Camera assembly and electronic equipment

Abstract

A camera assembly provided by the present invention comprises a lens, a support frame and a circuit board, the lens comprises a lens barrel and a heat absorption member, the lens barrel is provided with a heat dissipation groove, and the heat absorption member is accommodated in the heat dissipation groove; the supporting frame supports the lens barrel, and the supporting frame is provided with an accommodating cavity; the circuit board is provided with a photosensitive chip, the circuit board is connected to the side, away from the lens, of the supporting frame, the photosensitive chip is contained in the containing cavity, one end of the heat dissipation groove is communicated with the containing cavity, and the other opposite end of the heat dissipation groove penetrates through the outer surface of the lens barrel. The heat generated when the photosensitive chip works can be quickly transmitted out of the lens through the heat absorption piece, so that the heat dissipation efficiency of the photosensitive chip is greatly improved. The invention also provides an electronic device provided with the camera assembly.

Description

Technical Field

[0001] The present invention relates to the field of optical image devices, and in particular to a camera assembly and an electronic device provided with the camera assembly. Background Art

[0002] At present, fixed-focus cameras in some technologies generally include a lens, a base for supporting the lens, a circuit board and a heat sink, etc., wherein a plurality of lenses are arranged in the lens, the lens is arranged on the base, a photosensitive chip is arranged on the circuit board, the side of the base facing away from the lens is connected to the circuit board around the photosensitive chip by glue sealing, and the heat sink (such as a graphite sheet, etc.) is attached to the side of the circuit board facing away from the photosensitive chip; when the fixed-focus camera is working, the photosensitive chip is the heat source, and the heat generated by the photosensitive chip when working will be transferred to the inner cavity of the lens. Since the lens is sealed with glue and the barrel of the lens is a plastic part, the heat dissipation effect of the lens is poor, and the temperature inside the lens will rise rapidly. The temperature increase will cause the photosensitive plastic lens inside the lens to deform and loosen, resulting in blurred resolution. Current fixed-focus cameras generally use a heat sink attached to the side of the circuit board away from the photosensitive chip. However, the heat sink and the photosensitive chip are separated by materials with low heat dissipation efficiency such as the circuit board and glue, which causes the heat dissipation of the photosensitive chip to be slow and inefficient. The heat generated by the photosensitive chip cannot be dissipated in time, causing the internal temperature of the lens to continue to rise, resulting in thermal deformation of components such as the lens, changes in optical parameters and blurred resolution. Summary of the invention

[0003] The object of the present invention is to provide a camera assembly with better heat dissipation effect, and an electronic device provided with the camera assembly.

[0004] In order to solve the above technical problems, the present invention provides a camera assembly, which includes a lens, a support frame and a circuit board, the lens includes a lens barrel and a heat absorption component, the lens barrel is provided with a heat dissipation groove, and the heat absorption component is accommodated in the heat dissipation groove; the support frame supports the lens barrel, and the support frame is provided with a receiving cavity; a photosensitive chip is provided on the circuit board, the circuit board is connected to a side of the support frame away from the lens, the photosensitive chip is accommodated in the receiving cavity, one end of the heat dissipation groove is connected to the receiving cavity, and the other end of the heat dissipation groove passes through the outer surface of the lens barrel.

[0005] The present invention also provides an electronic device, which includes a shell, a mainboard arranged in the shell and a camera assembly, the camera assembly is arranged in the shell, the camera assembly includes a lens, a support frame and a circuit board, the lens includes a lens barrel and a heat absorption component, the lens barrel is provided with a heat dissipation groove, and the heat absorption component is accommodated in the heat dissipation groove; the support frame supports the lens barrel, and the support frame is provided with a receiving cavity; a photosensitive chip is provided on the circuit board, the circuit board is connected to a side of the support frame away from the lens, the photosensitive chip is accommodated in the receiving cavity, one end of the heat dissipation groove is connected to the receiving cavity, and the other end of the heat dissipation groove passes through the outer surface of the lens barrel, and the circuit board of the camera assembly is electrically connected to the mainboard.

[0006] One end of the heat absorbing component of the camera assembly provided by the present invention can directly contact the cold air outside the lens barrel, and the other end of the heat absorbing component can directly contact the hot air inside the lens. The heat absorbing component is made of materials with high heat absorption and thermal conductivity efficiency. Therefore, the heat generated by the photosensitive chip during operation can be quickly transferred to the outside of the lens through the heat absorbing component, so that the heat dissipation efficiency of the photosensitive chip is greatly improved, and the heat generated by the photosensitive chip can be reduced from being transferred to the inner cavity of the lens, thereby avoiding deformation of the lens inside the lens and preventing the deflection force from decreasing. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the implementation mode will be briefly introduced below. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0008] Figure 1 is a schematic diagram of the three-dimensional structure of a camera assembly provided by the first embodiment of the present invention;

[0009] Figure 2 yes Figure 1 A cross-sectional view of the camera assembly along line II-II;

[0010] Figure 3 yes Figure 2 An exploded diagram of the camera assembly in FIG.

[0011] Figure 4 is a schematic diagram of the three-dimensional structure of a camera assembly provided in a second embodiment of the present invention;

[0012] Figure 5 yes Figure 4 A cross-sectional view of the camera assembly along line VV;

[0013] Figure 6 yes Figure 5 An exploded diagram of the camera assembly in FIG.

[0014] Figure 7 is a schematic diagram of the three-dimensional structure of a camera assembly provided in a third embodiment of the present invention;

[0015] Figure 8 yes Figure 7 A cross-sectional view of the camera assembly along line VIII-VIII;

[0016] Fig. 9 yes Figure 8 An exploded diagram of the camera assembly in FIG.

[0017] Fig.10 is a schematic diagram of the three-dimensional structure of a camera assembly provided in a fourth embodiment of the present invention;

[0018] Fig.11 yes Fig.10 A cross-sectional view of the camera assembly along line XI-XI;

[0019] Fig.12 yes Fig.11 An exploded diagram of the camera assembly in FIG.

[0020] Fig.13 is a schematic diagram of the three-dimensional structure of a camera assembly provided in a fifth embodiment of the present invention;

[0021] Fig.14 yes Fig.13 A cross-sectional view of the camera assembly along line XIV-XIV;

[0022] Fig.15 yes Fig.14 An exploded diagram of the camera assembly in FIG.

[0023] Fig.16 is a schematic diagram of the three-dimensional structure of a camera assembly provided by a sixth embodiment of the present invention;

[0024] Fig.17 yes Fig.16 A cross-sectional view of the camera assembly along line XVII-XVII;

[0025] Fig.18 yes Fig.17 An exploded diagram of the camera assembly in FIG.

[0026] Fig.19 It is a schematic diagram of the three-dimensional structure of an electronic device provided by one embodiment of the present invention.

[0027] Description of main reference numerals: 100, camera assembly; 20, lens; 21, lens barrel; 201, bottom surface; 212, positioning portion; 2121, second front surface; 2124, outer side surface; 213, heat dissipation groove; 2132, first groove; 2134, second groove; 2135, first groove section; 2136, second groove section; 214, barrel; 2141, first front surface; 2143, first back surface; 2145, outer peripheral surface; 23, lens; 231, first lens; 233, second lens; 235, third lens; 237, fourth lens; 24, heat absorbing member; 241, first end surface; 242, first heat dissipation member part; 243, second end face; 244, second heat dissipation part; 2441, first heat dissipation bar; 2443, second heat dissipation bar; 245, side; 426, support step; 251, first support ring; 253, second support ring; 255, third support ring; 257, fourth support ring; 30, optical filter; 40, support frame; 42, receiving cavity; 421, positioning groove; 423, avoidance groove; 425, through groove; 43, third front side; 45, third back side; 60, circuit board; 62, photosensitive chip; 64, conductive wire; 80, heat sink; 400, housing; 500, motherboard; 600, display screen. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In addition, the following descriptions of the various embodiments are made with reference to the attached drawings to illustrate specific embodiments that the present application may be implemented in. Directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] See also Figures 1 to 3 The camera assembly 100 provided by the first embodiment of the present invention includes a lens 20, a support frame 40, a circuit board 60 and a heat sink 80. The lens 20 includes a lens barrel 21, a plurality of lenses 23 and a heat absorbing member 24. The lens barrel 21 is provided with a heat dissipation groove 213. The plurality of lenses are positioned in the lens barrel 21 at intervals. The support frame 40 is used to support the lens 20. The support frame 40 is provided with a receiving cavity 42. The receiving cavity 42 passes through the front and back sides of the support frame 40 along the axial direction of the lens barrel 21. The circuit board 60 is provided with a photosensitive chip 62 and a conductive line 64. The board 60 is connected to the side of the support frame 40 away from the lens 20, the photosensitive chip 62 is accommodated in the receiving cavity 42, one end of the conductive wire 64 is connected to the photosensitive chip 62, and the other end of the conductive wire 64 away from the photosensitive chip 62 is connected to the pad on the circuit board 60, one end of the heat dissipation groove 213 is connected to the receiving cavity 42, and the other end of the heat dissipation groove 213 passes through the outer surface of the lens barrel 21, one end of the heat absorbing member 24 in the heat dissipation groove 213 can directly contact with the cold air outside the lens 20, and the other end of the heat absorbing member 24 can directly contact with the hot air in the lens barrel 21. When the camera assembly 100 is working, the heat generated by the photosensitive chip 62 during operation is transferred to the receiving cavity 42, so that the air in the receiving cavity 42 becomes hot air, and one end of the heat absorbing member 24 performs heat exchange with the hot air in the receiving cavity 42, so that the heat is transferred to the heat absorbing member 24, and the heat on the heat absorbing member 24 is then heat exchanged with the cold air outside the lens barrel 21, so as to achieve high-efficiency heat dissipation of the photosensitive chip 62. It can be understood that the heat absorbing element 24 is made of a material with high heat absorption and thermal conductivity efficiency. Specifically, the heat absorbing element 24 can be made of but not limited to iron, steel, aluminum, copper, silver, silicon carbide, graphite, carbon black, polyethylene, polypropylene, polystyrene and other polymers, iron oxide, titanium dioxide and other oxide materials, etc.

[0032] Optionally, the lens barrel 21 may be hollowed out to form a heat sink 213, and a heat sink 213 may be filled with a heat sink material to form a heat absorber 24. Specifically, the heat sink material is dispensed into the heat sink 213 by a dispensing machine, and the heat sink 24 is formed after the heat sink material is cured; or the heat sink material is secondary-injected into the heat sink 213 of the lens barrel 21 by an injection molding machine to form the heat absorber 24.

[0033] It can be understood that the number of heat dissipation grooves 213 and the number of heat absorption components 24 on the lens barrel 21 can be set as needed. For example, if the lens barrel 21 is provided with a heat dissipation groove 213, the number of heat absorption components 24 is one, and one heat absorption component 24 is positioned at one heat dissipation groove 213; if the lens barrel 21 is provided with two heat dissipation grooves 213, the number of heat absorption components 24 is two, the two heat dissipation grooves 213 are located at opposite ends of the radial direction of the lens barrel 21, and the two heat absorption components 24 are respectively positioned at the two heat dissipation grooves 213; if the lens barrel 21 is provided with three heat dissipation grooves 213, the number of heat absorption components 24 is three, the three heat dissipation grooves 213 are arranged at intervals along the circumference of the lens barrel 21, and the three heat absorption components 24 are respectively positioned at the three heat dissipation grooves 213; if the lens barrel 21 is provided with more than three heat dissipation grooves 213, the number of heat absorption components 24 is the same as the number of heat dissipation grooves 213, more than three heat dissipation grooves 213 are arranged at intervals along the circumference of the lens barrel 21, and multiple heat absorption components 24 are respectively positioned at corresponding heat dissipation grooves 213. In this embodiment, the lens barrel 21 is provided with four heat dissipation slots 213, the number of heat absorbing members 24 is four, the four heat dissipation slots 213 are evenly spaced in a circle along the circumference of the lens barrel 21, and the four heat absorbing members 24 are respectively positioned at the four heat dissipation slots 213. In other embodiments, the lens barrel 21 is provided with a plurality of heat dissipation slots 213, the number of heat absorbing members 24 is multiple, the plurality of heat dissipation slots 213 are evenly spaced in a circle along the circumference of the lens barrel 21, and the plurality of heat absorbing members 24 are respectively positioned at the plurality of heat dissipation slots 213.

[0034] One end of the heat absorbing member 24 of the camera assembly 100 provided by the present invention can directly contact the cold air outside the lens barrel 21, and the other end of the heat absorbing member 24 can directly contact the hot air inside the lens 20, and the heat absorbing member 24 is made of a material with high thermal conductivity. Therefore, the heat generated by the photosensitive chip 62 when working is transferred to the lens barrel 21. When the heat is transferred to the heat absorbing member 24, the heat will be continuously absorbed by the heat absorbing member 24, and can be quickly transferred to the outside of the lens 20 through the heat absorbing member 24 to cool the lens barrel 21, so that the heat dissipation efficiency of the photosensitive chip 62 is greatly improved, and the heat generated by the photosensitive chip 62 can be reduced. The heat transferred to the inner cavity of the lens 20 can be reduced, avoiding deformation of the lens inside the lens 20 and preventing the deflection force from decreasing, so as to solve the problem of decreased deflection force of the camera assembly 100 caused by heat accumulation when the photosensitive chip 62 is working for a long time.

[0035] Optionally, the lens 20 has a bottom surface 201 facing the support frame 40, and one end of the heat dissipation groove 213 passes through the bottom surface 201, so that the heat dissipation groove 213 is connected to the accommodating cavity 42; the lens 20 includes a positioning portion 212 and a barrel 214 connected to the positioning portion 212, the positioning portion 212 is positioned on the support frame 40, and the heat dissipation groove 213 is provided on the barrel 214 and / or the positioning portion 212. In this embodiment, the heat dissipation groove 213 is provided on the barrel 214, and optionally, a plurality of heat dissipation grooves 213 are provided on the barrel 214, and the plurality of heat dissipation grooves 213 are arranged along the circumference of the barrel 214, and the plurality of heat absorbing members 24 are respectively accommodated in the plurality of heat dissipation grooves 213. In this embodiment, four heat dissipation grooves 213 are provided on the cylinder 214, and the four heat dissipation grooves 213 are evenly spaced and arranged in a circle along the circumference of the lens barrel 21. One end of each heat dissipation groove 213 passes through the surface of the cylinder 214 facing the support frame 40 so that the heat dissipation groove 213 is connected to the accommodating cavity 42, and the other end of the heat dissipation groove 213 passes through the outer surface of the cylinder 214; the four heat absorption components 24 are respectively accommodated in the four heat dissipation grooves 213. The positioning portion 212 is arranged around one end of the barrel 214. The barrel 214 includes a first front face 2141, a first back face 2143, and an outer peripheral surface 2145 connected between the first front face 2141 and the first back face 2143; the first back face 2143 faces the receiving cavity 42, and one end of the heat dissipation groove 213 passes through the surface of the barrel 214 facing the receiving cavity 42, that is, one end of the heat dissipation groove 213 passes through the first back face 2143 and connects to the receiving cavity 42, and the other end of the heat dissipation groove 213 at least passes through the first front face 2141 and connects to the cold air outside the lens barrel 21. The positioning portion 212 includes a second front face 2121, a second back face away from the second front face 2121, and an outer side face 2124 connected between the second front face 2121 and the second back face, and the second back face of the positioning portion 212 is coplanar with the bottom face 201. In this embodiment, the bottom face 201, the first back face 2143 and the second back face of the positioning portion 212 are coplanar. In other embodiments, the first back surface 2143 and the bottom surface 201 may not be coplanar, such as the first back surface 2143 is closer to or farther away from the support frame 40 than the bottom surface 201 .

[0036] Optionally, the heat dissipation groove 213 extends along the axial direction of the cylinder 214, a section of the heat dissipation groove 213 away from the photosensitive chip 62 passes through the outer surface of the cylinder 214, and a section of the heat absorption member 24 away from the photosensitive chip 62 is exposed to the outer surface of the cylinder 214. Specifically, a section of the heat dissipation groove 213 away from the photosensitive chip 62 passes through the outer peripheral surface 2145 and / or the first front surface 2141 of the cylinder 214, and a section of the heat absorption member 24 away from the photosensitive chip 62 is exposed to the outer peripheral surface 2145 and / or the first front surface 2141 of the cylinder 214. In this embodiment, the heat dissipation groove 213 is a linear groove, a section of the heat dissipation groove 213 away from the photosensitive chip 62 passes through the outer peripheral surface 2145 and the first front surface 2141 of the cylinder 214; a section of the heat absorption member 24 away from the photosensitive chip 62 is exposed to the outer peripheral surface 2145 and the first front surface 2141 of the cylinder 214. In other embodiments, one end of the heat dissipation groove 213 facing away from the support frame 40 passes through the outer peripheral surface 2145, and a section of the heat absorption component 24 away from the photosensitive chip 62 is exposed outside the outer peripheral surface 2145 of the cylinder 214; or one end of the heat dissipation groove 213 facing away from the support frame 40 passes through the first front side 2141, and a section of the heat absorption component 24 away from the photosensitive chip 62 is exposed outside the first front side 2141 of the cylinder 214.

[0037] In this embodiment, the heat sink 213 is a rectangular groove, the heat absorption element 24 is a rectangular strip, and the heat absorption element 24 includes a first end face 241, a second end face 243, and a side face 245 connected between the first end face 241 and the second end face 243; when the heat absorption element 24 is positioned at the heat sink 213, the first end face 241 exposes the first back face 2143, preferably, the first end face 241 and the first back face 2143 are coplanar; the second end face 243 exposes the first front face 2141, preferably, the second end face 243 and the first front face 2141 are coplanar; the side face 245 exposes the outer peripheral surface 2145, preferably, the side face 245 and the outer peripheral surface 2145 are coplanar.

[0038] In other embodiments, the heat dissipation groove 213 may be, but is not limited to, a circular groove, a polygonal groove, or an elliptical groove, etc., and the heat absorption element 24 may be, but is not limited to, a circular bar, a polygonal bar, or an elliptical bar, etc.

[0039] like Figure 2 and Figure 3As shown, the plurality of lenses 23 include a first lens 231, a second lens 233, a third lens 235 and a fourth lens 237; the first lens 231, the second lens 233, the third lens 235 and the fourth lens 237 are arranged from the object image to the image along the axis L, and the first lens 231, the second lens 233, the third lens 235 and the fourth lens 237 are coaxial. A first support ring 251 is sandwiched between the first lens 231 and the second lens 233, a second support ring 253 is sandwiched between the second lens 233 and the third lens 235, a third support ring 255 is sandwiched between the third lens 235 and the fourth lens 237, and a fourth support ring 257 is provided around the side of the fourth lens 237 away from the third lens 235. The lens 20 and the support frame 40 are fixedly connected by a connecting glue 70, and the connecting glue 70 can be but is not limited to fixing glue, double-sided tape, etc. In this embodiment, the bottom surface of the positioning portion 212 is connected to the front surface of the support frame 40 by fixing glue.

[0040] Optionally, the support frame 40 includes a third front side 43 and a third back side 45, the receiving cavity 42 is located in the middle of the support frame 40, and the opposite ends of the receiving cavity 42 pass through the third front side 43 and the third back side 45 respectively. The receiving cavity 42 includes a positioning groove 421 and a avoiding groove 423 located at opposite ends thereof, and a through groove 425 connecting the positioning groove 421 and the avoiding groove 423, and the positioning groove 421, the avoiding groove 423 and the through groove 425 share a central line; the side of the positioning groove 421 away from the avoiding groove 423 passes through the third front side 43, and the side of the avoiding groove 423 away from the positioning groove 421 passes through the third back side 45. The camera assembly 100 also includes an optical filter 30, which is located on the side of the support frame 40 away from the circuit board 60, and the middle of the photosensitive chip 62 faces the middle of the optical filter 30. Specifically, the optical filter 30 is positioned in the positioning groove 421, the touch-sensitive light chip 62 is accommodated in the avoidance groove 423, and the optical filter 30 is directly opposite to the touch-sensitive light chip 62. The opening area of ​​the positioning groove 421 is larger than the opening area of ​​the through groove 425, and the opening area of ​​the avoidance groove 423 is larger than the opening area of ​​the through groove 425, so that the support frame 40 forms a support step 426 between the positioning groove 421 and the through groove 425, and the support step 426 is used to support the optical filter 30.

[0041] In this embodiment, the support frame 40 is a rectangular frame, the positioning groove 421 is a circular groove, the avoidance groove 423 is a rectangular space, the through groove 425 is a circular groove, the axis of the positioning groove 421 is collinear with the axis of the through groove 425, the diameter of the positioning groove 421 is greater than the diameter of the through groove 425, and the length of the rectangular side of the avoidance groove 423 is greater than the diameter of the positioning groove 421. The optical filter 30 and the support frame 40 can be fixedly connected by, but not limited to, gluing or clamping. Specifically, the optical filter 30 and the support step 426 can be fixedly connected by, but not limited to, gluing or clamping. In other embodiments, the optical filter 30 and the support frame 40 can also be integrated by injection molding. In its embodiment, the support frame 40 can be, but not limited to, a circular frame, an elliptical frame, a polygonal frame, etc.

[0042] Optionally, the circuit board 60 is rectangular, and the front side of the circuit board 60 is connected to the third back side 45 of the support frame 40. In other embodiments, the circuit board 60 may also be, but not limited to, a circular plate, an elliptical plate, or a polygonal plate.

[0043] The heat sink 80 is attached to the side of the circuit board 60 away from the photosensitive chip 62, and the heat sink 80 faces the photosensitive chip 62. The shape of the heat sink 80 is similar to that of the photosensitive chip 62, and the front area of ​​the heat sink 80 facing the circuit board 60 is larger than the back area of ​​the photosensitive chip 62 facing the circuit board 60. The heat sink 80 can be, but is not limited to, a graphite sheet, a high thermal conductivity silicone pad, a thermal conductive silicone sheet, etc. The heat sink 80 can assist in heat dissipation of the photosensitive chip 62.

[0044] When assembling the camera assembly 100, the heat absorbing member 24 is positioned in the heat dissipation groove 213. Specifically, the heat absorbing member 24 is formed integrally with the lens barrel 21. The optical filter 30 is positioned in the positioning groove 421 of the support frame 40. The bottom surface 201 of the positioning portion 212 is connected to the third front surface 43 of the support frame 40 through the connecting glue 70, so that the lens 23 faces the optical filter 30. The front surface of the circuit board 60 is connected to the third back surface 45 of the support frame 40, so that the lens 23, the optical filter 30 and the photosensitive chip 62 are co-centered. Then, the heat sink 80 is attached to the back surface of the circuit board 60 away from the photosensitive chip 62.

[0045] One end of the heat absorbing member 24 on the lens 20 of the camera assembly 100 of the present application is exposed to the receiving cavity 42, so that the heat absorbing member 24 can exchange heat with the hot air in the receiving cavity 42; a section of the heat absorbing member 24 away from the photosensitive chip 62 is exposed to the outer surface of the barrel 214, so that the heat absorbing member 24 can exchange heat with the cold air outside the lens 20. When the photosensitive chip 62 is working, the heat generated is transferred to the heat absorbing member 24, and then the heat is dissipated to the outside of the lens barrel 21 through the heat absorbing member 24; because the heat absorbing member 24 is a high thermal conductivity material, the efficiency of heat conduction and heat dissipation is high, thereby greatly improving the heat dissipation efficiency of the photosensitive chip 62, reducing the heat generated by the photosensitive chip 62 from being transferred to the lens 20, preventing the lens 23 from deforming, and avoiding the reduction of resolution. The heat generated by the photosensitive chip 62 when working can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62. The camera assembly 100 of the present application can be used for but not limited to front-facing video or rear-facing video, etc. The heat generated by the photosensitive chip 62 during operation can be dissipated in a timely manner, which can effectively alleviate the deformation of the lens 23 caused by the increase in the temperature of the lens 20 and avoid the decrease in resolution, and can ensure that the front-facing view or rear-facing video is in clear focus for a long time and maintain normal resolution.

[0046] like Figure 4-Figure 6As shown, the structure of the camera assembly 100a in the second embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213a on the lens barrel 21 of the camera assembly 100a in the second embodiment and the shape of the heat absorption member 24a are different from the shape of the heat dissipation groove 213 on the lens barrel 21 of the camera assembly 100 in the first embodiment and the shape of the heat absorption member 24. In the second embodiment, the heat dissipation groove 213a includes a first groove 2132 and a second groove 2134 that are interconnected. The first groove 2132 is provided on the barrel 214, one end of the first groove 2132 is connected to the receiving cavity 42, the other end of the first groove 2132 passes through the outer surface of the barrel 214, and the end of the second groove 2134 away from the first groove 2132 passes through the outer surface of the positioning portion 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the cylinder 214, and a section of the first groove 2132 away from the circuit board 60 passes through the first front face 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the second groove 2134 is provided in the positioning portion 212, and one end of the second groove 2134 is connected to the first groove 2132, and the end of the second groove 2134 away from the first groove 2132 passes through the second front face 2121 and / or the outer side surface 2124 of the positioning portion 212. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front face 2141 and the outer peripheral surface 2145 of the cylinder 214, and the end of the second groove 2134 away from the first groove 2132 passes through the second front face 2121 and the outer side surface 2124 of the positioning portion 212. The second groove 2134 includes a first groove section 2135 and a second groove section 2136 that are connected to each other. At least one of the first groove section 2135 and the second groove section 2136 is connected to the first groove 2132. One end of the first groove section 2135 and the second groove section 2136 that are away from the first groove 2132 passes through the outer surface of the positioning portion 212. Specifically, the second groove 2134 is a "cross"-shaped groove. The length direction of the first groove section 2135 is perpendicular to the axis direction of the cylinder 214, and the length direction of the second groove section 2136 is parallel to the axis direction of the cylinder 214. One end of the first groove section 2135 is connected to the first groove 2132, and one end of the first groove section 2135 that is away from the first groove 2132 passes through the outer side surface 2124, and one end of the second groove section 2136 that is away from the first groove 2132 passes through the second front surface 2121.

[0047] The heat absorbing component 24a includes a first heat dissipation portion 242 and a second heat dissipation portion 244 which are interconnected. The first heat dissipation portion 242 is accommodated in the first groove 2132. One end of the first heat dissipation portion 242 is exposed from the surface of the cylinder 214 facing the accommodating cavity 42, that is, one end of the first heat dissipation portion 242 is exposed from the first back side 2143. A section of the first heat dissipation portion 242 away from the photosensitive chip 62 is exposed from the outer surface of the cylinder. Specifically, a section of the first heat dissipation portion 242 away from the circuit board 60 is exposed from the first front side 2141 and / or the outer peripheral surface 2145. The second heat dissipation portion 244 is accommodated in the second groove 2134. A portion of the second heat dissipation portion 244 away from the photosensitive chip is exposed from the outer surface of the positioning portion 212. Specifically, an end face of the second heat dissipation portion 244 away from the first heat dissipation portion 242 is exposed from the second front side 2121 and / or the outer side surface 2124 of the positioning portion 212. In this embodiment, the first heat dissipation portion 242 is a strip, and a section of the first heat dissipation portion 242 away from the circuit board 60 exposes the first front surface 2141 and the outer peripheral surface 2145, and the end surface of the second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the second front surface 2121 and the outer side surface 2124. The second heat dissipation portion 244 includes a first heat dissipation bar 2441 and a second heat dissipation bar 2443, the first heat dissipation bar 2441 is accommodated in the first slot section 2135, the second heat dissipation bar 2443 is accommodated in the second slot section 2136, and the end surface of the first heat dissipation bar 2441 and the second heat dissipation bar 2443 away from the first heat dissipation portion 242 exposes the outer surface of the positioning portion 212. Specifically, the second heat dissipation portion 244 is a "cross" shaped heat dissipation bar, the length direction of the first heat dissipation bar 2441 is perpendicular to the length direction of the first heat dissipation portion 242, the length direction of the second heat dissipation bar 2443 is parallel to the length direction of the first heat dissipation portion 242, the end surface of the first heat dissipation bar 2441 away from the first heat dissipation portion 242 is exposed to the outer side surface 2124; the second heat dissipation bar 2443 is positioned in the second slot section 2136, and the end surface of the second heat dissipation bar 2443 away from the first heat dissipation portion 242 is exposed to the second front surface 2121. Preferably, the end surface of the first heat dissipation portion 242 away from the circuit board 60 is coplanar with the first front surface 2141, the side surface of the first heat dissipation portion 242 is coplanar with the outer peripheral surface 2145, the end surface of the first heat dissipation bar 2441 away from the first heat dissipation portion 242 is coplanar with the outer side surface 2124, and the end surface of the second heat dissipation bar 2443 away from the first heat dissipation portion 242 is coplanar with the second front surface 2121.

[0048] In other embodiments, the length direction of the first groove 2132 can also be inclined to the axial direction of the lens barrel 21, and the length direction of the first heat dissipation portion 242 is consistent with the length direction of the first groove 2132; the length direction of the first groove section 2135 and the length direction of the second groove section 2136 can both be inclined to the radial direction of the lens barrel 21, the length direction of the first heat dissipation bar 2441 is consistent with the length direction of the first groove section 2135, and the length direction of the second heat dissipation bar 2443 is consistent with the length direction of the second groove section 2136.

[0049] The assembly method of the camera assembly 100a in the second embodiment is the same as the assembly method of the camera assembly 100 in the first embodiment, and will not be described again herein.

[0050] One end of the first heat sink 242 of the heat absorbing member 24a of the camera assembly 100a in the second embodiment is exposed to the receiving cavity 42, so that the first heat sink 242 can exchange heat with the hot air in the receiving cavity 42; a section of the first heat sink 242 away from the photosensitive chip 62 is exposed to the outer surface of the barrel 214, and one end of the second heat sink 244 is connected to the first heat sink 242, and the end surface of the second heat sink 244 away from the first heat sink 242 is exposed to the second front surface 2121 and the outer side surface 2124, so that the heat absorbing member 24a can exchange heat with the cold air outside the lens 20. When the photosensitive chip 62 is working, the heat generated is transferred to the first heat sink 242, and part of the heat is conducted to the second heat sink 244 through the first heat sink 242, and the heat on the first heat sink 242 and the heat on the second heat sink 244 are respectively exchanged with the cold air outside the lens barrel 21 for rapid heat dissipation. Since the heat absorbing member 24a is made of a high thermal conductivity material, the efficiency of heat conduction and heat dissipation is high, and the area of ​​heat exchange between the heat absorbing member 24a and the cold air outside the lens 20 is increased, the heat dissipation area is increased, and the heat dissipation speed is increased, which can greatly improve the heat dissipation efficiency of the photosensitive chip 62, and reduce the heat generated by the photosensitive chip 62 from being transferred to the lens 20, preventing the lens 23 from deforming and avoiding the reduction of resolution. The heat generated by the photosensitive chip 62 during operation can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62.

[0051] The camera assembly 100a in this embodiment can be used for but not limited to front-facing video or rear-facing video, etc. The heat generated by the photosensitive chip 62 during operation can be dissipated in time, which can effectively alleviate the deformation of the lens 23 caused by the increase in the temperature of the lens 20 and avoid the reduction in resolution, thereby ensuring that the front-facing view or rear-facing video is in clear focus for a long time and maintaining normal resolution.

[0052] Please also read Figure 7-Figure 9, the structure of the camera module 100b in the third embodiment of the present application is similar to that of the camera module 100 in the first embodiment. The differences are as follows: The shapes of the heat dissipation grooves 213b on the lens barrel 21 of the camera module 100b and the shape of the heat absorption member 24b in the third embodiment are different from the shapes of the heat dissipation grooves 213 on the lens barrel 21 of the camera module 100 and the shape of the heat absorption member 24 in the first embodiment. In the third embodiment, the heat dissipation groove 213b includes a first groove 2132 and a second groove 2134 that communicate with each other. The first groove 2132 is provided in the barrel body 214. One end of the first groove 2132 communicates with the accommodation cavity 42, and the opposite end of the first groove 2132 penetrates the outer surface of the barrel body 214. One end of the second groove 2134 away from the first groove 2132 penetrates the outer surface of the positioning portion 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the barrel body 214, and a section of the first groove 2132 away from the circuit board 60 penetrates the first front surface 2141 and / or the outer peripheral surface 2145 of the barrel body 214; the second groove 2134 is provided in the positioning portion 212. One end of the second groove 2134 communicates with the first groove 2132, and one end of the second groove 2134 away from the photosensitive chip 62 penetrates the second front surface 2121 and / or the outer side surface 2124 of the positioning portion 212. In this embodiment, one end of the first groove 2132 away from the circuit board 60 penetrates the first front surface 2141 and the outer peripheral surface 2145 of the barrel body 214, and one end of the second groove 2134 away from the first groove 2132 penetrates the second front surface 2121 and the outer side surface 2124 of the positioning portion 212; specifically, the second groove 2134 is a "plus" shaped groove. The second groove 2134 includes a first groove section 2135 and two second groove sections 2136 that communicate with each other. The length direction of the first groove section 2135 is perpendicular to the axis direction of the barrel body 214, the two second groove sections 2136 are parallel and spaced apart from each other, the length direction of the second groove section 2136 is parallel to the axis direction of the barrel body 214, one end of the first groove section 2135 away from the first groove 2132 penetrates the outer side surface 2124, and one end of the two second groove sections 2136 away from the first groove 2132 penetrates the second front surface 2121.

[0053] The heat absorption member 24b includes a first heat dissipation portion 242 and a second heat dissipation portion 244 that are interconnected. The first heat dissipation portion 242 is received in the first groove 2132. One end of the first heat dissipation portion 242 exposes the first back surface 2143, and a section of the first heat dissipation portion 242 facing away from the photosensitive chip 62 exposes the first front surface 2141 and / or the outer peripheral surface 2145. The second heat dissipation portion 244 is received in the second groove 2134, and the end surface of the second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the second front surface 2121 and / or the outer side surface 2124 of the positioning portion 212. In this embodiment, the first heat dissipation portion 242 is a strip-shaped bar, and a section of the first heat dissipation portion 242 away from the circuit board 60 exposes the first front surface 2141 and the outer peripheral surface 2145. The end surface of the second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the second front surface 2121 and the outer side surface 2124. In this embodiment, the second heat dissipation portion 244 is a "艹"-shaped heat dissipation strip. The second heat dissipation portion 244 includes a first heat dissipation strip 2441 and two second heat dissipation strips 2443. The first heat dissipation strip 2441 is received in the first groove section 2135, and the two second heat dissipation strips 2443 are respectively received in the two second groove sections 2136. The end surfaces of the first heat dissipation strip 2441 and the second heat dissipation strips 2443 away from the first heat dissipation portion 242 expose the outer surface of the positioning portion 212. Specifically, the length direction of the first heat dissipation strip 2441 is perpendicular to the length direction of the first heat dissipation portion 242, the length direction of the second heat dissipation strips 2443 is parallel to the length direction of the first heat dissipation portion 242, and the end surface of the first heat dissipation strip 2441 facing away from the first heat dissipation portion 242 exposes the outer side surface 2124. The end surfaces of the two second heat dissipation strips 2443 facing away from the first heat dissipation portion 242 both expose the second front surface 2121. Preferably, the end surface of the first heat dissipation portion 242 facing away from the circuit board 60 is coplanar with the first front surface 2141, the side surface of the first heat dissipation portion 242 is coplanar with the outer peripheral surface 2145, the end surface of the first heat dissipation strip 2441 facing away from the first heat dissipation portion 242 is coplanar with the outer side surface 2124, and the end surfaces of the two second heat dissipation strips 2443 away from the first heat dissipation portion 242 are coplanar with the second front surface 2121.

[0054] The assembling method of the camera module 100b in the third embodiment is the same as that of the camera module 100 in the first embodiment, and will not be described in detail here.

[0055] When the photosensitive chip 62 of the camera assembly 100b in the third embodiment is working, the heat generated is transferred to the first heat dissipation part 242, and part of the heat is transferred to the second heat dissipation part 244 through the first heat dissipation part 242. The heat on the first heat dissipation part 242 and the heat on the second heat dissipation part 244 are respectively heat-exchanged with the cold air outside the lens barrel 21 to quickly dissipate heat. Since the heat absorbing member 24b is a high thermal conductivity material, the efficiency of heat conduction and heat dissipation is high, and the area of ​​heat exchange between the heat absorbing member 24b and the cold air outside the lens 20 is increased, which can greatly improve the heat dissipation efficiency of the photosensitive chip 62, and can reduce the heat generated by the photosensitive chip 62 from being transferred to the lens 20, prevent the lens 23 from being deformed, and avoid the reduction of resolution. The heat generated by the photosensitive chip 62 when working can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62.

[0056] In other embodiments, the second groove 2134 may include more than three second groove sections 2136 spaced parallel to each other, and more than two first groove sections 2135 spaced parallel to each other, the more than two first groove sections 2135 are connected to the more than three second groove sections 2136, and one end of the first groove section 2135 is connected to the first groove 2132.

[0057] Please also read Figure 10-12 The structure of the camera assembly 100c in the fourth embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213c on the lens barrel 21 and the shape of the heat absorption member 24c of the camera assembly 100c in the fourth embodiment are different from the shape of the heat dissipation groove 213 on the lens barrel 21 and the shape of the heat absorption member 24 of the camera assembly 100 in the first embodiment. In the fourth embodiment, the heat dissipation groove 213c includes a first groove 2132 and a second groove 2134 that are connected to each other. The first groove 2132 is provided on the barrel 214, one end of the first groove 2132 is connected to the receiving cavity 42, and the other end of the first groove 2132 passes through the outer surface of the barrel 214, and the second groove 2134 is provided on the second front surface 2121 of the positioning portion 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the cylinder 214, and a section of the first groove 2132 away from the circuit board 60 passes through the first front face 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the length direction of the second groove 2134 is parallel to the radial direction of the cylinder 214, one end of the second groove 2134 is connected to the first groove 2132, and the end of the second groove 2134 away from the first groove 2134 passes through the outer side surface 2124 of the positioning portion 212. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front face 2141 and the outer peripheral surface 2145 of the cylinder 214, and the second groove 2134 passes through the second front face 2121 and the outer side surface 2124 of the positioning portion 212.

[0058] The heat absorbing member 24c includes a first heat dissipation portion 242 and a second heat dissipation portion 244 connected to each other. The first heat dissipation portion 242 is accommodated in the first groove 2132. One end of the first heat dissipation portion 242 exposes the first back surface 2143. A section of the first heat dissipation portion 242 away from the circuit board 60 exposes the first front surface 2141 and / or the outer peripheral surface 2145. The second heat dissipation portion 244 is accommodated in the second groove 2134. The end surface of the second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the outer side surface 2124 of the positioning portion 212. The side surface of the second heat dissipation portion 244 away from the circuit board 60 exposes the second front surface 2121. In this embodiment, the first heat dissipation portion 242 is a strip. A section of the strip away from the circuit board 60 exposes the first front surface 2141 and the outer peripheral surface 2145. The side surface of the second heat dissipation portion 244 and the end surface away from the first heat dissipation portion 242 both expose the second front surface 2121 and the outer side surface 2124. In this embodiment, the length direction of the first heat dissipation portion 242 is parallel to the axial direction of the cylinder 214, and the length direction of the second heat dissipation portion 244 is perpendicular to the length direction of the first heat dissipation portion 242. Preferably, the end surface of the first heat dissipation portion 242 facing away from the circuit board 60 is coplanar with the first front surface 2141, the side surface of the first heat dissipation portion 242 is coplanar with the outer peripheral surface 2145, the end surface of the second heat dissipation portion 244 facing away from the first heat dissipation portion 242 is coplanar with the outer side surface 2124, and the side surface of the second heat dissipation portion 244 facing the first heat dissipation portion 242 is coplanar with the second front surface 2121.

[0059] The assembly method of the camera assembly 100c in the fourth embodiment is the same as the assembly method of the camera assembly 100 in the first embodiment, and will not be described again herein.

[0060] When the photosensitive chip 62 of the camera assembly 100c in the fourth embodiment is working, the heat generated is transferred to the first heat dissipation part 242, and part of the heat is transferred to the second heat dissipation part 244 through the first heat dissipation part 242. The heat on the first heat dissipation part 242 and the heat on the second heat dissipation part 244 are respectively heat exchanged with the cold air outside the lens barrel 21 to quickly dissipate heat. Since the heat absorbing member 24b is a high thermal conductivity material, the efficiency of heat conduction and heat dissipation is high, and the area of ​​heat exchange between the heat absorbing member 24c and the cold air outside the lens 20 is increased, which can greatly improve the heat dissipation efficiency of the photosensitive chip 62, and can reduce the heat generated by the photosensitive chip 62 from being transferred to the lens 20, prevent the lens 23 from being deformed, and avoid the reduction of resolution. The heat generated by the photosensitive chip 62 when working can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62.

[0061] Please also read Figure 13-Figure 15The structure of the camera assembly 100d in the fifth embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213d on the lens barrel 21 and the shape of the heat absorption member 24d of the camera assembly 100d in the fifth embodiment are different from the shape of the heat dissipation groove 213 on the lens barrel 21 and the shape of the heat absorption member 24 of the camera assembly 100 in the first embodiment. In the fifth embodiment, the heat dissipation groove 213d includes a first groove 2132 and a second groove 2134 that are connected to each other. The first groove 2132 is provided on the barrel 214, one end of the first groove 2132 is connected to the receiving cavity 42, an opposite section of the first groove 2132 passes through the outer surface of the barrel 214, and the second groove 2134 is provided on the outer surface of the positioning portion 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the cylinder 214, and a section of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the second groove 2134 is L-shaped, and the second groove 2134 includes a first groove section 2135 and a second groove section 2136 that are connected to each other, one end of the first groove section 2135 is connected to the first groove 2132, the first groove section 2135 is arranged on the second front surface 2121, one end of the second groove section 2136 is connected to an end of the first groove 2132 away from the first groove 2132, and the second groove section 2136 is arranged on the outer side surface 2124. Specifically, the length direction of the first groove section 2135 is perpendicular to the axis L of the cylinder 214, and the length direction of the second groove section 2136 is parallel to the length direction of the first groove 2132. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front side 2141 and the outer peripheral surface 2145 of the barrel 214, and the second groove 2134 passes through the second front side 2121 and the outer side surface 2124 of the positioning portion 212. Specifically, the first groove section 2135 passes through the second front side 2121, and the second groove section 2136 extends to the bottom surface 201 of the lens barrel 21 away from the end of the first groove section 2135.

[0062] The heat absorbing component 24d includes a first heat dissipation portion 242 and a second heat dissipation portion 244 which are interconnected. The first heat dissipation portion 242 is accommodated in the first groove 2132, one end of the first heat dissipation portion 242 is exposed to the first back surface 2143, and a section of the first heat dissipation portion 242 which is away from the circuit board 60 is exposed to the first front surface 2141 and / or the outer peripheral surface 2145; the second heat dissipation portion 244 is accommodated in the second groove 2134, the second heat dissipation portion 244 is exposed to the outer surface of the positioning portion 212, and the surface of the second heat dissipation portion 244 which is away from the positioning portion 212 is exposed to the second groove 2134. In this embodiment, the first heat dissipation portion 242 is a strip, and a section of the strip away from the circuit board 60 exposes the first front surface 2141 and the outer peripheral surface 2145. The second heat dissipation portion 244 includes a first heat dissipation bar 2441 and a second heat dissipation bar 2443. One end of the first heat dissipation bar 2441 is connected to the first heat dissipation portion 242, and one end of the second heat dissipation bar 2443 is connected to an end of the first heat dissipation bar 2441 away from the first heat dissipation portion 242. In this embodiment, the length direction of the first heat dissipation portion 242 is parallel to the axial direction of the cylinder 214, the first heat dissipation bar 2441 is perpendicular to the first heat dissipation portion 242, and the length direction of the second heat dissipation bar 2443 is parallel to the length direction of the first heat dissipation portion 242. Preferably, the end surface of the first heat dissipation portion 242 facing away from the circuit board 60 is coplanar with the first front surface 2141, the side surface of the first heat dissipation portion 242 is coplanar with the outer peripheral surface 2145, the side surface of the first heat dissipation bar 2441 facing away from the positioning portion 212 is coplanar with the second front surface 2121, and the side surface of the second heat dissipation bar 2443 facing away from the positioning portion 212 is coplanar with the outer side surface 2124.

[0063] The assembly method of the camera assembly 100d in the fifth embodiment is the same as the assembly method of the camera assembly 100 in the first embodiment, and will not be described again herein.

[0064] When the photosensitive chip 62 of the camera assembly 100d in the fifth embodiment is working, the heat generated is transferred to the first heat dissipation part 242, and part of the heat is conducted to the first heat dissipation bar 2441 and the second heat dissipation bar 2443 through the first heat dissipation part 242. The heat on the first heat dissipation part 242, the heat on the first heat dissipation bar 2441 and the second heat dissipation bar 2443 are respectively heat exchanged with the cold air outside the lens barrel 21 to quickly dissipate heat. Since the heat absorbing member 24d is a high thermal conductivity material, the efficiency of heat conduction and heat dissipation is high, and the area of ​​heat exchange between the heat absorbing member 24d and the cold air outside the lens 20 is increased, which can greatly improve the heat dissipation efficiency of the photosensitive chip 62, and can reduce the heat generated by the photosensitive chip 62 from being transferred to the lens 20, prevent the lens 23 from being deformed, and avoid the reduction of resolution. The heat generated by the photosensitive chip 62 when working can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62.

[0065] Please also read Figure 16-18The structure of the camera assembly 100e in the sixth embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213e on the lens barrel 21 of the camera assembly 100e in the sixth embodiment and the shape of the heat absorption member 24e are different from the shape of the heat dissipation groove 213 on the lens barrel 21 and the shape of the heat absorption member 24 of the camera assembly 100 in the first embodiment. In the sixth embodiment, the heat dissipation groove 213e includes a first groove 2132 and two second grooves 2134 that are interconnected. The first groove 2132 is provided in the barrel 214, one end of the first groove 2132 is connected to the receiving cavity 42, and the other end of the first groove 2132 passes through the outer surface of the barrel 214. The two second grooves 2134 are both provided in the positioning portion 212, one end of each second groove 2134 passes through the first groove 2132, and the other end of each second groove 2134 passes through the outer side surface 2124. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the cylinder 214, and a section of the first groove 2132 away from the circuit board 60 passes through the first front face 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the length direction of the second groove 2134 is parallel to the radial direction of the cylinder 214. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front face 2141 and the outer peripheral surface 2145 of the cylinder 214, and the end of the second groove 2134 away from the first groove 2132 passes through the outer side surface 2124.

[0066] The heat absorbing member 24e includes a first heat dissipation portion 242 and two second heat dissipation portions 244 connected to each other. The first heat dissipation portion 242 is accommodated in the first groove 2132. One end of the first heat dissipation portion 242 exposes the first back surface 2143. A section of the first heat dissipation portion 242 away from the circuit board 60 exposes the first front surface 2141 and / or the outer peripheral surface 2145. The two second heat dissipation portions 244 are accommodated in the two second grooves 2134 respectively. The end surface of each second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the outer side surface 2124 of the positioning portion 212. The end surface of each second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the outer side surface 2124. In this embodiment, the first heat dissipation portion 242 is a strip, and a section of the strip away from the circuit board 60 exposes the first front surface 2141 and the outer peripheral surface 2145. The second heat dissipation portion 244 is a strip, and the end surface of the second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the outer side surface 2124. In this embodiment, the length direction of the first heat dissipation portion 242 is parallel to the axial direction of the cylinder 214, and the length direction of the second heat dissipation portion 244 is perpendicular to the length direction of the first heat dissipation portion 242. Preferably, the end surface of the first heat dissipation portion 242 facing away from the circuit board 60 is coplanar with the first front surface 2141, the side surface of the first heat dissipation portion 242 is coplanar with the outer peripheral surface 2145, and the end surface of the second heat dissipation portion 244 facing away from the first heat dissipation portion 242 is coplanar with the outer side surface 2124.

[0067] The assembly method of the camera assembly 100e in the sixth embodiment is the same as the assembly method of the camera assembly 100 in the first embodiment, and will not be repeated here.

[0068] When the photosensitive chip 62 of the camera assembly 100e in the sixth embodiment is working, the heat generated is transferred to the first heat dissipation part 242, and part of the heat is conducted to the two second heat dissipation parts 244 through the first heat dissipation part 242. The heat on the first heat dissipation part 242 and the heat on the two second heat dissipation parts 244 are respectively heat exchanged with the cold air outside the lens barrel 21 to quickly dissipate heat. Since the heat absorbing member 24e is a high thermal conductivity material, the efficiency of heat conduction and heat dissipation is high, and the area of ​​heat exchange between the heat absorbing member 24e and the cold air outside the lens 20 is increased, which can greatly improve the heat dissipation efficiency of the photosensitive chip 62, and can reduce the heat generated by the photosensitive chip 62 from being transferred to the lens 20, prevent the lens 23 from being deformed, and avoid the reduction of resolution. The heat generated by the photosensitive chip 62 when working can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62.

[0069] like Fig.19 As shown, the present invention also provides an electronic device, which includes a housing 400, a mainboard 500 disposed in the housing 400, a display screen 600 disposed on the front of the housing 400, and a camera assembly 100 in any of the above embodiments, wherein the camera assembly 100 is disposed in the housing 400, and the camera assembly 100 and the display screen 600 are electrically connected to the mainboard 500, respectively. In this embodiment, the electronic device is a mobile phone, and the camera assembly 100 is a front lens on the mobile phone. Since the heat generated by the photosensitive chip of the camera assembly 100 is heat-exchanged with the heat absorbing element, the heat on the heat absorbing element is directly heat-exchanged with the cold air outside the lens, so that the heat dissipation efficiency of the lens 20 is higher, thereby further improving the heat dissipation efficiency of the photosensitive chip, reducing the heat generated by the photosensitive chip from being transferred to the lens, preventing the lens from being deformed, and avoiding a decrease in resolution. In other embodiments, the camera assembly may also be a rear lens.

[0070] In other embodiments, the camera assembly may also be, but is not limited to, any electronic device that requires a lens, such as a tablet computer, a display screen, a smart TV, an electronic watch, a smart bracelet, etc.

[0071] The above is an implementation of the embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiment of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A camera assembly, characterized in that: The camera assembly comprises: The lens comprises a lens barrel and a heat absorbing member, the lens barrel is provided with a heat dissipation groove, and the heat absorbing member is accommodated in the heat dissipation groove; A support frame, the support frame supports the lens barrel, the support frame is provided with a receiving cavity; and A circuit board is provided with a photosensitive chip, the circuit board is connected to a side of the support frame away from the lens, the photosensitive chip is accommodated in the receiving cavity, one end of the heat dissipation groove is connected to the receiving cavity, and the other end of the heat dissipation groove passes through the outer surface of the lens barrel.

2. The camera assembly according to claim 1, characterized in that: The lens barrel comprises a positioning portion and a barrel body connected to the positioning portion, the positioning portion is positioned on the support frame, and the heat dissipation groove is arranged on the barrel body and / or the positioning portion.

3. The camera assembly according to claim 2, characterized in that: The heat dissipation groove extends along the axial direction of the cylinder, a section of the heat dissipation groove away from the photosensitive chip passes through the outer surface of the cylinder, and a section of the heat absorption component away from the photosensitive chip is exposed outside the outer surface of the cylinder.

4. The camera assembly according to claim 2, characterized in that: The heat dissipation groove extends along the axial direction of the cylinder, a section of the heat dissipation groove away from the photosensitive chip passes through the outer peripheral surface and / or the first front surface of the cylinder, and a section of the heat absorption component away from the photosensitive chip is exposed to the outer peripheral surface and / or the first front surface of the cylinder.

5. The camera assembly according to claim 2, characterized in that: The heat dissipation groove includes a first groove and a second groove which are connected to each other. The first groove is arranged on the cylinder, one end of the first groove is connected to the accommodating cavity, the other end of the first groove passes through the outer surface of the cylinder, and the end of the second groove away from the first groove passes through the outer surface of the positioning portion.

6. The camera assembly according to claim 5, characterized in that: The heat absorbing component includes a first heat dissipation part and a second heat dissipation part which are connected to each other. The first heat dissipation part is accommodated in the first groove, one end of the first heat dissipation part is exposed outside the surface of the cylinder facing the accommodating cavity, and a section of the first heat dissipation part away from the photosensitive chip is exposed outside the outer surface of the cylinder; the second heat dissipation part is accommodated in the second groove, and a part of the second heat dissipation part away from the photosensitive chip is exposed outside the outer surface of the positioning part.

7. The camera assembly according to claim 6, characterized in that: One end face of the first heat dissipation portion is coplanar with the surface of the cylinder facing the accommodating cavity, the end face of the first heat dissipation portion facing away from the circuit board is coplanar with the first front face, the side face of the first heat dissipation portion is coplanar with the outer peripheral surface of the cylinder, and an end of the second heat dissipation portion away from the first heat dissipation portion is exposed to the second front face and / or outer side face of the positioning portion.

8. The camera assembly according to claim 6, characterized in that: The second groove includes a first groove section and a second groove section that are interconnected, at least one of the first groove section and the second groove section is connected to the first groove, and one end of the first groove section and the second groove section that are away from the first groove passes through the outer surface of the positioning portion; the second heat dissipation portion includes a first heat dissipation bar and a second heat dissipation bar, the first heat dissipation bar is accommodated in the first groove section, the second heat dissipation bar is accommodated in the second groove section, and the end surfaces of the first heat dissipation bar and the second heat dissipation bar that are away from the first heat dissipation portion are exposed to the outer surface of the positioning portion.

9. The camera assembly according to claim 2, characterized in that: The barrel is provided with a plurality of heat dissipation grooves, which are arranged along the circumference of the barrel; the lens includes a plurality of heat absorbing components, which are respectively accommodated in the plurality of heat dissipation grooves.

10. An electronic device, characterized in that: It comprises a shell, a main board arranged in the shell, and a camera assembly as described in any one of claims 1 to 9, wherein the camera assembly is arranged in the shell, and a circuit board of the camera assembly is electrically connected to the main board.

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