Heating device and process treatment equipment

Abstract

The invention relates to the technical field of heat treatment, in particular to a heating device and process treatment equipment. The heating device can be used for heating a to-be-heated device, the to-be-heated device is placed on a supporting component capable of rotating around a center shaft, the heating device comprises multiple sets of circumferential heat radiation units, the multiple sets of circumferential heat radiation units diffuse from the center shaft to the periphery of the center shaft, and each set of circumferential heat radiation units can comprise at least three heat radiation units. The at least three heat radiation units are uniformly arranged to define a regular polygon or a ring, and the plane where the regular polygon or the ring is located is perpendicular to the central shaft; and each group of circumferential heat radiation units can be used for reflecting and converging light rays to the to-be-heated device so as to heat at least part of the surface of the to-be-heated device. According to the heating device, the heating area with the adjustable temperature and width can be formed on the surface of the to-be-heated device, so that the uniformity of the surface temperature of the to-be-heated device is improved.

Description

Technical Field

[0001] The present application relates to the field of heat treatment technology, and in particular to a heating device and process treatment equipment. Background Art

[0002] During the wafer processing process, a heat source is needed to heat the wafer, and the uniformity of heating on the wafer surface will directly affect the quality of the wafer. Therefore, how to improve the uniformity of the wafer surface temperature when the wafer is heated becomes a problem that needs to be solved urgently. Summary of the invention

[0003] The present application provides a heating device and a process treatment equipment, wherein the heating device can form a heating zone with adjustable temperature and width on the surface of a wafer to improve the uniformity of the surface temperature of the wafer.

[0004] In a first aspect, the present application provides a heating device that can be used to heat a device to be heated, wherein the device to be heated is placed on a supporting component that can rotate around a central axis, wherein the heating device may include a plurality of groups of circumferential heat radiation units, wherein the plurality of groups of circumferential heat radiation units diffuse from the central axis toward the periphery of the central axis, wherein each group of circumferential heat radiation units may include at least three heat radiation units, wherein at least three heat radiation units are evenly arranged to form a regular polygon or a ring, and the plane in which the regular polygon or the ring is located is perpendicular to the central axis; wherein each group of circumferential heat radiation units can be used to reflect and converge light toward the device to be heated, so as to heat at least a portion of the surface of the device to be heated. Specifically, among the at least three heat radiation units included in each group of circumferential heat radiation units, the tail end of the previous heat radiation unit corresponds to the head end of the next heat radiation unit, so that the at least three heat radiation units form a regular polygon or a ring, and the light reflected and converged by the at least three heat radiation units can form a regular polygon or a ring-shaped heating zone on the surface of the device to be heated. By adjusting the respective heat radiation units included in each group of circumferential radiation units, the width and temperature of the heating zone formed by each group of circumferential heat radiation units on the surface of the device to be heated can be adjusted, thereby achieving precise control of the temperature of each heating zone of the device to be heated.

[0005] The device to be heated may be, but is not limited to, a wafer. The number of heat radiation units included in each group of circumferential heat radiation units may be adjusted according to actual conditions and is not specifically limited here.

[0006] In a possible embodiment, the light reflected and converged by the multiple groups of circumferential heat radiation units can heat the entire surface of the device to be heated to ensure that the surface of the device to be heated can be completely heated. Specifically, it can be understood that the multiple heating zones formed by the multiple groups of circumferential heat radiation units on the surface of the device to be heated completely cover the surface of the device to be heated to prevent the unheated area from appearing on the surface of the device to be heated.

[0007] In a possible embodiment, the light reflected and converged by two adjacent groups of the circumferential heat radiation units partially overlaps on the surface of the device to be heated, which can completely cover the surface of the device to be heated, prevent part of the device to be heated from not radiating light, and ensure the uniformity of the surface temperature of the device to be heated. In addition, the light reflected and converged by two adjacent groups of heat radiation units partially overlaps in the two heating zones formed on the surface of the device to be heated, which can also make the temperatures of various parts of the overall heating area formed by each annular heating zone relatively uniform, so as to further improve the uniformity of the surface temperature of the device to be heated.

[0008] It is worth mentioning that the angle between the light reflected and converged by the circumferential heat radiation unit and the surface of the device to be heated can be 30°~150° to ensure that the energy radiated by the light reflected and converged by the circumferential heat radiation unit can be irradiated onto the surface of the device to be heated.

[0009] In the above-mentioned embodiment, the number of groups of circumferential heat radiation units can be 2 to 5 groups. The light reflected and converged by 2 to 5 groups of circumferential heat radiation units can form 2 to 5 heating zones on the surface of the device to be heated. When adjusting the 2 to 5 groups of circumferential heat radiation units, the mutual influence between two adjacent heating zones is small. When specifically adjusting the temperature in one of the heating zones, that is, adjusting a group of heat radiation units corresponding to the heating zone, the response of other groups of heat radiation units to this group of heat radiation units is relatively small. Therefore, the influence on the heating zones formed by other groups of heat radiation units in the device to be heated is relatively small, which is beneficial to improving the uniformity and adjustability of the surface temperature of the device to be heated.

[0010] In a possible embodiment, the heat radiation unit includes a reflector and a radiation source, the reflector is arranged on the side of the radiation source away from the device to be heated, and the reflective surface of the reflector converges the light emitted by the radiation source and reflects it toward the device to be heated. The radiation source can be, but is not limited to, a linear light source and an arc light source. When the radiation source is a linear light source, and each group of heat radiation units includes a large number of heat radiation units, the multiple heat radiation units in each group of circumferential heat radiation units can form an approximately annular heating zone on the surface of the device to be heated. The reflective surface in the reflector can converge the light emitted by the radiation source, and the light reflected to the surface of the device to be heated is approximately parallel, so as to improve the uniformity of heating on the surface of the device to be heated.

[0011] When regulating the temperature of the surface of the device to be heated, the temperature of the radiation area formed by the heat radiation unit on the surface of the device to be heated can be adjusted by adjusting the radiation source power and the emission angle of each heat radiation unit. Moreover, by controlling the emission angle of the light reflected and converged by the heat radiation unit, the width of the radiation area formed by the heat radiation unit on the surface of the device to be heated can also be controlled, thereby controlling the size of the overlapping area of ​​the two adjacent groups of heat radiation units on the surface of the device to be heated, so as to accurately regulate the temperature of the surface of the device to be heated; in addition, when adjusting the temperature of the heating zone formed by each group of circumferential heat radiation units in the device to be heated, the temperature of the heating area formed by each group of circumferential heat radiation units can be controlled by controlling the number of heat radiation units included in each group of circumferential heat radiation units.

[0012] In the above embodiments, the reflecting surface may be an ellipsoid, a parabola or a hyperbolic surface.

[0013] In a possible embodiment, the heating device further includes a mounting frame, the axis of the mounting frame can coincide with the central axis, and the multiple groups of circumferential heat radiation units diffuse from the axis of the mounting frame to the edge of the mounting frame. This arrangement can ensure that after the multiple groups of circumferential heat radiation units are arranged on the mounting frame, the light reflected and converged by each group of circumferential heat radiation units can still form an annular heating zone. Among them, the arrangement of the mounting frame can also facilitate the arrangement of the multiple groups of circumferential heat radiation units. In another embodiment, the heating device may not include a mounting frame, and the multiple groups of circumferential heat radiation units may be arranged in other feasible ways.

[0014] It is worth mentioning that when multiple groups of circumferential heat radiation units are placed on the mounting frame, the multiple groups of circumferential heat radiation units can be evenly distributed from the axis of the mounting frame to the edge of the mounting frame, or the multiple groups of circumferential heat radiation units can be unevenly distributed from the axis of the mounting frame to the edge of the mounting frame.

[0015] In the above-mentioned embodiment, in order to facilitate the installation of the heat radiation unit on the mounting frame, a plurality of groups of mounting openings can be provided on the mounting frame, and the plurality of groups of mounting openings can spread from the axis of the mounting frame to the edge of the mounting frame, and each group of mounting openings can be installed with a group of circumferential heat radiation units, wherein each group of mounting openings can include a plurality of mounting openings, and each mounting opening can penetrate the mounting frame along the thickness direction of the mounting frame, so that the light reflected and converged by the heat radiation unit arranged in the mounting opening can directly irradiate the surface of the device to be heated.

[0016] More specifically, in order to facilitate debugging and replacement of each heat radiation unit, each heat radiation unit can be detachably installed on the installation opening.

[0017] In a possible embodiment, the mounting frame may include a first mounting portion and a second mounting portion connected to each other, and the distance between the first mounting portion and the device to be heated may be smaller than the distance between the second mounting portion and the device to be heated, that is, the first mounting portion and the second mounting portion may be staggered in the direction of the central axis, thereby reducing the space occupied by the mounting frame in the direction perpendicular to the central axis, thereby reducing the space occupancy of the entire heating device. Wherein, at least one set of mounting ports is provided on each of the first mounting portion and the second mounting portion.

[0018] In a second aspect, the present application also provides a process treatment device, the process treatment device includes a vacuum chamber and at least one heating device, a support component is arranged in the vacuum chamber, a device to be heated is arranged on the support component, the vacuum chamber is a light-transmitting vacuum chamber, and at least one heating device is arranged on one side of the vacuum chamber for heating the surface of the device to be heated. Since the temperature and width of the heating zone formed on the surface of the wafer by the light radiated from the heating device are adjustable, the surface of the device to be heated is heated evenly.

[0019] In a possible embodiment, in order to improve the efficiency of heating the device to be heated, two heating devices can be provided, and the two heating devices are respectively provided on both sides of the vacuum chamber, and the two heating devices are respectively used to heat the two surfaces of the device to be heated. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A cross-sectional view of a process treatment device provided in an embodiment of the present application; Figure 2 A schematic diagram of a ring-shaped heating zone formed on the surface of a device to be heated by a heating device provided in an embodiment of the present application; Figure 3 A schematic diagram of energy distribution of an annular heating zone formed on the surface of a device to be heated by a heating device provided in an embodiment of the present application; Figure 4 A top view of a heating device provided in an embodiment of the present application; Figure 5 This is a schematic diagram of the structure of a heat radiation unit in a heating device provided in an embodiment of the present application.

[0021] Description of reference numerals: 1- Heating device; 10-heat radiation unit; 11-radiation source; 12-reflector; 120-reflective surface; 2- Vacuum chamber; 20-mounting frame; 21-first mounting portion; 22-second mounting portion; 3- Support components; 4-Central axis; 5-device to be heated; 50-Heating zone. DETAILED DESCRIPTION

[0022] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0023] In the prior art, a silicon substrate epitaxial process is usually used to improve the quality of wafers. In the silicon substrate epitaxial process, a heating device is required to perform radiation heating on the wafer. Currently, heating devices are generally provided on both surfaces of the wafer to perform thermal radiation heating on the surface of the wafer.

[0024] However, after the existing heating device performs radiation heating on the wafer, areas with too high or too low temperatures will appear on the surface of the wafer, thereby affecting the uniformity of the surface temperature of the wafer and further affecting the quality of the wafer.

[0025] Therefore, a new heating device is urgently needed to improve the uniformity of the surface temperature of the wafer after the wafer is heated by thermal radiation.

[0026] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0027] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0028] Figure 1 A cross-sectional view of a process treatment device provided in an embodiment of the present application, referring to Figure 1A process treatment equipment provided in an embodiment of the present application may include a vacuum chamber 2 and at least one heating device 1, wherein a support component 3 may be provided in the vacuum chamber 2, the support component 3 may rotate around a central axis 4, a device 5 to be heated may be provided on the support component 3, at least one heating device 1 is located on one side of the vacuum chamber 2, the heating device 1 may reflect and converge light toward the vacuum chamber 2, the light may pass through the vacuum chamber 2 to heat the device 5 to be heated on the support component 3, and the surface of the device 5 to be heated may be heated evenly.

[0029] Specifically, the vacuum chamber 2 may be a light-transmitting vacuum chamber 2 to ensure that light can enter the interior of the vacuum chamber 2 to heat the surface of the device to be heated 5 .

[0030] In order to improve the efficiency of heating the device to be heated 5, two heating devices 1 may be provided, and the two heating devices 1 may be symmetrically arranged on both sides of the vacuum chamber 2. It can be understood that the two heating devices 1 are symmetrically arranged on both sides of the device to be heated 5, one of the heating devices 1 is used to heat one surface of the device to be heated 5, and the other heating device 1 is used to heat the other surface of the device to be heated 5, so that the two surfaces of the device to be heated 5 can be heated at the same time. In another embodiment, the number of heating devices 1 may not be limited.

[0031] More specifically, Figure 2 It is a schematic diagram of the annular heating zone formed by the heating device on the surface of the device to be heated. Figure 3 for Figure 2 Schematic diagram of energy distribution in the middle annular heating zone, see Figure 1 , Figure 2 and Figure 3The light reflected and converged by the above-mentioned heating device 1 can form a plurality of annular heating zones 50 on the surface of the device to be heated 5, and two adjacent annular heating zones 50 partially overlap, so that the plurality of annular heating zones 50 can completely cover the surface of the device to be heated 5, and then heat the device to be heated 5, wherein the width of each annular heating zone 50 and the energy of each annular heating zone 50 can be adjusted by adjusting the heating device 1, so that the uniformity of heating on the surface of the device to be heated 5 can be better, so as to ensure that the quality of the device to be heated 5 is better after being processed by the heating device 1. In addition, since the energy of each annular heating zone 50 gradually decreases from the center to the two sides, the two adjacent annular heating zones 50 partially overlap, not only can the plurality of annular heating zones 50 completely cover the surface of the device to be heated 5, but also the energy of the overlapping part can be increased, so that the temperature of each part of the overall heating area formed by each annular heating zone 50 is relatively uniform, so as to further improve the uniformity of the surface temperature of the device to be heated 5. In another embodiment, two adjacent annular heating zones 50 may not overlap each other; or a portion of two adjacent annular heating zones 50 may overlap each other, while another portion of two adjacent annular heating zones 50 may not overlap each other.

[0032] The heating device is described in detail below.

[0033] Figure 4 A top view of the heating device provided in the embodiment of the present application, referring to Figure 1 , Figure 2 and Figure 4 , Figure 1The dotted line is the central axis 4, and the direction of the arrow is the peripheral direction of the central axis 4. The heating device 1 may include multiple groups of circumferential heat radiation units, each group of circumferential heat radiation units may include at least three heat radiation units 10, at least three heat radiation units 10 are evenly arranged to form a regular polygon or a ring, and the plane where the regular polygon or the ring is located may be perpendicular to the central axis 4, and multiple groups of circumferential heat radiation units diffuse from the central axis 4 to the periphery of the central axis 4, wherein each group of circumferential heat radiation units is used to reflect and converge light to the device 5 to be heated, so as to heat at least part of the surface of the device 5 to be heated. Specifically, when setting each group of circumferential heat radiation units, among the at least three heat radiation units 10 included in each group of circumferential heat radiation units, the tail end of the previous heat radiation unit 10 corresponds to the head end of the next heat radiation unit 10, so that the at least three heat radiation units 10 form a regular polygon or a ring, and the light reflected and converged by the at least three heat radiation units 10 can form a regular polygon or a ring-shaped heating zone 50 on the surface of the device to be heated 5. By adjusting the at least three heat radiation units 10, the temperature and width of a heating zone 50 on the surface of the device to be heated 5 can be adjusted. Similarly, the heating zones 50 formed on the surface of the device to be heated 5 by other circumferential heat radiation units can also be adjusted accordingly, so that each heating zone 50 on the surface of the device to be heated 5 can be accurately controlled in temperature, so as to improve the uniformity of the surface temperature of the device to be heated 5 when the heating device 1 heats the device to be heated 5.

[0034] The number of heat radiation units 10 included in each group of circumferential heat radiation units can be adjusted according to actual conditions and is not specifically limited here.

[0035] More specifically, the light reflected and converged by multiple groups of circumferential heat radiation units can heat the entire surface of the device to be heated 5, that is, the multiple groups of circumferential heat radiation units form a plurality of approximately annular heating zones 50 on the surface of the device to be heated 5, and the plurality of approximately annular heating zones 50 formed on the surface of the device to be heated 5 also diffuse from the central axis to the edge of the device to be heated 5, and completely cover the surface of the device to be heated 5, so as to heat the device to be heated 5.

[0036] It is worth mentioning that the angle between the light reflected and converged by the circumferential heat radiation unit and the surface of the device to be heated 5 can be 30° to 150°, so as to ensure that the energy radiated by the light reflected and converged by the circumferential heat radiation unit can be irradiated onto the surface of the device to be heated 5. In another embodiment, the angle between the light reflected and converged by the circumferential heat radiation unit and the surface of the device to be heated 5 may not be limited in this way.

[0037] In the above embodiment, the light reflected and converged by two adjacent groups of circumferential heat radiation units can partially overlap on the surface of the device to be heated 5, so as to ensure that the light reflected and converged by multiple groups of circumferential heat radiation units on the surface of the device to be heated 5 can completely cover the surface of the device to be heated 5, prevent part of the device to be heated 5 from being radiated by light, and ensure the uniformity of the surface temperature of the device to be heated 5. It can be understood that the light reflected and converged by each group of heat radiation units 10 can form an approximately annular heating zone 50 on the surface of the device to be heated 5, and the two heating zones 50 formed by the light reflected and converged by the two adjacent groups of heat radiation units 10 on the surface of the device to be heated 5 partially overlap, ensuring that the surface of the device to be heated 5 can be completely radiated, so as to improve the uniformity of the surface temperature of the device to be heated 5 when the device to be heated 5 is heated. In addition, the light reflected and converged by the two adjacent groups of heat radiation units 10 on the surface of the device to be heated 5 partially overlaps, and the temperature of each part of the overall heating area formed by each annular heating zone 50 can also be relatively uniform, so as to further improve the uniformity of the surface temperature of the device to be heated 5.

[0038] Figure 5 This is a schematic diagram of the structure of the heat radiation unit in the heating device provided in the embodiment of the present application, referring to Figure 4 and Figure 5 The heat radiation unit 10 may include a reflector 12 and a radiation source 11, wherein the radiation source 11 may be, but is not limited to, a linear light source or an arc light source, wherein when the radiation source 11 is a linear light source, and each group of circumferential heat radiation units includes a large number of heat radiation units 10, the light reflected and converged by the multiple heat radiation units 10 in each group of circumferential heat radiation units may form an approximately annular heating zone 50 on the surface of the device to be heated 5. The reflector 12 is disposed on the side of the radiation source away from the device to be heated 5, and the reflector 12 has a reflecting surface 120, which may converge the light emitted by the radiation source 11 and reflect it toward the device to be heated. In this arrangement, the reflector 12 can converge the light emitted by the radiation source 11, and reflect the converged light to the designated area of ​​the device to be heated. When at least three heat radiation units 10 form a regular polygon, and at least three heat radiation units 10 form a group of circumferential heat radiation units, the light reflected and converged by at least three heat radiation units 10 will also form at least three radiation areas on the surface of the device to be heated, and at least three radiation areas also form a regular polygon on the surface of the device to be heated. The radiation areas of the enclosed regular polygon form a heating area reflected and converged by a group of heat radiation units 10. When each group of circumferential heat radiation units includes a large number of heat radiation units 10, the heating area formed by each group of heat radiation units 10 on the surface of the device to be heated is approximately annular. In another embodiment, the structure of the heat radiation unit 10 may not be limited to this.

[0039] It is worth mentioning that when regulating the temperature of the surface of the device to be heated, the temperature of the radiation area formed by the heat radiation unit 10 on the surface of the device to be heated can be adjusted by adjusting the power and the emission angle of the radiation source 11 in each heat radiation unit 10. Moreover, by controlling the emission angle of the light reflected and converged by the heat radiation unit 10, the width of the radiation area formed by the heat radiation unit 10 on the surface of the device to be heated can also be controlled, thereby controlling the size of the overlapping area of ​​the two adjacent groups of heat radiation units 10 on the surface of the device to be heated, so as to accurately regulate the temperature of the surface of the device to be heated; in addition, when adjusting the temperature of the heating zone formed by each group of circumferential heat radiation units in the device to be heated, the number of heat radiation units 10 included in each group of circumferential heat radiation units can be controlled to control the temperature of the heating area formed by each group of circumferential heat radiation units.

[0040] In the above-mentioned embodiment, the reflecting surface 120 of the reflector 12 can be but is not limited to an ellipsoid, a parabola or a hyperboloid. The ellipsoid, the parabola or the hyperboloid can reflect the light emitted by the linear light source toward the location of the device to be heated, and the light reflected by the ellipsoid, the parabola or the hyperboloid is approximately parallel, so as to improve the uniformity of heating on the surface of the device to be heated.

[0041] In the above-mentioned embodiment, the number of groups of circumferential heat radiation units can be specifically 2 to 5 groups, so that the light reflected and converged by 2 to 5 groups of circumferential heat radiation units can form 2 to 5 heating zones on the surface of the device to be heated, and the overlapping area of ​​two adjacent heating zones can be adjusted, that is, the mutual influence between the two adjacent heating zones is small. When the temperature in one of the heating zones is specifically adjusted, that is, a group of heat radiation units 10 corresponding to the heating zone is adjusted, and the heat radiation units 10 of other groups are relatively less affected by the response of the group of heat radiation units 10. Therefore, the influence on the heating zone formed by other groups of heat radiation units 10 in the device to be heated is relatively small, which is conducive to improving the uniformity and adjustability of the surface temperature of the device to be heated. In another embodiment, the number of groups of circumferential heat radiation units may not be limited to this, for example, it may be greater than or equal to 6 groups.

[0042] Specifically, the device to be heated may be, but is not limited to, a wafer.

[0043] Continue to refer to Figure 1 The heating device 1 may further include a mounting frame 20, the axis of the mounting frame 20 coincides with the central axis 4, that is, the mounting frame 20 is coaxially arranged with the supporting component 3. When multiple groups of circumferential heat radiation units are arranged on the mounting frame 20, in order to ensure that the light reflected and converged by each group of circumferential heat radiation units can form a regular polygon on the surface of the device to be heated 5, the multiple groups of circumferential heat radiation units can be diffused from the axis of the mounting frame 20 to the edge of the mounting frame 20 (which can be understood as Figure 1The heat radiation units diffuse in the direction of the arrow in the figure), and the interval between two adjacent groups of circumferential heat radiation units can be adjusted according to actual needs, that is, multiple groups of circumferential heat radiation units can be evenly distributed from the axis of the mounting frame 20 to the edge of the mounting frame 20, or multiple groups of circumferential heat radiation units can be unevenly distributed from the axis of the mounting frame 20 to the edge of the mounting frame 20.

[0044] When the mounting frame 20 is specifically set up, a plurality of groups of mounting openings may be provided on the mounting frame 20, and the plurality of groups of mounting openings may spread from the axis of the mounting frame 20 to the edge of the mounting frame 20, and each group of mounting openings may be installed with a group of circumferential heat radiation units, wherein each group of mounting openings may include a plurality of mounting openings, and each mounting opening may penetrate the mounting frame 20 along the thickness direction of the mounting frame 20 (i.e., the axial direction of the mounting frame 20), so that the light reflected and converged by the heat radiation unit 10 arranged in the mounting opening may directly irradiate the surface of the device 5 to be heated.

[0045] Specifically, when the heat radiation unit 10 is set at the installation port, each heat radiation unit 10 can be detachably installed at the installation port, so as to facilitate the debugging and replacement of each heat radiation unit 10; each heat radiation unit 10 can be detachably installed at the installation port in a variety of ways, which are not specifically limited here. In addition, in this setting method, the number of heat radiation units 10 in each group of circumferential heat radiation units can also be effectively controlled, so as to control the temperature of the surface of the heating device 5.

[0046] More specifically, the mounting frame 20 may include a first mounting portion 21 and a second mounting portion 22, the first mounting portion 21 and the second mounting portion 22 may be connected to each other, and the distance between the first mounting portion 21 and the device to be heated 5 is smaller than the distance between the second mounting portion 22 and the device to be heated 5, and at least one set of mounting openings are provided on the first mounting portion 21 and the second mounting portion 22. In this arrangement, the first mounting portion 21 and the second mounting portion 22 may be staggered in the direction of the central axis 4, thereby reducing the space occupied by the mounting frame 20 in the direction perpendicular to the central axis 4, thereby reducing the space occupancy rate of the entire heating device 1.

[0047] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heating device, characterized in that: The heating device is used to heat the device to be heated, and the device to be heated is placed on a supporting component that can rotate around a central axis. The heating device includes: A plurality of groups of circumferential heat radiation units, each group of the circumferential heat radiation units includes at least three heat radiation units, and the at least three heat radiation units are evenly arranged to form a regular polygon or a ring, and the plane where the regular polygon or the ring is located is perpendicular to the central axis; The plurality of circumferential heat radiation units diffuse from the central axis to the periphery of the central axis, wherein: Each group of the circumferential heat radiation units is used to reflect and converge light toward the device to be heated, so as to heat at least a portion of the surface of the device to be heated.

2. The heating device according to claim 1, characterized in that The light reflected and concentrated by the multiple groups of circumferential heat radiation units is used to heat the entire surface of the device to be heated.

3. The heating device according to claim 2, characterized in that The angle between the light reflected and converged by any group of the circumferential heat radiation units and the surface of the device to be heated is 30° to 150°.

4. The heating device according to any one of claims 1 to 3, characterized in that: The light reflected and converged by two adjacent groups of the circumferential heat radiation units partially overlap on the surface of the device to be heated.

5. The heating device according to any one of claims 1 to 3, characterized in that: The number of the multiple groups of circumferential heat radiation units is 2 to 5.

6. The heating device according to any one of claims 1 to 3, characterized in that: The heat radiation unit includes a reflector and a radiation source. The reflector is arranged on a side of the radiation source away from the device to be heated. The reflective surface of the reflector is used to converge the light emitted by the radiation source and reflect it toward the device to be heated.

7. The heating device according to claim 6, characterized in that The reflecting surface is an ellipsoid, a parabola or a hyperbolic surface.

8. The heating device according to claim 6, characterized in that The radiation source is a linear light source or an arc light source.

9. The heating device according to any one of claims 1 to 3, characterized in that: The heating device further comprises a mounting frame, the axis of the mounting frame coincides with the central axis, and the plurality of groups of circumferential heat radiation units diffuse from the axis of the mounting frame to the edge of the mounting frame.

10. The heating device according to claim 9, characterized in that Each of the heat radiation units is detachably arranged on the mounting frame.

11. A process treatment equipment, characterized in that: It comprises a vacuum chamber and at least one heating device as described in any one of claims 1 to 10, wherein the supporting component is arranged in the vacuum chamber, the device to be heated is arranged on the supporting component, the vacuum chamber is a light-transmitting vacuum chamber, and at least one heating device is arranged on one side of the vacuum chamber for heating the surface of the device to be heated.

12. The process equipment according to claim 11, characterized in that: There are two heating devices, which are respectively arranged on two sides of the vacuum chamber, and are respectively used to heat the two surfaces of the device to be heated.

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