Semiconductor separation device and semiconductor separation method

Abstract

The invention provides a semiconductor separation device and a semiconductor separation method. The semiconductor separation apparatus includes: a pickup device for picking up a target element attached to a transport film; the jacking device is used for jacking the target element from the conveying film; in the jacking process, the magnetic mechanism is in an activated state, one of the picking device and the jacking device moves, and the other one of the picking device and the jacking device synchronously follows and moves through magnetic force generated by the magnetic mechanism in the activated state, so that the target element is jacked up from the conveying film till the target element reaches the separation height; in the separation process, the magnetic mechanism is in a non-activated state, the jacking device and the picking device stop moving synchronously, and the picking device adsorbs the target element to be separated from the conveying film. According to the invention, the separation effect of the semiconductor from the transmission film can be improved, and the bonding efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a semiconductor separation device and a semiconductor separation method. Background Art

[0002] During the chip manufacturing process, the chip is usually attached to a transfer film. When bonding the chip to a wafer (or another chip), the chip needs to be separated from the transfer film. In the related art, a ejector pin and a pickup head are usually used to cooperate with each other to separate the chip from the transfer film. However, it is difficult for the ejector pin and the pickup head to maintain a high degree of coordination, so that the chip is easily broken or the chip is not fully separated from the transfer film during the process of peeling off the transfer film, and the separation effect is poor, which affects the bonding efficiency. Summary of the invention

[0003] The present application provides a semiconductor separation device and a semiconductor separation method, which can alleviate the problem of chips being easily broken or insufficiently separated during separation from a transmission film in the related art, improve the separation effect, and thus improve the bonding efficiency.

[0004] In order to solve the above technical problems, the first aspect of the present application provides a semiconductor separation device, comprising a pick-up device, located on one side of a transmission film, for picking up a target element attached to the transmission film; a lifting device, located on the side of the transmission film away from the pick-up device, for lifting the target element from the transmission film; and a magnetic mechanism, including a first magnetic structure provided on the pick-up device and a second magnetic structure provided on the lifting device and corresponding to the first magnetic structure, the first magnetic structure and the second magnetic structure cooperating to switch the magnetic mechanism between an activated state and an inactivated state; during the lifting process, the magnetic mechanism is in the activated state, one of the pick-up device and the lifting device moves, and the other uses the magnetic force generated by the magnetic mechanism in the activated state to perform synchronous follow-up movement to lift the target element from the transmission film until the target element reaches the separation height; and during the separation process, the magnetic mechanism is in the inactivated state, the lifting device and the pick-up device stop synchronously moving, and the pick-up device adsorbs the target element and separates it from the transmission film.

[0005] In some embodiments, the magnetic force generated by the magnetic mechanism in an activated state is a magnetic attraction force. During the lifting process, the pickup device adsorbs the target element and moves, and the lifting device follows the pickup device based on the magnetic attraction force to perform synchronous following movement to lift the target element from the transmission film; during the separation process, the magnetic attraction force between the pickup device and the lifting device disappears, the lifting device stops moving, and the pickup device adsorbs the target element and moves further to separate the target element from the transmission film; or the magnetic force generated by the magnetic mechanism in an activated state is a magnetic repulsion force. During the lifting process, the lifting device moves to lift the target element from the transmission film, and the pickup device performs synchronous following movement based on the magnetic repulsion force while maintaining adsorption with the target element; during the separation process, the magnetic repulsion force between the pickup device and the lifting device disappears, the lifting device stops moving, and the pickup device adsorbs the target element and moves further to separate the target element from the transmission film.

[0006] In some embodiments, one of the first magnetic structure and the second magnetic mechanism is a magnetic excitation element; the other of the first magnetic structure and the second magnetic structure is a magnetic excitation element or a magnetic member.

[0007] In some embodiments, the pickup device includes: a pickup head, used to absorb the target element, the first magnetic structure is arranged on the pickup head; and a pickup head power element, connected to the pickup head, used to drive the pickup head to move the target element.

[0008] In some embodiments, the pickup head power element applies a buffering force to the pickup head when the pickup head moves; the magnetic force generated by the magnetic mechanism in an activated state is a magnetic repulsion force, and during the lifting process, the lifting device moves, and the pickup head follows the movement under the action of the magnetic repulsion force, and the magnitude of the magnetic repulsion force is greater than or equal to the sum of the buffering force applied by the pickup head power element to the pickup head, the gravity of the pickup head, and the gravity of the target element.

[0009] In some embodiments, the lifting device includes: a base having a receiving cavity formed thereon; an ejector pin assembly located in the receiving cavity, wherein the second magnetic structure is disposed on the ejector pin assembly and moves synchronously with the ejector pin assembly; and an ejector pin power element connected to the ejector pin assembly and used to drive the ejector pin assembly to be ejected from the receiving cavity.

[0010] In some embodiments, a plurality of adsorption holes are formed on the base, and when the target element is lifted up, the base adsorbs a portion of the transmission film around the target element through the adsorption holes.

[0011] In some embodiments, the ejector pin assembly includes a central ejector pin and at least one peripheral ejector pin, the at least one peripheral ejector pin is arranged around the central ejector pin, and the second magnetic structure is arranged on the central ejector pin. When the pickup device drives the target element to move in a direction away from the transmission film, in a direction from the edge of the base to the middle of the base, after each of the peripheral ejector pins moves in sequence to be restricted in the accommodating cavity, the central ejector pin continues to move until its displacement is limited by the accommodating cavity or the peripheral ejector pins.

[0012] In some embodiments, the central ejector and the peripheral ejector both include a pushing portion and a limiting portion, the pushing portion is provided on a side adjacent to the transmission film and connected to the limiting portion, the accommodating cavity allows the pushing portion to pass through and the limiting portion is limited within the accommodating cavity; the central ejector drives each of the peripheral ejectors to move synchronously, so that the limiting portions of the peripheral ejectors are successively limited in displacement by the accommodating cavity, and then the central ejector continues to move until the limiting portion of the central ejector is limited in displacement by the accommodating cavity or the peripheral ejector.

[0013] In some embodiments, in the projection perpendicular to the moving direction of the lifting device, the cross-sectional width of the limiting portion of the central ejector is greater than the cross-sectional width of the limiting portion of each peripheral ejector, and the cross-sectional width of the limiting portion of each peripheral ejector gradually increases in the direction from the edge of the base to the middle of the base.

[0014] In some embodiments, an elastic buffer is provided between two adjacent peripheral ejector pins and / or between the central ejector pin and a peripheral ejector pin adjacent to the central ejector pin.

[0015] In order to solve the above technical problems, the second aspect of the present application also provides a semiconductor separation method, which includes: providing a picking device, a lifting device and a magnetic mechanism, wherein the picking device is located on one side of the transmission film, and the lifting device is located on the side of the transmission film away from the picking device, and the target element is attached to the side of the transmission film facing the picking device; the magnetic mechanism includes a first magnetic structure provided on the picking device and a second magnetic structure provided on the lifting device and corresponding to the first magnetic structure, and the first magnetic structure cooperates with the second magnetic structure to switch the magnetic mechanism between an activated state and an inactivated state; controlling the magnetic mechanism to be in an activated state, moving one of the picking device and the lifting device, and the other of the picking device and the lifting device using the magnetic force generated by the magnetic mechanism in the activated state to perform synchronous follow-up movement to lift the target element from the transmission film until the target element reaches the separation height; and attaching and controlling the magnetic mechanism to be in an inactivated state, the lifting device and the picking device stop synchronous movement, and the picking device adsorbs the target element and separates it from the transmission film.

[0016] In some embodiments, the magnetic force generated by the magnetic mechanism in the activated state is a magnetic attraction force. During the lifting process, the pickup device adsorbs the target element and moves, and the lifting device follows the pickup device based on the magnetic attraction force to perform synchronous following movement to lift the target element from the transmission film; during the separation process, the magnetic attraction force between the pickup device and the lifting device disappears, the lifting device stops moving, and the pickup device adsorbs the target element and moves further to separate the target element from the transmission film; or the magnetic force generated by the magnetic mechanism in the activated state is a magnetic repulsion force. During the lifting process, the lifting device moves to lift the target element from the transmission film, and the pickup device performs synchronous following movement based on the magnetic repulsion force while maintaining adsorption with the target element; during the separation process, the magnetic repulsion force between the pickup device and the lifting device disappears, the lifting device stops moving, and the pickup device adsorbs the target element and moves further to separate the target element from the transmission film.

[0017] In some embodiments of the present application, a magnetic mechanism is provided correspondingly to the pickup device and the lifting device, and the magnetic mechanism switches between an activated state and an inactivated state. During the lifting process, the magnetic mechanism is in an activated state, and only one of the pickup device and the lifting device moves, while the other uses the magnetic force generated by the activated magnetic mechanism to perform synchronous follow-up movement. Compared with the related art, the problem caused by the asynchronous movement of the pickup device and the lifting device can be avoided, the coordination degree of the pickup device and the lifting device is required to be lower, and the stability of the target element during the picking process is improved, so that the target element can be stably picked up at the separation height without introducing additional pressure, thereby reducing the risk of target element breakage and improving the full separation of the target element and the transmission film, thereby improving the bonding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and are used together with the specification to illustrate the technical solution of the present application.

[0019] Figure 1 A schematic diagram of a partial structural decomposition of a semiconductor separation device provided in one embodiment of the present application;

[0020] Figure 2 This is a schematic diagram of a state in which a target element according to an embodiment of the present application moves to a separation height;

[0021] Figure 3 A schematic diagram of a projection of an ejector pin assembly on a target component according to an embodiment of the present application;

[0022] Figure 4 This is a partial structural schematic diagram of a jacking device according to an embodiment of the present application;

[0023] Figure 5 A schematic diagram of a magnetic mechanism of a semiconductor separation device provided in yet another embodiment of the present application;

[0024] Figure 6 A schematic diagram of a magnetic mechanism of a semiconductor separation device provided in yet another embodiment of the present application;

[0025] Figure 7 This is a schematic diagram of a state in which a target element according to an embodiment of the present application moves to a first set height;

[0026] Figure 8 This is a schematic diagram of a state in which a target element moves to a second set height according to an embodiment of the present application;

[0027] Fig. 9 A flow chart of a separation method provided in one embodiment of the present application. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] The terms "first" and "second" in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] All directional indications in the embodiments of the present application (such as up, down, left, right, front, back, top, bottom...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] In the design of semiconductor bonding machines, the ejector pins and the pickup head are usually used to cooperate with each other to lift the chip to the separation height and then separate it from the transfer film. In order to ensure that the chip picking process does not cause additional deformation to the chip, the ejector pins and the pickup head need to be lifted synchronously to ensure the smoothness of the chip picking process. Since the ejector pins and the pickup head are two different independent structures, the movement of the two is controlled by two motors respectively, which makes it difficult to ensure the synchronization of the two. If the pickup head moves too fast relative to the ejector pin, the pickup head will pick up the chip in advance before reaching the separation height, and the chip and the transfer film are not fully separated; if the pickup head moves too slowly relative to the ejector pin, the pickup head will apply additional pressure to the chip, resulting in an increase in the anchoring effect of the chip and the transfer film; thereby, the adhesion between the chip and the transfer film becomes larger, the separation effect is poor, and the bonding efficiency is affected.

[0034] In order to solve the above technical problems, some embodiments of the present application provide a semiconductor separation device, which is applied to a bonding system. The present application is described in detail below in conjunction with the accompanying drawings and embodiments.

[0035] Figure 1 A schematic diagram of a partial structural decomposition of a semiconductor separation device provided in one embodiment of the present application; Figure 2 FIG. 1 is a schematic diagram of a state in which a target element moves to a separation height according to an embodiment of the present application. Figure 1-2 , a semiconductor separation device 600 in an embodiment of the present invention comprises a pick-up device 100 and a lifting device 200. The pick-up device 100 and the lifting device 200 are respectively located on both sides of a transmission film 400. The transmission film 400 has a side facing the pick-up device 100 and a side facing away from the pick-up device 100. A target element 300 is attached to the side of the transmission film 400 facing the pick-up device 100, and at least two target elements 300 can be attached to the transmission film 400. The pick-up device 100 is located on one side of the transmission film 400 and faces the target element 300, and is used to pick up the target element 300 attached to the transmission film 400 and separate the target element 300 from the transmission film 400. The lifting device 200 is located on the side of the transmission film 400 facing away from the pick-up device 100, and is used to lift the target element 300 from the transmission film 400. The target element 300 can be a chip or wafer to be picked up, or a substrate made of other materials. The transmission film 400 may be a single-sided or double-sided adhesive film, such as a die attach film (DAF); the transmission film 400 may also be a non-adhesive film.

[0036] See also Figure 1-2, the pickup device 100 and the lifting device 200 are provided with corresponding magnetic mechanisms 500. Among them, the magnetic mechanism 500 generally includes a first magnetic structure 510 provided on the pickup device 100 and a second magnetic structure 520 provided on the lifting device 200 and corresponding to the first magnetic structure 510. The first magnetic structure 510 cooperates with the second magnetic structure 520 to switch the magnetic mechanism 500 between an activated state and an inactivated state. During the lifting process of the target element 300, the magnetic mechanism 500 is controlled to be in an activated state. At this time, there is magnetic force between the pickup device 100 and the lifting device 200. When one of the pickup device 100 and the lifting device 200 moves, the other uses the magnetic force generated by the magnetic mechanism 500 in the activated state to perform synchronous follow-up movement, so as to lift the target element 300 from the transmission film 400 until the target element 300 reaches the separation height H0. When the target element 300 reaches the separation height H0, the separation process is carried out, and the magnetic mechanism is controlled to be in an inactive state. At this time, the magnetic force between the picking device 100 and the lifting device 200 is eliminated, thereby causing the lifting device 200 and the picking device 100 to stop moving synchronously, and the picking device 100 adsorbs the target element 300 to separate the target element 300 from the transmission film 400.

[0037] In one embodiment of the present application, a magnetic mechanism 500 (including a first magnetic structure 510 and a second magnetic structure 520) is provided in correspondence between the pickup device 100 and the lifting device 200, and the magnetic mechanism 500 switches between an activated state and an inactivated state; during the lifting process, the magnetic mechanism 500 is in an activated state, and only one of the pickup device 100 and the lifting device 200 moves, while the other performs synchronous following movement using the magnetic force generated by the magnetic mechanism in the activated state. Compared with the related art, the problem caused by the asynchronous movement of the pickup device 100 and the lifting device 200 can be avoided, the matching degree of the pickup device 100 and the lifting device 200 is required to be relatively low, and the stability of the target element 300 during the picking process is improved, so that the target element 300 can be stably picked up at the separation height without introducing additional pressure, thereby reducing the risk of the target element 300 being broken and improving the sufficient separation of the target element 300 and the transmission film 400, thereby improving the bonding efficiency.

[0038] See also Figure 1, the pickup device 100 includes a pickup head power element 110 and a pickup head 120. The pickup head 120 is used to adsorb the target element 300. In one embodiment, at least one adsorption port 121 (such as a vacuum adsorption hole) may be provided on the pickup head 120, and at least one adsorption port 121 is disposed adjacent to the target element 300 for adsorbing the target element 300. In addition, a first magnetic structure 510 may be disposed on the pickup head 120, and then cooperate with a second magnetic structure 520 located in the lifting device 200 to realize the switching between the activation state and the inactivation state of the magnetic mechanism 500. The pickup head power element 110 is connected to the pickup head 120, and is used to drive the pickup head 120 to drive the target element 300 to move, so as to separate the target element 300 from the transmission film 400 through the pickup head 120, and then drive the target element 300 to move to the substrate to be bonded (not shown), and bond the target element 300 to the substrate to be bonded.

[0039] See also Figure 1 The lifting device 200 generally includes a base 240, an ejector assembly 220 and an ejector power element 230. The base 240 is provided with a receiving cavity 250 for receiving the ejector assembly 220 and the ejector power element 230. In one embodiment, the second magnetic structure 520 may be provided on the ejector assembly 220 and move synchronously with the ejector assembly 220. The ejector power element 230 is connected to the ejector assembly 220 and is used to drive the ejector assembly 220 to move, so that the ejector assembly 220 can be ejected from the receiving cavity 250 to lift the target component 300, or the ejector assembly 220 can be retracted into the receiving cavity 250.

[0040] When the semiconductor separation device 600 is in a non-working state, the ejector pin assembly 220 is accommodated in the accommodating cavity 250, and the outer surface of the ejector pin assembly 220 can be flush with the outer surface of the base 240, and the transmission film 400 can be placed flat on the ejector pin assembly 220 and the base 240. In other embodiments, the outer surface of the ejector pin assembly 220 and the outer surface of the base 240 may not be flush; when the semiconductor separation device 600 is in a working state, the ejector pin power element 230 drives the ejector pin assembly 220 to move and protrude from the outer surface of the base 240 to lift the target element 300.

[0041] See also Figure 2, a plurality of adsorption holes 210 are distributed on the base 240. When the target element 300 is lifted, the base 240 adsorbs part of the transmission film 400 around the target element 300 through the adsorption holes 210, thereby adsorbing the transmission film 400 near the ejector assembly 220 onto the base 240. When the target element 300 is lifted, the transmission film 400 between the base 240 and the ejector assembly 220 is lifted by the ejector assembly 220 and is stretched and deformed, and the transmission film 400 between the base 240 and the ejector assembly 220 is gradually separated from the target element 300 due to its own tension.

[0042] See also Figure 2 , the ejector assembly 220 includes a central ejector 223 and at least one peripheral ejector 221. The central ejector 223 is approximately located at the center of the ejector assembly 220, and at least one peripheral ejector 221 is disposed around the central ejector 223. When the pickup device 100 drives the target component 300 to move in a direction away from the transmission film 400, in a direction from the edge of the base 240 to the middle of the base 240, after each peripheral ejector 221 moves in sequence to be restricted in the accommodating cavity 250, the central ejector 223 continues to move to be limited by the accommodating cavity 250 or the peripheral ejector 221.

[0043] Figure 3 FIG. 1 is a schematic diagram of a projection of a pin assembly on a target component according to an embodiment of the present application. Figure 3 The central ejector pin 223 and the peripheral ejector pin 221 of the ejector pin assembly 220 both include a pushing portion 2201 and a limiting portion 2202. The pushing portion 2201 is close to the transmission film 400 and connected to the limiting portion 2202. The accommodating cavity 250 allows the pushing portion 2201 to pass through, so that the pushing portion 2201 lifts the target element 300 from the surface of the base 240, and the limiting portion 2202 is limited in the accommodating cavity 250. After the central ejector pin 223 drives the peripheral ejector pins 221 to move synchronously until the limiting portion 2202 of the peripheral ejector pins 221 is limited in displacement by the accommodating cavity 250, the central ejector pin 223 continues to move, so that the limiting portion 2202 of the central ejector pin 223 is limited in displacement by the accommodating cavity 250 or the peripheral ejector pins 221.

[0044] See also Figure 2-3In one embodiment, the ejector assembly 220 may be a three-stage ejector, including a central ejector 223 and two peripheral ejectors 221 (i.e., a first peripheral ejector 221a and a second peripheral ejector 221b). The central ejector is approximately located at the center of the ejector assembly 220, the second peripheral ejector 221b is arranged around the circumference of the central ejector 223, and the first peripheral ejector 221a is further arranged around the circumference of the second peripheral ejector 221b. The first peripheral ejector 221a includes a first peripheral push portion and a first peripheral stop portion, the second peripheral ejector 221b includes a second peripheral push portion and a second peripheral stop portion, and the central ejector 223 includes a central push portion and a central stop portion. The lengths of the push portions 2201 (i.e., the first peripheral push portion, the second peripheral push portion, and the central push portion) from the edge of the ejector assembly 220 to the center direction increase in sequence, forming a step-like shape, that is, the length of the first peripheral push portion is less than the length of the second peripheral push portion, and the length of the second peripheral push portion is less than the length of the central push portion. Therefore, in the process of separating the target element 300 from the transmission film 400, the portion of the transmission film 400 corresponding to the periphery of the ejector pin assembly 220 (corresponding to the peripheral ejector pin 221) is separated from the target element 300 first, and then the portion of the transmission film 400 corresponding to the middle portion of the ejector pin assembly 220 (corresponding to the central ejector pin 223) is separated from the target element 300, thereby realizing the gradual separation of the transmission film 400 from the target element 300.

[0045] Continue to see Figure 3 In one embodiment, a projection of each of the central ejector pin 223 and the peripheral ejector pin 221 on the target element 300 is located within the target element 300 , or a projection of at least a portion of the peripheral ejector pin 221 on the target element 300 is located within the target element 300 . In another embodiment, the cross-sectional width of the central ejector pin 223 is greater than the cross-sectional width of each peripheral ejector pin 221, the projection of the central ejector pin 223 on the target element 300 is located inside the target element 300, and the projection of the peripheral ejector pin 221 on the target element 300 is at least partially located outside the target element 300. Through this arrangement, the contact area between the central ejector pin 223 with a wider cross section and the transmission film 400 corresponding to the target element 300 can be increased, and the peripheral ejector pin 221 with a narrower cross section can be located at the outer edge of the transmission film 400 corresponding to the target element 300, thereby allowing the transmission film 400 to be gradually separated from the outer edge of the target element 300 to the middle of the target element 300, and the transmission film 400 can be separated from the central part of the target element 300 as a whole, thereby improving the peeling accuracy and reducing the risk of breaking the target element 300.

[0046] Figure 4 FIG. 1 is a partial structural diagram of a lifting device according to an embodiment of the present application. Figure 4In one embodiment of the present application, in the projection perpendicular to the moving direction of the lifting device 200, the cross-sectional width of the limiting portion of the central ejector 223 is greater than the cross-sectional width of the limiting portion of each peripheral ejector 221. In addition, in the direction from the edge of the base 240 to the middle of the base 240, the cross-sectional width of the limiting portion of each peripheral ejector 221 gradually increases. An elastic buffer is provided between two adjacent peripheral ejectors 221 and / or between the central ejector 223 and the peripheral ejector 221 adjacent to the central ejector 223. By providing the elastic buffer, a buffer can be provided for the continued upward movement of the peripheral ejector 221 and / or the central ejector 223, reducing the risk of the peripheral ejector 221 and / or the central ejector 223 hitting other peripheral ejectors and causing damage to the ejector assembly 220, thereby extending the service life of the semiconductor separation device 600. Among them, the elastic buffer can be a spring or other elastic structure that is deformed by force, which is not limited here.

[0047] For example, in Figure 4 In the illustrated embodiment, the cross-sectional width of the central stopper of the central ejector pin 223 is greater than the cross-sectional width of the second peripheral stopper of the second peripheral ejector pin 221b, and the cross-sectional width of the second peripheral stopper of the second peripheral ejector pin 221b is further greater than the cross-sectional width of the first peripheral stopper of the first peripheral ejector pin 221a. In one embodiment, a first gap is provided between the first peripheral stopper of the first peripheral ejector pin 221a and the second peripheral stopper of the second peripheral ejector pin 221b, and a first elastic buffer 224 may be provided in the first gap. A second gap may also be provided between the second peripheral stopper of the second peripheral ejector pin 221b and the central stopper of the central ejector pin 223, and a second elastic buffer 225 may be provided in the second gap.

[0048] In one embodiment, in a cross section parallel to the surface of the base 240, the cross section of the ejector assembly 220 includes but is not limited to a circle (eg Figure 3 As shown), square, triangle, polygon, irregular shape and combinations thereof.

[0049] In one embodiment, the magnetic force generated by the activated magnetic mechanism 500 may be a magnetic attraction force. In other words, the magnetic force generated between the first magnetic structure 510 and the second magnetic structure 520 may be a magnetic attraction force. In this case, during the lifting process, the pickup device 100 absorbs the target element 300 and moves, and the lifting device 200 follows the pickup device 100 based on the magnetic attraction force to move synchronously to lift the target element 300 from the transmission film 400 until the target element 300 reaches the separation height H0; during the separation process, the magnetic attraction force between the pickup device 100 and the lifting device 200 disappears, the lifting device 200 stops moving, and the pickup device 100 absorbs the target element 300 and moves further to separate the target element 300 from the transmission film 400. The magnetic mechanism 500 is set up in a magnetic suction force manner. During the picking process of the target component 300, the lifting device 200 can be controlled to move only the picking device 100 while the picking device 100 moves synchronously with the picking device 100. In this way, the synchronous movement of the lifting device 200 and the picking device 100 can be achieved with a smaller magnetic suction force, thereby improving the stability of the target component 300 during the picking process.

[0050] In another embodiment, the magnetic force generated by the activated magnetic mechanism 500 may be a magnetic repulsion force, in other words, the magnetic force generated between the first magnetic structure 510 and the second magnetic structure 520 may be a magnetic repulsion force. In this case, during the lifting process, the lifting device 200 moves to lift the target element 300 from the transmission film 400, and the pickup device 100 moves synchronously based on the magnetic repulsion force while maintaining adsorption with the target element 300 until the target element 300 reaches the separation height H0; during the separation process, the magnetic repulsion force between the pickup device 100 and the lifting device 200 disappears, the lifting device 200 stops moving, and the pickup device 100 adsorbs the target element 300 and moves further to separate the target element 300 from the transmission film 400. The magnetic mechanism 500 is set in a magnetic repulsion manner. During the picking process of the target component 300, the lifting device 200 can be controlled to move only while the picking device 100 moves synchronously with the lifting device 200, thereby realizing the synchronous movement of the lifting device 200 and the picking device 100 more quickly, improving the stability of the picking process of the target component 300, and having high separation efficiency. In some embodiments, the picking head 120 and the target component 300 can be moved as a whole to the separation height H0 under the action of the magnetic repulsion force.

[0051] Continue to see Figure 2In one embodiment, the pickup head power element 110 can apply a buffering force F1 to the pickup head 120 when the pickup head 120 moves. When the magnetic force generated by the activated magnetic mechanism 500 is a magnetic repulsion force, during the lifting process, the lifting device 200 moves, and the pickup head 120 follows the movement under the action of the magnetic repulsion force; wherein the magnitude of the magnetic repulsion force is greater than or equal to the sum of the buffering force F1 applied by the pickup head power element 110 to the pickup head 120, the gravity of the pickup head 120, and the gravity of the target element 300, thereby improving the stability of the target element 300 during the picking process, so that the target element 300 can be stably picked up at the separation height without introducing additional pressure, thereby improving the bonding efficiency.

[0052] In one embodiment, the pickup head power element 110 may be a cylinder, such as a piston cylinder, and is connected to the pickup head 120. When the pickup head 120 is subjected to magnetic repulsion and moves toward the cylinder, the cylinder remains stationary, and the piston is pushed by the pickup head 120 to compress the cylinder cavity, providing a buffer space for the movement of the pickup head 120, thereby the cylinder can apply a reverse buffering force to the pickup head 120, reduce the large pressure generated by the interaction between the pickup head 120 and the pickup head power element 110, and prevent the target component 300 from being broken. During the movement, the cylinder applies a buffering force F1 to the pickup head 120, and the magnetic repulsion between the pickup head 120 and the ejector assembly 220 is greater than or equal to the sum of the gravity of the target component 300, the gravity of the pickup head 120, and the buffering force F1 applied to the pickup head 120 by the cylinder. The pickup head power element 110 is implemented in the form of a cylinder. While improving the bonding efficiency, the cylinder provides a buffer space for the pickup head 120, thereby further improving the stability of the target component 300 during the picking process. Of course, in other embodiments, the pickup head power element 110 can also be implemented in other ways. For example, the pickup head power element 110 is provided with a buffer medium at the position where it contacts the pickup head 120, such as elastic silicone or soft rubber. The present application does not specifically limit the implementation method of the pickup head power element 110.

[0053] In one embodiment, the second magnetic structure 520 is disposed on the central ejector pin 223 , and the second magnetic structure 520 is disposed corresponding to the first magnetic structure 510 , so that the peripheral ejector pins 221 are driven to move toward the picking device 100 by the central ejector pin 223 through the cooperation between the first magnetic structure 510 and the second magnetic structure 520 .

[0054] In one embodiment, one of the first magnetic structure 510 and the second magnetic structure 520 is a magnetic excitation element. The other of the first magnetic structure 510 and the second magnetic structure 520 can be a magnetic excitation element or a magnetic member. The magnetic force of the magnetic excitation element can be controlled by an electric current, such as an electromagnet. The magnetic member can be a permanent magnet. For example, Figure 1 In the illustrated embodiment, the second magnetic structure 520 is an electromagnet and the first magnetic structure 510 is a permanent magnet. Figure 5 In the embodiment shown, the second magnetic structure 520 may be a permanent magnet, and the first magnetic structure 510 may be an electromagnet. Figure 6 In the illustrated embodiment, the second magnetic structure 520 may be an electromagnet, and the first magnetic structure 510 may also be an electromagnet. In another embodiment, the first magnetic structure 510 and / or the second magnetic structure 520 may also be implemented using room temperature superconducting materials, so as to utilize the property of room temperature superconducting materials to repel magnetic lines of force under specific conditions (e.g., low temperature conditions) to achieve synchronous movement of the pickup device 100 and the lifting device 200. The present application does not impose any specific restrictions on the implementation of the first magnetic structure 510 and the second magnetic structure 520, as long as they can cooperate with each other to achieve the activation state and the inactivation state of the magnetic mechanism 500.

[0055] Figure 7 This is a schematic diagram of a state in which a target element according to an embodiment of the present application moves to a first separation height. Figure 8 Schematic diagram of the state where the target element moves to the second set height in one embodiment of the present application. Figure 2 as well as Figure 7-8 , briefly describing the process of picking up the target component 300 using the semiconductor separation device in one embodiment of the present application.

[0056] See also Figure 7 During the lifting process of the target element 300, the magnetic mechanism 500 is in an activated state, so that a magnetic attraction force is generated between the pickup device 100 and the ejector assembly 220. The pickup device 100 is controlled to move upward, so that the ejector assembly 220 moves upward synchronously with the pickup device 100 due to the magnetic attraction force, and the part of the transmission film 400 corresponding to the ejector assembly 220 is lifted up as the ejector assembly 220 moves upward as a whole, and the target element 300 is lifted up synchronously; wherein, the transmission film 400 is always in a taut state during the lifting process of the ejector assembly 220. The ejector assembly 220 moves as a whole with the picking device 100 until the target element 300 is located at the first preset height H1. At this time, the first outer ring limiting portion of the first peripheral ejector 221a is limited in displacement by the accommodating cavity 250, thereby preventing the first peripheral ejector 221a from continuing to move with the picking device 100, thereby causing the transmission film 400 between the base 240 and the first peripheral ejector 221a to separate from the target element 300 due to its own tension.

[0057] See also Figure 8After the first peripheral ejector pin 221a is limited, the second peripheral ejector pin 221b and the center ejector pin 223 continue to move with the picking device 100 until the target element 300 is located at the second preset height H2. At this time, the second outer ring limiting portion of the second peripheral ejector pin 221b is limited by the accommodating cavity 250 or the first peripheral ejector pin 221a, thereby preventing the second peripheral ejector pin 221b from continuing to move with the picking device 100, thereby causing the portion of the transmission film 400 between the first peripheral ejector pin 221a and the second peripheral ejector pin 221b to automatically separate from the target element 300 due to its own tension.

[0058] Next, see Figure 2 After the second peripheral ejector pin 221b is limited, the central ejector pin 223 continues to move with the picking device 100 until the target component 300 is located at the separation height H0. At this time, the central limiting portion of the central ejector pin 223 is limited by the accommodating cavity 250 or the second peripheral ejector pin 221, thereby preventing the central ejector pin 223 from continuing to move with the picking device 100. As a result, the transmission film 400 between the second peripheral ejector pin 221b and the central ejector pin 223 is automatically separated from the target component 300 due to its own tension.

[0059] After the target element 300 reaches the separation height H0, the magnetic mechanism 500 is controlled to be in an inactive state to eliminate the magnetic force between the lifting device 200 and the pickup device 100. At this time, the pickup device 100 can continue to move upward, but the lifting device 200 no longer moves with the pickup device 100, that is, the lifting device 200 stops moving. Therefore, the pickup device 100 can continue to drive the target element 300 to move upward during the upward movement and separate the target element 300 from the transmission film 400.

[0060] The above description is made by taking the magnetic attraction generated by the magnetic mechanism 500 in the activated state as an example. Those skilled in the art can understand the working principle of the semiconductor separation device 600 when the magnetic mechanism 500 generates magnetic repulsion in the activated state.

[0061] To further solve the above technical problems, the present application also provides a target separation method. Fig. 9 , Fig. 9 Flow chart of a separation method provided in one embodiment of the present application, which method can be applied to the semiconductor separation device 600 described in any of the above embodiments. Fig. 9 As shown, the semiconductor separation method of the present application may include the following steps.

[0062] Step S101: Provide a picking device, a lifting device and a magnetic mechanism, the picking device is located on one side of the transmission film, the lifting device is located on the side of the transmission film away from the picking device, and the target element is attached to the side of the transmission film facing the picking device; the magnetic mechanism includes a first magnetic structure provided on the picking device and a second magnetic structure provided on the lifting device and corresponding to the first magnetic structure, the first magnetic structure cooperates with the second magnetic structure to switch the magnetic mechanism between an activated state and an inactivated state.

[0063] Among them, the picking device, the lifting device and the magnetic mechanism can all be implemented by using the corresponding picking device 100, the lifting device 200 and the magnetic mechanism 500 mentioned in any of the above embodiments, which will not be repeated here.

[0064] Step S102: Control the magnetic mechanism to be in an activated state, move one of the picking device and the lifting device, and the other of the picking device and the lifting device uses the magnetic force generated by the activated magnetic mechanism to perform synchronous follow-up movement to lift the target component from the transmission film until the target component reaches the separation height.

[0065] In step S102, from the time when the ejector assembly 220 is ejected from the base 240 to the time when the ejector assembly 220 moves to the separation height H0, only one of the picking device 100 and the lifting device 200 has a power element that drives the target element to move upward, and the power element of the other one does not work, and it uses the magnetic attraction or magnetic repulsion generated by the activated magnetic mechanism 500 to perform synchronous follow-up movement to lift the target element 300 from the transmission film 400 until the target element 300 reaches the separation height H0.

[0066] When the magnetic force generated by the magnetic mechanism 500 in the activated state is a magnetic attraction force, there is a magnetic attraction force between the pickup device 100 and the lifting device 200. At this time, only the pickup head power element 110 of the pickup head 120 can be controlled to be in a working state, while the ejector power element 230 of the lifting device 200 is not working. The pickup head power element 110 drives the pickup head 120 to move upward, and then the lifting device 200 is driven to move upward synchronously by the magnetic attraction force between the pickup head 120 and the lifting device 200.

[0067] When the magnetic force generated by the activated magnetic mechanism 500 is a magnetic repulsion force, there is a magnetic repulsion force between the pickup device 100 and the lifting device 200. At this time, only the ejector power element 230 of the lifting device 200 can be controlled to be in a working state, while the pickup head power element 110 of the pickup head 120 is not working. The ejector power element 230 drives the ejector assembly 220 to move upward, and then the pickup head 120 is driven to move upward synchronously by the magnetic repulsion force between the pickup head 120 and the lifting device 200.

[0068] Step S103: the magnetic mechanism is controlled to be in an inactive state, the lifting device and the picking device stop moving synchronously, and the picking device adsorbs the target component and separates it from the transmission film.

[0069] In one embodiment, when the magnetic force generated by the activated magnetic mechanism 500 is a magnetic attraction force, the lifting device 200 and the pickup device 100 are synchronously moved by the magnetic attraction force until the target element 300 is located at the separation height H0, and then the magnetic mechanism 500 is controlled to be in an inactive state to eliminate the magnetic attraction force between the pickup device 100 and the lifting device 200. The pickup head power element 110 continues to drive the pickup head 120 to adsorb the target element 300 and move it upward from the separation height H0 of the ejector pin assembly 220, while the ejector pin assembly 220 of the lifting device 200 is limited in displacement and no longer continues to move with the target element 300. Therefore, as the target element 300 moves, the target element 300 is gradually separated from the transmission film 400, so that the target element 300 is completely separated from the transmission film 400.

[0070] In one embodiment, when the magnetic force generated by the activated magnetic mechanism 500 is a magnetic repulsion force, after the lifting device 200 and the pickup device 100 are synchronously moved to the separation height H0 by the magnetic repulsion force, the magnetic mechanism 500 is controlled to be in an inactive state, the ejector power element 230 is turned off, and the magnetic repulsion force between the pickup device 100 and the lifting device 200 is eliminated; the pickup head power element 110 is turned on, so that the pickup head 120 adsorbs the target element 300 and moves further from the ejector assembly 220 at the separation height H0. Since the ejector assembly 220 is limited in displacement and no longer continues to move with the target element 300, as the target element 300 moves, the target element 300 is gradually separated from the transmission film 400, and the target element 300 is completely separated from the transmission film 400.

[0071] In the above manner, the separation method enables the lifting device 200 and the picking device 100 to move synchronously during the process of lifting the target component 300, ensuring that the target component 300 is stably picked up at a set height without introducing additional pressure. Compared with the related art, the problem caused by the asynchronous movement of the picking device 100 and the lifting device 200 can be avoided, the matching degree of the picking device 100 and the lifting device 200 is required to be low, the stability of the target component 300 during the picking process is improved, the risk of the target component 300 being broken can be reduced, and the target component 300 and the transmission film 400 can be fully separated, thereby improving the bonding efficiency.

[0072] Those skilled in the art will appreciate that, in the above method of specific implementation, the order in which the steps are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of the steps should be determined by their functions and possible internal logic.

[0073] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the description and drawings of the present application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A semiconductor separation device, characterized in that: include: A picking device, located on one side of the transmission film, is used to pick up a target component attached to the transmission film; A lifting device, located at a side of the transmission film away from the pickup device, for lifting the target component from the transmission film; as well as A magnetic mechanism, comprising a first magnetic structure provided on the pickup device and a second magnetic structure provided on the lifting device and corresponding to the first magnetic structure, wherein the first magnetic structure cooperates with the second magnetic structure to switch the magnetic mechanism between an activated state and an inactivated state; During the lifting process, the magnetic mechanism is in the activated state, one of the pickup device and the lifting device moves, and the other uses the magnetic force generated by the activated magnetic mechanism to perform synchronous follow-up movement, so as to lift the target component from the transmission film until the target component reaches the separation height; as well as During the separation process, the magnetic mechanism is in the inactive state, the lifting device and the picking device stop moving synchronously, and the picking device adsorbs the target element and separates it from the transport film.

2. The semiconductor separation device according to claim 1, characterized in that: The magnetic force generated by the magnetic mechanism in an activated state is a magnetic attraction force. During the lifting process, the pickup device absorbs the target element and moves. The lifting device follows the pickup device based on the magnetic attraction force and moves synchronously to lift the target element from the transmission film. During the separation process, the magnetic attraction between the pickup device and the lifting device disappears, the lifting device stops moving, and the pickup device absorbs the target element and moves further to separate the target element from the transmission film; or The magnetic force generated by the magnetic mechanism in the activated state is a magnetic repulsion force. During the lifting process, the lifting device moves to lift the target element from the transmission film, and the picking device moves synchronously based on the magnetic repulsion force while maintaining adsorption with the target element. During the separation process, the magnetic repulsion force between the picking device and the lifting device disappears, the lifting device stops moving, and the picking device adsorbs the target element and moves further to separate the target element from the transmission film.

3. The semiconductor separation device according to claim 1, characterized in that: One of the first magnetic structure and the second magnetic structure is a magnetic excitation element; the other of the first magnetic structure and the second magnetic structure is a magnetic excitation element or a magnetic member.

4. The semiconductor separation device according to claim 1, characterized in that: The pickup device comprises: A pickup head, used for adsorbing the target element, wherein the first magnetic structure is disposed on the pickup head; and The pickup head power element is connected to the pickup head and is used to drive the pickup head to move the target element.

5. The semiconductor separation device according to claim 4, characterized in that: The pickup head power element applies a buffering force to the pickup head when the pickup head moves; the magnetic force generated by the magnetic mechanism in an activated state is a magnetic repulsion force. During the jacking process, the jacking device moves, and the pickup head follows the movement under the action of the magnetic repulsion force. The magnitude of the magnetic repulsion force is greater than or equal to the sum of the buffering force applied by the pickup head power element to the pickup head, the gravity of the pickup head, and the gravity of the target element.

6. The semiconductor separation device according to claim 1, characterized in that: The lifting device comprises: A base having a receiving cavity formed thereon; An ejector assembly is located in the accommodating cavity, and the second magnetic structure is provided on the ejector assembly and moves synchronously with the ejector assembly; The ejector power element is connected to the ejector assembly and is used to drive the ejector assembly to be ejected from the accommodating cavity.

7. The semiconductor separation device according to claim 6, characterized in that: The base is provided with a plurality of adsorption holes. When the target element is lifted up, the base adsorbs a portion of the transmission film around the target element through the adsorption holes.

8. The semiconductor separation device according to claim 6, characterized in that: The ejector pin assembly includes a central ejector pin and at least one peripheral ejector pin, wherein the at least one peripheral ejector pin is arranged around the central ejector pin, and the second magnetic structure is arranged on the central ejector pin; When the picking device drives the target element to move in a direction away from the transmission film, in a direction from the edge of the base to the middle of the base, each of the peripheral ejector pins moves in turn until it is confined in the accommodating cavity, and then the central ejector pin continues to move until its displacement is limited by the accommodating cavity or the peripheral ejector pins.

9. The semiconductor separation device according to claim 8, characterized in that: The central ejector pin and the peripheral ejector pin each include a pushing portion and a limiting portion, wherein the pushing portion is disposed on a side adjacent to the transmission film and connected to the limiting portion, and the accommodating cavity allows the pushing portion to pass through and limits the limiting portion within the accommodating cavity; The central ejector drives the peripheral ejectors to move synchronously, so that the limiting parts of the peripheral ejectors are sequentially limited in displacement by the accommodating cavity, and then the central ejector continues to move until the limiting part of the central ejector is limited in displacement by the accommodating cavity or the peripheral ejectors.

10. The semiconductor separation device according to claim 9, characterized in that: In a projection perpendicular to the moving direction of the lifting device, the cross-sectional width of the limiting portion of the central ejector pin is greater than the cross-sectional width of the limiting portion of each peripheral ejector pin; In a direction from the edge of the base to the middle of the base, the cross-sectional width of the limiting portion of each peripheral ejector pin gradually increases.

11. The semiconductor separation device according to claim 10, characterized in that: An elastic buffer is provided between two adjacent peripheral ejector pins and / or between the central ejector pin and a peripheral ejector pin adjacent to the central ejector pin.

12. A semiconductor separation method, characterized in that: include: A pick-up device, a lifting device and a magnetic mechanism are provided, wherein the pick-up device is located on one side of a transmission film, the lifting device is located on a side of the transmission film away from the pick-up device, and a target element is attached to a side of the transmission film facing the pick-up device; the magnetic mechanism comprises a first magnetic structure provided on the pick-up device and a second magnetic structure provided on the lifting device and corresponding to the first magnetic structure, wherein the first magnetic structure cooperates with the second magnetic structure to switch the magnetic mechanism between an activated state and an inactivated state; Controlling the magnetic mechanism to be in an activated state, moving one of the pickup device and the lifting device, and the other of the pickup device and the lifting device uses the magnetic force generated by the activated magnetic mechanism to perform synchronous follow-up movement, so as to lift the target element from the transport film until the target element reaches a separation height; as well as The magnetic mechanism is controlled to be in an inactive state, the lifting device and the picking device stop moving synchronously, and the picking device adsorbs the target element and separates it from the transmission film.

13. The semiconductor separation method according to claim 12, characterized in that: The magnetic force generated by the magnetic mechanism in an activated state is a magnetic attraction force. During the lifting process, the pickup device absorbs the target element and moves. The lifting device follows the pickup device based on the magnetic attraction force and moves synchronously to lift the target element from the transmission film. During the separation process, the magnetic attraction between the pickup device and the lifting device disappears, the lifting device stops moving, and the pickup device absorbs the target element and moves further to separate the target element from the transmission film; or The magnetic force generated by the magnetic mechanism in the activated state is a magnetic repulsion force. During the lifting process, the lifting device moves to lift the target element from the transmission film, and the picking device moves synchronously based on the magnetic repulsion force while maintaining adsorption with the target element. During the separation process, the magnetic repulsion force between the picking device and the lifting device disappears, the lifting device stops moving, and the picking device adsorbs the target element and moves further to separate the target element from the transmission film.

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