Backdrill information generation method and device, storage medium and electronic equipment

Abstract

The embodiment of the invention provides a backdrilling information generation method and device, a storage medium and electronic equipment, and the method comprises the steps: determining a backdrilling starting surface of a multilayer circuit board, and determining a target region on the backdrilling starting surface, the back drilling starting surface is positioned on one of a signal layer, a grounding layer and a power supply layer of the multi-layer circuit board; determining back drilling depth information corresponding to the target area, and generating a first back drilling attribute corresponding to each first through hole in the target area according to the back drilling depth information; under the condition that it is determined that the target area passes electrical connectivity detection, first back drilling information corresponding to a plurality of first through holes is generated according to a plurality of first back drilling attributes, the electrical connectivity detection is used for detecting the electrical connection state between a plurality of circuit boards connected with the first through holes, and the second back drilling information is used for detecting the electrical connection state between the circuit boards connected with the first through holes. The multilayer circuit board comprises a plurality of circuit boards.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of circuit design, and in particular, to a method and device for generating backdrill information, a storage medium, and an electronic device. Background Art

[0002] The traditional way to add backdrilling is based on signal-driven backdrilling, that is, adding backdrilling attributes to the network, and then generating backdrilling information for production. Specifically, the following steps are included: assigning backdrilling attributes to the signal; setting the backdrilling layer and backdrilling parameters. This step is generally more complicated to set, and mainly refers to the simulation results of high-speed signals by Signal Integrity (SI) to set the layer that needs backdrilling, some of which are double-sided backdrilling and some are single-sided backdrilling; generating production backdrilling data. According to the above steps, the Electronic Design Automation (EDA) software automatically generates the coordinate position of the through hole, the corresponding backdrilling depth and other backdrilling parameters (for example, the size of the drill bit used can be set in advance, or you can communicate directly with the circuit board factory).

[0003] The above signal-driven backdrilling method only generates backdrill information for the signal layer, and cannot directly generate backdrill information for the ground layer and the power layer. In order to optimize the flow, the ground layer and the power layer are generally connected in multiple layers. If the ground layer and the power layer can also generate backdrill information, the ground layer and the power layer that are backdrilled can only be isolated with a prohibited wiring layer. There is also a potential risk in doing so. If the ground layer and the power layer are not distributed in the layer covered by the backdrilling depth in other places, redundant backdrilling will be generated, resulting in cost waste.

[0004] Therefore, with respect to the signal-driven backdrill adding method in the related art, backdrill information is only generated for the signal layer of the circuit board, and the problem that backdrill information cannot be directly generated for the ground layer and the power layer has not yet been effectively solved. Summary of the invention

[0005] The embodiments of the present application provide a method and device for generating backdrill information, a storage medium and an electronic device, so as to at least solve the problem that the signal-driven backdrill adding method in the related art only generates backdrill information for the signal layer of the circuit board, and cannot directly generate backdrill information for the ground layer and the power layer.

[0006] According to an embodiment of the present application, a method for generating backdrill information is provided, specifically comprising: determining a backdrill start surface of a multi-layer circuit board, and determining a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board; determining backdrill depth information corresponding to the target area, and generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information; when it is determined that the target area passes an electrical connectivity test, generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between a plurality of circuit boards connected by the plurality of first through holes, and the multi-layer circuit board comprises: a plurality of circuit boards.

[0007] In an exemplary embodiment, determining the backdrill depth information corresponding to the target area includes: determining whether a first instruction for indicating a first position of a backdrill end surface corresponding to the target area is received; in the case where the first instruction is received, parsing the first instruction to determine the first position of the backdrill end surface; in the case where the first instruction is not received, determining the first position of the backdrill end surface according to the hierarchical structure information of the multi-layer circuit board; determining a first distance between the backdrill start surface and the backdrill end surface according to the first position and the second position of the backdrill start surface, and determining a second distance between each two adjacent layers of the multi-layer circuit board and a target thickness of the backdrill end surface; calculating a sum of the first distance, the second distance and the target thickness; and determining the backdrill depth information according to the sum and a preset backdrill error.

[0008] In an exemplary embodiment, before generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information, the method further includes: screening the through holes in the target area to determine a second through hole in the target area, wherein the second through hole is a through hole for which a second backdrill attribute has been generated by signal driving; and determining other through holes in the target area except the second through hole as the first through hole.

[0009] In an exemplary embodiment, after generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes, the method further includes: calling an information generation interface corresponding to the target area; acquiring a second backdrill attribute corresponding to a second through hole in the target area according to the information generation interface, and generating second backdrill information corresponding to the second through hole according to the second backdrill attribute, wherein the second through hole is a through hole for which the second backdrill attribute has been generated by signal driving; generating a backdrill information table corresponding to the target area according to the first backdrill information and the second backdrill information; and determining working parameters corresponding to a drilling machine according to the backdrill information table, so that the drilling machine drills the target area based on the working parameters.

[0010] In an exemplary embodiment, generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information includes: determining a coordinate position of each first through hole in the backdrill start surface; adding the coordinate position of each first through hole, the backdrill start surface and the backdrill depth information to the through hole attribute corresponding to each first through hole to generate the first backdrill attribute corresponding to each first through hole.

[0011] In an exemplary embodiment, after generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes, the method further includes: performing backdrilling in the target area according to the first backdrill information to generate the plurality of first through holes in the target area; performing filling detection on the plurality of first through holes; and determining that placement of devices and / or routing in the target area is allowed when a first detection result of the filling detection indicates that the plurality of first through holes have all been filled with a target material.

[0012] In an exemplary embodiment, after generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes, the method further includes: performing an electrical connectivity test on the target area; determining that the target area passes the electrical connectivity test when a second test result of the electrical connectivity test indicates that the electrical connection states between the plurality of circuit boards connected to each first through hole are all in a normal state; determining that the target area fails to pass the electrical connectivity test when the second test result indicates that the electrical connection states between the plurality of circuit boards connected to a third through hole among the plurality of first through holes are in an open circuit state; receiving a second instruction for indicating whether backdrilling is allowed in the target area when it is determined that the target area fails to pass the electrical connectivity test; and enabling the target area to pass the electrical connectivity test when the second instruction indicates that backdrilling is allowed in the target area by at least one of the following methods: updating an area range corresponding to the target area so that the updated target area passes the electrical connectivity test, wherein the updated target area does not include the third through hole; deleting the third through hole in the target area so that the target area passes the electrical connectivity test.

[0013] According to another embodiment of the present application, a device for generating backdrill information is provided, comprising: a first determination module, used to determine a backdrill start surface of a multi-layer circuit board, and determine a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board; a second determination module, used to determine backdrill depth information corresponding to the target area, and generate a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information; a generation module, used to generate first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes when it is determined that the target area passes an electrical connectivity test, wherein the electrical connectivity test is used to detect the electrical connection status between a plurality of circuit boards connected by the plurality of first through holes, and the multi-layer circuit board comprises: a plurality of circuit boards.

[0014] According to another embodiment of the present application, a computer-readable storage medium is provided, in which a computer program is stored, wherein the computer program is configured to execute the steps in the above method embodiment when running.

[0015] According to another embodiment of the present application, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in the above method embodiment.

[0016] According to another embodiment of the present application, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps in the above method embodiment are implemented.

[0017] Through the method for generating backdrill information of the present application, the backdrill start surface of the multi-layer circuit board is determined, and the target area is determined on the backdrill start surface. The backdrill start surface can be one of the following: the signal layer, the ground layer and the power layer of the multi-layer circuit board; the backdrill depth information corresponding to the target area is determined, and the first backdrill attribute corresponding to each first through hole in the target area is generated according to the backdrill depth information; when the target area is determined to be an electrical connectivity detection for indicating the electrical connection state between multiple circuit boards connected by multiple first through holes, the first backdrill information corresponding to multiple first through holes is generated according to the multiple first backdrill attributes. That is to say, the backdrill start surface of the embodiment of the present application can be not only the signal layer of the multi-layer circuit board, but also the ground layer or the power layer of the multi-layer circuit board. After determining the backdrill depth information corresponding to the target area, the first backdrill attribute corresponding to each first through hole in the target area can be automatically generated according to the backdrill depth information, and then the first backdrill information corresponding to the multiple first through holes is generated according to the multiple first backdrill attributes, without the need to generate the backdrill information by signal driving. According to the embodiments of the present application, the problem that the signal-driven backdrill adding method in the related art only generates backdrill information for the signal layer of the circuit board, but cannot directly generate backdrill information for the ground layer and the power layer can be solved. Therefore, the backdrill information is not limited to being generated for the signal layer of the circuit board, but can also be generated for the ground layer or the power layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a hardware structure block diagram of a computer terminal of a method for generating backdrill information in an embodiment of the present application;

[0019] Figure 2 is a flow chart of a method for generating backdrill information according to an embodiment of the present application;

[0020] Figure 3 It is a flow chart of a technical solution for setting back drilling in the related art;

[0021] Figure 4 is a schematic diagram of a back drilling technology according to an optional embodiment of the present application;

[0022] Figure 5 is a schematic diagram of a method for determining a minimum back-drilling depth d according to an optional embodiment of the present application;

[0023] Figure 6 It is a structural block diagram of a device for generating backdrill information according to an embodiment of the present application. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0026] The method embodiments provided in the embodiments of the present application can be executed in a mobile terminal, a computer terminal or a similar computing device. Taking running on a computer terminal as an example, Figure 1 1 is a hardware structure block diagram of a computer terminal of a method for generating backdrill information in an embodiment of the present application. Figure 1 As shown, the computer terminal may include one or more ( Figure 1 Only one is shown in the figure) a processor 102 (the processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data, wherein the above-mentioned computer terminal may also include a transmission device 106 and an input / output device 108 for communication functions. It can be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above-mentioned computer terminal. Figure 1 More or fewer components as shown, or with Figure 1 Different configurations are shown.

[0027] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the method for determining the interactive state in the embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, to implement the above method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories can be connected to the computer terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0028] The transmission device 106 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of a computer terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0029] Figure 2 is a flowchart of a method for generating backdrill information according to an embodiment of the present application, which can be applied to Figure 1 In a computer terminal, such as Figure 2 As shown, the process includes the following steps:

[0030] Step S202, determining a backdrill start surface of a multi-layer circuit board, and determining a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board;

[0031] The above-mentioned multi-layer circuit board is a circuit board formed by laminating two or more single-layer circuit boards (i.e., multiple circuit boards in this application) through an insulating layer and a copper foil layer. It allows wiring on different layers of the circuit board and connects each layer of the circuit board through through holes or blind buried holes to increase the flexibility and complexity of circuit design.

[0032] When back drilling is performed on a multi-layer circuit board, the surface from which the hole is to be drilled is determined, that is, the back drilling start surface. The back drilling start surface is used to indicate the surface of the circuit board in the multi-layer circuit board where the back drilling is to be performed.

[0033] The back drilling start surface may also be located at: a wiring layer, etc.

[0034] Step S204, determining backdrill depth information corresponding to the target area, and generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information;

[0035] Step S206, when it is determined that the target area passes the electrical connectivity test, first back drill information corresponding to multiple first through holes is generated according to multiple first back drill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by the multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

[0036] Through the method for generating backdrill information of the present application, the backdrill start surface of the multi-layer circuit board is determined, and the target area is determined on the backdrill start surface. The backdrill start surface can be one of the following: the signal layer, the ground layer and the power layer of the multi-layer circuit board; the backdrill depth information corresponding to the target area is determined, and the first backdrill attribute corresponding to each first through hole in the target area is generated according to the backdrill depth information; when the target area is determined to be an electrical connectivity detection for indicating the electrical connection state between multiple circuit boards connected by multiple first through holes, the first backdrill information corresponding to multiple first through holes is generated according to the multiple first backdrill attributes. That is to say, the backdrill start surface of the embodiment of the present application can be not only the signal layer of the multi-layer circuit board, but also the ground layer or the power layer of the multi-layer circuit board. After determining the backdrill depth information corresponding to the target area, the first backdrill attribute corresponding to each first through hole in the target area can be automatically generated according to the backdrill depth information, and then the first backdrill information corresponding to the multiple first through holes is generated according to the multiple first backdrill attributes, without the need to generate the backdrill information by signal driving. According to the embodiments of the present application, the problem that the signal-driven backdrill adding method in the related art only generates backdrill information for the signal layer of the circuit board, but cannot directly generate backdrill information for the ground layer and the power layer can be solved. Therefore, the backdrill information is not limited to being generated for the signal layer of the circuit board, but can also be generated for the ground layer or the power layer.

[0037] Optionally, the above-mentioned step S204 of determining the backdrill depth information corresponding to the target area includes: determining whether a first instruction for indicating a first position of a backdrill end surface corresponding to the target area is received; if the first instruction is received, parsing the first instruction to determine the first position of the backdrill end surface; if the first instruction is not received, determining the first position of the backdrill end surface according to the hierarchical structure information of the multi-layer circuit board; determining a first distance between the backdrill start surface and the backdrill end surface according to the first position and the second position of the backdrill start surface, and determining a second distance between each two adjacent layers of circuit boards in the multi-layer circuit board and a target thickness of the backdrill end surface; calculating a sum of the first distance, the second distance and the target thickness; and determining the backdrill depth information according to the sum and a preset backdrill error.

[0038] It is understandable that when back drilling is performed on a multi-layer circuit board, the surface at which the drilling is completed is determined as the back drilling end surface, that is, the back drilling end surface is used to indicate the surface of the circuit board where the back drilling is completed in the multi-layer circuit board.

[0039] In an embodiment of the present application, the method for determining the backdrilling end surface includes: determining the first position of the backdrilling end surface through a first instruction sent by a target object, that is, the target object can specify the first position of the backdrilling end surface. The first position of the backdrilling end surface can also be automatically calculated. Specifically:

[0040] The target object may send a first instruction, the first instruction being used to indicate a first position of the backdrilling end surface; or the backdrilling end surface may be automatically calculated through information such as hierarchical structure information of a multi-layer circuit board.

[0041] It is understandable that the above-mentioned hierarchical structure information may include: the name, function (eg, signal layer, power layer, ground layer), thickness of each layer of the multi-layer circuit board, and relative position between the layers.

[0042] The scheme of calculating the first position of the backdrilling end surface through the hierarchical structure information is only an example. In specific applications, the first position of the backdrilling end surface can also be calculated by other methods, for example: the first position of the backdrilling end surface is calculated through relevant information such as the dielectric material and thickness between each layer of the circuit board.

[0043] After the first position is determined, the back drilling depth information may be determined according to the first position and the second position of the back drilling start surface. Specifically:

[0044] The first distance between the backdrill start surface and the backdrill end surface is determined according to the first position and the second position. For example, if the backdrill start surface is the top layer, i.e., the L1 layer, and the backdrill end surface is the L13 ground layer, then the first distance is the distance from the top layer to the L13 layer.

[0045] Determine the second distance between each two adjacent layers of the multi-layer circuit board and the target thickness of the back drilling end surface; calculate the sum of the first distance, the second distance and the target thickness; and determine the back drilling depth information according to the sum and a preset back drilling error.

[0046] The preset backdrill error refers to the tolerance in the manufacturing process of multi-layer circuit boards. Assume that the preset backdrill error is 2 mil. In order to ensure that the next layer of the backdrill end surface is not mistakenly drilled, the actual backdrill depth will be set to be less than or equal to the calculated sum minus the preset backdrill error.

[0047] The difference between the sum value and the preset back drilling error may be determined as the back drilling depth information.

[0048] The embodiment of the present application not only maintains the signal integrity and function of the multi-layer circuit board, but also avoids unnecessary cost waste and possible manufacturing errors, thereby improving the efficiency and manufacturing quality of the multi-layer circuit board design. The above method is particularly suitable for complex circuit board design, which can reduce the workload of designers and improve the accuracy of back drilling parameter setting.

[0049] Optionally, before generating the first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information in the above step S204, the method further includes: screening the through holes in the target area to determine the second through holes in the target area, wherein the second through holes are through holes for which the second backdrill attribute has been generated by signal driving; and determining the other through holes in the target area except the second through holes as the first through holes.

[0050] It is understandable that the through hole in the target area may include two parts, one part is the second through hole determined by signal driving, and the other part is the first through hole determined by the regional back drilling method of the embodiment of the present application. In some specific applications, the through hole in the target area may also include only the first through hole.

[0051] The above embodiment avoids repeated operation on the through hole (i.e., the second through hole) that has been back-drilled by screening and distinguishing the first through hole and the second through hole, thereby avoiding unnecessary work, saving design time and resources, and preventing potential errors such as over-drilling, thereby avoiding problems that affect the function and stability of the circuit board caused by over-drilling.

[0052] Optionally, after generating first backdrill information corresponding to multiple first through holes according to multiple first backdrill attributes in the above step S206, the method further includes: calling an information generation interface corresponding to the target area; acquiring a second backdrill attribute corresponding to a second through hole in the target area according to the information generation interface, and generating second backdrill information corresponding to the second through hole according to the second backdrill attribute, wherein the second through hole is a through hole for which the second backdrill attribute has been generated by signal driving; generating a backdrill information table corresponding to the target area according to the first backdrill information and the second backdrill information; and determining working parameters corresponding to a drilling machine according to the backdrill information table, so that the drilling machine drills the target area based on the working parameters.

[0053] It can be understood that after determining the first backdrill information, a backdrill information table can also be generated. The backdrill information table can be used to instruct the drilling machine to determine working parameters such as the depth of drilling each through hole; the backdrill information table can also be used as reference data for subsequent maintenance of multi-layer circuit boards.

[0054] For example, a multi-layer circuit board with 14 layers is being designed, where the top layer (L1) and the bottom layer (L14) are wiring layers, and layers L2 to L13 contain signal layers, ground layers, and power layers, etc. The target area is located on the top layer L1 and contains multiple through-holes, of which the first through-hole has been assigned the first backdrill attribute, and the second through-hole is the second backdrill attribute generated by signal driving. The interface needs to be called to obtain the second backdrill attribute.

[0055] By calling the information generation interface, the second backdrill attribute can be obtained through the information generation interface, and the second backdrill information can be generated according to the second backdrill attribute.

[0056] Then, add regional backdrill attributes to the first through hole; add signal-driven backdrill attributes to the second through hole. Integrate the backdrill attributes corresponding to the first through hole and the backdrill attributes corresponding to the second through hole to generate a backdrill information table. The backdrill information table contains the backdrill attributes of all through holes in the target area, which is convenient for subsequent processing.

[0057] The first backdrill attribute may be a regional backdrill attribute; and the second backdrill attribute may be a signal-driven backdrill attribute.

[0058] Furthermore, according to the generated backdrilling information table, the working parameters of the drilling machine can be determined, including but not limited to: drill bit selection, drilling speed, drilling depth, etc., to ensure that the drilling machine can perform correct drilling operations on all through holes in the target area according to the guidance in the backdrilling information table, including both necessary regional backdrilling and backdrilling generated by signal driving mode.

[0059] Through the above technical solution, it can be ensured that all through holes that need back drilling are processed correctly without manually adjusting the back drilling properties and information of each through hole. This not only improves the efficiency and accuracy of the design, but also reduces potential errors, ensures the signal integrity and functional stability of the circuit board, and also optimizes the production cost and production process of the entire multi-layer circuit board.

[0060] Optionally, the step S204 of generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information includes: determining the coordinate position of each first through hole in the backdrill start surface; adding the coordinate position of each first through hole, the backdrill start surface and the backdrill depth information to the through hole attributes corresponding to each first through hole, so as to generate the first backdrill attribute corresponding to each first through hole.

[0061] It is understandable that the first backdrilling attribute may be generated by the coordinate position of the first through hole, the backdrilling start surface, the backdrilling depth information and other related information.

[0062] Through the above technical solution, each first through hole is assigned a first backdrill attribute, and this information can be used to set the specific parameters of the drilling machine to ensure that each through hole is backdrilled at the correct level and at a specified depth, thereby achieving the purpose of optimizing the signal transmission of the circuit board.

[0063] Optionally, after generating first backdrill information corresponding to multiple first through holes according to multiple first backdrill attributes in the above step S206, the method further includes: performing backdrilling in the target area according to the first backdrill information to generate the multiple first through holes in the target area; performing filling detection on the multiple first through holes; and determining that placement of devices and / or routing in the target area is allowed when a first detection result of the filling detection indicates that the multiple first through holes have all been filled with target materials.

[0064] It is understandable that during the circuit board manufacturing stage, relevant files or similar process files containing backdrill information can be received. These files record in detail the coordinate position of each first through hole, the backdrill starting surface, and the backdrill depth information. According to this first backdrill information, the manufacturer will use a precision drilling machine to backdrill the through holes in the target area. For example, for a specific through hole, the manufacturer will drill from the top layer according to the backdrill information and drill to a depth of 70 mils to ensure that only the necessary vias are removed to avoid affecting the lower structure of the circuit board.

[0065] After the back drilling operation is completed, these through holes can be filled with resin or other filling materials (i.e., wood white materials) to close the holes created by the back drilling, and then the board is baked, polished, copper is poured again, and electroplated to restore the electrical connectivity of the through holes. Filling inspection is an important step to verify whether the filling process is successful. Usually, filling inspection uses X-ray inspection, ultrasonic inspection or other non-destructive testing technology to check whether each first through hole has been completely filled with the target filling material.

[0066] After the filling test is completed, if the test results of all the first through holes show that they have been completely filled with the target filling material, it can be determined that these through holes have the ability to carry circuit wiring or place components again. At this point, designers or manufacturers can safely place components and perform wiring in the target area without worrying about the impact of the backdrilling operation on the function of the circuit board.

[0067] The embodiments of the present application ensure the integrity and electrical performance of the structure through filling detection, thereby providing safety and reliability for placing devices and performing wiring on the circuit board.

[0068] Optionally, after generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes in the above step S206, the method further includes: performing an electrical connectivity test on the target area; determining that the target area passes the electrical connectivity test when a second test result of the electrical connectivity test indicates that the electrical connection states between a plurality of circuit boards connected to each first through hole are all in a normal state; determining that the target area fails to pass the electrical connectivity test when the second test result indicates that the electrical connection states between a plurality of circuit boards connected to a third through hole among the plurality of first through holes are in an open circuit state; when it is determined that the target area fails to pass the electrical connectivity test, receiving a second instruction for indicating whether backdrilling is allowed in the target area; when the second instruction indicates that backdrilling is allowed in the target area, enabling the target area to pass the electrical connectivity test in at least one of the following ways: updating the area range corresponding to the target area so that the updated target area passes the electrical connectivity test, wherein the updated target area does not include the third through hole; deleting the third through hole in the target area so that the target area passes the electrical connectivity test.

[0069] It can be understood that, when the electrical connection status between the multiple circuit boards connected by each first through hole is in a normal state, it can be determined that the target area passes the electrical connectivity test; when the electrical connection status between the multiple circuit boards connected by the third through hole among the multiple first through holes is in an open circuit state, it is determined that the target area does not pass the electrical connectivity test. At this time, the target area can be adjusted or the third through hole can be adjusted to make the target area pass the electrical connectivity test. Specifically:

[0070] The range of the target area may be reduced so that the target area does not include the third through hole; or the third through hole in the target area may be deleted.

[0071] The third through hole may also be moved to other locations in the multi-layer circuit board except the target area, so that the target area passes the electrical connectivity test.

[0072] Through the above technical solutions, designers and manufacturers can ensure that the circuit board still maintains good electrical connectivity after the back drilling operation, avoiding functional defects caused by improper back drilling operation, and improving the reliability and production quality of the circuit board. This dynamic adjustment and problem-solving mechanism is an important part of circuit board design and manufacturing, which helps to optimize the performance of the circuit board while reducing risks and costs in the manufacturing process.

[0073] In order to better understand the process of the above-mentioned backdrill information generation method, the implementation process of the above-mentioned backdrill information generation method is described below in combination with an optional embodiment, but it is not used to limit the technical solution of the embodiment of the present application.

[0074] In high-speed circuits, crosstalk between signal lines is particularly serious, which not only affects the quality of data transmission, but also leads to an increase in the bit error rate, which in turn affects the stability and performance of the entire system. In addition, with the increase in the number of circuit board layers and the increase in routing density, how to effectively control signal delay, reflection and attenuation has become a technical challenge that circuit designers must face.

[0075] In order to solve the problem of high-speed signal crosstalk, back drilling technology has emerged as an advanced printed circuit board (PCB) manufacturing process. The main purpose of back drilling is to reduce the mutual interference between signal lines by removing the redundant vias, thereby improving signal integrity. Specifically, back drilling is to partially remove some vias that do not need to penetrate the entire board thickness on the back side or non-signal layer of the circuit board, and only retain the section related to the actual signal transmission, so as to reduce the coupling effect between signal lines and improve the purity of the signal.

[0076] Figure 3 It is a technical solution flow chart of back drilling in the related art, such as Figure 3 As shown:

[0077] Step S301, adding backdrill attributes to the signal;

[0078] Assign backdrill attributes to signals. Theoretically, all signals can be added with backdrill attributes. However, if it is a ground layer, it is generally a multi-layer connection, that is, through Figure 3 The method,the ground layer cannot generate backdrill information;

[0079] Step S302, setting the backdrilling layer and backdrilling parameters;

[0080] Set the backdrill layer and backdrill parameters. The settings of the backdrill layer and backdrill parameters are generally complicated. Refer to the simulation results of SI for high-speed signals to set the layers that need backdrilling. Some have double-sided backdrilling, and some have single-sided backdrilling.

[0081] Step S303, generating production back drilling data.

[0082] Generate production backdrill data. According to step S301 and step S302, the EDA software automatically generates the coordinate position of the through hole, the corresponding backdrill depth and other backdrill parameters (for example, the drill size used can be set in advance or communicated directly with the PCB factory).

[0083] pass Figure 3It can be seen that the traditional way of adding backdrilling is to add backdrilling attributes to the network and then generate backdrilling information for production.

[0084] Figure 3 The backdrilling method only generates backdrill information for the signal layer, and cannot directly generate backdrill information for the ground layer and the power layer. In order to optimize the through-current, the ground layer and the power layer are generally connected in multiple layers. If the ground layer and the power layer can also generate backdrill information, the ground layer and the power layer that are backdrilled can only be isolated with a prohibited wiring layer. There is a potential risk in doing this: if the ground layer and the power layer are not distributed in the layer covered by the backdrilling depth in other places, redundant backdrills will be generated, resulting in cost waste. Because the traditional method of setting regional backdrilling is cumbersome and there is a waste of process cost, it is generally not necessary to place components or traces at the backdrilling holes on the backdrilling start surface. In the case of using through holes and placing components on both sides of the board, blind buried hole technology is mostly used. However, blind buried hole technology is a relatively advanced PCB process technology, and the process cost is generally much higher than the backdrilling process.

[0085] In response to the above problems, an optional embodiment of the present application proposes a method for setting regional back drilling, the main steps of which include: determining the starting surface of the regional back drilling, calculating the minimum back drilling depth d of the framed area; adding the back drilling depth information, the back drilling starting surface information and other information required for back drilling to the attributes of all through holes in the framed area; generating back drilling information for production. That is, the design idea of ​​the optional embodiment of the present application is: at the beginning of the design, the professional integrated design language (Special Integrated Design Language, referred to as Skill) is used to add back drilling to the through holes in the region, and then the back drilling holes are filled with resin, and then the panelized orifice filling via process (Panelized Orifice Filling Via Process, referred to as POFV) process is used to realize the placement of components on both sides of the PCB using the back drilling process. The key point of the optional embodiment of the present application is to back drill the through holes on one side of the region at the beginning of the design. Among them, the back drilling information directly added to the through hole can also be called regional back drilling. The regional back drilling of the optional embodiment of the present application does not include the back drilling generated by the signal network driver.

[0086] Figure 4 is a schematic diagram of a back drilling technology according to an optional embodiment of the present application, such as Figure 4 As shown, the multi-layer circuit board includes a signal layer and a ground layer / power layer. The optional embodiment of the present application can determine the back drilling start surface, and then determine the safety distance D between the back drilling start surface and the signal layer and the safety distance D1 between the ground layer / power layer and the signal layer, and then drill holes at the through holes. That is, the optional embodiment of the present application proposes a method for setting regional back drilling, which is mainly implemented through the following four modules, specifically:

[0087] Module 1: Add regional through-hole backdrilling information.

[0088] (1) Where there are through holes, select the area where the device or trace needs to be placed (i.e., the target area) on the Top surface (top layer, the front of the circuit board) or the Bot surface (bottom layer, the back of the circuit board). If you select on the Top surface, set the Top surface as the regional backdrilling start surface (i.e., the backdrilling start surface); if you select on the Bot surface, set the Bot surface as the regional backdrilling start surface.

[0089] (2) Calculate the minimum back-drilling depth d (i.e., back-drilling depth information) of the selected area. Figure 5 is a schematic diagram of a method for determining a minimum back drilling depth d according to an optional embodiment of the present application, such as Figure 5 As shown, for electrical safety, backdrilling is set to remove the L3 layer (L3 layer is the backdrilling end layer), and the L2 layer is not backdrilled. If the board factory presets the backdrilling error as d1, the minimum backdrilling depth d = H-d1. Among them, H (i.e., the sum value) is the distance between the upper surface of the L2 layer and the upper surface of the L4 layer.

[0090] (3) Add the backdrill depth information (i.e., the minimum backdrill depth d) to the through-hole attributes corresponding to all through-holes (i.e., the first through-hole) in the selected area (excluding the through-holes that have been attached with signal drive to generate backdrill information (i.e., the second through-hole)) to generate the backdrill attributes of each through-hole (i.e., the first backdrill attributes). And calculate whether the through-hole will cause an open circuit (i.e., perform an electrical connectivity test) after adding the backdrill attributes. If an open circuit occurs (i.e., the electrical connectivity test fails), highlight the through-hole that causes the open circuit.

[0091] (4) Confirm whether to add regional backdrill to this regional via. If so, proceed to the next step; if not, terminate the command. After the command is terminated, the via is highlighted to facilitate layout engineers to further study whether to add regional backdrill attributes to this via.

[0092] (5) If regional backdrilling is added in (4), it is necessary to add regional backdrilling notes for the through holes to distinguish the backdrilled through holes generated by the signal drive, so as to facilitate the inspection of the regional backdrilled through holes.

[0093] Module 2: Design Rule Check (DRC) that hides back-drilled holes, devices, and routing. Check the area selected by the mouse (i.e., the target area). If there are devices, routing, and back-drilled holes that generate DRC, call the Waived command (i.e., the Ignore command) to hide the DRC corresponding to the through hole at the corresponding coordinates by using the coordinates of the location where the DRC is generated. Module 2 is generally used when the drawing is finally produced. The Layout engineer determines whether to use this module based on the actual situation.

[0094] That is, when placing devices or routing corresponding to the back-drilled holes, DRC may appear, proving that there is an error in the back-drilled holes here; however, the back-drilled holes in the optional embodiments of the present application are filled with resin material in the final stage, and devices or routing can be placed in the filled back-drilled holes, so the DRC here can be ignored.

[0095] Module 3: Generate backdrill information for production. Call the backdrill information generation interface (i.e., information generation interface) to first generate network-driven backdrill information (i.e., second backdrill information); then, organize the through-hole coordinate position, backdrill start surface, backdrill depth, and other backdrill information for adding regional backdrills into a table (i.e., backdrill information table) and corresponding instructions, and add them to the backdrill layer corresponding to the target data (which can be Gerber data).

[0096] Module 4: Cancel the added through-hole backdrill information. If the Layout engineer does not need to backdrill in the added area, cancel the backdrill added directly through the through-hole here. The idea of ​​this step can be the sum of the inverse operations of module 3, module 2, and module 1.

[0097] Through the above four modules, the designed data is transmitted to the factory. After back drilling, the factory plugs the back-drilled holes with resin (i.e., the target material), and then passes through the baking plate, grinding, copper deposition and electroplating processes again, thereby realizing the function of placing components or routing on both sides of the PCB through-holes through the back drilling process.

[0098] According to a new regional backdrilling design method proposed in an optional embodiment of the present application, regional backdrilling can be easily added, and the space utilization rate of the PCB board can be improved and the PCB process cost can be reduced. At the same time, the optional embodiment of the present application automatically adds regional backdrilling properties to the through-hole through Skill, which is convenient for minimizing the number of backdrills and achieving the purpose of placing components and routing at the backdrilled holes, thereby maximizing the savings in PCB production costs. In addition, the optional embodiment of the present application realizes the function of placing components or routing on both sides of the PC B through-hole through backdrilling plus PO FV process.

[0099] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0100] In this embodiment, a device for generating backdrill information is also provided, which is used to implement the above embodiments and preferred implementations, and will not be repeated here. As used below, the term "module" can implement a combination of software and / or hardware for a predetermined function. Although the device described in the following embodiments is preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0101] Figure 6 is a structural block diagram of a device for generating backdrill information according to an embodiment of the present application, such as Figure 6 As shown, the device comprises:

[0102] A first determination module 62 is used to determine a backdrill start surface of a multi-layer circuit board and determine a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board;

[0103] A second determination module 64 is used to determine the backdrilling depth information corresponding to the target area, and generate a first backdrilling attribute corresponding to each first through hole in the target area according to the backdrilling depth information;

[0104] The third determination module 66 is used to generate first back drill information corresponding to multiple first through holes according to multiple first back drill attributes when it is determined that the target area passes the electrical connectivity detection, wherein the electrical connectivity detection is used to detect the electrical connection status between multiple circuit boards connected by the multiple first through holes, and the multi-layer circuit board includes: multiple circuit boards.

[0105] Through the backdrill information generation device of the present application, the backdrill start surface of the multi-layer circuit board is determined, and the target area is determined on the backdrill start surface. The backdrill start surface can be one of the following: the signal layer, the ground layer and the power layer of the multi-layer circuit board; the backdrill depth information corresponding to the target area is determined, and the first backdrill attribute corresponding to each first through hole in the target area is generated according to the backdrill depth information; when the target area is determined through the electrical connectivity detection for indicating the electrical connection state between the multiple circuit boards connected by the multiple first through holes, the first backdrill information corresponding to the multiple first through holes is generated according to the multiple first backdrill attributes. That is to say, the backdrill start surface of the embodiment of the present application can be not only the signal layer of the multi-layer circuit board, but also the ground layer or the power layer of the multi-layer circuit board. After determining the backdrill depth information corresponding to the target area, the first backdrill attribute corresponding to each first through hole in the target area can be automatically generated according to the backdrill depth information, and then the first backdrill information corresponding to the multiple first through holes is generated according to the multiple first backdrill attributes, without the need to generate the backdrill information by signal driving. According to the embodiments of the present application, the problem that the signal-driven backdrill adding method in the related art only generates backdrill information for the signal layer of the circuit board, but cannot directly generate backdrill information for the ground layer and the power layer can be solved. Therefore, the backdrill information is not limited to being generated for the signal layer of the circuit board, but can also be generated for the ground layer or the power layer.

[0106] In an exemplary embodiment, the second determination module 64 is further used to determine whether a first instruction for indicating a first position of a backdrill end surface corresponding to the target area is received; if the first instruction is received, the first instruction is parsed to determine the first position of the backdrill end surface; if the first instruction is not received, the first position of the backdrill end surface is determined according to the hierarchical structure information of the multi-layer circuit board; the first distance between the backdrill start surface and the backdrill end surface is determined according to the first position and the second position of the backdrill start surface, and the second distance between each two adjacent layers of the multi-layer circuit board and the target thickness of the backdrill end surface are determined; the sum of the first distance, the second distance and the target thickness is calculated; and the backdrill depth information is determined according to the sum and a preset backdrill error.

[0107] In an exemplary embodiment, the second determination module 64 is further used to screen the through holes in the target area to determine a second through hole in the target area, wherein the second through hole is a through hole that has generated a second backdrilling attribute by signal driving; and determine other through holes in the target area except the second through hole as the first through hole.

[0108] In an exemplary embodiment, the generation module 66 is further used to call an information generation interface corresponding to the target area; obtain a second backdrill attribute corresponding to a second through hole in the target area according to the information generation interface, and generate second backdrill information corresponding to the second through hole according to the second backdrill attribute, wherein the second through hole is a through hole for which the second backdrill attribute has been generated by signal driving; generate a backdrill information table corresponding to the target area according to the first backdrill information and the second backdrill information; determine working parameters corresponding to a drilling machine according to the backdrill information table, so that the drilling machine drills the target area based on the working parameters.

[0109] In an exemplary embodiment, the second determination module 64 is further used to determine the coordinate position of each first through hole in the backdrilling start surface; and add the coordinate position of each first through hole, the backdrilling start surface and the backdrilling depth information to the through hole attributes corresponding to each first through hole to generate the first backdrilling attributes corresponding to each first through hole.

[0110] In an exemplary embodiment, the generation module 66 is further used to perform back drilling in the target area according to the first back drilling information to generate the multiple first through holes in the target area; perform filling detection on the multiple first through holes; and determine that it is allowed to place devices and / or routings in the target area when a first detection result of the filling detection indicates that the multiple first through holes have been filled with the target material.

[0111] In an exemplary embodiment, the generating module 66 is further used to perform an electrical connectivity test on the target area; when the second test result of the electrical connectivity test indicates that the electrical connection status between the multiple circuit boards connected to each first through hole is in a normal state, it is determined that the target area passes the electrical connectivity test; when the second test result indicates that the electrical connection status between the multiple circuit boards connected to the third through hole among the multiple first through holes is in an open circuit state, it is determined that the target area does not pass the electrical connectivity test; when it is determined that the target area does not pass the electrical connectivity test, a second instruction for indicating whether back drilling is allowed in the target area is received; when the second instruction indicates that back drilling is allowed in the target area, the target area is made to pass the electrical connectivity test in at least one of the following ways: updating the area range corresponding to the target area so that the updated target area passes the electrical connectivity test, wherein the updated target area does not include the third through hole; deleting the third through hole in the target area so that the target area passes the electrical connectivity test.

[0112] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps in the above method embodiment when running.

[0113] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0114] Optionally, in this embodiment, the storage medium may be configured to store program codes for executing the following steps:

[0115] S1, determining a backdrill start surface of a multi-layer circuit board, and determining a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board;

[0116] S2, determining backdrill depth information corresponding to the target area, and generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information;

[0117] S3, when it is determined that the target area passes the electrical connectivity test, generating first backdrill information corresponding to multiple first through holes according to multiple first backdrill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by the multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

[0118] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in the above method embodiment.

[0119] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0120] Optionally, in this embodiment, the processor may be configured to perform the following steps through a computer program:

[0121] S1, determining a backdrill start surface of a multi-layer circuit board, and determining a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board;

[0122] S2, determining backdrill depth information corresponding to the target area, and generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information;

[0123] S3, when it is determined that the target area passes the electrical connectivity test, generating first backdrill information corresponding to multiple first through holes according to multiple first backdrill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by the multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

[0124] An embodiment of the present application further provides a computer program product, including a computer program, which is implemented to perform the steps in the above method embodiment when executed by a processor.

[0125] Optionally, in this embodiment, the computer program product may be executed by a processor to perform the following steps:

[0126] S1, determining a backdrill start surface of a multi-layer circuit board, and determining a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board;

[0127] S2, determining backdrill depth information corresponding to the target area, and generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information;

[0128] S3, when it is determined that the target area passes the electrical connectivity test, generating first backdrill information corresponding to multiple first through holes according to multiple first backdrill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by the multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

[0129] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

[0130] Obviously, those skilled in the art should understand that the above modules or steps of the present application can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order from that herein, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0131] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for generating backdrill information, characterized in that: include: Determine a backdrill start surface of a multi-layer circuit board, and determine a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board; Determine backdrill depth information corresponding to the target area, and generate a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information; When it is determined that the target area passes the electrical connectivity test, first backdrill information corresponding to multiple first through holes is generated according to multiple first backdrill attributes, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by the multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

2. The method according to claim 1, characterized in that Determining backdrill depth information corresponding to the target area includes: determining whether a first instruction for indicating a first position of a backdrilling end surface corresponding to the target area is received; When receiving the first instruction, parsing the first instruction to determine a first position of the back drilling end surface; In the case where the first instruction is not received, determining a first position of the backdrilling end surface according to the hierarchical structure information of the multi-layer circuit board; Determine a first distance between the backdrill start surface and the backdrill end surface according to the first position and the second position of the backdrill start surface, and determine a second distance between every two adjacent layers of the multi-layer circuit board and a target thickness of the backdrill end surface; calculating a sum of the first distance, the second distance, and the target thickness; The back drilling depth information is determined according to the sum value and a preset back drilling error.

3. The method according to claim 1, characterized in that: Before generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information, the method further includes: Screening the through holes in the target area to determine a second through hole in the target area, wherein the second through hole is a through hole that has generated a second backdrilling attribute by signal driving; The other through holes in the target area except the second through hole are determined as the first through holes.

4. The method according to claim 1, characterized in that After generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes, the method further includes: Calling the information generation interface corresponding to the target area; Acquire a second backdrill attribute corresponding to a second through hole in the target area according to the information generation interface, and generate second backdrill information corresponding to the second through hole according to the second backdrill attribute, wherein the second through hole is a through hole for which the second backdrill attribute has been generated by signal driving; generating a backdrill information table corresponding to the target area according to the first backdrill information and the second backdrill information; The working parameters corresponding to the drilling machine are determined according to the back drilling information table, so that the drilling machine drills the target area based on the working parameters.

5. The method according to claim 1, characterized in that Generating a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information includes: Determining the coordinate position of each of the first through holes in the back drilling start surface; The coordinate position of each first through hole, the backdrill start surface and the backdrill depth information are added to the through hole attributes corresponding to each first through hole to generate the first backdrill attributes corresponding to each first through hole.

6. The method according to claim 1, characterized in that After generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes, the method further includes: Performing back drilling in the target area according to the first back drilling information to generate the plurality of first through holes in the target area; Performing filling inspection on the plurality of first through holes; When the first inspection result of the filling inspection indicates that the plurality of first through holes have been filled with the target material, it is determined that placement of a device and / or a trace in the target area is allowed.

7. The method according to claim 1, characterized in that After generating first backdrill information corresponding to a plurality of first through holes according to a plurality of first backdrill attributes, the method further includes: Performing electrical connectivity testing on the target area; In the case where the second test result of the electrical connectivity test indicates that the electrical connection states between the plurality of circuit boards connected to each of the first through holes are all in a normal state, determining that the target area passes the electrical connectivity test; In the case where the second detection result indicates that the electrical connection state between the plurality of circuit boards connected by the third through hole among the plurality of first through holes is in an open circuit state, determining that the target area fails the electrical connectivity detection; In the case where it is determined that the target area fails the electrical connectivity test, receiving a second instruction for indicating whether backdrilling is allowed in the target area; When the second instruction indicates that backdrilling is allowed in the target area, the target area is made to pass the electrical connectivity test in at least one of the following ways: Updating the area range corresponding to the target area so that the updated target area passes the electrical connectivity test, wherein the updated target area does not include the third through hole; The third through hole in the target area is deleted so that the target area passes the electrical connectivity test.

8. A device for generating backdrill information, characterized in that: include: A first determination module is used to determine a backdrill start surface of a multi-layer circuit board and determine a target area on the backdrill start surface, wherein the backdrill start surface is located at one of the following: a signal layer, a ground layer, and a power layer of the multi-layer circuit board; A second determination module, configured to determine backdrill depth information corresponding to the target area, and generate a first backdrill attribute corresponding to each first through hole in the target area according to the backdrill depth information; A generation module is used to generate first back drill information corresponding to multiple first through holes according to multiple first back drill attributes when it is determined that the target area passes the electrical connectivity test, wherein the electrical connectivity test is used to detect the electrical connection status between multiple circuit boards connected by the multiple first through holes, and the multilayer circuit board includes: multiple circuit boards.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method according to any one of claims 1 to 7 when executed by a processor.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

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