Electronic device
By designing a pressure-pressure unit in an electronic device to apply pressure to the side circuit board and the side area of the electronic device, the problem of electrical connection instability caused by insufficient rigidity of the electronic device is solved, and a stable electrical connection between the main circuit board and the electronic device is achieved.
Patent Information
- Application Number
- CN202410816900.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-01
- Filing Date
- 2024-06-21
- Publication Date
- 2025-03-04
AI Technical Summary
In electronic devices, the overall rigidity of the electronic device is poor, resulting in the possibility of stable contact between the pins and the circuit board, affecting the stability of the electrical connection.
An electronic device is designed, including a main circuit board, an electronic device and a side circuit board. By applying pressure to the side area of the side circuit board and the electronic device, a stable electrical connection between the main circuit board and the electronic device is ensured.
By applying pressure, a stable electrical connection between the electronic device and the main circuit board and the side circuit board is ensured, and contact instability caused by insufficient rigidity is avoided.
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Figure CN119562438A_ABST
Abstract
Description
[0001] This application claims priority to a patent application with a filing date of September 1, 2023, application number 202311126027.0 and name “Electronic Device”. Technical Field
[0002] The present application relates to an electronic device, and in particular to an electronic device including an electronic component and a circuit board. Background Art
[0003] In an electronic device, some electronic devices (e.g., a central processing unit (CPU)) mounted on a main circuit board may also be electrically connected to other circuit boards on the other side opposite to the main circuit board. Such electronic devices are usually large in size, and some electronic devices have their top covers removed for heat dissipation, resulting in poor overall rigidity of the electronic devices and easy deformation after being stressed. This in turn may make it impossible for some pins of the electronic device located at different locations to stably contact with the circuit board to establish a stable electrical connection, so it is necessary to apply pressure to the electronic device and / or one or more circuit boards to establish a stable electrical connection between the two.
[0004] The circuit board located on the top surface of the electronic device is usually located at the edges of the electronic device. Conventional pressure-applying devices may cause the circuit board or even the electronic device to tilt after applying pressure, resulting in a smaller effective contact area between the circuit board and the electronic device or even some pins of the electronic device being unable to contact the circuit board to establish an electrical connection. Summary of the invention
[0005] In order to overcome at least one of the above and other problems and defects in the prior art, the present application is proposed.
[0006] The present application provides an electronic device, which includes: a main circuit board, an electronic device installed and electrically connected to the main circuit board, and a side circuit board positioned at the edge of the electronic device on a side of the electronic device facing away from the main circuit board and electrically connected to the electronic device. The electronic device also includes a pressure unit located on a side of the electronic device and each of the side circuit boards facing away from the main circuit board, the pressure unit is suitable for applying pressure to the side circuit board to maintain the electrical connection between the side circuit board and the electronic device, and the pressure unit is also suitable for applying pressure to the side area of the electronic device to maintain the electrical connection between the main circuit board and the electronic device.
[0007] In some embodiments, the pressure-applying unit includes: a top plate having an opening in the center of the top plate for dissipating heat for the electronic device, the top plate being suitable for being directly or indirectly connected to the main circuit board; and a first elastic member, the first elastic member being positioned on the side surface of the top plate facing the side circuit board, and being suitable for applying pressure to the side circuit board, and the applied pressure is also suitable for acting on the side area of the electronic device via the side circuit board.
[0008] In some embodiments, the electronic device further comprises a fixing frame fixed to the main circuit board, the fixing frame being located on the same side of the main circuit board as the electronic device and surrounding the electronic device, wherein the top plate is detachably connected to the fixing frame.
[0009] In some embodiments, the top plate is coupled to the fixing frame via a top plate screw, and the elastic force of the first elastic member is adjusted by adjusting the depth of the top plate screw being screwed into the fixing frame.
[0010] In some embodiments, the top plate is quadrilateral, and the first elastic member is detachably fixed to each of the four sides of the top plate.
[0011] In some embodiments, the first elastic member is fixed to each of the four sides of the top plate by welding or by rivets.
[0012] In some embodiments, the electronic device further comprises a first protective plate positioned between the side circuit board and the first elastic member, the first protective plate being adapted to disperse the pressure exerted by the first elastic member on the side circuit board, wherein the first protective plate is made of a rigid material.
[0013] In some embodiments, the first protection plate is made of a metal material, and an insulating layer is disposed on a side surface of the first protection plate facing the side circuit board.
[0014] In some embodiments, the pressure unit also includes a second elastic member, which is positioned on the side surface of the top plate facing the electronic device and is located at the corner between the side edges of the top plate, and the second elastic member is suitable for applying pressure to the corner area of the electronic device.
[0015] In some embodiments, the second elastic member is detachably fixed to each of the four corners of the top plate.
[0016] In some embodiments, the second elastic member is fixed to each of the four corners of the top plate by welding or by rivets.
[0017] In some embodiments, the electronic device further comprises a side socket connector positioned at an edge of the electronic device on a side of the electronic device facing away from the main circuit board, and an electrical connection is established between the side circuit board and the electronic device via the side socket connector.
[0018] In some embodiments, the electronic device further comprises a central pressure applying unit adapted to apply pressure to a central region and a corner region of the electronic device to maintain electrical connection between the main circuit board and the electronic device.
[0019] In some embodiments, the central pressure unit includes: a pressure member, which is positioned to at least partially contact and press the central area and the corner area of the electronic device; an elastic plate, which is located on the other side of the main circuit board opposite to the pressure member; and a connecting member, which is connected between the pressure member and the elastic plate to cause the elastic plate to deform to generate an elastic force, and the elastic force is transmitted to the pressure member via the connecting member so that the pressure member presses the electronic device.
[0020] In some embodiments, the pressure member includes: an annular portion, which is quadrilateral and has an opening in the center, and the annular portion at least partially contacts and presses the central area of the electronic device; and an extension portion, which extends outward from the corner of the annular portion on the plane where the annular portion is located, and is suitable for at least partially contacting and pressing the corner area of the electronic device, wherein the extension portion is located at the corner between two adjacent side circuit boards of the side circuit boards, and is suitable for being directly contacted and pressed by the second elastic member of the pressure unit.
[0021] In some embodiments, the central pressure unit also includes a nut, which is arranged in the middle position of the elastic plate, the connecting piece has a threaded end and a head opposite to each other, the head is connected to the pressure piece, and the threaded end is suitable for threaded connection with the nut, so that when the nut is tightened with the threaded end, the elastic plate is in an elastic deformation state to generate elastic force.
[0022] In some embodiments, the elastic plate includes: an elastic main body section, the nut is fixed in the central area of the main body section; a fixing portion, the fixing portion is located at opposite ends of the main body section along the length direction of the main body section and is suitable for being fixedly positioned relative to the main circuit board; and a connecting portion, the connecting portion extends in a bending manner between the main body section and the fixing portion so that the fixing portion is further away from the main circuit board than the main body section, wherein the main body section is configured to generate elastic deformation to generate elastic force when the nut is tightened with the threaded end of the connector.
[0023] In some embodiments, the central pressure unit further includes a support plate, which supports the main circuit board on a side opposite to the pressure member, and opposite ends of the elastic plate are fixed to the support plate by fastening devices.
[0024] In some embodiments, the support plate is fixedly connected to the fixing frame by studs passing through the main circuit board, so that the main circuit board is clamped between the support plate and the fixing frame.
[0025] In some embodiments, the fastening device includes: a fixing member, the fixing member is adapted to be fixedly engaged with the support plate; and a screw, the screw is adapted to pass through the fixing portion of the elastic plate to be threadedly connected with the fixing member.
[0026] In some embodiments, the main circuit board establishes an electrical connection with the electronic device via a main socket connector, and the side socket connector and the main socket connector are located on opposite sides of the electronic device.
[0027] In some embodiments, the electronic device is a central processing unit without a top cover, and the side circuit board is located at the edge of the central chip of the central processing unit.
[0028] In some embodiments, the pressure-applying unit also includes a third elastic member, which is positioned on the side surface of the top plate facing the electronic device and is closer to the opening for heat dissipation than the first elastic member; the third elastic member is suitable for applying pressure to the central area of the electronic device to maintain the electrical connection between the main circuit board and the electronic device.
[0029] In some embodiments, a height of the third elastic member protruding from the side surface of the top plate is greater than a height of the first elastic member protruding from the side surface of the top plate.
[0030] In some embodiments, the third elastic member is detachably fixed to each of the four sides of the top plate.
[0031] In some embodiments, the third elastic member is fixed to each of the four sides of the top plate by welding or by rivets.
[0032] In some embodiments, the electronic device further comprises a second protective plate positioned between the electronic component and the third elastic member, the second protective plate being adapted to disperse the pressure exerted by the third elastic member on the electronic component, wherein the protective plate is made of a rigid material.
[0033] In some embodiments, the second protection plate is made of a metal material, and a side surface of the second protection plate facing the electronic device is provided with an insulating layer.
[0034] In some embodiments, the second protective plate may include: a central protective portion, which is quadrilateral and has an opening in the center, and is suitable for evenly dispersing the pressure applied by the third elastic member on the central protective portion, so that the central protective portion at least partially contacts and presses the central area of the electronic device; and a corner protective portion, which extends outward from the corner of the central protective portion on the plane where the central protective portion is located, and is configured to be positioned at the corner between two adjacent side circuit boards of the side circuit boards, and is suitable for evenly dispersing the pressure applied by the second elastic member on the corner protective portion, so that the corner protective portion at least partially contacts and presses the corner area of the electronic device.
[0035] In the electronic device provided in various embodiments of the present application, the pressure-applying unit not only presses the side circuit board against the electronic device to establish a stable electrical connection between the two, but the pressure applied by the pressure-applying unit also applies pressure to the side area and / or corner area of the electronic device to establish a stable electrical connection between the main circuit board and the electronic device. In some embodiments, the pressure-applying unit may also apply pressure to the central area of the electronic device to establish a stable electrical connection between the main circuit board and the electronic device. In addition, the electronic device of the present application may also include a central pressure-applying unit that directly presses the central area and / or corner area of the electronic device to further establish a stable electrical connection between the main circuit board and the electronic device.
[0036] Other objects and advantages of the present application will be apparent from the following description of the present application with reference to the accompanying drawings, and can help to have a comprehensive understanding of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly described below. It should be noted that the drawings described below only relate to some embodiments of the present application, rather than limiting the present application. In the drawings:
[0038] Figure 1 A perspective view showing an electronic device according to an embodiment of the present application is shown.
[0039] Figure 2 An exploded view of an electronic device according to an embodiment of the present application is shown.
[0040] Figure 3 A cross-sectional view of an electronic device according to an embodiment of the present application is shown.
[0041] Figure 4 A perspective view of an electronic device with a pressure applying unit and a central pressure applying unit removed according to an embodiment of the present application is shown.
[0042] Figure 5 Shown along Figure 4 A cross-sectional view taken along line AA in FIG.
[0043] Figure 6 A top perspective view of a pressure applying unit of an electronic device according to an embodiment of the present application is shown.
[0044] Figure 7 A bottom perspective view of a pressure applying unit of an electronic device according to an embodiment of the present application is shown.
[0045] Figure 8 A top perspective view of an electronic device with a pressure applying unit and a side circuit board removed according to an embodiment of the present application is shown.
[0046] Fig. 9 Shows Figure 8 A bottom perspective view of an electronic device is shown.
[0047] Fig.10 The electronic device of the embodiment of the present application is shown with the pressure unit and the side circuit board removed. Fig. 9 A cross-sectional view taken along line BB in FIG.
[0048] Fig.11 The electronic device of the embodiment of the present application is shown with the pressure unit and the side circuit board removed. Fig. 9 Cross-sectional view taken along line CC in FIG.
[0049] Fig.12 A perspective view showing a central pressure applying unit of an electronic device according to an embodiment of the present application.
[0050] Fig.13 An exploded view of an electronic device according to another embodiment of the present application is shown.
[0051] Fig.14 A top perspective view of an electronic device according to another embodiment of the present application is shown.
[0052] Fig.15 A bottom perspective view of an electronic device according to another embodiment of the present application is shown.
[0053] Fig.16 A cross-sectional view through an electronic device is shown of a cross section of an electronic apparatus according to another embodiment of the present application.
[0054] Fig.17A perspective view illustrating an electronic device with a pressure applying unit removed according to another embodiment of the present application.
[0055] Fig.18 Shows Fig.17 A top view of the electronic device with the pressure applying unit removed is shown.
[0056] Fig.19 A top perspective view of a pressure applying unit of an electronic device according to another embodiment of the present application is shown.
[0057] Fig. 20 A bottom perspective view of a pressure applying unit of an electronic device according to another embodiment of the present application is shown.
[0058] Fig.21 Shows Fig. 20 A top view of the pressure unit is shown. DETAILED DESCRIPTION
[0059] The embodiments of the present application will be described below with reference to the accompanying drawings. The same reference numerals and symbols shown in the drawings of the present application refer to elements or components that perform substantially the same functions.
[0060] In addition, the terms used herein are used to describe embodiments and are not intended to limit and / or constrain the present application. Unless the context clearly indicates otherwise, the singular forms of "one", "a kind of", "said" and "the" are also intended to include plural forms. In the present application, "include", "comprise", "have" and similar terms are used to list features, quantities, steps, operations, elements, parts or combinations thereof, but do not exclude the presence or addition of one or more of the features, quantities, steps, operations, elements, parts or combinations thereof.
[0061] Although the terms "first", "second", "third", etc. may be used herein to describe a variety of different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the present application, a first element may be referred to as a second element, and a second element may be referred to as a first element. The term "and / or" includes multiple combinations of associated items or any one of a plurality of associated items.
[0062] An embodiment of the present application provides an electronic device. The electronic device includes a main circuit board 10, an electronic device 20 mounted and electrically connected to the main circuit board, and a side circuit board 30 positioned at the edge of the electronic device on a side of the electronic device away from the main circuit board and electrically connected to the electronic device. The electronic device also includes a pressure unit 40, which is located on a side of each of the electronic device 20 and the side circuit board 30 away from the main circuit board 10, and the pressure unit is suitable for applying pressure to the side circuit board 30 to maintain the electrical connection between the side circuit board 30 and the electronic device 20, and the pressure unit is also suitable for applying pressure to the side area 22 of the electronic device 20 to maintain the electrical connection between the main circuit board 10 and the electronic device 20.
[0063] In some embodiments, the electronic device may further include a central pressure unit 50 adapted to apply pressure to the central region 21 and the corner region 23 of the electronic device 20 to maintain electrical connection between the main circuit board 10 and the electronic device 20 .
[0064] In various embodiments of the present application, the electronic device 20 may be a central processing unit (CPU) with or without a top cover, and the electronic device may have a relatively large size. The side circuit board 30 may be located at the edge of the central chip of the electronic device such as the CPU.
[0065] like Figures 2 to 4 As shown in the figure, in the electronic device provided in the present application, the electronic device not only includes a main circuit board 10 and an electronic device 20 mounted and electrically connected to the main circuit board, but also includes a side circuit board 30 electrically connected to the electronic device. Figure 4 As shown, the side circuit board 30 is located on the side of the electronic device 20 facing away from the main circuit board 10, that is, on the top surface of the electronic device 20, and is positioned at the edge portion of the electronic device 20. In other words, at least a portion of the bottom surface and at least a portion of the top surface of the electronic device 20 have pins suitable for electrical connection with the corresponding circuit boards, wherein the pins on the bottom surface of the electronic device 20 are suitable for electrical connection to the main circuit board 10, and the pins on the top surface of the electronic device 20 are suitable for electrical connection to the side circuit board 30. In other words, at least a portion of the electronic device 20 is sandwiched between the main circuit board 10 and the side circuit board 30. In the illustrated embodiment, the side circuit board 30 is located at the four edge portions of the top surface of the electronic device 20, so that the chip located at the central portion of the electronic device is exposed, so as to facilitate heat dissipation of the electronic device.
[0066] In order to establish a stable electrical connection between the side circuit board 30 and the electronic device 20 and between the main circuit board 10 and the electronic device 20, the electronic device provided by the present application further includes a pressure unit 40, which is located on the side of each of the electronic device 20 and the side circuit board 30 away from the main circuit board 10, that is, located on the top surface of the electronic device 20 and the side circuit board 30. The pressure unit is suitable for applying pressure to the side circuit board 30 to maintain the electrical connection between the side circuit board and the electronic device 20. In addition, the pressure applied by the pressure unit 40 to the side circuit board 30 is also suitable for being transmitted to the side area 22 of the electronic device 20 via the side circuit board 30, so as to maintain the electrical connection between the main circuit board 10 and the electronic device 20.
[0067] like Figure 6 and Figure 7 As shown, the pressure applying unit 40 may include a top plate 41 and a first elastic member 42 positioned on a side surface of the top plate facing the side circuit board 30 and adapted to apply pressure to the side circuit board.
[0068] The top plate 41 may be in a substantially quadrilateral shape, such as a rectangle or a square. The top plate has an opening in the center for dissipating heat from the electronic device 20, especially from the central area of the electronic device 20 containing the chip. The top plate 41 is suitable for being directly or indirectly connected to the main circuit board 10.
[0069] In the illustrated embodiment, the top plate 41 is indirectly connected to the main circuit board 10 via the fixing frame 11. Figure 1 , Figure 4 and Figure 7 As shown, the fixing frame 11 is fixed to the same side of the main circuit board as the electronic device 20. In the illustrated embodiment, the fixing frame 11 is detachably fixed to the main circuit board 10 by screws. However, in some embodiments not shown, the fixing frame 11 can be fixed to the main circuit board 10 by adhesive or welding. The fixing frame 11 surrounds the electronic device 20 to fix the electronic device in place, thereby preventing the electronic device 20 from shifting on the plane where the top surface of the main circuit board 10 is located. In some embodiments, the fixing frame 11 can also surround the main socket connector 12, which will be further described below, to prevent the main socket connector 12 from shifting on the plane where the top surface of the main circuit board 10 is located.
[0070] In the illustrated embodiment, the top plate 41 of the pressure applying unit 40 may be detachably coupled to the fixing frame 11 by top plate screws 43 , whereby the top plate 41 is indirectly connected to the main circuit board 10 via the fixing frame 11 .
[0071] However, in some embodiments not shown, the top plate 41 of the pressure unit 40 may be directly connected to the main circuit board 10 by top plate screws. In some other embodiments, the top plate 41 may be directly connected to the main circuit board 10 by adhesive, rivets or welding.
[0072] The first elastic member 42 of the pressure applying unit 40 is positioned on the side surface of the top plate 41 facing the side circuit board 30, that is, positioned on the lower side surface of the top plate 41. The first elastic member 42 is suitable for applying pressure to the side circuit board 30. As described above, the pressure applied by the first elastic member 42 is also suitable for acting on the side area 22 of the electronic device 20 via the side circuit board.
[0073] The first elastic member 42 can be detachably fixed to each of the four sides of the top plate 41 by screws. In other embodiments, the first elastic member 42 can be fixed to each of the four sides of the top plate 41 by welding or by rivets. Even in some embodiments, the first elastic member 42 can be glued to the lower surface of the top plate 41 by an adhesive.
[0074] In addition, if Figure 6 and Figure 7 As shown, the first elastic member 42 is wavy, and each of the first elastic members has a plurality of protrusions protruding toward the side circuit board 30, and the protrusions are suitable for applying pressure to the side circuit board 30 by deformation. In addition, the first elastic member 42 is fixed to the top plate 41 at its middle position, and the two ends of the first elastic member in the length direction are free ends not fixed to the top plate, so that the first elastic member can stretch and deform in the length direction. The first elastic member 42 can be made of a highly elastic metal material, such as a highly elastic copper alloy, but the present application is not limited thereto.
[0075] In the illustrated embodiment, the top plate 41 is connected to the fixing frame 11 by the top plate screws 43, and thus the elastic force of the first elastic member 42 is adjusted by adjusting the depth of the top plate screws 43 screwed into the fixing frame 11, thereby adjusting the pressure acting on the side circuit board 30 and the side area 22 of the electronic device 20. In this case, the acting force between the electronic device 20 and the main circuit board 10 and the side circuit board 30 is adjustable, thereby not only preventing the pins used to establish electrical connection from being unable to establish a stable electrical connection due to insufficient local force, but also preventing the circuit board or even the electronic device from tilting due to uneven force, thereby establishing a stable electrical connection between the circuit board and the electronic device.
[0076] like Figure 4 and Figure 5As shown, the electronic device further includes a first protective plate 31 positioned between the side circuit board 30 and the first elastic member 42. That is, the first protective plate 31 is positioned to cover at least a portion of the side circuit board 30. The first protective plate 31 is made of a rigid material and can evenly disperse the pressure applied by the first elastic member 42 to the side circuit board 30, thereby protecting the side circuit board 30 from being damaged by concentrated pressure.
[0077] In this case, the elastic force generated by the first elastic member 42 after being squeezed first acts on the compressed area P (such as Figure 4 As shown), it is then conducted to the side circuit board 30 located below the first protective plate 31, and then to the side socket connector 32 present in some embodiments described below, and then to the side area 22 of the electronic device 20, and finally to the main circuit board 10.
[0078] In the illustrated embodiment, the first protective plate 31 may be made of a metal material such as stainless steel, aluminum or aluminum alloy, copper or copper alloy, and the side surface of the first protective plate facing the side circuit board 30 is provided with an insulating layer, which may be made of plastic and adhered to the lower side surface of the first protective plate 31. In some embodiments not shown, the first protective plate 31 may also be made of a rigid plastic material. Thus, there is no need to provide an insulating layer on the side surface of the first protective plate facing the side circuit board.
[0079] like Figure 3 and Figure 7 As shown better, the pressure unit 40 can also include a second elastic member 44, which is positioned on the side surface of the top plate 41 facing the electronic device 20 and is located at the corner between the side edges of the top plate, so that the second elastic member is suitable for applying pressure to the corner area 23 of the electronic device 20.
[0080] Similar to the first elastic member 42, the second elastic member 44 can be fixed to each of the four corners of the top plate 41 by screws in a detachable manner. Alternatively, the second elastic member can be fixed to each of the four corners of the top plate 41 by welding, or by rivets, or even by adhesive. In addition, similar to the first elastic member 42, the elastic force of the second elastic member 44 can be adjusted by adjusting the depth of the top plate screw 43 screwed into the fixing frame 11, thereby adjusting the pressure acting on the corner area 23 of the electronic device 20.
[0081] In addition, if Figure 7As shown, the second elastic member 44 has a fixed end fixed to the top plate 41 and a free end opposite to the fixed end. That is, one end of the second elastic member 44 is not fixed to the top plate 41, so that the second elastic member can be stretched and deformed. The second elastic member 44 can be made of a highly elastic metal material, such as a highly elastic copper alloy, but the present application is not limited thereto.
[0082] In the illustrated embodiment, the electronic device further includes a side socket connector 32 (eg, Figure 5 As shown in FIG. 1 , the side socket connector is suitable for being positioned at the edge of the electronic device 20 on the side of the electronic device 20 facing away from the main circuit board 10. That is to say, the side socket connector 32 is positioned at the edge portion of the top surface of the electronic device 20. Thus, the side circuit board 30 can establish an electrical connection with the electronic device 20 via the side socket connector 32. The side socket connector 32 can have a substrate made of insulating material and a plurality of conductors with elasticity located in and penetrating the substrate, the conductors being suitable for electrically connecting the corresponding pins of the electronic device 20 and the side circuit board 30 located on both sides of the side socket connector to establish an electrical connection.
[0083] exist Figures 1 to 12 In the illustrated embodiment, the electronic device may further include a central pressure unit 50 adapted to apply pressure to the central region 21 and the corner regions 23 of the electronic device 20 to maintain electrical connection between the main circuit board 10 and the electronic device 20 .
[0084] like Figures 8 to 12 As shown, the central pressure unit 50 may include a pressure member 51, an elastic plate 52, and a connecting member 53. The pressure member 51 may be positioned to at least partially contact and press the central area 21 and the corner area 23 of the electronic device 20. The elastic plate 52 may be located on the other side of the main circuit board 10 opposite to the pressure member 51. The connecting member 53 may be connected between the pressure member 51 and the elastic plate 52 to cause the elastic plate to deform to generate an elastic force, which is transmitted to the pressure member 51 via the connecting member 53 so that the pressure member presses the electronic device 20.
[0085] like Figures 8 to 12 As shown, the pressure member 51 may include an annular portion 511, which is quadrilateral and has an opening in the center, so that the chip in the center of the electronic device 20 can be exposed from the opening to dissipate heat. The annular portion 511 can at least partially contact and press the central area 21 of the electronic device. The pressure member 51 may also include an extension portion 512, which extends outward from the corner of the annular portion 511 on the plane where the annular portion is located. In other words, the extension portion extends outward at the corner of the outer side of the quadrilateral annular portion 511. The extension portion 512 is suitable for at least partially contacting and pressing the corner area 23 of the electronic device.
[0086] In the illustrated embodiment, the extension 512 is located at the corner between two adjacent side circuit boards in the side circuit board 30, and is suitable for being directly contacted and pressed by the second elastic member 44 of the pressure unit 40. In this case, the elastic force generated by the deformation of the second elastic member 44 first acts on the extension 512 of the pressure member 51, and then is transmitted to the corner area 23 of the electronic device. Therefore, not only the pressure member 51 of the central pressure unit 50 applies pressure to the corner area of the electronic device 20, but also the second elastic member 44 of the pressure unit 40 applies pressure to the corner area of the electronic device 20, thereby further ensuring the electrical connection between the electronic device 20 and the main circuit board 10.
[0087] like Figures 8 to 12 As shown, the central pressure unit 50 may further include a nut 54, which is disposed at a middle position of the elastic plate 52. The connecting member 53 may have a threaded end 531 and a head 532 opposite to each other, wherein the head 532 is connected to the pressurizing member 51, and the threaded end 531 is suitable for being threadedly connected with the nut 54, so that when the nut is tightened with the threaded end, the elastic plate 52 is in an elastic deformation state to generate an elastic force, and the elastic force can be transmitted to the pressurizing member 51 via the connecting member 53 so that the pressurizing member presses the electronic device 20.
[0088] like Figures 9 to 12 As shown, the elastic plate 52 may include an elastic main body section 521, a fixing portion 523 and a connecting portion 522. The nut 54 may be fixed to the central area of the main body section 521. The fixing portion 523 may be located at opposite ends of the main body section 521 along the length direction of the main body section, and is suitable for being fixedly positioned relative to the main circuit board 10. The connecting portion 522 may be bent and extend between the main body section 521 and the fixing portion 523, so that the fixing portion 523 is further away from the main circuit board 10 than the main body section 521.
[0089] In addition, the main body section 521 is configured to generate elastic deformation to generate elastic force when the nut 54 is tightened with the threaded end 531 of the connector 53. Therefore, by adjusting the tightening degree between the nut 54 and the threaded end 531 of the connector 53, the magnitude of the elastic force generated by the elastic plate 52 can be adjusted, thereby adjusting the magnitude of the pressure applied by the central pressure unit 50 to the central area and the corner area of the electronic device 20.
[0090] like Figure 1 , Figure 3 , Fig.10 and Fig.11As shown, the central pressure unit 50 may further include a support plate 55, which supports the main circuit board 10 on the side opposite to the pressure member 51, thereby preventing the main circuit board 10 from being deformed. In addition, opposite ends of the elastic plate 52 of the central pressure unit 50 are fixed to the support plate 55 by fastening devices 56. Fig.10 As shown, the fastening device 56 may include a fixing member 561 and a screw 562, wherein the fixing member is adapted to be fixedly engaged with the support plate 55, and the screw 562 is adapted to pass through the fixing portion 523 of the elastic plate 52 to be threadedly connected with the fixing member 561. With the aid of the fixing member 561, the fixing portion 523 of the elastic plate 52 is further away from the main circuit board 10 than the main body section 521, so that the elastic plate 52 can be deformed to generate elastic force.
[0091] In the illustrated embodiment, the support plate 55 may be fixedly connected to the fixing frame 11 via studs passing through the main circuit board 10 , so that the main circuit board 10 is clamped between the support plate 55 and the fixing frame 11 , thereby further preventing the main circuit board 10 from being deformed.
[0092] In some embodiments, Figures 2 to 5 As shown, the electronic device may further include a main socket connector 12 located between the main circuit board 10 and the electronic device 20, whereby the main circuit board 10 establishes an electrical connection with the electronic device 20 via the main socket connector 12. In an embodiment including a side socket connector 32, the side socket connector 32 and the main socket connector 12 are located on opposite sides of the electronic device 20, respectively.
[0093] The main socket connector 12 may have a substrate made of insulating material and a plurality of elastic conductors located in and passing through the substrate, wherein the conductors are suitable for electrically connecting the electronic devices 20 located on both sides of the main socket connector and corresponding pins of the main circuit board 10 to establish an electrical connection.
[0094] In addition, as shown in FIG. 4 , the fixing frame 11 fixed to the main circuit board 10 can surround the main socket connector 12 , thereby preventing the main socket connector 12 and the electronic device 20 from being offset on the plane of the upper surface of the main circuit board 10 .
[0095] Figures 13 to 21 The diagram shows another embodiment of the present application, wherein the structures, functions and relative positions of the main circuit board, electronic components, side circuit boards, main socket connectors, side socket connectors and fixing frames of the electronic device are similar to those of the embodiment of the present invention. Figures 1 to 12 The structures, functions and relative positions of the main circuit board 10, electronic device 20, side circuit board 30, main socket connector 12, side socket connector 32 and fixed frame 11 of the electronic device in the illustrated embodiment are basically the same, so they are represented by the same figure marks and will not be described repeatedly.
[0096] exist Figures 13 to 21 The embodiment shown is Figures 1 to 12 The main difference of the embodiment shown is that the pressure applying unit 40 located on the side of the electronic device 20 and the side circuit board 30 facing away from the main circuit board 10 can also apply pressure to the central area 21 of the electronic device 20 to maintain the electrical connection between the main circuit board 10 and the electronic device 20. Figures 13 to 21 In the illustrated embodiment, the central pressure unit 50 can be omitted, thereby further reducing the space occupied by the electronic device and avoiding drilling holes for the connector 53 of the central pressure unit 50 in the main circuit board 10 .
[0097] like Fig. 20 and Fig.21 As shown, the pressure applying unit 40 may further include a third elastic member 45 adapted to apply pressure to the central region 21 of the electronic device 20 , thereby maintaining the electrical connection between the main circuit board 10 and the electronic device 20 .
[0098] The third elastic member 45 may be positioned on the side surface of the top plate 41 facing the electronic device 20, that is, positioned on the lower side surface of the top plate 41. Fig. 20 and Fig.21 As shown, the third elastic member 45 is arranged in parallel with the first elastic member 42 and is closer to the opening for heat dissipation than the first elastic member 42 , so that the third elastic member 45 can apply pressure to the central area 21 of the electronic device 20 .
[0099] like Fig.19 and Fig. 20 As shown, the third elastic member 45 is wavy, and each of the third elastic members 45 has a plurality of protrusions protruding toward the electronic device 20, and the protrusions are suitable for applying pressure to the electronic device 20 by deformation. Fig.16 and Fig. 20 As shown, the height of the third elastic member 45 protruding from the side surface of the top plate 41 can be greater than the height of the first elastic member 42 protruding from the side surface of the top plate 41. In other words, the protruding height of the ridge of the third elastic member 45 is greater than the protruding height of the ridge of the first elastic member 42, thereby applying pressure to the central area 21 of the electronic device 20.
[0100] In some embodiments, the third elastic member 45 is detachably fixed to each of the four sides of the top plate 41. For example, the third elastic member 45 can be detachably fixed to the top plate 41 by screws. In other embodiments, the third elastic member 45 can be fixed to each of the four sides of the top plate 41 by welding or by rivets. Even in some embodiments, the third elastic member 45 can be glued to the lower surface of the top plate 41 by an adhesive.
[0101] like Fig. 20 and Fig.21 As shown, the third elastic member 45 is fixed to the top plate 41 at its middle position, and the two ends of the third elastic member 45 in the length direction are free ends that are not fixed to the top plate, so that the third elastic member can be stretched and deformed in the length direction. Similar to the first elastic member 42 and the second elastic member 44, the third elastic member 45 can be made of a highly elastic metal material, such as a highly elastic copper alloy, but the present application is not limited thereto.
[0102] In addition, similar to the first elastic member 42 and the second elastic member 44 , the elastic force of the third elastic member 45 can be adjusted by adjusting the depth of the top plate screw 43 screwed into the fixing frame 11 , thereby adjusting the pressure acting on the central area 21 of the electronic device 20 .
[0103] In some embodiments, the electronic device may further include a second protective plate 500 positioned between the electronic device 20 and the third elastic member 45. The second protective plate 500 is positioned to cover at least a portion of the central region 21 of the electronic device 20, for example, to cover the periphery of the central region 21, and to expose the central portion of the central region 21, so that heat can be dissipated through the opening of the top plate 41.
[0104] The second protection plate 500 may be made of a rigid material, and may evenly disperse the pressure exerted by the third elastic member 45 on the electronic device 20 , thereby protecting the electronic device 20 from being damaged by concentrated pressure.
[0105] In this case, the elastic force generated by the third elastic member 45 after being squeezed first acts on the compressed area on the second protective plate 500, then is transmitted to the electronic device 20 located under the second protective plate 500, then is transmitted to the main socket connector 12, and finally is transmitted to the main circuit board 10.
[0106] Similar to the first protective plate 31, the second protective plate 500 may be made of a metal material such as stainless steel, aluminum or aluminum alloy, copper or copper alloy, and the side surface of the second protective plate 500 facing the electronic device 20 is provided with an insulating layer, which may be made of plastic and adhered to the lower side surface of the second protective plate 500. In some other embodiments, the second protective plate 500 may also be made of a rigid plastic material. Thus, there is no need to provide an insulating layer on the side surface of the second protective plate 500 facing the electronic device.
[0107] like Fig.17 and Fig.18As shown, the second protective plate 500 may include a central protective portion 501, which may be quadrilateral and have an opening in the center, that is, a ring-like shape. The central protective portion 501 is suitable for evenly dispersing the pressure applied by the third elastic member 45 on the central protective portion, so that the central protective portion at least partially contacts and presses the central area 21 of the electronic device.
[0108] In addition, the second protection plate 500 may further include a corner protection portion 502, which extends outward from the corner of the central protection portion 501 on the plane where the central protection portion is located. In other words, the corner protection portion 502 extends outward at the corner of the outer side of the quadrilateral central protection portion 501. The corner protection portion 502 may be configured to be positioned at the corner between two adjacent side circuit boards in the side circuit board 30. The corner protection portion 502 is suitable for evenly dispersing the pressure applied by the second elastic member 44 on the corner protection portion, so that the corner protection portion at least partially contacts and presses the corner area 23 of the electronic device 20.
[0109] In some embodiments, Fig.14 and Fig.15 As shown, the electronic device may further include a support plate 55, which may support the main circuit board 10 on a side opposite to the top plate 41. The support plate 55 may be fixedly connected to the fixing frame 11 by studs passing through the main circuit board 10, so that the main circuit board 10 is sandwiched between the support plate 55 and the fixing frame 11, thereby further preventing the main circuit board 10 from being deformed.
[0110] and Figures 1 to 12 Compared with the embodiment shown in FIG. 1 , the support plate 55 of the electronic device of this embodiment does not need to be connected to the fastening device 56 of the central pressure unit 50, thereby reducing the space occupied by the fastening device 56 of the central pressure unit 50 and the elastic plate 52. Figures 1 to 12Compared with the embodiment shown, the electronic device of this embodiment can also avoid drilling holes for the connector 53 of the central pressure unit 50 in the main circuit board 10, thereby avoiding adverse effects on the circuit arrangement of the main circuit board 10. In the electronic devices provided in various embodiments of the present application, the pressure unit not only presses the side circuit board against the electronic device to establish a stable electrical connection between the two, but the pressure applied by the pressure unit also applies pressure to the side area and / or corner area of the electronic device to establish a stable electrical connection between the main circuit board and the electronic device. In some embodiments, the pressure unit can also apply pressure to the central area of the electronic device so as to establish a stable electrical connection between the main circuit board and the electronic device. In addition, the electronic device of the present application can also include a central pressure unit that directly presses the central area and / or corner area of the electronic device, further so as to establish a stable electrical connection between the main circuit board and the electronic device.
[0111] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.
[0112] The above embodiments are merely illustrative of the principles and structures of the present application, and are not intended to limit the present application. A person skilled in the art should understand that any changes and improvements made to the present application without departing from the overall concept of the present application are within the scope of the present application. The scope of protection of the present application shall be subject to the scope defined by the claims of the present application.
Claims
1. An electronic device, comprising a main circuit board (10), an electronic device (20) mounted and electrically connected to the main circuit board, and a side circuit board (30) positioned at an edge of the electronic device on a side of the electronic device facing away from the main circuit board and electrically connected to the electronic device, The electronic device further comprises a pressure unit (40) located on a side of each of the electronic device (20) and the side circuit board (30) facing away from the main circuit board (10), wherein the pressure unit is suitable for applying pressure to the side circuit board (30) to maintain the electrical connection between the side circuit board (30) and the electronic device (20), and the pressure unit is also suitable for applying pressure to the side area (22) of the electronic device (20) to maintain the electrical connection between the main circuit board (10) and the electronic device (20).
2. The electronic device according to claim 1, wherein: The pressure applying unit (40) comprises: a top plate (41), the center of which has an opening for dissipating heat from the electronic device (20), the top plate being suitable for being directly or indirectly connected to the main circuit board (10); and A first elastic member (42), the first elastic member is positioned on the side surface of the top plate (41) facing the side circuit board (30), and is suitable for applying pressure to the side circuit board, and the applied pressure is also suitable for acting on the side area (22) of the electronic device (20) via the side circuit board.
3. The electronic device according to claim 2, wherein: The electronic device further comprises a fixing frame (11) fixed to the main circuit board (10), the fixing frame being located on the same side of the main circuit board as the electronic device (20) and surrounding the electronic device. Wherein, the top plate (41) is connected to the fixed frame (11) in a detachable manner.
4. The electronic device according to claim 3, wherein: The top plate (41) is connected to the fixing frame (11) via a top plate screw (43), and the elastic force of the first elastic member (42) is adjusted by adjusting the depth of the top plate screw (43) screwed into the fixing frame.
5. The electronic device according to claim 2, wherein: The top plate (41) is quadrilateral, and the first elastic member (42) is detachably fixed to each of the four sides of the top plate; or The first elastic member (42) is fixed to each of the four sides of the top plate by welding or by rivets.
6. The electronic device according to claim 2, wherein: The electronic device further comprises a first protective plate (31) positioned between the side circuit board (30) and the first elastic member (42), wherein the first protective plate is suitable for dispersing the pressure applied by the first elastic member to the side circuit board, wherein the first protective plate is made of a rigid material.
7. The electronic device according to claim 6, wherein: The first protection plate (31) is made of a metal material, and an insulating layer is provided on a side surface of the first protection plate facing the side circuit board (30).
8. The electronic device according to claim 2, wherein: The pressure applying unit (40) further comprises a second elastic member (44), the second elastic member being positioned on a side surface of the top plate (41) facing the electronic device (20) and being located at a corner between side edges of the top plate, The second elastic member (44) is suitable for applying pressure to the corner area (23) of the electronic device (20).
9. The electronic device according to claim 8, wherein: The second elastic member (44) is detachably fixed to each of the four corners of the top plate (41); or The second elastic member is fixed to each of the four corners of the top plate by welding or by rivets.
10. The electronic device according to claim 2, wherein: The pressure applying unit (40) further comprises a third elastic member (45), the third elastic member being positioned on a side surface of the top plate (41) facing the electronic device (20) and being closer to an opening for heat dissipation than the first elastic member (42); The third elastic member (45) is suitable for applying pressure to the central area (21) of the electronic device (20) to maintain the electrical connection between the main circuit board (10) and the electronic device (20).
11. The electronic device according to claim 10, wherein: The height at which the third elastic member (45) protrudes from the side surface of the top plate (41) is greater than the height at which the first elastic member (42) protrudes from the side surface of the top plate (41).
12. The electronic device according to claim 10, wherein: The third elastic member (45) is detachably fixed to each of the four side edges of the top plate (41); or The third elastic member (45) is fixed to each of the four sides of the top plate by welding or by rivets.
13. The electronic device according to claim 10, wherein: The electronic device further comprises a second protective plate (500) positioned between the electronic device (20) and the third elastic member (45), the second protective plate being suitable for dispersing the pressure applied by the third elastic member to the electronic device, wherein the protective plate is made of a rigid material.
14. The electronic device according to claim 13, wherein: The second protection plate (500) is made of a metal material, and a side surface of the second protection plate facing the electronic device (20) is provided with an insulating layer.
15. The electronic device according to claim 13, wherein: The second protection plate (500) comprises: a central protection portion (501), the central protection portion being quadrilateral and having an opening in the center, and being adapted to evenly distribute the pressure applied by the third elastic member (45) on the central protection portion, so that the central protection portion at least partially contacts and presses the central area (21) of the electronic device; and A corner protection portion (502), which extends outward from a corner of the central protection portion (501) on a plane where the central protection portion is located, and is configured to be positioned at a corner between two adjacent side circuit boards of the side circuit board (30), and is suitable for evenly dispersing the pressure applied by the second elastic member (44) on the corner protection portion, so that the corner protection portion at least partially contacts and presses the corner area (23) of the electronic device (20).
16. The electronic device according to any one of claims 2 to 15, wherein: The electronic device further comprises a support plate (55) which supports the main circuit board (10) on a side opposite to the top plate (41). The support plate (55) is fixedly connected to the fixing frame (11) by means of studs passing through the main circuit board (10), so that the main circuit board (10) is sandwiched between the support plate and the fixing frame.
17. The electronic device according to any one of claims 1 to 15, wherein: The electronic device further comprises: a side socket connector (32) located at an edge of the electronic device (20) on a side of the electronic device (20) facing away from the main circuit board (10), wherein the side circuit board (30) establishes an electrical connection with the electronic device (20) via the side socket connector (32); and A main socket connector (12), wherein the main circuit board (10) establishes an electrical connection with the electronic device (20) via the main socket connector (12), Wherein, the side socket connector (32) and the main socket connector (12) are located on opposite sides of the electronic device (20).
18. The electronic device according to any one of claims 1 to 9, wherein: The electronic device further comprises a central pressure unit (50) adapted to apply pressure to a central region (21) and a corner region (23) of the electronic device (20) to maintain electrical connection between the main circuit board (10) and the electronic device (20).
19. The electronic device according to claim 18, wherein: The central pressure unit (50) comprises: a pressurizing member (51) positioned to at least partially contact and press the central region (21) and the corner region (23) of the electronic device (20); an elastic plate (52), the elastic plate being located on the other side of the main circuit board (10) opposite to the pressure member (51); and A connecting member (53) is connected between the pressurizing member (51) and the elastic plate (52) to cause the elastic plate (52) to deform to generate an elastic force, and the elastic force is transmitted to the pressurizing member (51) via the connecting member (53) so that the pressurizing member presses the electronic device.
20. The electronic device according to claim 19, wherein: The pressure member (51) comprises: an annular portion (511), the annular portion being quadrilateral and having an opening in the center, and the annular portion at least partially contacts and presses the central area (21) of the electronic device; and an extension portion (512), the extension portion extending outward from a corner of the annular portion (511) on a plane where the annular portion is located, and adapted to at least partially contact and press the corner region (23) of the electronic device, The extension portion (512) is located at a corner between two adjacent side circuit boards of the side circuit board (30), and is suitable for being directly contacted and pressed by the second elastic member (44) of the pressure unit.
21. The electronic device according to claim 20, wherein: The central pressure unit (50) further comprises a nut (54), which is arranged at a middle position of the elastic plate (52). The connecting member (53) has a threaded end (531) and a head (532) opposite to each other, the head is connected to the pressurizing member (51), and the threaded end (531) is suitable for being threadedly connected to the nut (54), so that when the nut and the threaded end are tightened, the elastic plate (52) is in an elastic deformation state to generate elastic force.
22. The electronic device according to claim 21, wherein: The elastic plate (52) comprises: A main body section (521) having elasticity, wherein the nut (54) is fixed in a central area of the main body section; A fixing portion (523), the fixing portion being located at opposite ends of the main body section (521) along the length direction of the main body section and being suitable for being fixedly positioned relative to the main circuit board (10); and a connecting portion (522), the connecting portion extending in a bent manner between the main body section (521) and the fixing portion (523), so that the fixing portion (523) is further away from the main circuit board (10) than the main body section (521), The main body section (521) is configured to generate elastic deformation to generate elastic force when the nut (54) and the threaded end (531) of the connecting member (53) are tightened.
23. The electronic device according to claim 19, wherein: The electronic device further comprises a support plate (55) which supports the main circuit board (10) on a side opposite to the pressure member (51), and opposite ends of the elastic plate (52) are fixed to the support plate (55) by fastening devices (56).
24. The electronic device according to claim 23, wherein: The support plate (55) is fixedly connected to the fixing frame (11) by means of studs passing through the main circuit board (10), so that the main circuit board (10) is sandwiched between the support plate and the fixing frame.
25. The electronic device according to claim 23, wherein: The fastening device (56) comprises: a fixing member (561), the fixing member being adapted to be fixedly engaged with the support plate (55); and A screw (562) is adapted to pass through the fixing portion (523) of the elastic plate (52) to be threadedly connected with the fixing member (561).
26. The electronic device according to any one of claims 1-15 and 19-25, wherein: The electronic device (20) is a central processing unit without a top cover, and the side circuit board (30) is located at the edges around the central chip of the central processing unit.