 and 330 may include dipping the ceramic body 10 in a conductive paste including a conductive metal and glass, printing the conductive paste on the surface of the ceramic body 10 using a screen printing method or a gravure printing method, or coating the conductive paste on the surface of the ceramic body 10.

[0081] The connection electrodes 230 and 330 may include a first connection electrode 230 disposed on the third surface 13 of the ceramic body 10 and a second connection electrode 330 disposed on the fourth surface 14 of the ceramic body 10. The first connection electrode 230 may include a portion belonging to the first connection portion 21 and other portions belonging to the first corner portion 25 and the first band portion 23. The second connection electrode 330 may include a portion belonging to the second connection portion 31 and other portions belonging to the second corner portion 35 and the second band portion 33.

[0082] The plated electrodes 250 and 350 may include nickel (Ni) as a main component, and may include nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti) or lead (Pb) alone or an alloy thereof, but the present embodiment is not limited thereto. For example, the plated electrodes 250 and 350 may be formed by sputtering or electrolytic plating (electrodeposition).

[0083] The plated electrodes 250 and 350 may include a first plated electrode 250 at least partially covering the first connection electrode 230 and a second plated electrode 350 at least partially covering the second connection electrode 330. The first plated electrode 250 may include a portion belonging to the first connection portion 21 and other portions belonging to the first corner portion 25 and the first band portion 23. The second plated electrode 350 may include a portion belonging to the second connection portion 31 and other portions belonging to the second corner portion 35 and the second band portion 33.

[0084] Figure 4 yes Figure 2 is an enlarged partial cross-sectional view of a portion A of Figure 5 yes Figure 2 An enlarged partial cross-sectional view of portion B.

[0085] Reference Figure 4 and Figure 5 , the protective layers 210 and 310 may be disposed on the third surface 13 and the fourth surface 14 of the ceramic body 10, respectively. The protective layers 210 and 310 may be at least partially covered by the connection electrodes 230 and 330. The protective layers 210 and 310 may include a first protective layer 210 disposed on the third surface 13 of the ceramic body 10 and a second protective layer 310 disposed on the fourth surface 14 of the ceramic body 10.

[0086] The first protective layer 210 may include a portion extending from the third surface 13 of the ceramic body 10 to the first surface 11 and the second surface 12. In addition, the first protective layer 210 may include a portion extending from the third surface 13 of the ceramic body 10 to the fifth surface 15 and the sixth surface 16. The first protective layer 210 may be at least partially covered by the first connection electrode 230. The first protective layer 210 may have a portion located between the ceramic body 10 and the first connection electrode 230, and may contact the ceramic body 10. The first protective layer 210 may be used to combine the ceramic body 10 and the first connection electrode 230.

[0087] The first opening 217 may be formed on the third surface 13 of the ceramic body 10. The first opening 217 is a portion where the first protective layer 210 is not disposed on the third surface 13 of the ceramic body 10. That is, the first protective layer 210 may be disposed on a portion of the third surface 13 of the ceramic body 10. The first opening 217 may overlap the first internal electrode 150 exposed through the third surface 13 of the ceramic body 10, and the first connection electrode 230 may contact the first internal electrode 150 through the first opening 217.

[0088] The first protective layer 210 may include a first lower continuous region 211 , a first upper continuous region 213 , and a first discontinuous region 215 .

[0089] The first lower continuous region 211 is a portion in which the first protective layer 210 extends from the first surface 11 of the ceramic body 10 to a portion of the third surface 13 of the ceramic body 10. One end of the first lower continuous region 211 may be located on the first surface 11 of the ceramic body 10, and the other end of the first lower continuous region 211 may be located on the third surface 13 of the ceramic body 10. The other end of the first lower continuous region 211 located on the third surface 13 of the ceramic body 10 may be located on one side of the first opening 217, and the first opening 217 may be the first opening 217 closest to the first surface 11 of the ceramic body 10. The first lower continuous region 211 may extend continuously from one end on the first surface 11 of the ceramic body 10 to the other end without interruption, the one end being on the first surface 11 of the ceramic body 10 and the other end being on the third surface 13 of the ceramic body 10, that is, no opening is formed in the first lower continuous region 211.

[0090] The first upper continuous region 213 is a portion in which the first protective layer 210 extends from the second surface 12 of the ceramic body 10 to a portion of the third surface 13 of the ceramic body 10. One end of the first upper continuous region 213 may be located on the second surface 12 of the ceramic body 10, and the other end of the first upper continuous region 213 may be located on the third surface 13 of the ceramic body 10. The other end of the first upper continuous region 213 located on the third surface 13 of the ceramic body 10 may be located on one side of the first opening 217, and the first opening 217 may be the first opening 217 closest to the second surface 12 of the ceramic body 10. The first upper continuous region 213 may extend continuously from one end on the second surface 12 of the ceramic body 10 to the other end without interruption, the one end being on the second surface 12 of the ceramic body 10 and the other end being on the third surface 13 of the ceramic body 10, that is, no opening is formed in the first upper continuous region 213.

[0091] The first discontinuous region 215 is a region located between the first lower continuous region 211 and the first upper continuous region 213. That is, the first discontinuous region 215 may be located between the first opening 217 closest to the first surface 11 of the ceramic body 10 and the first opening 217 closest to the second surface 12 of the ceramic body 10. The first opening 217 may be formed in the first discontinuous region 215.

[0092] The first protective layer 210 may protrude further than the first connection electrode 230 on the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10 in a direction toward the fourth surface 14 of the ceramic body 10. In addition, the first protective layer 210 may protrude further than the first plated electrode 250 on the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10 in a direction toward the fourth surface 14 of the ceramic body 10.

[0093] The second protective layer 310 may include a portion extending from the fourth surface 14 of the ceramic body 10 to the first surface 11 and the second surface 12. In addition, the second protective layer 310 may include a portion extending from the fourth surface 14 of the ceramic body 10 to the fifth surface 15 and the sixth surface 16. The second protective layer 310 may be at least partially covered by the second connection electrode 330. The second protective layer 310 may have a portion located between the ceramic body 10 and the second connection electrode 330, and may contact the ceramic body 10. The second protective layer 310 may be used to combine the ceramic body 10 and the second connection electrode 330.

[0094] The second opening 317 may be formed on the fourth surface 14 of the ceramic body 10. The second opening 317 is a portion where the second protective layer 310 is not disposed on the fourth surface 14 of the ceramic body 10. That is, the second protective layer 310 may be disposed on a portion of the fourth surface 14 of the ceramic body 10. The second opening 317 may overlap the second internal electrode 160 exposed through the fourth surface 14 of the ceramic body 10, and the second connection electrode 330 may contact the second internal electrode 160 through the second opening 317.

[0095] The second protective layer 310 may include a second lower continuous region 311 , a second upper continuous region 313 , and a second discontinuous region 315 .

[0096] The second lower continuous region 311 is a portion in which the second protective layer 310 extends from the first surface 11 of the ceramic body 10 to a portion of the fourth surface 14 of the ceramic body 10. One end of the second lower continuous region 311 may be located on the first surface 11 of the ceramic body 10, and the other end of the second lower continuous region 311 may be located on the fourth surface 14 of the ceramic body 10. The other end of the second lower continuous region 311 located on the fourth surface 14 of the ceramic body 10 may be located on one side of the second opening 317, and the second opening 317 may be the second opening 317 closest to the first surface 11 of the ceramic body 10. The second lower continuous region 311 may extend continuously from one end on the first surface 11 of the ceramic body 10 to the other end without interruption, the one end being on the first surface 11 of the ceramic body 10 and the other end being on the fourth surface 14 of the ceramic body 10, that is, no opening is formed in the second lower continuous region 311.

[0097] The second upper continuous region 313 is a portion in which the second protective layer 310 extends from the second surface 12 of the ceramic body 10 to a portion of the fourth surface 14 of the ceramic body 10. One end of the second upper continuous region 313 may be located on the second surface 12 of the ceramic body 10, and the other end of the second upper continuous region 313 may be located on the fourth surface 14 of the ceramic body 10. The other end of the second upper continuous region 313 located on the fourth surface 14 of the ceramic body 10 may be located on one side of the second opening 317, and the second opening 317 may be the second opening 317 closest to the second surface 12 of the ceramic body 10. The second upper continuous region 313 may extend continuously from one end on the second surface 12 of the ceramic body 10 to the other end without interruption, the one end being on the second surface 12 of the ceramic body 10 and the other end being on the fourth surface 14 of the ceramic body 10, that is, no opening is formed in the second upper continuous region 313.

[0098] The second discontinuous region 315 is a region located between the second lower continuous region 311 and the second upper continuous region 313. That is, the second discontinuous region 315 may be located between the second opening 317 closest to the first surface 11 of the ceramic body 10 and the second opening 317 closest to the second surface 12 of the ceramic body 10. The second opening 317 may be formed in the second discontinuous region 315.

[0099] The second protective layer 310 may protrude further than the second connection electrode 330 on the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10 in a direction toward the third surface 13 of the ceramic body 10. In addition, the second protective layer 310 may protrude further than the second plated electrode 350 on the first surface 11, the second surface 12, the fifth surface 15, and the sixth surface 16 of the ceramic body 10 in a direction toward the third surface 13 of the ceramic body 10.

[0100] For example, the average thickness of the protective layers 210 and 310 may be about 0.1 μm to 10 μm, but the embodiment is not limited thereto.

[0101] The protective layers 210 and 310 may include a glass component including a mixture of oxides, and the protective layers 210 and 310 may include a combination of one or more selected from the group consisting of boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, and alkaline earth metal oxide with silicon oxide. For example, the protective layers 210 and 310 may include, but are not limited to, a combination of one or more components of barium oxide (BaO), calcium oxide (CaO), zinc oxide (ZnO), aluminum oxide (Al2O3), boron oxide (B2O3), sodium oxide (Na2O), and copper (II) oxide (CuO) with silicon dioxide (SiO2). In addition, the protective layers 210 and 310 may include a combination of greater than 5 mol% of sodium oxide (Na2O) and / or greater than 2 mol% of copper (II) oxide (CuO) with silicon oxide, but are not limited thereto. For example, the protective layers 210 and 310 may include a combination of greater than 7.5 mol% of sodium oxide (Na2O) with silicon oxide. As another example, the protective layers 210 and 310 may include a combination of greater than 10 mol% of sodium oxide (Na2O) and silicon oxide. In addition, for example, the protective layers 210 and 310 may include a combination of greater than 3 mol% of copper (II) oxide (CuO) and silicon oxide. As another example, the protective layers 210 and 310 may include a combination of greater than 4 mol% of copper (II) oxide (CuO) and silicon oxide. When sodium oxide (Na2O) and / or copper (II) oxide (CuO) are included, the wettability of the protective layers 210 and 310 may be improved, thereby facilitating the formation of continuous protective layers 210 and 310 between the ceramic body 10 and the connecting electrodes 230 and 330.

[0102] Compared with the first and second connection parts 21 and 31 and the first and second band parts 23 and 33, stress may be more concentrated in the first and second corner parts 25 and 35. Therefore, when cracks occur in the first and second corner parts 25 and 35, the damaged or broken parts may become a path for moisture penetration. The protective layers 210 and 310 according to the embodiment enhance the adhesion between the ceramic body 10 and the connection electrodes 230 and 330, thereby reducing the risk of external electrode detachment that may easily occur at the first and second corner parts 25 and 35.

[0103] For example, the protective layers 210 and 310 may be formed by partially dipping a ceramic body in a conductive paste including small glass particles to coat the paste according to a dilution degree of the solution, heating and drying the paste at a temperature below 200° C., and sintering the paste.

[0104] The multilayer ceramic capacitor 1000 is classified based on its length and width. Therefore, even in a multilayer ceramic capacitor having the same length or width, the size of the ceramic body may vary according to the thickness of the external electrode. That is, a multilayer ceramic capacitor having a thinner external electrode may have a larger ceramic body than a multilayer ceramic capacitor having a thicker external electrode. A larger ceramic body means that the above-mentioned effective area is larger, which may further mean that the capacitance is larger. Ultimately, as the external electrodes of the multilayer ceramic capacitor become thinner, the capacitance may increase. However, if the thickness of the external electrode becomes thinner, moisture may easily penetrate into the ceramic body, which may reduce the moisture resistance reliability of the multilayer ceramic capacitor. In the present embodiment, by forming a protective layer between the ceramic body and the connecting electrode, moisture can be prevented from penetrating into the ceramic body even when the external electrode is formed very thin.

[0105] The protective layers 210 and 310 may have low conductivity. For example, the protective layers 210 and 310 may have a conductivity of less than 10 -7 The conductivity of S / cm can be measured by a conductivity sensor. Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art can be used. The protective layers 210 and 310 constructed as described above can prevent plating diffusion when forming the plated electrodes 250 and 350. That is, when the first protective layer 210 and the second protective layer 310 made of an insulating material protrude farther than the first connection electrode 230 and the second connection electrode 330, the protective layers 210 and 310 can prevent the plating components from diffusing on the protruding connection electrodes 230 and 330 during the formation of the plated electrodes 250 and 350. Therefore, it is possible to prevent the plated electrodes 250 and 350 from being formed in unexpected areas of the ceramic body 10 that exceed the protective layers 210 and 310.

[0106] In the following, reference will be made to Figure 6 A method of manufacturing a multilayer ceramic capacitor according to an embodiment is described.

[0107] Figure 6 2 is a diagram illustrating a method of manufacturing a multilayer ceramic capacitor according to an embodiment.

[0108] Reference Figure 6 In the method of manufacturing a multilayer ceramic capacitor according to an embodiment, a ceramic body is first formed (S100). In order to form the ceramic body 10, a plurality of dielectric green sheets are first prepared. After sintering, the dielectric green sheets may become the dielectric layers 140 of the ceramic body 10.

[0109] The dielectric green sheet can be manufactured by mixing ceramic powder, ceramic additives, organic solvents, plasticizers, binders, and dispersants to produce a paste, and manufacturing the paste into a sheet having a thickness of several micrometers by a method such as a doctor blade method or a screen printing method.

[0110] For example, the ceramic powder may include a dielectric ceramic, which includes components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. In addition, these components may also include sub-components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds. For example, it may include (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), where Ca, Zr, etc. are partially dissolved in the BaTiO3-based dielectric ceramic.

[0111] For example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), or aluminum (Al) can be used as ceramic additives.

[0112] A conductive paste layer is formed on the surface of the dielectric green sheet. After sintering, the conductive paste layer can become the first internal electrode 150 and the second internal electrode 160.

[0113] The conductive paste layer can be formed by coating a conductive paste including a conductive metal onto the surface of the dielectric green sheet using a method such as a doctor blade method or a screen printing method.

[0114] For example, the first conductive paste layer can be coated onto the surface of the first dielectric green sheet in a first pattern, and the second conductive paste layer can be coated onto the surface of the second dielectric green sheet in a second pattern. The first pattern and the second pattern can be aligned such that when the first dielectric green sheet and the second dielectric green sheet are alternately stacked, a part of the first conductive paste layer and a part of the second conductive paste layer are superimposed and the remaining parts are not superimposed.

[0115] A dielectric green sheet laminate is manufactured by stacking the first dielectric green sheet and the second dielectric green sheet. The first dielectric green sheet and the second dielectric green sheet are stacked such that a part of the first conductive paste layer and a part of the second conductive paste layer are superimposed, while at least a part of the first conductive paste layer and at least a part of the second conductive paste layer are not superimposed. Optionally, the dielectric green sheet laminate is pressed.

[0116] The dielectric green sheet laminate can be cut such that the first conductive paste layer and the second conductive paste layer are respectively exposed through two end surfaces. The end of each of the first internal electrode 150 and the second internal electrode 160 can be exposed to one of the two end surfaces of the dielectric green sheet laminate.

[0117] The ceramic body 10 is manufactured by sintering a dielectric green sheet laminate at a high temperature. After sintering, the dielectric green sheet forms the dielectric layer 140. The conductive paste layer formed on the surface of the dielectric green sheet forms the first internal electrode 150 and the second internal electrode 160 by sintering, and the first internal electrode 150 and the second internal electrode 160 may be alternately arranged with one dielectric layer 140 therebetween. The first internal electrode 150 and the second internal electrode 160 may be electrically insulated from each other by the dielectric layer 140.

[0118] A liquid conductive paste layer is formed on both end surfaces of the ceramic body 10 exposing the first internal electrode 150 and the second internal electrode 160 (S200). The liquid conductive paste layer may be formed by dipping the ceramic body 10 in a conductive paste including a conductive metal and a glass powder. As another example, the liquid conductive paste layer may be formed by printing the conductive paste on the surface of the ceramic body 10 using a screen printing method or a gravure printing method, or by applying the conductive paste to the surface of the ceramic body 10.

[0119] Next, the liquid conductive paste layer is dried ( S300 ). The liquid conductive paste layer may be dried at a temperature of 200° C. or less. After drying, the shape of the external electrode may be formed, and the external electrode may be temporarily fixed to the ceramic body 10 .

[0120] Next, by sintering the conductive paste layer (S400), a fixed external electrode may be formed, and the internal and external electrodes may be connected. Sintering the conductive paste layer may include debonding (S410), connecting the internal and external electrodes (S420), and forming a protective layer (S430).

[0121] The conductive paste layer may be debonded (S410). Debonding includes removing organic materials (such as a binder) in the conductive paste layer. Debonding may be performed at a temperature of 600° C. or less. Due to the debonding, an empty space may be formed inside the conductive paste layer.

[0122] Next, the inner electrode and the outer electrode may be connected (S420). In this step, in an environment of 500°C to 800°C, the adjacent metal powders may be necked and a molten metal may be formed. In this case, the molten metal may flow and fill the empty space formed by the above-mentioned debonding. In addition, the molten metal may flow to the interface of the ceramic body 10 to form a portion where the connection electrode of the outer electrode and the inner electrode are connected.

[0123] Next, a protective layer (S430) may be formed. In this step, in an environment of 550°C to 800°C, adjacent glass powders may be necked, and molten glass may be formed. In this case, when the molten glass flows, the molten glass may fill the empty space inside the external electrode and form a glass film on the surface of the ceramic body 10. The formed glass film may become protective layers 210 and 310. The glass powders may be continuously connected to each other to cover the surface of the ceramic body 10, and the first opening 217 and the second opening 317 may be formed in the portion where the connecting electrode of the external electrode and the internal electrode are connected. The first opening 217 and the second opening 317 are portions where the glass film is not formed, and the internal electrodes 150 and 160 may be connected to the connecting electrodes 230 and 330 through the first opening 217 and the second opening 317. When the molten metal and the molten glass fill the empty space formed due to debonding, the external electrode may become denser.

[0124] Hereinafter, an experimental example comparing the examples of the present disclosure with the comparative examples is provided. However, the examples and comparative examples described below are only intended to specifically illustrate or explain the present disclosure and should not limit the scope of the present disclosure.

[0125] [Comparative Examples, Examples, and Measurement Methods]

[0126] (Example)

[0127] A plurality of sintered ceramic bodies with a size of 1005 were prepared, and a liquid conductive paste layer including a conductive metal and glass powder was formed on both ends of the exposed internal electrodes of the laminate. The conductive paste layer was dried and sintered to form an external electrode including a glass film and a connecting electrode. Then, a plated electrode was formed on the sintered external electrode.

[0128] (Comparative Example)

[0129] A plurality of sintered ceramic bodies with a size of 1005 are prepared, and a liquid conductive paste layer including a conductive metal is formed on both ends of the exposed internal electrodes of the laminate. The conductive paste layer is dried and sintered to form an external electrode. Then, a plated electrode is formed on the sintered external electrode.

[0130] (Measurement method)

[0131] The formation of a glass film can be determined by a contrast difference in an image of a multilayer ceramic capacitor taken with an SEM, or by checking whether a component of glass (such as Si) is detected using an energy dispersive X-ray spectrometer (EDX) or an electron probe microanalyzer (EPMA).

[0132] [Experimental example: Performance of multilayer ceramic capacitors]

[0133] The multilayer ceramic capacitors manufactured in the examples and comparative examples were measured for external electrode blistering defects, plating diffusion defects, and moisture resistance degradation.

[0134] 1) Measurement of external electrode blistering

[0135] 100 multilayer ceramic capacitors of each of the example and the comparative example were prepared. In order to examine the effect of the multilayer ceramic capacitor of the embodiment, the external electrodes of the comparative example and the example were sintered in a strong reducing atmosphere. Then, the plated electrodes were formed on the sintered external electrodes.

[0136] (Table 1)

[0137] Results of external electrode blistering measurements

[0138]

[0139] As shown in Table 1, in the comparative example, the defect of blistering of the external electrode occurred in 15 samples out of 100 samples, while such defect did not occur in the sample of the example. This is because the glass film acts as an adhesive between the ceramic body and the connection electrode, thereby more firmly fixing the connection electrode.

[0140] 2) Plating diffusion defects

[0141] 100 multilayer ceramic capacitors of each of the example and the comparative example were prepared. In the example, the external electrodes were formed so that the glass film protruded farther toward the center of the ceramic body than the connection electrode. Then, the plated electrodes were formed on the sintered external electrodes.

[0142] (Table 2)

[0143] Results of the Plating Diffusion Measurements

[0144] Comparative Example Example Sample quantity 100 100 Number of samples plated for diffusion 14 0

[0145] As shown in Table 2, in the comparative examples, a defect in which the plating diffused to the surface of the ceramic body where the external electrode was not formed was observed in 14 samples among 100 samples.

[0146] In the example, this plating diffusion defect does not occur because the glass film prevents the plated electrode from diffusing beyond the glass film.

[0147] 3) Measurement of moisture resistance degradation

[0148] Multilayer ceramic capacitors of 20 channels each of the examples and comparative examples were prepared. One channel consisted of 20 multilayer ceramic capacitors connected in series.

[0149] For each of the 20-channel multilayer ceramic capacitors of the example and comparative example prepared in this manner, a voltage of 1.5 V was applied to each channel for 12 hours under an environment of 85° C. and 85% RH.

[0150] (Table 3)

[0151] Results of humidity resistance degradation measurement

[0152]

[0153] As shown in Table 3, moisture resistance degradation occurred in 3 channels among the 20-channel sample, whereas moisture resistance degradation did not occur in the example sample. This is because the glass film formed on the surface of the ceramic body inhibits moisture from penetrating into the ceramic body.

[0154] While the disclosure has been described in connection with what are presently considered to be practical embodiments, it should be understood that the disclosure is not limited to the disclosed embodiments, but on the contrary, the disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A multilayer ceramic capacitor comprising: A ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; An inner electrode, disposed inside the ceramic body; a protective layer disposed on the third surface and the fourth surface of the ceramic body; and Connecting electrodes, covering the protective layer, The protective layer includes a first protective layer disposed on the third surface and a second protective layer disposed on the fourth surface, and one or more openings are formed at portions of the third surface and the fourth surface where the protective layer is not disposed.

2. The multilayer ceramic capacitor according to claim 1, wherein: The first protective layer includes a first portion extending from the third surface to the first surface and a second portion extending from the third surface to the second surface, and the second protective layer includes a first portion extending from the fourth surface to the first surface and a second portion extending from the fourth surface to the second surface.

3. The multilayer ceramic capacitor of claim 1, wherein: The inner electrode is connected to the connecting electrode through the one or more openings.

4. The multilayer ceramic capacitor of claim 1, wherein: The protective layer includes silicon oxide.

5. The multilayer ceramic capacitor of claim 1, wherein: The protective layer has less than 10 -7 The conductivity is S / cm.

6. The multilayer ceramic capacitor of claim 4, wherein: The protective layer also includes sodium oxide.

7. The multilayer ceramic capacitor of claim 4, wherein: The protective layer also includes CuO.

8. The multilayer ceramic capacitor of claim 4, wherein: The connection electrode includes particles of the same material as that of the protection layer.

9. The multilayer ceramic capacitor of claim 2, wherein: The connecting electrode includes a first connecting electrode at least partially covering the first protective layer and a second connecting electrode at least partially covering the second protective layer. The first protective layer has a portion on the first surface and the second surface of the ceramic body that protrudes farther than the first connection electrode in a direction toward the fourth surface, and The second protection layer has a portion protruding further than the second connection electrode in a direction toward the third surface on the first surface and the second surface of the ceramic body.

10. The multilayer ceramic capacitor of claim 9, further comprising: a first plated electrode and a second plated electrode, wherein the first plated electrode at least partially covers the first connecting electrode, and the second plated electrode at least partially covers the second connecting electrode, wherein the first protective layer has a portion on the first surface and the second surface of the ceramic body that protrudes further than the first plated electrode in a direction toward the fourth surface, and The second protective layer has a portion protruding further than the second plated electrode in a direction toward the third surface on the first surface and the second surface of the ceramic body.

11. The multilayer ceramic capacitor of claim 1, wherein: The first protective layer and the second protective layer have portions in contact with the ceramic body.

12. The multilayer ceramic capacitor of claim 2, wherein: The first portion and the second portion of the first protective layer each extend continuously without an opening, and the first portion and the second portion of the second protective layer each extend continuously without an opening.

13. The multilayer ceramic capacitor of claim 10, wherein: The protective layer includes glass containing sodium, copper and silicon.

14. A multilayer ceramic capacitor comprising: A ceramic body including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface; An inner electrode, disposed inside the ceramic body; a protective layer disposed on a portion of the third surface and a portion of the fourth surface of the ceramic body; as well as Connecting electrodes, covering the protective layer, The connection electrode includes a portion contacting the internal electrode through portions of the third surface and the fourth surface of the ceramic body where the protection layer is not provided.

15. The multilayer ceramic capacitor of claim 14, wherein: The protective layer includes a portion extending from the third surface or the fourth surface onto the first surface and the second surface.

16. The multilayer ceramic capacitor of claim 15, wherein: The openings are provided at portions of the third surface and the fourth surface of the ceramic body where the protective layer is not provided, The protective layer has a portion that continuously extends from one end of the protective layer located on the first surface or the second surface to the other end of the protective layer located on one side of the opening.

17. The multilayer ceramic capacitor of claim 15, wherein: The protective layer includes a first protective layer extending along the first surface, the third surface, and the second surface, and a second protective layer extending along the first surface, the fourth surface, and the second surface. The connecting electrode includes a first connecting electrode covering the first protective layer and a second connecting electrode covering the second protective layer. The first protective layer has a portion on the first surface and the second surface that protrudes further than the first connecting electrode in a direction toward the fourth surface, The second protection layer has a portion protruding further than the second connection electrode in a direction toward the third surface on the first surface and the second surface.

18. The multilayer ceramic capacitor of claim 17, further comprising: a first plated electrode and a second plated electrode, wherein the first plated electrode covers the first connecting electrode, and the second plated electrode covers the second connecting electrode, wherein the first protective layer has a portion on the first surface and the second surface that protrudes further than the first plated electrode in a direction toward the fourth surface, The second protective layer has a portion that protrudes farther than the second plated electrode in a direction toward the third surface on the first surface and the second surface.

19. The multilayer ceramic capacitor of claim 15, wherein: The portion of the protective layer continuously extends from the third surface or the fourth surface to the first surface and the second surface without an opening.

20. The multilayer ceramic capacitor of claim 18, wherein: The protective layer includes glass containing sodium, copper and silicon.

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