Ceramic packaging method for LDS (Laser Direct Structuring) process

Abstract

The invention discloses an LDS (laser direct structuring) process ceramic packaging method, which is characterized in that an embedded circuit of a ceramic substrate is externally arranged, lead intercommunication is performed through a cavity wall space, and the technological process sequentially comprises the following steps of: performing dry pressing molding on a ceramic carrier or stacking and sintering green ceramic chips, and performing laser engraving on a required pattern on a ceramic surface through laser by using an LDS laser direct structuring technology, and plating a nickel-gold layer through chemical plating and electroplating processes. According to the invention, the LDS laser direct structuring technology is applied to ceramic, so that the manufacturing process of ceramic packaging is simplified, and the cost of ceramic packaging is greatly reduced.

Description

Technical Field

[0001] The present application belongs to the field of ceramic packaging, and in particular, relates to a LDS process ceramic packaging method. Background Art

[0002] LDS-Laser Direct Structuring technology refers to the technology of using CNC laser to directly transfer the circuit diagram to the surface of the molded plastic original part, and using the three-dimensional surface of the three-dimensional workpiece to form a circuit interconnection structure. LDS material is generally a modified plastic containing an organic metal complex. After laser irradiation, the organic metal complex releases metal ions, and then the metal layer is plated. The process route is relatively simple. The traditional ceramic packaging process is complicated and cumbersome, requiring drilling holes, filling holes (hanging holes), printing circuits, lamination, isostatic pressing, hot cutting, sintering, etc. on the raw porcelain, which requires more equipment and manpower. In addition, the interconnection circuits are mostly printed. For dense integrated circuits, screen printing has certain limitations, and the material and processing costs are expensive. Summary of the invention

[0003] The purpose of the present invention is to provide a LDS process ceramic packaging method, which applies LDS laser direct forming technology to ceramics, simplifies the process of ceramic packaging, and greatly reduces the cost of ceramic packaging.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] The embodiment of the present application discloses an LDS process ceramic packaging method, in which the embedded circuit of the ceramic substrate is externalized and the leads are interconnected through the cavity wall space. The process flow includes: dry pressing the ceramic carrier into shape or stacking and sintering the raw ceramic sheets, and then using LDS laser direct forming technology to laser engrave the required pattern on the ceramic surface, and then plating the nickel-gold layer through chemical plating and electroplating processes.

[0006] Compared with the prior art, the advantage of the present invention is that the LDS laser direct forming technology is applied to ceramic packaging products, shortening the process flow, reducing equipment use and labor, and greatly reducing product development cycle and production costs. In addition, half of the traditional ceramic packaging uses screen printing, and the high-precision screen is expensive and has a short service life, and the accuracy is generally ±10um, and the narrower the line, the more serious the edge jagged. By using LDS laser laser engraving technology, the accuracy of the line and the consistency of edge quality are guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0008] Figure 1 Shown is a stereogram of a LCC28 type ceramic package in a conventional embodiment;

[0009] Figure 2 Shown is a stereogram of a LCC28 type ceramic package in a conventional embodiment;

[0010] Figure 3 Shown is a side cross-sectional view of a LCC28 type ceramic package in a conventional embodiment;

[0011] Figure 4 Shown is a three-dimensional diagram of a LDS process ceramic package in a specific embodiment of the present invention;

[0012] Figure 5 Shown is a three-dimensional diagram of a LDS process ceramic package in a specific embodiment of the present invention;

[0013] Figure 6 Shown is a side view of an LDS process ceramic package in a specific embodiment of the present invention. DETAILED DESCRIPTION

[0014] The following will describe the technical solutions in the embodiments of the present invention in detail in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0015] Conventional LCC28 ceramic package adopts adhesive sealing cap, such as Figure 1-3 As shown, the dimensions are 11.43mm in length and width, and the core cavity size is 7.37mm. It is made of 3 layers of 0.5mm ceramic substrates stacked together. The bottom lead wire and the chip are used for gold wire bonding leads through semi-hole metallization. The process flow of this product is relatively complicated. First, the green ceramic sheet is prepared by tape casting, and then the upper and lower interconnection holes are punched on the green ceramic sheet by laser or punching machine, and then the interconnection hole wall is metallized with metal slurry, and the circuit is printed with metal slurry. Then the three layers of green ceramic sheets are stacked and pressed into a whole with isostatic pressing equipment; then cut into the required size, and fired into mature ceramics in a nitrogen and hydrogen atmosphere sintering furnace, and finally nickel and gold are plated on the metallization. The specific process is as follows: slurry preparation, tape casting, slicing, punching, hanging holes, printing, lamination, isostatic pressing, hot cutting, sintering, electroplating / chemical plating.

[0016] The introduction of LDS technology requires a change in design. The embedded circuit is placed outside and the leads are interconnected through the cavity wall space. The design is as follows Figure 4-6 As shown in the figure, the process is simplified compared to the traditional process. It only needs to dry press the ceramic carrier or drop and sinter the green ceramic sheet, and then use the LDS laser direct forming technology to laser engrave the required pattern on the ceramic surface, and then plate the nickel-gold layer through chemical plating and electroplating. The specific process is as follows: powder preparation, dry pressing, sintering, LDS laser engraving, chemical plating / electroplating.

[0017] The present invention applies LDS laser direct shaping technology to ceramic packaging products, shortens the process flow, reduces equipment use and labor, and greatly reduces product development cycle and production costs. Traditional ceramic packaging uses screen printing, and the price of high-precision screens is expensive and has a short service life. The accuracy is generally ±10um, and the narrower the line, the more serious the edge jaggedness. By using LDS laser laser engraving technology, the accuracy of the line and the consistency of edge quality are guaranteed.

[0018] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0019] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A LDS process ceramic packaging method, characterized in that: The embedded circuits of the ceramic substrate are placed externally, and the leads are interconnected through the cavity wall space. The process flow includes: dry pressing the ceramic carrier into shape or stacking and sintering the raw ceramic sheets, and then using LDS laser direct forming technology to laser engrave the required pattern on the ceramic surface, and then plating the nickel-gold layer through chemical plating and electroplating processes.

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