An eight-surface AOI detection device

Abstract

The application relates to the technical field of wafer detection, in particular to an eight-surface AOI detection equipment which comprises a machine table, a wafer feeding mechanism is installed at one end of the surface of the machine table, a turntable mechanism is installed on the surface of the machine table, product correction CCD guiding assemblies, automatic correction assemblies, Die surface and gold wire AOI detection assemblies, steering correction modules, bottom long-side AOI detection assemblies and bottom short-side AOI detection assemblies are installed on the surface of the machine table and located outside the turntable mechanism in anticlockwise direction. The application improves the automation degree, does not need manual auxiliary operation in the detection process, is convenient for wafer taking work, thus reduces the labor intensity during wafer detection, improves the work efficiency; moreover, the whole detection process is automatically completed by the machine, manual operation does not exist in the middle, thus the missing detection work cannot occur, the defective products are directly discharged during detection, the phenomenon that the defective products flow into the next process cannot occur, and thus the yield during wafer detection is increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer detection technology, in particular to an eight-surface AOI detection device. BACKGROUND

[0002] Wafer refers to a silicon wafer used for making silicon semiconductor integrated circuits, which can be processed into various circuit element structures on the silicon wafer to become IC products with specific electrical properties. The wafer needs to be detected during production and processing.

[0003] Generally, the wafer is pasted on the bottom film of the wafer disc during storage, and the wafer is manually taken out for detection. Therefore, the automation degree in the detection process is low, the labor intensity is increased, and the work efficiency during detection is reduced. Moreover, since the entire detection process needs to be manually operated, the detection is prone to miss detection, and the detected defective products are prone to mixed line, thereby reducing the yield of good products during detection. SUMMARY

[0004] The present application aims to provide an eight-surface AOI detection device to solve the problem of high labor intensity, low work efficiency, and low yield of good products caused by miss detection or mixed line of defective products during detection in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: an eight-surface AOI detection device, comprising a machine table, one end of the surface of the machine table is provided with a wafer feeding mechanism, which is used for feeding and loading wafer products; the surface of the machine table is provided with a turntable mechanism, which is used for receiving wafer products carried by the wafer feeding mechanism and carrying the wafer products between stations; the surface of the machine table and outside the turntable mechanism are sequentially provided with a product correction CCD guiding assembly, an automatic correction assembly, a Die surface and gold wire AOI detection assembly, a steering correction module, a bottom long edge AOI detection assembly, and a bottom short edge AOI detection assembly in counterclockwise direction; the surface of the machine table is provided with a waste separation assembly, which is used for separating waste wafer products; one end of the surface of the machine table away from the wafer feeding mechanism is provided with an NG tray mechanism, which is used for placing and discharging defective products after wafer product detection; the surface of the machine table is provided with a tray loading mechanism, which is used for tray discharging of good products after wafer product detection.

[0006] Preferably, the wafer feeding mechanism comprises a feeding rack, a basket lifting assembly, a code scanning gun, a wafer expansion workbench, and a transplanting manipulator, the feeding rack is fixedly connected to the surface of the machine table, and the basket lifting assembly is installed on one side of the surface of the machine table and located at the feeding rack, which is used for storing and lifting wafer products.

[0007] Preferably, the inside of the feeding frame is provided with a wafer spreading workbench for feeding the scanned wafer products to the rotating disc mechanism, the surface of the feeding frame is fixed with a code scanning gun for scanning the wafer products entering the wafer spreading workbench, and the surface of the feeding frame is further fixed with a transplanting manipulator for carrying the wafer products on the basket lifting assembly to the surface of the wafer spreading workbench.

[0008] Preferably, the wafer spreading workbench comprises a three-axis motion module, a wafer positioning table and a needle lifting assembly, the surface of the three-axis motion module is provided with the wafer positioning table, the surface of the feeding frame is fixed with the needle lifting assembly, the needle lifting assembly can pierce the film of the wafer disc when lifting and lift the wafer inside to facilitate the material taking work, and the rotating manipulator is fixed to the surface of the feeding frame, and the rotating manipulator is used to suck and feed the wafer lifted by the needle lifting assembly to the rotating disc mechanism.

[0009] Preferably, the rotating disc mechanism comprises a support arm, a multi-station rotating disc and a DD motor, the support arm is fixed to the surface of the machine table, and the top end of the support arm is provided with the DD motor through a support.

[0010] Preferably, the multi-station rotating disc is rotatably connected to the surface of the machine table and located directly below the DD motor, the multi-station rotating disc is used for wafer product adsorption, fixation and carrying work, and the output end of the DD motor is fixedly connected to the surface of the multi-station rotating disc.

[0011] Preferably, the tray feeding mechanism is composed of a good product tray frame, a tray constraint assembly and a transplanting lifting module, the good product tray frame is fixed to the surface of the machine table, and the top end of the good product tray frame is provided with two groups of tray constraint assemblies, the tray constraint assemblies are used for limiting the placement of the tray, and the bottom of the good product tray frame is provided with the transplanting lifting module, the transplanting lifting module is used for lifting the tray in the two groups of tray constraint assemblies.

[0012] Preferably, the NG disc swinging mechanism comprises a disc swinging frame, a disc swinging linear module, a defective product disc, a material taking manipulator and a defective product unloading rotating module, the disc swinging frame is fixed to the surface of the machine table, the bottom end of the disc swinging frame is provided with the disc swinging linear module, and the sliding seat of the disc swinging linear module is fixed with the defective product disc, the defective product disc is used for carrying the defective products.

[0013] Preferably, the surface of the disc swinging frame is provided with a defective product unloading rotating module for rotating the defective products, the top end of the disc swinging frame is provided with a material taking manipulator, the material taking manipulator is used for grabbing and carrying the defective products on the multi-station rotating disc to the defective product unloading rotating module, and the defective product unloading rotating module can carry the rotated defective products to the defective product disc to realize disc swinging.

[0014] Preferably, a top end of the machine table is provided with a machine cover, and a control panel is fixed on a surface of the machine cover, which is used for controlling the whole device; a waste box and a cleaning assembly are also installed on the surface of the machine table, the waste box is used for collecting the scattered waste, and the cleaning assembly is used for cleaning the empty work station after the wafer is unloaded.

[0015] Compared with the prior art, the eight-surface AOI detection device loads the wafer product through the wafer feeding mechanism, guides the position of the product through the CCD camera in the product correction CCD guiding assembly after the wafer product is loaded, fine-tunes and corrects the product through the automatic correction assembly, then performs AOI detection through the Die surface and gold wire AOI detection assembly, turns and corrects through the turning correction module after the detection, performs AOI detection through the bottom long-side AOI detection assembly and the bottom short-side AOI detection assembly, separates the waste through the waste separating assembly after the detection, places the defective product through the NG placing mechanism, and loads the good product into the tray loading mechanism to realize the tray unloading; the scattered waste is collected through the waste box, and finally the cleaning assembly is used for cleaning the empty work station after the wafer is unloaded. The present application improves the automation degree, and does not need manual operation in the detection process, which facilitates the wafer feeding work, reduces the labor intensity during the wafer detection, and improves the work efficiency. Moreover, since the whole detection process is automatically completed by the machine, manual operation is not needed in the middle, so the missed detection does not occur, the defective product is directly discharged, and the defective product does not flow into the next process, thereby increasing the yield of the wafer detection. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a three-dimensional appearance structure schematic view of the present application;

[0017] Figure 2 It is an internal structure schematic view of the present application;

[0018] Figure 3 It is a top view structure schematic view of the present application;

[0019] Figure 4 It is an explosion structure schematic view of the present application;

[0020] Figure 5 It is a local enlarged structure schematic view of the present application;

[0021] Figure 6 It is a wafer feeding mechanism structure schematic view of the present application;

[0022] Figure 7 It is a turntable mechanism structure schematic view of the present application;

[0023] Figure 8 It is a tray feeding mechanism structural schematic view of the present application;

[0024] Figure 9 It is a NG tray mechanism structural schematic view of the present application;

[0025] Figure 10 It is a wafer expansion workbench structural schematic view of the present application;

[0026] Figure 11 It is a needle lifting assembly structural schematic view of the present application.

[0027] In the figure: 1, machine table; 101, machine cover; 102, control panel; 2, wafer feeding mechanism; 21, feeding rack; 22, basket lifting assembly; 23, code scanning gun; 24, wafer expansion workbench; 241, three-axis motion module; 242, wafer positioning table; 243, needle lifting assembly; 244, rotary manipulator; 25, transplanting manipulator; 3, turntable mechanism; 31, support arm; 32, multi-station turntable; 33, DD motor; 4, tray feeding mechanism; 41, good tray rack; 42, tray constraint assembly; 43, transplanting lifting module; 5, product correction CCD guiding assembly; 6, automatic correction assembly; 7, Die surface and gold wire AOI detection assembly; 8, steering correction module; 9, bottom long side AOI detection assembly; 10, bottom short side AOI detection assembly; 11, NG tray mechanism; 111, tray rack; 112, tray linear module; 113, defective product tray; 114, material taking manipulator; 115, defective product unloading rotary module; 12, waste material separation assembly; 13, waste material box; 14, cleaning assembly. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. In addition, the terms "first", "second", "third", "upper", "lower", "left", "right" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Meanwhile, in the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of the present application.

[0029] The structure of the eight-face AOI detection equipment provided by the present application is as follows Figure 1 and Figure 6As shown, it comprises a machine table 1, one end of the surface of the machine table 1 is provided with a wafer feeding mechanism 2, which is used for feeding and loading work of wafer products, and the wafer feeding mechanism 2 comprises a feeding rack 21, a basket lifting assembly 22, a code scanning gun 23, a wafer expansion workbench 24 and a transplanting manipulator 25, the feeding rack 21 is fixedly connected to the surface of the machine table 1, the surface of the machine table 1 and located on one side of the feeding rack 21 is provided with the basket lifting assembly 22, the basket lifting assembly 22 comprises a basket feeding bin and a screw rod motor lifting platform, and the basket lifting assembly 22 is used for storing and lifting wafer products, the inside of the feeding rack 21 is provided with the wafer expansion workbench 24, which is used for loading the scanned wafer products onto the turntable mechanism 3, and the surface of the feeding rack 21 is fixedly provided with the code scanning gun 23, which is used for scanning the wafer products entering the wafer expansion workbench 24; the surface of the feeding rack 21 is also fixedly provided with the transplanting manipulator 25, which is used for carrying the wafer products on the basket lifting assembly 22 to the surface of the wafer expansion workbench 24.

[0030] In implementation, the wafer products are placed in the basket lifting assembly 22, the wafer in the basket lifting assembly 22 is carried to the wafer expansion workbench 24 by the transplanting manipulator 25, the wafer is scanned by the code scanning gun 23 after being carried, and then the wafer products are loaded onto the multi-station turntable 32 in the turntable mechanism 3 by the wafer expansion workbench 24.

[0031] Specifically, as shown in Figure 6 and Figure 10 The wafer expansion workbench 24 comprises a three-axis motion module 241, a wafer positioning table 242, a needle lifting assembly 243 and a rotary manipulator 244, the surface of the feeding rack 21 is fixedly connected with the three-axis motion module 241, the surface of the three-axis motion module 241 is provided with the wafer positioning table 242, the surface of the feeding rack 21 is fixedly provided with the needle lifting assembly 243, which will pierce the film of the wafer disc and lift the wafer inside when lifting, so as to facilitate the material taking work; the rotary manipulator 244 is fixedly connected to the surface of the feeding rack 21, and the rotary manipulator 244 is used for sucking and loading the wafer lifted by the needle lifting assembly 243 to the turntable mechanism 3.

[0032] The three-axis motion module 241 comprises a lifting screw module installed on the surface of the feeding rack 21, a Y-axis screw module fixedly connected to the lifting plate of the lifting screw module and an X-axis screw module installed on the sliding plate of the Y-axis screw module, and the wafer positioning table 242 is installed on the sliding plate of the X-axis screw module; the rotary manipulator 244 comprises a servo motor installed on the surface of the feeding rack 21, a rotating arm fixedly connected to the output end of the servo motor and a suction nozzle installed on both ends of the rotating arm; as Figure 11As shown, the needle lifting assembly 243 includes a needle seat mounted on the lifting linear module and a sliding plate mounted on the lifting linear module, and a needle head fixedly connected to the needle seat. The needle head can pierce the film while lifting the wafer chip without causing damage.

[0033] In implementation, the lifting screw module in the three-axis motion module 241 lifts the wafer positioning table 242 to the same level as the wafer disc placed in each layer of the basket lifting assembly 22. Then the Y-axis screw module and the X-axis screw module of the three-axis motion module 241 drive the wafer positioning table 242 to be connected to the basket lifting assembly 22. Subsequently, the transplanting manipulator 25 moves the wafer disc in the basket lifting assembly 22 to the wafer positioning table 242. The three-axis motion module 241 drives the wafer positioning table 242 to reset. Then the lifting linear module in the needle lifting assembly 243 drives the needle seat and the needle head to move upward. The needle head pierces the film at the bottom of the wafer disc and lifts the wafer chip inside. The needle head does not damage the wafer chip when lifting it. When the top of the needle seat is attached to the top of the film, the code is scanned by the code scanning gun 23. After scanning the code, the wafer is fed to the multi-station turntable 32 by the rotating manipulator 244. Therefore, it is more convenient to take the material.

[0034] Further, as shown in Figure 2 and Figure 7 , the surface of the machine table 1 is provided with a turntable mechanism 3. The turntable mechanism 3 is used to receive the wafer products carried by the wafer feeding mechanism 2 and perform the carrying work between stations. The turntable mechanism 3 includes a support arm 31, a multi-station turntable 32, and a DD motor 33. The support arm 31 is fixedly connected to the surface of the machine table 1. The top end of the support arm 31 is provided with the DD motor 33 through a support. The multi-station turntable 32 is rotatably connected to the surface of the machine table 1 below the DD motor 33. The multi-station turntable 32 has twenty stations. Each station is provided with a suction nozzle to adsorb and fix the wafer product. The multi-station turntable 32 is used for adsorbing, fixing, and carrying the wafer product. The output end of the DD motor 33 is fixedly connected to the surface of the multi-station turntable 32.

[0035] In implementation, the DD motor 33 on the surface of the support arm 31 drives the multi-station turntable 32 to rotate, thereby carrying the wafer product between stations.

[0036] Further, as shown in Figure 1 , Figure 3 , Figure 5As shown, the surface of the machine table 1 and located outside the turntable mechanism 3 is sequentially installed with a product correction CCD guiding assembly 5, an automatic correction assembly 6, a Die surface and gold wire AOI detection assembly 7, a turning correction module 8, a bottom long side AOI detection assembly 9 and a bottom short side AOI detection assembly 10 in the counterclockwise direction. The AOI detection is realized by using a visual camera to realize appearance detection. The top end of the machine table 1 is installed with a machine cover 101, and the surface of the machine cover 101 is fixed with a control panel 102 for the control work of the entire equipment. The surface of the machine table 1 is installed with a waste separation assembly 12 for the waste separation work of the wafer product. The surface of the machine table 1 is also installed with a waste box 13 and a cleaning assembly 14. The waste box 13 is used for the unloading and collection work of the scattered waste, and the cleaning assembly 14 is used for the cleaning work of the empty station after unloading.

[0037] In implementation, the wafer product is driven by the turntable mechanism 3 to pass through the product correction CCD guiding assembly 5 and the automatic correction assembly 6. The position of the product is fine-tuned and corrected under the guidance. Then, the AOI detection is performed by the Die surface and gold wire AOI detection assembly 7. After detection, the turning correction is performed by the turning correction module 8. Then, the AOI detection is performed by the bottom long side AOI detection assembly 9 and the bottom short side AOI detection assembly 10.

[0038] Further, as shown in Figure 4 and Figure 9 , the surface of the machine table 1 and away from one end of the wafer feeding mechanism 2 is installed with an NG tray mechanism 11 for the tray unloading work of the defective products after detection. The NG tray mechanism 11 comprises a tray frame 111, a tray linear module 112, a defective product tray 113, a material taking manipulator 114 and a defective unloading rotary module 115. The tray frame 111 is fixedly connected to the surface of the machine table 1, and the bottom end of the tray frame 111 is installed with the tray linear module 112. The sliding seat of the tray linear module 112 is fixedly connected with the defective product tray 113 for bearing the defective products. The surface of the tray frame 111 is installed with the defective unloading rotary module 115 for driving the rotation of the defective products. The top end of the tray frame 111 is installed with the material taking manipulator 114 for grabbing and carrying the defective products on the multi-station turntable 32 to the defective unloading rotary module 115, and can carry the full-rotation defective products of the defective unloading rotary module 115 to the defective product tray 113 to realize the tray.

[0039] In implementation, the defective products on the multi-station turntable 32 are picked up by the material taking manipulator 114 and transported to the defective unloading rotary module 115. After one side is full, the defective products are rotated by the defective unloading rotary module 115, and the defective unloading rotary module 115 transports the defective products on the full side to the defective product tray 113. During the transportation, the defective product tray 113 is moved by the tray linear module 112 to realize the tray unloading work of the defective products.

[0040] Further, as shown in Figure 3 and Figure 8 , the surface of the machine table 1 is provided with a tray feeding mechanism 4 for tray unloading of good products after wafer product detection. The tray feeding mechanism 4 is composed of a good product tray rack 41, a tray restraint assembly 42, and a transplant lifting module 43. The good product tray rack 41 is fixedly connected to the surface of the machine table 1, and the top end of the good product tray rack 41 is provided with two sets of tray restraint assemblies 42 for limiting the placement of the tray. The bottom of the good product tray rack 41 is provided with a transplant lifting module 43, which includes a linear module and a screw rod motor lifting table. The transplant lifting module 43 is used for lifting the tray in the two sets of tray restraint assemblies 42.

[0041] In implementation, the tray is placed inside the tray restraint assembly 42, and then the good products are transported to the tray by the manipulator. After one layer of tray is full, it is unloaded, and then the lower tray is lifted to the receiving position by the transplant lifting module 43 for receiving work.

[0042] Working principle: In use, the wafer product is fed by the wafer feeding mechanism 2. After feeding, the wafer product is guided by the product correction CCD guide assembly 5, and the position of the product is guided by the CCD camera. Then, the product is fine-tuned and corrected by the automatic correction assembly 6, and then AOI detection is performed by the Die surface and gold wire AOI detection assembly 7. After detection, the product is turned and corrected by the turning correction module 8, and then AOI detection is performed by the bottom long-side AOI detection assembly 9 and the bottom short-side AOI detection assembly 10. The AOI detection is realized by a vision camera for appearance detection. After detection, the waste is separated by the waste separation assembly 12, the defective products are trayed by the NG traying mechanism 11, the good products are trayed by the tray feeding mechanism 4, the scattered waste is collected by the waste box 13, and finally the empty station is cleaned by the cleaning assembly 14. Finally, the use of the eight-face AOI detection equipment is completed.

[0043] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the present application can be implemented in other particular forms without departing from the spirit or essential characteristics of the present application. The embodiments should therefore be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the above description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No reference signs in the claims should be considered as limiting the scope of the claims with respect to the figures of the patent document.

Claims

1. An eight-surface AOI detection device, comprising a machine table (1), characterized in that: The surface of the machine table (1) is provided with a wafer feeding mechanism (2) at one end, which is used for feeding and loading wafer products; the surface of the machine table (1) is provided with a turntable mechanism (3), which is used for receiving wafer products carried by the wafer feeding mechanism (2) and carrying the wafer products between stations; the surface of the machine table (1) and outside the turntable mechanism (3) are provided with a product correction CCD guide assembly (5), an automatic correction assembly (6), a Die surface and gold wire AOI detection assembly (7), a steering correction module (8), a bottom long side AOI detection assembly (9) and a bottom short side AOI detection assembly (10) in sequence in the counterclockwise direction; the surface of the machine table (1) is provided with a waste separation assembly (12), which is used for separating waste wafer products; the surface of the machine table (1) and away from the wafer feeding mechanism (2) is provided with an NG disc mechanism (11) at one end, which is used for discarding defective products after wafer product detection; the surface of the machine table (1) is provided with a tray loading mechanism (4), which is used for tray unloading of good products after wafer product detection; The wafer feeding mechanism (2) comprises a feeding rack (21), a basket lifting assembly (22), a code scanning gun (23), a wafer expansion workbench (24) and a transplanting manipulator (25), the feeding rack (21) is fixedly connected to the surface of the machine table (1), the surface of the machine table (1) and one side of the feeding rack (21) is provided with the basket lifting assembly (22), which is used for storing and lifting wafer products; The tray loading mechanism (4) is composed of a good product tray rack (41), a tray restraint assembly (42) and a transplanting lifting module (43), the good product tray rack (41) is fixedly connected to the surface of the machine table (1), and the top end of the good product tray rack (41) is provided with two groups of tray restraint assemblies (42), which are used for limiting the placement of the tray; the bottom of the good product tray rack (41) is provided with a transplanting lifting module (43), which is used for lifting the tray in the two groups of tray restraint assemblies (42).

2. The eight-surface AOI inspection apparatus according to claim 1, wherein: The inside of the feeding rack (21) is provided with a wafer expansion workbench (24), which is used for feeding the scanned wafer products to the turntable mechanism (3), the surface of the feeding rack (21) is fixedly provided with a code scanning gun (23), which is used for scanning the wafer products entering the wafer expansion workbench (24); the surface of the feeding rack (21) is also fixedly provided with a transplanting manipulator (25), which is used for carrying the wafer products on the basket lifting assembly (22) to the surface of the wafer expansion workbench (24).

3. The eight-surface AOI inspection apparatus according to claim 2, wherein: The wafer extension workbench (24) includes a three-axis motion module (241), a wafer positioning table (242), a needle lifting assembly (243), and a rotary manipulator (244), the surface of the three-axis motion module (241) is mounted with the wafer positioning table (242), the surface of the feeding rack (21) is fixed with the needle lifting assembly (243), the needle lifting assembly (243) will pierce the film of the wafer disc when lifting and lift the wafer inside to facilitate the material taking work; the rotary manipulator (244) is fixed on the surface of the feeding rack (21), and the rotary manipulator (244) is used to suck and feed the wafer lifted by the needle lifting assembly (243) to the rotary disc mechanism (3).

4. The eight-surface AOI inspection apparatus according to claim 1, wherein: The rotary disc mechanism (3) includes a support arm (31), a multi-station rotary disc (32), and a DD motor (33), the support arm (31) is fixed on the surface of the machine table (1), and the top end of the support arm (31) is mounted with the DD motor (33) through a support.

5. The eight-surface AOI inspection apparatus according to claim 4, wherein: The surface of the machine table (1) and below the DD motor (33) is rotatably connected with the multi-station rotary disc (32), which is used for wafer product adsorption and carrying work, and the output end of the DD motor (33) is fixedly connected with the surface of the multi-station rotary disc (32).

6. The eight-sided AOI inspection apparatus of claim 1, wherein: The NG disc swinging mechanism (11) includes a disc swinging rack (111), a disc swinging linear module (112), a defective product disc (113), a material taking manipulator (114), and a defective product unloading rotary module (115), the disc swinging rack (111) is fixed on the surface of the machine table (1), and the bottom end of the disc swinging rack (111) is mounted with the disc swinging linear module (112), and the sliding seat of the disc swinging linear module (112) is fixed with the defective product disc (113), which is used for carrying defective products.

7. The eight-sided AOI inspection apparatus of claim 6, wherein: The surface of the disc swinging rack (111) is mounted with the defective product unloading rotary module (115) for rotating the defective product, the top end of the disc swinging rack (111) is mounted with the material taking manipulator (114), which is used for grabbing and carrying the defective product on the multi-station rotary disc (32) to the defective product unloading rotary module (115), and can carry the defective product rotated by the defective product unloading rotary module (115) to the defective product disc (113) to realize disc swinging.

8. The eight-sided AOI inspection apparatus of claim 1, wherein: The top end of the machine table (1) is mounted with a machine cover (101), and the surface of the machine cover (101) is fixed with a control panel (102), which is used for the control of the whole equipment; the surface of the machine table (1) is also mounted with a waste box (13) and a cleaning assembly (14), the waste box (13) is used for collecting the scattered waste, and the cleaning assembly (14) is used for cleaning the empty station after unloading.

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